JP2010083085A - Resin sealing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin sealing apparatus which does not require an adjustment work by a person, and can automatically achieve the high-accuracy parallelism for top and bottom dies in the sealing process. <P>SOLUTION: This resin sealing apparatus includes: the first die 20 and the second die 30 for resin-sealing an electronic component; a first plate 2 which holds the first die 20; a second plate 3 which holds the second die 30, and pressurizes the first plate 2 by relatively moving in the vertical direction; and a joint section 10 which is installed between at least either of the dies 20 and 30 and corresponding one of the plates 2 and 3 which holds either of the dies 20 and 30, has two rotating degrees of freedom around the axis orthogonal to each other within a plane being in parallel with the plates 2 and 3 which hold at least one of the dies 20 and 30, and relatively rotatably connects at least either of the dies 20 and 30, and the corresponding plates 2 and 3 which hold at least either of the dies 20 and 30. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a resin sealing device.

  In order to protect semiconductor products such as finely interconnected and bonded chips from the effects of disturbances such as mechanical stress, temperature, and humidity, it is necessary to harden the chips and bonded parts with resin. It is called sealing or encapsulation (mold), and its production process is called a sealing process or a molding process. An apparatus used in this process is generally called a resin sealing apparatus.

  The resin sealing device for semiconductor sets the chip attached to the lead frame to the mold, melts the epoxy resin by applying heat, heat cures by applying pressure and heat for a certain time, and seals Thereafter, it is automatically performed until it is stored in a predetermined magazine (storage shelf).

  In recent years, with the increase in density, miniaturization, and miniaturization of semiconductors, high adhesion and high density between a resin and a mold are required. For this reason, there is a demand for a technique for sealing with high precision and accuracy with respect to the resin sealing surface.

  FIG. 8A is a front view schematically showing a general resin sealing device 101, and FIG. 8B is a schematic front view when the resin sealing device 101 is clamped.

  The upper mold 120 is fixed to the fixed plate 102, and the lower mold 130 is fixed to the movable plate 103 and has a mechanism that can move relative to the upper mold 120. As shown in FIG. 8B, the lower mold 130 is pressed against the upper mold 120 to perform resin sealing between the molds.

  The resin sealing device 101 is a very large device, and the movable plate 103 as shown in FIG. 8 is supported at two points on the left and right sides from the power source. It has a difficult structure. Therefore, it is very difficult for the movable plate 103 to be completely parallel to the fixed plate 120. Therefore, in order to perform highly accurate resin sealing, it is necessary to adjust the parallelism between the two molds 120 and 130.

  The adjustment of the parallelism of the upper and lower molds is generally performed manually by a skilled worker. In addition to being performed manually, the apparatus is also large, so that the adjustment work takes a very long time. In addition, adjustments must be made for each type of mold and for each apparatus (machine difference), and enormous work time is required in mass production lines and factories. As a result, problems such as an increase in production tact and an increase in apparatus cost occur.

  Furthermore, even when the parallelism adjustment is performed by a person, it is practically difficult to achieve 100% parallelism, and there is always a slight parallelism shift. Therefore, as shown in FIG. 9 (in order to make the drawing easier to see, the deviation in parallelism is larger than actual), the mold is clamped in a state where the lower mold 130 is inclined with respect to the upper mold 120. The inclination of the lower mold 130 causes variations in force (clamping force) in the product surface. If the clamping force on the product surface is non-uniform (surface pressure variation occurs), problems such as the occurrence of resin burrs and the inclusion of bubbles in the resin will lead to product quality degradation.

In order to avoid such a shift in parallelism between molds, for example, in Patent Document 1, regardless of the accuracy of the pressurizing apparatus, the gap between the upper mold and the lower mold is not limited during the sealing process. A mold for manufacturing a semiconductor device in which parallelism is realized and resin sealing is performed using a compression molding method is disclosed.
JP 11-274192 A

  However, in the above-described mold for manufacturing a semiconductor device, the surface of the lower mold that can achieve parallelism with respect to the sealing surface of the upper mold is different from the actual sealing surface. In other words, in order to actually realize the parallelism between the sealing surfaces in the sealing process, it is necessary to separately adjust the accuracy between these surfaces, and the above-described mold has an adjustment mechanism for that purpose. (See, for example, paragraphs [0077] to [0079] of Patent Document 1). Therefore, when expansion or change with time occurs in the mold or the entire apparatus, regular adjustment work of the mold is necessary, and an increase in adjustment time leads to an increase in production cost.

  Accordingly, an object of the present invention is to provide a resin sealing device that can automatically realize high-precision parallelism of the upper and lower molds in the sealing step without requiring adjustment work by a person.

