JP2010040613A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2010040613A
JP2010040613A JP2008199084A JP2008199084A JP2010040613A JP 2010040613 A JP2010040613 A JP 2010040613A JP 2008199084 A JP2008199084 A JP 2008199084A JP 2008199084 A JP2008199084 A JP 2008199084A JP 2010040613 A JP2010040613 A JP 2010040613A
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lead member
light emitting
emitting element
light
corner
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JP5206204B2 (en
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Kenji Nakada
憲司 中田
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Nichia Corp
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Nichia Corp
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    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a reliable light-emitting device of improved characteristics by preventing degradation of adhesion between a lead and a translucent resin and wire disconnection while assuring breakdown strength by allowing a protective element to be used as a light-emitting element. <P>SOLUTION: The light-emitting device comprises a light-emitting element, a first lead member where the light-emitting element is placed, a second lead member whose corner parts face the first lead member with a predetermined interval, a conductive wire for electrically connecting an electrode of the light-emitting element to the second lead member, and a translucent resin for covering the light-emitting element, parts of the first lead member and second lead member, and the conductive wire. The first corner part of the first lead member has an acute angle while the second corner part has an obtuse angle. The third corner part of the second lead member has an obtuse angle while the fourth corner part has an acute angle. The first corner part faces the third corner part, and the second corner part faces the fourth corner part. The lead members of the first corner part and the fourth corner part are thin in wall thickness. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、樹脂封止型発光装置に係り、特にリードフレーム上に発光素子を搭載して導電性ワイヤをリード部材にボンディング接続した状態で透光性樹脂により被覆されたパッケージを有する発光装置のリード部材およびパッケージの構造に関するもので、照明用光源、各種アミューズメント用光源、インジケーター用光源、車載用光源、ディスプレイ用光源、液晶のバックライト用光源などに使用されるものである。   The present invention relates to a resin-sealed light emitting device, and more particularly, to a light emitting device having a package covered with a translucent resin in a state where a light emitting element is mounted on a lead frame and a conductive wire is bonded to a lead member. The present invention relates to the structure of lead members and packages, and is used for illumination light sources, various amusement light sources, indicator light sources, in-vehicle light sources, display light sources, liquid crystal backlight light sources, and the like.

発光装置の発光素子として発光ダイオード（ＬＥＤ）チップを用いたものは、小型で消費電力も少なく耐用年数も長いので、携帯電話のインジケーター用光源、液晶のバックライト用光源など幅広い分野で使用されている。   Light emitting diodes that use light emitting diode (LED) chips as light emitting elements are used in a wide range of fields such as light sources for mobile phone indicators and liquid crystal backlights because they are small, consume less power and have a long service life. Yes.

発光素子を実装するパッケージとして多種の構造があるが、ここでは、フルモールド・パッケージ構造を有する樹脂封止型発光装置を例にとって説明する。   There are various structures as a package for mounting a light emitting element. Here, a resin-sealed light emitting device having a full mold package structure will be described as an example.

例えば、下記特許文献１に開示された発光装置は、発光素子を一対のリードのうちの一方のリード上に接合部材を用いて搭載し、他方のリードと発光素子とを導電性ワイヤによって電気的に接続した後、発光素子とリードと、導電性ワイヤの全体を透明樹脂で封止するとともに、発光素子の上方側に凸レンズ形状の光放射面を形成するようにモールドすることにより形成される。   For example, in a light emitting device disclosed in Patent Document 1 below, a light emitting element is mounted on one of a pair of leads using a bonding member, and the other lead and the light emitting element are electrically connected by a conductive wire. After the connection, the light emitting element, the lead, and the entire conductive wire are sealed with a transparent resin and molded so as to form a convex lens-shaped light emitting surface on the upper side of the light emitting element.

一方、このような発光装置において、発光素子を過電圧による破壊から保護するため、発光装置にツェナーダイオードなどの保護素子が搭載されることがある。保護素子は、発光素子を搭載するリード部材に載置され、発光素子と電気的に接続されている。例えば、下記特許文献２には、リードに凹部および鍔部を形成し、該凹部に発光素子を、鍔部に保護素子を載置し、これらの周囲を樹脂によりモールドすることにより、発光装置を形成することが開示されている。   On the other hand, in such a light emitting device, a protective element such as a Zener diode may be mounted on the light emitting device in order to protect the light emitting element from destruction due to overvoltage. The protection element is placed on a lead member on which the light emitting element is mounted, and is electrically connected to the light emitting element. For example, in Patent Document 2 below, a concave portion and a collar portion are formed in a lead, a light emitting element is placed in the concave portion, a protective element is placed in the collar portion, and the periphery thereof is molded with a resin, whereby a light emitting device is obtained. It is disclosed to form.

ところで、特許文献１のような発光装置では、一対のリードと透光性樹脂との密着強度が低いと、透光性樹脂からなるパッケージ樹脂が吸湿状態になった後で例えば表面実装に際してリフロー炉を通る時、パッケージ樹脂中の水分が蒸気になってパッケージ樹脂にクラックが発生し、その後の信頼性が著しく低下するという問題がある。また、温度サイクルの時の剪断応力で導電性ワイヤの断線を引き起こすという問題がある。また、リード上の発光素子とリードとを導電性ワイヤにより電気的に接続した樹脂封止型の発光装置において、インナーリード部と導電性ワイヤとの接続部（セカンドボンディング部）の接続強度が弱いことが知られている（特許文献１参照）。   By the way, in the light emitting device as disclosed in Patent Document 1, if the adhesion strength between the pair of leads and the translucent resin is low, the reflow oven is used, for example, for surface mounting after the package resin made of the translucent resin is in a moisture absorption state. When passing through, there is a problem that the moisture in the package resin becomes vapor and cracks occur in the package resin, and the reliability thereafter is significantly reduced. In addition, there is a problem in that the conductive wire is broken due to the shear stress during the temperature cycle. Further, in a resin-sealed light emitting device in which a light emitting element on a lead and the lead are electrically connected by a conductive wire, the connection strength (second bonding portion) between the inner lead portion and the conductive wire is weak. It is known (see Patent Document 1).

この問題を解決するために、例えば先行技術３には、リードフレームのダイ・パッド外周部に溝を設け、温度サイクル時のせん断応力を緩和させボンディングワイヤーの断線を防止すること、また、樹脂とリードとの密着性を上げ、パッケージの信頼性を向上することが提案されている。   In order to solve this problem, for example, in Prior Art 3, a groove is provided in the outer periphery of the die pad of the lead frame to relieve the shear stress during the temperature cycle and prevent disconnection of the bonding wire. It has been proposed to increase the adhesion with the leads and improve the reliability of the package.

