WO2013150841A1 - Conveyance system - Google Patents

Conveyance system Download PDF

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Publication number
WO2013150841A1
WO2013150841A1 PCT/JP2013/055156 JP2013055156W WO2013150841A1 WO 2013150841 A1 WO2013150841 A1 WO 2013150841A1 JP 2013055156 W JP2013055156 W JP 2013055156W WO 2013150841 A1 WO2013150841 A1 WO 2013150841A1
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WO
WIPO (PCT)
Prior art keywords
conveyed
stacker crane
semiconductor manufacturing
transported
storage shelf
Prior art date
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PCT/JP2013/055156
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French (fr)
Japanese (ja)
Inventor
山本　眞
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村田機械株式会社
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Publication of WO2013150841A1 publication Critical patent/WO2013150841A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Definitions

  • the present invention relates to a transport system.
  • the transport system described in Patent Document 1 includes a warehouse having a plurality of circulation-type shelves for storing articles, and a ceiling transport vehicle and an automatic guided vehicle for transporting articles outside the warehouse.
  • the loading / unloading entrances provided at the top and bottom of the warehouse are used for transfer with the overhead transport vehicle and the automatic guided vehicle.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a transport system that can secure a storage space for a transported object and can improve the transport efficiency of the transported object.
  • a transport system is provided above a loader port, a stacker crane that loads a transported object into a load port of a semiconductor manufacturing apparatus and unloads the transported object from the load port. And a stacker crane that is provided in the vicinity of the semiconductor manufacturing apparatus and that travels along the trajectory and moves the gripper that grips the object to be conveyed to convey the object to be conveyed.
  • a storage shelf in which the object can be taken in and out, and the object can be carried in and out by a stacker crane and an overhead carriage at the load port.
  • a storage shelf for storing the object to be transported is provided in the vicinity of the semiconductor manufacturing apparatus.
  • the space which accommodates a to-be-conveyed object is securable.
  • the storage shelf is disposed in the vicinity of the semiconductor manufacturing apparatus, the transfer of the object to be transported between the storage shelf and the load port can be performed quickly.
  • At least a part of the storage shelf is provided so that an object to be transported can be taken in and out by a gripper of a ceiling transport vehicle.
  • the storage shelf can function as a port for exchanging the object to be transported between the stacker crane and the overhead transport vehicle. Thereby, conveyance of a to-be-conveyed object can be implemented more efficiently.
  • the semiconductor manufacturing apparatuses are arranged to face each other at a predetermined interval, and the stacker crane is movable between the opposing semiconductor manufacturing apparatuses in a direction substantially orthogonal to the facing direction.
  • the object to be conveyed is carried into and out of each load port of each semiconductor manufacturing apparatus.
  • the present invention it is possible to secure a storage space for the object to be conveyed and improve the efficiency of conveying the object to be conveyed.
  • FIG. 1 is a figure which looked at the conveyance system concerning one embodiment from the top.
  • FIG. 2 is a perspective view showing the transport system shown in FIG.
  • FIG. 1 is a top view of a transport system according to an embodiment.
  • FIG. 2 is a perspective view showing the transport system shown in FIG.
  • the transport system 100 shown in FIGS. 1 and 2 is provided in a clean room for manufacturing semiconductor devices.
  • the transport system 100 includes a storage shelf 20 that stores the object to be transported 10, a stacker crane 30, and a vehicle (ceiling transport vehicle) 40.
  • Semiconductor manufacturing apparatuses 50 and 52 are arranged in the clean room.
  • the semiconductor manufacturing apparatuses 50 and 52 are provided with load ports 54 and 56 for carrying the object 10 into and out of the semiconductor manufacturing apparatuses 50 and 52, respectively.
  • the transport system 100 is made of MCS (Material Control system).
  • the MCS is provided between the controller that controls the stacker crane 30 and the vehicle 40 and the MES (Manufacturing Execution System), and transmits various instructions from the MES to the controller in a timely manner, and reports from the controller are collectively transmitted to the MES. It has the function to do.
  • the MES is an integrated production information system that manages and manages various types of information at the factory site, and manages information on the MCS and the semiconductor manufacturing apparatuses 50 and 52.
  • the transported object 10 is a container (so-called FOUP (Front Opening Unified Pod)) containing a plurality of semiconductor wafers.
  • a flange portion 10b that is held by a gripper 44 of a vehicle 40 to be described later is provided on the upper surface 10a of the conveyed object 10.
  • a detachable lid (not shown) for taking in and out the semiconductor wafer is attached to the side surface (rear surface) 10c of the transferred object 10.
  • the storage shelf 20 is a shelf for temporarily storing the object to be transported 10.
  • the storage shelf 20 is disposed in the vicinity of the semiconductor manufacturing apparatuses 50 and 52.
  • the storage shelf 20 is disposed with the load ports 54 and 56 of the semiconductor manufacturing apparatuses 50 and 52 interposed therebetween.
  • the storage shelf 20 is provided with a plurality of rows (in this case, three rows) of placement portions 22 on which the object 10 is placed in the height direction.
  • the mounting portion 22 is provided with a pin 24 that protrudes upward from the upper surface thereof.
  • the pin 24 engages with a positioning hole (not shown) provided on the bottom surface of the conveyed object 10.
  • the conveyed object 10 is positioned in the storage shelf 20 by the pin 24.
  • a clearance for inserting a transfer arm 39c (described later) of the stacker crane 30 is provided in the mounting portion 22 below the bottom surface of the conveyed object 10.
  • the upper part of the storage shelf 20 is open. That is, at least a part of the storage shelf 20 can be loaded and unloaded with the gripper 44 of the vehicle 40.