  In order to achieve the above-described object, the resin sealing device of the present invention is a first mold and a second mold, in which a resin melted between the molds is injected and pressurized to apply an electron. A first mold and a second mold for resin-sealing components; a first plate for holding the first mold; and the second mold for holding the first mold. Provided between the second plate that pressurizes by moving relative to the plate in the vertical direction, and at least one of the molds and the plate that holds the at least one mold. Two rotational degrees of freedom about axes orthogonal to each other in a plane parallel to the plate holding the mold, and relatively rotating the at least one mold and the plate holding the at least one mold And a joint portion to be connected.

  As described above, according to the resin sealing device of the present invention, there is provided a resin sealing device that can automatically realize high-precision parallelism of the upper and lower molds in the sealing process without requiring any adjustment work by a person. can do.

  Hereinafter, embodiments of the resin sealing device of the present invention will be described with reference to the drawings.

  FIG. 1 is a front view schematically showing a resin sealing device 1 of the present embodiment. FIG. 1A shows the normal state before the sealing step, and FIG. 1B shows the state of the resin sealing device 1 at the time of mold clamping in the sealing step. In the present specification, in order to make the drawings easier to see, the angle deviation between the members is shown larger than the actual in all the drawings.

  The sealing resin device 1 of this embodiment used for resin-sealing electronic components includes an upper mold (first mold) 20 held by a fixed plate (first plate) 2 and a movable plate. (Second plate) 3 has a lower mold 30 (second mold) held on the plate. The upper mold 20 and the lower mold 30 include a heater and a thermocouple (both not shown) for heating the molds 20 and 30, and sufficient heating is performed before the sealing operation is performed. Done.

  The fixed plate 2 is fixed to the base plate 5 by four shafts (only two are shown in FIG. 1) 4 provided at the end of the apparatus.

  The movable plate 3 is connected to a motor 8 attached to the base plate 5 via a ball screw 6 and an attachment portion 7. The ball screw 9 has a structure for transmitting the power of the motor 9 in the vertical direction, whereby the movable plate 3 can be driven in the vertical direction by rotating the rotation of the motor 9. Thus, the movable plate 3 can move relative to the fixed plate 4, and the lower die 30 can be pressed against the upper die 20. Further, when the movable plate 3 moves up and down, the shaft 4 serves as a guide.

  While the lower mold 30 is directly attached and fixed to the movable plate 3, a joint that connects the upper mold 20 and the fixed plate 2 so as to be relatively displaceable between the upper mold 20 and the fixed plate 2. Part 10 is provided. The joint portion 10 has two degrees of freedom of rotation around mutually orthogonal axes (for example, the x direction and the y direction in FIG. 1) in a plane parallel to the fixed plate 2, so-called rolling (rotational motion about the x axis). And a degree of freedom of rotation for pitching (rotational motion about the y-axis). With this joint portion 10, the upper mold 20 can move so as to have the same inclination as that of the fixed plate 2, that is, when the lower mold 30 is inclined. Moreover, the joint part 10 becomes a structure which has sufficient intensity | strength with respect to the pressurization load in the mold clamping from the lower side. Accordingly, even when the pressing is performed in a state where the movable plate 3 is not parallel to the fixed plate 2, that is, in a state where the lower mold 30 is inclined with respect to the upper mold 20, the upper mold 20 is not moved to the lower mold 30. Accordingly, a high degree of parallelism between the molds 20 and 30 can be realized (see FIG. 1B).

  In addition to the two degrees of freedom of rotation described above, the joint unit 10 has a degree of freedom of rotation about an axis orthogonal to these rotation axes, that is, a degree of freedom of rotation of yawing (rotational motion about the z axis). is doing. Such a joint portion 10 is advantageous when the molds 20 and 30 are formed with shapes such as concavities and convexities that fit with each other, and are pressurized while being positioned with respect to each other. That is, when the lower mold 30 is deviated from the normal pressing position in the rotation direction around the z-axis, the unevenness formed in the molds 20 and 30 at the time of pressing becomes a kind of guide, Not only the parallelism of the molds 20 and 30 but also the positioning can be realized automatically.

  Here, a specific configuration example of the joint unit 10 will be described with reference to FIGS. 2 to 4.

  2 to 4 are perspective views schematically showing the joint portion 10 in the present embodiment, respectively.

  FIG. 2 shows a case where a spherical bearing 11 is used as the joint portion 10a. Thereby, the joint part 10a can have not only two rotational degrees of freedom of rolling A1 around the x axis and pitching A2 around the y axis, but also the degree of freedom of rotation of the yawing A3 around the z axis. Thereby, it is advantageous that the three upper degrees of freedom of rotation can be given to the upper mold 20 by one mechanism.

  Moreover, the above-mentioned degree of freedom of rotation can also be realized by using a mechanism as shown in FIG.

