JP2008244399A - Light-emitting device - Google Patents

Light-emitting device Download PDF

Info

Publication number
JP2008244399A
JP2008244399A JP2007086727A JP2007086727A JP2008244399A JP 2008244399 A JP2008244399 A JP 2008244399A JP 2007086727 A JP2007086727 A JP 2007086727A JP 2007086727 A JP2007086727 A JP 2007086727A JP 2008244399 A JP2008244399 A JP 2008244399A
Authority
JP
Japan
Prior art keywords
light emitting
lead
light
emitting element
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007086727A
Other languages
Japanese (ja)
Other versions
JP5196107B2 (en
Inventor
Kazuaki Sakai
和明 酒井
Osamu Taruki
統 多留木
Naomasa Koide
直正 小出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2007086727A priority Critical patent/JP5196107B2/en
Publication of JP2008244399A publication Critical patent/JP2008244399A/en
Application granted granted Critical
Publication of JP5196107B2 publication Critical patent/JP5196107B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device improved in yield by reducing the flow-out of an adhesive material with which a protection element is adhered. <P>SOLUTION: The light-emitting device is provided with a light emitting element which is mounted to a first lead; the protection element which is mounted to a second lead via the adhesive material; and a wire which connects the light emitting element and the second lead wherein the surface to which the wire is connected and the surface to which the protection element is mounted have differences in height by a step formed in the second lead. In the other case, the light-emitting device and the protection element are mounted to the first lead via the adhesive material, and the surface to which the light emitting element is mounted and the surface to which the protection element is mounted have differences in height by the step wherein the surface to which light emitting element is mounted is lower than the surface to which the protection element is mounted. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、半導体発光素子を用いた発光装置に関し、特に、静電耐圧向上のための保護素子を搭載した発光装置に関する。   The present invention relates to a light emitting device using a semiconductor light emitting element, and more particularly to a light emitting device equipped with a protective element for improving electrostatic withstand voltage.

近年、高輝度、高出力の半導体発光素子を利用した発光装置が開発され、種々の分野に利用されている。このような発光装置は、小型、低消費電力や軽量等の特徴を生かして、例えば、携帯電話および液晶バックライトの光源、各種メータの光源、信号、照明用途等に利用されている。   In recent years, light-emitting devices using high-luminance and high-power semiconductor light-emitting elements have been developed and used in various fields. Such light emitting devices are utilized for light sources of mobile phones and liquid crystal backlights, light sources of various meters, signals, lighting applications, and the like, taking advantage of features such as small size, low power consumption and light weight.

このような発光素子として用いられるＧａＮやＧａＰ等をはじめとする化合物半導体は、大電圧や逆電圧に対して弱く、静電気や交流電圧の印加により、半導体発光素子が破損、特性が劣化する。   Compound semiconductors such as GaN and GaP used as such a light-emitting element are weak against a large voltage or a reverse voltage, and the semiconductor light-emitting element is damaged and the characteristics are deteriorated by application of static electricity or an alternating voltage.

この問題を解決し、発光装置の内部に保護素子を搭載するために、第１のリードの先端部に湾曲面を有する凹部が形成され、凹部の底面に発光素子チップがマウントされ、凹部の上面の一部に鍔部が設けられ、鍔部の表面に発光素子を保護する保護素子が設けられてなる発光装置がある。   In order to solve this problem and mount the protective element inside the light emitting device, a concave portion having a curved surface is formed at the tip of the first lead, a light emitting element chip is mounted on the bottom surface of the concave portion, and the top surface of the concave portion There is a light-emitting device in which a collar portion is provided in a part of which is provided with a protective element for protecting the light-emitting element on the surface of the collar portion.

また、保護素子を接合するボンディング材がリード上に流れ、ワイヤボンディングの信頼性の低下を防止するために、第２のリードの先端部が分離溝により２つの領域に分離され、発光素子チップが第１のリードの先端部にマウントされると共に、発光素子チップに接続される電極が第２のリードの一方の領域に電気的に接続され、保護素子が第２のリードの先端部の他方の領域にマウントされて発光素子チップを保護するように第１および第２のリードの間に電気的に接続されてなる発光装置がある（特許文献１）。   In addition, the bonding material for bonding the protective element flows on the lead, and the tip of the second lead is separated into two regions by the separation groove in order to prevent the reliability of the wire bonding from being reduced. The electrode connected to the light emitting element chip is mounted on the tip of the first lead and electrically connected to one region of the second lead, and the protective element is connected to the other end of the tip of the second lead. There is a light-emitting device that is mounted in a region and electrically connected between first and second leads so as to protect the light-emitting element chip (Patent Document 1).

特開平１０−２５６６１０号公報JP-A-10-256610

しかし、上記のような発光装置では、保護素子を接合する接着部材が鍔部の上から流れ出すことがある。また、狭いリードの先端部に、接着部材の流れ出しを十分に防止できる深さおよび幅を有する分離溝を設けることは、設計上、困難なことがある。   However, in the light emitting device as described above, an adhesive member that joins the protective element may flow out from the top of the collar. In addition, it may be difficult in design to provide a separation groove having a depth and a width that can sufficiently prevent the adhesive member from flowing out at the tip of a narrow lead.

接着部材が流れ出すと、発光素子が載置される第1のリードに保護素子を載置する場合においては、接着部材ないしは劣化し着色した接着部材に発光素子からの発光が吸収され、光出力に影響を与える等の不具合を生じるおそれがあり、また、第2のリードに保護素子を載置する場合においては、第2のリードに接続されるワイヤの不着が発生するなどして、発光装置の歩留まりが悪化する。   When the adhesive member flows out, in the case where the protective element is placed on the first lead on which the light emitting element is placed, the light emitted from the light emitting element is absorbed by the adhesive member or the deteriorated and colored adhesive member, and the light output is increased. In the case where a protective element is mounted on the second lead, the wire connected to the second lead may not be attached. Yield deteriorates.

本発明はこのような問題に鑑みてなされたものであり、接着部材の流れ出しを容易に低減し、歩留まりのよい発光装置を提供することを目的とする。   The present invention has been made in view of such problems, and an object of the present invention is to provide a light-emitting device that easily reduces the flow of an adhesive member and has a high yield.

以上の目的を達成するため、本発明の発光装置は、第１のリードに載置される発光素子と、第２のリードに接着部材を介して載置される保護素子と、発光素子と第２のリードとを接続するワイヤとを備えており、前記ワイヤが接続される面と、前記保護素子が載置される面とは、第２のリードに設けられた段差による高低差を有している。   In order to achieve the above object, a light emitting device of the present invention includes a light emitting element placed on a first lead, a protection element placed on a second lead via an adhesive member, a light emitting element, And a surface on which the wire is connected and a surface on which the protective element is placed have a height difference due to a step provided on the second lead. ing.

