JP2010061289A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment having improved cooling efficiency for electronic components housed in a casing without causing the increase of the power consumption or noise of a fan or the increase of the size of a cooling device. <P>SOLUTION: Electronic equipment is provided with: a casing 10 equipped with an exhaust port 23; a radiator 32 arranged adjacently to the exhaust port 23 in the casing 10; a heat transmission means 33 for connecting the first heating element 25a arranged in the casing 10 and the radiator 32; a fan 41 for cooling the radiator 32 by blowing air to the radiator 32; and an air duct 35 connected to a portion of a blower port 48 of the fan 41 for guiding a portion of air sent out from the fan 41 to a second heating element 25b arranged in the casing 10, and configured to cool a second heating element 25b by blowing a portion of air sent out from the fan 41 through the air duct 35 to the second heating element 25b. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic apparatus including a cooling device that cools a plurality of electronic components housed in a housing.

  As this type of electronic apparatus, for example, a notebook personal computer (hereinafter referred to as “notebook PC” for short) as shown in Patent Document 1 is known. This notebook PC is configured to include a housing having a keyboard on the top surface and a lid that covers the top surface of the housing. A plurality of electronic components that generate heat when energized, such as a CPU (Central Processing Unit) and a memory, and a cooling device for cooling these electronic components are housed inside the housing.

  The cooling device includes a heat dissipating fin disposed close to an exhaust port provided on the wall of the housing, a heat transfer plate connected to the CPU, a heat pipe connecting the heat transfer plate and the heat dissipating fin, It is comprised from the fan unit which ventilates toward a radiation fin. The fan unit includes a fan and a fan case that houses the fan. The fan case is provided with a blower opening, and the heat radiating fin is connected to the blower opening.

  When the fan of the cooling device configured as described above is driven, air is taken into the interior of the housing from the air inlet provided on the housing wall surface, and an air flow is generated in the interior space of the housing, The electronic component housed in the housing is cooled. The air that has circulated in the housing is sucked into the fan case, is sent out in the centrifugal direction from the rotation center of the fan, and is guided to the blower opening. The air sent out from the blower opening of the fan case passes through the radiation fins and cools the radiation fins by exchanging heat with the radiation fins. By cooling the radiation fins, the CPU connected to the radiation fins is also cooled. The air heated to high temperature by taking heat from the heat radiating fins is discharged to the outside through an exhaust port provided in the housing.

JP 2007-274001 A

  By the way, in recent years, with the increase in information processing speed and power consumption, not only the CPU but also the heat generation of electronic components such as graphic chips and power FETs have increased. Electronic components with a large amount of heat and electronic components with a small amount of heat generation are mixedly arranged. For this reason, there is a problem that electronic components having a large amount of heat cannot be sufficiently cooled only by air circulating in the housing. In addition, when a part with a large amount of heat generation is not sufficiently cooled, the temperature of the outer surface of the casing in the vicinity thereof increases, leading to a decrease in operational feeling.

  The above problem can be solved by connecting heat pipes to all the electronic components that generate a large amount of heat or increasing the number of fans. However, when heat pipes are connected to all electronic components that generate a large amount of heat, or when the number of fans is increased, there is a problem that the cooling device becomes large and complicated. In particular, in an electronic device such as a notebook PC that requires a thin casing, it is difficult to secure a space for installing a plurality of fans.

  The present invention has been made in view of the above circumstances, and provides an electronic device capable of improving the cooling efficiency of an electronic component housed in a housing without causing an increase in size and complexity of a cooling device. The purpose is to do.

  In order to achieve the above object, an electronic device according to the present invention includes a housing provided with an exhaust port, a radiator disposed in the housing in the vicinity of the exhaust port, and a first disposed in the housing. In an electronic apparatus comprising a heat transfer means for connecting the heat generating body and the heat radiating body, and a fan for cooling the heat radiating body by blowing air toward the heat radiating body, a part of the air blowing port of the fan A blower duct that is connected and guides a part of the air sent out from the fan to a second heating element arranged in the housing; and a part of the air sent out from the fan The second heat generating element is cooled by blowing air through the second heat generating element.

