JP2010056043A - Load control device and illumination apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a discharge lamp lighting device in which an effect of noises caused by heat generated from a first element on a processing device is suppressed. <P>SOLUTION: A control circuit board 87 is connected to one main surface of a main circuit board 81 in crossing state to the main circuit board 81. A first element 82 which constitutes a part of the main circuit to operate a lamp is mounted on the one main surface of the main circuit board 81. A processing device 56 which constitutes a part of a control circuit to operate the lamp by controlling the main circuit is mounted on the main surface 87b on a far side from the first element 82 of the control circuit board 87. Thereby, an effect of noises caused by heat generated from the first element 82 on the processing device 56 can be suppressed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a load control device having a processing device that constitutes at least a part of a control circuit that controls a main circuit to drive a load, and a lighting fixture including the load control device.

  Conventionally, for example, a discharge lamp lighting device that is a load control device that lights a discharge lamp such as a fluorescent lamp as a load, a rectifying / smoothing filter unit connected to a power supply, and a DC voltage converted by the filter unit into a high-frequency voltage. An inverter circuit to be converted and a resonance circuit connected to the output of the inverter circuit are provided, and these circuits are connected to a discharge lamp to constitute a main circuit.

  Driving of the inverter circuit is controlled by a control circuit which is a control means which is a predetermined processing apparatus, and the control circuit is supplied with power by a control power source for driving.

As such a discharge lamp lighting device, an element having a large voltage value and a current value is arranged on one main surface side of the substrate, and an element having a small voltage value and current value is arranged on the other main surface side of the substrate. Thus, a configuration is known in which the influence of heat generated by an element having a large voltage value and current value on other components is suppressed (see, for example, Patent Document 1).
JP-A-3-219596 (page 3-6, Fig. 1)

  In recent years, there is a discharge lamp lighting device that uses a processing device such as a microcomputer in a control circuit in order to perform dimming control of the discharge lamp more finely. Such a processing device is particularly susceptible to noise and the like due to heat generated from the element, and like the above-described discharge lamp lighting device, the element is separated from one main surface of the substrate according to the voltage value and the current value. It is not easy to sufficiently protect the processing apparatus against heat only by the configuration divided into the main surface.

  This invention is made in view of such a point, and it aims at providing the load control apparatus which suppressed the influence on the processing apparatus of the noise resulting from the heat which generate | occur | produces from an element, and a lighting fixture provided with the same. To do.

  The load control device according to claim 1, a first substrate; a second substrate connected to one main surface of the first substrate in a crossing manner with respect to the first substrate; and one main surface of the first substrate And an element constituting at least a part of a main circuit for operating a load; a control circuit mounted on the main surface of the second substrate far from the element and controlling the main circuit to drive the load And at least a part of the processing device.

  As the first substrate, for example, a printed circuit board having one main surface as a component surface and the other main surface as a mounting surface is used.

  As the second substrate, for example, a build-up multilayer substrate is used. The phrase “connected to the first substrate in an intersecting manner” means that the first substrate is disposed on one main surface of the first substrate so as to be, for example, perpendicular to the first substrate.

  For example, a low-pressure mercury discharge lamp such as a fluorescent lamp is preferably used as the load, but is not limited thereto.

  The element includes, for example, a transformer, a switching element, a capacitor, and the like.

  The main surface of the second substrate far from the element refers to, for example, a main surface opposite to the main surface of the second substrate facing the element.

  The processing device is, for example, a microcomputer (DSP) for controlling the operation of the main circuit.

  The load control device according to a second aspect is the load control device according to the first aspect, wherein the first substrate is formed in a longitudinal shape and disposed along the longitudinal direction of the first substrate, and is more rigid than the first substrate. And a heat sink that dissipates heat generated from at least a part of the element, and the second substrate is disposed along the longitudinal direction of the first substrate.

  The heat radiating plate is made of a metal having good heat radiating properties such as aluminum.

  The fact that the heat radiating plate is arranged in the longitudinal direction of the first substrate is not only the configuration in which the heat radiating plate is formed in a longitudinal shape along the longitudinal direction of the first substrate, but also a plurality of heat radiating plates, for example, The structure etc. which are arranged in parallel by the longitudinal direction may be sufficient.

  The load control device according to claim 3 is the load control device according to claim 1 or 2, wherein the element includes a transformer, and the second substrate is arranged along a protruding direction of the leakage magnetic flux from the transformer. It is.

