JP2010056549A - Method of cutting led, and product thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of cutting an LED having a preferable light emission efficiency and a 3D optical characteristic by effectively improving a reflection angle and reducing thermal depletion in a chip, and to provide a product manufactured by the same. <P>SOLUTION: This method of cutting the LED includes the following four processes: (A) LED chips are fixed to a chip fixing seat; (B) a fluid object is actuated and run between a cutter and the chips to be used as a medium of a sound wave reflecting layer; (C) a power source of a power is turned on, and piston motion vertically moving the position for expanding the volume of an electrostrictive extensible material or voltage ceramic material is carried out; and (D) fine particles are continuously driven between the LED chips by a cutter of the fine particles of diamond, cBN or SiC having electrocasting at one end, and the LED chips are cut by generating large impact in a relatively small contact area. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an LED or LED epitaxy substrate cutting tool, and more particularly to an LED cutting method and its product.

  In any case where the LED chip is cut, either wire cutting, a cutter with a circular blade inside, or a cutter with a circular blade on the outside is used for cutting.

  Any of the above-described cutting methods is performed using frictional force or linear motion.

  When cutting with frictional force, a situation occurs in which diamond grains provided on a wire or a cutter easily fall off due to the cutting force.

  Therefore, the above-mentioned method has low processing efficiency and the loss of consumables becomes very large.

  In addition, the cutting surfaces after cutting by friction are all symmetrical, flat and smooth.

  However, since it has only a 2D optical structure, it affects the light output efficiency and quality of LED products.

  Many of the materials for LEDs use materials having a high refractive index of III-VI group. Its refractive index is about 3 to 3.5.

According to Snell's law, (3-1 / 3 + 1) ² = 25% reflection is lost. Most of the light returns to its original position, is reflected and vibrates in the LED chip, forming heat and consuming heat.

  That is, when the temperature increases once, about 1.5% of light is lost, and thus the light emission efficiency is the first cause that is not preferable.

  Next, since the critical angle of a material having a high refractive index of III-VI group is small, when the incident angle of the light beam is larger than the critical angle, the light beam cannot enter the second interface, All are reflected by the first interface.

This is so-called “total light reflection” (ie, entering from n ₁ to n ₂ , satisfying n ₁ > n ₂ , and the total reflection angle is n ₁ Sin ic = n ₂ Sin 90 °).

  Since the cross section is smooth and symmetric, and the critical angle is small, loss due to total reflection of light easily occurs, and the light output efficiency is reduced.

  Therefore, the light emission efficiency of the LED is a second cause that is not preferable.

  Conventional chips have reached a perfect level of light emission efficiency, whereas LEDs in the prior art only have about 20% in light output efficiency.

  Any of the conventional techniques is merely an improvement of the post-process part of the particles in terms of the light output rate. For example, there are flip chip LEDs, sticking the chips to the LEDs, or LED organic package lenses.

  Conventionally, Hewlett Packard (HP) has the most preferable light output efficiency of non-parallel polishing performed on the LED particles, and has been able to increase to 45%.

  However, usually, when a non-parallel cross section is formed by a conventional polishing process, the processing speed is slow, and there are differences depending on the selection of materials.

When AL ₂ O ₃ is used as an LED epitaxy substrate, the Mohs hardness reaches 9 degrees, close to that of diamond, difficult to polish, and the surface after processing becomes flat and smooth. Reflection defects are formed very easily.

  Luminance technology has been enhanced for processing LED substrates. The patent publication number 508841 of the Republic of China is owned by Nichia Corporation, a Japanese trading company, and has a protective layer such as a rod-like, lattice-like, or island-like hole periodically on the LED epictomy board Can be formed most preferably.

However, since the protective layer is etched with a different material of SiO ₂ on the plating, a resistance force is generated by the different material, and defects in the etching process are increased.

It is an object of the present invention to provide an LED cutting method and a product thereof that effectively improve the reflection angle, reduce the heat consumption inside the chip, and have preferable light output efficiency and 3D optical characteristics.