  Moreover, according to a preferable aspect of the present invention, it is desirable that the air duct is connected to a portion where the air blowing speed is relatively small in the air blowing port of the fan.

  Further, according to a preferred aspect of the present invention, the air blowing port of the fan is located in a plane parallel to the axis of the fan, and the end of the air blowing port on the downstream side in the rotation direction of the fan It is desirable to connect the air duct to

  Further, according to a preferred aspect of the present invention, the radiator is connected to a part of the blower opening of the fan, and the blower duct is farthest from a connection portion of the heat transfer means in the radiator, It is desirable that the fan is connected to the fan outlet adjacent to the radiator.

In addition, an electronic device according to the present invention includes a housing having an exhaust port, a heat radiator disposed in the housing in the vicinity of the exhaust port, a first heating element disposed in the housing, In an electronic device comprising a heat transfer means for connecting a heat radiator and a fan for cooling the heat radiator by blowing air toward the heat radiator, connected to a part of an air outlet of the heat radiator, A blower duct for guiding a part of the air that has passed through the heat dissipating member to the second heating element disposed in the housing;
A part of the air that has passed through the heat dissipating body is blown to the second heat generating body through the air blowing duct, thereby cooling the second heat generating body.

  According to a preferred aspect of the present invention, it is desirable that the air duct is connected to a portion where the temperature of the heat radiator is relatively low at the air outlet of the heat radiator.

  In the conventional electronic device, all of the air sent from the fan is used for cooling the heat radiating body, and is exhausted to the outside of the housing after heat exchange with the heat radiating body. On the other hand, in the electronic device of the present invention, a blower duct is connected to a part of the blower opening of the fan, and a part of the air sent from the fan is passed through the blower duct to a predetermined electronic component inside the casing. It is configured to lead to (heating element). By configuring as described above, the cooling device is sufficiently large and complicated, and the cooling of the electronic components scattered inside the housing is sufficiently performed without causing a situation such as an increase in power consumption and noise when the fan is driven. Can be performed.

(Embodiment 1)
Exemplary embodiments of an electronic apparatus according to the invention applied to a notebook personal computer will be described below in detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view showing a notebook personal computer 1 (hereinafter simply referred to as “notebook PC 1”) according to the present embodiment. The notebook PC 1 exemplified here includes a main body housing 10 and a lid body 11.

  The main body housing 10 is a box composed of an upper surface portion 12, a left side surface portion 13, a right side surface portion 14, a front surface portion 15, a rear surface portion 16, and a bottom surface portion (not shown). A keyboard 17 is provided on the upper surface 12 of the main body housing 10. Although not shown, the keyboard 17 is an input device configured by disposing a membrane switch sheet and a plurality of key tops 17a on the upper surface of a base member formed of a metal plate. A palm rest 18 is provided at a position located on the front side of the upper surface portion 12.

  The lid 11 is provided with a display device 21 composed of a liquid crystal display, an organic EL display, or the like on a surface facing the upper surface portion 12 of the main body housing 10, and a hinge at a rear edge of the main body housing 10. The lower end portion of the portion 22 is rotatably supported. When the lid 11 is opened with respect to the main body housing 10, the display device 21 is exposed toward the front side of the main body housing 10 and the upper surface 12 of the main body housing 10 is opened. On the other hand, if it is rotated via the hinge portion 22, it functions as a cover that simultaneously covers the upper surface portion 12 of the main body housing 10 and the display device 21.

  A plurality of exhaust ports 23 are formed on the rear end side of the left side surface portion 13 of the main body housing 10. The exhaust port 23 has a long hole shape through which air sent out from a fan 41 (see FIG. 2) of the cooling device 30 disposed inside the main body housing 10 is discharged to the outside of the main body housing 10. It is a hole. Although not shown, the right side surface portion 14 and the like of the main body housing 10 is provided with an intake port for taking outside air into the main body housing 10.