  • the conveyed object 10 is placed so that the front surface (the surface opposite to the side surface 10 c to which the lid is attached) faces the stacker crane 30 side.
  • the number of installations and installation positions of the storage shelves 20 are appropriately set according to the installation positions and number of semiconductor manufacturing apparatuses 50 and 52 and the structure of the clean room.
  • the storage shelf 20 may be suspended from the ceiling, or may be fixed to the floor with a support member or the like interposed.
  • the stacker crane 30 is provided so as to be movable in the vertical direction with respect to the strut device 34, a traveling carriage 32 that moves along the rail R ⁇ b> 1 in the clean room, two strut devices 34 erected on the traveling carriage 32, and the strut device 34.
  • the lift table 36 and the transfer device 38 installed on the lift table 36 are configured.
  • the stacker crane 30 includes a turntable installed on the lifting platform 36, a controller that controls the operation of the stacker crane 30, and the like.
  • the stacker crane 30 moves linearly along the rail R1 laid in the clean room.
  • the rail R1 is laid along a direction orthogonal to the facing direction between the semiconductor manufacturing apparatuses 50 and 52 disposed facing each other. That is, the stacker crane 30 is provided so as to be movable along a direction substantially orthogonal to the facing direction of the semiconductor manufacturing apparatuses 50 and 52. Note that the term “opposite” as used herein does not require the semiconductor manufacturing apparatuses 50 and 52 to completely face each other, as long as they are arranged at a predetermined interval.
  • the transfer device 38 has a scalar arm 39.
  • the scalar arm 39 includes a proximal end arm 39a, a distal end arm 39b, and a transfer arm 39c.
  • the upper surface of the transfer arm 39c constitutes a placement surface on which the article to be transported 10 is placed.
  • the scalar arm 39 linearly moves in the direction (the direction in which the article to be conveyed 10 is taken in and out) perpendicular to the moving direction of the traveling carriage 32 by the transfer arm 39c.
  • the stacker crane 30 operates as follows. That is, the stacker crane 30 stops in front of the predetermined storage rack 20 and takes out the predetermined object 10 stored in the storage rack 20 by the transfer arm 39c. Subsequently, the stacker crane 30 is moved along the rail R ⁇ b> 1 by the traveling carriage 32, and the transferred object 10 is transferred to the load port 54 of the semiconductor manufacturing apparatus 50, for example. Further, the stacker crane 30 is stopped before the load port 56 of the semiconductor manufacturing apparatus 52, for example, and the transferred object 10 placed on the load port 56 is carried out by the transfer arm 39c. Subsequently, the stacker crane 30 moves along the rail R ⁇ b> 1 by the traveling carriage 32 to the conveyance destination (for example, the storage shelf 20), and transfers the object to be conveyed 10.
  • the conveyance destination for example, the storage shelf 20
  • the stacker crane 30 is provided so as to be rotatable by a turntable. Therefore, the stacker crane 30 moves the scalar arm 39 toward one of the semiconductor manufacturing apparatus 50 side and the semiconductor manufacturing apparatus 52 side by appropriately changing the direction with the turntable. As a result, the stacker crane 30 loads and unloads the transferred object 10 with respect to each of the load ports 54 and 56 of the semiconductor manufacturing apparatuses 50 and 52 arranged to face each other.
  • one stacker crane 30 may be installed on the rail R1, or a plurality of stacker cranes 30 may be installed.
  • Vehicle 40 is OHT (Overhead Hoist Transport), which transports the transported object 10 along a traveling rail (track) R2.
  • the traveling rail R ⁇ b> 2 is installed on the ceiling of the clean room, and is disposed above the load ports 54 and 56 of the semiconductor manufacturing apparatuses 50 and 52.
  • the vehicle 40 has a gripper 44.
  • the gripper 44 holds the conveyed object 10 by gripping the flange portion 10b.
  • the gripper 44 is lowered from a predetermined position by a plurality of belts 46 being synchronously fed by an elevating unit (not shown). Further, the gripper 44 is moved up to a predetermined position by the plurality of belts 46 being synchronously wound by the elevating part.
  • the vehicle 40 operates as follows. That is, the vehicle 40 transports the transported object 10 from a transport source (for example, a stocker of the transported object), stops, for example, above the load port 54 of the semiconductor manufacturing apparatus 50, and lowers the transported object 10 that has been transported. And place it on the load port 54. Further, the vehicle 40 transports the transported object 10 from the transport source, stops above the predetermined storage shelf 20, lowers the transported transported object 10, and transports the transported object 10 to a predetermined position on the storage shelf 20. The object 10 is placed.
  • a transport source for example, a stocker of the transported object
  • the vehicle 40 stops, for example, above the load port 56 of the semiconductor manufacturing apparatus 52, grips the object to be transported 10 placed on the load port 56 with the gripper 44, and lifts it while holding it.
  • the conveyed product 10 is conveyed to a predetermined conveyance destination. Further, the vehicle 40 stops, for example, above the storage shelf 20, holds the object to be conveyed 10 stored in the storage shelf 20 with the gripper 44, and raises the object to be conveyed 10 in a predetermined state. Transport to destination.
  • the storage shelf 20 is disposed in the vicinity of the semiconductor manufacturing apparatuses 50 and 52.
  • the storage shelf 20 can secure a space for storing the transported object 10. Further, since the storage shelf 20 is disposed in the vicinity of the semiconductor manufacturing apparatuses 50 and 52, the transfer of the transported object 10 between the storage shelf 20 and the load ports 54 and 56 can be performed quickly.
  • the vehicle 40 directly carries in and out the article 10 to / from the load ports 54 and 56.
  • the transported object 10 is transported and placed on a predetermined port by a vehicle 40, and then the stacker crane 30 is placed.
