JP2010062451A - Component built-in type multilayer wiring board, and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component built-in type multilayer wiring board and a method for manufacturing the same, which are specially suitable to perform component incorporation and interlayer connection by a surface mounting device being commonly-used existing equipment and a plating method. <P>SOLUTION: The component built-in type multilayer wiring board includes: the first circuit pattern layer 1 having the first and second main surfaces 1a, 1b; the first and second circuit components 2, 3 respectively surface-mounted on the first and second main surfaces 1a, 1b; the film-like first adhesion resin layer 4 which internally seals the first circuit component 2 and where the first main surface 1a of the first circuit pattern layer 1 adheres onto one surface; the second circuit pattern layer 5 having the first and second main surfaces 5a, 5b, where the first main surface 5a adheres onto the other surface of the adhesion resin layer 4 and the third circuit component is surface-mounted on the second main surface 5b; a through-hole H penetrating the adhesion resin layer 4 between the first and second circuit patterns; and a conductive via 51a made of a plating layer for the mutual connection of the first and second circuit patterns through the through-hole. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a component built-in type multilayer wiring board and a manufacturing method thereof, and in particular, a component built-in type multilayer wiring board suitable for performing component built-in and interlayer connection by a surface mounting apparatus and a plating method, which are general current facilities, and the manufacturing thereof. Regarding the method.

  In recent years, in the field of circuit wiring boards incorporated in various electronic devices such as mobile phones and digital cameras, there are increasing demands for miniaturization, thinning, multi-functionality and high density. In order to meet this demand, circuit components such as active elements such as semiconductor IC / LSI and passive elements such as resistors, which have been mounted on the surface of circuit wiring boards, are embedded in the circuit wiring board. Reduced component built-in technologies have been developed.

  The component built-in technology increases the degree of freedom of component placement compared to the case of surface mounting (SMT), and can be expected to improve high-frequency characteristics by optimization such as shortening the wiring length between components. In the future, various circuit parts such as active / passive elements will be developed in response to the demand for multi-functionality, and the number of built-in circuit parts to be embedded will increase, and it will be easy to incorporate them by reducing the chip size. It is expected that the component built-in technology will be applied to a large-scale circuit wiring board such as a main board as the computerization progresses.

  Such a component built-in technology is disclosed in Patent Document 1 and Patent Document 2 as an example. In the technique of Patent Document 1, an electrical component mounted only on one side of a conductor circuit provided on a transfer substrate is embedded in a resin layer in a B-stage state, and the conductor circuit is bonded to the surface of the resin layer. Thereafter, the transfer substrate is peeled off to provide an electric component built-in wiring board (layer) having a conductor circuit on the surface of the resin layer. This technology is widely known as SIMPACT (registered trademark of Matsushita Electric Industrial Co., Ltd.), and Patent Document 2 discloses a component built-in technology similar to Patent Document 1.

  Incidentally, in Patent Documents 1 and 2, ALIVH (registered trademark of Matsushita Electric Industrial Co., Ltd.) or the like is used as means for electrical connection (interlayer connection) between multilayer wirings to a wiring board (layer) in which components are built. As in B2it (registered trademark), a conductive via formed by pressurizing and filling a conductive paste into a through hole of an insulating resin substrate is used.

  However, for the interlayer connection with such a component built-in technology, there is a problem that a dedicated special manufacturing facility is required, and it is difficult to realize it by diverting the current facility or board material. In addition, many conductive pastes are pressure-bonded at many locations on the conductor circuit (pattern), but the pressure-bonding uniformity between each location cannot be obtained sufficiently, resulting in an increase in interlayer contact resistance. Have

  On the other hand, when mounting a component using a general surface mounting (SMT) device, first, a circuit pattern is formed in advance on the mounting surface when mounting a circuit component on a substrate (base material). is required.

  Therefore, when a normal single-sided copper foil laminate (single-sided CCL) is used for the substrate, the circuit component is mounted after the copper foil layer is patterned, and this circuit component is built in another laminated insulating resin substrate. However, in order to mount a circuit component on the opposite surface of the one-sided CCL and further incorporate it in another insulating resin substrate, an additional process for forming a new circuit pattern by the additive method or the like is formed on the opposite surface. There is a drawback that it requires a complicated process and an increase in manufacturing cost. Such a difficulty cannot be solved even in Patent Documents 1 and 2.

Further, even when the double-sided CCL is used for the substrate, in order to use a plating method to make an interlayer connection across an insulating resin substrate containing a circuit component, a mask process for protecting the circuit pattern surface, Alternatively, two plating steps of performing plating for the interlayer connection in addition to plating for connection of the circuit patterns themselves on both surfaces are required, resulting in complicated processes and increased manufacturing costs.
JP 2007-83423 A JP 2004-146634 A

  The present invention solves the above-described problems, and is a component mounting type multilayer wiring board particularly suitable for performing component built-in and interlayer connection by a surface mounting apparatus and plating method, which are general current facilities, and a method for manufacturing the same. The purpose is to provide.

  The component-embedded multilayer wiring board according to the first aspect of the present invention includes a first circuit pattern layer having first and second main surfaces, and first and second surface mounted on the first and second main surfaces, respectively. A second circuit component, a first adhesive resin layer in the form of a film in which the first circuit component is sealed inside and the first main surface of the first circuit pattern layer is bonded to one surface; A second circuit pattern layer having two main surfaces, the first main surface being bonded to the other surface of the adhesive resin layer, and a third circuit component being surface-mounted on the second main surface; A through hole penetrating the adhesive resin layer between two circuit patterns and a conductive via made of a plating layer for interconnecting the first and second circuit patterns through the through hole are provided. .

  According to a second aspect of the present invention, in the multilayer wiring board with built-in components according to the first aspect, a fourth circuit component is surface-mounted on the first main surface of the second circuit pattern layer, and the first adhesion It is characterized by being sealed inside the resin layer.

  According to a third aspect of the present invention, in the component-embedded multilayer wiring board according to the first or second aspect, the first adhesive resin layer is provided on at least one side of the second and third circuit components. A third circuit pattern layer having first and second main surfaces on which one surface of the second adhesive resin layer is adjacent and the other surface of the second adhesive resin layer is surface-mounted is disposed. One of the second and third circuit components and the other circuit component are sealed in a second adhesive resin layer, and the second main surface and the third circuit pattern of the first or second circuit pattern layer The first main surface of the layer is formed by a plating layer that is bonded to both surfaces of the second adhesive resin layer and penetrates the second adhesive resin layer between the first or second circuit pattern layer and the third circuit pattern layer. Conductive vias are provided.