  FIG. 2 is an enlarged view of the vicinity of the exhaust port 23 in the main body housing 10 shown in FIG. FIG. 2 shows a state where the keyboard 17 is removed and the inside of the main body housing 10 is exposed. Inside the main body housing 10, a plurality of electronic components (heating elements) 25 that generate heat when operated by energization, such as a CPU 25a (see FIG. 5) and a memory (not shown), and these heat generating electrons A cooling device 30 for cooling the component 25 is accommodated. In FIG. 2, only the electronic component 25 b that directly receives air from a blower duct 35 described later is shown among the plurality of electronic components 25 that generate heat. The plurality of electronic components 25 are mounted on the printed board 24. On the other hand, the cooling device 30 is disposed outside the printed circuit board 24.

  FIG. 3 is a front perspective view of the cooling device 30, FIG. 4A is a plan view of the cooling device 30, and FIG. 4B is a side view of the cooling device 30. FIG. 5 is a diagram showing a configuration around the cooling device 30 inside the main body housing 10, and is a diagram for explaining a mechanism by which the cooling device 30 cools the plurality of electronic components 25. In FIGS. 4A to 5, in order to facilitate understanding of the description, the flow of the air sent out from the air blowing port 48 through the heat dissipating fins 32 described later is indicated by a broken-line arrow, and the air blowing port 48 (48 a The flow of the air sent out through the blower duct 35 is indicated by white arrows. FIG. 5 shows only three electronic components 25 a to 25 c among the plurality of electronic components 25.

  2 to 5, the cooling device 30 includes a heat receiving body 31 (see FIG. 5), a heat radiating fin (heat radiating body) 32, a heat pipe (heat transfer means) 33, a fan unit 34, and an air duct. 35 is provided.

  The heat receiving body 31 is a plate-like body to which the heat of the heating element 25 is transmitted, and is made of a metal material having a high thermal conductivity such as copper or an aluminum alloy. As shown in FIG. 5, the heat receiving body 31 is connected to a CPU 25 a that generates the largest amount of heat among the electronic components 25 disposed in the main body housing 10.

  The radiation fin 32 is a member that radiates heat of the electronic component (CPU 25a) transmitted through the heat receiving body 31 and the heat pipe 33. The radiating fin 32 has a configuration in which a plurality of fin pieces 36 made of a metal material having high thermal conductivity such as copper or aluminum alloy are arranged in parallel at a predetermined interval, and the overall shape thereof is a rectangular parallelepiped shape. is doing. As shown in FIG. 3, each fin piece 36 has a shape in which an upper edge portion and a lower edge portion are bent at a right angle, and the bent portions are connected to adjacent fin pieces 36, thereby adjacent to each other. A gap is formed between the matching fin pieces 36. That is, a large number of openings are formed in the radiating fin 32 along the direction in which the fin pieces 36 are juxtaposed. The air taken in from one opening cools the fin pieces 36 by removing heat from the fin pieces 36 when flowing through the gaps between the adjacent fin pieces 36. And the air which became high temperature by heat-exchanging with the fin piece 36 is discharged | emitted from the other opening. Hereinafter, in the radiating fin 32, a plurality of openings on the air introduction side are collectively referred to as an air inlet 37, and a plurality of openings on the air discharge side are collectively referred to as an air outlet 38.

  The radiating fins 32 having the above-described configuration are disposed in a state where the air inlet 37 is connected to a blower port 48 of the fan unit 34 described later, and the air outlet 38 is brought close to the exhaust port 23 of the main body housing 10. Here, as shown in FIGS. 3 and 4-1, the width dimension of the air inlet 37 and the air outlet 38 of the radiating fin 32 is formed to be shorter than the width dimension of the air blowing port 48 in the fan unit 34. Therefore, the air inlet 37 of the radiating fin 32 is attached to the air outlet 48 in such a manner that a part 48 a of the air outlet 48 of the fan unit 34 is left. Hereinafter, a part 48 a of the air blowing port 48, that is, a portion of the air blowing port 48 that is not connected to the heat radiation fin 32 is referred to as a “left end 48 a” of the air blowing port 48.

