JP2010080749A - Circuit board structure and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board structure in which the effect of an electronic component mounted on one surface hardly reaches an electronic component mounted on the other surface, and to provide an electronic device having the circuit board structure. <P>SOLUTION: The circuit board structure 100 includes a first board 110 having a first electrode interconnect, a second board 120 overlaid on the first board 110 and has a second interconnect, and a plurality of connection members 130 which fix the first board 110 and the second board 120 to form a space 140 between the first board 110 and the second board 120 and at least some of which electrically connect the first electrode interconnect to the second interconnect. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a circuit board structure and an electronic apparatus including the circuit board structure.

  2. Description of the Related Art Conventionally, electronic devices such as mobile phones have a main board having a signal processing function. The main board has a multilayer structure (for example, 8 to 10 layers), and a large number (600 to 1000 points) of electronic components are mounted on both sides of the main board. As a result, the main board exhibits a signal processing function.

  The electronic components mounted on the main board include various types of circuit components such as a radio / signal processing circuit, an acoustic circuit, an optical circuit, and a power supply circuit. For this reason, various interferences such as interference due to high frequency noise, vibration, and acoustic interference occur between the electronic components mounted on the main board, and these interferences cause deterioration of electronic device functions and performance degradation. There was a problem that.

In view of this, a technique has been proposed in which an interference reducing member is arranged between electronic components that cause interference to reduce the interference. However, this method requires a region for disposing the interference reducing member on the main substrate, and thus has a problem that the mounting area of the electronic component is limited.
In addition, in a circuit board in which a conductor circuit is formed on both surfaces of a metal plate via an insulating layer, a hole is provided in a portion of the metal plate located around a portion where an electronic component with low heat resistance is mounted. There has also been proposed a method of reducing the influence of heat from other electronic components on this low heat resistance electronic component (see Patent Document 1).
JP-A-1-228193

  However, in the method proposed in Patent Document 1, since a space is provided in a portion of the metal plate located around the electronic component having low heat resistance, a surface different from the surface on which the electronic component having low heat resistance is mounted. When another electronic component is mounted at a position overlapping with the electronic component in the thickness direction, there is a problem that the influence of heat from the other electronic component cannot be reduced.

  Accordingly, an object of the present invention is to provide a circuit board structure in which the influence of an electronic component mounted on one surface hardly affects the electronic component mounted on the other surface, and an electronic device including the circuit board structure. To do.

  The present invention includes a first substrate provided with a first electrode wiring, a second substrate provided with a second electrode wiring while being stacked on the first substrate, the first substrate, and the second substrate. The first substrate and the second substrate are fixed so as to form a space between them, and at least a part of the plurality of electrodes electrically connect the first electrode wiring and the second electrode wiring. And a connection board member.

  The circuit board structure preferably further includes a heat-generating electronic component mounted on the outer surface of the first substrate and an electronic component mounted on the outer surface of the second substrate.

  Moreover, it is preferable that the heat-generating electronic component and the electronic component of the second substrate are mounted at positions overlapping each other in the thickness direction.

  The circuit board structure includes an electronic component mounted on the outer surface of the second substrate, an underfill that reinforces the connection of the electronic component to the second substrate, and the electronic component on the second substrate. A through hole that is formed in the vicinity of the position and communicates with the space portion, and the underfill is located between the bottom surface of the electronic component and the outer surface of the second substrate from the outer surface side of the second substrate. It is preferable that it is injected into the gap formed at the same time and injected into the through hole to spread around the through hole on the inner surface of the second substrate.

  The circuit board structure includes an electronic component mounted on the outer surface of the first substrate, a cover member disposed on the outer surface of the first substrate and covering the electronic component, a head portion, and a shaft portion. A portion that is positioned in the space portion, and the shaft portion is inserted through the first substrate to fix the first substrate to the cover member, and overlaps the fixing member in the second substrate in the thickness direction. It is preferable to further include a through hole formed at a position and communicating with the space portion.

  Further, the circuit board structure connects the first electronic component and the second electronic component mounted on the outer surface of the second substrate, the first electronic component and the second electronic component, and all or part of the circuit board structure is It is preferable that a signal line disposed on the inner surface of the second substrate and a ground layer disposed on the inner surface of the first substrate facing the signal line via the space portion are further provided.

  The circuit board structure includes an electronic component mounted on the outer surface of the first substrate and an electronic component disposed in the space portion and mounted on the inner surface of the first substrate. The electronic component is inserted through the first substrate. It is preferable to further include a noise bypass member electrically connected to the.

  Further, the circuit board structure is formed on the second substrate, and a sealing portion that annularly connects the inner surface of the first substrate and the inner surface of the second substrate to seal at least a part of the space portion. A through hole communicating with a portion sealed by the sealing portion in the space, and a sounding body electronic component mounted on the second substrate so as to close the through hole with the sounding surface facing outward. Are preferably further provided.

  Further, the circuit board structure is formed on the first substrate, and a sealing portion that annularly connects the inner surface of the first substrate and the inner surface of the second substrate to seal at least a part of the space portion. The first through hole communicating with the portion sealed by the sealing portion in the space portion, and the sealing in the space portion formed at a position overlapping the first through hole in the second substrate in the thickness direction. A second through hole communicating with the portion sealed by the portion, and sound generator electrons mounted on the first substrate so as to block the first through hole in a state where the sound generation surface faces the second through hole side And a component.