さらに、ワイヤが接続される面よりも低い面に保護素子が載置されていることが好ましい。   Furthermore, it is preferable that the protective element is placed on a surface lower than the surface to which the wire is connected.

また、第1のリードに発光素子および保護素子が接着部材を介して載置され、発光素子が載置される面と、保護素子が載置される面とは、段差により高低差を有しており、発光素子が載置される面よりも低い面に保護素子が載置されていることを特徴とする。   In addition, the light emitting element and the protective element are placed on the first lead through an adhesive member, and the surface on which the light emitting element is placed and the surface on which the protective element is placed have a height difference due to a step. The protective element is mounted on a surface lower than the surface on which the light emitting element is mounted.

また、第1のリードに発光素子および保護素子が接着部材を介して載置され、第1のリードは、発光素子が載置される凹部を有し、凹部の上端の面と、保護素子が載置される面とは、段差による高低差を有しており、段差は凹部の外に設けられていることを特徴とする。   The light emitting element and the protective element are placed on the first lead via an adhesive member, and the first lead has a concave portion on which the light emitting element is placed, and the upper end surface of the concave portion and the protective element are The surface to be placed has a height difference due to a step, and the step is provided outside the recess.

これに加え、保護素子の上面は、凹部の上端の面よりも低くなるよう設けられていることが好ましい。   In addition to this, the upper surface of the protective element is preferably provided so as to be lower than the upper end surface of the recess.

本発明によれば、接着部材の流れ出しを容易に低減でき、歩留まりのよい発光装置とすることができる。   According to the present invention, the flow-out of the adhesive member can be easily reduced, and a light emitting device with a high yield can be obtained.

本発明の発光装置の一つの形態では、第１のリードに発光素子を、第２のリードに接着部材を介して保護素子を載置し、発光素子および保護素子と第１および／または第２のリードとを、それぞれワイヤで接続して構成されており、接着部材の流れ出しによるワイヤの不着を防止するため、ワイヤが接続される面と、保護素子が載置される面とは、段差による高低差を有している。この段差により、接着部材の流れ出しを低減することができ、歩留まりの低下を防止することができる。   In one form of the light emitting device of the present invention, the light emitting element is placed on the first lead, and the protective element is placed on the second lead via an adhesive member, and the light emitting element, the protective element, and the first and / or second In order to prevent non-bonding of the wire due to the flow of the adhesive member, the surface to which the wire is connected and the surface on which the protective element is placed are caused by a step. Has a height difference. This step can reduce the flow-out of the adhesive member and can prevent the yield from decreasing.

また、保護素子は、ワイヤが接続される面よりも低い面に載置されることが好ましい。これにより、ワイヤの接続される面に接着部材が流れ出すことを確実に防止することができる。   Moreover, it is preferable that a protection element is mounted in the surface lower than the surface where a wire is connected. Thereby, it can prevent reliably that an adhesion member flows out to the surface where a wire is connected.

また、本発明の別の形態の発光装置では、発光素子および保護素子が接着部材を介して第1のリードに載置され、発光素子が載置される面と、保護素子が載置される面とは、段差により高低差を有しており、発光素子が載置される面よりも低い面に保護素子が載置されている。これにより、保護素子の接着部材が発光素子の方向へ流れ出すことを確実に防止することができる。   In the light emitting device according to another aspect of the present invention, the light emitting element and the protective element are placed on the first lead via the adhesive member, and the surface on which the light emitting element is placed and the protective element are placed. The surface has a height difference due to a step, and the protective element is placed on a surface lower than the surface on which the light emitting element is placed. Thereby, it can prevent reliably that the adhesive member of a protection element flows out in the direction of a light emitting element.

第1のリードには、発光素子が載置される凹部が設けられており、凹部の外に段差が設けられていることが好ましい。このとき、凹部の上端の面は、凹部内側よりも高くなるため、ここに段差を設け、保護素子を載置する。   It is preferable that the first lead has a recess in which the light emitting element is placed, and a step is provided outside the recess. At this time, since the upper end surface of the recess is higher than the inside of the recess, a step is provided here to place the protective element.

本発明において、段差は、通常、リードの上面（例えば、発光装置の発光方向）の一部に設けられている。   In the present invention, the step is usually provided on a part of the upper surface of the lead (for example, the light emitting direction of the light emitting device).

ワイヤが接続される面および発光素子または保護素子が載置される面は、それぞれ適当な面積と平坦度を有していればよい。また、これらの面を必要に応じて、スタンピングや研磨等を行い、平坦度を高め、ワイヤ、保護素子および発光素子の接合性を高めることができる。   The surface to which the wire is connected and the surface on which the light emitting element or the protection element is placed may have an appropriate area and flatness. Further, these surfaces can be stamped, polished, or the like as necessary to increase the flatness and to improve the bondability of the wire, the protective element, and the light emitting element.

段差の高さの差は、接着部材の厚みや表面張力の強さ、保護素子等に接続されるワイヤの長さや角度等を考慮して適宜決定され、特に限定されるものではない。また、第1のリードに保護素子を載置する場合には、保護素子が発光に影響することを確実に防止するため、保護素子の上面が、発光素子が載置される面または凹部の上端の面よりも低くなるよう設けられることが好ましい。   The difference in height of the step is appropriately determined in consideration of the thickness of the adhesive member, the strength of the surface tension, the length and angle of the wire connected to the protective element, etc., and is not particularly limited. In addition, when the protective element is placed on the first lead, the upper surface of the protective element is placed on the upper surface of the surface on which the light emitting element is placed or the recess in order to reliably prevent the protective element from affecting the light emission. It is preferable to be provided so as to be lower than this surface.

また、後述する封止部材を用いた発光装置に保護素子を搭載する場合、保護素子または発光素子とリードを接続するワイヤが長くなり、発光装置の周囲の温度環境の変化によって、ワイヤが断線しやすくなることがある。つまり、保護素子を発光装置内の高い位置に実装すると、ワイヤの長さが長くなるとともにワイヤの高さが高くなり、ワイヤの下方に配置される封止部材の量が増大する。このため、封止部材が温度変化により膨張、収縮する際、ワイヤにかかる負荷が大きくなり、ワイヤの断線が発生するが、本発明のように、リードに段差を設けることで、ワイヤの高さを低くすることができるため、ワイヤの断線が少なく、信頼性の高い発光装置とすることができる。   In addition, when a protective element is mounted on a light emitting device using a sealing member to be described later, the wire connecting the protective element or the light emitting element and the lead becomes long, and the wire is disconnected due to a change in the temperature environment around the light emitting device. May be easier. That is, when the protective element is mounted at a high position in the light emitting device, the length of the wire is increased and the height of the wire is increased, and the amount of the sealing member disposed below the wire is increased. For this reason, when the sealing member expands and contracts due to a temperature change, the load applied to the wire increases and the wire breaks. However, by providing a step in the lead as in the present invention, the height of the wire is increased. Therefore, a highly reliable light-emitting device with less wire breakage can be obtained.

