JP2010080639A - Electronic component unit, and method of manufacturing electronic component unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component unit which suppresses positional deviation of an electronic component in a case, and to provide a method thereof. <P>SOLUTION: There is disclosed the electronic component unit, wherein a capacitor unit 1 includes a capacitor part 10 and an outside case 30 where the capacitor part 10 is stored, and the inside of the outside case 30 is molded with resin in a state where front ends of lead frames 15a and 15b are exposed to the outside of the outside case 30. The outside case 30 has an outside cover 40 and an outside cup 60, and the outside cover 40 has a projection 47 extending toward the outside cup 60, inside the outside case 30. The front end of the lead frame 15b drawn out of the outside case 30 from between the outside cover 40 and the outside cup 60, and the lead frame 15b is interposed between an inner wall side surface 65 of the outside cup 60 and the projection 47. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component unit in which an electronic component is housed in a case and the inside of the case is resin-molded, and a method for manufacturing the electronic component unit.

Conventionally, an electronic component unit described in Patent Document 1 below is known as a technology in such a field. In this electronic component unit, an electronic component such as a capacitor is accommodated in a case, and the inside of the case is resin-molded. In the manufacture of this electronic component unit, the mold resin material is injected into the case and solidified in a state where the electronic component is housed in the case opened above and the metal terminal extending from the electrode of the electronic component is drawn out of the case. Is done. Further, the electronic terminal unit is completed by bending the metal terminal drawn out of the case. Thus, it has been proposed to obtain an electronic component unit that is excellent in pressure resistance and suitable for medium to high pressure applications by resin-molding the electronic component in the case.
Japanese Utility Model Publication No. 2-79020

  However, in the manufacturing process of the electronic component, the position of the electronic component element in the case is unstable from the time the electronic component element is accommodated in the case until the mold resin material is solidified, resulting in misalignment. There is a case. In this way, the required characteristics of the electronic component unit may not be obtained due to the displacement of the position of the electronic component element. Further, when the position of the electronic component element in the case is shifted, the position of the electronic component unit is also shifted with respect to the mounting board.

  Then, an object of this invention is to provide the electronic component unit which can suppress the position shift of the electronic component in a case, and its manufacturing method.

  An electronic component unit of the present invention includes an electronic component having a component main body and a metal terminal fixed to the component main body, and a case for storing the electronic component, and a state in which the tip of the metal terminal is exposed to the outside of the case The case is an electronic component unit in which the inside of the case is resin-molded. The case has a first part and a second part, and the first part is a protrusion extending toward the second part in the case. The tip of the metal terminal is drawn to the outside of the case from between the first part and the second part, and the metal terminal is connected to the inner wall surface of the second part and the first part in the case. It is characterized by being sandwiched between the protrusions of the parts.

  In this electronic component unit, the metal terminal of the electronic component is sandwiched between the inner wall surface of the second part of the case and the protrusion of the first part, and the tip of the metal terminal is connected to the first part and the second part. It is pulled out to the outside of the case. Therefore, in the manufacturing process of the electronic component unit, when forming the case and arranging the electronic component in the case, the first part and the second part are combined, and the metal terminal of the electronic component is used as the protrusion of the first part. And the inner wall surface of the second part. At this time, the metal terminal is fixed by being sandwiched between the protrusion and the inner wall surface. As a result, the entire electronic component including the metal terminal is fixed to the case. As described above, since the electronic component can be fixed to the case in the case before the injection of the mold resin, it is possible to suppress the displacement of the electronic component in the case.

  Specifically, the second part may have a bottomed cup shape, and the protrusion may be inserted to the bottom side of the opening surface of the second part.

  The component main body may have a surface electrode having a pole different from that of the metal terminal provided on the surface, and the protrusion may be located between the surface electrode and the metal terminal. In this type of electronic component unit, there is a mold resin between the metal terminal routed in the case and the surface electrode of the opposite polarity provided on the surface of the component body. Destruction can be a problem. On the other hand, according to the configuration of the electronic component unit, the protrusion that is also a part of the case is located between the surface electrode and the metal terminal. Protrusions that form part of the case are considered to have higher insulation reliability than the mold resin, so the presence of such protrusions between the metal terminal and the surface electrode with a different polarity suppresses the above dielectric breakdown. can do.

