JP2010062322A - Semiconductor wafer transfer system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that a stocker is provided at a position facing an EFEM system via a transfer path, therefore, a floor area occupied by the transfer path, a processing device, and the stocker is increased, thereby causing the size increase of a semiconductor wafer transfer system. <P>SOLUTION: A semiconductor wafer transfer system includes: a stocker 3 for storing FOUPs 6; an EFEM 4 provided on the front face of a semiconductor wafer processing device 2 so as to deliver a semiconductor substrate housed in each FOUP 6 to the semiconductor wafer processing device 2; a load port 7 constituting the EFEM 4 and having each FOUP mount 10 on which each FOUP 6 is placed; and an FOUP transfer robot 5 for transferring each FOUP 6 stored in the stocker 3 to each FOUP mount 10 of the load port 7. The stocker 3 is provided almost immediately above the FOUP mounts 10 of the load port 7. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor wafer transfer system for transferring a semiconductor substrate. Specifically, the present invention relates to a semiconductor wafer transfer system for transferring a semiconductor substrate stored in a FOUP to a semiconductor wafer processing apparatus.

As shown in FIG. 11, the conventional semiconductor wafer transfer system has a FOUP (closed box (hoop)) transferred by a transfer device such as an OHT (overhead transfer device) 103.
The Opening Unified Pod) 100 is moved to the load board 104, and the wafer in the FOUP 100 is delivered by the robot 106 via the opener 105. EFEM (Equipment Front) equipped with the load port 104 and the opener 105
The End Module system 101 is installed on the front surface of the processing apparatus 108 (see, for example, Patent Document 1). FIG. 11 is a schematic diagram of a conventional semiconductor wafer transfer system.

JP 2002-231802 A (prior art)

  However, in the conventional semiconductor wafer transfer system, the stocker 102 for storing the FOUP 100 is provided in the vicinity of the EFEM system 101. In order to increase the operating rate of the processing apparatus 108, the number of the FOUPs 100 to be temporarily stored is set. When the number is increased, there is a problem that the stocker 102 is enlarged.

  Furthermore, in the conventional EFEM system 101, each time a wafer (MAX 25 sheets) stored in one FOUP 100 is processed by the processing device 108, the FOUP 100 is transferred from the central storage location (central stocker) to the load board 104 using the OHT 103. Since it was moved (one reciprocation), there was a problem that a shortage of processing capability was caused due to a long conveyance time and a shortage of conveyance capability. For this reason, it is necessary to provide a plurality of OHTs 103. However, even in this case, traffic congestion of the OHT 103 occurs, and it is not possible to solve the shortage of processing capacity due to insufficient transport capacity. Therefore, it is necessary to provide a small stocker (small stocker) for temporarily storing the FOUP 100 in the vicinity of the EFEM system 101.

  The present invention has been made in view of the above problems, and is easy to install, and it is possible to save the space of the semiconductor wafer transfer system without reducing the amount of FOUP that can be stored in the stocker. The purpose is to provide a system.

In order to solve the above problems and achieve the above object, a first aspect of the present invention is a stocker for storing a FOUP, and a semiconductor substrate provided in front of the semiconductor wafer processing apparatus and accommodated in the FOUP. An EFEM that delivers the FOUP to the semiconductor wafer processing apparatus, a load port that includes the FOUP frame on which the FOUP is placed, and a robot that transfers the FOUP stored in the stocker to the FOUP frame of the load port, The stocker is provided almost directly above the FOUP frame of the load port.

According to the present invention, since the stocker is provided almost immediately above the FOUP frame of the load port, the total floor area occupied by the stocker and the EFEM is reduced, and the semiconductor wafer can be transferred without reducing the amount of FOUP that can be stored in the stocker. System space can be saved. In addition, in order to install the stocker and EFEM in the factory, it is necessary to adjust the positional relationship between the stocker and the EFEM, the relationship between the stocker and the OHT trajectory, and the relationship between the robot, the load board, and the stocker. The stocker and EFEM can be integrated by providing the stocker almost directly above the load port FOUP frame, making it easy to install the stocker and EFEM, and to easily adjust the OHT trajectory and position for robot control. Can be.

