JP2010040223A - Lamp apparatus - Google Patents

Lamp apparatus Download PDF

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Publication number
JP2010040223A
JP2010040223A JP2008199037A JP2008199037A JP2010040223A JP 2010040223 A JP2010040223 A JP 2010040223A JP 2008199037 A JP2008199037 A JP 2008199037A JP 2008199037 A JP2008199037 A JP 2008199037A JP 2010040223 A JP2010040223 A JP 2010040223A
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Prior art keywords
lighting circuit
led
circuit board
element substrate
main body
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JP2008199037A
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Inventor
Nobuya Shirata
伸弥 白田
Tsutomu Araki
努 荒木
Hirokazu Otake
寛和 大武
Shigeru Osawa
滋 大澤
Takeshi Hisayasu
武志 久安
Hitoshi Kono
仁志 河野
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Priority to JP2008199037A priority Critical patent/JP2010040223A/en
Publication of JP2010040223A publication Critical patent/JP2010040223A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bulb-type LED lamp whose lighting circuit side and LED side can easily be connected together while the length of a power feeder is kept short. <P>SOLUTION: The lamp apparatus includes an LED board 13 having an LED 35 disposed on one principal surface of an LED board body 34 and a connector-receiving portion disposed on the other principal surface of the LED board body 34 and in a position away from the center position and electrically connected to the LED 35. A power feeder 45 electrically connected to a connection to be connected to the connector-receiving portion of the LED board 13 is electrically connected to a lighting circuit 42 and put out at a position near an end on the side of the LED board 13 and away from the centerline C of a lighting circuit board body 41. With a lighting circuit board 14 opposed to the other principal surface of the LED board body 34 and oriented in a direction perpendicular to the LED board body 34, the positions of the power feeder 45 and the connector-receiving portion are close enough to each other so that the length of the power feeder 45 can be kept short. The lighting circuit 42 side and the LED 35 side can easily be connected to each other by simply connecting the connection to the connector-receiving portion. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、複数の発光素子を有する素子基板を備えたランプ装置に関する。   The present invention relates to a lamp device including an element substrate having a plurality of light emitting elements.

従来、この種のランプ装置は、複数のＬＥＤを実装した素子基板であるＬＥＤ基板と、このＬＥＤ基板のＬＥＤを点灯制御する点灯回路を備えた点灯回路基板とを、略円筒状のケース体内に収容し、かつ、このケース体に口金を取り付けて構成されている。ＬＥＤ基板は、ケース体の照射開口側に向けて配置されており、点灯回路基板は、ケース体内の口金側に配置されている（例えば、特許文献１参照。）。
特開２００３−１２４５２８号公報(第７頁、図３) Conventionally, this type of lamp device includes an LED substrate, which is an element substrate on which a plurality of LEDs are mounted, and a lighting circuit substrate having a lighting circuit that controls lighting of the LEDs on the LED substrate, in a substantially cylindrical case body. The case body is accommodated and a base is attached to the case body. The LED board is arranged toward the irradiation opening side of the case body, and the lighting circuit board is arranged on the base side in the case body (for example, refer to Patent Document 1).
Japanese Patent Laying-Open No. 2003-124528 (page 7, FIG. 3)

しかしながら、上述のランプ装置の場合には、ＬＥＤ基板に対して点灯回路基板側からの給電線を接続する際には、ＬＥＤ基板に設けた端子に対して配線を作業者がラッピング接続することがあり、このようなラッピング接続の場合、熟練を要するだけでなく、作業者によって配線作業の仕上がりに個人差が生じるため、好ましくない。   However, in the case of the lamp device described above, when connecting the power supply line from the lighting circuit board side to the LED board, the operator may wrap and connect the wiring to the terminal provided on the LED board. In addition, such a wrapping connection is not preferable because not only skill is required, but also an individual difference occurs in the finish of wiring work by an operator.

また、ＬＥＤからの配光を均一化する際には、例えばＬＥＤの一部を中心近傍に配置し、残りの他のＬＥＤを基板の外縁近傍に配置して、互いに略等距離とすることが好ましいものの、この場合、コネクタをＬＥＤ基板の中心位置に配置することが容易でないので、コネクタの位置がこのＬＥＤ基板の中心位置に対してずれた位置となる。このため、点灯回路基板側との給電線の距離が長くなり、この給電線を収容するスペースなども考慮する必要がある。   Further, when making the light distribution from the LEDs uniform, for example, a part of the LEDs may be arranged near the center, and the remaining other LEDs may be arranged near the outer edge of the substrate so that they are substantially equidistant from each other. Although preferable, in this case, it is not easy to arrange the connector at the center position of the LED board, so the position of the connector is shifted from the center position of the LED board. For this reason, the distance of the feeder line with the lighting circuit board side becomes long, and it is necessary to consider the space for accommodating this feeder line.