  The circuit board structure is disposed in the space portion and is formed at a position overlapping the electronic component on the inner surface of the first substrate and the electronic component on the second substrate in the thickness direction. It is preferable to further include a through hole communicating with the.

  The second substrate includes a hard first rigid portion and a second rigid portion, and a flex portion connecting the first rigid portion and the second rigid portion and having flexibility, and the plurality of connecting members. Is preferably disposed between the second rigid portion of the second substrate and the first substrate.

  Preferably, an electronic component is mounted on the first rigid portion, and a heat-generating electronic component is mounted on the second rigid portion and / or the first substrate.

  In addition, sound receiving body electronic components are mounted on the first rigid portion, and sounding body electronic components, transmitter electronic components, or vibrating body electronic components are mounted on the second rigid portion and / or the first substrate. It is preferred that

  Further, it is preferable that a sound generator electronic component is mounted on the first rigid portion, and a receiver electronic component or an oscillator electronic component is mounted on the second rigid portion and / or the first substrate.

  Preferably, a vibrating electronic component is mounted on the first rigid portion, and an oscillating electronic component or a receiving electronic component is mounted on the second rigid portion and / or the first substrate.

  Preferably, a noise generating electronic component is mounted on the first rigid portion, and a receiver electronic component or an analog circuit electronic component is mounted on the second rigid portion and / or the first substrate.

  The second rigid portion has an opening, and the flex portion extends inward from a peripheral edge of the opening and is connected to the first rigid portion. The size in plan view is preferably smaller than the size of the opening.

  The present invention also relates to an electronic device having any one of the circuit board structures described above.

  According to the present invention, it is possible to provide a circuit board structure in which the influence of an electronic component mounted on one surface hardly affects the electronic component mounted on the other surface, and an electronic device including the circuit board structure.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
First, a mobile phone 1 as an electronic apparatus having the circuit board structure of the present invention will be described with reference to FIG.
FIG. 1 is an external perspective view of a mobile phone 1 according to an embodiment of the present invention.

The mobile phone 1 includes an operation unit side body 2, a display unit side body 3, and a hinge mechanism 4 that couples the operation unit side body 2 and the display unit side body 3.
The operation unit side body 2 includes an operation unit 11 and a microphone 12 on the surface unit 10.
The operation unit 11 includes a function setting operation button 13 for operating various functions such as various setting functions, a phone book function, and a mail function, an input operation button 14 for inputting a telephone number and mail, and determination in various operations. And a determination operation button 15 for performing scrolling and the like.
The microphone 12 is used for inputting a voice uttered by a user of the mobile phone 1 during a call.

  Inside the operation unit side body 2, a key sheet 220 (see FIG. 9 described later), a circuit board on which a plurality of electronic components are mounted (see FIGS. 2 to 16 described later), and power is supplied to the circuit board. A battery case, a shield case (see FIG. 4 described later) as a cover member that covers an electronic component that is disposed on one surface side of the circuit board and mounted on the one surface side are accommodated. The circuit board structure inside the operation unit side body 2 will be described later.

As shown in FIG. 1, the display unit side body 3 is configured to include a display unit 21 and a receiver 22 on the surface unit 20.
The display unit 21 displays various information such as the telephone number, mail address, and mail content of the other party of the call. The receiver 22 outputs the voice of the other party on the call.

  A liquid crystal module (not shown) that displays various types of information on the display unit 21 is housed inside the display unit side body 3. The liquid crystal module includes a liquid crystal panel, a drive circuit that drives the liquid crystal panel, a light source unit such as a backlight that emits light from the back side of the liquid crystal panel, and the like.

  The hinge mechanism 4 connects the operation unit side body 2 and the display unit side body 3 so as to move relative to each other. The mobile phone 1 relatively rotates the operation unit side body 2 and the display unit side body 3 which are connected via the hinge mechanism 4, so that the operation unit side body 2 and the display unit side body 3 are rotated. Can be in an open state (open state), or the operation unit side body 2 and the display unit side body 3 can be folded (closed state).

Next, a first embodiment of the circuit board structure inside the operation unit side body 2 described above will be described with reference to FIG.
FIG. 2 is a cross-sectional view showing the circuit board structure 100 according to the first embodiment.

  The circuit board structure 100 of the first embodiment includes a first substrate 110, a second substrate 120 stacked on the first substrate 110, and a plurality of intervening arrangements between the first substrate 110 and the second substrate 120. Connecting member 130.

One surface and the other surface of the first substrate 110 are each provided with an electrode wiring. One surface and the other surface of the second substrate are each provided with an electrode wiring. The first substrate 110 and the second substrate 120 have a multi-layer structure formed by stacking a plurality of insulating layers having electrode wirings formed on the surfaces thereof.
The insulating layer is composed of a hard insulating base material. Examples of the insulator base material include a glass woven fabric impregnated with an epoxy resin. The electrode wiring is formed by printing a predetermined wiring pattern on the surface of the insulating layer.

The plurality of connection members 130 are made of a conductive member, and are formed in a substantially cylindrical shape having a predetermined height. The plurality of connection members 130 are arranged in a plane direction between the first substrate 110 and the second substrate 120.
Specifically, the plurality of connecting members 130 include a first electrode wiring (not shown) that is an electrode wiring formed on a surface of the first substrate 110 facing the second substrate 120, and a second substrate 120. It arrange | positions so that the 2nd electrode wiring (not shown) which is an electrode wiring formed in the surface facing the 1st board | substrate 110 may be connected.