特開２００２−１９８５７０号公報。JP 2002-198570 A.

特開平５−９５０７７号公報。JP-A-5-95077.

特開平１０−２５６６１０号公報。Japanese Patent Laid-Open No. 10-256610.

しかしながら、特許文献１を参照して前述した発光装置用のリードフレームは、ｐ電極、ｎ電極に対応して一対のリード部を有するものであり、特許文献３のようにダイ・パッド部の周囲に多数のリード部を有する半導体装置のリードフレームとは異なり、ダイ・パッド外周部に沿ってリング状の溝を加工した構造を採用することが最善とは言い難い。即ち、発光装置用のリードフレームとして、リードフレームと透光性樹脂との密着強度を向上させるとともに温度サイクルの時の剪断応力による導電性ワイヤの断線を防止するための適切な構造が必要とされている。   However, the lead frame for a light-emitting device described above with reference to Patent Document 1 has a pair of lead portions corresponding to the p-electrode and the n-electrode. Unlike a lead frame of a semiconductor device having a large number of lead portions, it is difficult to say that it is best to employ a structure in which a ring-shaped groove is processed along the outer periphery of the die pad. That is, as a lead frame for a light emitting device, an appropriate structure for improving the adhesion strength between the lead frame and the translucent resin and preventing disconnection of the conductive wire due to shear stress during the temperature cycle is required. ing.

また、特許文献２には、保護素子を載置する顎部が、透光性樹脂や導電性ワイヤなどの他の構成部材に与える影響について、言及されていない。   Patent Document 2 does not mention the influence of the jaw portion on which the protective element is placed on other components such as a translucent resin and a conductive wire.

本発明は、上記課題に鑑みなされたものであり、保護素子を発光素子に併用可能とすることにより、より耐圧強度を確保しながら、リードと透光性樹脂との密着性の低下やワイヤの断線を防止して、その特性を向上させ、信頼性の高い発光装置を提供することを目的とする。   The present invention has been made in view of the above problems, and by making it possible to use a protective element in combination with a light emitting element, it is possible to reduce the adhesion between the lead and the translucent resin and to secure the wire while ensuring a higher pressure resistance. An object is to provide a highly reliable light-emitting device by preventing disconnection and improving its characteristics.

以上の目的を達成するために、本発明に係る発光装置は、発光素子と、前記発光素子が載置される第１のリード部材と、所定の間隙をあけて前記第１のリード部材と、その隅部が対向する第２のリード部材と、前記発光素子の電極と前記第２のリード部材とを電気的に接続する導電性ワイヤと、前記発光素子、第１のリード部材および第２のリード部材の一部、導電性ワイヤを被覆する透光性樹脂と、を有する発光装置であって、前記第１のリード部材の第１の隅部が鋭角であり、第２の隅部が鈍角であり、前記第２のリード部材の第３の隅部が鈍角であり、第４の隅部が鋭角であり、前記第１の隅部と前記第３の隅部が対向しており、前記第２の隅部と前記第４の隅部が対向しており、前記第１の隅部と前記第４の隅部は、リード部材の厚みが肉薄であることを特徴とする。   In order to achieve the above object, a light emitting device according to the present invention includes a light emitting element, a first lead member on which the light emitting element is placed, the first lead member with a predetermined gap therebetween, A second lead member facing the corner, a conductive wire electrically connecting the electrode of the light emitting element and the second lead member, the light emitting element, the first lead member and the second lead member; A light emitting device having a part of a lead member and a translucent resin covering a conductive wire, wherein the first corner of the first lead member has an acute angle and the second corner has an obtuse angle. The third corner of the second lead member is an obtuse angle, the fourth corner is an acute angle, and the first corner and the third corner are opposed to each other, The second corner and the fourth corner are opposed to each other, and the first corner and the fourth corner are the thickness of the lead member. Characterized in that but is thin.

この発光装置においては、前記第１の隅部に搭載された保護素子と、前記保護素子の電極と前記第２のリード部材とを電気的に接続する導電性ワイヤと、を有することが好ましい。   The light emitting device preferably includes a protection element mounted on the first corner, and a conductive wire that electrically connects the electrode of the protection element and the second lead member.

さらに、前記第１のリード部材は、その上面に凹部を有し、該凹部に前記発光素子が載置されてなることが好ましい。   Furthermore, it is preferable that the first lead member has a concave portion on the upper surface, and the light emitting element is placed in the concave portion.

また、本発明に係る発光装置の製造方法は、発光素子と、前記発光素子が載置される第１のリード部材と、所定の間隙をあけて前記第１のリード部材と、その端部が対向する第２のリード部材と、前記発光素子の電極と前記第２のリード部材とを電気的に接続する導電性ワイヤと、前記発光素子、第１のリード部材および第２のリード部材の一部、導電性ワイヤを被覆する透光性樹脂とを有する発光装置を製造する方法であって、金属部材の延長方向に対して前記金属部材を斜めに切断することにより前記第１および第２のリード部材の隅部をそれぞれ鈍角および鋭角に形成する工程と、前記鋭角に形成された部分をプレス加工することにより、リード部材の厚みが肉薄となる部分を形成する工程と、前記第１のリード部材に前記発光素子を載置する工程と、前記発光素子の電極と前記第２のリード部材とを導電性ワイヤにて電気的に接続する工程と、前記隅部を含む前記第１のリード部材および第２のリード部材の一部、前記発光素子、導電性ワイヤを前記透光性樹脂にて被覆する工程と、を有することを特徴とする。   The method for manufacturing a light emitting device according to the present invention includes a light emitting element, a first lead member on which the light emitting element is placed, the first lead member with a predetermined gap therebetween, and an end thereof. The opposing second lead member, a conductive wire that electrically connects the electrode of the light emitting element and the second lead member, and one of the light emitting element, the first lead member, and the second lead member A light-emitting device having a light-transmitting resin covering a conductive wire, wherein the first and second metal members are cut obliquely with respect to an extending direction of the metal member. A step of forming the corners of the lead member at an obtuse angle and an acute angle, a step of forming a portion where the thickness of the lead member is reduced by pressing the portion formed at the acute angle, and the first lead The light emitting element is attached to the member. A step of electrically connecting the electrode of the light emitting element and the second lead member with a conductive wire, and the first lead member and the second lead member including the corners. And a step of covering the light emitting element and the conductive wire with the light transmitting resin.

