JP2010057038A - Camera mounting assembly apparatus and assembly method of camera mounting - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a camera mounting assembly apparatus which can carry out assembly operation of camera mounting easily and efficiently with optical precision required by a machine vision. <P>SOLUTION: The camera mounting assembly apparatus includes: an XY axial movable table 6 which fixedly-supports a sensor holder 10 by turning up an imaging surface so as to be exposed; a three-dimensional measurement instrument 1 for optically measuring the tilt adjustment of the imaging surface and the deviation in X, Y directions with respect to an optical axis; an X and Y2 axial direction tilt moving stage for combining a Y axial tilt stage 4 and an X axial tilt stage 5 where the table 6 is moved in the X, Y directions based on the value measured by the three-dimensional measurement instrument 1 and is positioned to the optical axis so as to perform tilt adjustment of the imaging surface; and a Z axial movement stage 7 for carrying out adhesion fixing of a CCD holder 10 to a mount base 20 by lowering the mount base 20 till the point to maintain a flange back between the imaging surfaces. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a camera mount assembling apparatus and a camera mount assembling method applied when manufacturing a camera mount including a sensor holder on which an area image sensor is mounted and a mount base having a lens mount.

  In machine vision systems, solid-state image sensor cameras using CCD (Charge Coupled Device) or CMOS image sensor (Charge Coupled Device Image Sensor) as an area image sensor serving as an image sensor are widely used as industrial electronic imaging cameras. It has been.

  A solid-state imaging device camera applied to this type of machine vision system is required to have an imaging output capable of highly accurate position detection with respect to, for example, detection position accuracy.

  For this reason, in the manufacturing process of attaching an area image sensor to a mount base having a camera lens mounting portion (flange) and a reference mounting surface parallel to the lens optical axis, fine position adjustment of the sensor imaging surface with respect to the mount base is required. Become.

  In particular, in this type of camera assembly, the management of the distance (flange back) between the camera lens mounting surface (flange surface) and the sensor imaging surface is very important. For example, in the case of a C mount lens, it is necessary to set the flange back (FB) to 17.526 mm.

  Normally, the flange back is often managed by measuring the distance between one point between the center of the flange and the center of the sensor imaging surface, and the parallelism between the flange surface and the sensor imaging surface depends on the tolerance of part machining dimensions. . In this case, if the processing accuracy is not high, the flange surface and the imaging surface are assembled in an inclined state. Strictly speaking, the flange back varies depending on the position on the surface (the tilt is generated). Conventional general-purpose camera manufacture often does not have an adjustment mechanism for the tilt, and even when the tilt adjustment mechanism is provided, the tilt adjustment is performed by other optical systems such as optical axis alignment adjustment. It was done in a separate process from the adjustment. Therefore, there has been a problem in the assembly accuracy of the entire optical system including the tilt.

Conventionally, as this type of tilt adjustment technology, the plate surface of the fixed plate to which the image pickup device is attached and the image pickup surface of the image pickup device to be attached to the fixed plate are parallel to each other by three-dimensional measurement. There was a technology to attach.
JP 2007-259166 A

  However, in the above-described conventional technology, even if the parallelism between the plate surface of the fixed plate and the imaging surface can be maintained, there is a possibility that an optical shift may occur in a subsequent assembly process such as the fixed plate mounting step. There was a problem.

  The present invention relates to a camera mount assembling apparatus capable of efficiently and easily performing assembly work of a camera mount constituted by a sensor holder on which an area image sensor is mounted and a mount base having a lens mount with optical accuracy required in machine vision. An object is to provide a method for assembling a camera mount.

  The present invention is a camera mount assembly device for mounting on a mount base a sensor holder to which an image sensor having a rectangular imaging surface is attached, and a table for fixing and supporting the sensor holder with the imaging surface exposed upward. And a three-dimensional measuring device for optically measuring deviations in the X and Y directions with respect to the tilt of the imaging surface and the optical axis position, and the table in the X and Y directions based on the measurement values of the three-dimensional measuring device. It is mounted on an X and Y direction 2-axis orthogonal movement stage that moves and adjusts the optical axis alignment of the imaging surface, and is mounted on the X and Y direction 2-axis orthogonal movement stage, based on the measurement values of the three-dimensional measuring device. Tilting the table in the X and Y directions to adjust the tilt of the imaging surface, and an X and Y biaxial tilt movement stage, holding the mount base above the table, The und base is lowered position to keep the flange back between said imaging surface, characterized in that the sensor holder has and a Z-axis moving stage for bonded and fixed to the mounting base.