  According to a fourth aspect of the present invention, there is provided a method of manufacturing a component-embedded multilayer wiring board according to the present invention. (A) The second main surface of the first conductive layer having the first and second main surfaces is a film-like first base material. Preparing a first transfer substrate formed in such a manner that the first transfer substrate is peelably laminated, and patterning the first conductive layer to form a first circuit pattern layer; and (B) first step of the first circuit pattern layer. A step of surface-mounting the first circuit component on one main surface; and (C) sealing the first circuit component in an insulating first adhesive resin layer, and one surface of the first adhesive resin layer Adhering the first main surface of the first circuit pattern layer to the (lower surface), (D) laminating the second conductive layer on the other surface (upper surface) of the first adhesive resin layer, and (E ) A through hole is formed through the second conductive layer and the first adhesive resin layer so as to expose a part of the first main surface of the first circuit pattern layer. And (F) forming a conductive via made of a metal plating layer by plating over the inner wall of the through hole, the exposed surface of the first main surface of the first circuit pattern layer, and the surface of the second conductive layer. And (G) patterning the second conductive layer and the plating layer to form a second circuit pattern layer having the first adhesive resin layer side as a first main surface and the opposite side as a second main surface. And (H) exposing the second main surface of the first circuit pattern layer by peeling and removing the first substrate; and (I) exposing the second second of the first circuit pattern layer. A step of surface-mounting the second circuit component on the main surface and surface-mounting the third circuit component on the second main surface of the second circuit pattern layer.

  6. The method of manufacturing a component built-in multilayer wiring board according to claim 5 includes: (a) a film on each of the second main surfaces of the first and second conductive layers each having the first and second main surfaces. Preparing first and second transfer substrates formed to be peelable on the first and second substrates, respectively, and (b) a first conductive layer and a first transfer layer on the first transfer substrate. (2) patterning the second conductive layer of the transfer substrate to form first and second circuit pattern layers, respectively, (c) first on each first main surface of the first and second circuit pattern layers; And (d) sealing the first circuit component in the insulative first adhesive resin layer, and mounting the first circuit component on one side (lower surface) of the first adhesive resin layer. Adhering a first main surface of the first circuit pattern layer; and (e) attaching the fourth circuit component in the first adhesive resin layer. Stopping and bonding the first main surface of the second circuit pattern layer to the other surface (upper surface) of the first adhesive resin layer; and (f) the second transfer substrate and the first adhesive resin layer. A step of forming a through hole so as to penetrate and expose a part of the first main surface of the first circuit pattern layer; and (g) exposing the inner wall of the through hole and the first main surface of the first circuit pattern layer. Forming a conductive via made of a metal plating layer by plating over the surface and the surface of the second circuit pattern layer; and (h) peeling and removing the first and second substrates, And a step of exposing each second main surface of the second circuit pattern layer, and (i) second and third circuit components are respectively exposed on the exposed second main surfaces of the first and second circuit pattern layers. And a surface mounting process.

  According to a sixth aspect of the present invention, there is provided a method of manufacturing a component-embedded multilayer wiring board according to the present invention. (A) A film is formed on the second main surfaces of the first and second conductive layers, both having first and second main surfaces. Preparing first and second transfer substrates formed in a peelable manner on the first and second substrates, respectively, and (b) a first conductive layer and a first transfer layer of the first transfer substrate. (2) patterning the second conductive layer of the transfer substrate to form the first and second circuit pattern layers, respectively, (c) first on the first main surface of the first and second circuit pattern layers, And (4) sealing the first circuit component in the insulating first adhesive resin layer, and mounting the first circuit component on one surface (lower surface) of the first adhesive resin layer. Adhering a first main surface of the first circuit pattern layer; and (e) attaching the fourth circuit component in the first adhesive resin layer. And a step of bonding the first main surface of the second circuit pattern layer to the other surface (upper surface) of the first adhesive resin layer, and (f) the first and second transfer base materials, the first A step of forming a through hole through the second circuit pattern layer and the first adhesive resin layer; and (g) a portion of each of the second main surfaces of the first and second circuit pattern layers adjacent to the through hole. And (h) a through-hole type conductive via made of a metal plating layer by plating over the inner surface of the through hole and the exposed surface of the first and second circuit pattern layers. (I) a step of exposing the second main surfaces of the first and second circuit pattern layers by removing the mask; and (nu) a step of forming the first and second circuit pattern layers. And surface-mounting the second and third circuit components on each second main surface. For example, characterized in that is.

  According to a seventh aspect of the present invention, in the method for manufacturing a component-embedded multilayer wiring board according to any one of the fourth to sixth aspects, the through-hole patterns the conductive layer of the transfer base material. In this case, a conformal mask hole corresponding to the through hole is provided in the conductive layer in advance, and the conductive layer is formed by laser processing.

  According to an eighth aspect of the present invention, in the method for manufacturing a component built-in multilayer wiring board according to any one of the fourth to seventh aspects, the third conductive material further includes first and second main surfaces. Patterning the third conductive layer of the third transfer substrate, the step of preparing a third transfer substrate formed by releasably laminating the second main surface of the layer on the film-like third substrate Forming a third circuit pattern layer having first and second main surfaces, surface-mounting other circuit components on the first main surface of the third circuit pattern layer, and the first adhesive resin layer A second adhesive resin layer disposed between the first adhesive resin layer and a circuit component surface-mounted on the circuit pattern on one surface of the first adhesive resin layer. Sealing and bonding the circuit pattern to one surface of the second adhesive resin layer; and the third time Sealing the other circuit component surface-mounted on the first main surface of the pattern layer with the second adhesive resin layer, and bonding the first main surface to the other surface of the second adhesive resin layer; Providing a conductive via made of a plating layer penetrating the second adhesive resin layer between the circuit patterns adhered to both surfaces of the second adhesive resin layer.

  According to the component-embedded multilayer wiring board of the present invention, the first circuit pattern layer bonded to one surface of the adhesive resin layer in which the first circuit component is embedded has the first and second circuit components on both surfaces thereof. Are mounted on the surface, and a third circuit component is surface-mounted on the second circuit pattern layer bonded to the other surface of the adhesive resin layer, for connection between the first and second circuit pattern layers. A characteristic configuration is that the conductive via is formed of a plating layer.

  With such a characteristic configuration, a component-embedded multilayer wiring board having a multilayered structure and a highly densified structure can be easily and reliably manufactured by a general facility such as a current surface mounting apparatus or plating apparatus. Also, even when a large number of interlayer conductive vias are required at many locations in the first and second circuit patterns, the conductive vias are formed of a plating layer, so that compared with the conventional conductive paste. Thus, the interlayer connection state between the respective portions can be made much more uniform, and the effect of obtaining a low interlayer connection resistance can be obtained.

  In addition, according to the method for manufacturing a component-embedded multilayer wiring board of the present invention, a transfer technique using a transfer substrate in which a conductive layer for forming a circuit pattern layer is detachably laminated on a film-like substrate is employed. However, at that time, each circuit component incorporated in each adhesive resin layer can be surface-mounted on both surfaces of each circuit pattern layer. Therefore, the number of built-in circuit components can be increased.

  In the plating layer forming step for forming conductive vias for interlayer connection, the film-like substrate in the transfer can be used as a plating resist or a mask, and the through holes for interlayer connection are formed by laser processing. When forming, if the conformal mask hole is formed with the circuit pattern in the conductive layer, the through hole can be formed easily and easily.