The plurality of connection members 130 are connected to the first substrate 110 and the second substrate 120 via anisotropic conductive films (not shown), respectively. Thereby, the first substrate 110 and the second substrate 120 are fixed, and the first electrode wiring and the second electrode wiring are electrically connected by at least a part of the plurality of connection members 130.
In addition, a space 140 is formed in a portion where the plurality of connection members 130 are not disposed between the first substrate 110 and the second substrate 120. The space portion 140 has a predetermined height and is formed to expand in the surface direction.

On the outer surface 111 of the first substrate 110 in the circuit board structure 100, a plurality of electronic components 150 including a heat generating electronic component 150A such as a voltage conversion circuit and a high frequency processing circuit are mounted.
Specifically, a plurality of electronic components are fixed at predetermined positions on the electrode wiring formed on the outer surface 111 of the first substrate 110, and the plurality of electronic components 150 and the electrode wiring are electrically connected. Has been.
It is preferable that the heat-generating electronic component 150 </ b> A among the plurality of electronic components 150 is mounted on a portion where the connection member 130 is not disposed on the inner surface side of the first substrate 110.

  A plurality of electronic components 150 are also mounted on the outer surface 121 of the second substrate 120 in the circuit board structure 100. One of the plurality of electronic components 150 is mounted at a position overlapping the heat-generating electronic component 150A in the thickness direction.

According to the circuit board structure 100 of the first embodiment having the above configuration, the following effects can be obtained.
(1) A space 140 is formed between the first substrate 110 and the second substrate 120. Thereby, the transmission of heat generated from the heat-generating electronic component 150 </ b> A mounted on the outer surface 111 of the first substrate 110 in the thickness direction of the circuit board structure 100 is suppressed by the space 140. Therefore, the influence of heat on the electronic component mounted on the second substrate 120 by the heat-generating electronic component 150A mounted on the first substrate 110 can be reduced.
As a result, the degree of freedom of arrangement of electronic components that are easily affected by heat, such as a temperature sensor, a temperature compensated oscillation circuit, and a voltage controlled oscillation circuit, is improved.
That is, according to the circuit board structure 100 of the first embodiment, the influence of the electronic component 150 mounted on one surface is unlikely to affect the electronic component 150 mounted on the other surface.

  (2) The space 140 formed between the first substrate 110 and the second substrate 120 is formed so as to spread in the surface direction of the first substrate 110 and the second substrate 120. Thereby, the heat that has reached the space 140 from the first substrate 110 side diffuses widely in the plane direction in the space 140. Therefore, the influence of heat on the electronic component 150 mounted on the second substrate 120 can be further reduced.

  (3) The heat-generating electronic component 150A is mounted on a portion where the connection member 130 is not disposed on the inner surface side of the first substrate 110. Thereby, in the part which overlaps with exothermic electronic component 150A in the thickness direction, the transmission to the thickness direction of the heat | fever through the connection member 130 can also be suppressed. Therefore, it is possible to further reduce the influence of heat on the electronic component 150 mounted on the outer surface 121 of the second substrate 120 at a position overlapping the heat-generating electronic component 150A in the thickness direction.

Next, a circuit board structure 100 according to the second embodiment will be described with reference to FIG. In the description of each embodiment below, the same constituent elements are denoted by the same reference numerals, and the description thereof is omitted or simplified.
FIG. 3 is a cross-sectional view showing a circuit board structure 100 according to the second embodiment.

The circuit board structure 100 of the second embodiment is mainly different from the first embodiment in the configuration on the second substrate 120 side.
Specifically, a plurality of electronic components 150 including an electronic component 150 </ b> B having a plurality of connection terminals such as BGA and CSP are mounted on the outer surface 121 of the second substrate 120. The circuit board structure 100 according to the second embodiment is formed on the second substrate 120 and the underfill 160 that reinforces the connection between the electronic component 150B mounted on the outer surface 121 of the second substrate 120 and the second substrate 120. A plurality of through holes 122.

  The electronic component 150B is arranged such that a plurality of terminals provided on the bottom surface are positioned on an electrode pattern (not shown) formed on the outer surface 121 of the second substrate 120, and a plurality of connection terminals of the electronic component 150B are provided. And the second substrate 120 are connected by soldering or the like. In a state where the electronic component 150B and the second substrate 120 are connected by soldering or the like, a slight gap is formed between the bottom surface of the electronic component 150B and the outer surface 121 of the second substrate 120.

  The plurality of through holes 122 are formed in the vicinity of the position where the electronic component 150 </ b> B is mounted on the second substrate 120, and communicate with the space 140.

  The underfill 160 is made of a thermosetting resin. The underfill 160 is injected into a gap formed between the bottom surface of the electronic component 150B and the outer surface 121 of the second substrate 120 from the outer surface 121 side of the second substrate 120 in a fluid state. The through hole 122 is injected. As a result, the underfill 160 injected into the plurality of through holes 122 fills the inside of the through holes 122 and also enters the space 140 to surround the plurality of through holes 122 on the inner surface of the second substrate 120. To spread. In this state, the underfill 160 is thermally cured.

The circuit board structure 100 according to the second embodiment has the following effects in addition to the effects (1) and (2) described above.
(4) The underfill 160 was injected into the through hole 122 and spread around the plurality of through holes 122 on the inner surface of the second substrate 120. Accordingly, the underfill 160 that has spread and hardened on the inner surface of the second substrate 120 cannot easily move the through hole 122 toward the outer surface 121. Therefore, the underfill 160 can be hardly peeled off from the second substrate 120, and the connection strength between the electronic component 150B and the second substrate 120 can be improved.