  The transformer is, for example, a ballast choke of an LC resonance circuit that forms part of the main circuit.

  A lighting fixture according to a fourth aspect includes the load control device according to any one of the first to third aspects; and a fixture main body to which a lamp as a load is attached.

  According to the load control device of the first aspect, the processing device that constitutes at least a part of the control circuit that drives the load by controlling the main circuit is connected to the second substrate in a crossing manner with respect to the first substrate. By mounting on the main surface on the side far from the element, it is possible to suppress the influence of noise caused by the heat generated from the element on the processing apparatus.

  According to the load control device of the second aspect, in addition to the effect of the load control device of the first aspect, the rigidity is higher than that of the first substrate in the longitudinal direction of the first substrate, and is generated from at least a part of the element. In addition to disposing a heat dissipation plate that dissipates heat, and disposing the second substrate along the longitudinal direction of the first substrate, the heat generated from the element is suppressed, and noise generated by the heat to the processing apparatus, etc. The influence can be further suppressed, and the first substrate can be reinforced in the longitudinal direction by the heat radiating plate, and the influence on the second substrate due to the bending of the first substrate in the longitudinal direction can be suppressed.

  According to the load control device of the third aspect, in addition to the effect of the load control device of the first or second aspect, the second substrate is disposed along the protruding direction of the leakage magnetic flux from the transformer, thereby causing leakage. The influence of noise caused by magnetic flux on the second substrate and the processing apparatus can be suppressed.

  According to the lighting fixture of Claim 4, each effect can be show | played by providing the load control apparatus as described in any one of Claim 1 thru | or 3.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  1 is a perspective view of the load control device, FIG. 2 is a plan view of the load control device, FIG. 3 is a circuit diagram of the load control device, and FIG. 4 is a side view of a part of a lighting fixture provided with the load control device. FIG. 5 is a bottom view in which a part of the lighting apparatus is shown in cross section.

  As shown in FIGS. 4 and 5, the luminaire 11 is a residential luminaire that is attached to a ceiling of a house by an attachment device (not shown) such as an attachment adapter, and is a discharge lamp (discharge lamp) that is a light source as a load. Electric lamp), that is, a circular annular lamp 12 is used. The lamp 12 includes an arc tube 15 formed in a circular ring shape, and a base (not shown) that connects both ends of the arc tube 15 at a part of the arc tube 15 and has a coldest part formed in the vicinity thereof. On the inner peripheral surface side of the base, connection pins (not shown) connected to electrodes (not shown) provided at both ends of the arc tube 15 are projected.

  The luminaire 11 includes a luminaire main body 21, a lamp holder body 23, and a shade 24. The lamp 12 is attached to the lamp holder body 23, and a discharge control device is provided between the luminaire main body 21 and the lamp holder body 23. An electric lamp lighting device 25 (hereinafter referred to as a lighting device 25) is housed and attached.

  The instrument body 21 is formed in a substantially disk shape having an opening 31 through which a mounting device is inserted at the center, and the upper surface is an elastic member such as a sponge interposed between the instrument body 21 and the instrument mounting surface. 32 is installed.

  The lamp holder body 23 includes a holding portion 33 that is curved in an arc shape at the tip, and holds the arc tube 15 of the lamp 12 in the holding portion 33. In FIG. 4, two different lamps 12 can be held in the holding unit 33, but for convenience, the following description will be given assuming that one lamp 12 is provided.

  The seed 24 has translucency and is attached to the instrument body 21 so as to surround the entire lower surface of the instrument body 21.

  In the lighting device 25, as shown in FIG. 3, an inverter circuit 52 is connected to a filter unit 50 and a power source unit 51 for rectifying and smoothing a commercial AC power source e. A resonance circuit 53 is connected to an output terminal of the inverter circuit 52. The filaments FLa and FLb of the lamp 12 are connected via In addition, a preheating circuit 55 for the filaments FLa and FLb of the lamp 12 is connected to a connection portion between the inverter circuit 52 and the resonance circuit 53. Furthermore, the power supply unit 51, the inverter circuit 52, and the preheating circuit 55 are connected to a processing device 56 that is a circuit control means (MPU) as a control device, and this processing device 56 is supplied with power from the control power supply unit 57. In addition, the temperature sensor 58 is electrically connected. The filter unit 50, the power source unit 51, the inverter circuit 52, the resonance circuit 53, the preheating circuit 55, the control power source unit 57, and the temperature sensor 58 constitute a main circuit MC that operates the lamp 12.