段差が設けられる位置は、特に限定されず、リードのどの部分に設けられていてもよい。   The position where the step is provided is not particularly limited, and may be provided at any part of the lead.

また、保護素子と、保護素子からのワイヤが接続されるリードとの間には、ワイヤをさえぎる壁等が設けられておらず直接に対向していることが、ワイヤの短絡、断線防止等の観点から好ましいが、種々の目的に応じ、適宜変更することができる。同様の理由で、第2のリードに保護素子が載置されている場合には、保護素子からのワイヤは、第2のリードの上面から適当な高さを経由し、第1のリードの上面に接続されることが好ましい。   In addition, the protection element and the lead to which the wire from the protection element is connected are not directly provided with a wall or the like that blocks the wire. Although it is preferable from the viewpoint, it can be appropriately changed according to various purposes. For the same reason, when the protective element is placed on the second lead, the wire from the protective element passes through an appropriate height from the upper surface of the second lead, and the upper surface of the first lead It is preferable to be connected to.

以下、本発明の実施の形態の各構成について詳述する。   Hereafter, each structure of embodiment of this invention is explained in full detail.

（発光素子）
本発明における発光素子は、半導体発光素子であり、発光ダイオードやレーザダイオード等を用いることができる。 (Light emitting element)
The light-emitting element in the present invention is a semiconductor light-emitting element, and a light-emitting diode, a laser diode, or the like can be used.

発光素子の組成としては、例えば、基板上に、ＩｎＮ、ＡｌＮ、ＧａＮ、ＺｎＳ、ＺｎＳｅ、ＳｉＣ、ＧａＰ、ＧａＡｌＡｓ、ＧａＡｓＰ、ＩｎＧａＮ、ＡｌＧａＮ、ＡｌＧａＩｎＰ、ＡｌＩｎＧａＮ等の半導体を活性層として形成させた物が挙げられる。半導体材料およびその混晶度等によって発光波長を紫外光から赤外光まで選択することができる。   As a composition of the light emitting element, for example, a substrate in which a semiconductor such as InN, AlN, GaN, ZnS, ZnSe, SiC, GaP, GaAlAs, GaAsP, InGaN, AlGaN, AlGaInP, and AlInGaN is formed as an active layer on a substrate. Can be mentioned. The emission wavelength can be selected from ultraviolet light to infrared light depending on the semiconductor material and the degree of mixed crystal thereof.

このような発光素子は、第１のリードに直接的または間接的に載置される。発光素子をリードに接合、載置するためには、後述する接着部材が用いられる。   Such a light emitting element is mounted directly or indirectly on the first lead. In order to bond and place the light emitting element on the lead, an adhesive member described later is used.

また、発光素子は、必要に応じて、サブマウントのような補助的な支持体を介して間接的に載置されてもよい。   In addition, the light emitting element may be mounted indirectly via an auxiliary support such as a submount as necessary.

（保護素子）
保護素子は、過電圧、サージ電流等から発光素子を保護するものである。 (Protective element)
The protection element protects the light emitting element from overvoltage, surge current, and the like.

保護素子は、特に限定されるものではなく、発光装置に搭載される公知のもののいずれでもよい。例えば、発光素子に印加される逆方向の電圧を短絡したり、発光素子の動作電圧より高い所定の電圧以上の順方向電圧を短絡したりさせることができる素子、つまり、過電圧、過電流、保護回路、静電保護素子等が挙げられる。具体的には、ツェナーダイオード、トランジスタのダイオード等が利用できる。保護素子は、上面と下面に電極を有していてもよく、一面側に二つの電極を有していてもよい。   The protective element is not particularly limited, and may be any known element mounted on the light emitting device. For example, an element capable of short-circuiting a reverse voltage applied to the light-emitting element or short-circuiting a forward voltage higher than a predetermined voltage higher than the operating voltage of the light-emitting element, that is, overvoltage, overcurrent, protection A circuit, an electrostatic protection element, etc. are mentioned. Specifically, a Zener diode, a transistor diode, or the like can be used. The protective element may have electrodes on the upper surface and the lower surface, or may have two electrodes on one surface side.

保護素子は、後述する接着部材によってリードに接合、載置される。   The protective element is bonded and placed on the lead by an adhesive member described later.

本発明の発光装置では、発光素子または保護素子は２つ以上搭載されていてもよい。   In the light emitting device of the present invention, two or more light emitting elements or protective elements may be mounted.

また、発光素子および保護素子は、別々の工程で接着してもよいが、接着の際の熱履歴等の影響を低減するため、同時に接着されることが好ましい。例えば、発光素子および保護素子を、Ａｕ−Ｓｕ粒子とフラックスを混合したペースト状の接着部材上にそれぞれ仮固定し、リフローすることにより、発光素子および保護素子を同時に接着することができる。   Further, the light emitting element and the protective element may be bonded in separate steps, but are preferably bonded at the same time in order to reduce the influence of thermal history and the like during bonding. For example, the light emitting element and the protective element can be bonded simultaneously by temporarily fixing and reflowing the light emitting element and the protective element on a paste-like adhesive member in which Au—Su particles and a flux are mixed.

（接着部材）
接着部材は、はじめ液状ないしペースト状等の流動性を有し、熱や光等によって硬化する、ないしは加熱溶融後に硬化する材料で、保護素子または発光素子をリードに接合、載置するための部材である。その材料は、具体的には、エポキシやシリコーン等の樹脂、Ａｕ−Ｓｎ等の共晶、はんだ、低融点金属等を用いることができる。保護素子または発光素子の上下両面に電極が形成されている場合には、樹脂にＡｇ、Ａｕ、Ｐｄ等の導電性部材を含有させたペースト、はんだ、共晶等の導電性の材料を用い、リードと導通をとることもできる。 (Adhesive member)
The adhesive member is a material that has fluidity such as liquid or pasty form and is cured by heat or light, or is cured after heating and melting, and is a member for bonding and mounting the protective element or light emitting element on the lead. It is. Specifically, a resin such as epoxy or silicone, a eutectic such as Au—Sn, solder, a low melting point metal, or the like can be used as the material. When electrodes are formed on the upper and lower surfaces of the protective element or the light emitting element, a conductive material such as paste, solder, or eutectic containing a conductive member such as Ag, Au, or Pd in a resin is used. It can also be connected to the lead.