  FIG. 3A shows a rotating mechanism section 12 having two plate-like rotating members 13a and 13b and a columnar rotating shaft member 14 provided so as to be sandwiched between them. Each rotary member 13a, 13b is provided with V-shaped rotary grooves 15a, 15b, respectively, and the rotary shaft member 14 is in contact with the rotary grooves 15a, 15b in a rotatable manner. Accordingly, the rotating members 13a and 13b can rotate around the rotating shaft member 14 (see the arrow in FIG. 3A), and the rotating mechanism unit 12 has a degree of freedom of rotation.

  As shown in FIG. 3 (b), two rotation mechanism parts are stacked one above the other and the upper rotation mechanism part 12a is rotated 90 degrees with respect to the lower rotation mechanism part 12b as shown in FIG. The joint part 10b can have rolling A1 and pitching A2. In this case, for example, the above-described three degrees of freedom of rotation can be realized by using, for example, the θ stage 16 that supports the upper mold 20 so as to be rotatable around the z axis.

  In addition, although not shown in the drawing, two of the rotational motions with three degrees of freedom described above can be performed by using a universal joint mechanism. In that case, another mechanism such as the above-mentioned θ stage may be used for the remaining one degree of freedom of rotation, or a combination of two universal joint mechanisms may be used to realize three degrees of freedom of rotation. it can.

  Further, as shown in FIG. 4, a mechanism such as an XY stage 17 having two degrees of freedom in translation directions (see arrows B1 and B2 in FIG. 4) orthogonal to each other in a plane is used as the spherical bearing 11 described above. It can also be used in combination. As a result, it is possible to cope with a horizontal shift between the two molds 20 and 30, and a resin sealing operation requiring higher accuracy is also possible. Further, the same effect is obtained by combining a mechanism such as an XYθ stage having two translational degrees of freedom and rotational degrees of freedom in a plane with two rotating mechanism parts 12a and 12b as shown in FIG. Can also be obtained.

  Next, referring to FIG. 5, the upper mold 20 follows the movement of the lower mold 30 and realizes high-precision parallelism between the two molds 20 and 30 (the operation following the upper mold). ).

  Here, as shown in FIG. 5 (a), the state where the lower mold 30 is rotated counterclockwise as seen in the figure around the x axis will be described. It is assumed that there is no shift in the rotation direction.

  When the movable plate 3 moves upward while the lower mold 30 is tilted with respect to the upper mold 20, the lower mold 30 comes into contact with the right side of the upper mold 20 first (FIG. 5B). )reference). Further, when the movable plate 3 continues to rise due to pressurization, the upper mold 20 receives an upward force from the portion in contact with the lower mold 30. Further, when the movable plate 3 rises and pressurization proceeds, the upper mold 20 moves the x axis with respect to the fixed plate 2 by the joint portion 10 provided between the upper mold 20 and the fixed plate 2. It rotates counterclockwise as seen in the figure at the center. Then, the upper mold 20 and the lower mold 30 move until the inclination is the same (see FIG. 5C). In this manner, the upper mold 20 and the lower mold 30 can achieve high-precision parallelism during mold clamping by pressurization.

  Here, a work procedure for actually manufacturing a resin product will also be briefly described.

  Before the resin sealing device is operated, a product to be molded is set on the upper surface of the lower mold 30. When the start button on the front side of the apparatus is pressed to start the sealing operation, the motor 8 operates to raise the lower mold 30. Even after the upper mold 20 and the lower mold 30 are in contact with each other, the motor 8 continues to be driven, and the lower mold 30 continues to rise upward to pressurize the upper mold 20. At this time, the upper die 20 connected to the fixed plate 2 by the joint portion 10 having at least three degrees of freedom becomes parallel to the lower die 30 by the following operation. Thus, highly accurate parallelism between the upper mold 20 and the lower mold 30 can be realized only by the raising operation of the lower mold 30 without requiring adjustment by a person. Such a follow-up operation on the lower mold 30 of the upper mold 20 is always performed at the time of pressurization, and thus the pressurization surface can be always kept uniform. After the pressurization operation (sealing operation) of the lower mold 30 is completed and the resin product is completed, the lower mold 30 is lowered to a predetermined position, the motor 8 is stopped, and a series of sealing is performed by taking out the product. Stop operation is completed. By repeating this operation, resin products are mass-produced.

  As described above, according to the resin sealing device 1 of the present embodiment, the upper mold 20 is moved with respect to the lower mold 30 at the time of pressurization due to the lower mold 30 being lifted, so Highly accurate parallelism can be automatically realized in the sealing process. As a result, it is possible to eliminate mold parallelism adjustment work due to mold replacement, thermal expansion, apparatus difference, change with time, and the like, which are necessary in conventional resin sealing apparatuses. Therefore, the adjustment work time can be eliminated, leading to a reduction in production tact, and a reduction in production cost can be realized.