Therefore, the inventor of the present invention has conducted extensive research in view of the drawbacks found in the prior art, and as a result, in A, the LED chip is fixed to the chip fixing seat,
In B, the liquid material is actuated to flow between the cutter and the chip to form a medium for the acoustic reflection layer,
In C, the motive power is turned on and driven, and the electrostrictive elastic material or the voltage ceramic material expands and compresses the volume, and moves the piston up and down to move the position,
In D, diamond, cBN, or SiC fine particle cutter with electroforming at one end, and fine particles are continuously driven between LED chips to produce a large impact and cutting with a relatively small contact area. The present invention has been completed on the basis of this knowledge, focusing on the problem that can be solved by the LED cutting method.

The present invention will be specifically described below.
The LED cutting method according to claim 1, in A, the LED chip is fixed to the chip fixing seat in A,
In B, the liquid material is actuated to flow between the cutter and the chip to form a medium for the acoustic reflection layer,
In C, the motive power is turned on and driven, and the electrostrictive elastic material or the voltage ceramic material expands and compresses the volume, and moves the piston up and down to move the position,
In D, diamond, cBN, or SiC fine particle cutter with electroforming at one end, and fine particles are continuously driven between LED chips to produce a large impact and cutting with a relatively small contact area. Consists of.

The LED cutting method according to claim 2 is the magnetostrictive expansion / contraction material in C of claim 1 or the voltage ceramic material is moved up and down to convert electrical energy into mechanical energy and perform volume expansion and compression. This is the power source for LED cutting.

The LED cutting method according to claim 3 is a cutter in which the cutter in D in claim 1 is made of titanium, steel, aluminum, copper, or other alloy, and diamond is used for electroforming the front edge portion of one end face. Or cBN, or super hard particles such as SiC are attached, and an LED or LED epitaxy substrate is cut.

According to a fourth aspect of the present invention, there is provided a method for cutting an LED, wherein the cutter having a parallel cross-section according to the first or third aspect forms a continuous uneven columnar body on a plane, and the uneven columnar shape is triangular, arcuate, It has a rectangular shape with a rectangular cross section.

The cutting tool according to claim 5 is the cutting cutter according to claim 1 or 3, wherein the cutting tip is sharp, the sharp angle is greater than 0 degree and the critical angle of the LED chip material, and the cross sections of the two sides are non-parallel. A simple cutter with an LED chip cutter with a non-parallel cut section.

According to a sixth aspect of the present invention, there is provided a method for cutting an LED, wherein the blade of the cutter for cutting an LED according to the first or third aspect has an arcuate shape that is recessed inward or an arc-shaped sharp tip that protrudes outward. .

The LED cutting method according to claim 7 is a method in which a cutter for cutting an LED having a sharp tip in a non-parallel cross section in claim 1 or 3 forms a column shape that is continuously uneven on a sharp plane. In this case, the uneven columnar shape is any one of a triangular shape, an arc shape, a rectangular shape, and a conical shape.

The LED cutting method according to claim 8 is a method in which the cross section of the LED particle product formed by cutting in claim 1 is a rough surface equal to the particle size of the fine particles attached on the cutter, A product of LED particles shaped to complement each other is formed.

The LED cutting method according to claim 9 is such that the cross section of the LED particle product formed by cutting according to claim 1 or 8 is roughly the same as the particle size of the particle on the surface of the cutter blade. Now, the two cross sections face each other in parallel.

The LED cutting method according to claim 10 is such that the cross section of the LED particle product formed by cutting according to claim 1 or 8 is as rough as the shape of the particle diameter of the surface of the cutter blade. These are LED particles each having an uneven column shape in which two cutting surfaces are parallel and continuous with each other.

The LED cutting method according to claim 11 is similar to the particle size of the particle on the surface of the blade of the sharp tip cutter in which the cross section of the LED particle product formed by cutting in claim 1 or 8 is sharp. It is rough and the corresponding two cross sections are non-parallel.

The LED cutting method according to claim 12 is such that the cross section of the product of the cut LED particles according to claim 1 or 8 is as coarse as the particle size of the particles on the surface of the cutter blade, and the cross section is non-parallel. The cross section is recessed inward or formed in an arc shape protruding outward.

