JP2010067835A - Method of manufacturing electronic component mounted with wiring board and electronic component mounted with wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting wiring board composed by filling a part between an electronic component and a wiring pattern with an insulating member without forming a gap, improving the adhesion of the electronic component and the wiring pattern, and preventing the peeling of the electronic component from the wiring pattern. <P>SOLUTION: An electronic component built-in type two-layer wiring board composed by embedding an electronic component so as to expose at least a part of at least one main surface in an insulating member disposed between a pair of wiring patterns is formed. On the exposed side of the electronic component of the two-layer wiring board, a wiring board having the insulating member is laminated, and the exposed part of the electronic component of the two-layer wiring board is embedded with the insulating member. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic component mounting wiring board in which an electronic component is embedded in an insulating member disposed between wiring patterns, and the electronic component mounting wiring board.

  In recent years, electronic devices are required to have higher density and higher functionality in the trend of higher performance and smaller size. From this point of view, even modules with circuit components are required to support high density and high functionality. In order to meet such demands, multilayering of wiring boards is currently being actively performed.

  In such a multilayer wiring board, a plurality of wiring patterns are arranged so as to be substantially parallel to each other, an insulating member is disposed between the wiring patterns, and an electronic component such as a semiconductor component is placed in the insulating member. It is embedded so as to be electrically connected to at least one of the wiring patterns, and an interlayer connection (via) penetrating the insulating members in the thickness direction is formed to electrically connect the plurality of wiring patterns to each other. (For example, refer to Patent Document 1).

Conventionally, the electronic component built-in wiring board described above has been manufactured by, for example, B ² it (B Square It). This manufacturing method obtains a target electronic component built-in wiring board according to the following steps. That is, a wiring having a pair of wiring patterns arranged so as to be substantially parallel to each other via an insulating member (prepreg), and these wiring patterns are appropriately electrically connected in the thickness direction by an interlayer connector. An electronic component is arranged on the substrate so as to be electrically connected to the wiring pattern to form an electronic component mounting type wiring substrate, and an electronic component non-mounting type wiring substrate having the same configuration is prepared. These wiring boards are formed by pressurizing and laminating each other under heating (for example, see Non-Patent Document 1).

  When laminating the wiring boards, the insulating board (prepreg) is fluidized by heating the wiring boards, and is formed between the electronic components by the insulating board (prepreg). A gap, in particular, a gap between the electronic component and the wiring pattern is filled.

  However, as the size of the electronic component is reduced, the melted insulating member does not sufficiently wrap around the gap, and the gap cannot be completely buried. For this reason, the gap remains between the electronic component and the wiring pattern.

  On the other hand, when the solder material is reflowed due to heating in the mounting process, the insulating member does not exist between the electronic component and the wiring pattern, and thus the gap is used as a base point. As a result, the possibility of occurrence of delamination (swelling and peeling) increases, and the solder material in the gap portion reflows, causing a short circuit of the electronic component built-in wiring board.

JP 2003-197849 A Build-up multilayer printed wiring board technology (June 20, 2000, published by Nikkan Kogyo Shimbun)

  According to the present invention, the gap between the electronic component and the wiring pattern is filled with an insulating member without forming a gap, and the adhesion between the electronic component and the wiring pattern is improved. An object of the present invention is to provide a wiring board with a built-in electronic component that prevents peeling of the electronic component.

In order to achieve the above object, the present invention provides:
Electronic component built-in type two-layer wiring in which an electronic component is embedded in a first insulating member disposed between a pair of first wiring patterns so that at least a part of at least one main surface is exposed. Forming a substrate;
A second wiring pattern is formed on one main surface of the second insulating member, and an interlayer connection body is formed through the second insulating member and electrically connected to the second wiring pattern. Forming a wiring board having,
The second insulating member of the wiring board is located on the side of the two-layer wiring board on which at least one main surface of the electronic component is exposed, and the interlayer connector is the first wiring pattern. A step of laminating the two-layer wiring board and the wiring board under heating so as to be electrically connected to each other;
It is related with the manufacturing method of the electronic component mounting wiring board characterized by including.