  The heat pipe 33 is a heat transfer member in which a working fluid is sealed in a pipe made of a metal such as copper or aluminum, and a wick is provided on an inner wall portion. One end of the heat pipe 33 is connected to the heat receiving body 31, while the other end is connected to the heat pipe connection portion 32 a at the lower end of the radiating fin 32. The heat pipe 33 illustrated in FIGS. 3 to 5 has a configuration that extends in the direction in which the fin pieces 36 are juxtaposed after the heat pipe 33 is connected to the heat pipe connection portion 32a of the radiating fin 32.

  The fan unit 34 includes a fan 41 and a fan case 42 that houses the fan 41. The fan 41 includes a rotating shaft 43 supported by the fan case 42 and a plurality of blades 44 that radiate from the rotating shaft 43. The fan 41 is a so-called centrifugal fan, and is configured to send air in the radial direction (centrifugal direction) of the rotating shaft 43 when driven.

  The fan case 42 is a box that houses the fan 41 described above. The fan case 42 includes an upper surface portion 45 and a bottom surface portion (not shown) perpendicular to the rotation shaft 43 of the fan 41, and a side surface portion 46 surrounding the rotation shaft 43. The upper surface 45 and the bottom surface (not shown) of the fan case 42 are provided with intake openings 47 for taking air into the interior from the outside of the fan case 42. Further, as shown in FIG. 3 and FIG. 4A, the side surface portion 46 of the fan case 42 has an air outlet that sends out an airflow generated in the fan case 42 when the fan 41 is driven to the outside of the fan case 42. 48 is formed.

  Although not clearly shown in the drawing, the air blowing port 48 is a rectangular opening formed in a plane parallel to the rotation shaft 43 of the fan 41, and as described above, the width dimension of the air blowing fin 32 is It is formed longer than the width dimension of the air inlet 37. As shown in FIGS. 3 to 4-2, the left end 48 a of the air outlet 48 is connected to the air duct 35 described later, while the portions other than the left end 48 a are the air inlets 37 of the radiating fins 32. It is connected to the.

  The air duct 35 is a tube that guides a part of the air sent out from the fan 41 to a predetermined electronic component 25 b (see FIGS. 2 and 5) in the main body housing 10. The air duct 35 has one end 51 connected to the left end 48a of the air outlet 48 of the fan unit 34 described above, and is bent after extending from the one end 51 above the height of the radiation fin 32, After extending along the upper surface of the radiating fin 32, it is bent in the direction of the electronic component 25b. The air sent out from the left end 48a of the blower port 48 is discharged from the air discharge port 52 after passing through the blower duct 35 and blown toward the electronic component 25b. As a result, the electronic component 25 b is cooled by the air blown from the duct 35. The air duct 35 having the above-described configuration is made of, for example, a resin material.

  The electronic component 25b to be blown by the air duct 35 does not generate as much heat as the CPU 25a, but the electronic component 25 disposed inside the main body housing 10 has a relatively large amount of heat generation. The thing which is not cooled enough only by the airflow which circulates in the inside 10 corresponds. Specifically, electronic parts such as graphic chips and power FETs are applicable.

  Here, in the present embodiment, the air duct 35 is connected to the left end portion 48 a of the air outlet 48, but to which part of the air outlet 48 the air duct 35 is connected is the following two ways of thinking. It is decided based on.