（リード）
第1および第２のリードは、発光素子と保護素子とを載置する機能ならびに発光装置外部と発光素子とを電気的に接続する機能を果たす。従ってこれらの機能を果たすことができるものであれば、その材料は特に限定されないが、熱伝導率の比較的大きな材料で形成することが好ましい。例えば、２００Ｗ／（ｍ・Ｋ）程度以上の熱伝導率を有しているもの、比較的大きい機械的強度を有するもの、あるいは打ち抜きプレス加工またはエッチング加工等が容易な材料が好ましい。例えば、Ｃｕ、Ａｌ、Ａｕ、Ａｇ、Ｗ、Ｆｅ、Ｎｉ等の金属またはこれらの合金、燐青銅、Ｆｅ入りＣｕ等あるいはこれらの表面にＡｇ、Ａｌ、Ｃｕ、Ａｕ等のメッキが施されたもの等が挙げられる。 (Lead)
The first and second leads have a function of placing the light emitting element and the protective element and a function of electrically connecting the light emitting device exterior and the light emitting element. Accordingly, the material is not particularly limited as long as it can perform these functions, but it is preferably formed of a material having a relatively high thermal conductivity. For example, a material having a thermal conductivity of about 200 W / (m · K) or more, a material having a relatively large mechanical strength, or a material that can be easily stamped or etched is preferable. For example, metals such as Cu, Al, Au, Ag, W, Fe, Ni or alloys thereof, phosphor bronze, Fe-containing Cu, etc., or surfaces thereof plated with Ag, Al, Cu, Au, etc. Etc.

第1のリードには、凹部が形成され、凹部内に発光素子が載置されていることが好ましい。凹部は、少なくとも発光素子が載置できる底面積を有していればよく、その深さは、発光素子の高さ以上であることが好ましい。また、側面は、垂直であってもよいが、底面に向かって狭くなるように傾斜していることが好ましい。例えば、底面に対する法線方向に０〜４５°程度、２０〜４０°程度で傾斜していることが適している。これにより、発光素子からの光を効率的に上方に導くことができる。また、凹部内には後述する透光性部材が充填されていることが好ましい。   The first lead is preferably formed with a recess, and the light emitting element is placed in the recess. The recess only needs to have at least a bottom area on which the light emitting element can be placed, and the depth is preferably equal to or higher than the height of the light emitting element. The side surface may be vertical, but is preferably inclined so as to become narrower toward the bottom surface. For example, it is suitable to incline at about 0 to 45 ° or about 20 to 40 ° in the normal direction with respect to the bottom surface. Thereby, the light from the light emitting element can be efficiently guided upward. Moreover, it is preferable that the translucent member mentioned later is filled in the recessed part.

上記第１および第２のリードは、例えば、ＦｅまたはＣｕからなる厚さが０.４〜０.５ｍｍ程度の板状体を、打ち抜いて成形することができる。その際、一方のリードの上部を段差を有する形状に打ち抜くことで、段差を容易に形成することができる。   The first and second leads can be formed by punching a plate-like body having a thickness of about 0.4 to 0.5 mm made of Fe or Cu, for example. At that time, the step can be easily formed by punching the upper part of one lead into a shape having a step.

その後、任意の形状に成形したリードフレームを、第１のリードの上面側から円錐状のポンチによりスタンピングすることにより、その上面に凹部が形成される。通常、製造段階においては、第１および第２のリードの下端部はリードフレームの枠部で連結されている。   Thereafter, the lead frame molded into an arbitrary shape is stamped by a conical punch from the upper surface side of the first lead, whereby a recess is formed on the upper surface. Normally, at the manufacturing stage, the lower ends of the first and second leads are connected by a frame portion of the lead frame.

また、第１および第２のリードは、板状体を屈曲して形成されていてもよい。このとき、第１のリードに凹部が設けられ、その凹部の外周全部または一部を取り囲む平坦な領域が形成されていてもよい。その場合、平坦な領域の一部を屈曲またはスタンピングすることで、段差を容易に形成することができる。   Further, the first and second leads may be formed by bending a plate-like body. At this time, a recess may be provided in the first lead, and a flat region surrounding all or part of the outer periphery of the recess may be formed. In that case, a step can be easily formed by bending or stamping a part of the flat region.

なお、第１および第２のリードの上面は、同じ高さであってもよいが、ワイヤのループを低くできるよう、また種々の目的に応じて適宜変更することができる。   The top surfaces of the first and second leads may be the same height, but can be appropriately changed according to various purposes so that the wire loop can be lowered.

（ワイヤ）
発光素子および保護素子は、ワイヤによって、各リードと電気的な接続を有している。 (Wire)
The light emitting element and the protective element have an electrical connection with each lead by a wire.

ワイヤの材料としては、発光素子の電極とのオーミック性が良好であるか、機械的接続性が良好であるか、電気伝導性および熱伝導性が良好なものであることが好ましい。作業性等を考慮し、ワイヤの直径は、１０μｍ〜４５μｍ程度であることが好ましい。このようなワイヤとしては、例えば、Ａｕ、Ｃｕ、Ｐｔ、Ａｌ等の金属およびそれらの合金が挙げられる。   As a material of the wire, it is preferable that the ohmic property with the electrode of the light-emitting element is good, the mechanical connectivity is good, or the electrical conductivity and the thermal conductivity are good. Considering workability and the like, the diameter of the wire is preferably about 10 μm to 45 μm. Examples of such wires include metals such as Au, Cu, Pt, and Al, and alloys thereof.