本発明の発光装置によれば、保護素子を発光素子に併用可能とすることにより、より耐圧強度を確保しながら、リードと透光性樹脂との密着性の低下やワイヤの断線を防止して、その特性を向上させ、信頼性の高い発光装置を提供することができる。   According to the light emitting device of the present invention, the protective element can be used in combination with the light emitting element, thereby preventing a decrease in the adhesion between the lead and the translucent resin and disconnection of the wire while securing a higher pressure resistance. The characteristics can be improved and a highly reliable light-emitting device can be provided.

以下、本発明の実施の形態を図面に基づいて説明する。ただし、以下に示す実施の形態は、本発明の技術思想を具体化するための発光装置を例示するものであって、本発明は発光装置を以下のものに特定しない。また、本明細書は特許請求の範囲に示される部材を、実施の形態の部材に特定するものでは決してない。特に実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は特に特定的な記載がない限りは、本発明の範囲をそれのみに限定する趣旨ではなく、単なる説明例にすぎない。なお、各図面が示す部材の大きさや位置関係等は、説明を明確にするため誇張していることがある。さらに以下の説明において、同一の名称、符号については同一もしくは同質の部材を示しており、詳細説明を適宜省略する。さらに、本発明を構成する各要素は、複数の要素を同一の部材で構成して一の部材で複数の要素を兼用する態様としてもよいし、逆に一の部材の機能を複数の部材で分担して実現することもできる。また、一部の実施例、実施形態において説明された内容は、他の実施例、実施形態等に利用可能なものもある。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies a light emitting device for embodying the technical idea of the present invention, and the present invention does not specify the light emitting device as follows. Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention unless otherwise specified, and are merely explanations. It's just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing. In addition, the contents described in some examples and embodiments may be used in other examples and embodiments.

（実施の形態１）
図１は、本発明の樹脂封止型発光装置の実施の形態に係る一例を概略的に示す端面側面図である。図２は、図１中のリード部材を取り出して折り曲げ前の状態を説明するための上面図である。また、図３（ａ）、（ｂ）は、図１中のリードフレームの製造方法の一例を示す図であり、図４は、図１中のリード部材を取り出して示す部分上面図である。 (Embodiment 1)
FIG. 1 is an end side view schematically showing an example of an embodiment of the resin-sealed light emitting device of the present invention. FIG. 2 is a top view for explaining a state before the lead member in FIG. 1 is taken out and bent. 3A and 3B are views showing an example of the manufacturing method of the lead frame in FIG. 1, and FIG. 4 is a partial top view showing the lead member in FIG.

図１に示す発光装置は、主たる構成要素として、発光素子１１２と、第１のリード部材１００ａおよび第２のリード部材１００ｂと、導電性ワイヤ１１４と、透光性樹脂１１３とを有する。   The light-emitting device illustrated in FIG. 1 includes a light-emitting element 112, a first lead member 100a and a second lead member 100b, a conductive wire 114, and a translucent resin 113 as main components.

本実施の形態において、第１のリード部材１００ａは、第１のインナーリード部１０６ａが厚く、第１のアウターリード部１０７ａが薄い平板状である。厚く形成された第１のインナーリード部１０６ａの上面に凹部が形成されており、該凹部に発光素子１１２が載置されている。   In the present embodiment, the first lead member 100a has a flat plate shape in which the first inner lead portion 106a is thick and the first outer lead portion 107a is thin. A concave portion is formed on the upper surface of the thick first inner lead portion 106a, and the light emitting element 112 is placed in the concave portion.

図１に示すように、第２のリード部材１００ｂは、第２のインナーリード部１０６ｂが厚く、第２のアウターリード部１０７ｂが薄い平板状である。なお、第２のリード部材１００ｂは、発光素子載置部１０５が設けられない分、第１のリード部材よりも表面積が小さい。第１のリード部材１００ａと、第２のリード部材１００ｂとは、所定の間隙をあけて、それぞれその隅部が対向するように配置される。ここで、リード部材の「隅部」とは、リード部材のインナーリード側の端部に形成される角の部分をいい、図２において、１０１乃至１０４で示される。   As shown in FIG. 1, the second lead member 100b has a flat plate shape in which the second inner lead portion 106b is thick and the second outer lead portion 107b is thin. The second lead member 100b has a surface area smaller than that of the first lead member because the light emitting element mounting portion 105 is not provided. The first lead member 100a and the second lead member 100b are arranged such that their corners face each other with a predetermined gap. Here, the “corner portion” of the lead member refers to a corner portion formed at the end portion of the lead member on the inner lead side, and is indicated by 101 to 104 in FIG.

第１のリード部材の第１の隅部１０１は、鋭角に形成されており、第１のリード部材の他方の隅部である第２の隅部１０２は、鈍角に形成されている。また、第２のリード部材の第３の隅部１０３は鈍角に形成され、他方の第４の隅部１０４は鋭角に形成される。そして、第１のリード部材の第１の隅部１０１と第２のリード部材の第３の隅部１０３が、第１のリード部材の第２の隅部１０２と第２のリード部材の第４の隅部１０４が互いに対向するように配置される。第１のリード部材１００aと第２のリード部材１００ｂとを、このように配置し、第１の隅部１０１を保護素子載置領域とすることにより、リード部材の全体の大きさを延長することなく、保護素子が載置可能な発光装置とすることができる。また、第２のリード部材の第４の隅部１０４をワイヤボンド領域とすることができる。なお、本実施の形態において、これらの隅部は、間隙の中心に対して点対称となるように配置されている。   The first corner 101 of the first lead member is formed at an acute angle, and the second corner 102, which is the other corner of the first lead member, is formed at an obtuse angle. Further, the third corner portion 103 of the second lead member is formed at an obtuse angle, and the other fourth corner portion 104 is formed at an acute angle. The first corner portion 101 of the first lead member and the third corner portion 103 of the second lead member are the second corner portion 102 of the first lead member and the fourth corner of the second lead member. The corners 104 are arranged so as to face each other. By disposing the first lead member 100a and the second lead member 100b in this way and using the first corner portion 101 as a protection element mounting region, the overall size of the lead member is extended. And a light-emitting device on which a protective element can be placed. Further, the fourth corner 104 of the second lead member can be a wire bond region. In the present embodiment, these corners are arranged so as to be point-symmetric with respect to the center of the gap.