  First, it is preferable that the air duct 35 is connected to the air outlet 48 of the fan 41 in a manner that is farthest from the heat pipe connection portion 32 a in the radiating fin 32. In other words, in the configuration illustrated in FIG. 4A, the heat pipe 33 is connected to the right side of the radiating fin 32, so that the temperature of the fin piece 36 at the right end of the radiating fin 32 is the highest, The temperature of the piece 36 is lowered. For this reason, if the right side part of the radiation fin 32 is cooled, the left side part is also sufficiently cooled, and therefore the left end part of the radiation fin 32 is not necessarily cooled. That is, it is considered that the air sent out from the left end portion 48 a out of the air sent out from the air outlet 48 of the fan unit 34 does not contribute to cooling of the radiating fin 32 as much as the air sent out from other parts of the air outlet 48. Therefore, in the present embodiment, the air blowing duct 35 is connected to the position farthest from the heat pipe connecting portion 32a of the radiating fin 32, that is, the left end portion 48a of the air blowing port 48, and sent out from this portion. The air sent from the air outlet 48 of the fan unit 34 can be utilized most efficiently by using the air to be used for cooling the other electronic components 25b in the main body housing 10.

Second, it is desirable that the air duct 35 is connected to a portion of the air outlet 48 where the air blowing speed is relatively small. Specifically, it is desirable that the blower port 48 is connected to the end portion on the downstream side in the rotation direction of the fan 41. More specifically, as shown in FIG. 6, a line segment connecting a point at the air outlet 48 and the axis O of the rotation shaft 43 of the fan 41 is a line segment L ₁ that is most advanced in the rotation direction of the fan 41. as described above, select point X ₁ in the air blowing port 48, preferably connected to the air duct 35 in the vicinity of the point X _1. In the air outlet 48 shown in FIG. 6, it has been experimentally proved that the wind speed is lower in the vicinity of the point X ₁ in the line segment L ₁ that is the most advanced in the rotation direction of the fan 41 compared to other parts. This air delivered by each of the blades of the fan 41 is so pushed out in the tangential direction of rotation of the fan, in the vicinity of the X ₁ is considered to be because the component perpendicular to the air blowing port is relatively small.

  FIG. 7A is a perspective view showing a conventional cooling device 30 ′ in which the heat radiating fins 32 ′ are connected over the entire area of the air outlet 48 of the fan unit 34. FIG. 7-2 is a graph showing the exhaust velocity / temperature distribution at the air outlet 38 ′ when the fan 41 in FIG. 7-1 is rotated clockwise. In FIG. 7-2, points 1 to 5 mean the measurement points 1 to 5 of the air outlet 38 ′ shown in FIG. When the centrifugal fan 41 is driven to rotate, the airflow generated in the centrifugal direction from the rotation center of the fan 41 is guided to the air blowing port 48 along the inner wall surface of the fan case 42 to cool the radiating fins 32. As described above, a distribution occurs in the blowing speed of the blowing port 48. Along with this, distribution also occurs in the speed (exhaust speed) of the air passing through the radiation fins 32, and as shown in FIG. 7-2, the exhaust speed of the measurement point 1 located at the left end portion at the air outlet 38 ′ is increased. The smallest.

  Moreover, as shown in FIG. 7-2, although there is not much difference between the five measurement points with respect to the temperature of the air exhausted from the radiation fins 32 (exhaust temperature), the exhaust temperature at the measurement point 1 is It is relatively low compared to the measurement point. Here, the amount of heat taken from the radiation fins 32 is proportional to the product of the exhaust speed and the increase in the exhaust temperature. That is, it is considered that the air sent out from the measurement point 1 does not contribute to the cooling of the radiation fins 32 as much as the air sent out from other measurement points.

  From the above, in this embodiment, the air blowing speed is connected to the portion of the air blowing port 48 where the air blowing speed is relatively low, i.e., the left end 48a of the air blowing port 48, and the air sent from this portion is By using it for cooling the other electronic components 25b in the main body housing 10, the air sent out from the air outlet 48 of the fan unit 34 can be utilized most efficiently.