  • the object to be conveyed 10 was carried into a predetermined load port. For this reason, it takes time to transport the object to be transported 10.
  • the object to be conveyed 10 can be directly carried into and out of the load ports 54 and 56 by the vehicle 40 without using the stacker crane 30, the time for temporarily storing the object to be conveyed 10 The transfer time by the stacker crane 30 is shortened. Therefore, the conveyance time of the conveyed product 10 can be shortened, and the conveyed product 10 can be conveyed quickly. In addition, it is possible to improve the degree of freedom in transporting the transported object 10. As described above, in this embodiment, it is possible to improve the conveyance efficiency of the object to be conveyed 10.
  • the upper part of the storage shelf 20 is opened. Thereby, the vehicle 40 can take in and out the article to be transported 10 in the storage shelf 20. Therefore, the storage shelf 20 can function as a port for exchanging the conveyed object 10 between the stacker crane 30 and the vehicle 40. Thereby, conveyance of the to-be-conveyed object 10 can be implemented more efficiently.
  • the stacker crane 30 is disposed between the semiconductor manufacturing apparatuses 50 and 52 disposed to face each other, and is movable between the semiconductor manufacturing apparatuses 50 and 52.
  • the stacker crane 30 can access both the load ports 54 and 56, the transfer time of the conveyed object 10 can be shortened.
  • the present invention is not limited to the above embodiment.
  • the configuration in which the two semiconductor manufacturing apparatuses 50 and 52 are arranged has been described as an example.
  • the number of semiconductor manufacturing apparatuses to be installed may be appropriately set according to the design of the semiconductor manufacturing factory. Good.
  • an interbay stocker for temporarily storing the object to be transported 10 may be provided.
  • the stacker crane 30 and the vehicle 40 are accessible to the interbay stocker.
  • SYMBOLS 100 ... Conveyance system, 10 ... Conveyed object, 20 ... Storage shelf, 30 ... Stacker crane, 40 ... Vehicle (ceiling conveyance vehicle), 44 ... Gripper, 50, 52 ... Semiconductor manufacturing apparatus, 54, 56 ... Load port.

Abstract

Provided is a conveyance system with which accommodating space of objects to be conveyed can be ensured, and with which an improvement in conveyance efficiency of the objects to be conveyed is achieved. The conveyance system is provided with: a stacker crane (30) for carrying, into and out of loading ports (54, 56) of semiconductor producing devices (50, 52), objects (10) to be conveyed; vehicles (40) which travel along rails (R2) provided above the loading ports (54, 56), and on which grippers (44) for gripping the objects (10) to be conveyed are made to ascend and descend to convey the objects (10) to be conveyed; and accommodating shelves (20) which are provided in the vicinity of the semiconductor producing devices (50, 52), which accommodate the objects (10) to be conveyed, and which enable the stacker crane (30) to deposit and withdraw the objects (10) to be conveyed. As a result of the stacker crane (30) and the vehicles (40), the objects (10) to be conveyed can be carried into and out of the loading ports (54, 56).

Description

搬送システムTransport system
　本発明は、搬送システムに関するものである。 The present invention relates to a transport system.
　従来の搬送システムとして、例えば特許文献１に記載されたものが知られている。特許文献１に記載の搬送システムは、物品を収納する循環式の複数の棚を有する倉庫と、倉庫の外部において物品を搬送するための天井搬送車及び無人搬送車とを含んで構成されており、倉庫の上下に設けられた搬出入口を天井搬送車及び無人搬送車との移載に用いている。 As a conventional transport system, for example, the one described in Patent Document 1 is known. The transport system described in Patent Document 1 includes a warehouse having a plurality of circulation-type shelves for storing articles, and a ceiling transport vehicle and an automatic guided vehicle for transporting articles outside the warehouse. In addition, the loading / unloading entrances provided at the top and bottom of the warehouse are used for transfer with the overhead transport vehicle and the automatic guided vehicle.
特開２００１－３１２１６号公報JP 2001-3216 A
　ところで、半導体デバイスの製造においては、処理の高速化が進められている。そのため、半導体製造装置におけるタクトタイムの短縮が求められているが、それと同時に工程間における半導体ウェハの搬送時間の短縮も求められている。また、近年の半導体ウェハの大型化に伴い、それを収納する容器（例えばＦＯＵＰ：Front Opening Unified Pod等）も大型化する。そのため、半導体製造工場においては、ＦＯＵＰを収納するスペースが従来よりも必要とされるが、限られたスペースにおいてＦＯＵＰを収納するスペースを確保することは容易ではない。 By the way, in the manufacture of semiconductor devices, the processing speed has been increased. Therefore, shortening of the tact time in the semiconductor manufacturing apparatus is demanded, but at the same time, shortening of the transport time of the semiconductor wafer between processes is also demanded. In addition, with the recent increase in size of semiconductor wafers, containers for storing them (for example, FOUP: Front Opening Unified Unified Pod) are also increased in size. Therefore, in the semiconductor manufacturing factory, a space for storing the FOUP is required more than before, but it is not easy to secure a space for storing the FOUP in a limited space.
　本発明は、上記課題を解決するためになされたものであり、被搬送物の収納スペースを確保できると共に、被搬送物の搬送効率の向上を図れる搬送システムを提供すること目的とする。 The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a transport system that can secure a storage space for a transported object and can improve the transport efficiency of the transported object.