  In this way, even when manufacturing a multilayer wiring board with built-in components consisting of multiple layers of adhesive resin layers with circuit pattern layers formed on both sides and built-in surface mounted circuit components, With the general equipment such as the surface mounting apparatus and the plating apparatus, it is possible to produce the component built-in type multilayer wiring board easily and surely without incurring complicated processes and increased manufacturing costs.

  Embodiments 1 to 4 relating to a component built-in multilayer wiring board and a method for manufacturing the same according to the present invention will be sequentially described below with reference to FIGS.

[Embodiment 1]
FIG. 1A to FIG. 1I are cross-sectional views by process showing a method for manufacturing a component built-in multilayer wiring board according to Embodiment 1 of the present invention.

  FIG. 1I is a cross-sectional view showing the final structure of the component built-in multilayer wiring board according to the first embodiment, which will be described first.

  The first circuit pattern layer 1 is formed by appropriately patterning a conductive layer material made of, for example, copper foil having a first main surface 1a (upper surface in the drawing) and a second main surface 1b (lower surface in the drawing). On the first and second main surfaces 1a and 1b, the first circuit component 2 and the second circuit component 3 are respectively surfaced by soldering or face-down bonding using a general surface mounting (SMT) apparatus. Has been implemented.

  Here, the first circuit component 2 is represented by one semiconductor active element such as an IC / LSI (left side in the figure) and one passive element such as a resistor (right side in the figure). Are shown by one similar passive element (left side in the figure) and one semiconductor active element (right side in the figure), but the type, number and arrangement relationship of these first and second circuit components 2 and 3. Is selected and incorporated as necessary. Such a circuit component can take various forms such as a semiconductor bare chip or an active / passive device with a package.

  The film-like first adhesive resin layer 4 is made of an insulating material capable of bonding the circuit pattern layers and embedding and sealing the circuit components. For example, a prepreg, a thermosetting resin, and a thermoplastic resin are used. It is formed by appropriately selecting from the above.

  Therefore, the one circuit component 2 is sealed in a state of being embedded in the first adhesive resin layer 4, and the first main surface 1 a of the first circuit pattern layer 1 is one side of the first adhesive resin layer 4. Is bonded to the surface (the lower surface in the figure). Here, the first circuit pattern layer 1 is formed by sinking into the surface layer of the first adhesive resin layer 4, and the second main surface 1 b is flush with the lower surface of the first adhesive resin layer 4, These entire surfaces are flattened.

  The second circuit pattern layer 5 on the other surface (upper surface in the drawing) of the first adhesive resin layer 4 has a two-layer structure including a second conductive layer C2 and a plating layer 51 on the second conductive layer C2, which will be described in detail later. The first main surface (lower surface) 5a on the first adhesive resin layer 4 side and the second main surface (upper surface) 5b on the opposite side are formed. The first main surface (lower surface) 5a is indirectly bonded to the upper surface of the first adhesive resin layer 4 via a base material S2 made of an insulating film, which will be described in detail later.

  On the surface of the second main surface (upper surface) 5b of the second circuit pattern layer 5, here, as the third circuit component 6, as in the case of the first and second circuit components 2, 3, a resistance element ( The left side in the figure and the semiconductor active element (right side in the figure) are mounted on the surface by soldering or face-down bonding using a general surface mounting (SMT) apparatus.

  An appropriate number of through holes H are formed between the first and second circuit pattern layers 1 and 5 so as to pass through the first adhesive resin layer 4. The first circuit pattern 1 is perforated by, for example, laser processing so as to open to the side and expose the first main surface 1a of the first circuit pattern 1.

  The conductive via 51a for interlayer connection between the first and second circuit pattern layers 1 and 5 includes an exposed surface of the first main surface 1a of the first circuit pattern 1, an inner wall surface of the through hole H, and a second surface. The plating layer 51 is formed over the surface of the second conductive layer C2 which is the lower layer of the circuit pattern layer 5, and is formed as a portion corresponding to the through hole H in the plating layer 51. A land portion 51b is formed on the periphery of the conductive via 51a. The land portion 51b has a pattern having an area and shape necessary for connection with a mounted circuit component and conductive vias of other adjacent wiring board layers.

  Next, a method for manufacturing the component built-in type multilayer wiring board according to the first embodiment will be described with reference to FIGS. 1A to 1I sequentially.

  First, as shown in FIG. 1A, the second main surface of the first conductive layer C1 having a first main surface C1a and a second main surface C1b as a raw material for forming the first circuit pattern 1. A first transfer substrate P1 formed by releasably laminating C2b on a film-like first substrate S1 is prepared.

  At this stage, as the original material for forming the second circuit pattern 5, the second conductive layer C2 having the first and second main surfaces C2a and C2b and the film-like first material are formed in the same manner as the first transfer substrate P1. It is also possible to prepare a second transfer substrate P2 in which the two substrates S2 are detachably laminated.

  The first and second transfer base materials P1 and P2 are the first and second base materials S1 and S2 on the second main surface (lower surface in the drawing) of, for example, copper foil as the first and second conductive layers C1 and C2. It consists of the copper clad laminated board formed by laminating | pasting or laminating | separating to each one surface (upper surface in the figure), respectively.

  The base materials S1 and S2 need to be a material that is stable to chemicals such as an etching solution in a subtractive method and heating in a surface mounting (SMT) process in the subsequent processes. For example, a polyimide resin ( Insulating films such as PI) or liquid crystal polymer (LCP) are used.

The adhesive material (not shown) for adhering and bonding each conductive layer C1 (C2) and each substrate S1 (S2) in a peelable state is a peelable adhesive even in the subsequent steps. It is desirable that the material be stable both thermally and chemically so that the state can be maintained. Specific examples of the adhesive material include a micro-adhesive material, a UV curable material, a UV extinguishing material, and a thermal foam material, and these are also commercialized by, for example, Somar Co., Ltd. It is preferable that the conductive layers C1 (C2) are bonded to each other and bonded to the base materials S1 (S2) in advance.

  In addition, as each said base material S1, S2, although the insulating film is used in this Embodiment 1, if the process conditions, such as thermal or chemical, are satisfy | filled during the process after this, it will be metal instead. It is also possible to use a conductive material such as.

  Next, in the step shown in FIG. 1B, the first circuit pattern layer 1 is formed by patterning the first conductive layer C1. The first circuit pattern layer 1 has a first main surface 1a exposed on the upper side in the drawing and a second main surface 1b on the first base material S1 side. This patterning can be performed by a general subtractive method. Specifically, other than a circuit pattern required by applying an etching mask to the first conductive layer C1 by a photolithography technique using a photosensitive film or the like. This is done by etching away unnecessary portions.

  In the step shown in FIG. 1C, the first circuit component 2 is surface-mounted on the surface of the first main surface 1 a of the first circuit pattern layer 1. The first circuit component 2 is illustrated here as an example composed of two components, a semiconductor IC / LSI as an active element (left side in the figure) and a resistive element as a passive element (right side in the figure). However, the type and number are selected as necessary. The surface mounting can be performed by face-down bonding or soldering of each first circuit component 2 on the first main surface 1a using a general surface mounting (SMT) apparatus.

