TWI423319B - - Google Patents
Info
- Publication number
- TWI423319B TWI423319B TW97132552A TW97132552A TWI423319B TW I423319 B TWI423319 B TW I423319B TW 97132552 A TW97132552 A TW 97132552A TW 97132552 A TW97132552 A TW 97132552A TW I423319 B TWI423319 B TW I423319B
- Authority
- TW
- Taiwan
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97132552A TW201009913A (en) | 2008-08-26 | 2008-08-26 | A LED fragmentation cutting method and product thereof |
| JP2009182264A JP2010056549A (en) | 2008-08-26 | 2009-08-05 | Method of cutting led, and product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97132552A TW201009913A (en) | 2008-08-26 | 2008-08-26 | A LED fragmentation cutting method and product thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201009913A TW201009913A (en) | 2010-03-01 |
| TWI423319B true TWI423319B (en) | 2014-01-11 |
Family
ID=42072078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97132552A TW201009913A (en) | 2008-08-26 | 2008-08-26 | A LED fragmentation cutting method and product thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2010056549A (en) |
| TW (1) | TW201009913A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300818A (en) * | 2018-10-26 | 2019-02-01 | 张婷 | A kind of processing unit (plant) of epitaxial substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11354841A (en) * | 1998-06-04 | 1999-12-24 | Rohm Co Ltd | Fabrication of semiconductor light emitting element |
| TW480742B (en) * | 2000-10-27 | 2002-03-21 | United Epitaxy Co Ltd | Method for cutting III-group nitride semiconductor light-emitting element |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3795298B2 (en) * | 2000-03-31 | 2006-07-12 | 豊田合成株式会社 | Method for manufacturing group III nitride compound semiconductor light emitting device |
| JP2002246337A (en) * | 2001-02-20 | 2002-08-30 | Nichia Chem Ind Ltd | Manufacturing method of nitride semiconductor chip |
| JP4008692B2 (en) * | 2001-11-02 | 2007-11-14 | Ｔｈｋ株式会社 | Scribing equipment |
| JP2007242856A (en) * | 2006-03-08 | 2007-09-20 | Rohm Co Ltd | Chip-type semiconductor light emitting device |
| JP5308618B2 (en) * | 2006-04-26 | 2013-10-09 | 日亜化学工業株式会社 | Semiconductor light emitting device |
-
2008
- 2008-08-26 TW TW97132552A patent/TW201009913A/en unknown
-
2009
- 2009-08-05 JP JP2009182264A patent/JP2010056549A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11354841A (en) * | 1998-06-04 | 1999-12-24 | Rohm Co Ltd | Fabrication of semiconductor light emitting element |
| TW480742B (en) * | 2000-10-27 | 2002-03-21 | United Epitaxy Co Ltd | Method for cutting III-group nitride semiconductor light-emitting element |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201009913A (en) | 2010-03-01 |
| JP2010056549A (en) | 2010-03-11 |