The LED cutting method according to claim 13 is such that the cross-section of the product of the LED particle cut in claim 1 or 8 is as rough as the particle size of the particle on the surface of the cutter blade, and the cross-section is non-parallel. Columnar LED particle product is formed.

The LED cutting device according to claim 14 is similar to the particle size of the particle on the surface of the blade of the sharp tip cutter in which the cross section of the LED particle product formed by cutting in claim 1 or 8 is sharp. The two corresponding cross-sections are rough and are formed in a non-parallel, continuous conical shape, and a non-parallel cross-section.

In the LED half-cutting method according to claim 15, in A, the LED chip is fixed to the chip fixing seat, in B, the liquid is actuated to flow between the cutter and the chip to be a sound wave reflection preventing medium, and in C When power is turned on, magnetostriction expansion or contraction, or voltage ceramic material forms a piston motion that moves up and down by volume expansion and compression, and in Da, diamond, cBN, or SiC fine particles are electroformed on one end face With the cutting tool, cut the fine particles on the LED chip and stop the work when the thickness is closest to the surface of the chip fixing seat. In E, the half-cutting LED is split by heat to produce the LED particle product. Then, the LED is half-cut in the above five steps.

The LED half-cutting method according to claim 16 is a cross-section in which the cross-section by the cutting method in claim 15 is as coarse as the particle size of the fine particles attached to the surface of the cutter blade and complements the shape of the cutter surface. This is a product of irregularly sectioned LED particles formed by heat splitting.

In the LED half-cutting method according to claim 17, in A, the LED chip is fixed to the chip fixing seat, in B, the liquid is actuated to flow between the cutter and the chip to form a sound wave reflection preventing medium, and in C When power is turned on, magnetostrictive expansion or contraction, or voltage ceramic material forms a piston motion that moves up and down by volume expansion and compression, Da is a convex or concave periodic, continuous stepped cutter, stepped plane Electroforming is deposited on top of the diamond, or diamond or SiC on one end surface, or a very stiff, continuous staircase. Using any level of fine particle cutting tool, the fine particles are applied to the LED chip. When the thickness is closest to the surface of the chip fixing seat, the operation is stopped. In E, the half-cutting LED is split by heat to produce LED particles. Forming a half-cut of the LED in the previous five steps.

An LED epitaxy substrate half-cutting method according to claim 18 uses a convex or concave continuous stepped cutter in D of claim 17, and the step difference in height of each step of the cutter is a wavelength relative to the LED. Is an odd multiple of 1 / 4λ optical thickness, and diamond, SiC, or cBN ultra-hard particles are provided in electroforming on a stepped plane, and the LED epitaxy substrate is half-cut.

In the LED half-cutting method according to claim 19, the cutter according to claims 17 and 18 has a continuous uneven step shape, and is any one of a hexagonal step shape, a circular step shape, or a rectangular step shape. One half-cuts the LED epitaxy substrate.

In the half-cutting method of the LED epitaxy substrate according to claim 20, the half-cutting processing step according to claim 17 is performed using AL ₂ O ₃ , SiC, GaN, MgAl ₂ O ₄ , ZnS, ZnO, GaAs, SiO ₂ , Si Any one of the LED epitaxy substrates, the plane of the substrate is formed so as to complement the shape of the end face of the cutter, and one or more stepped substrates having a convex or concave shape that are periodically continuous. This is an LED epitaxy substrate whose height difference is an odd multiple of 1 / 4λ optical thickness.

The half-cutting method of the LED epitaxy substrate according to claim 21 is the half-cutting epitaxy substrate according to claim 17 or 20, wherein the half-cutting epitaxy substrate is an uneven periodic stepped circular staircase, or a period on the unevenness. This is an LED epitaxy substrate made of a group III-VI of LED raw materials, such as gallium nitride, indigallium nitride, and aluminum gallium nitride.

  The LED cutting method according to the present invention has an effect of protecting the chip fixing seat in the processing step and having a preferable irradiation efficiency.