  Next, a circuit board structure 100 according to a third embodiment will be described with reference to FIG. FIG. 4 is a cross-sectional view showing a circuit board structure 100 according to the third embodiment.

  The circuit board structure 100 of the third embodiment includes a shield case 170 as a cover member disposed on the outer surface 111 of the first substrate 110, and a fixing screw 180 as a fixing member that fixes the first substrate 110 to the shield case 170. And a through hole 123 formed in the second substrate 120 and communicating with the space 140.

The shield case 170 has a side wall portion 171 and a lid portion 172. The shield case 170 covers the plurality of electronic components 150 mounted on the outer surface 111 of the first substrate 110 with the end portion side of the side wall portion 171 in contact with the outer surface 111 of the first substrate 110.
The fixing screw 180 includes a head portion 181 and a shaft portion 182. The fixing screw 180 fastens the first substrate 110 and the shield case 170 from the inner surface side of the first substrate 110.

Specifically, a screw hole is formed in a portion where the side wall portion 171 of the shield case 170 is in contact with the side wall portion 171 of the first substrate 110, and a shaft portion 182 of the fixing screw 180 is formed in this screw hole. Are screwed together. Thus, the fixing screw 180 has the head 181 positioned in the space 140 and the shaft 182 inserted through the first substrate 110 to fix the first substrate 110 to the shield case 170.
As shown in FIG. 4, the connection member 130 is not disposed in a portion where the fixing screw 180 is disposed on the inner surface of the first substrate 110.

  The through hole 123 is formed at a position overlapping the fixing screw in the second substrate 120 in the thickness direction. The diameter of the through hole 123 is configured to be larger than the diameter of the head 181 of the fixing screw 180.

  The circuit board structure 100 according to the third embodiment has the following effects in addition to the effects (1) and (2) described above.

  (5) The head 181 of the fixing screw 180 is positioned in the space 140 and the first substrate 110 is fixed to the shield case 170. Thereby, the head 181 of the fixing screw 180 does not protrude toward the outer surface 121 of the second substrate 120. Therefore, the circuit board structure 100 can be thinned.

  Next, a circuit board structure 100 according to a fourth embodiment will be described with reference to FIG. FIG. 5 is a cross-sectional view showing a circuit board structure 100 according to the fourth embodiment.

  The circuit board structure 100 of the fourth embodiment connects the first electronic component 150C and the second electronic component 150D mounted on the outer surface 121 of the second substrate 120, and the first electronic component 150C and the second electronic component 150D. The signal line 190 and the ground layer 112 disposed on the inner surface of the first substrate 110 are provided.

  The first electronic component 150C and the second electronic component 150D transmit and receive high-frequency signals. Examples of the first electronic component 150C and the second electronic component 150D include an antenna element and a high-frequency processing circuit.

The signal line 190 is mostly disposed on the inner surface of the second substrate 120, and transmits a high-frequency signal between the first electronic component 150C and the second electronic component 150D.
Specifically, a through hole 124 is formed in the vicinity of the first electronic component 150C and the second electronic component 150D on the second substrate 120. Most of the signal lines 190 arranged on the inner surface of the second substrate 120 pass through the through holes 124 on one end side and the other end side, respectively, and the first electronic component 150C and the second electronic component are disposed on the outer surface 121 side. 150D is connected.

The ground layer 112 is disposed through the space 140 at a position facing the signal line 190 on the inner surface of the first substrate 110. The ground layer 112 is configured by electrode wiring formed on the inner surface of the first substrate 110.
As shown in FIG. 5, the connection member 130 is not disposed in the portion where the signal line 190 and the ground layer 112 are disposed between the first substrate 110 and the second substrate 120.

  The circuit board structure 100 according to the fourth embodiment has the following effects in addition to the effects (1) and (2) described above.

  (6) The signal line 190 is disposed on the inner surface of the second substrate 120, and the ground layer 112 is disposed on the inner surface of the first substrate 110 via the space 140. Accordingly, the signal line 190, the space 140, and the ground layer 112 can obtain a configuration equivalent to a microstrip line that can suitably transmit a high-frequency signal. Therefore, since the high-frequency signal can be suitably transmitted using the space 140, the wiring efficiency of the circuit board structure 100 can be improved.

  Next, a circuit board structure 100 according to a fifth embodiment will be described with reference to FIG. FIG. 6 is a cross-sectional view showing a circuit board structure 100 according to the fifth embodiment.

The circuit board structure 100 of the fifth embodiment is mounted on a signal processing electronic component 150E such as a switch circuit mounted on the outer surface 111 of the first substrate 110 and the inner surface of the first substrate 110 disposed in the space 140. And a plurality of capacitors 200 as noise bypass members.
The signal processing electronic component 150E is made of BGA and is electrically connected to the first substrate 110 by a plurality of connection terminals.
The plurality of capacitors 200 are electrically connected to the connection terminals of the signal processing electronic component 150E through the first substrate 110. The plurality of capacitors 200 reduce radiation noise generated by the switching operation of the internal circuit of the signal processing electronic component 150E.
As shown in FIG. 6, the connection member 130 is not disposed in a portion where the plurality of capacitors 200 are disposed between the first substrate 110 and the second substrate 120.