第１のリードに保護素子が載置されている場合には、保護素子からのワイヤのループトップ（ワイヤの最も高い部分）は、第２のリードより第１のリードに近い位置に設けられていることが好ましく、保護素子の直上に設けられていることがさらに好ましい。発光素子からのワイヤは、発光素子の上面の電極に接続され、発光素子上方において、第２のリードに接続される位置よりも高い位置にループトップを形成した後、第２のリードに接続されるため、ワイヤの高さは、発光素子に近いほど高く、第２のリードに近づくにつれて低くなる。よって、保護素子からのワイヤのループトップを、発光素子に近く、発光素子からのワイヤが高い位置に設けることにより、保護素子からのワイヤが最も高い部分においても、発光素子からのワイヤとの距離を十分にとることができるため、ワイヤ同士の接触や短絡を有効に防止できる。   When the protective element is placed on the first lead, the loop top (the highest part of the wire) of the wire from the protective element is provided at a position closer to the first lead than the second lead. It is preferable that the protective element is provided immediately above the protective element. The wire from the light emitting element is connected to the electrode on the upper surface of the light emitting element, and after the loop top is formed at a position higher than the position connected to the second lead above the light emitting element, the wire is connected to the second lead. Therefore, the height of the wire is higher as it is closer to the light emitting element, and is lower as it approaches the second lead. Therefore, by providing the loop top of the wire from the protective element close to the light emitting element and at a position where the wire from the light emitting element is high, the distance from the light emitting element to the wire even at the highest portion of the wire from the protective element Therefore, contact between wires and a short circuit can be effectively prevented.

なお、保護素子からのワイヤは、第1のリードの発光素子が載置される面または発光素子からのワイヤが接続される第2のリードの面と、異なる高さに接続されていてもよい。このことにより、ワイヤ同士の接触、短絡を有効に防止できる。さらに、保護素子および保護素子からのワイヤが接続される面を、ともに低い位置に設けることで、ワイヤを低くすることができ、信頼性の高い発光装置とできる。この場合、ワイヤが接続される面は、上述したものと同様の段差を形成すること、第1または第2のいずれかのリードを切り欠くこと、スタンピングすること等によって形成することができる。   Note that the wire from the protective element may be connected to a different height from the surface on which the light emitting element of the first lead is placed or the surface of the second lead to which the wire from the light emitting element is connected. . This can effectively prevent contact and short circuit between wires. Furthermore, by providing both the protective element and the surface to which the wire from the protective element is connected at a low position, the wire can be lowered and a highly reliable light-emitting device can be obtained. In this case, the surface to which the wire is connected can be formed by forming a step similar to that described above, cutting out either the first or second lead, stamping, or the like.

本発明の発光装置は、その他の部材を備えていてもよい。   The light emitting device of the present invention may include other members.

（封止部材）
封止部材は、発光素子や保護素子等を外部から保護するために設けられる、透光性の部材である。封止部材は、発光素子、保護素子、ワイヤ、第1および第2のリードの一部を封止するよう、形成される。 (Sealing member)
The sealing member is a translucent member provided to protect the light emitting element, the protective element, and the like from the outside. The sealing member is formed so as to seal a part of the light emitting element, the protective element, the wire, and the first and second leads.

その材料としては、具体的には、エポキシ樹脂、シリコーン樹脂、アクリル樹脂、ポリカーボネート樹脂、非晶質ポリオレフィン樹脂、ポリスチレン樹脂、ノルボルネン系樹脂、シクロオレフィンポリマー（ＣＯＰ）、硝子等が挙げられる。なお、透光性とは、発光素子から出射された光を７０％程度以上、８０％程度以上、９０％程度以上、９５％程度以上透過させる性質を意味する。封止部材の大きさおよび形状は特に限定されるものではなく、例えば、円柱、楕円柱、球、卵形、三角柱、四角柱、多角柱又はこれらに近似する形状等どのような形状であってもよい。   Specific examples of the material include epoxy resin, silicone resin, acrylic resin, polycarbonate resin, amorphous polyolefin resin, polystyrene resin, norbornene resin, cycloolefin polymer (COP), and glass. Note that the light-transmitting property means a property of transmitting light emitted from the light emitting element to about 70% or more, about 80% or more, about 90% or more, or about 95% or more. The size and shape of the sealing member are not particularly limited. For example, the sealing member may have any shape such as a cylinder, an elliptical column, a sphere, an oval, a triangular column, a quadrangular column, a polygonal column, or a shape similar to these. Also good.

また、封止部材には、視野角の調整、指向性の緩和、発光の収束、拡散等種々の目的に応じて、拡散剤、蛍光物質、染料、顔料等を含有させてもよく、二種類以上の含有物、例えば拡散剤と蛍光物質を共に含有させてもよい。拡散剤は、光を拡散させるものであり、発光素子からの指向性を緩和させ、視野角を増大させることができる。蛍光物質は、発光素子からの光を変換させるものであり、発光素子から発光装置の外部へ出射される光の波長を変換することができる。例えば青色光を発する発光素子を利用する場合には、ＹＡＧ：Ｃｅ、Ｅｕおよび／またはＣｒで賦活された窒素含有ＣａＯ−Ａｌ２Ｏ３−ＳｉＯ２等の蛍光物質が種々好適に用いられる。 In addition, the sealing member may contain a diffusing agent, a fluorescent substance, a dye, a pigment, and the like according to various purposes such as adjustment of viewing angle, relaxation of directivity, convergence of light emission, and diffusion. The above-mentioned inclusions, for example, a diffusing agent and a fluorescent substance may be contained together. The diffusing agent diffuses light and can reduce the directivity from the light emitting element and increase the viewing angle. The fluorescent substance converts light from the light emitting element, and can convert the wavelength of light emitted from the light emitting element to the outside of the light emitting device. For example, when a light-emitting element that emits blue light is used, various fluorescent materials such as nitrogen-containing CaO—Al 2 O 3 —SiO 2 activated with YAG: Ce, Eu, and / or Cr are suitably used.

（透光性部材）
透光性部材は、第1のリードに設けられた凹部内に充填され、発光素子を被覆する透光性の部材である。前述した封止部材と同じ材料であってもよいが、ワイヤにかかる応力を緩和し、ワイヤの断線を少なくするため、ＳｉＯ２、ＴｉＯ２等のフィラーを添加してもよい。 (Translucent member)
The translucent member is a translucent member that fills the recess provided in the first lead and covers the light emitting element. Although the same material as the sealing member described above may be used, a filler such as SiO 2 or TiO 2 may be added in order to relieve stress applied to the wire and reduce wire breakage.

透光性部材は発光素子の近傍に位置するため、耐光性の高い材料を用いることが好ましい。具体的には、シリコーン樹脂や無機樹脂等の材料が挙げられる。   Since the translucent member is located in the vicinity of the light emitting element, it is preferable to use a material having high light resistance. Specific examples include materials such as silicone resins and inorganic resins.

以下、本発明に係る実施例について詳述する。   Examples according to the present invention will be described in detail below.

（実施例１）
この実施例の発光装置１１０は、図１（ａ）に示すように、封止部材１０７の下方から第１のリード１０３および第２のリード１０４が突出するように構成された砲弾型の発光装置である。 Example 1
As shown in FIG. 1A, the light emitting device 110 of this embodiment is a shell-type light emitting device configured such that the first lead 103 and the second lead 104 protrude from below the sealing member 107. It is.