  In the step shown in FIG. 1D, first, the first circuit component 2 is sealed in the insulating first adhesive resin layer 4, and the one surface (lower surface) of the first adhesive resin layer 4 is placed on the surface. The first main surface 1a of the first circuit pattern layer 2 is bonded. The first adhesive resin layer 4 is selected and used from a prepreg, a thermosetting resin, a thermoplastic resin, or the like, which is a material capable of pressing and embedding the circuit component 2. Of course, if the first adhesive resin layer 4 is provided with a storage hole (not shown) according to the size of the circuit component 2, the circuit component 2 can be easily stored or built-in, and the first The range of material selection for the degree of plasticity of the adhesive resin layer 4 can be increased.

  Then, the second conductive layer C <b> 2 is laminated on the other surface (upper surface) of the first adhesive resin layer 4. In this lamination, the second conductive layer C2 made of a single copper foil can be directly bonded to the upper surface of the first adhesive resin layer 4, or a copper-clad laminate in which a copper foil is bonded to an insulating film can be bonded. However, here, the second substrate S2 of the second transfer substrate P2 is shown as an example in which the second substrate S2 is bonded and laminated on the first adhesive resin layer 4.

  In the step shown in FIG. 1E, a through hole H is formed so as to penetrate the second conductive layer C2 and the first adhesive resin layer 4 and expose a part of the first main surface 1a of the first circuit pattern layer 1. (2 locations in the figure) are formed. In this case, since the second conductive layer C2 constitutes a part of the second transfer substrate P2, the through hole H is also formed in the second substrate S2.

  The through hole H can be formed by ordinary LVH processing, and can be obtained by forming a via hole with a laser beam such as a carbon dioxide laser, a UV-YAG laser, or an excimer laser. Further, if a desmear process is performed as necessary in order to remove smear remaining in the through hole H during LVH processing, connection reliability by plating described later can be improved. As this desmear treatment, for example, plasma desmear using a reactive gas such as CF4, C2F6 or NF3, or wet desmear using permanganic acid can be used.

  If a conformal mask hole corresponding to the through hole H is provided in the second conductive layer C2 in advance, the through hole H can be easily formed in the first adhesive resin layer 4 by laser processing using the mask hole. Can be formed.

  In the step shown in FIG. 1 (f), first, a generally known direct plating process or the like is used for the surface layer of the inner wall portion of each through-hole H of the first adhesive resin layer 4 and the second base material S 2 that is an insulator. Using this technique, a plating seed layer (not shown) is formed by making a conductor.

  Then, the metal plating layer 51 is formed by plating over the inner wall of the through hole H, the exposed surface of the first main surface 1a of the first circuit pattern layer 1 and the surface of the second conductive layer C2. A portion corresponding to the through hole H in the metal plating layer 51 is used as a conductive via 51a to provide an interlayer connection function.

  In this step, the exposed surface of the first base material S1 of the first transfer base material P1 is directly plated. However, since it is finally peeled and removed, there is no problem. Rather, since the first substrate S1 protects the surface of the first circuit pattern layer 1 during the plating process, it can be used as a plating resist, and it is necessary to use a special plating resist. It helps to simplify the process.

  Further, when a fine pattern circuit with a narrow circuit line width or circuit interval is required, the conductive via 51a may be formed by partial plating limited to the portion of the through hole H using, for example, a plating resist. . In this case, the plating layer 51 is not provided on the surface of the second conductive layer C2 on which the circuit pattern is to be formed, and the second circuit pattern layer 5 is substantially formed by the second conductive layer C2, thereby being relatively thin. Since it can be a layer, it is convenient for fine patterning.

  In the step shown in FIG. 1G, the second conductive layer C2 and the plating layer 51 are patterned so that the first adhesive resin layer 4 side is the first main surface 5a and the opposite side is the second main surface. A second circuit pattern layer 5 is formed as 5b.

  The pattern formation of the second circuit pattern layer 5 can be performed by a general subtractive method. Specifically, the second conductive layer C2 and the plating layer 51 are formed by a photolithography technique using a photosensitive film or the like. This two-layer structure is performed by etching away unnecessary portions other than the required circuit pattern by applying an etching mask. In this process, the first base material S1 of the first transfer base material P1 is also used as an etching mask.

  In the step shown in FIG. 1H, the second main surface 1b of the first circuit pattern layer 1 is exposed by peeling and removing the first base material S1.

  By the way, when the conventional general single-sided CCL is used without using the first transfer substrate P1, the insulating substrate cannot be peeled and removed, and the copper foil layer cannot be exposed on the lower surface. This makes it impossible to mount the circuit component on the lower surface of the component built-in multilayer wiring board. In addition, even if a general double-sided CCL is used to enable surface mounting on the lower surface, a process such as through-hole (TH) plating or LVH plating is required on the surface of the copper foil layer on which the circuit pattern has been formed. However, the process is extremely complicated.

  Therefore, according to the above process in the first embodiment, the next surface mounting process can be achieved by an extremely simple process as compared with the use of the above-described conventional general single-sided CCL or double-sided CCL.

  Thereafter, in the step shown in FIG. 1 (i), the second circuit component 3 is surface-mounted on the exposed second main surface 1 b of the first circuit pattern layer 1, and the second circuit pattern layer 5 has a second portion. The third circuit component 6 is surface-mounted on the main surface 5b.

  As described above, conductive vias 51a each including a form in which a circuit component is surface-mounted and a plating layer are provided on both surfaces of the first circuit pattern layer 1 bonded to the first adhesive resin layer 4 containing the circuit component. The component built-in multilayer wiring board according to the first embodiment is formed. The detailed structure is as described above.

[Embodiment 2]
2 (a) to 2 (e) are cross-sectional views by process showing a method of manufacturing a component built-in multilayer wiring board according to Embodiment 2 of the present invention. Since the second embodiment has the same components as the component built-in type multilayer wiring board in the first embodiment (FIG. 1), the same reference numerals are given to the same portions and the same members, and the detailed description thereof will be given. Omitted.

  FIG. 2E is a cross-sectional view showing the final structure of the component-embedded multilayer wiring board according to the second embodiment, which will be described first.

  For example, the first circuit component 2 and the second circuit component 3 are generally mounted on the first and second main surfaces 1a and 1b of the first circuit pattern layer 1 formed by patterning a copper foil layer. ) Using a device, each surface is mounted by soldering or face-down bonding. The one circuit component 2 is sealed in a state of being embedded from below the first adhesive resin layer 4, and the first main surface 1 a of the first circuit pattern layer 1 is the first adhesive resin layer 4. Is adhered to one surface (the lower surface in the figure). In this case, the first circuit pattern layer 1 is sunk into the surface layer of the first adhesive resin layer 4 by the thickness, and the second main surface 1b of the first circuit pattern layer 1 is the second main surface 1b. The entire surface is flattened on the same surface as the lower surface of the adhesive resin layer 4.