In addition, the present invention provides an XY axis moving stage that combines an X, Y 2 axis direction tilt moving stage and an X, Y direction 2 axis orthogonal moving stage, an XY axis moving table that is controlled to move by the XY axis moving stage, Using a three-dimensional measuring instrument equipped with a Z-axis moving stage and a Z-axis moving table controlled up and down by the Z-axis moving stage, a sensor holder mounted with an image sensor having a rectangular imaging surface is mounted on a mount base. A first step of exposing the sensor holder with the imaging surface facing upward and fixing and supporting the sensor holder on the XY-axis moving table; and an orientation of the imaging surface by the three-dimensional measuring instrument. Based on the measurement value of the CMM in the second step and the X, Y2 axis direction tilt moving stage Accordingly, the third step of adjusting the tilt of the imaging surface by tilting the XY axis moving table in the X and Y directions, and the three-dimensional measuring device in the X and Y directions with respect to the optical axis position of the imaging surface. A fourth step of measuring the deviation;
Based on the measurement value of the three-dimensional measuring instrument in the fourth step, the X- and Y-direction biaxial orthogonal movement stage moves the XY-axis movement table in the X and Y directions, and the optical axis of the imaging surface A fifth step of adjusting the alignment; and after the mount base is fixedly supported on the Z-axis movement table above the XY-axis movement table, the Z-axis movement table is attached to the mount base by the Z-axis movement stage. And a sixth step of lowering the sensor holder to the mount base by lowering the flange back to a position maintaining the flange back with the imaging surface.

  According to the present invention, the assembly work of the camera mount can be performed efficiently and easily with the optical accuracy required in machine vision.

  Embodiments of the present invention will be described below with reference to the drawings. In the present invention, a mount base on which an area image sensor is mounted is referred to as a camera mount. In this embodiment, a CCD is targeted for mounting as an area image sensor, but a CMOS image sensor may be targeted for mounting.

  As shown in FIGS. 1 and 2, a camera mount assembling apparatus according to an embodiment of the present invention has a sensor holder (hereinafter referred to as a CCD holder) to which an image sensor (hereinafter referred to as CCD) having a rectangular imaging surface is attached. An XY axis moving table (hereinafter simply referred to as a table) 6 that is fixedly supported with the imaging surface 10 exposed upward, and an optical measurement of the tilt of the imaging surface and the deviation in the X and Y directions with respect to the optical axis position. And the X-axis moving stage 2 that adjusts the optical axis alignment of the imaging surface by moving the table 6 in the X and Y directions based on the measurement values of the three-dimensional measuring instrument 1. The X- and Y-direction two-axis orthogonal movement stage combined with the Y-axis movement stage 3 and the X- and Y-direction two-axis orthogonal movement stage are mounted on the table 6 based on the measurement values of the three-dimensional measuring instrument 1. The The X- and Y2-axis direction tilt moving stages, which combine the X-axis tilt stage 5 and the Y-axis tilt stage 4 to adjust the tilt of the imaging surface by tilting in the Y direction, and the mount base 20 above the table 6 And a Z-axis moving stage 7 for lowering the mount base 20 to a position to keep the flange back between the mount surface 20 and the imaging surface, and fixing the CCD holder 10 to the mount base 20. .

  X-axis moving stage 2 and Y-axis moving stage 3 constituting the X- and Y-direction two-axis orthogonal moving stage, X-axis tilting stage 5 and Y-axis tilting stage 4 constituting the X and Y2-axis direction tilt moving stage, The Z-axis moving stage 7 is provided integrally with the three-dimensional measuring device 1 on the base 1 a of the three-dimensional measuring device 1, and the table 6 is provided on the X-axis tilting stage 5. This table 6 is a three-dimensional measurement process for measuring the tilt of the imaging surface and the X- and Y-direction deviations relative to the optical axis position, a process of adjusting the tilt and optical axis alignment based on the three-dimensional measurement, and mounting the CCD holder 10 A work support table common to each operation in the process of bonding and fixing to the base 20 is configured.