  The filter unit 50 includes a common mode transformer Tr connected to the commercial AC power source e and a capacitor C1 that cuts off a high frequency component connected to the common mode transformer Tr. The capacitor C1 side is connected to the power source unit 51. Yes.

  The power supply unit 51 is a step-up chopper power supply having a power factor improvement (PFC) function of a so-called critical mode (discontinuous mode) that matches the phase of the input current I0 and the input voltage V0. A rectifier element REC is connected, and a boost chopper circuit 59 is connected to the output side of the full-wave rectifier element REC. The boost chopper circuit 59 is connected to the output side of the full-wave rectifier element REC with a series circuit of a chopper choke L1 as a boosting transformer and a reverse blocking diode D1 between the inverter circuit 52 and the inverter circuit 52. A first switching element as a switching element, that is, a field effect transistor (FET) Q1, which is a chopping switching element, is connected in parallel to the connection point between the chopper choke L1 and the anode of the diode D1, and the cathode of the diode D1 The electrolytic capacitor C2, which is a smoothing capacitor, is connected in parallel to the connection point between the inverter circuit 52 and the inverter circuit 52.

  The chopper choke L1 has a primary winding L1a and a secondary winding L1b, and the primary winding L1a is connected between the output side of the full-wave rectifying element REC and the anode of the diode D1, and the secondary winding L1a One end of the winding L1b is connected to the ground potential, and the other end is connected to the processing device 56 via the detection resistor R1.

  In the field effect transistor Q1, the drain terminal is connected to the connection point between the chopper choke L1 and the anode of the diode D1, the resistor R2 is connected to the source terminal, and the gate terminal that is the control terminal is connected to the processing device 56. The processing device 56 performs switching driving based on the choke current that flows through the chopper choke L1 and the switching current IQ that flows through the field effect transistor Q1.

  Further, the inverter circuit 52 is a so-called half-bridge type in which field effect transistors Q2 and Q3, which are second switching elements as control signal output members, that is, inverter switching elements, are connected in series to the power supply unit 51. Is.

  The field effect transistors Q2 and Q3 are connected at their gate terminals, which are control terminals, to a processing device 56 via a driver 65 as control means, and are turned on and off by signals supplied from the driver 65.

  The driver 65 alternately turns on and off the field effect transistors Q2 and Q3 at a frequency of about several tens of kHz to 200 kHz in accordance with the dimming PWM signal P supplied from the processing device 56 (switching driving). A predetermined high-frequency alternating current is generated between the drain and source of the field effect transistor Q3.

  The resonant circuit 53 includes a capacitor C4 for resonance through a capacitor C3 that cuts off a DC component and a ballast choke L2 that is a resonance winding (resonance inductor) as a transformer in series between both ends of the field effect transistor Q3. Connected in parallel.

  As shown in FIGS. 1 and 2, the ballast choke L2 is configured by winding a winding portion L2b around a core L2a such as an EE core or an EI core formed of a conductive material.

  Returning to FIG. 3, the preheating circuit 55 includes a series circuit of a preheating transformer L3 as a transformer, a capacitor C5, a field effect transistor Q4 as a preheating switching element, and a resistor R2 for current detection. A diode D2 is connected between a connection point with the field effect transistor Q4 and a source terminal of the field effect transistor Q2.

  In the preheating transformer L3, the primary winding L3a, the first secondary winding L3b and the second secondary winding L3c are arranged to face each other, and the primary winding L3a is a connection point between the field effect transistors Q2 and Q3. And the resonance capacitor C4, and the secondary windings L3b and L3c are connected to the filaments FLa and FLb of the lamp 12 via the capacitors C6 and C7, respectively.

  In the field effect transistor Q4, a gate terminal as a control terminal is connected to the processing device 56, and switching control is performed by a preheating PWM signal PP supplied from the processing device 56.