The present invention is an LED cutting method and product that effectively improves the reflection angle, reduces heat consumption inside the chip, and has favorable light output efficiency and 3D optical characteristics. In A, the LED chip is fixed to the chip. Fixed to the seat,
In B, the liquid material is actuated to flow between the cutter and the chip to form a medium for the acoustic reflection layer,
In C, the motive power is turned on and driven, and the electrostrictive elastic material or the voltage ceramic material expands and compresses the volume, and moves the piston up and down to move the position,
In D, diamond, cBN, or SiC fine particle cutter with electroforming at one end, and fine particles are continuously driven between LED chips to produce a large impact and cutting with a relatively small contact area. Consists of.
Specific examples will be given in order to detail the LED cutting method and the features of the product, which will be described below with reference to the drawings.

  The LED cutting method of the present invention forms an action force that moves the piston up and down when the electric power is driven to magnetostriction expansion or contraction, or the voltage ceramic material expands or compresses (that is, converts electrical energy into mechanical energy). Then, the LED chip is cut, or the LED epitaxy substrate is cut.

  An appropriate shaped cutter is used as a processing cutter for fine particle modeling of diamond, cBN, or SiC with electroforming at one end.

Sonic reflection prevention uses a liquid medium, and a sonic reflection preventing layer is formed between the cutter and the tip.

The chip fixing seat is a facility such as an LED chip or a fixing seat for an LED epitaxy substrate, and completes an LED cutting method and its product according to the steps shown in FIG.

The power source 14 is an alloy of magnetostrictive stretchable material Cr (20) Al (3) Fe driven by electric power.

Pure water 13 is used as the sound wave preventing medium.

The cutter unit is cutters 21, 22, 23, and 24 disclosed in FIG.

The LED chip 11 to be processed is provided on a chip fixing seat, and the process is performed according to FIG. 1 below.

The embodiment is used in the present invention, but is not limited to the present invention.

In A, the LED chip 11 is fixed on the chip fixing seat 12 for preparation.

  In B, the pure water 13 of the sound wave prevention medium is activated and flows downward from above, and flows onto the chip fixing seat 12 via the cutter 15, and the sound wave prevention medium between the cutter and the chip is also used for cooling and dust removal. can do.

In C, an impact force of a piston motion that moves the position up and down by operating the power source 14 of the alloy of the magnetostrictive stretchable material Cr (20) Al (3) Fe is formed.

In D, ultrafine particles are continuously applied to the LED chip on the surface of the cutter, and the light emitting diode chip 15 is cut. When the cutting is completed, the power source 14 and the power source of the pure water 13 of the sound wave prevention medium are closed.

That is, the LED chip that has been cut is taken out, and a grade is selected using QC to form particles.

The LED cutting method is configured through the four processes A, B, C, and D.

One of the characteristics of the product after cutting by the above-mentioned method is that the particle cross section is rough. The LED particle product having a cross-sectional shape that complements the shape of the cutter surface is the second feature.

For example, the cutter 21 forms LED particles 41 having a rough cross section and parallel. The cutter 22 forms non-parallel LED particles 42 with a rough cross section. The cutter 23 forms non-parallel LED particles 44 with a rough cross section. The cutter 24 forms non-parallel LED particles 43 (see FIG. 6) having a rough cross section.

This invention is a non-parallel LED chip with the most preferred cross section, which can greatly overcome the total reflection and overcome the reflected light being reflected back to the original position. Form a product of LED particles with a rough and preferred cross-section.

As disclosed in FIG. 1, the power source 14 is a PZT (lead zirconate titanate) voltage material driven by electric power.

Sonication prevention medium uses water added with alcohol (to prevent freezing).

Cutters 28, 29, and 30 shown in FIG. 4 are used.

The workpiece is an LED chip 11 and is provided on a chip fixing seat.

In the working process, a product of LED particles is manufactured by the cutting method of the first embodiment described above.

In A, the LED chip 11 is prepared by being fixed on the chip fixing seat 12.

In B, when the pure water 13 of the sound wave preventing medium is operated, it flows downward from above and flows onto the chip fixing seat 12 via the cutter 15, so that the sound wave preventing medium / coolant, dust, between the cutter and the chip It can be used as a removal material.

In C, when the power source 14 of the PZT voltage material is driven by electric power, an impact force of a piston motion that moves once up and down is generated.