青色光を発する発光素子１０１は、Ｆｅ入りＣｕにＡｇメッキを施した第１のリード１０３に形成された凹部内に、Ａｕ−Ｓｎ共晶を介して載置され、一つの電極はＡｕからなるワイヤ１０９ａにより、第２のリード１０４と電気的に接続されている。発光素子１０１は絶縁性のサファイア基板上にＧａＮを積層して形成され、上面に二つの電極を有しており、もう片方の電極は別のワイヤにより第１のリード１０３の上面に接続されている。   The light emitting element 101 that emits blue light is placed via a Au—Sn eutectic in a recess formed in the first lead 103 in which Ag-plated Cu containing Fe is included, and one electrode is made of Au. The wire 109a is electrically connected to the second lead 104. The light emitting element 101 is formed by laminating GaN on an insulating sapphire substrate, has two electrodes on the upper surface, and the other electrode is connected to the upper surface of the first lead 103 by another wire. Yes.

第２のリード１０４は、その上面の一部に段差１０５が設けられ、発光素子１０１からのワイヤ１０８が接続される面１０５ａと、それより低い、保護素子１０２が載置される面１０５ｂとを有している。保護素子１０２は、接着部材である導電性のＡｇペースト１０６を介して載置されている。保護素子１０２は、ツェナーダイオードであり、電極が上下両面にあるものを用いている。保護素子１０２の第２のリード１０３に接する底面は電極であり、接着部材１０６により第２のリード１０３と電気的に接続されている。保護素子１０２の上面の電極は、ワイヤによって第１のリード１０３の上面と電気的に接続されている。保護素子が載置される面１０５ｂと、ワイヤが接続される面１０５ａに近接するリードの側面が接する段差の隅部１０５ｃは、段差を形成する打ち抜きの際に、バリが発生すること防止するため、丸みを帯びている。   The second lead 104 is provided with a step 105 on a part of its upper surface, and includes a surface 105a to which the wire 108 from the light emitting element 101 is connected and a surface 105b on which the protection element 102 is placed, which is lower than the surface 105a. Have. The protective element 102 is placed via a conductive Ag paste 106 that is an adhesive member. The protection element 102 is a Zener diode, and electrodes having electrodes on both upper and lower sides are used. The bottom surface of the protection element 102 that is in contact with the second lead 103 is an electrode, and is electrically connected to the second lead 103 by an adhesive member 106. The electrode on the upper surface of the protection element 102 is electrically connected to the upper surface of the first lead 103 by a wire. The step 105a where the surface 105b on which the protective element is placed and the side surface of the lead adjacent to the surface 105a to which the wire is connected is in contact with the surface 105a to prevent the occurrence of burrs when punching to form the step. , Rounded.

本実施例で使用した保護素子１０２の高さは約１４０μｍであり、段差の高さの差は約１５０μｍである。なお、保護素子１０２の底面に配置された接着部材１０６の厚みは約１０μｍである。   The height of the protective element 102 used in this example is about 140 μm, and the difference in height of the step is about 150 μm. The thickness of the adhesive member 106 disposed on the bottom surface of the protective element 102 is about 10 μm.

保護素子１０２からのワイヤは、保護素子１０２の直上１５０μｍ程度の位置でループトップを形成し、第１のリード１０３の上面に接続されている。発光素子１０１からのワイヤ１０８は、第２のリード１０４に接続されている。   The wire from the protection element 102 forms a loop top at a position of about 150 μm immediately above the protection element 102, and is connected to the upper surface of the first lead 103. A wire 108 from the light emitting element 101 is connected to the second lead 104.

この発光装置１１０は、次のようにして形成できる。   The light emitting device 110 can be formed as follows.

まず、金属板を打ち抜き、第１のリード１０３および第２のリード１０４を形成する。その際、第２のリード１０４の上面を、第１のリード１０３に近接する側が高く、かつその隅部が丸みを帯びている段差を有する形状に打ち抜き、ワイヤが接続される面１０５ａと保護素子が載置される面１０５ｂとを形成する。その後、第1のリード１０３の上面を円錐形のポンチにてスタンピングして凹部を形成した後、ワイヤが接続される面１０５ａをスタンピングし、平坦度を向上させる。   First, the metal plate is punched to form the first lead 103 and the second lead 104. At that time, the upper surface of the second lead 104 is punched into a shape having a step which is high on the side close to the first lead 103 and has rounded corners, and the surface 105a to which the wire is connected and the protective element Are formed on the surface 105b. Thereafter, the upper surface of the first lead 103 is stamped with a conical punch to form a recess, and then the surface 105a to which the wire is connected is stamped to improve the flatness.

次に、凹部の底面に、発光素子１０１をＡｕ−Ｓｕ共晶を介して載置し、その後、保護素子が載置される面１０５ｂに、保護素子１０２を、接着部材１０６を介して載置する。   Next, the light emitting element 101 is placed on the bottom surface of the concave portion via the Au—Su eutectic, and then the protective element 102 is placed on the surface 105 b on which the protective element is placed via the adhesive member 106. To do.

そして、発光素子１０１とワイヤが接続される面１０５a、保護素子１０２と第1のリード１０３の上面をそれぞれＡｕのワイヤ１０８ａおよび１０８ｂで接続し、電気的に接続する。   Then, the surface 105a to which the light emitting element 101 is connected to the wire, and the protection element 102 and the upper surface of the first lead 103 are connected by Au wires 108a and 108b, respectively, to be electrically connected.

その後、発光素子１０１が収容されている凹部に、ＹＡＧ：Ｃｅ蛍光体およびＳｉＯ２のフィラーを含有する透光性部材としてのシリコーン樹脂（図示せず）を充填、硬化させる。その後、このリードフレームを透光性のエポキシ樹脂が充填された樹脂製のキャスティングケースに挿入、熱硬化させ、封止部材１０７を形成する。 Thereafter, a concave portion in which the light emitting element 101 is accommodated is filled and cured with a silicone resin (not shown) as a translucent member containing a YAG: Ce phosphor and a SiO 2 filler. Thereafter, the lead frame is inserted into a resin casting case filled with a translucent epoxy resin and thermally cured to form the sealing member 107.

本実施例では、青色光を発する発光素子と、発光素子から放出された青色光を吸収、波長変換し黄色光を発する蛍光物質を用いることにより、白色系に発光する発光装置としている。   In this embodiment, a light-emitting device that emits white light is formed by using a light-emitting element that emits blue light and a fluorescent material that absorbs blue light emitted from the light-emitting element, converts the wavelength, and emits yellow light.