このような第１乃至第４の隅部は、リードフレームの延長方向に対して、リードフレームを斜めに切断することにより、形成することができる。   Such first to fourth corners can be formed by cutting the lead frame obliquely with respect to the extending direction of the lead frame.

図４に示すように、発光素子１１２は、アノード・カソードに対応する一対の電極（ｐ電極、ｎ電極）を上面側に有し、第１のリード部材１００ａの凹部内に固着（ダイボンディング）されている。そして、発光素子１１２の一対の電極のうち、一方の電極（本形態ではｎ電極）は、第１のリード部材１００ａの第１のインナーリード部に導電性ワイヤ１１４を用いて電気的に接続されている。発光素子１１２の他方の電極（本形態ではｐ電極）は、第２のインナーリード部に同様に導電性ワイヤを用いて電気的に接続される。   As shown in FIG. 4, the light emitting element 112 has a pair of electrodes (p electrode and n electrode) corresponding to the anode and cathode on the upper surface side, and is fixed in the recess of the first lead member 100a (die bonding). Has been. One electrode (n electrode in this embodiment) of the pair of light emitting elements 112 is electrically connected to the first inner lead portion of the first lead member 100a using the conductive wire 114. ing. The other electrode (p-electrode in this embodiment) of the light-emitting element 112 is electrically connected to the second inner lead portion similarly using a conductive wire.

そして、図１に示すように、発光素子１１２、第１のリード部材１００ａおよび第２のリード部材１００ｂの一部、導電性ワイヤ１１４を透光性樹脂で被覆して、発光装置を形成している。本形態の透光性樹脂は、トランスファモールド成形によって形成されている。この場合、透光性樹脂１１３は、第１のリード部材１００ａの第１のインナーリード部１０６ａ、第２のリード部材１００ｂの第２のインナーリード部１０６ｂ、導電性ワイヤ１１４を被覆する部分が例えば直方体である。そして、この直方体部分の上面側（発光素子１１２の上方側）に凸レンズ形状の光放出面を形成するようにモールドされている。但し、透光性樹脂１１３の全体的な形状は種々変更することが可能である。   Then, as shown in FIG. 1, the light emitting element 112, a part of the first lead member 100a and the second lead member 100b, and the conductive wire 114 are covered with a translucent resin to form a light emitting device. Yes. The translucent resin of this embodiment is formed by transfer molding. In this case, the translucent resin 113 has a portion covering the first inner lead portion 106a of the first lead member 100a, the second inner lead portion 106b of the second lead member 100b, and the conductive wire 114, for example. It is a rectangular parallelepiped. Then, it is molded so as to form a light emitting surface having a convex lens shape on the upper surface side (above the light emitting element 112) of the rectangular parallelepiped portion. However, the overall shape of the translucent resin 113 can be variously changed.

上記構成の発光装置において、第１のリード部材１００ａの第１の隅部１０１と、第２のリード部材１００ｂの第４の隅部１０４は、リード部材の厚みが肉薄となるよう形成されている。すなわち、図１に示すように、隅部の端部に、リード部材の厚みが肉薄となることで形成される肉薄部１１０を有している。リード部材が肉薄となることで形成される肉薄部１１０の段差形状、もしくはテーパー形状により透光性樹脂を係止することにより、第１の隅部１０１および第４の隅部１０４と、透光性樹脂との密着性を向上させることができる。   In the light emitting device having the above structure, the first corner portion 101 of the first lead member 100a and the fourth corner portion 104 of the second lead member 100b are formed so that the thickness of the lead member is thin. . That is, as shown in FIG. 1, a thin portion 110 formed by reducing the thickness of the lead member is provided at the end of the corner. By engaging the translucent resin with the stepped shape or the tapered shape of the thin portion 110 formed when the lead member is thin, the first corner portion 101 and the fourth corner portion 104 are translucent. Adhesiveness with an adhesive resin can be improved.

言い換えると、リード部材の端部の端面に、アンカーとなるような突起を設け、透光性樹脂と、第１および第４の隅部との密着性を向上させている。   In other words, a protrusion that serves as an anchor is provided on the end face of the end portion of the lead member, thereby improving the adhesion between the translucent resin and the first and fourth corners.

このような肉薄部１１０は、あらかじめ異形条のリードフレームを用いることによって形成されてもよいが、ここでは、簡単にプレス加工で形成する方法を図３を用いて説明する。平板状のリードフレーム１００の上面に、成形パンチ１１１を降下させる（図３（ａ））ことにより、リードフレーム１００の厚みが薄くなると同時に、薄くなったぶんのリードフレームが、横方向に押し出されて変形することにより、肉薄部１１０が形成される。（図３（ｂ））
このようにして、第１の隅部１０１および第４の隅部１０４に肉薄部１１０が形成されると、隅部の上面を平坦に加工することができ、ダイボンドやワイヤボンドの強度を高めることができる。また、上面の表面積を広げることができることから、保護素子載置領域や、ワイヤボンド領域を広くすることもでき、好ましい。本実施の形態において、肉薄部１１０は、図４に示すような領域に形成されるのが好ましい。 Such a thin portion 110 may be formed in advance by using a deformed lead frame, but here, a method of forming it simply by pressing will be described with reference to FIG. By lowering the molding punch 111 on the upper surface of the flat lead frame 100 (FIG. 3A), the thickness of the lead frame 100 is reduced, and at the same time, the thinned lead frame is pushed laterally. By deforming, the thin portion 110 is formed. (Fig. 3 (b))
Thus, when the thin part 110 is formed in the 1st corner part 101 and the 4th corner part 104, the upper surface of a corner part can be processed flat, and the intensity | strength of a die bond or a wire bond is raised. Can do. In addition, since the surface area of the upper surface can be increased, the protective element mounting region and the wire bond region can be increased, which is preferable. In the present embodiment, the thin portion 110 is preferably formed in a region as shown in FIG.