  Further, the second part may have a bottomed cup shape, and the metal terminal may be formed along the bottom surface and the inner wall side surface of the second part. With this configuration, the metal terminal is routed at a position away from the component main body in the case, so that the dielectric breakdown between the metal terminal and the component main body can be suppressed.

  Specifically, the second part has a bottomed cup shape, the first part has a cylindrical shape, and a case is formed by combining the openings of the first and second parts. It is good as well. According to this configuration, in the state in which the first and second parts are combined to form the case, the case has an opening. Therefore, this opening can be used as an injection port for injecting mold resin into the case, and the process of injecting mold resin can be facilitated.

  Moreover, the casting surface of the mold resin for resin-molding the inside of the case may be curved. When the casting surface is the surface of the electronic component unit and a plurality of metal terminals are pulled out of the case, the casting surface is curved, thereby increasing the creepage distance between the metal terminals on the surface of the electronic component unit. And the dielectric breakdown between the metal terminals can be suppressed.

  The electronic component unit manufacturing method includes an electronic component having a component main body and a metal terminal fixed to the component main body, and a case for storing the electronic component, and the tip of the metal terminal is exposed to the outside of the case. An electronic component unit manufacturing method for manufacturing an electronic component unit in which the inside of the case is resin-molded, wherein the case has a first part and a second part, and the first part is in the case The first step of housing the component main body of the electronic component inside the second part, the inner wall surface of the second part, and the projection of the first part The first part is combined with the second part so that the metal terminal of the electronic component is sandwiched between the first part and the second part so that the tip of the metal terminal is pulled out of the case. Form a case Two steps, a third step of closing the gap between the terminal lead-out portions where the metal terminals are drawn to the outside of the case, a fourth step of injecting and curing a mold resin into the case and resin-molding the inside of the case, And a fifth step of bending the metal terminal drawn out to a predetermined shape.

  In this manufacturing method, in the second step, the metal terminal of the electronic component is sandwiched between the inner wall surface of the second part of the case and the protrusion of the first part, and the tip of the metal terminal is connected to the first part and the first part. It is pulled out of the case from between the two parts. Therefore, in this second step, when the case is formed and the electronic component is placed in the case, the first part and the second part are combined, and the metal terminal of the electronic component is connected to the protrusion of the first part and the second part. It can be made the state pinched | interposed between the inner wall surfaces of these parts. At this time, since the metal terminal is fixed by being sandwiched between the protrusion and the inner wall surface, as a result, the entire electronic component including the metal terminal is fixed to the case. Thereafter, in the fourth step, the electronic component is Mold resin can be injected in a fixed state. Thus, since resin molding can be performed in a state in which the electronic component is fixed to the case within the case, positional displacement of the electronic component within the case can be suppressed.

  In the third step, the gap may be closed by joining the metal terminal and the first and second parts by thermocompression bonding, ultrasonic pressure bonding, or an adhesive in the terminal lead-out portion. . Since the metal terminal and the first and second parts are securely joined by any one of the above-mentioned thermocompression bonding, ultrasonic pressure bonding, or adhesive, the terminal drawing of the mold resin injected in the fourth step Leakage from the part can be suppressed.

  Each of the first part and the second part has a terminal joint portion that protrudes from the outer wall surface in the metal lead-out direction in the terminal lead-out portion and is joined to the metal terminal in the third step. In the fifth step, the metal terminal may be bent by pressing the mold at a position closer to the tip than the terminal joint of the metal terminal.

  Since the terminal joint part to which the metal terminal is joined in the third step protrudes from the outer wall surface of the first part and the second part in the metal terminal drawing direction, the metal terminal and the first and The joining area with the second part is increased, and the terminal lead-out portion can be closed more reliably. Then, in the fifth step of bending the drawn metal terminal, the die is pressed against the position on the tip side from the above-mentioned terminal joint, so that the damage of the terminal joint due to the die can be avoided. Thus, it is possible to reduce the appearance defect of the completed electronic component unit.