本実施例では、ワイヤが接続される面１０５ａより低い面に保護素子１０２を載置することで、接着部材１０６が、ワイヤ１０８ａの接続される面１０５ａに流れ出すことがなく、ワイヤの不着を防止することができる。   In this embodiment, the protective element 102 is placed on a surface lower than the surface 105a to which the wire is connected, so that the adhesive member 106 does not flow out to the surface 105a to which the wire 108a is connected, thereby preventing the non-bonding of the wire. can do.

（実施例２）
本実施例の発光装置は、図２に示すように、第1のリード２０３に発光素子２０１および保護素子２０２が載置されている。第１のリード２０３に設けられた凹部内に発光素子２０１が載置されており、凹部の外に凹部の上端の面２０５ｄよりも低い、保護素子が載置される面２０５ｂを有している。保護素子２０２は、実施例１と同様に上下両面に電極を有し、Ａｕ−Ｓｕ共晶の接着部材２０６により下面の電極と第１のリード２０３が電気的に接続され、上面の電極と第２のリード２０４の上面が、ワイヤによって接続されている。この場合でも、実施例１と同様に、接着部材の流れ出しを防止することができる。 (Example 2)
In the light emitting device of this embodiment, as shown in FIG. 2, a light emitting element 201 and a protective element 202 are placed on a first lead 203. The light emitting element 201 is placed in a concave portion provided in the first lead 203, and has a surface 205b on which a protective element is placed outside the concave portion, which is lower than the upper surface 205d of the concave portion. . The protective element 202 has electrodes on both the upper and lower surfaces as in the first embodiment, and the lower electrode and the first lead 203 are electrically connected by the Au—Su eutectic adhesive member 206, and the upper electrode and the first electrode 203 are electrically connected. The upper surfaces of the two leads 204 are connected by wires. Even in this case, similarly to the first embodiment, it is possible to prevent the adhesive member from flowing out.

実施例３
本実施例の発光装置３１０は、図３に示すように、第１のリード３０３および第２のリード３０４は、金属板を屈曲して形成されている。凹部の上端の面３０５ｄおよび保護素子が載置される面３０５ｂは、第1のリード３０１の一部を屈曲して形成され、凹部の上端の面３０５ｄより低い保護素子が載置される面３０５ｂに、接着部材３０６を介して保護素子３０２が載置されるとともに、これらが封止部材３０７により一体に封止されている。 Example 3
In the light emitting device 310 of the present embodiment, as shown in FIG. 3, the first lead 303 and the second lead 304 are formed by bending a metal plate. The upper surface 305d of the recess and the surface 305b on which the protection element is placed are formed by bending a part of the first lead 301, and the surface 305b on which the protection element lower than the upper surface 305d of the recess is placed. In addition, the protective element 302 is placed via the adhesive member 306, and these are integrally sealed by the sealing member 307.

この場合も、実施例１および２と同様の効果が得られる。   In this case, the same effect as in the first and second embodiments can be obtained.

本発明の発光装置は、照明用光源、各種インジケーター用光源、車載用光源、ディスプレイ用光源、液晶のバックライト用光源、信号機、車載部品、看板用チャンネルレター等、種々の光源に使用することができる。   The light-emitting device of the present invention can be used for various light sources such as illumination light sources, various indicator light sources, in-vehicle light sources, display light sources, liquid crystal backlight light sources, traffic lights, in-vehicle components, signboard channel letters, and the like. it can.

本発明にかかる発光装置の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the light-emitting device concerning this invention. 本発明にかかる発光装置の一例を示す部分拡大図である。It is the elements on larger scale which show an example of the light-emitting device concerning this invention. 本発明にかかる発光装置の一例を示す部分断面図である。It is a fragmentary sectional view which shows an example of the light-emitting device concerning this invention. 本発明にかかる発光装置の一例を示す断面図である。It is sectional drawing which shows an example of the light-emitting device concerning this invention.

符号の説明Explanation of symbols

１０１、２０１、３０１ 発光素子
１０２、２０２、３０２ 保護素子
１０３、２０３、３０３ 第１のリード
１０４、２０４、３０４ 第２のリード
１０５ 段差
１０５ａ ワイヤが接続される面
１０５ｂ、２０５ｂ、３０５ｂ 保護素子が載置される面
１０５ｃ 隅部
２０５ｄ、３０５ｄ 凹部の上端の面
１０６、２０６、３０６ 接着部材
１０７、３０７ 封止部材
１０８ ワイヤ
１１０、３１０ 発光装置 101, 201, 301 Light emitting element 102, 202, 302 Protection element 103, 203, 303 First lead 104, 204, 304 Second lead 105 Step 105a Surface to which wire is connected 105b, 205b, 305b Protection element is mounted Placed surface 105c Corner portion 205d, 305d Top surface of recess 106, 206, 306 Adhesive member 107, 307 Sealing member 108 Wire 110, 310 Light emitting device

Claims (5)

第１のリードに載置される発光素子と、
第２のリードに接着部材を介して載置される保護素子と、
前記発光素子と前記第２のリードとを接続するワイヤとを備えており、
前記ワイヤが接続される面と、前記保護素子が載置される面とは、前記第２のリードに設けられた段差による高低差を有していることを特徴とする発光装置。 A light emitting device mounted on the first lead;
A protective element placed on the second lead via an adhesive member;
A wire connecting the light emitting element and the second lead;
The light emitting device according to claim 1, wherein a surface to which the wire is connected and a surface on which the protection element is placed have a height difference due to a step provided on the second lead. 前記ワイヤが接続される面よりも低い面に前記保護素子が載置されていることを特徴とする請求項１に記載の発光装置。 The light emitting device according to claim 1, wherein the protective element is placed on a surface lower than a surface to which the wire is connected. 第1のリードに発光素子および保護素子が接着部材を介して載置され、
前記発光素子が載置される面と、前記保護素子が載置される面とは、段差による高低差を有しており、前記発光素子が載置される面よりも低い面に前記保護素子が載置されていることを特徴とする発光装置。 The light emitting element and the protective element are placed on the first lead via an adhesive member,
The surface on which the light emitting element is placed and the surface on which the protective element is placed have a height difference due to a step, and the protective element is on a surface lower than the surface on which the light emitting element is placed. Is mounted, a light emitting device. 第1のリードに発光素子および保護素子が接着部材を介して載置され、
前記第1のリードは、前記発光素子が載置される凹部を有し、
前記凹部の上端の面と、前記保護素子が載置される面とは、
段差による高低差を有しており、前記段差は前記凹部の外に設けられていることを特徴とする発光装置。 The light emitting element and the protective element are placed on the first lead via an adhesive member,
The first lead has a recess in which the light emitting element is placed,
The top surface of the recess and the surface on which the protection element is placed are:
A light emitting device having a height difference due to a step, and the step is provided outside the recess. 前記保護素子の上面は、前記凹部の上端の面よりも低くなるよう設けられていることを特徴とする請求項４に記載の発光装置。 The light emitting device according to claim 4, wherein an upper surface of the protection element is provided to be lower than a top surface of the recess.
JP2007086727A 2007-03-29 2007-03-29 Light emitting device Active JP5196107B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007086727A JP5196107B2 (en) 2007-03-29 2007-03-29 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007086727A JP5196107B2 (en) 2007-03-29 2007-03-29 Light emitting device