  Next, the operation of the cooling device 30 configured as described above will be described with reference to FIG. When a motor (not shown) is driven to rotate the fan 41, air is taken into the main body housing 10 from an air inlet (not shown) of the main body housing 10, thereby generating an air flow inside the main body housing 10. To do. This air flow spreads over the entire internal space of the main body housing 10 and cools various electronic components 25 mounted on the printed circuit board 24. The air whose temperature has been increased by cooling these electronic components 25 is sucked into the fan case 42 through the intake opening 47 of the fan unit 34. When air is introduced into the fan case 42, the air is sent out in the centrifugal direction from the rotation center of the fan 41, and is guided to the air outlet 48 along the inner wall surface of the fan case 42.

  The air sent out from the air outlet 48 branches into the heat radiating fins 32 and the air duct 35. The air introduced from the air inlet 37 of the radiating fin 32 into the radiating fin 32 circulates through the gaps of the fin pieces 36 as shown by broken line arrows in FIG. 5, and the CPU 25 a via the heat pipe 33 and the heat receiving body 31. The fin pieces 36 are cooled by exchanging heat with the fin pieces 36 to which the heat is transferred. By cooling the fin pieces 36, the CPU 25a connected to the heat pipe 33 and the heat receiving body 31 is also cooled. The air heated to a higher temperature by removing heat from the fin pieces 36 is discharged to the outside from the exhaust port 23 formed in the main body housing 10.

  On the other hand, the air introduced into the blower duct 35 from the left end 48a of the blower port 48 is discharged from the air discharge port 52 after flowing through the blower duct 35 as shown by the white arrow in FIG. It is blown toward. Thereby, the electronic component 25b is cooled. Moreover, since the air discharged from the air discharge port 52 diffuses around the electronic component 25b, it also contributes to cooling of the electronic component 25c adjacent to the electronic component 25b.

  Hereinafter, the electronic apparatus of the present invention will be specifically described with reference to examples.

  The cooling device 30 described above was installed inside the main body housing 10 of the notebook PC 1, the electronic components 25 mounted on the printed circuit board 24 in the main body housing 10 were cooled, and the temperature of each electronic component 25 was measured. Table 1 shows the electronic components on which the temperature was measured.

  Of the electronic components shown in Table 1, those having a particularly large calorific value are a CPU, a CPU FET that is a power supply FET, and a Vcore FET. Therefore, the heat receiving body 31 is connected to the CPU having the largest calorific value among these, and cooling by the heat radiation fins 32 is performed via the heat pipe 33. Then, the CPU FET having the next largest heat generation amount after the CPU is set as the blowing target of the blowing duct 35. The Vcore FET was disposed adjacent to the CPU FET that is the blowing target of the blowing duct 35. In addition, the battery cell is disposed in the rear portion of the main body casing 10, and the memory and the north bridge are disposed on the printed circuit board 24.

The temperature of each electronic component was measured under two conditions: an external ambient temperature of 35.0 ° C. and an external ambient temperature of 26.6 ° C. First, the air duct 35 was closed, and the temperature A of each electronic component when no air was blown by the air duct 35 was measured. Next, the air duct 35 was opened, and the temperature B of each electronic component when a part of the air sent out from the air outlet 48 was blown toward the CPU FET was measured. Table 1 shows temperature A, temperature B, and temperature difference B-A under the two conditions.

  As shown in Table 1, the temperature of the CPU FET that directly receives air from the air duct 35 in both cases where the external ambient temperature is 35.0 ° C. and the external ambient temperature is 26.6 ° C. It can be seen that the temperature is significantly lower than the temperature when the air is not blown. Moreover, it turns out that the temperature of Vcore FET which has not received the ventilation from the ventilation duct 35 also falls remarkably. Further, the temperature of the battery cell, the memory, the north bridge, and the palm rest 18 and bottom surface of the main body housing 10 are also lowered. From the above results, it was possible to confirm the cooling effect when the air was blown from the air duct 35 toward the predetermined electronic component.