  According to the electronic component unit and the manufacturing method thereof of the present invention, it is possible to suppress displacement of the electronic component in the case.

  Hereinafter, preferred embodiments of an electronic component unit according to the present invention will be described in detail with reference to the drawings.

[First Embodiment]
1 to 3 show a surface mount type capacitor unit 1 as a first embodiment of an electronic component unit according to the present invention. The capacitor unit 1 is a cast-type resin mold medium-high voltage capacitor unit, and includes a capacitor part (electronic component) 10 and an outer case 30 that houses the capacitor part 10. The capacitor unit 1 is housed in an exterior case 30 with the capacitor unit 10 with its lead frames (metal terminals) 15a and 15b exposed to the outside of the exterior case 30, and the interior of the exterior case 30 is resin molded. It is a component unit. Hereinafter, details of the capacitor unit 1 will be described.

  The exterior case 30 is composed of two parts, an exterior cup (second part) 60 and an exterior cover (first part) 40 that are separated in the vertical direction. Both the exterior cover 40 and the exterior cup 60 are made of a plastic material such as LCP (liquid crystal polymer). The exterior cup 60 has a circular bottomed cup shape that opens upward, and the exterior cover 40 has a cylindrical shape that is substantially the same diameter as the exterior cup 60. And the contact surface 60a of the upper end of the exterior cup 60 and the contact surface 40a of the lower part of the exterior cover 40 are abutted, and the opening under the exterior cover 40 and the upward opening of the exterior cup 60 are fitted. Thus, the outer walls of the exterior cover 40 and the exterior cup 60 are flush with each other. As shown in FIG. 4, the fitting guide portion 43 along the inner wall side surface 65 of the outer cup 60 protrudes from the contact surface 40 a of the outer cover 40 as shown in FIG. 4. As described above, the outer case 30 formed by combining the upper and lower parts has a cup shape having the opening 31 on the top as a whole.

  The capacitor unit 10 includes a disk-shaped capacitor main body (component main body) 13 and two lead frames (metal terminals) 15 a and 15 b electrically connected to the capacitor main body 13. The capacitor body 13 includes a ceramic element 17 made of a disk-shaped ceramic molded body. Then, surface electrodes 19a and 19b made of Cu or Ag are formed on both the upper and lower circular end faces of the ceramic element 17 so as to spread substantially near the entire surface. Thus, a capacitor is constituted by the opposing surface electrodes 19a and 19b and the dielectric ceramic element 17 sandwiched between the surface electrodes 19a and 19b. The capacitor body 13 has a posture in which the upper and lower circular end surfaces are substantially parallel to the bottom surface 63 of the outer cup 60, and the upper surface electrode 19 a is positioned lower than the contact surface 60 a of the outer cup 60. It is stored at the approximate center position.

  The lead frames 15a and 15b are formed in a plate shape by applying Sn plating, Sn—Ag alloy plating, or Sn—Ni alloy plating to a lower material made of Cu. One end of the lead frame 15a is fixed to the surface electrode 19a on the upper surface of the capacitor body 13 by soldering. Then, the other end of the lead frame 15a passes between the contact surface 60a of the exterior cup 60 and the contact surface 40a of the exterior cover 40 and is pulled out of the exterior case 30 horizontally, and then the exterior of the exterior case 30 It is bent into a predetermined shape on the outside. Similarly, one end of the lead frame 15b is fixed to the surface electrode 19b on the lower surface of the capacitor body 13 by soldering. The other end of the lead frame 15b passes between the contact surface 60a of the exterior cup 60 and the contact surface 40a of the exterior cover 40 and is pulled out of the exterior case 30 horizontally, It is bent into a predetermined shape on the outside.