Publications (2)

Publication Number Publication Date
JP2008244399A true JP2008244399A (en) 2008-10-09
JP5196107B2 JP5196107B2 (en) 2013-05-15

Family

ID=39915318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007086727A Active JP5196107B2 (en) 2007-03-29 2007-03-29 Light emitting device

Country Status (1)

Country Link
JP (1) JP5196107B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040613A (en) * 2008-07-31 2010-02-18 Nichia Corp Light-emitting device
JP2014022491A (en) * 2012-07-17 2014-02-03 Citizen Holdings Co Ltd Semiconductor light-emitting device and manufacturing method of the same
WO2016047130A1 (en) * 2014-09-22 2016-03-31 旭化成エレクトロニクス株式会社 Hall sensor and lens module

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045640U (en) * 1990-04-27 1992-01-20
JPH05175553A (en) * 1991-12-20 1993-07-13 Sanyo Electric Co Ltd Light emitting diode device
JPH0715046A (en) * 1993-06-25 1995-01-17 Matsushita Electric Works Ltd Injection molded printed board
JPH09252080A (en) * 1996-03-15 1997-09-22 Mitsubishi Electric Corp High-frequency integrated circuit
JPH09283790A (en) * 1996-04-16 1997-10-31 Toshiba Corp Stereoscopic wiring-type optical bonding device and reflection-type optical bonding device
JPH10256610A (en) * 1997-01-10 1998-09-25 Rohm Co Ltd Semiconductor light emitting device
JPH1154799A (en) * 1997-07-30 1999-02-26 Rohm Co Ltd Semiconductor light emitting device
JP2002314146A (en) * 2001-04-12 2002-10-25 Toyoda Gosei Co Ltd Led lamp
JP2004111937A (en) * 2002-08-30 2004-04-08 Nichia Chem Ind Ltd Light-emitting device
JP2004207688A (en) * 2002-12-09 2004-07-22 Nichia Chem Ind Ltd Light emitting device and planar light source using the same
JP2005019663A (en) * 2003-06-26 2005-01-20 Nichia Chem Ind Ltd Light emitting device and its fabricating process
JP2007043175A (en) * 2005-08-02 2007-02-15 Samsung Electro-Mechanics Co Ltd Side type light emitting diode including protective element

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045640U (en) * 1990-04-27 1992-01-20
JPH05175553A (en) * 1991-12-20 1993-07-13 Sanyo Electric Co Ltd Light emitting diode device
JPH0715046A (en) * 1993-06-25 1995-01-17 Matsushita Electric Works Ltd Injection molded printed board
JPH09252080A (en) * 1996-03-15 1997-09-22 Mitsubishi Electric Corp High-frequency integrated circuit
JPH09283790A (en) * 1996-04-16 1997-10-31 Toshiba Corp Stereoscopic wiring-type optical bonding device and reflection-type optical bonding device
JPH10256610A (en) * 1997-01-10 1998-09-25 Rohm Co Ltd Semiconductor light emitting device
JPH1154799A (en) * 1997-07-30 1999-02-26 Rohm Co Ltd Semiconductor light emitting device
JP2002314146A (en) * 2001-04-12 2002-10-25 Toyoda Gosei Co Ltd Led lamp
JP2004111937A (en) * 2002-08-30 2004-04-08 Nichia Chem Ind Ltd Light-emitting device
JP2004207688A (en) * 2002-12-09 2004-07-22 Nichia Chem Ind Ltd Light emitting device and planar light source using the same
JP2005019663A (en) * 2003-06-26 2005-01-20 Nichia Chem Ind Ltd Light emitting device and its fabricating process
JP2007043175A (en) * 2005-08-02 2007-02-15 Samsung Electro-Mechanics Co Ltd Side type light emitting diode including protective element

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040613A (en) * 2008-07-31 2010-02-18 Nichia Corp Light-emitting device
JP2014022491A (en) * 2012-07-17 2014-02-03 Citizen Holdings Co Ltd Semiconductor light-emitting device and manufacturing method of the same
WO2016047130A1 (en) * 2014-09-22 2016-03-31 旭化成エレクトロニクス株式会社 Hall sensor and lens module
JPWO2016047130A1 (en) * 2014-09-22 2017-04-27 旭化成エレクトロニクス株式会社 Hall sensor and lens module

Also Published As

Publication number Publication date
JP5196107B2 (en) 2013-05-15

Similar Documents

Publication Publication Date Title
JP5023781B2 (en) Light emitting device
US7771093B2 (en) Light emitting device
JP4826470B2 (en) Light emitting device
JP2008060344A (en) Semiconductor light-emitting device
JP4961978B2 (en) Light emitting device and manufacturing method thereof
JP2009065002A (en) Light-emitting apparatus
JP5458910B2 (en) Light emitting device
US9246074B2 (en) Light emitting device
JP2007066939A (en) Semiconductor light emitting device
JP6947995B2 (en) Light emitting device
JP4940900B2 (en) Mounting parts and semiconductor devices
JP5256591B2 (en) Light emitting device
JP5125060B2 (en) Light emitting device
JP6107229B2 (en) Light emitting device
JP2012054280A (en) Light-emitting device
JP2007280983A (en) Light-emitting device
JP5196107B2 (en) Light emitting device
JP5206204B2 (en) Light emitting device
JP2008160091A (en) Light-emitting device
JP6191214B2 (en) Light emitting device
JP5701843B2 (en) Light emitting device
JP2007317956A (en) Light-emitting device
KR20120020601A (en) Light emitting device and lighting system
JP5392059B2 (en) Semiconductor device
KR20120111757A (en) Light emitting device package

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100316

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120201

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120612

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120803

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120904

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121128

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20121205

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130109

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130122

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160215

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5196107

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160215

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250