上記構成の発光装置を、例えば半田リフロー法を用いて実装基板上に表面実装する際、リフロー炉を通すことによって半田付けが行われる。この際、予備加熱後の本加熱時の温度は半田の融点以上の２２０℃〜２４０℃程度（鉛フリーの場合には２６０℃程度以上）の高温になり、熱膨張の大きい例えばエポキシ樹脂等の透光性樹脂１１３によって、リード部材も引っ張られて変形する。この際に、第１の隅部１０１と第４の隅部１０４は、第２の隅部１０２および第３の隅部１０３に比べて、表面積が大きいため、より多く透光性樹脂の熱膨張の影響を受ける。そのため、第１の隅部１０１と第４の隅部１０４がより大きく引っ張られ、第１の隅部１０１に搭載される保護素子の導電性ワイヤに悪影響を及ぼす。また、第４の隅部１０４にワイヤボンディングされる、発光素子と接続される導電性ワイヤに対しても、同じく悪影響を及ぼすことになる。   When the light emitting device having the above structure is surface-mounted on a mounting substrate using, for example, a solder reflow method, soldering is performed by passing through a reflow furnace. At this time, the temperature during the main heating after the preheating becomes a high temperature of about 220 ° C. to 240 ° C., which is higher than the melting point of the solder (about 260 ° C. in the case of lead-free). The lead member is also pulled and deformed by the translucent resin 113. At this time, since the first corner portion 101 and the fourth corner portion 104 have a larger surface area than the second corner portion 102 and the third corner portion 103, more thermal expansion of the translucent resin is performed. Affected by. Therefore, the first corner portion 101 and the fourth corner portion 104 are pulled more greatly, which adversely affects the conductive wire of the protective element mounted on the first corner portion 101. In addition, the conductive wire connected to the light emitting element, which is wire-bonded to the fourth corner 104, also has an adverse effect.

本実施の形態によれば、リード部材が最も変形しやすい箇所を肉薄とし、リード部材に透光性樹脂を係止することにより、透光性樹脂の熱膨張が起こっても、その膨張が導電性ワイヤに与える影響を抑制することができ、導電性ワイヤの電気的接触不良あるいは断線を極力防止することが可能になり、不良率が低減する。   According to the present embodiment, the portion where the lead member is most easily deformed is thinned, and the translucent resin is locked to the lead member, so that the expansion of the translucent resin is conducted even if thermal expansion occurs. The influence on the conductive wire can be suppressed, and it becomes possible to prevent electrical contact failure or disconnection of the conductive wire as much as possible, and the failure rate is reduced.

結果として、上記発光装置によれば、熱衝撃試験に対する高い信頼性と歩留まりの向上を図り、大面積、高出力の発光素子を搭載することが可能になる。   As a result, according to the light emitting device, it is possible to improve the reliability and yield of the thermal shock test, and to mount a light emitting element having a large area and a high output.

また、発光装置の底面側に表面実装用の外部端子１０８を有するので、応用装置への基板上へ表面実装した場合の面積が少なくて済み、実装面積効率の向上、応用装置の小型化を図ることが可能になる。   In addition, since the external terminal 108 for surface mounting is provided on the bottom surface side of the light emitting device, the area required for surface mounting on the substrate to the application device can be reduced, so that the mounting area efficiency can be improved and the application device can be downsized. It becomes possible.

また、透光性樹脂１１３は、発光素子１１２の上側方向に突出する凸レンズ形状を有するので、発光出力を高めることが可能になる。   In addition, since the translucent resin 113 has a convex lens shape protruding in the upper direction of the light emitting element 112, the light emission output can be increased.

なお、図１に示すように、第１のインナーリード部１０６ａに、溝部１０９を形成し、透光性樹脂１１３と第１のリード部材１００ａとの密着性をさらに向上させている。   In addition, as shown in FIG. 1, the groove part 109 is formed in the 1st inner lead part 106a, and the adhesiveness of the translucent resin 113 and the 1st lead member 100a is further improved.

（実施の形態２）
図５は、本発明の発光装置の実施の形態２に係る発光装置のリード部材を取り出して示す部分上面図であり、図６は実施の形態２に係る発光装置のリード部材を取り出して示す斜視図である。 (Embodiment 2)
FIG. 5 is a partial top view showing a lead member of the light emitting device according to Embodiment 2 of the present invention, and FIG. 6 is a perspective view showing the lead member of the light emitting device according to Embodiment 2. FIG.

実施形態２は、実施の形態１と同様に、第１のリード部材２００aに鋭角の第１の隅部２０１と鈍角の第２の隅部２０２を、第２のリード部材２００ｂに鈍角の第３の隅部２０３と鋭角の第４の隅部２０４を有し、一対の外部端子２０８を有している。   In the second embodiment, similar to the first embodiment, the first lead member 200a has an acute first corner 201 and an obtuse second corner 202, and the second lead member 200b has an obtuse third. Corner 203 and acute fourth corner 204, and a pair of external terminals 208.

第１の隅部２０１には、保護素子１１６が搭載されており、第２のリード部材２００ｂの第４の隅部２０４に、発光素子１１２と電気的に接続される導電ワイヤがワイヤボンディングにより接続されている。なお、本実施形態においては、セカンドボンディング部を補強するように、さらに、ワイヤボンディングを行っている。この際に、第１の隅部２０１と、第４の隅部２０４の方向に補強ワイヤを有することにより、この補強ワイヤによるアンカー効果により、透光性樹脂とリード部材との剥離を抑制することができる。   A protective element 116 is mounted on the first corner 201, and a conductive wire electrically connected to the light emitting element 112 is connected to the fourth corner 204 of the second lead member 200b by wire bonding. Has been. In the present embodiment, wire bonding is further performed so as to reinforce the second bonding portion. At this time, by having a reinforcing wire in the direction of the first corner portion 201 and the fourth corner portion 204, the anchor effect by the reinforcing wire suppresses peeling between the translucent resin and the lead member. Can do.

これらの隅部は、図６に示すように、実施の形態１と同様に、プレス加工により、肉薄部２１０が形成されている。発光素子１１２と第１のリード部材１００ａとの電気的接続をとるための導電性ワイヤをワイヤボンディングする箇所に、同様のプレス加工を施すことにより、平坦部１１７を形成しており、導電性ワイヤとの接続強度を向上させている。   As shown in FIG. 6, the thin portions 210 are formed at these corners by pressing as in the first embodiment. The flat portion 117 is formed by applying the same pressing process to the portion where the conductive wire for electrical connection between the light emitting element 112 and the first lead member 100a is wire-bonded. Connection strength is improved.

また、第２のリード部材２００ｂには、上下方向に溝部１１８が形成されており、これにより、封止樹脂との密着性をさらに向上している。   The second lead member 200b has a groove 118 in the vertical direction, thereby further improving the adhesion with the sealing resin.

以下、上記した各実施形態の発光装置における各構成要素について詳述する。   Hereinafter, each component in the light-emitting device of each above-mentioned embodiment is explained in full detail.