  The processing device 56 is a so-called microcomputer (DSP) that performs digital processing, and includes ROM, RAM, I / O port as an interface, a clock generation unit that generates an operation clock, and the like as storage means (not shown). And a state detection unit 71 for detecting the operation state of the lamp 12, a chopper control unit 72 for controlling the boost chopper circuit 59, an inverter control unit 73 for controlling the driver 65, and a control unit for controlling the preheating circuit 55. For example, the state detection unit 71, the chopper control unit 72, the inverter control unit 73, the preheating circuit control unit 74, and the like are integrated by sharing the software processing part. Further, as shown in FIG. 1, the processing apparatus 56 is a surface-mount type device in which a plurality of lead portions 56b protrude from the four sides of a rectangular processing apparatus main body 56a.

  Returning to FIG. 3, the state detector 71 detects at least one of the discharge current, that is, the lamp current IL and the discharge voltage, that is, the lamp voltage VL, at a timing synchronized with the peak phase of the lamp current IL and the lamp voltage VL, It has a function of an A / D converter which is an arithmetic means for converting into digital frequency data corresponding to the lamp current IL and the lamp voltage VL, and at least one of the A / D converted lamp current IL and lamp voltage VL. One of them is output to the inverter control unit 73 or the preheating circuit control unit 74.

  The chopper control unit 72 generates a switching pulse for switching the field effect transistor Q1 for PFC control of the power supply unit 51, and adjusts the phase of the input voltage V0 and the input current I0 to improve the power factor. Part.

  The inverter control unit 73 generates a PWM signal P for controlling the operation of the field effect transistors Q2 and Q3 of the inverter circuit 52 based on the operation state detected by the state detection unit 71 and the ambient temperature detected by the temperature sensor 58. A software unit having a function of a generation unit, that is, a dimming signal generation unit.

  In the ROM, various programs to be executed by the respective units of the processing device 56 are stored in advance.

  In the RAM, various digital values detected by the state detection unit 71, the temperature sensor 58, and the like are stored in areas assigned thereto.

  The preheating circuit control unit 74 is for controlling the switching of the field effect transistor Q4 of the preheating circuit 55, and is a preheating current detection unit that detects the preheating current IP of the preheating circuit 55. The optimum preheating condition, that is, the target value so as to follow the change in at least one of the lamp current IL and the lamp voltage VL detected by the state detection unit 71 or the ambient temperature change detected by the temperature sensor 58 while monitoring. And a preheating PWM signal PP to be supplied to the gate terminal of the field effect transistor Q4 of the preheating circuit 55 is generated so that the preheating current IP approaches the target value.

The control power supply unit 57 supplies power for driving the control circuit CC that drives the lamp 12 by controlling the processing device 56 and the main circuit MC. This is a part that generates a so-called V _DD such as 8V.

  The temperature sensor 58 is an analog or digital temperature sensor IC or the like, detects the ambient temperature, and sends a signal TS corresponding to the detected temperature to the inverter control unit 73 and the preheating circuit control unit 74 of the processing device 56. Can be output. Further, as shown in FIG. 1, the temperature sensor 58 is a surface-mount type device in which a lead portion 58b protrudes from a side portion of a rectangular temperature sensor main body 58a.

  As shown in FIGS. 1 and 2, the lighting device 25 includes a main circuit board part 77 as a first board part having a main circuit MC and a control circuit board as a second board part having a control circuit CC. It is comprised by the part 78, and is accommodated in the case body which is not shown in figure.

  The main circuit board portion 77 includes a main circuit board 81 as a first board formed in a substantially rectangular shape having a long shape, and a first element 82 as an element mounted on the main surface of the main circuit board 81. ing.

  The main circuit board 81 is, for example, a single-sided board in which one main surface 81a is a component surface and the other main surface 81b is a mounting surface. Further, on the main circuit board 81, a filter unit 50 and a power source unit 51 directly connected to the power input terminal are sequentially formed from a power input terminal side (not shown) provided on the instrument body 21 (FIG. 4) side. The control circuit board 78 is connected to a position adjacent to the power supply 51, and the control power supply 57 is formed on both sides of the control circuit board 78 (upper and lower in FIG. 2). An inverter circuit 52 is formed on the lamp output side terminal (not shown) provided on the) side, and a preheating circuit 55 directly connected to the lamp output side terminal between the inverter circuit 52 and the lamp output side terminal, etc. Is formed.

  The main circuit board 81 is arranged such that one main surface 81a side is on the lower side and the other main surface 81b side is on the upper side by attaching the instrument main body 21 (FIG. 5) to the embedded opening in the ceiling.