According to a second aspect of the present invention, there is provided a semiconductor wafer transfer system according to the first aspect, wherein a plurality of EFEMs are arranged side by side, and a FOUP provided opposite to the EFEM via a robot is provided. The robot further includes an opposing stocker to be stored, and the robot can transfer the FOUP stored in the opposing stocker to the FOUP frame of the load port.

  According to the present invention, a plurality of EFEMs are arranged side by side, and the opposing stocker for storing the FOUP facing the EFEM via the robot is provided separately from the stocker. Therefore, even when a large amount of processing is performed by the semiconductor wafer processing apparatus. A sufficient amount of FOUP can be stored in the stocker (stocker and counter stocker). Thereby, production efficiency can be improved.

  According to the present invention, it is easy to install and the space of the semiconductor wafer transfer system can be saved without reducing the amount of FOUP that can be stored in the stocker.

(First embodiment)
Hereinafter, an embodiment of a semiconductor wafer transfer system of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a semiconductor wafer transfer system according to an embodiment of the present invention, FIG. 2 is a front view of the semiconductor wafer transfer system according to an embodiment of the present invention, and FIG. FIG. 4 is a side view of the semiconductor wafer transfer system in the embodiment, FIG. 4 is a top view of the semiconductor wafer transfer system in the embodiment of the present invention, and FIG. 5 is the semiconductor wafer transfer system in the embodiment of the present invention. FIG.

As shown in FIGS. 1 to 5, a semiconductor wafer transfer system 1 is provided adjacent to a semiconductor wafer processing apparatus 2 and includes a stocker 3 and an EFEM (front end module: Equipment).
A front end module) 4 and a FOUP transfer robot 5.

  The stocker 3 stores a FOUP (Front Opening Unified Pod) 6. As shown in FIG. 1, shelves are provided on the top, bottom, left, and right, and the FOUP 6 is stored on these shelves. The FOUP 6 is transported from the storage location (central stocker) of the FOUP 6 to the shelf of the stocker 3 by using an OHT (Overhead Hoist Transport (see FIG. 5)) 200 that is an automatic guided vehicle traveling in the ceiling space. Specifically, the FOUP 6 is transferred to a predetermined placement location using the OHT 200, and the FOUP 6 is transferred from the predetermined placement location to the shelf of the stocker 3 using a FOUP transfer robot 5 described later. In this embodiment, the FOUP 6 is transferred to the stocker 3 using the OHT 200. However, the present invention is not limited to this, and an AGV (Automated Guided Vehicle) that is an automatic guided vehicle that runs following a guide tape or the like attached to the floor is used. The FOUP 6 may be transferred to the stocker 3 by an RGV (Rail Guided Vehicle) that is guided by a track rail installed on the floor and travels.

  As shown in FIG. 6, the FOUP 6 is a sealed container for transporting a semiconductor wafer (semiconductor substrate) to the semiconductor wafer processing apparatus 2 while keeping the inside of the FOUP 6 at a high degree of cleanliness. A plurality of semiconductor wafers are accommodated in the FOUP 6, and the semiconductor wafers are arranged at regular intervals in the vertical direction. An opening / closing lid 8 is provided on the side surface of the FOUP 6, and the semiconductor wafer accommodated in the semiconductor wafer can be taken in and out by opening the opening / closing lid 8. Here, FIG. 6 is a top view of the FOUP in one embodiment of the present invention.

  The EFEM 4 is installed adjacent to the front surface of the semiconductor wafer processing apparatus 2 and delivers the semiconductor wafer stored in the FOUP 6 to the semiconductor wafer processing apparatus 2. The EFEM 4 includes a load port 7 attached to the front surface, an FFU (Fan Filter Unit (not shown)) and a wafer transfer robot (not shown) in which an internal filter and a blower are integrated. A wafer transfer robot (not shown) takes out the semiconductor wafer from the FOUP 6 and supplies it to the semiconductor wafer processing apparatus 2, and stores the processed semiconductor wafer in the FOUP 6. A stocker 3 is attached to the front surface of the EFEM 4.