（第１のリード部材１００ａ、２００ａ、第２のリード部材１００a、２００a）
各リード部材は、高熱伝導体を用いることが好ましく、鉄入り銅等の表面に銀、アルミニウム、金等の金属メッキを施し、その表面を平滑にして反射率を向上させることが好ましい。本例では、銅（Ｃｕ）合金板の表面に銀（Ａｇ）メッキが施されている。これらの金属の熱膨張率は、銅（Ｃｕ）で１６．７×１０-6／℃、鉄（Ｆｅ）で１１．８×１０-6／℃である。 (First lead members 100a and 200a, second lead members 100a and 200a)
Each lead member is preferably made of a high thermal conductor, and it is preferable to apply metal plating such as silver, aluminum or gold on the surface of iron-containing copper or the like to smooth the surface and improve the reflectance. In this example, the surface of a copper (Cu) alloy plate is subjected to silver (Ag) plating. The thermal expansion coefficients of these metals are 16.7 × 10 −6 / ° C. for copper (Cu) and 11.8 × 10 −6 / ° C. for iron (Fe).

（発光素子１１２）
発光素子は、４６０ｎｍ近傍に発光ピーク波長を持つ青色発光の発光素子、４１０ｎｍ近傍に発光ピーク波長を持つ青紫色発光の発光素子、３６５ｎｍ近傍に発光ピーク波長を持つ紫外線発光の発光素子などを使用することができる。 (Light emitting element 112)
As the light emitting element, a blue light emitting element having an emission peak wavelength near 460 nm, a blue-violet light emitting element having an emission peak wavelength near 410 nm, an ultraviolet light emitting element having an emission peak wavelength near 365 nm, or the like is used. be able to.

発光素子の種類は特に制限されるものではないが、例えば、ＭＯＣＶＤ法等によって基板上にＩｎＮ、ＡｌＮ、ＧａＮ、ＩｎＧａＮ、ＡｌＧａＮ、ＩｎＧａＡｌＮ等の窒化物半導体を発光層として形成させたもの、一例として、サファイア基板上にｎ型ＧａＮよりなるｎ型コンタクト層と、ｎ型ＡｌＧａＮよりなるｎ型クラッド層と、ｐ型ＧａＮよりなるｐ型コンタクト層とが順次に積層された構造のものを使用する。また、半導体の構造としては、ＭＩＳ接合、ＰＩＮ接合やＰＮ接合などを有するホモ構造、ヘテロ結合あるいはダブルヘテロ結合のものが挙げられる。半導体の材料やその混晶比によって発光波長を種々選択できる。また、半導体活性層を量子効果が生ずる薄膜に形成させた単一量子井戸構造や多重量子井戸構造とすることができる。また、活性層には、Ｓｉ、Ｇｅ等のドナー不純物および／またはＺｎ、Ｍｇ等のアクセプター不純物がドープされる場合もある。発光素子の発光波長は、その活性層のＩｎＧａＮのＩｎ含有量を変えるか、または活性層にドープする不純物の種類を変えることにより、紫外領域から赤色まで変化させることができる。   The type of the light emitting element is not particularly limited, but for example, a nitride semiconductor such as InN, AlN, GaN, InGaN, AlGaN, InGaAlN, etc. formed as a light emitting layer on a substrate by MOCVD method, for example The n-type contact layer made of n-type GaN, the n-type cladding layer made of n-type AlGaN, and the p-type contact layer made of p-type GaN are sequentially stacked on the sapphire substrate. The semiconductor structure includes a homostructure having a MIS junction, a PIN junction, a PN junction, etc., a hetero bond, or a double hetero bond. Various emission wavelengths can be selected depending on the semiconductor material and the mixed crystal ratio. Moreover, it can be set as the single quantum well structure or the multiple quantum well structure which formed the semiconductor active layer in the thin film which produces a quantum effect. The active layer may be doped with donor impurities such as Si and Ge and / or acceptor impurities such as Zn and Mg. The emission wavelength of the light-emitting element can be changed from the ultraviolet region to red by changing the In content of InGaN in the active layer or changing the type of impurities doped in the active layer.

（発光素子１１２の発光素子載置部１０５ への接合部材）
例えば青色発光あるいは緑色発光を有し、サファイア基板上に窒化物半導体を成長させた発光素子をリード部材の発光素子載置部上に接合（ダイボンデイング）する場合には、接合部材としてエポキシ樹脂やシリコーン等を用いることができる。また、発光素子からの光や熱による劣化を考慮して、樹脂を使用せず、Ａｕ−Ｓｎ共晶半田や、低融点金属等のろう材を用いることもできる。 (Joint member to light emitting element mounting portion 105 of light emitting element 112)
For example, when a light emitting element having blue light emission or green light emission and having a nitride semiconductor grown on a sapphire substrate is bonded (die-bonded) on a light emitting element mounting portion of a lead member, an epoxy resin or Silicone or the like can be used. In consideration of deterioration due to light and heat from the light emitting element, it is also possible to use a brazing material such as Au—Sn eutectic solder or a low melting point metal without using a resin.

他方、ＧａＡｓ等からなり、赤色発光を有する発光素子をリード部材の発光素子載置部上に接合する場合には、発光素子の両面に電極を形成することができるので、接合部材として、銀、金、パラジウムなどの導電性ペースト等を用いることができる。   On the other hand, when a light-emitting element made of GaAs or the like and having red light emission is bonded onto the light-emitting element mounting portion of the lead member, electrodes can be formed on both surfaces of the light-emitting element. A conductive paste such as gold or palladium can be used.

（導電性ワイヤ１１４）
導電性ワイヤとしては、発光素子の電極とのオーミック性、機械的接続性、電気伝導性および熱伝導性が良いものが求められる。熱伝導率としては、0.01cal ／（S ）（cm2 ）（℃／cm）以上が好ましく、より好ましくは、0.5cal／（S ）（cm2 ）（℃／cm）以上である。また、作業性などを考慮して導電性ワイヤの直径は、好ましくは10μｍ以上、45μｍ以下である。このような導電性ワイヤとして、具体的には、金、銅、白金、アルミニウム等の金属およびそれらの合金を用いたワイヤが挙げられる。このような導電性ワイヤは、ワイヤボンデイング装置によって、各発光素子と内部端子との間に容易にボンデイング接続させることができる。 (Conductive wire 114)
The conductive wire is required to have good ohmic properties, mechanical connectivity, electrical conductivity, and thermal conductivity with the electrode of the light emitting element. The thermal conductivity, preferably 0.01cal / (S) (cm 2 ) (℃ / cm) or higher, more preferably is 0.5cal / (S) (cm 2 ) (℃ / cm) or more. In consideration of workability and the like, the diameter of the conductive wire is preferably 10 μm or more and 45 μm or less. Specific examples of such conductive wires include wires using metals such as gold, copper, platinum, and aluminum, and alloys thereof. Such a conductive wire can be easily bonded to each light emitting element and the internal terminal by a wire bonding apparatus.