  On the other hand, the temperature difference B-A of the CPU connected to the radiating fin 32 was zero. Conventionally, all the air sent out from the air outlet 48 of the fan unit 34 has been used for cooling the radiating fins 32, but in this embodiment, a part of the air sent out from the air outlet 48 is replaced with the air duct 35. To the CPU FET. For this reason, there is a possibility that the temperature of the CPU connected to the radiating fins 32 will increase because the amount of air blown to the radiating fins 32 is smaller than the conventional amount. It can be seen that the same cooling effect as before is maintained.

  As described above, in the conventional notebook PC, all the air sent out from the air outlet 48 of the fan unit 34 is used for cooling the heat radiating fins 32, and after exchanging heat with the heat radiating fins 32, It was discharged to the outside of the housing 10. On the other hand, in the notebook PC 1 of the present embodiment, the air duct 35 is connected to a part of the air outlet 48 of the fan unit 34, and a part of the air sent from the fan 41 is passed through the air duct 35. The structure is such that it leads to a predetermined electronic component 25 inside the main body housing 10. With the configuration described above, the heat generating components scattered in the main body casing 10 can be obtained without causing an increase in size and complexity of the cooling device 30 and an increase in power consumption and noise during driving of the fan. Cooling can be sufficiently performed.

  Further, in the notebook PC 1 of the present embodiment, the air duct 35 is connected to a portion of the air blowing port 48 of the fan 41 where the air blowing speed is relatively slow. As described above, of the air sent out from the air outlet 48, it is considered that the air does not contribute much to the cooling of the heat radiating fins 32, and the air is used for cooling the other electronic components 25b in the main body housing 10. The air sent out from the air outlet 48 of the fan unit 34 can be utilized efficiently.

  In the above embodiment, the shape of the air duct 35 is not limited to the shape illustrated in FIGS. 2 to 5, and the arrangement position of the electronic component 25 b is different from the position shown in FIG. 5. Of course, the shape and length of the air duct 35 are also different. Further, in the above embodiment, only one air duct 35 is provided and the air sent from the fan 41 is blown only to one electronic component. However, the air duct 35 is branched in the middle. By forming a plurality of air ducts 35, it is also possible to blow air to the plurality of electronic components 25 scattered in the main body housing 10.

(Embodiment 2)
In the first embodiment, the air duct 35 is connected to a part of the air outlet 48 of the fan unit 34, and a part of the air sent out from the fan 41 is guided to a predetermined electronic component 25b inside the main body housing 10. However, as described below, a part of the air that has passed through the heat radiation fins 32 may be guided to the electronic component 25b. Although illustration of the second embodiment is omitted, the same components as those of the first embodiment will be described using the same reference numerals.

  In the second embodiment, the width dimension of the air inlet 37 and the air outlet 38 of the radiating fin 32 is substantially the same as the width dimension of the air outlet 48 in the fan unit 34 as in the conventional cooling device (see FIG. 7-1). Formed identically. And the radiation fin 32 is connected to the ventilation port 48 in the aspect which covers the whole ventilation port 48. As shown in FIG. A blower duct 35 similar to that in the above embodiment is connected to a part of the air outlet 38 of the radiating fin 32. By configuring as described above, a part of the air that has passed through the radiation fins 32 is blown to the predetermined electronic component 25b in the main body housing 10 via the blower duct 35 and cooled.

  Here, the air duct 35 is preferably connected to a portion where the temperature of the fin piece 36 is relatively low at the air outlet 38 of the radiating fin 32. For example, in the case where the heat pipe 33 is connected to the right end of the radiating fin 32 as in the conventional cooling device shown in FIG. 7A, the temperature of the fin piece 36 at the right end of the radiating fin 32. Is the highest and the temperature of the fin piece 36 decreases as it goes to the left. Therefore, the air duct 35 is preferably connected to the left side at the air outlet 38 of the radiating fin 32.