  The second circuit pattern layer 10 adhered on the other surface (upper surface in the drawing) of the first adhesive resin layer 4 includes a first main surface 10a on the first adhesive resin layer 4 side and a second main surface on the upper exposed side. 10b. The third circuit component 6 is surface-mounted on the second main surface 10b (upper surface in the drawing) of the second circuit pattern layer 10 by the same component configuration, arrangement and means as in the first embodiment, and the second circuit On the first main surface 10a (lower surface in the figure) of the pattern layer 10, a fourth circuit component 7 made of, for example, a resistance element is similarly surface-mounted.

  The four circuit components 7 are sealed in an embedded state from above the first adhesive resin layer 4, and the second circuit pattern layer 10 has the other thickness of the first adhesive resin layer 4 corresponding to the thickness thereof. The first main surface 10a is bonded to the surface layer of the surface (upper surface in the drawing), and the second main surface 10b is in the same flattened surface as the upper surface of the first adhesive resin layer 4.

  The conductive vias 51a in the appropriate number of through holes H penetrating the first adhesive resin layer 4 and the land portions 51b at the periphery of the openings of the through holes H are the inner walls of the through holes H, the first main surface of the first circuit pattern 1. The plating layer is formed over the exposed surface 1a and the surface of the second main surface 10b of the second circuit pattern layer 10.

  As for the arrangement of each circuit component, according to the comparison on the drawing, in the drawing, of the two first circuit components 2 that are surface-mounted on the first main surface 1a of the first circuit pattern layer 1 in the first embodiment. In the second embodiment, the right circuit component (resistive element) is excluded from the first circuit pattern layer 1 and is mounted on the first main surface 10 a of the second circuit pattern layer 10. It is expressed as

  Next, a method for manufacturing a component built-in multilayer wiring board according to the second embodiment will be described with reference to FIGS. 1 (a) to 1 (c) and FIGS. 2 (a) to 2 (e).

  First, as shown in FIG. 1A, as the original material of the first circuit pattern layer 1, the second main surface of the first conductive layer C1 having the first and second main surfaces C1a and C1b is film-shaped. A first transfer substrate P1 is prepared which is formed on the first substrate S1 so as to be peelable. Similarly, as the original material of the second circuit pattern layer 10, the second main surface C2b of the second conductive layer C2 having the first and second main surfaces C2a and C2b is used as the film-like second base material S2. A second transfer substrate P2 formed so as to be peelable is prepared.

  Then, as shown in FIG. 1B, the conductive layers C1 and C2 of the first and second transfer base materials P1 and P2 are patterned to form first and second main surfaces 1a and 1b, respectively. The 1st circuit pattern layer 1 and the 2nd circuit pattern layer 10 which has 1st, 2nd main surface 10a, 10b are formed.

  Thereafter, as shown in FIG. 1C, the respective circuit components are surface-mounted on the first main surfaces 1a and 10a of the first and second circuit pattern layers 1 and 10, respectively. At this stage, as shown in FIG. 2A, the first circuit component 2 is placed on the first main surface 1 a of the first circuit pattern layer 1 and the first main surface of the second circuit pattern layer 10. The fourth circuit component 7 is mounted on the surface 2a.

  Then, in the step shown in FIG. 2A, the first circuit component 2 is sealed in the insulating first adhesive resin layer 4, and the one surface (lower surface) of the first adhesive resin layer 4 The first main surface 1a of the first circuit pattern layer 1 is bonded. Further, the fourth circuit component 7 is sealed in the first adhesive resin layer 4, and the first main surface of the second circuit pattern layer 10 is formed on the other surface (upper surface) of the first adhesive resin layer 4. Adhere 10a. Specific examples of the material and structure of the first adhesive resin layer 4 and the sealing means for the first and fourth circuit components 2 and 7 are the same as those described in the step of FIG. It is.

  In the step shown in FIG. 2B, a through-hole is formed so as to penetrate the second transfer substrate P2 and the first adhesive resin layer 4 and expose a part of the first main surface 1a of the first circuit pattern layer 1. H is formed.

  The through hole H is formed by, for example, LVH processing. At that time, a conformal mask hole CM corresponding to the through hole H is formed in advance along with the patterning of the second circuit pattern layer 10 in the second conductive layer C2 of the second transfer substrate P2 on the LVH processing side. Thus, the second conductive layer C2 can be used as a conformal mask.

  In this case, the second substrate S2 of the second transfer substrate P2 has an opening SH having an inner diameter larger than the hole diameter of the through hole H in order to form the land portion 51b in the subsequent plating process. In order to form, a resin-based material capable of laser processing is used.

  Therefore, by irradiating a laser beam having a beam diameter larger than the diameter of the conformal mask hole CM (through hole H) and equivalent to the opening SH diameter of the second base material S2 in accordance with the central axis of the through hole H, The through hole H and the opening SH can be easily formed at once.

  Thus, although LVH processing by the conformal mask method is advantageous, laser processing can be performed for each circuit pattern layer by copper direct. In this case, the second base material S2 is a laser regardless of resin-based material or metal material. Processable materials are used.

  For the LVH processing, for example, a laser beam such as a carbon dioxide laser, a UV-YAG laser, or an excimer laser can be used. If it carries out, the connection reliability by the plating mentioned later can be improved. As this desmear treatment, for example, plasma desmear using a reactive gas such as CF4, C2F6 or NF3, or wet desmear using permanganic acid can be used.

  In the step shown in FIG. 2 (c), the plating seed layer is obtained by converting the inner wall surface layer of the through hole H of the first adhesive resin layer 4 which is an insulator into a conductor using a technique such as a general direct plating process. (Not shown). At this time, although the first and second base materials S1 and S2 are also made into conductors, there is no problem because they are finally peeled off.

  Therefore, the lower plating resist layer MR1 is deposited on the entire surface of the first substrate S1, and the upper plating resist layer MR2 is deposited on the surface of the second substrate S2. The upper plating resist layer MR2 is photomasked at a position corresponding to the through hole H so as to have a mask hole having an inner diameter larger than the diameter of the through hole H and permitting the formation of the land portion 51b made of a plating layer. Patterned by lithography or the like.

  2D, on the inner wall of the through hole H, the exposed surface of the first main surface 1a of the first circuit pattern layer 1, and the surface extending over the second main surface 10b of the second circuit pattern layer 10. Plating is performed to form conductive vias 51a and land portions 51b made of a metal plating layer.

  Thereafter, the second main surface 1b of each of the first and second circuit pattern layers 1 and 10 is peeled and removed from both surfaces of the first adhesive resin layer 4 to remove the first and second base materials S1 and S2. 10b is exposed. In this manner, a state where the patterned first and second circuit pattern layers 1 and 10 are transferred onto both surfaces of the first adhesive resin layer 4 is obtained.

  In the step shown in FIG. 2E, the second and third circuit components 3 and 6 are respectively applied to the exposed second main surfaces 1b and 10b of the first and second circuit pattern layers 1 and 10, respectively. Surface mount.