In D, ultrafine particles on the surface of the cutter are continuously driven into the LED chip to cut the LED chip 15. When the cutting is completed, the power source 14 and the power source of the pure water 13 of the sound wave preventing medium are closed. The cut LED particles are taken out and classified into grades through QC sorting, and the particles become products.

The LED cutting method of the present invention is performed through the above-described four steps A, B, C, and D. The first feature is that the cross section of the particles of the product after cutting is rough.

The second feature is LED particles having a cross-sectional shape that complements the irregular shape of the cutter surface.

The cutter 28 produces a non-parallel rectangular columnar LED particle 49 with a rough cross-section, the cutter 29 produces a non-parallel triangular cone-shaped LED particle 48 with a rough cross-section, and the cutter 30 A non-parallel arc-shaped columnar LED particle 50 having a rough cross section is manufactured (see FIG. 8).

Similar to the steps of the embodiment disclosed in FIG. 1, the working process produces LED particle related products in the same steps as the cutting method of the above example.

As the cutter, cutters 25, 26 and 27 disclosed in FIG. 3 are used.

A, B, C, and D are performed to cut the LED.

The first feature is that the cutting surfaces of the particles of the product after cutting are parallel and rough, and the second feature is an LED particle-related product having cross-sections in which the irregularities on the surface of the cutter complement each other.

The cross section formed by the cutter 25 is a rough and parallel triangular columnar LED particle 46, the cross section formed by the cutter 26 is rough, and the parallel arc-shaped columnar LED particle 45 and the cross section formed by the cutter 27 is It is a coarse, flat rectangular columnar LED particle 47 (see FIG. 7).

As disclosed in FIG. 1, a work process is performed. The power source 14 is a voltage material of LiNbO ₃ driven by electric power.

The sound wave prevention medium uses a medium in which alcohol (anti-icing) is added to water, the cutters are cutters 21, 22, and 29 disclosed in FIG. 3, and the LED chip 11 that is a workpiece is provided on the chip fixing seat. .

The work process is the same as that for manufacturing LED particle-related products by cutting as described above, and the three steps A, B, and C are performed. The half cutting operation 15a is immediately stopped when the thickness becomes close to that of the surface.

The LED chip cut by E is taken out, heated at a high temperature gradient, and the chip is split 17a by thermal vibration, and a particle product is manufactured.

The implementation steps are
In A, the LED chip 11 is fixedly provided on the chip fixing seat 12.

In B, the alcohol-purified water 13 of the sonic wave-preventing medium is actuated to flow downward from above, and the alcohol-purified water 13 also flows on the cutter 15 and the chip fixing seat 12 so Can be used as coolant and dust removal material.

In C, the power source 14 of the LiNbO ₃ voltage material is driven by electric power, and the impact force of the piston motion moving up and down is generated.

In Da, the ultrafine particles on the surface of the cutter are continuously applied to the LED chip to cut the LED chip 15. Carry out so as not to damage the surface of the chip fixing seat, and stop processing as soon as the closest thickness is reached. After cutting, the power source 14 and the power source of the sound wave prevention medium 13 are closed.

At E, the half-cutting LED chip 11 is taken out and heated in a high temperature gradient furnace, and the chip is split 17a by thermal vibration to become a particle product, and the grade is selected by QC to obtain a product.

The above five steps A, B, C, Da, and E are performed.

One of the features of the LED half-cutting method of the present invention is that the cross-section of the chip of the product after cutting is rough. The LED chip having a cross-sectional shape that complements the shape of the cutter surface is the second feature, and burrs remain. The LED chip is the third feature.

The cross section formed by the cutter 21 is rough and parallel LED particles 51, the cross section formed by the cutter 22 is rough and non-parallel LED particles 52, and the cross section formed by the cutter 29 is rough and conical non-parallel LED particles. 53 (see FIG. 9).

The most preferred cross-section is a rough, non-parallel LED particle, which can improve the problem of total reflection and improve the reflected light being reflected back to the interior of the particle.

The next preferred cross-section is the coarse columnar parallel LED particles.