  Conventionally, all the air that has passed through the radiating fins 32 has been exhausted to the outside of the main body housing 10, but the air duct 35 is connected to a relatively low temperature portion of the fin piece 36 as in the second embodiment. And the air which passed through the radiation fin 32 can be effectively utilized by using the air sent out from this site | part for cooling of the other electronic component 25 in the main body housing | casing 10. FIG.

  In the first and second embodiments described above, the example in which the electronic apparatus of the present invention is applied to a notebook personal computer has been described. However, the present invention is not limited to this, and is disposed in a housing. The present invention can also be applied to other electronic devices including a cooling device that cools the heating element.

It is a schematic perspective view of the notebook PC which is this Embodiment. It is the figure which expanded and showed the exhaust-gas-portion vicinity of notebook PC shown by FIG. It is a front perspective view of the cooling device accommodated in the main body housing | casing of the notebook PC shown by FIG. It is a top view of the cooling device shown by FIG. FIG. 4 is a side view of the cooling device shown in FIG. 3. It is a figure which shows the structure of the cooling device periphery in the main body housing | casing of notebook PC. It is a figure for demonstrating the ventilation speed in the ventilation port of a fan. It is a front perspective view of the conventional cooling device. It is a graph which shows the distribution of the exhaust speed and exhaust temperature in the air exit of the conventional cooling device shown by FIGS.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Notebook personal computer 10 Main body housing | casing 11 Cover body 12 Upper surface part 13 Left side surface part 14 Right side surface part 15 Front surface part 16 Back surface part 17 Keyboard 17a Key top 18 Palm rest area 21 Display apparatus 22 Hinge part 23 Exhaust port 24 Printed circuit board 25 Electronic Parts (heating element)
25a CPU (first heating element)
25b Electronic component (second heating element)
25c Electronic components (heating elements)
30 Cooling device 31 Heat receiving body 32 Heat radiation fin (heat radiation body)
32a Heat pipe connection 33 Heat pipe (heat transfer means)
34 Fan unit 35 Blower duct 36 Fin piece 37 Air inlet 38 Air outlet 41 Fan 42 Fan case 43 Rotating shaft 44 Blade 45 Upper surface portion 46 Side surface portion 47 Inlet opening 48 Air outlet 51 One end portion 52 Air discharge portion

Claims (6)

A housing with an exhaust port;
A heat dissipating member disposed in the housing in proximity to the exhaust port;
A heat transfer means for connecting the first heat generator and the heat dissipator disposed in the housing;
In an electronic device comprising a fan that cools the radiator by blowing air toward the radiator,
A blower duct connected to a part of the blower opening of the fan and guiding a part of the air sent out from the fan to a second heating element disposed in the housing;
An electronic apparatus characterized in that a part of the air sent out from the fan is blown to the second heating element through the blowing duct to cool the second heating element. The air duct is
The electronic device according to claim 1, wherein an air blowing speed of the fan is connected to a portion having a relatively low air blowing speed. The fan outlet is located in a plane parallel to the fan axis;
The electronic device according to claim 2, wherein the blower duct is connected to an end portion of the blower opening on the downstream side in the rotation direction of the fan. The radiator is connected to a part of the fan outlet;
2. The electron according to claim 1, wherein the blower duct is connected to a blower opening of the fan adjacent to the heat dissipating member in a manner that is farthest from a connection portion of the heat transfer unit in the heat dissipating member. machine. A housing with an exhaust port;
A heat dissipating member disposed in the housing in proximity to the exhaust port;
A heat transfer means for connecting the first heat generator and the heat dissipator disposed in the housing;
In an electronic device comprising a fan that cools the radiator by blowing air toward the radiator,
A blower duct connected to a part of the air outlet of the radiator and leading a part of the air that has passed through the radiator to a second heating element disposed in the housing;
An electronic apparatus characterized in that a part of the air that has passed through the heat dissipating body is blown to the second heat generating body through the air blowing duct to cool the second heat generating body. The air duct is
The electronic apparatus according to claim 5, wherein the air outlet of the heat radiating body is connected to a portion where the temperature of the heat radiating body is relatively low.

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