  The circuit board structure 100 according to the fifth embodiment has the following effects in addition to the effects (1) and (2) described above.

  (7) The capacitor 200 is disposed in the space 140 and mounted on the inner surface of the first substrate 110. Therefore, radiation noise generated from the signal processing electronic component 150E can be reduced without reducing the mounting efficiency of the electronic component 150 on the outer surface 111 of the first substrate 110.

  Next, a circuit board structure 100 according to a sixth embodiment will be described with reference to FIG. FIG. 7 is a cross-sectional view showing a circuit board structure 100 according to the sixth embodiment.

The circuit board structure 100 of the sixth embodiment is arranged so as to close the sealing portion 210 that seals at least a part of the space portion 140, the through hole 125 formed in the second substrate 120, and the through hole 125. And a sounding body electronic component 150F such as a speaker and a receiver.
The sealing part 210 connects the peripheral part on the inner surface of the first substrate 110 and the peripheral part on the inner surface of the second substrate 120 in an annular shape. Thereby, in 6th Embodiment, the substantially whole area of the space part 140 is sealed by the sealing part 210. FIG.

The through hole 125 communicates with a portion sealed by the sealing portion 210 in the space portion 140.
The sounding body electronic component 150F has a sounding surface 150Fa and is mounted on the outer surface 121 of the second substrate 120 with the sounding surface 150Fa facing outward. The sounding body electronic component 150F is connected to the operation unit side body 2.

  In the circuit board structure 100 of the sixth embodiment, the sound output from the sounding body electronic component 150F is first transmitted through the space 140 positioned behind the sounding surface 150Fa. Here, since the space part 140 is sealed by the sealing part 210, the transmitted sound is resonated in the space part 140. The sound resonated in the space 140 is transmitted from the sound generation surface 150Fa to the outside.

  The circuit board structure 100 according to the sixth embodiment has the following effects in addition to the effects (1) and (2) described above.

  (7) The sealing portion 210 was provided, and the through hole 125 was provided in the second substrate 120, and the sound generator electronic component 150F was mounted so as to close the through hole 125. Thereby, the space part 140 can be made into the resonance space which resonates the sound output from the sounding body electronic component 150F. Therefore, the acoustic performance by the circuit board structure 100 can be improved without providing a separate resonance space.

  Next, a circuit board structure 100 according to a seventh embodiment will be described with reference to FIG. FIG. 8 is a cross-sectional view showing a circuit board structure 100 according to the seventh embodiment.

  The circuit board structure 100 according to the seventh embodiment is formed in the sealing part 210 that seals at least a part of the space part 140, the first through hole 113 formed in the first substrate 110, and the second substrate 120. A second through hole 126 and a sounder electronic component 150 </ b> F disposed so as to close the first through hole 113.

  The sealing part 210 connects the peripheral part on the inner surface of the first substrate 110 and the peripheral part on the inner surface of the second substrate 120 in an annular shape. Thereby, in 7th Embodiment, the substantially whole area of the space part 140 is sealed by the sealing part 210. FIG.

The first through hole 113 and the second through hole 126 are formed at positions overlapping each other in the thickness direction, and communicate with a portion sealed by the sealing portion 210 in the space portion 140.
The sounding body electronic component 150F has a sounding surface 150Fa. The sounding surface 150Fa faces the second through hole 126 side, that is, the outer surface 111 of the first substrate 110 faces the space 140 side. Has been implemented.

  In the circuit board structure 100 of the seventh embodiment, the sound output from the sounding body electronic component 150F is transmitted through the space 140 located in front of the sounding surface 150Fa. Here, since the space part 140 is sealed by the sealing part 210, the transmitted sound is resonated in the space part 140. And the sound resonated in the space 140 is transmitted to the outside from the second through hole 126 provided in front of the sound generation surface 150Fa.

  According to the circuit board structure 100 of the seventh embodiment, the above-described effect (7) is achieved.

  Next, a circuit board structure 100 according to an eighth embodiment will be described with reference to FIG. FIG. 9 is a cross-sectional view showing a circuit board structure 100 according to the eighth embodiment.

  The circuit board structure 100 of the eighth embodiment includes a plurality of electronic components 150G and 150H that are disposed in the space 140 and mounted on the inner surface of the first substrate 110, and the plurality of electronic components 150G and 150H and a plurality of through holes 127 provided at positions overlapping in the thickness direction.

In the eighth embodiment, a light emitter electronic component 150G such as an LED and a sound receiver electronic component 150H such as a microphone are mounted on the inner surface of the first substrate 110.
A key sheet 220 is disposed on the outer surface 121 side of the second substrate 120 and covers the outer surface side of the second substrate 120 and the plurality of light emitting electronic components 150G. An opening 221 is formed in a portion of the key sheet 220 that overlaps the sound receiving body electronic component 150H in the thickness direction, and external sound can be input. The key sheet 220 is made of a light transmissive member.

  The circuit board structure 100 according to the eighth embodiment has the following effects in addition to the effects (1) and (2) described above.

  (8) On the inner surface of the first substrate 110, a plurality of light emitter electronic components 150G and sound receiver electronic components 150H are arranged. Therefore, the circuit board structure 100 can be thinned.

  (9) A plurality of through holes 127 are provided in the second substrate 120 at positions overlapping with the plurality of light emitter electronic components 150G and the sound receiver electronic component 150H in the thickness direction. Therefore, light output from the plurality of light emitter electronic components 150G mounted on the inner surface of the first substrate 110 can be emitted to the outside, and external sound can be input from the sound receiver electronic component 150H.