　上記課題を解決するために、本発明に係る搬送システムは、半導体製造装置のロードポートに被搬送物を搬入すると共に、ロードポートから被搬送物を搬出するスタッカクレーンと、ロードポートの上方に設けられた軌道に沿って走行し、被搬送物を把持するグリッパを昇降させて被搬送物を搬送する天井搬送車と、半導体製造装置の近傍に設けられ、被搬送物を収納すると共にスタッカクレーンによる被搬送物の出し入れが可能とされている収納棚と、を備え、ロードポートにおいて、スタッカクレーン及び天井搬送車による被搬送物の搬入及び搬出が可能とされていることを特徴とする。 In order to solve the above-described problems, a transport system according to the present invention is provided above a loader port, a stacker crane that loads a transported object into a load port of a semiconductor manufacturing apparatus and unloads the transported object from the load port. And a stacker crane that is provided in the vicinity of the semiconductor manufacturing apparatus and that travels along the trajectory and moves the gripper that grips the object to be conveyed to convey the object to be conveyed. A storage shelf in which the object can be taken in and out, and the object can be carried in and out by a stacker crane and an overhead carriage at the load port.
　この搬送システムでは、半導体製造装置の近傍に被搬送物を収納する収納棚が設けられている。これにより、被搬送物を収納するスペースを確保できる。また、収納棚を半導体製造装置の近傍に配置しているため、収納棚とロードポートとの間での被搬送物の移載を迅速に行える。また、ロードポートにおいて、スタッカクレーン及び天井搬送車による被搬送物の搬入及び搬出が可能とされている。そのため、天井搬送車により直接ロードポートに被搬送物の搬入及び搬出ができる。これにより、被搬送物をスタッカクレーンに渡すために一時的に被搬送物を保管する時間の短縮が図れ、且つ、スタッカクレーンによる移載の時間も短縮できるため、被搬送物を迅速に搬送できる。また、被搬送物の移載の自由度の向上も図れる。したがって、被搬送物の搬送効率の向上が図れる。 In this transport system, a storage shelf for storing the object to be transported is provided in the vicinity of the semiconductor manufacturing apparatus. Thereby, the space which accommodates a to-be-conveyed object is securable. In addition, since the storage shelf is disposed in the vicinity of the semiconductor manufacturing apparatus, the transfer of the object to be transported between the storage shelf and the load port can be performed quickly. In addition, it is possible to carry in and carry out the object to be conveyed by the stacker crane and the overhead conveyance vehicle at the load port. Therefore, it is possible to carry in and carry out the object to be conveyed directly to the load port by the overhead conveyance vehicle. As a result, it is possible to shorten the time for temporarily storing the transported object in order to pass the transported object to the stacker crane, and also to shorten the transfer time by the stacker crane, so that the transported object can be transported quickly. . In addition, it is possible to improve the degree of freedom of transfer of the transferred object. Therefore, it is possible to improve the conveyance efficiency of the object to be conveyed.
　一実施形態においては、収納棚の少なくとも一部は、天井搬送車のグリッパによる被搬送物の出し入れが可能に設けられている。このように、天井搬送車が収納棚にアクセスできる構成とすることにより、収納棚を、スタッカクレーンと天井搬送車との間で被搬送物をやり取りするためのポートとして機能させることができる。これにより、被搬送物の搬送をより効率的に実施できる。 In one embodiment, at least a part of the storage shelf is provided so that an object to be transported can be taken in and out by a gripper of a ceiling transport vehicle. In this way, by adopting a configuration in which the overhead transport vehicle can access the storage shelf, the storage shelf can function as a port for exchanging the object to be transported between the stacker crane and the overhead transport vehicle. Thereby, conveyance of a to-be-conveyed object can be implemented more efficiently.
　一実施形態においては、半導体製造装置は、所定の間隔をあけて互いに対向して配置されており、スタッカクレーンは、対向する半導体製造装置の間において当該対向方向と略直交する方向に移動可能とされており、各半導体製造装置の各ロードポートに被搬送物を搬入及び搬出する。このような構成により、１台のスタッカクレーンにより複数のロードポートにおいて被搬送物の搬入及び搬出することができるので、クリーンルーム、ひいては半導体製造工場の省スペース化を図ることができると共に、被搬送物の移載時間の短縮が図れる。 In one embodiment, the semiconductor manufacturing apparatuses are arranged to face each other at a predetermined interval, and the stacker crane is movable between the opposing semiconductor manufacturing apparatuses in a direction substantially orthogonal to the facing direction. The object to be conveyed is carried into and out of each load port of each semiconductor manufacturing apparatus. With such a configuration, a single stacker crane can carry in and out a transported object at a plurality of load ports, so that it is possible to save space in a clean room and eventually a semiconductor manufacturing factory, and to transport a transported object. Transfer time can be shortened.
　本発明によれば、被搬送物の収納スペースを確保できると共に、被搬送物の搬送効率の向上を図れる。 According to the present invention, it is possible to secure a storage space for the object to be conveyed and improve the efficiency of conveying the object to be conveyed.
図１は、一実施形態に係る搬送システムを上から見た図である。Drawing 1 is a figure which looked at the conveyance system concerning one embodiment from the top. 図２は、図１に示す搬送システムを示す斜視図である。FIG. 2 is a perspective view showing the transport system shown in FIG.
　以下、添付図面を参照して、本発明の好適な実施形態について詳細に説明する。なお、図面の説明において同一又は相当要素には同一符号を付し、重複する説明は省略する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted.