  The X-axis moving stage 2 and Y-axis moving stage 3, the Y-axis tilting stage 4 and the X-axis tilting stage 5 are each configured with a fixed part on the lower side and a movable part on the upper side. A linear motion guide 2a is interposed between the fixed portion and the movable portion of the X-axis moving stage 2, and the movable portion can be moved by a predetermined amount in the X-axis direction indicated by an arrow a. Similarly, a linear motion guide 3a is interposed between the fixed portion and the movable portion of the Y-axis moving stage 3, and the movable portion can be moved by a predetermined amount in the Y-axis direction indicated by an arrow b. The linear motion guides 2a and 3a are configured, for example, by interposing a roller-type retainer between the fixed part raceway and the movable part raceway. A swing mechanism (not shown) is provided between the fixed portion and the movable portion of the X-axis tilt stage 5 to allow the movable portion to move a predetermined amount in the tilt direction indicated by the arrow c. A swinging mechanism (not shown) is provided between the fixed part and the movable part to enable the movable part to move by a predetermined amount in the tilt direction indicated by the arrow d. The Z-axis moving stage 7 has a table 7a that moves up and down in the Z-axis direction orthogonal to the X-axis and Y-axis directions, and a bracket 8 that fixes and supports the mount base 20 is fixed to the lifting table 7a. ing. The X-axis moving stage 2 and the Y-axis moving stage 3, the Y-axis tilting stage 4 and the X-axis tilting stage 5 are each provided with a drive control mechanism using a motor and an encoder, and fine adjustment is possible.

  As shown in FIG. 3, the CCD holder 10 includes a hollow dust-proof cylindrical portion 13, an adhesive surface 15 to which an adhesive (see symbol Pa shown in FIG. 5) is applied, and a CCD mounting substrate 11. Configured. The CCD holder 10 has, on one surface on the lens mounting side (flange side), a mounting portion for a dust-proof cylindrical portion 13 that is loosely inserted into a base body opening portion (see reference numeral 21a shown in FIG. 9) of the mount base 20 described later. A bonding surface 15 for forming an adhesive application surface, a substrate mounting surface on the other surface, and a CCD mounting substrate 11 on which the CCD 12 is mounted on the substrate mounting surface by a fastening screw (not shown). The dust-proof cylindrical portion 13 is screwed and fixed to the attachment portion of the dust-proof cylindrical portion 13 with a fastening screw 14. The dust-proof cylindrical portion 13 also serves as a fitting ring that is loosely inserted into the mount base 20. The CCD mounting substrate 11 is screwed and fixed at a predetermined mounting position where the imaging surface 12a of the CCD 12 is exposed at the center of the dust-proof cylindrical portion 13. The dust-proof cylindrical portion 13 is attached so that the center of gravity coincides with the imaging surface 12a on an axis parallel to the optical axis. Furthermore, a pressing surface 10p is formed on one side surface of the CCD holder 10 so that a fixing support pressing screw (see reference numeral 9a shown in FIGS. 4 and 5), which will be described later, comes into contact therewith. By pressing the pressing surface 10p with the pressing screw, the CCD holder 10 is fixedly supported on the holder support pallet (see reference numeral 9 shown in FIGS. 4 and 5), and the pressing by the pressing screw is released. The CCD holder 10 can be released from the holder support pallet.

  The CCD holder 10 is fixedly supported on the table 6 by a holder support pallet 9 shown in FIGS. As shown in FIGS. 4 and 5, the holder support pallet 9 engages with both side portions of the CCD holder 10 and sets the CCD holder 10 at a predetermined fixed position of the holder support pallet 9. B1, B2, a through hole 9b of a fixing screw for fixing the holder support pallet 9 to the table 6 so that the inclination θ around the vertical axis parallel to the optical axis O1 (see FIG. 7) can be adjusted, and an engagement holding portion A fixing presser screw 9 a that is screwed into B <b> 1 and has a tip abutting on the pressering surface 10 p of the CCD holder 10 set on the holder support pallet 9 is provided. Note that a fixing screw that passes through the through hole 9b and is screwed to the table 6 is not shown.