  Next, a circuit board structure 100 according to a ninth embodiment will be described with reference to FIGS. FIG. 10 is a plan view showing a circuit board structure 100 according to the ninth embodiment, and FIG. 11 is a sectional view taken along line XX of FIG.

In the circuit board structure 100 of the ninth embodiment, the second substrate 120 is configured by a rigid flexible substrate.
The rigid flexible substrate is formed by sandwiching a flexible substrate having flexibility in a multilayer structure of a rigid rigid substrate, and has both the characteristics of the rigid substrate and the flexible substrate.
More specifically, the second substrate 120 includes a rigid first rigid portion 310 and a second rigid portion 320, and a pair of flex portions 330 that connect the first rigid portion 310 and the second rigid portion 320 and have flexibility. And comprising.

As shown in FIG. 10, each of the first rigid portion 310 and the second rigid portion 320 has a rectangular shape in plan view. The size of the first rigid portion 310 is configured to be smaller than the size of the second rigid portion 320.
A rectangular opening 340 is formed in the second rigid portion 320. The opening 340 is formed larger than the size of the first rigid portion 310 in plan view, and the first rigid portion 310 is disposed at a position overlapping the opening 340 in the thickness direction.

  The pair of flex portions 330 extends inward from the peripheral edge of the opening 340 in the second rigid portion 320 and is connected to the first rigid portion 310. More specifically, the pair of flex portions 330 extends from the pair of edges extending in the width direction of the opening 340 along the longitudinal direction of the opening 340 and extends in the width direction of the first rigid portion 310. Connected to the side edge.

In the ninth embodiment, as illustrated in FIG. 11, the plurality of connection members 130 are disposed between the second rigid portion 320 and the first substrate 110 in the second substrate 120, and the first substrate 110 and the second substrate 110. The substrate 120 is fixed and electrically connected.
That is, the plurality of connection members 130 are not arranged on the first rigid portion 310.

Electronic components 150 are mounted on the outer surface 311 of the first rigid portion 310, the outer surface 321 of the second rigid portion 320, and the outer surface 111 of the first substrate 110, respectively.
The electronic component 150 mounted on the outer surface of the first rigid portion 310 is an electronic component that is easily affected by heat, such as a temperature sensor, a temperature compensated oscillation circuit, and a voltage controlled oscillation circuit. Further, on the outer surface 321 of the second rigid part 320 and the outer surface 111 of the first substrate 110, heat-generating electronic components 150A such as a voltage conversion circuit and a high-frequency processing circuit are mounted.

The circuit board structure 100 according to the ninth embodiment has the following effects in addition to the effects (1) and (2) described above.
(10) The second substrate 120 includes the first rigid portion 310, the second rigid portion 320, and the flex portion 330 that connects them. Thereby, the transmission of heat generated from the heat-generating electronic component 150 </ b> A in the surface direction on the second substrate 120 is suppressed by the flex portion 330. Therefore, the influence of heat on the electronic component mounted on the first rigid portion 310 by the heat-generating electronic component 150A mounted on the second rigid portion 320 can be reduced.
As a result, the degree of freedom of arrangement of electronic components that are easily affected by heat, such as a temperature sensor, a temperature compensated oscillation circuit, and a voltage controlled oscillation circuit, is further improved.

  (11) The connection member 130 is not disposed between the first rigid portion 310 and the first substrate 110. Accordingly, the influence of the electronic component 150 mounted on the first substrate 110 on the electronic component 150 mounted on the first rigid portion 310 can be further reduced.

Next, a circuit board structure 100 according to a tenth embodiment will be described with reference to FIG. FIG. 12 is a cross-sectional view of a circuit board structure 100 according to the tenth embodiment.
Each of the embodiments after the tenth embodiment has the same configuration as that of the ninth embodiment except that the characteristics of the electronic components to be mounted are different.

  In the circuit board structure 100 of the tenth embodiment, a sound receiver electronic component 150H such as a microphone is mounted on the outer surface 311 of the first rigid portion 310. A plurality of electronic components 150 including a sound generator electronic component 150F such as a speaker and a transmitter electronic component 150I such as an antenna element and a high frequency processing circuit are mounted on the outer surface 321 of the second rigid portion 320. On the outer surface 111 of the first substrate 110, a plurality of electronic components 150 including a vibrator electronic component 150J such as a vibrator are mounted.

The circuit board structure 100 according to the tenth embodiment has the following effects in addition to the effects (1), (2), and (11) described above.
(12) The sound receiver electronic component 150 </ b> H is mounted on the first rigid portion 310. Accordingly, the sound generator electronic component 150F and transmitter electronic component 150I mounted on the second rigid portion 320, and the sound, high frequency noise, and vibration that the vibrator electronic component 150J mounted on the first substrate 110 gives to the sound receiver electronic component 150H. Can reduce the effects of

  Next, a circuit board structure 100 according to an eleventh embodiment will be described with reference to FIG. FIG. 13 is a cross-sectional view of the circuit board structure 100 according to the eleventh embodiment.

  In the circuit board structure 100 of the eleventh embodiment, a sound generator electronic component 150F such as a speaker or a receiver is mounted on the outer surface 311 of the first rigid portion 310. A plurality of electronic components 150 including a receiver electronic component 150K such as a receiver circuit and an oscillator electronic component 150L such as an oscillator circuit are mounted on the outer surface 321 of the second rigid portion 320.