The present invention also provides an electronic component in which an electronic component is embedded in a first insulating member disposed between a pair of first wiring patterns so that at least a part of at least one main surface is exposed. Built-in two-layer wiring board,
A second wiring pattern is formed on one main surface of the second insulating member, and an interlayer connection body is formed through the second insulating member and electrically connected to the second wiring pattern. The second insulating member is in contact with the at least part of the exposed at least one main surface of the electronic component, and the interlayer connection body is electrically connected to the first wiring pattern. A wiring board laminated on the two-layer wiring board,
It is related with the electronic component mounting wiring board characterized by comprising.

  According to the present invention, instead of a wiring board on which an electronic component is mounted on a wiring pattern as in the prior art, the electronic component is embedded in an insulating member, and at least a part of at least one main surface thereof is exposed. An electronic component built-in type two-layer wiring board is prepared, and the insulating member in the wiring board having the conventional configuration is positioned on the side of the two-layer wiring board on which the main surface of the electronic component is exposed. The two-layer wiring board and the wiring board are laminated while being heated.

  In this case, the insulating member of the wiring board flows and flows onto the exposed main surface of the electronic component. On the other hand, since the electronic component is embedded in the insulating member of the two-layer wiring board, the main surface on the unexposed side of the electronic component is in contact with the insulating member. Therefore, when the two-layer wiring board and the wiring board are stacked, the periphery of the electronic component is surrounded by the insulating member of the two-layer wiring board and the insulating member of the wiring board without a gap.

  As a result, since the electronic component is firmly held by the insulating member, the solder material connecting the electronic component and the wiring pattern is reflowed by heating in the above-described laminating process. However, the electronic component does not peel off from the wiring pattern. As a result, there is no fear that the obtained electronic component built-in wiring board will be defective.

  As described above, according to the present invention, the gap between the electronic component and the wiring pattern is filled with the insulating member without forming a gap, and the adhesion between the electronic component and the wiring pattern is improved. An electronic component built-in wiring board that prevents peeling from the wiring pattern can be provided.

  Hereinafter, specific features of the present invention will be described based on the best mode for carrying out the invention.

  1 to 15 are process diagrams showing an example of a method of manufacturing an electronic component mounting wiring board according to the present invention. 1 to 9 are process diagrams relating to a method of manufacturing a two-layer wiring board with a built-in electronic component.

  First, as shown in FIG. 1, a metal support 11 is prepared, a metal foil 12 made of, for example, copper foil is formed on the support 11, and a conductor land 13 is further formed. The metal foil 12 can be formed by, for example, a plating method. The conductor land 13 can be formed by screen printing using, for example, a conductive paste. In particular, when a conductive paste is used, stress relaxation can be caused by the elasticity of the paste material, and reliability can be improved.

  Next, as shown in FIG. 2, an electronic component 21 is fixed on the conductor land 13 via a conductive connection member 14 such as solder, and the electronic component 21 is placed on the support plate 11 via the metal foil 12 and the conductor land 13. The component 21 is arrange | positioned and the electronic component laminated body 15 is obtained.

  Next, as shown in FIG. 3, an additional support 31 made of metal is prepared, and a metal foil 32 made of, for example, copper foil is formed on the support 31, and then, for example, a screen is formed as shown in FIG. A conical bump 33A made of a conductive material is formed by printing. Next, as shown in FIG. 5, the prepreg 34 </ b> A is formed so that the bumps 33 </ b> A penetrate, and the prepreg laminate 35 is obtained.

  Next, as shown in FIG. 6, the prepreg laminate 35 is turned upside down, and the electronic component laminate 15 and the prepreg laminate 35 are laminated so that the bumps 33 </ b> A are in contact with the metal foil 12 of the electronic component laminate 15. Then, as shown in FIG. 7, heating and pressing are performed from above and below through the support plates 11 and 31. At this time, the prepreg 34 </ b> A is cured to become the insulating member 34, and the bump 33 </ b> A becomes the interlayer connector 33.