（透光性樹脂１１３）
透光性樹脂は、外力、水分等から発光素子を保護するように封止することができる。発光装置の製造工程中あるいは製造段階での保管中に透光性樹脂内に水分が含まれてしまった場合においては、100 ℃で14時間以上のべ−キングを行うことによって、樹脂内に含有された水分を外気へ逃がすことができるので、水蒸気爆発や、発光素子と封止部材との剥がれに起因する色調のずれ等の弊害を防ぐことができる。 (Translucent resin 113)
The light-transmitting resin can be sealed so as to protect the light-emitting element from external force, moisture, and the like. If water is contained in the translucent resin during the manufacturing process of the light emitting device or during storage at the manufacturing stage, it is contained in the resin by baking at 100 ° C for 14 hours or more. Since the generated moisture can be released to the outside air, adverse effects such as a steam explosion and a color shift caused by peeling between the light emitting element and the sealing member can be prevented.

また、封止部材は、発光素子からの光を効率よく外部に発するために、高い光の透過性が要求される。発光素子の電極と内部端子部とを導電性ワイヤで接続する構造においては、封止部材は導電性ワイヤを保護する機能も有する。封止部材として用いられる透光性樹脂の材料としては、エポキシ樹脂、シリコーン樹脂やアクリル樹脂、ユリア樹脂などの耐候性に優れた樹脂を用いると好適である。また、透光性樹脂に拡散剤を含有させることによって、発光素子からの指向性を緩和させ、視野角を増やすこともできる。   In addition, the sealing member is required to have high light transmittance in order to efficiently emit light from the light emitting element to the outside. In the structure in which the electrode of the light emitting element and the internal terminal portion are connected by a conductive wire, the sealing member also has a function of protecting the conductive wire. As a material of the translucent resin used as the sealing member, it is preferable to use a resin having excellent weather resistance such as an epoxy resin, a silicone resin, an acrylic resin, or a urea resin. Further, by adding a diffusing agent to the light-transmitting resin, directivity from the light-emitting element can be relaxed and the viewing angle can be increased.

なお、発光素子１１２として単色発光の発光素子を使用し、パッケージ用の透光性樹脂に、発光素子から放出される光を吸収して励起され、発光素子の発光色とは異なる色の発光を行う波長変換用の蛍光物質を含ませることにより、発光素子の発光色と透光性樹脂中の蛍光物質との組み合わせに応じて所望の混色発光を得ることが可能になる。この場合、発光素子の発光色に対して補色関係を有する発光を行う波長変換用の蛍光物質（例えば青色発光の発光素子に対しては透光性エポキシ樹脂中にＹＡＧ蛍光体（Ｃｅ等のランタノイド系元素で主に賦活される希土類アルミン酸塩蛍光体）を含ませることにより、その含有量によって、青色発光素子からの光を一部吸収して補色となる黄色系の発光が可能となり、青色発光素子による発光とＹＡＧ蛍光体による発光との混色によって白色系に発光する発光装置を比較的簡単に信頼性良く形成できる。同様に、Ｅｕおよび／またはＣｒで賦活された窒素含有ＣａＯ−Ａｌ2 Ｏ3 −ＳｉＯ2 蛍光体を利用した場合は、その含有量によって、青色発光素子からの光を一部吸収して補色となる赤色系の発光が可能となり、青色発光素子との組み合わせにより白色系の発光装置を比較的簡単に信頼性良く形成できる。 Note that a single-color light-emitting element is used as the light-emitting element 112, and the light-transmitting resin for the package absorbs light emitted from the light-emitting element and is excited to emit light having a color different from the light-emitting element. By including the fluorescent substance for wavelength conversion to be performed, it is possible to obtain desired mixed color emission according to the combination of the emission color of the light emitting element and the fluorescent substance in the translucent resin. In this case, a fluorescent substance for wavelength conversion that emits light having a complementary color relationship with the light emission color of the light emitting element (for example, a YAG phosphor (a lanthanoid such as Ce) in a translucent epoxy resin for a light emitting element emitting blue light). Incorporating rare earth aluminate phosphors, which are mainly activated with a system element), the content makes it possible to absorb yellow light that partially absorbs light from the blue light emitting element and to emit blue light. A light-emitting device that emits white light can be formed relatively easily and reliably by mixing the light emitted from the light-emitting element and the light emitted from the YAG phosphor.Similarly, nitrogen-containing CaO—Al 2 activated with Eu and / or Cr O 3 when using -SiO 2 phosphor is set in the content thereof, it is possible to emission of red light as a complementary color to absorb part of the light from the blue light emitting element, a blue light emitting element The light-emitting device of white relatively easy to reliably form the Align.

照明用光源、各種インジケーター用光源、車載用光源、ディスプレイ用光源、液晶のバックライト用光源、信号機、車載部品、看板用チャンネルレターなど、種々の光源に使用することができる。   It can be used for various light sources such as illumination light sources, various indicator light sources, in-vehicle light sources, display light sources, liquid crystal backlight light sources, traffic lights, in-vehicle components, and signboard channel letters.

本発明の実施の形態２に係る発光装置の一例を概略的に示す端面側面図である。It is an end surface side view which shows roughly an example of the light-emitting device which concerns on Embodiment 2 of this invention. 図１中のリード部材を取り出して折り曲げ前の状態を説明するための上面図である。It is a top view for taking out the lead member in FIG. 1 and explaining the state before bending. 図３（ａ）、（ｂ）は、図１中のリードフレームの製造方法の一例を示す図である。3A and 3B are views showing an example of a manufacturing method of the lead frame in FIG. 図１中のリード部材を取り出して示す部分上面図である。FIG. 2 is a partial top view showing the lead member in FIG. 1 taken out. 本発明の発光装置の実施の形態２に係る発光装置のリード部材を取り出して示す部分上面図である。It is a partial top view which takes out and shows the lead member of the light-emitting device which concerns on Embodiment 2 of the light-emitting device of this invention. 実施の形態２に係る発光装置のリード部材を取り出して示す斜視図である。FIG. 6 is a perspective view showing a lead member extracted from the light emitting device according to Embodiment 2.