According to the circuit board structure 100 of the eleventh embodiment, in addition to the effects (1), (2) and (11) described above, the following effects can be obtained.
(13) The sound generator electronic component 150F is mounted on the first rigid portion 310. Therefore, it is possible to reduce the influence of sound and vibration noise on the receiver electronic component 150K and the oscillator electronic component 150L mounted on the second rigid portion 320 by the sound generator electronic component 150F.

  Next, a circuit board structure 100 according to a twelfth embodiment will be described with reference to FIG. FIG. 14 is a cross-sectional view of a circuit board structure 100 according to the twelfth embodiment.

  In the circuit board structure 100 of the twelfth embodiment, a vibrating body electronic component 150J such as a vibrator is mounted on the outer surface 311 of the first rigid portion 310. A plurality of electronic components 150 including a receiver electronic component 150K such as a receiver circuit and an oscillator electronic component 150L such as an oscillator circuit are mounted on the outer surface 321 of the second rigid portion 320.

According to the circuit board structure 100 of the twelfth embodiment, in addition to the effects (1), (2) and (11) described above, the following effects can be obtained.
(14) The vibrating body electronic component 150J is mounted on the first rigid portion 310. Therefore, it is possible to reduce the influence of vibration noise exerted on the receiver electronic component 150K and the oscillator electronic component 150L mounted on the second rigid portion 320 by the vibrator electronic component 150J.

  Next, a circuit board structure 100 according to a thirteenth embodiment will be described with reference to FIG. FIG. 15 is a cross-sectional view of a circuit board structure 100 according to the thirteenth embodiment.

  In the circuit board structure 100 of the thirteenth embodiment, a noise generating electronic component 150M such as a switch circuit or a transmission circuit is mounted on the outer surface 311 of the first rigid portion 310. A plurality of electronic components 150 including a receiver electronic component 150K such as a receiving circuit, an analog circuit electronic component 150N, and the like are mounted on the outer surface 321 of the second rigid portion 320.

The circuit board structure 100 according to the thirteenth embodiment has the following effects in addition to the effects (1), (2), and (11) described above.
(15) The noise generating electronic component 150M is mounted on the first rigid portion 310. Therefore, it is possible to reduce the influence of noise on the receiver electronic component 150K and the analog circuit electronic component 150N mounted on the second rigid portion 320 by the noise generating electronic component 150M.

While the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and can be implemented in various forms.
For example, in the ninth to thirteenth embodiments, the first rigid portion 310 is connected to the second rigid portion 320 by the pair of flex portions 330, but the present invention is not limited to this. That is, as shown in FIG. 16, the first rigid part 310 may be connected to the second rigid part 320 by one flex part 330.
Thereby, the freedom degree of the arrangement | positioning to the thickness direction of the 1st rigid part 310 can be improved, and the various interference which arises between the electronic component 150 mounted in the 1st rigid part 310 and the other electronic components 150 more Can be reduced.

  Further, in each of the above-described embodiments, the present invention is applied to the circuit board accommodated in the operation unit side body 2. However, the present invention is not limited to this. For example, the present invention is accommodated in the display unit side body 3. It may be applied to a circuit board.

  Moreover, the electronic device of the present invention is not a foldable electronic device including the hinge mechanism 4 as in each of the above-described embodiments, but from a state in which the operation unit side body 2 and the display unit side body 3 are overlapped. A sliding electronic device in which one housing is slid in one direction may be used. Alternatively, a rotary (revolver) electronic device in which one casing is rotated around an axis line along the overlapping direction of the operation unit side casing 2 and the display unit side casing 3 may be used.

  The present invention can be applied to portable electronic devices other than cellular phones, and can also be applied to electronic devices other than portable electronic devices. Examples of portable electronic devices other than mobile phones include PHS (registered trademark: Personal Handyphone System), portable game machines, portable navigation devices, PDAs (Personal Digital Assistants), notebook computers, EL displays or liquid crystal displays equipped with an operation unit. Is mentioned.

  Furthermore, examples of electronic devices other than portable electronic devices include electronic dictionaries, calculators, electronic notebooks, digital cameras, video cameras, and radios.

1 is an external perspective view of a mobile phone according to an embodiment of the present invention. It is sectional drawing which shows the circuit board structure concerning 1st Embodiment. It is sectional drawing which shows the circuit board structure concerning 2nd Embodiment. It is sectional drawing which shows the circuit board structure concerning 3rd Embodiment. It is sectional drawing which shows the circuit board structure concerning 4th Embodiment. It is sectional drawing which shows the circuit board structure concerning 5th Embodiment. It is sectional drawing which shows the circuit board structure concerning 6th Embodiment. It is sectional drawing which shows the circuit board structure concerning 7th Embodiment. It is sectional drawing which shows the circuit board structure concerning 8th Embodiment. It is a top view which shows the circuit board structure concerning 9th Embodiment. It is the XX sectional view taken on the line of FIG. It is sectional drawing which shows the circuit board structure concerning 10th Embodiment. It is sectional drawing which shows the circuit board structure concerning 11th Embodiment. It is sectional drawing which shows the circuit board structure concerning 12th Embodiment. It is sectional drawing which shows the circuit board structure concerning 13th Embodiment. It is sectional drawing which shows the modification of the circuit board structure of this invention.