  At the positions where the lead frames 15a and 15b pass, flange portions (terminal joint portions) 62a and 62b projecting from the outer wall surface are provided on the radially outer side at two positions on the upper end of the exterior cup 60, respectively. . On the flanges 62a and 62b, guide grooves 61a and 61b extending in the radial direction are formed, respectively. Similarly, flanges (terminal joint portions) 42a and 42b are also provided at two locations below the exterior cover 40 (see FIG. 4) so as to face the flange portions 62a and 62b, respectively. Further, guide grooves 41a and 41b extending in the radial direction are also formed on the flange portions 42a and 42b, respectively.

  Through the guide grooves as described above, through-slits corresponding to the thickness of the lead frames 15a and 15b are formed on the side walls of the outer case 30, and the lead frames 15a and 15b are respectively drawn out through the outer case 30. be able to. The portions from which the lead frames 15a and 15b are pulled out in this way are referred to as terminal lead portions 33a and 33b, respectively, in the following description. Note that the terminal lead portions 33a and 33b are provided on opposite sides of the outer case 30 in order to keep the two lead frames 15a and 15b as far as possible outside the outer case 30 to avoid surface leakage.

  Next, the routing of the lead frame 15b in the outer case 30 will be further described. The lead frame 15 b extends from the lower surface of the capacitor body 13 so as to approach the bottom surface 63 of the exterior cup 60, and further extends along the bottom surface 63 and the inner wall side surface 65 on the distal end side to reach the upper end of the exterior cup 60. Furthermore, the lead frame 15b is bent toward the outside of the outer case 30 on the tip side, passes through a through slit formed by the guide groove 61a and the guide groove 41a, and is drawn out of the outer case 30. As described above, the lead frame 15 b is routed as far as possible from the capacitor body 13 along the bottom surface 63 and the inner wall side surface 65.

  With such a configuration, the distance between the lead frame 15b and the surface electrode 19a having a different polarity from the lead frame 15b is increased. As a result, dielectric breakdown due to discharge between the lead frame 15b and the surface electrode 19a is caused. The possibility of is reduced. The lead frame 15a is routed by a relatively short distance from the upper surface of the capacitor body 13 to the terminal lead portion 33a. Therefore, it is not necessary for the lead frame 15a to pass through the vicinity of the surface electrode 19b or the like having a different polarity, and there is relatively little concern about dielectric breakdown with respect to the lead frame 15a.

  Also, as shown in FIG. 4, the exterior cover 40 is formed with a protrusion 47 that protrudes downward from the contact surface 40a inside the guide groove 41b. As shown in FIG. 3, the protrusion 47 extends downward from the contact surface 40 a toward the exterior cup 60 side, and extends along the inner wall side surface 65 from the contact surface 60 a of the exterior cup 60 to the bottom surface 63 side. Inserted. In the vicinity of the upper end of the exterior cup 60, the lead frame 15 b is pressed against the inner wall side surface 65 by the projection 47, and is sandwiched between the inner wall side surface 65 and the outer surface of the projection 47. The protrusion 47 has a rectangular plate shape and extends in parallel with the inner wall side surface 65 to a position closer to the bottom face 63 than the position of the surface electrode 19a, and the width of the protrusion 47 is larger than the width of the lead frame 15b. Here, the protrusion 47 is formed continuously and integrally with the fitting guide portion 43, but the structure in which the protrusion 47 is formed continuously and integrally with the fitting guide portion 43 is not essential. Further, the fitting guide portion such as the fitting guide portion 43 may be formed on the exterior cup 60 side.

  With such a configuration of the protrusion 47, as shown in FIG. 3, the protrusion 47 exists between the position 16 closest to the lead frame 15b when viewed from the surface electrode 19a and the surface electrode 19a. That is, when viewed from the surface electrode 19a, the closest position 16 of the lead frame 15b is hidden by the protrusion 47 and cannot be seen.