  The first element 82 is the full-wave rectifier element REC, field effect transistors Q1 to Q4, common mode transformer Tr, chopper choke L1, ballast choke L2, preheating transformer L3, diodes D1 and D2, resistors R1 to R3, capacitor C1. It is composed of elements with relatively high rated current, including discrete parts such as ~ C7. Among the first elements 82, the electrolytic capacitor C2, the full-wave rectifying element REC, the diode D1, the field effect transistors Q1 to Q3, the ballast choke L2, and the like that generate particularly large heat are on one side in the width direction of the main circuit board 81. Displaced and arranged side by side along the longitudinal direction of the main circuit board 81. In other words, the electrolytic capacitor C2, the full wave rectifier element REC, the diode D1, the field effect transistors Q1 to Q3, the ballast choke L2, and the like are arranged at positions separated from the other side in the width direction of the main circuit board 81. Yes. Further, among the first elements 82, the full-wave rectifying element REC, the diode D1, and the field effect transistors Q1 to Q3 are attached to a heat radiating plate 85 fixed to one side in the width direction of the main circuit board 81 along the longitudinal direction. The generated heat is radiated by the heat radiating plate 85. Of the first elements 82, the ballast choke L2 is disposed such that the winding portion L2b protrudes in the longitudinal direction of the main circuit board 81 with respect to the core L2a. In other words, the ballast choke L2 is arranged so that the side surface direction of the core L2a faces the longitudinal direction of the main circuit board 81. For this reason, the ballast choke L2 of the first element 82 is arranged such that the protruding direction of the generated leakage magnetic flux is the longitudinal direction of the main circuit board 81 as shown by the arrow A in FIG.

  Note that only a part of the first element 82 is shown in FIGS. 1 and 2 for convenience.

  The heat radiating plate 85 is formed in a longitudinal shape with a metal member such as aluminum having good heat dissipation and higher rigidity than the main circuit board 81, for example. Therefore, the heat sink 85 is configured to reinforce the main circuit board 81 in the longitudinal direction.

  On the other hand, the control circuit board portion 78 includes a control circuit board 87 as a second board formed in a substantially rectangular shape with a long shape, and a second element 88 mounted on the control circuit board 87.

  The control circuit board 87 is, for example, a buildup multilayer board having a buildup multilayer structure in which an arbitrary buildup layer including a ground layer (not shown) is electrically connected by a plurality of via holes (not shown), and the longitudinal dimension is the main circuit board 81. For example, the length is set to about 1/3. Further, the control circuit board 87 has a plurality of lead portions 87a on one side, and these lead portions 87a are connected to the main circuit board 81 so that they intersect with the main circuit board 81. For example, the main circuit board 81 is arranged so as to be perpendicular to one main surface 81a. Further, the control circuit board 87 is located on the other side in the width direction of the main circuit board 81, that is, in the vicinity of the side opposite to the side where the full-wave rectifying element REC, the diode D1, and the field effect transistors Q1 to Q3 are located, In other words, the main circuit board 81 is disposed along the longitudinal direction of the main circuit board 81 at a position closer to the other side than the center position in the width direction of the main circuit board 81. That is, the control circuit board 87 is disposed at a position separated from the first element 82 that generates a relatively large amount of heat.

  The control circuit board 87 is arranged (substantially in parallel) along the protruding direction (arrow A direction) of the leakage magnetic flux from the ballast choke L2. The control circuit board 87 has a rectangular processing device 56 and a temperature sensor 58 on the main surface far from the first element 82, that is, on the other main surface 87b. Has been implemented. The processing device 56 and the temperature sensor 58 are arranged at positions close to each other on the main surface 87b of the control circuit board 87.

The second element 88 is, for example, an electronic component such as a resistor or a capacitor constituting the control circuit CC. Among these second elements 88, on the main surface of the control circuit board 87, the processing device 56, the temperature sensor 58, etc. In addition, a surface mounting component (chip component) mounted by reflow soldering is located. The second element 88 is an element that is driven at a voltage equal to or lower than V _DD that is a voltage for driving the processing device 56 and has a smaller rated current than the first element 82.

  Note that only a part of the second element 88 is shown in FIGS. 1 and 2 for convenience.

  Next, the operation of the above embodiment will be described.