As shown in FIG. 1, the power source 14 of the facility drives the PZT voltage material with electric power, the sonic prevention medium uses pure water, and the cutters are the cutters 31, 32, 33, disclosed in FIG. 34, diamond of ultra-hard particles is attached to electroforming, and the work piece AL ₂ O ₃ is used as an LED epitaxy substrate.

The working process is the same as the method of manufacturing LED particles by cutting as described above, and the AL ₂ O ₃ epitaxy substrate material 11 is fixedly provided on the epitaxy substrate fixing seat 12.

The half-cutting processing operation is performed according to the above-described method. When the horizontal plane of the substrate has a relative wavelength of 1 / 4λ and the optical thickness reaches an odd multiple in the last stage, the processing ends.

The cut AL ₂ O ₃ epitaxy substrate is taken out, chemically polished with a fluorine compound or fluoric acid, and then washed to form an LED epitaxy substrate.

In step A, AL ₂ O ₃ of the LED epitaxy substrate 11 is fixed on the epitaxy substrate fixing seat 12 in A.

In B, the pure water 13 of the sound wave prevention medium is operated to flow downward from above and flow to the cutters 31, 32, 33, and 34 so as to drip on the AL ₂ O ₃ epitaxy substrate and the epitaxy substrate fixing seat 12. To do.

At C, power is applied to drive the PZT voltage material to serve as the power source 14 to generate the impact force of the piston motion that moves up and down.

In Da, when the LED epitaxy substrate AL ₂ O ₃ is cut, the cutting process is performed when the optical thickness becomes an odd multiple of 1 / 4λ at the nearest stage so as not to damage the surface of the epitaxy substrate AL ₂ O _3. To stop.

In F, the LED epitaxy substrate is taken out, chemically polished 17b with a fluorine compound or fluoric acid, and then washed to form an LED epitaxy substrate.

The LED epitaxy substrate is half-cut through five processes of A, B, C, Da, and F.

On the surface of the epitaxy substrate after cutting, an LED epitaxy substrate having a continuous periodic stepped shape that is smaller than the surface area of the main body and protrudes one or more steps outwardly or is recessed inwardly is formed.

As disclosed in FIG. 9, the feature is that the shape of the surface formed by the cutter 31 is an LED epitaxy substrate of form 52 that complements each other, and the surface formed by the cutter 33 is an LED epitaxy substrate of form 51 that complements each other, The surface formed by the cutter 34 becomes an LED epitaxy substrate of the form 53 that complements each other (see FIG. 10).

The half-cutting method of the LED epitaxy substrate of the present invention is a continuous periodic method in which the surface of the LED epitaxy substrate protrudes outside of one or more polygons smaller than the plane area of the basic body or is recessed inward. Features a stepwise LED epitaxy substrate.

The staircase is one of a hexagon, a circle, a rectangle, and a polygon.

As shown in FIG. 9, a plurality of small periodic continuous protrusions are formed on the surface of the LED epitaxy substrate, and a stepped shape is formed inwardly, with edges having different thicknesses in use. Therefore, a time difference between the reflection of light and the light transmission is formed.

The lead of the light, or the situation after the fall, helps the light overlap and increases the overall brightness.

The most preferred form is two or more steps and the next is one or more steps.

The above is a preferred embodiment of the present invention and does not limit the scope of the present invention. Therefore, any modifications or changes that can be made by those skilled in the art, which are made within the spirit of the present invention and have an equivalent effect on the present invention, shall belong to the scope of the claims of the present invention. To do.

It is the block diagram which showed the cutting method of LED of this invention. It is the perspective view which showed the cutting tool of the parallel and non-parallel in the cutting method of LED of this invention, and its product. It is the perspective view which showed the column-shaped parallel cutting tool in the cutting method of LED of this invention, and its product. It is the perspective view which showed the column-shaped non-parallel cutting tool in the cutting method of LED of this invention, and its product. It is the perspective view which showed the cutting method of the LED of this invention, and the uneven | corrugated stepped cutting tool in the product. It is the perspective view which showed the product of the particle | grains whose cutting surface of LED in the LED cutting method of this invention and its product is coarse. It is the perspective view which showed the product of the column-shaped coarse particle | grains in which the LED cutting method of this invention and the cutting surface of LED in the product were continuous. It is the perspective view which showed the product of the rough particle | grains with which the non-parallel cutting surface of LED in the LED cutting method of this invention and its product continued. It is the perspective view which showed the particle | grains of LED formed with the cutting method of LED of this invention, and the half cutting method in the product. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a stepped LED epiquity substrate having continuous periodic irregularities formed by the LED cutting method of the present invention and its product.