　図１は、一実施形態に係る搬送システムを上から見た図である。図２は、図１に示す搬送システムを示す斜視図である。図１及び図２に示す搬送システム１００は、半導体デバイスを製造するためのクリーンルームに設けられている。搬送システム１００は、被搬送物１０を収納する収納棚２０と、スタッカクレーン３０と、ビークル（天井搬送車）４０と、を備えている。クリーンルームには、半導体製造装置５０，５２が配置されている。半導体製造装置５０，５２には、この半導体製造装置５０，５２に被搬送物１０を搬入及び搬出するためのロードポート５４，５６がそれぞれ設置されている。 FIG. 1 is a top view of a transport system according to an embodiment. FIG. 2 is a perspective view showing the transport system shown in FIG. The transport system 100 shown in FIGS. 1 and 2 is provided in a clean room for manufacturing semiconductor devices. The transport system 100 includes a storage shelf 20 that stores the object to be transported 10, a stacker crane 30, and a vehicle (ceiling transport vehicle) 40. Semiconductor manufacturing apparatuses 50 and 52 are arranged in the clean room. The semiconductor manufacturing apparatuses 50 and 52 are provided with load ports 54 and 56 for carrying the object 10 into and out of the semiconductor manufacturing apparatuses 50 and 52, respectively.
　搬送システム１００は、ＭＣＳ（Material
Control System）により制御される。ＭＣＳは、スタッカクレーン３０及びビークル４０を制御するコントローラと、ＭＥＳ（Manufacturing Execution System）との間に設けられ、ＭＥＳからの各種指示をコントローラに適時伝達し、コントローラからの報告をまとめてＭＥＳに伝達する機能を有する。ＭＥＳは、工場現場における様々な情報を統括して管理する統合生産情報システムであり、ＭＣＳ及び半導体製造装置５０，５２の情報管理を行う。 The transport system 100 is made of MCS (Material
Control system). The MCS is provided between the controller that controls the stacker crane 30 and the vehicle 40 and the MES (Manufacturing Execution System), and transmits various instructions from the MES to the controller in a timely manner, and reports from the controller are collectively transmitted to the MES. It has the function to do. The MES is an integrated production information system that manages and manages various types of information at the factory site, and manages information on the MCS and the semiconductor manufacturing apparatuses 50 and 52.
　被搬送物１０は、複数枚の半導体ウェハを収容した容器（いわゆるＦＯＵＰ（Front OpeningUnified Pod））である。被搬送物１０の上面１０ａには、後述するビークル４０のグリッパ４４によって保持されるフランジ部１０ｂが設けられている。また、被搬送物１０の側面（後面）１０ｃには、半導体ウェハを出し入れするための着脱自在の蓋（図示しない）が取り付けられている。 The transported object 10 is a container (so-called FOUP (Front Opening Unified Pod)) containing a plurality of semiconductor wafers. A flange portion 10b that is held by a gripper 44 of a vehicle 40 to be described later is provided on the upper surface 10a of the conveyed object 10. In addition, a detachable lid (not shown) for taking in and out the semiconductor wafer is attached to the side surface (rear surface) 10c of the transferred object 10.
　収納棚２０は、被搬送物１０を一時的に収納する棚である。収納棚２０は、半導体製造装置５０，５２の近傍に配置されている。本実施形態では、収納棚２０は、半導体製造装置５０，５２のロードポート５４，５６を挟んで配置されている。収納棚２０には、被搬送物１０が載置される載置部２２が高さ方向に複数列（ここでは３列）設けられている。載置部２２には、その上面から上方に突出するピン２４が設けられている。ピン２４は、被搬送物１０の底面に設けられた位置決め穴（図示しない）と係合する。このピン２４により、収納棚２０において被搬送物１０が位置決めされる。なお、載置部２２には、被搬送物１０の底面の下方に、スタッカクレーン３０の移載アーム３９ｃ（後述）が挿入される隙間が設けられている。 The storage shelf 20 is a shelf for temporarily storing the object to be transported 10. The storage shelf 20 is disposed in the vicinity of the semiconductor manufacturing apparatuses 50 and 52. In the present embodiment, the storage shelf 20 is disposed with the load ports 54 and 56 of the semiconductor manufacturing apparatuses 50 and 52 interposed therebetween. The storage shelf 20 is provided with a plurality of rows (in this case, three rows) of placement portions 22 on which the object 10 is placed in the height direction. The mounting portion 22 is provided with a pin 24 that protrudes upward from the upper surface thereof. The pin 24 engages with a positioning hole (not shown) provided on the bottom surface of the conveyed object 10. The conveyed object 10 is positioned in the storage shelf 20 by the pin 24. In addition, a clearance for inserting a transfer arm 39c (described later) of the stacker crane 30 is provided in the mounting portion 22 below the bottom surface of the conveyed object 10.
　収納棚２０の上部は、開放されている。すなわち、収納棚２０の少なくとも一部は、ビークル４０のグリッパ４４による被搬送物１０の出し入れが可能とされている。収納棚２０において、被搬送物１０は、その前面（蓋が取り付けられている側面１０ｃとは反対側の面）がスタッカクレーン３０側を向くように載置される。収納棚２０は、半導体製造装置５０，５２の設置位置や台数、クリーンルームの構造に応じて設置数や設置位置が適宜設定される。また、収納棚２０は、天井に吊り下げられていてもよいし、床に支持部材などを介在させて固定されていてもよい。 The upper part of the storage shelf 20 is open. That is, at least a part of the storage shelf 20 can be loaded and unloaded with the gripper 44 of the vehicle 40. In the storage shelf 20, the conveyed object 10 is placed so that the front surface (the surface opposite to the side surface 10 c to which the lid is attached) faces the stacker crane 30 side. The number of installations and installation positions of the storage shelves 20 are appropriately set according to the installation positions and number of semiconductor manufacturing apparatuses 50 and 52 and the structure of the clean room. The storage shelf 20 may be suspended from the ceiling, or may be fixed to the floor with a support member or the like interposed.