  When the field effect transistor Q1 is turned on by a starting circuit (not shown) or the like, a linearly increasing current flows through the chopper choke L1 (diode D1), so that the choke current I flows through the secondary winding L1b of the chopper choke L1. Flows and electromagnetic energy is accumulated in the chopper choke L1. At the same time, when a voltage generated by the resistor R2 due to the switching current IQ due to the ON of the field effect transistor Q1 is input to the processing device 56, an OFF switching pulse is supplied from the chopper controller 72 to the gate terminal of the field effect transistor Q1. When the field effect transistor Q1 is turned off, electromagnetic energy accumulated in the chopper choke L1 is released, and a linearly decreasing current flows through the chopper choke L1 (diode D1).

  By repeating this operation, the output current I1 is formed using the waveform of the input voltage V0, that is, the reference waveform which is a sine waveform subjected to full-wave rectification, as an envelope.

  The output voltage V1 generated by the power supply unit 51 is converted into a high-frequency AC voltage by causing the inverter control unit 73 to turn on / off the field effect transistors Q2 and Q3 of the inverter circuit 52 at a predetermined frequency and a predetermined on-duty. Converted.

  By this high frequency AC voltage, the resonance circuit 53 resonates and a resonance current flows, and the field effect transistor Q4 is switched by the preheating PWM signal PP having a predetermined frequency generated by the preheating circuit control unit 74. A preheating current IP flows through the secondary windings L3b and L3c of the preheating transformer L3 to preheat the filaments FLa and FLb of the lamp 12.

  A predetermined starting voltage is applied between the filaments FLa and FLb by preheating the filaments FLa and FLb, the lamp 12 is turned on (started), and the lamp 12 is steadily lit.

  At this time, the lighting device 25 performs feedback based on at least one of the lamp current IL and the lamp voltage VL detected by the state detection unit 71 so that the lamp current IL or the lamp voltage VL becomes a predetermined target value. Control is made.

  When dimming the lit lamp 12 as described above, the PWM signal P is input from the inverter control unit 73 to the driver 65 of the lighting device 25 to vary the drive frequency of the inverter circuit 52. By increasing or decreasing the drive frequency of the inverter circuit 52, the high frequency power from the inverter circuit 52 is suppressed or increased, the lamp current IL is suppressed or increased, and the lamp 12 is dimmed.

  The drive frequency of the inverter circuit 52, that is, the frequency of the PWM signal P is determined by the inverter control unit 73, for example, at least one of the lamp current IL, the lamp voltage VL, and the signal TS from the temperature sensor 58 detected by the state detection unit 71. Is set based on

  In the preheating circuit 55, the preheating circuit control unit 74 is set so as to follow the lamp current IL, the lamp voltage VL, the lamp power detected by the state detection unit 71, or the ambient temperature change detected by the temperature sensor 58. The amount of preheating during lighting that varies depending on the type of lamp 12 and variations in the manufacturing process, etc., by switching the field effect transistor Q4 with the preheating PWM signal PP generated so that the preheating current IP approaches the target value. To optimize.

  As described above, the processing device 56 constituting a part of the control circuit CC for controlling the main circuit MC to drive the lamp 12 is connected to the main circuit board 81 in a crossed manner. By mounting on the main surface 87 b far from the first element 82, not only the processing device 56 is moved away from the first element 82, but also the heat generated from the first element 82 is generated by the control circuit board 87. And the influence of noise caused by the heat generated from the first element 82 on the processing device 56 can be suppressed.

  In particular, the control circuit board 87 having a relatively expensive build-up multilayer structure is used only at an appropriate position where the control circuit CC is mounted, and the main circuit board 81 which is a relatively inexpensive and versatile single-sided board is used. In the lighting device 25 configured to be connected to each other, the position of the processing device 56 is separated from the first element 82 as described above, thereby achieving high functionality, miniaturization, and cost reduction, and reliability. Can be secured. That is, it is possible to effectively protect the processing device 56 from the heat generated by the first element 82 by using a configuration in which the control circuit board 87 is connected to the main circuit board 81 in an intersecting manner.

  In addition, the lighting device 25 attaches the fixture main body 21 of the lighting fixture 11 to the embedded opening in the ceiling, so that one main surface 81a which is the component surface of the main circuit board 81 is the lower side and the other main surface which is the mounting surface. The surface 81b is on the upper side. For this reason, the heat generated from the first element 82 is easily transferred to the other main surface 81b side through the main circuit board 81, so that the control circuit in which the processing device 56 is mounted as in the above-described embodiment. By disposing the substrate 87 on one main surface 81a side of the main circuit substrate 81, for example, a configuration in which the processing device 56 is directly mounted on the other main surface 81b of the main circuit substrate 81, or the other main surface substrate 81 Compared with a configuration in which the processing device 56 is disposed on the main surface 81b side, heat generated from the first element 82 is more difficult to be transmitted to the processing device 56.