  As described above, the exterior case 30 is resin-molded with the mold resin 80 in a state where the capacitor unit 10 is disposed in the exterior case 30. As described above, by forming the outer cover 40 into a cylindrical shape, the outer case 30 has a cup shape with an opening 31 on the whole, so liquid mold resin can be easily injected into the outer case 30 through the opening 31. And can be filled. As the liquid mold resin to be injected, a heat-resistant epoxy resin which is an insulating paint is used. Here, due to the surface tension of the liquid mold resin injected from the opening 31, the liquid surface has a concavely curved shape, and when the mold resin is then thermoset, a concavely curved casting surface 81 is formed. The casting surface 81 becomes the surface of the completed capacitor unit 1 as it is. As the casting surface 81 of the mold resin 80 is curved in this manner, the creepage distance on the surface of the capacitor unit 1 between the lead frame 15a and the lead frame 15b is increased, and the possibility of surface leakage can be reduced. .

  In addition, since the undercoat paint is applied to the surface of the portion of the capacitor unit 10 in the outer case 30 before the mold resin is injected, a coating layer is formed around the capacitor unit 10 and the lead frames 15a and 15b. 11 is formed. In FIG. 2, illustration of the mold resin 80 and the paint layer 11 is omitted.

  Then, the manufacturing method of this capacitor | condenser unit 1 is demonstrated with reference to FIGS.

(Assembly of capacitor part)
First, as shown in FIG. 5, lead frames 15a and 15b are manufactured by bending a metal plate for a lead frame into a predetermined shape. Next, as shown in FIG. 6, a disk-shaped capacitor body 13 is prepared, one end of the lead frame 15a is soldered to the surface electrode 19a of the capacitor body 13, and similarly, one end of the lead frame 15b is Solder to the surface electrode 19b of the capacitor body 13. Thus, the capacitor unit 10 in which the capacitor body 13 and the lead frames 15a and 15b are integrated is completed. Next, as shown in FIG. 7, an undercoat paint is applied to a portion of the capacitor unit 10 that is housed in the outer case 30 to form a paint layer 11.

  The lead frames 15a and 15b having a metal plate shape have a sufficiently large rigidity with respect to the weight of the capacitor body 13 and the like, and an external force (for example, acting on the capacitor unit 10 in each of the following steps) It can be considered that deformation such as bending of the lead frames 15a and 15b does not occur at the level of the force acting on the capacitor portion 10 when the mold resin is injected into the outer case 30.

(First step)
Next, as shown in FIG. 8, the exterior cup 60 is prepared, and the capacitor unit 10 is accommodated in the exterior cup 60. At this time, the lead frames 15a and 15b are disposed on the guide grooves 61a and 61b, respectively, and the leading ends of the lead frames 15a and 15b protrude from the outer cup 60 to the outside horizontally. At this time, the surface electrode 19a of the capacitor unit 10 is at the same height as the contact surface 60a at the upper end of the exterior cup 60 or at a position lower than the contact surface 60a.

(Second step)
Next, as shown in FIGS. 9 and 10, the exterior cover 40 is fitted onto the exterior cup 60 to form the exterior case 30. At this time, the leading end sides of the lead frames 15a and 15b protrude out of the outer case 30 from the gap between the outer cup 60 and the outer cover 40 at the terminal lead portions 33a and 33b, respectively. In the outer case 30, the lead frame 15 b is pressed against the inner wall side surface 65 of the outer cup 60 by the projection 47 of the outer cover 40, and the lead frame 15 b is sandwiched between the inner wall side surface 65 and the projection 47.

(Third step)
Next, in the terminal lead portion 33a, the lead frame 15a and the flange portions 62a and 42a are thermocompression bonded. Similarly, in the terminal lead portion 33b, the lead frame 15b and the flange portions 62b and 42b are thermocompression bonded. By this processing, the gap between the lead frames 15a, 15b and the outer case 30 in the terminal lead portions 33a, 33b can be closed, and the outer cup 60 and the outer cover 40 can be fixed. Here, since the flanges 42a, 42b, 62a, 62b extend from the outer wall surface of the case 30 along the direction in which the lead frames 15a, 15b are pulled out, the lead frames 15a, 15b and the terminal frames 33a, 33b A large bonding area with the case 30 can be secured, and a more reliable bonding state can be obtained. Note that the joining of the lead frames 15a and 15b and the flange portion is not limited to thermocompression bonding from the viewpoint of reliable joining, and may be performed using an ultrasonic pressure bonding method or may be performed by bonding with an adhesive. .