  Each of the first and second circuit pattern layers 1 and 10 bonded to both surfaces of the first adhesive resin layer 4 containing the circuit components as described above is surface-mounted on both surfaces. Thus, the component built-in type multilayer wiring board according to the second embodiment including the conductive via 51a made of a plating layer is formed. The detailed structure is as described above.

  According to the second embodiment, since the first and second circuit pattern layers 1 and 10 are formed by adhering a transfer substrate to both surfaces of the first adhesive resin layer 4, the second circuit pattern layer 10 is Compared to the second circuit pattern layer 5 having a two-layer structure of the copper foil layer and the plating layer in the first embodiment, the thickness can be reduced to easily meet the demand for fine patterning of the circuit. Further, when the transfer base materials P1 and P2 are in the form of a roll material, an RR (roll-to-roll) circuit pattern can be formed, man-hours in the mass production line can be reduced, and the manufacturing cost can be reduced.

[Embodiment 3]
FIG. 3A to FIG. 3F are cross-sectional views by process showing a method of manufacturing a component built-in multilayer wiring board according to Embodiment 3 of the present invention. Since the third embodiment has the same components as the component-embedded multilayer wiring board in the first embodiment (FIG. 1) and the second embodiment, the same reference numerals are given to the same portions and the same members. Detailed description thereof is omitted.

  FIG. 3F is a cross-sectional view showing the final structure of the component built-in multilayer wiring board according to the third embodiment, which will be described first.

  For example, the first circuit component 2 and the second circuit component 3 are generally mounted on the first and second main surfaces 1a and 1b of the first circuit pattern layer 1 formed by patterning a copper foil layer. ) Using a device, each surface is mounted by soldering or face-down bonding. The one circuit component 2 is sealed in a state of being embedded from below the first adhesive resin layer 4, and the first main surface 1 a of the first circuit pattern layer 1 is the first adhesive resin layer 4. Is adhered to one surface (the lower surface in the figure). In this case, the first circuit pattern layer 1 is sunk into the surface layer of the first adhesive resin layer 4 by the thickness, and the second main surface 1b of the first circuit pattern layer 1 is the second main surface 1b. The entire surface is flattened on the same surface as the lower surface of the adhesive resin layer 4.

  A third circuit component 6 is provided on the second main surface 10b (upper surface in the drawing) of the second circuit pattern layer 10 bonded on the other surface (upper surface in the drawing) of the first adhesive resin layer 4 according to the first and second embodiments. The surface of the second circuit pattern layer 10 is mounted on the first main surface 10a (the lower surface in the drawing), for example, by a fourth circuit component 7 made of a resistance element. Has been implemented.

  The four circuit components 7 are sealed in an embedded state from above the first adhesive resin layer 4, and the second circuit pattern layer 10 has the other thickness of the first adhesive resin layer 4 corresponding to the thickness thereof. The first main surface 10a is bonded to the surface layer of the surface (upper surface in the drawing), and the second main surface 10b is in the same flattened surface as the upper surface of the first adhesive resin layer 4.

  Through holes TH as appropriate numbers of through holes penetrating the first adhesive resin layer 4 and the first and second circuit pattern layers 1 and 10 on both surfaces thereof are provided, and conductive vias 51h in the through holes TH are provided. And the land part 51i of the peripheral edge of both ends is formed by a plating layer formed over the inner wall of the through hole TH and the surfaces of the second main surfaces 1b and 10b of the first and second circuit patterns 1 and 10. Has been.

  Next, a manufacturing method of the component built-in type multilayer wiring board according to the third embodiment will be described with reference to FIGS.

  First, the steps up to FIG. 3A according to the third embodiment are the same as the steps shown in FIGS. 1A to 1C and FIG. 2A according to the second embodiment. Therefore, the process up to FIG. 3A will be briefly described. First, the first and second conductive layers C1 and C2 each having the first and second main surfaces C1a, C2a and C1b, and C2b are first described. First and second transfer base materials P1 and P2 formed by laminating the second main surfaces C1b and C2b on the first and second base materials S1 and S2 in a film form so as to be peeled off are prepared.

  The first and second circuit pattern layers 1 and 10 are formed by patterning the first conductive layer C1 of the first transfer substrate P1 and the second conductive layer C2 of the second transfer substrate P2.

  Then, the first and fourth circuit components 2 and 7 are surface-mounted on the first main surfaces 1a and 10a of the first and second circuit pattern layers 1 and 10, respectively.

  The first circuit component 2 is sealed in the insulating first adhesive resin layer 4, and the first main surface 1 a of the first circuit pattern layer 1 is formed on one surface (lower surface) of the first adhesive resin layer 4. Glue.

  The fourth circuit component 2 is sealed in the first adhesive resin layer 4, and the first main surface 10 a of the second circuit pattern layer 10 is bonded to the other surface (upper surface) of the first adhesive resin layer 4. To do.

  Next, in the step shown in FIG. 3B, a through hole that passes through the first and second transfer base materials P1 and P2, the first and second circuit pattern layers 1 and 10, and the first adhesive resin layer 4 is provided. Form TH. Here, the through-hole TH is a through-hole type formed by a drilling method, and a plurality of wiring board materials can be stacked to perform a number of processes at a time, so that the manufacturing cost can be reduced.

  The formation of the through-hole type through-hole TH has a cost merit because there is little residual amount of smear and the like in the inside and generally no desmear treatment is required. However, the connection reliability of the conductive via by plating can be improved by performing a desmear process as necessary. As this desmear treatment, for example, plasma desmear using a reactive gas such as CF4, C2F6 or NF3, or wet desmear using permanganic acid may be used.

  As described in the second embodiment, the through hole TH has a conformal mask hole corresponding to the through hole TH in the second conductive layers C1 and C2 of the first and second transfer base materials P1 and P2. It may be formed in advance by laser processing using the first and second conductive layers C1 and C2 as a conformal mask.

  Prior to the electrolytic plating described later, the inner surface of the through hole TH of the first adhesive resin layer 4 that is an insulator is made into a conductor by using a technique such as a general direct plating process to form a plating seed layer. It may be formed in advance. At this time, the first and second base materials S1 and S2 are also made into conductors, but finally peel off, so there is no problem.

  In the step shown in FIG. 3C, portions of the second main surfaces 1b and 10b of the first and second circuit pattern layers 1 and 10 that are adjacent to the through hole TH are exposed and their surroundings are masked. In this mask process, after the through holes TH are formed, the first and second base materials S1 and S2 are peeled off from both surfaces of the first adhesive resin layer 4, and then the lower surfaces are formed on both surfaces of the first adhesive resin layer 4. The side plating resist layer MR1 and the upper side plating resist layer MR2 are respectively deposited. Each of the plating resist layers MR1 and MR2 has a mask hole having an inner diameter larger than the diameter of the through hole TH and allowing the formation of the land portion 51i made of a plating layer at a position corresponding to the through hole TH. As described above, by patterning by photolithography or the like, a portion adjacent to the through hole TH is exposed.