  Then, as shown in FIG. 8, after removing the support bodies 11 and 31, as shown in FIG. 9, the metal foils 12 and 32 are patterned by the photolithography technique, and a pair of wiring patterns 41 and 42 are formed. Thus, the electronic component built-in type two-layer wiring board 40 is formed.

  As is clear from FIG. 8, the electronic component 21 has a size on the order of, for example, a sub-micron, so that the gap between the electronic component 21 and the metal foil 12 in the prepreg 34A in the heating and pressing operation described above. The wrap around 36 becomes insufficient, and the air gap 36 cannot be completely buried, but in some cases, it remains as it is. Therefore, after forming the two-layer wiring board 40 as shown in FIG. 9, the gap 36 is opened, and the main surface 21 </ b> A located on the lower side of the electronic component 21 is exposed.

  In this example, since the electronic component 21 is fixed on the conductor land 13, the surface level of the main surface 21A is lower than the surface level of the wiring pattern 42 on the side where the main surface 21A is exposed. It is in a depressed state. On the other hand, the electronic component 21 is electrically connected to the wiring pattern 42 via the connection member 14 and the conductor land 13.

  The electronic component 21 can be a passive component such as a capacitor and a thermistor, but can also be an active component such as an IC, a transistor, or a diode. When the electronic component 21 is an active component, for example, in the process shown in FIG. 2, an underfill resin may be injected into the gap between the electronic component 21 and the metal foil 12. In comparison, the possibility of forming the air gap 36 as described above is reduced.

  Therefore, the manufacturing method of this example can be particularly preferably used when the electronic component 21 is a passive component. However, even when the electronic component 21 is an active component, the formation of the gap 36 cannot be completely eliminated, and therefore the manufacturing method of this example can be applied even in such a case.

  On the other hand, as shown in FIG. 10, a metal foil 51 such as a copper foil is prepared, and a conical bump 52A made of a conductive material is formed on the metal foil 51 by, for example, screen printing. Next, as shown in FIG. 11, a prepreg 53A is formed so that the bump 52A penetrates. Next, as shown in FIG. 12, a metal foil 54 such as a copper foil is placed on the prepreg 53A, and then a heat and pressure press is performed to cure the prepreg 53A, and a double-sided metal (copper) foil-clad plate is formed. Form.

  Next, as shown in FIG. 13, the metal foil 54 is patterned by photolithography to form a wiring pattern 55, and conical bumps 56A are formed on the wiring pattern 55 by, for example, screen printing. Next, the prepreg 57A is formed so as to penetrate the bump 56A, and the wiring board 60 having the interlayer connection body (bump) is obtained.

  Next, as shown in FIG. 14, the two-layer wiring board 40 obtained in FIG. 9 is turned upside down and the wiring board 60 obtained in FIG. The wiring board 60 obtained in FIG. 13 is turned upside down from below the two-layer wiring board 40 so that the bumps 56A are in electrical contact with the wiring pattern 42. To be laminated.

  Next, as shown in FIG. 15, the laminate obtained in FIG. 14 is heated and pressed from above and below, and the metal foil 51 is patterned to form a wiring pattern 58, thereby obtaining a target electronic component built-in wiring board 70. At this time, the prepreg 57 </ b> A is cured to form the insulating member 57. On the other hand, the prepreg 57A of the wiring board 60 positioned above is fluidized and embeds around the gap 36 where the main surface 21A of the two-layer wiring board 21 is exposed.

  Therefore, the exposed main surface 21A of the electronic component 21 comes into contact with the insulating member 57 and is surrounded by the insulating member 57 without a gap. As a result, since the electronic component 21 is firmly held by the insulating member 57, even when the joining member 14 or the like connecting the electronic component 21 and the wiring pattern 42 is reflowed by heating in the mounting process. Since the insulating member 57 exists between the electronic component 21 and the wiring pattern 42 and no gap is formed, the electronic component is caused by the occurrence of delamination (swelling or peeling) based on the gap or the reflow of the solder material. There is no fear that the built-in wiring board 70 becomes defective.