  The load port 7 has a FOUP opener 9 and a FOUP mount 10 as disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-349322. The FOUP opener 9 opens and closes the opening / closing lid 8 of the FOUP 6 and is disposed on the back side (semiconductor wafer processing apparatus 2 side). The FOUP opener 9 includes a drive motor (not shown), and is configured to be movable in the vertical direction by the drive motor (not shown). The FOUP opener 9 is provided with a suction portion (not shown) for sucking the opening / closing lid 8 of the FOUP 6 on the surface facing the FOUP 6. A locking pin (not shown) is provided. On the other hand, the opening / closing lid 8 of the FOUP 6 has an adsorbed portion (not shown) at a position corresponding to the adsorbing portion (not shown) of the FOUP opener 9. Further, the opening / closing lid 8 of the FOUP 6 is formed with a locked hole (not shown) at a position corresponding to the locking pin (not shown) of the FOUP opener 9. When the opening / closing lid 8 of the FOUP 6 is opened, the suction portion (not shown) of the FOUP opener 9 is attracted to the suctioned portion (not shown) of the opening / closing lid 8 of the FOUP 6, thereby opening and closing the FOUP opener 9 and the FOUP 6. The lid 8 is aligned. The FOUP gantry 10 is a table on which the FOUP 6 is placed. The FOUP gantry 10 includes a movable mounting table 11, and the mounting table 11 includes a pin (not illustrated) that can be fitted into a recess (not illustrated) formed on the bottom of the FOUP 6. By fitting a pin (not shown) of the mounting table 11 into a recess (not shown) at the bottom of the FOUP 6, the FOUP 6 on the mounting table 11 can always be directed in a certain direction. Then, when a recess (not shown) at the bottom of the FOUP 6 is fitted to a pin (not shown) of the mounting table 11 and the load port 6 is driven, the mounting table 11 moves, and the mounting table 11 moves the FOUP 6 with the FOUP opener 9. Guide to the location where it was placed. In addition, although this embodiment demonstrated using the form with which the mounting base 11 was provided in the FOUP base 10, not only this but the FOUP base 10 which is not provided with the mounting base 11 may be used. Moreover, as shown in FIGS. 1-4, the FOUP mount 10 of this load port 7 is provided directly under the stocker 3 mentioned above. In other words, the stocker 3 is provided immediately above the FOUP frame 10 of the load port 7. Note that “directly above” does not have to be strictly above, and “substantially above” is sufficient as long as the effects of the present invention are achieved.

  The FOUP transfer robot 5 moves the FOUP 6 stored in the stocker 3 onto the FOUP frame 10 of the load port 7, and includes an arm 12, a support member 13, and a robot moving rail 14. The robot moving rail 14 is fixed to the load port 7 so that the positions of the stocker 3 and the FOUP frame 10 are fixed and the control becomes easy.

  The arm 12 is rotatably connected around a connection point 15 with the support member 13, and can be rotated 360 degrees around the support member 13 in the horizontal direction by a rotational force from a rotational drive source (not shown). Further, the arm 12 has a grip portion 15 that grips the FOUP 6 at the tip. The grip unit 15 can lift the FOUP 6 by gripping the gripped portion 201 (see FIG. 6) of the FOUP 6. Further, the support member 13 can extend and contract in the vertical direction and is erected in the vertical direction. The robot moving rail 14 is configured to extend in the left-right direction with respect to the load port 7, and has a fitting groove 16 that fits with the lower end of the support member 13. The support member 13 slides on the robot movement rail 14 along the fitting groove 16, so that the FOUP transfer robot 5 (support member 13) can move in the longitudinal direction of the robot movement rail 14. As a result, the FOUP transfer robot 5 can grip the FOUP 6 and move the gripped FOUP 6 to a free position. The FOUP transfer robot 5 is an example of a FOUP transfer unit. The FOUP transfer unit includes a holding unit that holds the FOUP 6, a rotary lifting robot that rotates and lifts the holding unit, and the rotary lifting robot in a horizontal direction. Any device having a moving means for moving is included.

  Next, a method for transferring the FOUP 6 will be described with reference to FIG. FIG. 7 is an explanatory diagram of a FOUP transfer method according to an embodiment of the present invention.