  In the step shown in FIG. 3D, electrolytic plating is performed over the inner wall of the through hole TH exposed from the mask holes of the plating resist layers MR1 and MR2 and the exposed surfaces of the first and second circuit pattern layers 1 and 10. A through-hole type conductive via 51h made of a metal plating layer and a land portion 51i constituting a part of the periphery thereof are formed.

  In the step shown in FIG. 3E, the second main surfaces 1b and 10b of the first and second circuit pattern layers 1 and 10 are exposed by removing the mask. Specifically, the removal of the mask is performed by removing the plating resist layers MR1 and MR2 after the plating process.

  In the step shown in FIG. 3F, the second and third circuit components 3 and 6 are surface-mounted on the exposed second main surfaces 1b and 10b of the first and second circuit pattern layers 1 and 10, respectively. . As described above, the component built-in type multilayer wiring board according to Embodiment 3 of the present invention is manufactured. The detailed structure is as described above.

[Embodiment 4]
FIG. 4 is a cross-sectional view for explaining a method for manufacturing a component built-in multilayer wiring board according to Embodiment 4 of the present invention. And this Embodiment 4 shows one Embodiment of this invention of the component built-in type multilayer wiring board of the type which laminated | stacked the several circuit wiring board, and quotes FIG.1 and FIG.2 with FIG. explain.

  Similar to the first and second transfer base materials P1 and P2 shown in FIG. 1A, the third conductive layer C3 having the first and second main surfaces can be peeled to the film-like third base material S3. A third transfer substrate P3 formed by stacking is prepared as a source material. Next, in the same manner as the first and second circuit patterns 1 and 10 shown in FIG. 1B, the third conductive layer C3 is patterned to form a third circuit pattern layer having first and second main surfaces. 20 is formed.

  Next, similarly to the first circuit component 2 shown in FIG. 1C, a new circuit component 8 different from the first to fourth circuit components is attached to the first main surface 20 a of the third circuit pattern layer 20. The third transfer substrate P3 having the third circuit pattern layer 20 already mounted on the first main surface 20a is prepared by surface mounting.

  Then, for example, after the surface mounting process of the third circuit component 6 shown in FIG. 2 (e) in the second embodiment, the upper surface of the first adhesive resin layer 4 according to the process shown in FIG. 2 (a). A second adhesive resin layer 9 is newly disposed on the side. Further, the third transfer substrate P3 is arranged on the upper surface side of the second adhesive resin layer 9 so that the new circuit component 8 is opposed.

  Then, the third circuit component 6 is embedded and sealed in the second adhesive resin layer 9 from the lower surface side, and the second main surface 10b of the second circuit pattern layer 10 is the second adhesive resin layer. Adhere to the lower surface of 9. Further, the new circuit component 8 is embedded and sealed in the second adhesive resin layer 9 from the upper surface side, and the first main surface 20a of the third circuit pattern layer 20 is formed on the second adhesive resin layer 9. Adhere to the top surface.

  Thereafter, in accordance with the process shown in FIG. 2B, the third substrate S3 of the third transfer substrate P3 and the third circuit pattern layer are formed by performing LVH processing on the portion where the conductive via is to be provided. 20 and the second adhesive resin layer 9 are formed, and a through hole is formed to expose a part (for example, the land portion 51b) of the second main surface 10b of the second circuit pattern layer 10.

  Further, a separate new circuit component is surface-mounted on the subsequent step of forming a conductive via made of a plating layer for interlayer connection in the through hole and on the second main surface 20b of the third circuit pattern layer 20 The steps and the like are in accordance with the steps shown in FIGS. 2C to 2E in the second embodiment. Furthermore, when the number of layers of the transfer base material and the adhesive resin layer is increased, the component-embedded multilayer wiring board can be manufactured by repeating the above process cycle in the same manner.

  In the fourth embodiment, the component built-in type multilayer wiring board shown in FIG. 2E has been described as the starting point of the above-mentioned process. The first circuit pattern layer 1 side is shown in FIG. As shown, the second adhesive resin layer and the third transfer substrate with respect to the third circuit component 6 side are protected in a state where the first circuit pattern layer 1 is protected by leaving the first substrate S1 and the plating resist MR1. Proceed to the placement process. In that case, the surface mounting of the second circuit component 3 on the second main surface of the first circuit pattern layer 1 may be performed at the final stage of the component built-in multilayer wiring board.

  Further, the second adhesive resin layer 9 can be disposed on the lower surface side of the first adhesive resin layer 4 and can be laminated in association with the second circuit component 3 through the same process as described above.

  Note that the layering process according to the fourth embodiment as described above can be similarly applied to the component built-in type multilayer wiring board obtained by the first and third embodiments.

  According to the fourth embodiment, when manufacturing a component built-in multilayer wiring board of a type in which a plurality of circuit wiring boards are laminated, each adjacent adhesive in a state where the circuit components are surface-mounted on both surfaces of each circuit pattern layer. A circuit component corresponding to the resin layer is built in, each circuit pattern layer is bonded to each adhesive resin layer in contact therewith, and each conductive via for interlayer connection penetrating each adhesive resin layer is formed by a plating layer it can.

  As described above, in the component built-in multilayer wiring board and the manufacturing method thereof according to the present invention, the characteristic effects of the respective embodiments shown in the first to fourth embodiments are described in the description of the embodiments. That's right. The effects common to the respective embodiments are as described in the [Effects of the invention] column.

It is sectional drawing according to process for showing and explaining the component built-in type multilayer wiring board which concerns on Embodiment 1 of this invention, and its manufacturing method to (a)-(i). It is sectional drawing according to process for showing and explaining the component built-in type multilayer wiring board which concerns on Embodiment 2 of this invention, and its manufacturing method to (a)-(e). It is sectional drawing according to process for showing and explaining the component built-in type multilayer wiring board which concerns on Embodiment 3 of this invention, and its manufacturing method to (a)-(f). It is sectional drawing for demonstrating the manufacturing method of the component built-in type multilayer wiring board which concerns on Embodiment 4 of this invention.