  A mount base 20 is fixedly supported on the bracket 8 fixed to the lifting table 7 a of the Z-axis moving stage 7. As shown in FIG. 9, the mount base 20 includes a base portion 21 having a L-shaped cross section and a flange portion 22. The base 21 has an opening 21a having a hole diameter larger than the outer diameter of the dust-proof cylindrical portion 13 into which the dust-proof cylindrical portion 13 provided in the CCD holder 10 is loosely inserted, and a reference mounting surface 21f parallel to the optical axis. Have The flange portion 22 constitutes a lens mount and forms a flange surface at the tip. The mount base 20 is fixedly supported on the bracket 8 with the flange surface facing upward above the CCD holder 10 fixedly supported on the holder support pallet 9 on the table 6, and the lifting table 7 a of the Z-axis moving stage 7. Is lowered to a position that keeps the flange back between the flange surface and the imaging surface 12a (see reference numeral ed shown in FIG. 10), whereby the CCD holder 10 is placed in the opening 21a provided in the base portion 21 of the mount base 20. The dust-proof cylindrical portion 13 attached to the mounting base 20 is loosely inserted, and the CCD holder 10 is bonded and fixed to the mount base 20 in the bonding step described later.

  A camera mount assembling process by the camera mount assembling apparatus having the above-described configuration will be described with reference to FIGS. The following measurement and adjustment processes according to the measurement contents can be automatically assembled by program control, but here it is applied to the manufacturing process of a limited number of industrial cameras applied to machine vision. Therefore, the measurement and adjustment work accompanying the measurement shall be performed manually.

  Step 1: The CCD holder 10 on which the CCD 12 is mounted is fixedly supported on the table 6 with the imaging surface 12a exposed upward. Here, a CCD holder 10 is attached to a holder support pallet 9 fixed to the table 6, and the CCD holder 10 is fixedly supported to the table 6.

  Step 2: The tilt of the imaging surface 12a of the CCD 12 mounted on the CCD holder 10 is measured by the optical measuring unit 1b of the three-dimensional measuring device 1. As shown in FIG. 6, this tilt measurement is performed by measuring two points near both ends on the X-axis direction center line of the imaging surface 12a and two points near both ends on the Y-axis direction center line of the imaging surface, respectively. Are measured, and the inclinations in the X-axis and Y-axis directions with respect to the reference plane parallel to the flange surface are measured three-dimensionally. In FIG. 6, the symbol O3 indicates the position of the center of gravity of the imaging surface 12a.

  Step 3: Based on the measurement value of the three-dimensional measuring instrument 1 in the above step 2, the table 6 is moved to the X axis by the X, Y2 axis direction tilt moving stage in which the X axis tilt stage 5 and the Y axis tilt stage 4 are combined. The tilt of the imaging surface 12a is adjusted by inclining in the Y-axis direction. That is, the inclination of the table 6 is adjusted so that the imaging surface 12a is parallel to the flange surface.

  Step 4: By the optical measuring unit 1b of the three-dimensional measuring instrument 1, the inclination θ around the vertical axis parallel to the optical axis with respect to the reference surface O2 parallel to the reference mounting surface 21f shown in FIG. 7 and shown in FIG. A deviation in the X and Y directions with respect to the optical axis position O1 of the imaging surface 12a is measured.

  Step 5: Based on the measurement value of the three-dimensional measuring instrument 1 in the above step 4, the inclination θ of the imaging surface 12a and the deviation in the X and Y directions with respect to the optical axis position O1 are adjusted. Here, when the inclination θ has a deviation of a specified angle or more, the fixed state of the holder support pallet 9 to the table 6 is once released, and the holder support pallet 9 is placed on the table 6 again. Fix it. Here, the adjustment means by re-fixing the pallet is applied on the premise that the occurrence frequency of the deviation more than the specified angle of the inclination θ is low, but in the actual machine, between the X-axis inclination stage 5 and the table 6 is applied. Is provided with a θ angle adjustment stage, and the θ angle is adjusted by the θ angle adjustment stage. Further, the X- and Y-direction two-axis orthogonal movement stages that combine the X-axis movement stage 2 and the Y-axis movement stage 3 adjust the X and Y directions with respect to the optical axis position O1.