　スタッカクレーン３０は、クリーンルーム内をレールＲ１に沿って移動する走行台車３２と、この走行台車３２に立設された２基の支柱装置３４と、支柱装置３４に対して上下方向に移動可能に設けられた昇降台３６と、昇降台３６上に設置された移載装置３８とを含んで構成されている。また、スタッカクレーン３０は、図示しないが、昇降台３６上に設置されたターンテーブルや、スタッカクレーン３０の動作を制御するコントローラなどを備えている。 The stacker crane 30 is provided so as to be movable in the vertical direction with respect to the strut device 34, a traveling carriage 32 that moves along the rail R <b> 1 in the clean room, two strut devices 34 erected on the traveling carriage 32, and the strut device 34. The lift table 36 and the transfer device 38 installed on the lift table 36 are configured. Although not shown, the stacker crane 30 includes a turntable installed on the lifting platform 36, a controller that controls the operation of the stacker crane 30, and the like.
　スタッカクレーン３０は、クリーンルーム内に敷設されたレールＲ１に沿って直線移動する。レールＲ１は、対向して配置された半導体製造装置５０，５２の間において、この対向方向に直交する方向に沿って敷設されている。すなわち、スタッカクレーン３０は、半導体製造装置５０，５２の対向方向に略直交する方向に沿って移動可能に設けられている。なお、ここで言う対向とは、半導体製造装置５０，５２とが完全に向き合っている必要はなく、所定の間隔をあけて配置されている状態であればよい。 The stacker crane 30 moves linearly along the rail R1 laid in the clean room. The rail R1 is laid along a direction orthogonal to the facing direction between the semiconductor manufacturing apparatuses 50 and 52 disposed facing each other. That is, the stacker crane 30 is provided so as to be movable along a direction substantially orthogonal to the facing direction of the semiconductor manufacturing apparatuses 50 and 52. Note that the term “opposite” as used herein does not require the semiconductor manufacturing apparatuses 50 and 52 to completely face each other, as long as they are arranged at a predetermined interval.
　移載装置３８は、スカラーアーム３９を有している。スカラーアーム３９は、基端側アーム３９ａと、先端側アーム３９ｂと、移載アーム３９ｃとにより構成されている。移載アーム３９ｃの上面は、被搬送物１０を載置する載置面を構成している。スカラーアーム３９は、移載アーム３９ｃが走行台車３２の移動方向に直交する方向（被搬送物１０が出し入れされる方向）に直線移動する。 The transfer device 38 has a scalar arm 39. The scalar arm 39 includes a proximal end arm 39a, a distal end arm 39b, and a transfer arm 39c. The upper surface of the transfer arm 39c constitutes a placement surface on which the article to be transported 10 is placed. The scalar arm 39 linearly moves in the direction (the direction in which the article to be conveyed 10 is taken in and out) perpendicular to the moving direction of the traveling carriage 32 by the transfer arm 39c.
　スタッカクレーン３０は、次のように動作する。すなわち、スタッカクレーン３０は、所定の収納棚２０の前に停止し、収納棚２０に収納されている所定の被搬送物１０を移載アーム３９ｃにより取り出す。続いて、スタッカクレーン３０は、走行台車３２によりレールＲ１に沿って移動し、例えば半導体製造装置５０のロードポート５４に被搬送物１０を移載する。また、スタッカクレーン３０は、例えば半導体製造装置５２のロードポート５６の前に停止し、ロードポート５６に載置された被搬送物１０を移載アーム３９ｃにより搬出する。続いて、スタッカクレーン３０は、搬送先（例えば収納棚２０）まで走行台車３２によりレールＲ１に沿って移動し、被搬送物１０を移載する。 The stacker crane 30 operates as follows. That is, the stacker crane 30 stops in front of the predetermined storage rack 20 and takes out the predetermined object 10 stored in the storage rack 20 by the transfer arm 39c. Subsequently, the stacker crane 30 is moved along the rail R <b> 1 by the traveling carriage 32, and the transferred object 10 is transferred to the load port 54 of the semiconductor manufacturing apparatus 50, for example. Further, the stacker crane 30 is stopped before the load port 56 of the semiconductor manufacturing apparatus 52, for example, and the transferred object 10 placed on the load port 56 is carried out by the transfer arm 39c. Subsequently, the stacker crane 30 moves along the rail R <b> 1 by the traveling carriage 32 to the conveyance destination (for example, the storage shelf 20), and transfers the object to be conveyed 10.
　また、スタッカクレーン３０は、ターンテーブルにより回転可能に設けられている。そのため、スタッカクレーン３０は、ターンテーブルにより向きを適宜変えることで、半導体製造装置５０側及び半導体製造装置５２側のいずれか一方側に向かってスカラーアーム３９を移動させる。これにより、スタッカクレーン３０は、対向して配置された半導体製造装置５０，５２のロードポート５４，５６のそれぞれに対して、被搬送物１０の搬入及び搬出を行う。 Also, the stacker crane 30 is provided so as to be rotatable by a turntable. Therefore, the stacker crane 30 moves the scalar arm 39 toward one of the semiconductor manufacturing apparatus 50 side and the semiconductor manufacturing apparatus 52 side by appropriately changing the direction with the turntable. As a result, the stacker crane 30 loads and unloads the transferred object 10 with respect to each of the load ports 54 and 56 of the semiconductor manufacturing apparatuses 50 and 52 arranged to face each other.
　なお、図１においては、スタッカクレーン３０を１台しか図示していないが、スタッカクレーン３０は、レールＲ１上に１台設置されていてもよいし、複数台設置されていてもよい。 Although only one stacker crane 30 is shown in FIG. 1, one stacker crane 30 may be installed on the rail R1, or a plurality of stacker cranes 30 may be installed.