Explanation of symbols

1 Mobile phone (electronic equipment)
DESCRIPTION OF SYMBOLS 100 Circuit board structure 110 1st board | substrate 112 Ground layer 113 1st through-hole 120 2nd board | substrate 122 Through-hole 123 Through-hole 124 Through-hole 125 Through-hole 126 2nd through-hole 127 Through-hole 130 Connection member 140 Space part 150 Electronic component 160 Underfill 170 Shield case (cover member)
180 Fixing screw (fixing member)
181 Head 182 Shaft portion 190 Signal line 200 Noise bypass member 210 Sealing portion 310 First rigid portion 320 Second rigid portion 330 Flex portion 340 Opening portion

Claims (18)

A first substrate provided with a first electrode wiring;
A second substrate stacked on the first substrate and provided with a second electrode wiring;
The first substrate and the second substrate are fixed so as to form a space between the first substrate and the second substrate, and at least a part of the first electrode wiring and the second substrate are fixed. A circuit board structure comprising: a plurality of connecting members that electrically connect the electrode wiring.   The circuit board structure according to claim 1, further comprising: an exothermic electronic component mounted on the outer surface of the first substrate; and an electronic component mounted on the outer surface of the second substrate.   The circuit board structure according to claim 2, wherein the heat-generating electronic component and the electronic component of the second substrate are mounted at positions that overlap each other in the thickness direction. Electronic components mounted on the outer surface of the second substrate;
An underfill that reinforces the connection of the electronic component to the second substrate;
A through hole formed near the position where the electronic component is mounted on the second substrate and communicating with the space portion;
The underfill is injected from the outer surface side of the second substrate into a gap formed between the bottom surface of the electronic component and the outer surface of the second substrate, and is injected into the through hole to form the second substrate. The circuit board structure according to claim 1, wherein the circuit board structure extends around the through hole on the inner surface of the substrate. An electronic component mounted on the outer surface of the first substrate;
A cover member disposed on the outer surface of the first substrate and covering the electronic component;
A fixing member having a head portion and a shaft portion, the head portion being positioned in the space portion, and the shaft portion being inserted through the first substrate and fixing the first substrate to the cover member;
The circuit board structure according to claim 1, further comprising a through hole formed at a position overlapping with the fixing member in the thickness direction in the second substrate and communicating with the space portion. A first electronic component and a second electronic component mounted on the outer surface of the second substrate;
A signal line connecting the first electronic component and the second electronic component, all or part of which is disposed on the inner surface of the second substrate;
The circuit board structure according to claim 1, further comprising: a ground layer disposed via the space portion at a position facing the signal line on the inner surface of the first substrate. An electronic component mounted on the outer surface of the first substrate;
The noise bypass member according to claim 1, further comprising a noise bypass member disposed in the space portion and mounted on an inner surface of the first substrate, and is electrically connected to the electronic component through the first substrate. Circuit board structure. A sealing portion that annularly connects the inner surface of the first substrate and the inner surface of the second substrate to seal at least a part of the space portion;
A through hole formed in the second substrate and communicating with a portion sealed by the sealing portion in the space portion;
The circuit board structure according to claim 1, further comprising: a sound generator electronic component mounted on the second substrate so as to close the through hole in a state where the sound generation surface faces outward. A sealing portion that annularly connects the inner surface of the first substrate and the inner surface of the second substrate to seal at least a part of the space portion;
A first through hole formed in the first substrate and continuing to a portion sealed by the sealing portion in the space portion;
A second through hole formed in a position overlapping the first through hole in the second substrate in the thickness direction and communicating with a portion sealed by the sealing portion in the space portion;
2. The circuit board structure according to claim 1, further comprising: a sound generator electronic component mounted on the first substrate so as to close the first through hole in a state where the sound generation surface faces the second through hole side. An electronic component disposed in the space and mounted on the inner surface of the first substrate;
2. The circuit board structure according to claim 1, further comprising a through hole formed at a position overlapping with the electronic component in the thickness direction in the second substrate and communicating with the space portion. The second substrate includes a hard first rigid part and a second rigid part, and a flex part that connects the first rigid part and the second rigid part and has flexibility.
2. The circuit board structure according to claim 1, wherein the plurality of connection members are disposed between the second rigid portion and the first board in the second board. An electronic component is mounted on the first rigid portion,
The circuit board structure according to claim 11, wherein a heat generating electronic component is mounted on the second rigid portion and / or the first substrate. A sound receiver electronic component is mounted on the first rigid portion,
The circuit board structure according to claim 11, wherein a sound generator electronic component, a transmitter electronic component, or a vibrator electronic component is mounted on the second rigid portion and / or the first substrate. A sound generator electronic component is mounted on the first rigid portion,
The circuit board structure according to claim 11, wherein a receiver electronic component or an oscillator electronic component is mounted on the second rigid portion and / or the first substrate. A vibrating body electronic component is mounted on the first rigid portion,
The circuit board structure according to claim 11, wherein an oscillator electronic component or a receiver electronic component is mounted on the second rigid portion and / or the first substrate. A noise generating electronic component is mounted on the first rigid portion,
The circuit board structure according to claim 11, wherein a receiver electronic component or an analog circuit electronic component is mounted on the second rigid portion and / or the first substrate. The second rigid part has an opening,
The flex portion extends inward from the peripheral edge of the opening and is connected to the first rigid portion;
The circuit board structure according to any one of claims 11 to 16, wherein a size of the first rigid portion in a plan view is smaller than a size of the opening.   An electronic apparatus comprising the circuit board structure according to any one of claims 1 to 17.

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