  Step 6: On the table 6, the adjusted CCD holder 10 fixedly supported on the table 6 with the holder support pallet 9 interposed therebetween is bonded and fixed to the mount base 20. In this step, as shown in FIGS. 5B and 9, an adhesive (for example, an ultraviolet curable adhesive) Pa is applied to the adhesive surface 15 of the CCD holder 10 fixedly supported on the holder support pallet 9 on the table 6. Apply. Further, the mount base 20 is attached to the bracket 8 fixed to the lifting table 7 a at the ascending position of the Z-axis moving stage 7, and the mount base 20 is fixedly supported to the bracket 8. Thereafter, as shown in FIG. 10, the mount base 20 is lowered in the direction of the arrow ed to the position where the flange back (FB) is maintained between the imaging surface 12 a and the adhesive Pa is cured (af), and the CCD holder 10. Is fixed to the mount base 20 by adhesion.

  As a result, as shown in FIG. 11, the imaging surface 12a has the same center of gravity as the flange surface, maintains the flange back (FB), and does not tilt (tilt) with respect to the flange surface. It can be mounted on the mount base 20.

  In the camera mount assembly process described above, the tilt of the imaging surface 12a is measured in the process 2, the tilt adjustment is performed in the process 3, the deviation in the X and Y directions with respect to the optical axis position is measured in the process 4, and the process 5 is performed. Although the optical axis alignment adjustment is performed, the tilt measurement and tilt adjustment steps may be interchanged with the measurement of deviation relative to the optical axis position and the optical axis alignment adjustment steps.

  Note that the present invention is not limited to the above-described embodiments as they are, and the configuration and components of the apparatus can be changed without departing from the gist of the present invention in the implementation stage.

The side view which shows the structure of the camera mount assembly apparatus which concerns on embodiment of this invention. The front view which shows the structure of the camera mount assembly apparatus which concerns on the said embodiment. The top view (a) and side view (b) which show the structure of the CCD holder 10 handled with the camera mount assembly apparatus based on the said embodiment. The perspective view which shows the structure of the holder support pallet 9 and CCD holder 10 which are handled with the camera mount assembly apparatus which concerns on the said embodiment. The top view (a) and side view (b) which show the structure of the holder support pallet 9 and CCD holder 10 which are handled with the camera mount assembly apparatus which concerns on the said embodiment. The figure for demonstrating the assembly process of the camera mount assembly apparatus which concerns on the said embodiment. The figure for demonstrating the assembly process of the camera mount assembly apparatus which concerns on the said embodiment. The figure for demonstrating the assembly process of the camera mount assembly apparatus which concerns on the said embodiment. . The figure for demonstrating the assembly process of the camera mount assembly apparatus which concerns on the said embodiment. The figure for demonstrating the assembly process of the camera mount assembly apparatus which concerns on the said embodiment. The figure for demonstrating the assembly process of the camera mount assembly apparatus which concerns on the said embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Three-dimensional measuring device, 2 ... X-axis movement stage, 3 ... Y-axis movement stage, 4 ... Y-axis inclination stage, 5 ... X-axis inclination stage, 6 ... Table (XY-axis movement table), 7 ... Z-axis movement Stage, 8 ... Bracket, 9 ... Holder support pallet, 10 ... CCD holder, 11 ... CCD mounting substrate, 12 ... CCD, 12a ... Imaging surface, 13 ... Dust-proof cylindrical part (fit ring), 15 ... Adhesive surface, 20 ... mount base, 21 ... base part, 21a ... opening, 21f ... reference mounting surface, 22 ... flange part.

Claims (6)