  In addition, since it is always possible to perform the following operation during pressurization (during mold clamping), even if the mold is clamped with the movable plate 3 always tilted with respect to the fixed plate 2, the upper mold 20 and the lower mold It becomes possible to make the pressure of the clamping surface with 30 constant. Thereby, in the mass production process of the product, it is possible to improve the quality of the product, prevent defective products, and improve the productivity by suppressing the variation in the surface pressure.

  Furthermore, in the sealing resin device 1 of the present embodiment, by providing the joint portion 10 having three degrees of freedom of yawing, pitching, and rolling on the fixed plate 2 side, it is possible to cope with the inclination and displacement of the movable plate 3. Thus, it becomes possible to make the freedom degree of the movable range of a metal mold | die higher than before. Therefore, it can have robustness against weighted displacement or displacement due to thermal expansion, and can reduce product variation and stabilize quality.

  So far, the embodiment in which the joint portion 10 is provided between the upper mold 20 and the fixed plate 2 has been described. However, in FIGS. 6 and 7, the resin sealing device 1 in another embodiment is illustrated. Show. Each (a) figure is a schematic front view of the resin sealing device 1 at the normal time before the sealing process, and each (b) figure is a mold clamping at the sealing process.

  As shown in these drawings, the joint portion 10 is provided between the lower mold 30 and the movable plate 3 (see FIG. 6), or is provided in both molds 20 and 30 (see FIG. 7). Is also possible. Thereby, it is possible to obtain the same effect as in the above-described embodiment.

  As described above, the resin-sealing device according to the present invention uses a number of QFP (Quad Flat Package) products bonded on a lead frame (reference example: width 50 mm, length 12 mm, etc., 12 locations) as a base metal. Install on the upper surface of the mold and raise the lower mold. After the lower mold and the upper mold are in contact, pressurize the lower mold in the direction of the upper mold and seal against the bonding area. By using the following mechanism (angle following mechanism) of the present apparatus when performing, it is possible to make the pressure on the clamping surface uniform at the time of sealing. As a result, evenly pressurizing the ends of the lead frame can prevent burrs from being removed and voids from being mixed, thereby improving quality.

It is a front view showing roughly the resin sealing device in one embodiment of the present invention. It is a figure for demonstrating the sealing process of the resin sealing apparatus in one Embodiment of this invention. It is a perspective view which shows roughly the joint part of the resin sealing apparatus in one Embodiment of this invention. It is a perspective view which shows roughly the joint part of the resin sealing apparatus in one Embodiment of this invention. It is a perspective view which shows roughly the joint part of the resin sealing apparatus in one Embodiment of this invention. It is a front view which shows roughly the resin sealing apparatus in another embodiment of this invention. It is a front view which shows roughly the resin sealing apparatus in another embodiment of this invention. It is a front view which shows the conventional resin sealing apparatus schematically. It is a front view which shows the conventional resin sealing apparatus schematically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin sealing apparatus 2 Fixed plate 20 Upper mold 3 Movable plate 30 Lower mold 10, 10a, 10b Joint part 11 Spherical bearing 12, 12a, 12b Rotation mechanism part 13a, 13b Rotating member 14 Rotating shaft member 15a, 15b Rotation Axis A1 Rolling A2 Pitching A3 Yawing

Claims (5)

  1st metal mold | die and 2nd metal mold | die, Comprising: The 1st metal mold | die and 2nd metal mold | die for resin-sealing an electronic component by inject | pouring and pressurizing the melted resin between these metal mold | dies A mold, a first plate for holding the first mold, and a second plate for holding the second mold, and performing a pressurization by moving relative to the first plate in the vertical direction. Around the axes orthogonal to each other in a plane parallel to the plate holding the at least one mold, provided between the plate and at least one of the molds and the plate holding the at least one mold A resin sealing device comprising a joint portion that has the two rotational degrees of freedom and connects the at least one mold and the plate holding the at least one mold so as to be relatively rotatable.   The first mold and the second mold are formed such that the second mold is pressed while being positioned with respect to the first mold, and the joint portion is The resin sealing device according to claim 1, further comprising a degree of freedom of rotation about an axis orthogonal to the axis.   The resin sealing device according to claim 1, wherein the joint portion includes a spherical bearing.   The resin sealing device according to claim 1, wherein the joint portion includes at least one universal joint mechanism.   The joint portion includes a columnar first rotating shaft member, a plate-shaped first rotating member formed with a groove that contacts the first rotating shaft member in a rotatable manner, and a columnar first rotating member. And a plate-like second rotary member provided above or below the first rotary member, wherein a second rotary shaft member and a groove that rotatably contacts the second rotary shaft member are formed. The resin sealing device according to claim 1, comprising a rotation mechanism portion having

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