符号の説明Explanation of symbols

１００…リードフレーム
１００ａ、２００ａ…第１のリード部材
１００ｂ、２００ｂ…第２のリード部材
１０１、２０１…第１の隅部
１０２、２０２…第２の隅部
１０３、２０３…第３の隅部
１０４、２０４…第４の隅部
１０５…発光素子載置部
１０６ａ…第１のインナーリード部
１０６ｂ…第２のインナーリード部
１０７ａ…第１のアウターリード部
１０７ｂ…第２のアウターリード部
１０８、２０８…外部端子
１０９…溝部
１１０、２１０…肉薄部
１１１…成形パンチ
１１２…発光素子
１１３…透光性樹脂
１１４…導電性ワイヤ
１１６…保護素子
１１７…平坦部
１１８…溝部 DESCRIPTION OF SYMBOLS 100 ... Lead frame 100a, 200a ... 1st lead member 100b, 200b ... 2nd lead member 101, 201 ... 1st corner 102, 202 ... 2nd corner 103, 203 ... 3rd corner 104 , 204, fourth corner 105, light emitting element mounting portion 106 a, first inner lead portion 106 b, second inner lead portion 107 a, first outer lead portion 107 b, second outer lead portion 108, 208 DESCRIPTION OF SYMBOLS ... External terminal 109 ... Groove part 110, 210 ... Thin part 111 ... Molding punch 112 ... Light emitting element 113 ... Translucent resin 114 ... Conductive wire 116 ... Protection element 117 ... Flat part 118 ... Groove part

Claims (4)

発光素子と、
前記発光素子が載置される第１のリード部材と、
所定の間隙をあけて前記第１のリード部材と、その隅部が対向する第２のリード部材と、
前記発光素子の電極と前記第２のリード部材とを電気的に接続する導電性ワイヤと、
前記発光素子、第１のリード部材および第２のリード部材の一部、導電性ワイヤを被覆する透光性樹脂と、を有する発光装置であって、
前記第１のリード部材の第１の隅部が鋭角であり、第２の隅部が鈍角であり、
前記第２のリード部材の第３の隅部が鈍角であり、第４の隅部が鋭角であり、
前記第１の隅部と前記第３の隅部が対向しており、
前記第２の隅部と前記第４の隅部が対向しており、
前記第１の隅部と前記第４の隅部は、リード部材の厚みが肉薄であることを特徴とする発光装置。 A light emitting element;
A first lead member on which the light emitting element is placed;
The first lead member with a predetermined gap, and the second lead member whose corners face each other;
A conductive wire that electrically connects the electrode of the light emitting element and the second lead member;
A light-emitting device having the light-emitting element, a part of the first lead member and the second lead member, and a translucent resin covering the conductive wire,
The first corner of the first lead member has an acute angle and the second corner has an obtuse angle;
The third corner of the second lead member is obtuse and the fourth corner is acute;
The first corner and the third corner are opposed to each other;
The second corner and the fourth corner are opposed to each other;
The light emitting device according to claim 1, wherein the first corner portion and the fourth corner portion have a thin lead member. 前記第１の隅部に搭載された保護素子と、前記保護素子の電極と前記第２のリード部材とを電気的に接続する導電性ワイヤと、を有する請求項１に記載の発光装置。   The light emitting device according to claim 1, further comprising: a protective element mounted on the first corner, and a conductive wire that electrically connects an electrode of the protective element and the second lead member. 前記第１のリード部材は、その上面に凹部を有し、該凹部に前記発光素子が載置されてなる請求項１または２に記載の発光装置。   The light emitting device according to claim 1, wherein the first lead member has a recess on an upper surface thereof, and the light emitting element is placed in the recess. 発光素子と、
前記発光素子が載置される第１のリード部材と、
所定の間隙をあけて前記第１のリード部材と、その端部が対向する第２のリード部材と、
前記発光素子の電極と前記第２のリード部材とを電気的に接続する導電性ワイヤと、
前記発光素子、第１のリード部材および第２のリード部材の一部、導電性ワイヤを被覆する透光性樹脂とを有する発光装置を製造する方法であって、
金属部材の延長方向に対して前記金属部材を斜めに切断することにより前記第１および第２のリード部材の隅部をそれぞれ鈍角および鋭角に形成する工程と、
前記鋭角に形成された部分をプレス加工することにより、リード部材の厚みが肉薄となる部分を形成する工程と、
前記第１のリード部材に前記発光素子を載置する工程と、
前記発光素子の電極と前記第２のリード部材とを導電性ワイヤにて電気的に接続する工程と、
前記隅部を含む前記第１のリード部材および第２のリード部材の一部、前記発光素子、導電性ワイヤを前記透光性樹脂にて被覆する工程と、を有することを特徴とする発光装置の製造方法。 A light emitting element;
A first lead member on which the light emitting element is placed;
A first lead member with a predetermined gap, a second lead member having an end facing the first lead member;
A conductive wire that electrically connects the electrode of the light emitting element and the second lead member;
A method of manufacturing a light emitting device having the light emitting element, a part of the first lead member and the second lead member, and a translucent resin covering a conductive wire,
Forming the corners of the first and second lead members at an obtuse angle and an acute angle by cutting the metal member obliquely with respect to the extending direction of the metal member;
Forming a portion where the thickness of the lead member is reduced by pressing the portion formed at the acute angle; and
Placing the light emitting element on the first lead member;
Electrically connecting the electrode of the light emitting element and the second lead member with a conductive wire;
A step of covering the first lead member and the second lead member including the corner, the light emitting element, and a conductive wire with the light transmitting resin. Manufacturing method.
JP2008199084A 2008-07-31 2008-07-31 Light emitting device Expired - Fee Related JP5206204B2 (en)

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JP2011249368A (en) * 2010-05-21 2011-12-08 Sharp Corp Semiconductor light-emitting device
JP2012114286A (en) * 2010-11-25 2012-06-14 Toshiba Corp Led package
JP2012146816A (en) * 2011-01-12 2012-08-02 Dainippon Printing Co Ltd Semiconductor device, method for manufacturing the same and lighting apparatus
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KR101830716B1 (en) 2011-06-28 2018-02-21 엘지이노텍 주식회사 A light emitting device pakage

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WO2014174873A1 (en) * 2013-04-26 2014-10-30 シャープ株式会社 Semiconductor device and method for manufacturing same

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