(4th process)
Next, as shown in FIG. 11, liquid mold resin is injected into the exterior case 30 through the opening 31 of the exterior case 30. At this time, in the third step, the gap between the lead frames 15a and 15b and the outer case 30 is closed, so that the liquid mold resin is prevented from leaking from the terminal lead portions 33a and 33b. The injected liquid mold resin is thermally cured to form a mold resin 80 for mold-sealing the exterior case 30, and the capacitor body 13 is mold-sealed in the exterior case 30. At this time, the upper surface of the mold resin 80 cured in a curved state due to the surface tension forms a casting surface 81 curved in a concave shape.

(5th process)
Next, as shown in FIG. 12, the mold A11 is pressed against the upper surfaces of the lead frames 15a and 15b drawn out of the outer case 30, and the mold A13 is pressed against the lower surfaces of the lead frames 15a and 15b. The lead frames 15a and 15b are bent. At this time, the mold A11 is disposed so as not to contact the flanges 42a and 42b, and is pressed against the lead frames 15a and 15b at a position closer to the tip than the flanges 42a and 42b. Therefore, when the lead frames 15a and 15b are bent, the stress acting on the flange portions 42a and 42b is relieved, and cracks and cracks of the flange portions 42a and 42b, and the flange portions 42a and 42b formed by the molds A11 and A13 are reduced. Crushing can be prevented and appearance defects of the capacitor unit 1 can be prevented. Further, in order to efficiently exhibit the effect of preventing the damage of the flange portions 42a and 42b, it is preferable to shorten the flange portions 42a and 42b, or the flange portions 42a and 42b may be eliminated. Thereafter, the lead frames 15a and 15b are further bent into a predetermined shape and cut into a predetermined length, and the capacitor unit 1 is completed.

  Then, the effect by the above-mentioned capacitor unit 1 and the effect by the above-mentioned manufacturing method are explained.

  As shown in FIG. 3, in the capacitor unit 1, the outer case 30 is constituted by two divided parts such as an outer cover 40 and an outer cup 60. When the capacitor unit 10 is stored in the outer case 30, the lead frame 15 b is pressed against the inner wall side surface 65 of the outer cup 60 by the projection 47 provided on the outer cover 40, and the lead 47 is lead by the projection 47 and the inner wall side surface 65. The frame 15b can be sandwiched and fixed securely. Then, by fixing the lead frame 15 b, the entire capacitor unit 10 is fixed to the outer case 30 in the outer case 30.

  Therefore, after the capacitor portion 10 (particularly, the capacitor body 13) is securely positioned and fixed at a desired position in the outer case 30 in the first step, the liquid mold resin can be injected and cured in the second step. . Therefore, also in the completed capacitor unit 1, the capacitor unit 10 is surely arranged at a desired position, and the positional deviation of components in the outer case 30 can be suppressed.

  Also, in this type of capacitor unit, dielectric breakdown between the parts may be a problem. In particular, in the case of this capacitor unit 1, the lead frame 15b extending from the lower surface of the capacitor body 13 needs to be routed along a long path from the lower surface of the capacitor body 13 to the terminal lead portion 33b. Therefore, it cannot be completely avoided that the distance between the lead frame 15b and the surface electrode 19a having a different polarity is close. Further, the insulating reliability of the mold resin 80 may be reduced due to a defect portion or the like generated during curing. Therefore, there is a possibility that dielectric breakdown due to discharge between the lead frame 15b and the surface electrode 19a may occur.