  Further, by mounting the temperature sensor 58 for detecting the ambient temperature on the main surface 87b of the control circuit board 87 far from the first element 82, it is difficult to be affected by the heat generated from the first element 82. The ambient temperature can be detected at the position, and the ambient temperature detection accuracy can be improved. Therefore, by controlling the driving of the main circuit MC by the processing device 56 corresponding to the ambient temperature detected by the temperature sensor 58, it becomes possible to perform an operation corresponding to the ambient temperature more accurately. .

  In the longitudinal direction of the main circuit board 81, a heat dissipation plate 85 having a rigidity higher than that of the main circuit board 81 and dissipating heat generated from a part of the first element 82 is disposed, and the control circuit board 87 is disposed in the main circuit. By arranging along the longitudinal direction of the substrate 81, heat generated from the first element 82 can be suppressed, and the influence of noise and the like on the processing device 56 and the like due to this heat can be further suppressed. The board 81 is reinforced in the longitudinal direction and the main circuit board 81 is prevented from being bent in the longitudinal direction, and the influence on the control circuit board 87 due to the bending, for example, the bending of the control circuit board 87 and the main circuit board. Breakage of the connection of the lead portion 87a to 81 can be suppressed.

  In addition, by disposing the control circuit board 87 along the protruding direction (direction of arrow A) of the leakage magnetic flux from the ballast choke L2, that is, at a position not easily affected by the leakage magnetic flux, leakage from the ballast choke L2 The influence of noise caused by magnetic flux on the control circuit board 87 and the processing device 56 can be suppressed.

  As a result, the influence of noise due to heat, leakage magnetic flux, etc. on the processing device 56 can be suppressed, so that malfunction of the main circuit MC caused by noise can be suppressed, and the reliability of the lighting device 25 can be improved.

  Furthermore, since the lighting device 11 includes the lighting device 25, each effect exhibited by the lighting device 25 can be achieved. For example, the influence of noise caused by heat generated from the first element 82 on the processing device 56 can be suppressed. Can improve reliability.

  In the above embodiment, the lighting device 25 can be applied to an arbitrary lighting fixture such as a ceiling-mounted lighting fixture for facilities.

  Further, the load control device is not limited to the lighting device 25.

  Further, the arrangement of the control circuit board 87 is not limited as long as the control circuit board 87 is arranged so as to intersect the main circuit board 81. In this case, if the processing device 56 is arranged on the main surface on the side far from the first element 82, the same operational effects can be obtained.

It is a perspective view of a load control device showing an embodiment of the present invention. It is a top view of a load control apparatus same as the above. It is a circuit diagram of a load control apparatus same as the above. It is the side view which made a part of lighting fixture provided with a load control device same as the above in the cross section. It is the bottom view which made a part of lighting fixture same as the above into the section.

Explanation of symbols

11 Lighting equipment
12 Lamp as load
21 Instrument body
25 Discharge lamp lighting device as load control device
56 Processing equipment
81 Main circuit board as first board
82 First element as an element
85 Heat sink
87 Control circuit board as second board
CC control circuit
Ballast choke as an L2 transformer
MC main circuit

Claims (4)

A first substrate;
A second substrate connected to one main surface of the first substrate in a crossing manner with respect to the first substrate;
An element mounted on one main surface of the first substrate and constituting at least a part of a main circuit for operating a load;
A processing device mounted on the main surface of the second substrate far from the element and constituting at least a part of a control circuit for controlling the main circuit to drive a load;
A load control device comprising: The first substrate is formed in a longitudinal shape,
A heat dissipating plate is disposed along the longitudinal direction of the first substrate and has a higher rigidity than the first substrate and dissipates heat generated from at least a part of the element.
The load control device according to claim 1, wherein the second substrate is disposed along a longitudinal direction of the first substrate. The element comprises a transformer,
The load control device according to claim 1, wherein the second substrate is arranged along a protruding direction of leakage magnetic flux from the transformer. A load control device according to any one of claims 1 to 3;
An instrument body to which a lamp as a load is attached;
The lighting fixture characterized by comprising.

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