In the conventional B ² it (B Square It), the gap 36 formed below the electronic component 21 is not opened. Therefore, as shown in the step shown in FIG. 14 of this example, the prepreg does not wrap around the gap 36 even if the wiring boards are stacked from above and below.

  As a result, even after the electronic component built-in wiring board is manufactured, the gap 36 remains as described above, and the bonding member 14 that bonds the electronic component 21 and the wiring pattern 42 is heated by the above-described laminating process. When the reflow is performed, there is no insulating member between the electronic component 21 and the wiring pattern 42, and a gap is formed between the electronic component 21 and the wiring pattern 42. There is a case. For this reason, the electronic component 21 peels from the wiring pattern 42, and the obtained electronic component built-in wiring board 70 becomes defective.

  The present invention has been described in detail based on the above specific examples. However, the present invention is not limited to the above specific examples, and various modifications and changes can be made without departing from the scope of the present invention.

  For example, in the above specific example, the wiring board 60 is a wiring board having a two-layer structure, but any number can be used depending on the type of the electronic component mounting wiring board, and a single-layer structure or a three-layer structure. It can be set as the above structure.

It is a figure which shows 1 process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention. Similarly, it is a figure which shows one process in an example of the manufacturing method of the electronic component built-in wiring board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11, 31 Support plate 12, 32, 51, 55 Metal foil 13 Conductor land 14 Connection member 15 Electronic component laminated body 21 Electronic component 33A, 52A, 56A Bump 34, 53, 57 Insulating member 34A, 53A, 57A Prepreg 35 Prepreg lamination Body 36 Air gap 40 Electronic component built-in type two-layer wiring board 41, 42, 55, 58 Wiring pattern

Claims (6)

Electronic component built-in type two-layer wiring in which an electronic component is embedded in a first insulating member disposed between a pair of first wiring patterns so that at least a part of at least one main surface is exposed. Forming a substrate;
A second wiring pattern is formed on one main surface of the second insulating member, and an interlayer connection body is formed through the second insulating member and electrically connected to the second wiring pattern. Forming a wiring board having,
The second insulating member of the wiring board is located on the side of the two-layer wiring board on which at least one main surface of the electronic component is exposed, and the interlayer connector is the first wiring pattern. A step of laminating the two-layer wiring board and the wiring board under heating so as to be electrically connected to each other;
A method for producing an electronic component mounting wiring board, comprising:   In the two-layer wiring board, the electronic component is electrically connected to the first wiring pattern on a side where the at least one main surface is exposed, and the electronic component is formed on the at least one main surface of the electronic component. 2. The method of manufacturing an electronic component-mounted wiring board according to claim 1, wherein the surface level is lower than the surface level of the first wiring pattern and is recessed.   The method of manufacturing an electronic component mounting wiring board according to claim 1, wherein the electronic component is a passive component. Electronic component built-in type two-layer wiring in which an electronic component is embedded in a first insulating member disposed between a pair of first wiring patterns so that at least a part of at least one main surface is exposed. A substrate,
A second wiring pattern is formed on one main surface of the second insulating member, and an interlayer connection body is formed through the second insulating member and electrically connected to the second wiring pattern. The second insulating member is in contact with the at least part of the exposed at least one main surface of the electronic component, and the interlayer connection body is electrically connected to the first wiring pattern. A wiring board laminated on the two-layer wiring board,
An electronic component mounting wiring board, comprising:   The second insulating member of the wiring board is electrically connected to the first wiring pattern on the side where the at least one main surface is exposed in the two-layer wiring board, 5. The electronic component mounting according to claim 4, wherein a surface level of the at least one main surface of the electronic component is lower than a surface level of the first wiring pattern, and a recessed portion is embedded. Wiring board.   The electronic component mounting wiring board according to claim 4, wherein the electronic component is a passive component.

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