Explanation of symbols

1 1st circuit pattern layer 1a, 5a, 10a, C1a, C2a, 20a 1st main surface 1b, 5b, 10b, C1b, C2a, 20b 2nd main surface 2 1st circuit component 3 2nd circuit component 4 1st adhesion | attachment Resin layers 5 and 10 Second circuit pattern layer 6 Third circuit component 7 Fourth circuit component 8 New circuit component 9 Second adhesive resin layer 10 Insulator protective layer 20 Third circuit pattern layer 51 Plating layers 51a and 51h Conductive vias 51b, 51i Land portions C1, C2, C3 First, second and third conductive layers H, TH through holes M1, M2 Plating resists P1, P2, P3 First, second and third transfer base materials S1, S2, S3 First, second and third base materials

Claims (8)

  A first circuit pattern layer having first and second main surfaces; first and second circuit components surface-mounted on the first and second main surfaces, respectively; and sealing the first circuit component inside. A film-like first adhesive resin layer to which the first main surface of the first circuit pattern layer is bonded to one surface, and first and second main surfaces, the first main surface of which is the adhesive resin layer A second circuit pattern layer bonded to the other surface and surface-mounted with a third circuit component on the second main surface; a through-hole penetrating the adhesive resin layer between the first and second circuit patterns; A component built-in multilayer wiring board, comprising: a conductive via made of a plating layer for interconnecting the first and second circuit patterns through a through hole.   The component built-in type according to claim 1, wherein a fourth circuit component is surface-mounted on the first main surface of the second circuit pattern layer and sealed inside the first adhesive resin layer. Multilayer wiring board.   One surface of the second adhesive resin layer is adjacent to the first adhesive resin layer on at least one side of the second and third circuit components, and another circuit is connected to the other surface of the second adhesive resin layer. A third circuit pattern layer having first and second main surfaces on which the component is surface-mounted is disposed, and one of the second and third circuit components and the other circuit component are disposed in the second adhesive resin layer. The first main surface of the first or second circuit pattern layer and the first main surface of the third circuit pattern layer are bonded to both surfaces of the second adhesive resin layer, respectively, and the first or second circuit pattern layer is sealed. 3. The component built-in multilayer wiring board according to claim 1, wherein a conductive via made of a plating layer penetrating the second adhesive resin layer is provided between the first circuit pattern layer and the third circuit pattern layer. . (A) preparing a first transfer substrate formed by releasably laminating the second main surface of the first conductive layer having the first and second main surfaces on a film-like first substrate; Patterning the first conductive layer to form a first circuit pattern layer;
(B) surface-mounting a first circuit component on the first main surface of the first circuit pattern layer;
(C) The first circuit component is sealed in the insulating first adhesive resin layer, and the first main surface of the first circuit pattern layer is bonded to one surface (lower surface) of the first adhesive resin layer. And a process of
(D) laminating a second conductive layer on the other surface (upper surface) of the first adhesive resin layer;
(E) forming a through-hole so as to penetrate the second conductive layer and the first adhesive resin layer and expose a part of the first main surface of the first circuit pattern layer;
(F) forming a conductive via made of a metal plating layer by plating over the inner wall of the through hole, the exposed surface of the first main surface of the first circuit pattern layer, and the surface of the second conductive layer;
(G) patterning the second conductive layer and the plating layer to form a second circuit pattern layer having the first adhesive resin layer side as a first main surface and the opposite side as a second main surface; ,
(H) exposing the second main surface of the first circuit pattern layer by peeling and removing the first substrate;
(I) surface-mounting a second circuit component on the exposed second main surface of the first circuit pattern layer, and surface-mounting a third circuit component on the second main surface of the second circuit pattern layer;
A method of manufacturing a component built-in type multilayer wiring board, comprising: (A) Both of the first and second conductive layers having the first and second main surfaces were formed by laminating the second main surfaces of the first and second conductive layers on the film-like first and second substrates, respectively. Preparing first and second transfer substrates;
(B) patterning the first conductive layer of the first transfer substrate and the second conductive layer of the second transfer substrate to form first and second circuit pattern layers, respectively.
(C) surface-mounting the first and fourth circuit components on the first main surfaces of the first and second circuit pattern layers,
(D) The first circuit component is sealed in the insulating first adhesive resin layer, and the first main surface of the first circuit pattern layer is formed on one surface (lower surface) of the first adhesive resin layer. Bonding process;
(E) Sealing the fourth circuit component in the first adhesive resin layer and bonding the first main surface of the second circuit pattern layer to the other surface (upper surface) of the first adhesive resin layer. Process,
(F) forming a through-hole so as to penetrate the second transfer substrate and the first adhesive resin layer and expose a part of the first main surface of the first circuit pattern layer;
(G) forming a conductive via made of a metal plating layer by plating over the inner wall of the through hole, the exposed surface of the first main surface of the first circuit pattern layer, and the surface of the second circuit pattern layer;
(H) exposing the second main surfaces of the first and second circuit pattern layers by peeling and removing the first and second substrates;
(I) surface-mounting the second and third circuit components on the exposed second main surfaces of the first and second circuit pattern layers, respectively.
A method of manufacturing a component built-in type multilayer wiring board, comprising: (A) Each of the first and second conductive layers having the first and second main surfaces was formed by laminating the respective second main surfaces of the first and second conductive layers on the film-like first and second substrates in a peelable manner. Preparing first and second transfer substrates;
(B) patterning the first conductive layer of the first transfer substrate and the second conductive layer of the second transfer substrate to form first and second circuit pattern layers, respectively.
(C) a step of surface-mounting the first and fourth circuit components on the first main surfaces of the first and second circuit pattern layers;
(D) sealing the first circuit component in the insulating first adhesive resin layer, and placing the first main surface of the first circuit pattern layer on one surface (lower surface) of the first adhesive resin layer; Bonding process;
(E) sealing the fourth circuit component in the first adhesive resin layer and bonding the first main surface of the second circuit pattern layer to the other surface (upper surface) of the first adhesive resin layer; Process,
(F) forming a through-hole that passes through the first and second transfer base materials, the first and second circuit pattern layers, and the first adhesive resin layer;
(G) exposing a portion adjacent to the through hole in each of the second main surfaces of the first and second circuit pattern layers and masking the periphery thereof;
(H) forming a through-hole type conductive via made of a metal plating layer by plating over the inner wall of the through hole and the exposed surfaces of the first and second circuit pattern layers;
(I) exposing the second main surfaces of the first and second circuit pattern layers by removing the mask;
(Nu) Surface-mounting the second and third circuit components on the second main surfaces of the first and second circuit pattern layers,
A method of manufacturing a component built-in type multilayer wiring board, comprising:   5. The through hole is formed by laser processing by previously providing a conformal mask hole corresponding to the through hole in the conductive layer when patterning the conductive layer of the transfer substrate. The manufacturing method of the component built-in type multilayer wiring board as described in any one of Claim 6. Furthermore, a step of preparing a third transfer substrate formed by releasably laminating the second main surface of the third conductive layer having the first and second main surfaces on a film-like third substrate;
Patterning a third conductive layer of the third transfer substrate to form a third circuit pattern layer having first and second main surfaces;
Surface-mounting another circuit component on the first main surface of the third circuit pattern layer;
Disposing a second adhesive resin layer between the first adhesive resin layer and the third circuit pattern layer;
Sealing a circuit component surface-mounted on a circuit pattern on one surface of the first adhesive resin layer in the second adhesive resin layer, and bonding the circuit pattern to one surface of the second adhesive resin layer; ,
The other circuit component surface-mounted on the first main surface of the third circuit pattern layer is sealed with the second adhesive resin layer, and the first main surface is sealed with the other surface of the second adhesive resin layer. Bonding process;
Providing a conductive via composed of a plating layer penetrating the second adhesive resin layer between the circuit patterns adhered to both surfaces of the second adhesive resin layer;
The method for manufacturing a component built-in type multilayer wiring board according to claim 4, wherein:

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