　ビークル４０は、ＯＨＴ（Overhead
Hoist Transport）であり、被搬送物１０を走行レール（軌道）Ｒ２に沿って搬送する。走行レールＲ２は、クリーンルームの天井に設置されたものであり、半導体製造装置５０，５２のロードポート５４，５６の上方に配置されている。 Vehicle 40 is OHT (Overhead
Hoist Transport), which transports the transported object 10 along a traveling rail (track) R2. The traveling rail R <b> 2 is installed on the ceiling of the clean room, and is disposed above the load ports 54 and 56 of the semiconductor manufacturing apparatuses 50 and 52.
　ビークル４０は、グリッパ４４を有している。グリッパ４４は、フランジ部１０ｂを把持することで、被搬送物１０を保持する。グリッパ４４は、昇降部（図示しない）により複数本のベルト４６が同期して繰り出されることで、所定の位置から下降する。また、グリッパ４４は昇降部により複数本のベルト４６が同期して巻き取られることで、所定の位置まで上昇する。 The vehicle 40 has a gripper 44. The gripper 44 holds the conveyed object 10 by gripping the flange portion 10b. The gripper 44 is lowered from a predetermined position by a plurality of belts 46 being synchronously fed by an elevating unit (not shown). Further, the gripper 44 is moved up to a predetermined position by the plurality of belts 46 being synchronously wound by the elevating part.
　ビークル４０は、次のように動作する。すなわち、ビークル４０は、被搬送物１０を搬送元（例えば被搬送物のストッカ）から搬送し、例えば半導体製造装置５０のロードポート５４の上方に停止して、搬送してきた被搬送物１０を下降させ、ロードポート５４上に載置する。また、ビークル４０は、被搬送物１０を搬送元から搬送し、所定の収納棚２０の上方に停止して、搬送してきた被搬送物１０を下降させ、収納棚２０の所定の位置に被搬送物１０を載置する。 The vehicle 40 operates as follows. That is, the vehicle 40 transports the transported object 10 from a transport source (for example, a stocker of the transported object), stops, for example, above the load port 54 of the semiconductor manufacturing apparatus 50, and lowers the transported object 10 that has been transported. And place it on the load port 54. Further, the vehicle 40 transports the transported object 10 from the transport source, stops above the predetermined storage shelf 20, lowers the transported transported object 10, and transports the transported object 10 to a predetermined position on the storage shelf 20. The object 10 is placed.
　また、ビークル４０は、例えば半導体製造装置５２のロードポート５６の上方に停止し、当該ロードポート５６に載置されている被搬送物１０をグリッパ４４で把持し、保持した状態で上昇させて被搬送物１０を所定の搬送先に搬送する。また、ビークル４０は、例えば収納棚２０の上方に停止し、当該収納棚２０に収納されている被搬送物１０をグリッパ４４で把持し、保持した状態で上昇させて被搬送物１０を所定の搬送先に搬送する。 The vehicle 40 stops, for example, above the load port 56 of the semiconductor manufacturing apparatus 52, grips the object to be transported 10 placed on the load port 56 with the gripper 44, and lifts it while holding it. The conveyed product 10 is conveyed to a predetermined conveyance destination. Further, the vehicle 40 stops, for example, above the storage shelf 20, holds the object to be conveyed 10 stored in the storage shelf 20 with the gripper 44, and raises the object to be conveyed 10 in a predetermined state. Transport to destination.
　以上説明したように、本実施形態では、半導体製造装置５０，５２の近傍に収納棚２０が配置されている。この収納棚２０により、被搬送物１０を収納するスペースを確保できる。また、収納棚２０を半導体製造装置５０，５２の近傍に配置しているため、収納棚２０とロードポート５４，５６との間での被搬送物１０の移載を迅速に行える。 As described above, in the present embodiment, the storage shelf 20 is disposed in the vicinity of the semiconductor manufacturing apparatuses 50 and 52. The storage shelf 20 can secure a space for storing the transported object 10. Further, since the storage shelf 20 is disposed in the vicinity of the semiconductor manufacturing apparatuses 50 and 52, the transfer of the transported object 10 between the storage shelf 20 and the load ports 54 and 56 can be performed quickly.
　また、本実施形態では、ビークル４０が、ロードポート５４，５６に対して被搬送物１０を直接搬入及び搬出する。例えば早急に処理が必要とされる緊急ロット用の被搬送物１０を搬送する場合、従来では、ビークル４０により所定のポートに当該被搬送物１０を搬送して載置し、その後にスタッカクレーン３０によりその被搬送物１０を所定のロードポートに搬入していた。そのため、被搬送物１０の搬送にどうしても時間がかかっていた。 Further, in the present embodiment, the vehicle 40 directly carries in and out the article 10 to / from the load ports 54 and 56. For example, when transporting an object 10 for an emergency lot that requires immediate processing, conventionally, the transported object 10 is transported and placed on a predetermined port by a vehicle 40, and then the stacker crane 30 is placed. Thus, the object to be conveyed 10 was carried into a predetermined load port. For this reason, it takes time to transport the object to be transported 10.
　これに対して、本実施形態では、スタッカクレーン３０を介さずにビークル４０によりロードポート５４，５６に直接被搬送物１０を搬入及び搬出できるため、被搬送物１０を一時的に保管する時間やスタッカクレーン３０による移載時間が短縮される。したがって、被搬送物１０の搬送時間を短縮でき、被搬送物１０を迅速に搬送できる。また、被搬送物１０の搬送の自由度の向上が図れる。以上のように、本実施形態では、被搬送物１０の搬送効率の向上が図れる。 On the other hand, in the present embodiment, since the object to be conveyed 10 can be directly carried into and out of the load ports 54 and 56 by the vehicle 40 without using the stacker crane 30, the time for temporarily storing the object to be conveyed 10 The transfer time by the stacker crane 30 is shortened. Therefore, the conveyance time of the conveyed product 10 can be shortened, and the conveyed product 10 can be conveyed quickly. In addition, it is possible to improve the degree of freedom in transporting the transported object 10. As described above, in this embodiment, it is possible to improve the conveyance efficiency of the object to be conveyed 10.