11 LED chip 12 Chip fixing seat 13 Alcohol-purified water 14 Power source 15 Cutter 15a Half cutting operation 16 LED product 16a LED product 17a Split 17b Polish 18 LED epiquity substrate 21, 22, 23, 24, 29 Cutter 25, 26 27, Cutter 28, 29, 30 Cutter 31, 32, 33, 34 Cutter 41, 42, 43, 44 LED particles 45, 46, 47 LED particles 48, 49, 50 LED particles 51, 52, 53 LED particles 54 Hexagonal stepped epiquity substrate 55 continuously recessed inwardly Hexagonal stepped epiquity substrate 56 continuously protruded outwardly Circular stepped epiquity substrate 57 continuously recessed inwardly A circular staircase-like epiquity substrate protruding continuously outward

Claims (21)

In A, the LED chip is fixed to the chip fixing seat,
In B, the liquid material is actuated to flow between the cutter and the chip to form a medium for the acoustic reflection layer,
In C, the motive power is turned on and driven, and the electrostrictive elastic material or the voltage ceramic material expands and compresses the volume, and moves the piston up and down to move the position,
In D, diamond, cBN, or SiC fine particle cutter with electroforming at one end, and fine particles are continuously driven between LED chips to produce a large impact and cutting with a relatively small contact area. An LED cutting method comprising the steps of: The magnetostrictive expansion / contraction material or voltage ceramic material at C converts electrical energy into mechanical energy, performs piston movement that moves up and down to expand and compress the volume, and becomes a power source for LED cutting The LED cutting method according to claim 1, wherein: The cutter in D is a cutter made of titanium, steel, aluminum, copper, or other alloy, and diamond, cBN, or super hard particles such as SiC are attached to the electroforming of the front edge of one end face. The LED cutting method according to claim 1, wherein the LED or the LED epitaxy substrate is cut. The cutter having a parallel cross section forms an uneven columnar body that is continuous on a plane, and the uneven columnar shape has a triangular shape, an arc shape, or a rectangular shape, and the cross section is a parallel columnar shape. The LED cutting method according to claim 1 or 3. The cutting cutter is an LED chip cutter with a sharp tip, a sharp angle greater than 0 degree and a critical angle of the LED chip material, with two non-parallel cross sections on both sides, and a non-parallel cut cross section. The cutting instrument according to claim 1, wherein the cutting instrument is provided. The LED cutting method according to claim 1 or 3, wherein a blade of a cutter for cutting the LED has an arcuate shape that is dented inward or an arc shape that protrudes outward, and has a sharp tip. . A cutter for cutting an LED having a sharp tip with a non-parallel cross-section forms a continuously uneven columnar shape on a sharp plane, and the uneven columnar shape is triangular, arc-shaped, rectangular, or conical. The LED cutting method according to claim 1, wherein the LED is a tool for cutting a columnar LED having a non-parallel cross section. The section of the LED particle product formed by cutting adheres to the cutter and forms a product of LED particles having a shape that is equal to the particle size of the fine particles and complements the cutter surface. The LED cutting method according to claim 1. The cross section of the LED particle product formed by the cutting has a roughness similar to the shape of the particle diameter of the particle on the surface of the cutter blade, and the two cross sections face each other in parallel. 9. The LED cutting method according to 1 or 8. The section of the LED particle product formed by the cutting is rough like the shape of the particle diameter of the surface of the cutter blade, and the two corresponding cutting surfaces are provided with an uneven column shape which is continuous in parallel with each other. The LED cutting method according to claim 1, wherein the LED cutting method is an LED particle. The cross-section of the LED particle product formed by the cutting is as rough as the particle size of the particle on the surface of the blade of the sharp tip cutter, and the two corresponding cross-sections are non-parallel. Item 9. The LED cutting method according to Item 1 or 8. The section of the product of the cut LED particles is as rough as the particle diameter of the cutter blade surface, and the cross section is a non-parallel cross section that is recessed inside or formed in an arc shape protruding outward. The LED cutting method according to claim 1, wherein the LED cutting method is performed. 