  First, the FOUP 6 stored in the stocker 3 is gripped by the gripping portion 16 provided at the tip of the arm 12. Then, the FOUP 6 is slightly lifted from the shelf of the stocker 3 by extending the support member 13 upward (see FIG. 7A). Next, the arm 12 is rotated 90 degrees counterclockwise while the support member 13 is moved to the right along the robot moving rail 14 (FIG. 7B). Then, while moving the support member 13 to the left along the robot moving rail 14, the arm 12 is rotated 90 degrees clockwise and lowered. As a result, the FOUP 6 gripped by the FOUP transfer robot 5 is transferred and placed on the FOUP frame 10 of the load port 7 that is substantially directly below the stocker 3 (FIG. 7C).

  As described above, according to the present embodiment, since the stocker 3 is provided almost directly above the FOUP frame 10 of the load port 7, the floor area occupied by the stocker 3 and the EFEM 4 is reduced and can be stored in the stocker 3. Space saving of the semiconductor wafer transfer system 1 can be achieved without reducing the amount of the FOUP 6. Moreover, in order to install the stocker 3 and the EFEM 4, the positional relationship between the stocker 3 and the EFEM 4, the relationship between the stocker 3 and the OHT trajectory, and the relationship between the FOUP transfer robot 5, the load board 7, and the stocker 3 can be adjusted. Although it is necessary, the stocker 3 and the EFEM 4 can be integrated by providing the stocker 3 almost directly above the FOUP base 10 of the load port 7, so that the stocker 3 and the EFEM 4 can be easily installed and the OHT track or the like Position adjustment for robot control is also easy.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 8 is a side view of a semiconductor wafer transfer system according to the second embodiment of the present invention, and FIG. 9 is a top view of the semiconductor wafer transfer system according to the second embodiment of the present invention. The difference between the second embodiment and the first embodiment is that, in the second embodiment, a counter stocker 17 is further provided in the configuration of the first embodiment. Note that in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the same effects are provided, and the description thereof is omitted.

  As shown in FIGS. 8 and 9, in the present embodiment, an opposing stocker 17 is provided that stores a FOUP 6 provided to face the EFEM 4 via the FOUP transfer robot 5. 8 and 9, one EFEM 4 is provided. However, the present invention is not limited to this, and the semiconductor wafer loading / unloading efficiency before and after the processing step by the semiconductor wear processing apparatus 2 can be improved, and the semiconductor wafer loading / unloading can be performed simultaneously. In order to do this, a plurality of EFEMs 4 are arranged in parallel. In this case, the storage amount of the stocker can be increased, and if the robot moving rail 14 of the FOUP transfer robot 5 is lengthened and configured as a single FOUP transfer robot, an inexpensive and efficient semiconductor wear transfer system is configured.

  Next, a method for transferring the FOUP 6 in the second embodiment will be described with reference to FIG. FIG. 10 is an explanatory diagram of a FOUP transfer method according to an embodiment of the present invention.

  First, the FOUP 6 is placed on the shelf of the stocker 3 using OHT or the like. Next, the FOUP 6 stored in the stocker 3 is gripped by the gripping portion 16 provided at the tip of the arm 12. Then, the FOUP 6 is slightly lifted from the shelf of the stocker 3 by extending the support member 13 upward (the leftmost FOUP transfer robot 5). Next, the arm 12 is rotated 90 degrees counterclockwise while moving the support member 13 along the robot movement rail 14 in the right direction (shift to the second FOUP transfer robot 5 from the left). Next, after moving the support member 13 further to the right along the robot movement rail 14, the arm 12 is rotated 90 degrees clockwise while moving the support member 13 to the left along the robot movement rail 14. Lower (move to the fourth FOUP transfer robot 5 from the left). As a result, the FOUP 6 gripped by the FOUP transfer robot 5 is transferred to and placed on the FOUP gantry 10 of the load port 7 that is substantially directly below the stocker 3. Next, the semiconductor wafer in the FOUP 6 placed on the FOUP base 10 is pulled out and processed by the semiconductor wafer processing apparatus 2. Then, the processed semiconductor wafer is stored in the FOUP 6 placed on the FOUP frame 10 (the state of the fourth FOUP transfer robot 5 from the left). Next, the arm 12 is rotated 90 degrees counterclockwise while the support member 13 is moved to the right along the robot movement rail 14, and then the support member 13 is moved to the left along the robot movement rail 14. Then, the arm 12 is rotated 90 degrees counterclockwise (transfer to the third FOUP transfer robot 5 from the left). Thereby, the FOUP 6 gripped by the FOUP transfer robot 5 is transferred to the opposing stocker 17 and stored. The rotation direction of the arm 12 and the movement direction of the support member 13 for transferring the FOUP 6 stored in the stocker 3 to the FOUP frame 10 are transferred to the position of the shelf of the stocker 3 storing the FOUP 6 and the FOUP 3. The position is determined by the position of the FOUP mount 10 and is not limited to the rotation direction of the arm 3 or the movement direction of the support member 13 (the same applies to the first embodiment). The transfer method is the same when the FOUP 6 stored in the opposed stocker 17 is transferred to the FOUP frame 10. Furthermore, the FOUP 100 transported by the FOUP transport means such as OHT is always placed on the same shelf of the stocker 3 and transferred to an empty shelf by the FOUP transfer robot 5 to prevent congestion of the FOUP transport means. Is possible.