　また、本実施形態では、収納棚２０の上部が開放されている。これにより、ビークル４０が、収納棚２０において、被搬送物１０の出し入れを行える。したがって、収納棚２０を、スタッカクレーン３０とビークル４０との間で被搬送物１０をやり取りするためのポートとして機能させることができる。これにより、被搬送物１０の搬送をより効率的に実施できる。 In the present embodiment, the upper part of the storage shelf 20 is opened. Thereby, the vehicle 40 can take in and out the article to be transported 10 in the storage shelf 20. Therefore, the storage shelf 20 can function as a port for exchanging the conveyed object 10 between the stacker crane 30 and the vehicle 40. Thereby, conveyance of the to-be-conveyed object 10 can be implemented more efficiently.
　本実施形態では、スタッカクレーン３０は、対向して配置された半導体製造装置５０，５２の間に配置されており、半導体製造装置５０，５２の間を移動可能とされている。これにより、１台のスタッカクレーン３０により複数のロードポート５４，５６にアクセスできるため、クリーンルーム（半導体製造工場）の省スペース化をより一層図ることができる。また、スタッカクレーン３０がロードポート５４，５６の双方にアクセスできるため、被搬送物１０の移載時間を短縮できる。 In the present embodiment, the stacker crane 30 is disposed between the semiconductor manufacturing apparatuses 50 and 52 disposed to face each other, and is movable between the semiconductor manufacturing apparatuses 50 and 52. As a result, since the plurality of load ports 54 and 56 can be accessed by one stacker crane 30, the space in the clean room (semiconductor manufacturing factory) can be further reduced. Moreover, since the stacker crane 30 can access both the load ports 54 and 56, the transfer time of the conveyed object 10 can be shortened.
　本発明は、上記実施形態に限定されるものではない。例えば、上記実施形態では、２台の半導体製造装置５０，５２が配置された構成を一例に説明したが、半導体製造装置の設置数などは、半導体製造工場の設計に応じて適宜設定されればよい。また、被搬送物１０を一時的に保管するインターベイストッカが設けられていてもよい。インターベイストッカには、スタッカクレーン３０及びビークル４０がアクセス可能とされる。 The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the configuration in which the two semiconductor manufacturing apparatuses 50 and 52 are arranged has been described as an example. However, the number of semiconductor manufacturing apparatuses to be installed may be appropriately set according to the design of the semiconductor manufacturing factory. Good. Further, an interbay stocker for temporarily storing the object to be transported 10 may be provided. The stacker crane 30 and the vehicle 40 are accessible to the interbay stocker.
　１００…搬送システム、１０…被搬送物、２０…収納棚、３０…スタッカクレーン、４０…ビークル（天井搬送車）、４４…グリッパ、５０，５２…半導体製造装置、５４，５６…ロードポート。 DESCRIPTION OF SYMBOLS 100 ... Conveyance system, 10 ... Conveyed object, 20 ... Storage shelf, 30 ... Stacker crane, 40 ... Vehicle (ceiling conveyance vehicle), 44 ... Gripper, 50, 52 ... Semiconductor manufacturing apparatus, 54, 56 ... Load port.

Claims (3)

  1. 　半導体製造装置のロードポートに被搬送物を搬入すると共に、前記ロードポートから前記被搬送物を搬出するスタッカクレーンと、
    　前記ロードポートの上方に設けられた軌道に沿って走行し、前記被搬送物を把持するグリッパを昇降させて前記被搬送物を搬送する天井搬送車と、
    　前記半導体製造装置の近傍に設けられ、前記被搬送物を収納すると共に前記スタッカクレーンによる前記被搬送物の出し入れが可能とされている収納棚と、を備え、
    　前記ロードポートにおいて、前記スタッカクレーン及び前記天井搬送車による前記被搬送物の搬入及び搬出が可能とされていることを特徴とする搬送システム。     A stacker crane that carries a conveyed object into a load port of a semiconductor manufacturing apparatus and unloads the conveyed object from the load port;
    A ceiling transport vehicle that travels along a track provided above the load port, lifts and lowers a gripper that grips the transported object, and transports the transported object;
    A storage shelf that is provided in the vicinity of the semiconductor manufacturing apparatus and stores the transported object and allows the transported object to be taken in and out by the stacker crane;
    In the load port, it is possible to carry in and carry out the object to be conveyed by the stacker crane and the overhead conveyance vehicle.
  2. 　前記収納棚の少なくとも一部は、前記天井搬送車の前記グリッパによる前記被搬送物の出し入れが可能に設けられていることを特徴とする請求項１記載の搬送システム。 2. The transport system according to claim 1, wherein at least a part of the storage shelf is provided so that the transported object can be taken in and out by the gripper of the overhead transport vehicle.
  3. 　前記半導体製造装置は、所定の間隔をあけて互いに対向して配置されており、
    　前記スタッカクレーンは、対向する前記半導体製造装置の間において当該対向方向と略直交する方向に移動可能とされており、各前記半導体製造装置の各前記ロードポートに前記被搬送物を搬入及び搬出することを特徴とする請求項１又は２記載の搬送システム。     The semiconductor manufacturing apparatus is arranged to face each other with a predetermined interval,
    The stacker crane is movable between opposing semiconductor manufacturing apparatuses in a direction substantially perpendicular to the facing direction, and carries the object to be transferred into and out of each load port of each of the semiconductor manufacturing apparatuses. The conveyance system according to claim 1 or 2, wherein
PCT/JP2013/055156 2012-04-05 2013-02-27 Conveyance system WO2013150841A1 (en)

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