2. The product of the cut LED particle product is formed in a columnar LED particle product having a non-parallel cross section in which the cross section of the product of the LED particle is as rough as the particle size of the particle on the surface of the cutter blade. Or the LED cutting method according to 8. The cross-section of the LED particle product formed by the cutting is as rough as the particle size of the particle on the surface of the cutter blade with a sharp tip, and the corresponding two cross-sections are non-parallel and continuously conical. The LED cutting device according to claim 1, wherein the LED cutting device is formed in a conical shape having a non-parallel cross section. In A, the LED chip is fixed to the chip fixing seat, in B, the liquid is actuated to flow between the cutter and the chip to make a sound wave reflection preventing medium, and in C, the power source is turned on and magnetostriction expansion or contraction or voltage ceramic material is applied. Piston movement that moves up and down by volume expansion and compression is formed, and in Da, a diamond, cBN, or SiC fine particle cutting tool is used for electroforming on one end surface, and the fine particle is applied to the LED chip for cutting. When the thickness is closest to the surface of the chip fixing seat, the operation is stopped, and in E, the half-cutting LED is split by heat to form an LED particle product, and the LED is half-cut in the above five steps. An LED half-cutting method comprising: The cross section by the cutting method is rough like the particle size of the fine particles attached to the surface of the cutter blade, and is a cross section that complements the shape of the surface of the cutter. The LED half-cutting method according to claim 15, wherein the LED half-cutting method is a product. In A, the LED chip is fixed to the chip fixing seat, in B, the liquid is actuated to flow between the cutter and the chip to make a sound wave reflection preventing medium, and in C, the power source is turned on and magnetostriction expansion or contraction or voltage ceramic material is applied. Piston movement that moves up and down by volume expansion and compression is formed, Da is a convex or concave periodic, continuous stepped cutter, and electroforming adheres to the stepped plane, diamond, or one end surface Diamond or SiC, or a very hard continuous staircase, with the fine particle cutting tool, hitting the fine particle on the LED chip and cutting it to the thickness closest to the chip fixing seat surface At E, the work is stopped, and in E, the half-cutting LED is split by heat to form an LED particle product, and the LED is half-cut in the above five steps. LED half cutting method, characterized by. Convex or concave continuous stepped cutters are used in D, and the height difference of each step of the cutters is an odd multiple of the optical thickness of 1 / 4λ of the wavelength with respect to the LED. 18. The method of half-cutting an LED epitaxy substrate according to claim 17, wherein ultra-hard particles of diamond, SiC, or cBN are provided in the electroforming on the flat surface, and the LED epitaxy substrate is half-cut. 18. The cutter has a continuous uneven staircase shape, and half-cuts an LED epitaxy substrate with any one of a hexagonal staircase shape, a circular staircase shape, or a rectangular staircase shape. Or the LED half-cutting method according to 18. The half-cutting process is an LED epitaxy substrate of any one of AL ₂ O ₃ , SiC, GaN, MgAl ₂ O ₄ , ZnS, ZnO, GaAs, SiO ₂ , Si, and the plane of the substrate is the end face of the cutter. LED epitaxy, which is formed so as to complement each other and is a convex or concave periodic continuous one or more stepped substrates, and the height difference for each step is an odd multiple of 1 / 4λ optical thickness The method of half-cutting an LED epitaxy substrate according to claim 17, wherein the substrate is a substrate. The epitaxy substrate to be half-cut is a circular staircase having a periodic continuous staircase shape having irregularities, or a rectangular staircase having a periodic continuous staircase shape having irregularities, and includes gallium nitride, indium gallium nitride, 21. The LED epitaxy substrate half-cutting method according to claim 17 or 20, wherein the LED epitaxy substrate is made of a group III-VI group of LED raw materials such as aluminum gallium nitride.

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