  Next, the semiconductor wafer processed by the semiconductor wafer processing apparatus 2 is accommodated in an empty FOUP 6 and the door of the FOUP 5 is closed. The processed FOUP 5 is transferred to, for example, a delivery shelf of the stocker 3 by the FOUP transfer robot 5 and then transferred to the next processing step by the FOUP transfer means. In the present embodiment, the FOUP 6 (semiconductor wafer) processed by the semiconductor wafer processing apparatus 2 may be transferred to the opposing stocker 17 by the FOUP transfer robot 5.

  As described above, according to this embodiment, a plurality of EFEMs 4 are arranged in parallel, and the opposed stocker 17 that stores the FOUP 6 facing the EFEM 4 via the FOUP transfer robot 5 is provided separately from the stocker 3. Even when a large amount of processing is performed by the semiconductor wafer processing apparatus 2, a sufficient amount of the FOUP 6 can be stored in the stocker (stocker 3 and counter stocker 17). Thereby, production efficiency can be improved.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is a perspective view of the semiconductor wafer conveyance system in one embodiment of the present invention. It is a front view of the semiconductor wafer conveyance system in one embodiment of the present invention. It is a side view of the semiconductor wafer conveyance system in one embodiment of the present invention. It is a top view of the semiconductor wafer conveyance system in one embodiment of the present invention. It is a schematic diagram of a semiconductor wafer conveyance system in one embodiment of the present invention. It is a top view of FOUP in one embodiment of the present invention. It is explanatory drawing of the transfer method of FOUP in one Embodiment of this invention. It is a side view of the semiconductor wafer conveyance system in 2nd Embodiment of this invention. It is a top view of the semiconductor wafer conveyance system in 2nd Embodiment of this invention. It is explanatory drawing of the transfer method of FOUP in 2nd Embodiment of this invention. It is the schematic of the conventional semiconductor wafer conveyance system.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor wafer transfer system 2 Semiconductor wafer processing apparatus 3 Stocker 4 EFEM
5 Robot 6 FOUP
7 Load port 8 Opening / closing lid 9 FOUP opener 10 FOUP base 11 Mounting base 12 Arm 13 Support member 14 Robot moving rail 15 Connection point 16 Grasping part 17 Opposite stocker

Claims (2)

A semiconductor wafer transfer system for transferring a semiconductor substrate stored in a FOUP to a semiconductor wafer processing apparatus,
A stocker for storing the FOUP;
EFEM provided on the front surface of the semiconductor wafer processing apparatus and delivering the semiconductor substrate housed in the FOUP to the semiconductor wafer processing apparatus;
A load port comprising the EFEM and having a FOUP frame on which the FOUP is placed;
FOUP transfer means for transferring the FOUP stored in the stocker to the FOUP frame of the load port,
The FOUP transfer means is movable in the horizontal direction on the front surface of the EFEM,
The semiconductor wafer transfer system, wherein the stocker is provided almost immediately above the FOUP frame of the load port. A plurality of the EFEMs are juxtaposed,
A counter stocker for storing the FOUP provided to face the EFEM via the FOUP transfer means;
2. The semiconductor wafer transfer system according to claim 1, wherein the FOUP transfer means can transfer the FOUP stored in the opposite stocker to a FOUP frame of the load port.

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