  In contrast, in the capacitor unit 1, as described above, the protrusion 47 extends to a position closer to the bottom surface 63 than the position of the surface electrode 19a (see FIG. 3). Accordingly, the protrusion 47 exists between the position 16 closest to the lead frame 15b when viewed from the surface electrode 19a and the surface electrode 19a. Thus, since the protrusion 47 which is considered to have higher insulation reliability than the mold resin 80 exists between the position 16 and the surface electrode 19a, the insulation reliability between the protrusion 47 and the lead frame 15b is improved. In addition, the possibility of dielectric breakdown can be reduced.

  Further, as another casting type resin mold medium-high voltage capacitor unit, as shown in FIG. 13, the lead frames 215a and 215b of the capacitor unit 210 are drawn out from the opening 231 of the cup-shaped outer case 203, and the liquid liquefied from the opening 231. A type of capacitor unit 201 that injects mold resin is also conceivable. However, in this case, resin swelled portions 216a and 216b are formed around the lead frames 215a and 215b drawn from the casting surface 281 of the mold resin due to surface tension. As described above, when irregular shapes such as the raised portions 216a and 216b exist on the casting surface 281, for example, in the heat shock test of the capacitor unit 201, thermal stress concentrates on the raised portions 216 a and 216 b, and the mold There is a risk of cracks occurring in the resin 280.

  On the other hand, according to the capacitor unit 1 (FIG. 3), the lead frame 15a, 15b is passed through the space between the exterior cup 60 and the exterior cover 40 by dividing the cup-shaped exterior case 30 into two. It can be pulled out from 30 side walls. Thus, there is no need to pull out the lead frames 15a and 15b from the casting surface 81, and no irregular shape is generated on the casting surface 81. Therefore, there is a low possibility that the mold resin 80 will crack.

[Second Embodiment]
As shown in FIG. 14, the exterior case 103 of the capacitor unit 101 is composed of two parts, an exterior cup (first part) 160 and an exterior cover (second part) 140 that are separated vertically. ing. The exterior cup 160 has a circular bottomed cup shape that opens upward, and the exterior cover 140 has a cylindrical shape that is substantially the same diameter as the exterior cup 160.

  The exterior cup 160 includes a protrusion 167 that extends upward from the bottom surface 163 and is inserted into the exterior cover 140. The lead frame 15 a is pressed against the inner wall side surface 145 of the exterior cover 140 by the projection 167, and is sandwiched between the inner wall side surface 145 and the outer surface of the projection 167. Further, a protrusion 167 exists between the position 116 closest to the lead frame 15a when viewed from the surface electrode 19b and the surface electrode 19b. That is, when viewed from the surface electrode 19b, the closest position 116 of the lead frame 15a is hidden by the protrusion 167 and cannot be seen.

  As described above, the capacitor unit 101 in which the protrusion 167 is provided on the exterior cup 160 can also obtain the same effects as those of the capacitor unit 1 described above. In the capacitor unit 101, the same or equivalent components as those of the capacitor unit 1 described above are denoted by the same reference numerals, and redundant description is omitted.

  The present invention is not limited to the first and second embodiments described above. For example, in the first and second embodiments, the outer covers 40 and 140 and the outer cups 60 and 160 have a circular shape in plan view, but the outer cover and outer cup are polygonal in plan view. The shape may be (for example, a quadrangle) or another shape.