A camera mount assembly device for mounting a sensor holder to which an image sensor having a rectangular imaging surface is mounted on a mount base,
A table for fixing and supporting the sensor holder with the imaging surface exposed upward;
A three-dimensional measuring instrument for optically measuring the deviation in the X and Y directions with respect to the tilt of the imaging surface and the optical axis position;
An X, Y direction biaxial orthogonal moving stage for adjusting the optical axis alignment of the imaging surface by moving the table in the X, Y directions based on the measurement values of the three-dimensional measuring instrument;
X, Y2 axis direction mounted on the X, Y direction two-axis orthogonal moving stage and tilting the table in the X, Y direction based on the measurement value of the three-dimensional measuring device to adjust the tilt of the imaging surface An inclined moving stage;
A Z-axis moving stage that holds the mount base above the table, lowers the mount base to a position that maintains a flange back with the imaging surface, and adheres and fixes the sensor holder to the mount base; A camera mount assembling apparatus comprising:   The X, Y2 axis direction tilt movement stage, the X, Y direction 2 axis orthogonal movement stage, and the Z axis movement stage are integrally provided in the three-dimensional measuring instrument, and the table is tilted in the X, Y2 direction. The camera mount assembling apparatus according to claim 1, wherein the camera mount assembling apparatus is provided on a moving stage.   The camera mount assembly apparatus according to claim 1, wherein the sensor holder is fixedly supported on a holder support pallet fixed to the table so that an inclination θ around a vertical axis parallel to the optical axis can be adjusted.   The three-dimensional measuring instrument measures the tilt of the imaging surface using two points near both ends on the center line in the X-axis direction of the imaging surface and two points near both ends on the center line in the Y-axis direction of the imaging surface. The camera mount assembling apparatus according to claim 1, wherein: XY axis moving stage combining X, Y 2 axis direction tilt moving stage and X, Y direction 2 axis orthogonal moving stage, XY axis moving table controlled by this XY axis moving stage, Z axis moving stage, and this Method of assembling a camera mount for mounting a sensor holder having an image sensor having a rectangular imaging surface on a mount base using a three-dimensional measuring instrument having a Z-axis moving table that is controlled to move up and down by a Z-axis moving stage Because
A first step of exposing the sensor holder with the imaging surface facing upward and fixing and supporting the sensor holder on the XY axis moving table;
A second step of measuring the tilt of the imaging surface by the three-dimensional measuring device;
Based on the measurement value of the CMM in the second step, the tilt of the imaging surface is adjusted by tilting the XY-axis moving table in the X and Y directions by the X and Y 2-axis tilt moving stage. A third step to perform,
A fourth step of measuring deviations in the X and Y directions with respect to the optical axis position of the imaging surface by the three-dimensional measuring device;
Based on the measurement value of the three-dimensional measuring instrument in the fourth step, the X- and Y-direction biaxial orthogonal movement stage moves the XY-axis movement table in the X and Y directions, and the optical axis of the imaging surface A fifth step of adjusting the alignment;
After the mount base is fixedly supported on the Z-axis movement table above the XY-axis movement table, the Z-axis movement stage causes the Z-axis movement table to place a flange back between the mount base and the imaging surface. A camera mount assembling method, comprising: a sixth step of lowering the sensor holder to a position to be held and bonding and fixing the sensor holder to the mount base. XY axis moving stage combining X, Y 2 axis direction tilt moving stage and X, Y direction 2 axis orthogonal moving stage, XY axis moving table controlled by this XY axis moving stage, Z axis moving stage, and this Method of assembling a camera mount for mounting a sensor holder having an image sensor having a rectangular imaging surface on a mount base using a three-dimensional measuring instrument having a Z-axis moving table that is controlled to move up and down by a Z-axis moving stage Because
A first step of exposing the sensor holder with the imaging surface facing upward and fixing and supporting the sensor holder on the XY axis moving table;
A second step of measuring a deviation in the X and Y directions with respect to the optical axis position of the imaging surface by the three-dimensional measuring device;
Based on the measurement value of the three-dimensional measuring device in the second step, the X and Y direction biaxial orthogonal movement stage moves the XY axis movement table in the X and Y directions to thereby optical axis of the imaging surface. A third step of adjusting the alignment;
A fourth step of measuring the tilt of the imaging surface by the three-dimensional measuring device;
The tilt of the imaging surface is adjusted by tilting the XY axis moving table in the X and Y directions by the X and Y 2 axis direction tilt moving stage based on the measurement value of the CMM in the fourth step. And a fifth step to
After the mount base is fixedly supported on the Z-axis movement table above the XY-axis movement table, the Z-axis movement table causes the Z-axis movement table to have a flange back between the mount base and the imaging surface. A camera mount assembling method, comprising: a sixth step of lowering the sensor holder to a position to be held and bonding and fixing the sensor holder to the mount base.

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