It is a perspective view which shows a capacitor | condenser unit as 1st Embodiment of the electronic component unit which concerns on this invention. It is a disassembled perspective view of the capacitor | condenser unit of FIG. It is sectional drawing of the capacitor | condenser unit of FIG. It is a perspective view which shows the shape which looked at the exterior cover of the capacitor | condenser unit of FIG. 1 from the downward direction. It is a front view which shows 1 process of the manufacturing method of the capacitor | condenser unit of FIG. (A) is a front view which shows the subsequent process of FIG. 5, (b) is the top view. FIG. 7 is a cross-sectional view showing a step subsequent to FIG. 6. (A) is a front view which shows the subsequent process of FIG. 7, (b) is the top view. FIG. 9 is a cross-sectional view showing a step subsequent to FIG. 8. FIG. 10 is a cross-sectional view showing a step subsequent to FIG. 9. FIG. 11 is a cross-sectional view showing a step subsequent to FIG. 10. FIG. 12 is a cross-sectional view showing a step subsequent to FIG. 11. It is sectional drawing which shows the other capacitor | condenser unit compared with the capacitor | condenser unit of FIG. It is sectional drawing which shows the capacitor | condenser unit of 2nd Embodiment of the electronic component unit which concerns on this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Capacitor unit, 10 ... Capacitor part (electronic component), 13 ... Capacitor main body (component main body), 15b ... Lead frame (metal terminal), 19a ... Surface electrode, 30 ... Exterior case, 33a, 33b ... Terminal lead-out part, 40 ... exterior cover (first part), 42a, 42b ... collar (terminal joint), 47 ... projection, 60 ... exterior cup (second part), 62a, 62b ... collar (terminal joint), 63 ... Bottom surface, 65 ... Inner wall side surface, 80 ... Mold resin, 81 ... Casting surface, 101 ... Capacitor unit, 103 ... Exterior case, 140 ... Exterior cover (second part), 160 ... Exterior cup (first part) ), 167... Projection, A11.

Claims (9)

An electronic component having a component main body and a metal terminal fixed to the component main body, and a case for storing the electronic component, and the inside of the case is in a state where a tip of the metal terminal is exposed to the outside of the case. An electronic component unit molded with resin,
The case has a first part and a second part,
The first part has a protrusion extending toward the second part in the case,
The tip of the metal terminal is drawn to the outside of the case from between the first part and the second part,
The electronic component unit, wherein the metal terminal is sandwiched between an inner wall surface of the second part and the protrusion of the first part in the case. The second part has a bottomed cup shape,
2. The electronic component unit according to claim 1, wherein the protrusion is inserted to a bottom surface side from an opening surface of the second part. The component body has a surface electrode having a pole different from the metal terminal provided on the surface,
The protrusion is
The electronic component unit according to claim 1, wherein the electronic component unit is located between the surface electrode and the metal terminal. The second part has a bottomed cup shape,
The metal terminal is
The electronic component unit according to claim 1, wherein the electronic component unit is formed along a bottom surface and an inner wall side surface of the second part.   The second part has a bottomed cup shape, the first part has a cylindrical shape, and the case is formed by combining openings of the first and second parts. The electronic component unit according to any one of claims 1 to 4.   The electronic component unit according to any one of claims 1 to 5, wherein a casting surface of a mold resin for resin-molding the inside of the case is curved. An electronic component having a component main body and a metal terminal fixed to the component main body, and a case for storing the electronic component, and the inside of the case is exposed with a tip of the metal terminal exposed to the outside of the case. An electronic component unit manufacturing method for manufacturing an electronic component unit formed by resin molding,
The case has a first part and a second part, and the first part has a protrusion extending toward the second part in the case,
A first step of storing the component main body of the electronic component inside the second part;
The metal terminal of the electronic component is sandwiched between the inner wall surface of the second part and the protrusion of the first part, and the tip of the metal terminal is between the first part and the second part. A second step of forming the case by combining the first part with the second part so as to be pulled out from the case to the outside;
A third step in which the metal terminal closes a gap in a terminal lead-out portion drawn out of the case;
A fourth step of injecting and curing a mold resin into the case and resin-molding the case;
A fifth step of bending the metal terminal drawn out of the case into a predetermined shape;
An electronic component unit manufacturing method comprising: In the third step,
The said gap is closed by joining the said metal terminal and said 1st and 2nd parts by thermocompression bonding, ultrasonic pressure bonding, or an adhesive agent in the said terminal drawer part. The manufacturing method of the electronic component unit of Claim 7. The first part and the second part are provided at the terminal lead-out portion so as to protrude from the outer wall surface in the pull-out direction of the metal terminal, and are joined to the metal terminal in the third step. Have
In the fifth step,
9. The method of manufacturing an electronic component unit according to claim 7, wherein the metal terminal is bent by pressing a metal mold at a position closer to a tip side than the terminal joint portion of the metal terminal.

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