本発明は、このような点に鑑みなされたもので、給電線の長さを抑制しつつ点灯回路側と発光素子側とを容易に接続できるランプ装置を提供することを目的とする。   This invention is made in view of such a point, and it aims at providing the lamp device which can connect the lighting circuit side and the light emitting element side easily, suppressing the length of a feeder.

請求項１記載のランプ装置は、素子基板本体、この素子基板本体の一主面側に配置された複数の発光素子、および、素子基板本体の他主面側でかつ素子基板本体の中心位置からずれた位置に配置され発光素子と電気的に接続された接続受部を備えた素子基板と；点灯回路基板本体、この点灯回路基板本体に形成され発光素子を点灯制御する点灯回路、点灯回路基板本体から導出された給電線、および、この給電線と電気的に接続され素子基板の接続受部に接続される接続部を備え、素子基板の素子基板本体の他主面側に対向し素子基板に対して交差する方向に沿って配置され、かつ、給電線が点灯回路基板本体の中心線に対してずれた素子基板側の端部近傍の位置で点灯回路に電気的に接続されて導出されている点灯回路基板と；を具備しているものである。   The lamp device according to claim 1 is an element substrate main body, a plurality of light emitting elements arranged on one main surface side of the element substrate main body, and the other main surface side of the element substrate main body and from the center position of the element substrate main body. An element substrate having a connection receiving portion disposed at a shifted position and electrically connected to the light emitting element; a lighting circuit board main body, a lighting circuit formed on the lighting circuit board main body to control lighting of the light emitting element, and the lighting circuit board A power supply line led out from the main body, and a connection part that is electrically connected to the power supply line and connected to a connection receiving part of the element substrate, facing the other main surface side of the element substrate main body of the element substrate. Are arranged along the direction intersecting with the power supply line, and the power supply line is electrically connected to the lighting circuit at a position near the end on the element substrate side shifted from the center line of the lighting circuit board body. A lighting circuit board having; Is shall.

発光素子としては、例えば、ＬＥＤあるいは有機ＥＬなどの固体発光素子などが用いられる。   As the light emitting element, for example, a solid light emitting element such as an LED or an organic EL is used.

素子基板本体の中心位置からずれた位置とは、少なくとも接続受部の中心位置が素子基板本体の中心位置と重ならない位置をいう。   The position shifted from the center position of the element substrate body means a position where at least the center position of the connection receiving portion does not overlap with the center position of the element substrate body.

接続受部は、例えばコネクタ受部などの機械的保持手段を有するものの他、端子台のように給電線が挿入されて電気的に接続されるものでもよい。   For example, the connection receiving portion may have a mechanical holding means such as a connector receiving portion or may be electrically connected by inserting a feeder line like a terminal block.

点灯回路基板本体の中心線に対してずれた素子基板側の端部近傍の位置とは、少なくとも給電線の中心位置が点灯回路基板本体の中心線上でない素子基板側の端部近傍の位置をいう。   The position near the end on the element substrate side shifted from the center line of the lighting circuit board main body means a position near the end on the element substrate side where at least the center position of the feeder line is not on the center line of the lighting circuit board main body. .

請求項２記載のランプ装置は、請求項１記載のランプ装置において、円筒状に形成され、素子基板を軸方向に交差する方向に沿って収容するとともに、点灯回路基板を軸方向に沿って収容するケース体を具備し、点灯回路基板は、接続部よりも高さが高く点灯回路基板本体の中心線上に配置され点灯回路を構成する回路素子を備えているものである。   A lamp device according to a second aspect is the lamp device according to the first aspect, wherein the lamp device is formed in a cylindrical shape, and accommodates the element substrate along a direction intersecting the axial direction, and accommodates the lighting circuit substrate along the axial direction. The lighting circuit board includes a circuit element that is higher in height than the connection portion and is arranged on the center line of the lighting circuit board main body to form the lighting circuit.

回路素子としては、例えばトランスやコンデンサなどが用いられる。   For example, a transformer or a capacitor is used as the circuit element.

請求項１記載のランプ装置によれば、素子基板の素子基板本体の一主面側に複数の発光素子を配置し、素子基板本体の他主面側でかつ素子基板本体の中心位置からずれた位置に発光素子と電気的に接続された接続受部を配置するとともに、接続受部に対して接続される接続部に電気的に接続された給電線を、点灯回路基板の点灯回路基板本体の中心線に対してずれた素子基板側の端部近傍の位置で点灯回路に電気的に接続して導出することで、点灯回路基板を素子基板本体の他主面側に対向して素子基板本体と交差する方向に配置した状態で給電線の位置と接続受部の位置とが接近し、給電線の長さを抑制できるとともに、接続受部に対して接続部を接続するだけで点灯回路側と発光素子側とを容易に接続できる。   According to the lamp device of claim 1, the plurality of light emitting elements are arranged on one main surface side of the element substrate body of the element substrate, and the other main surface side of the element substrate body is shifted from the center position of the element substrate body. The connection receiving part electrically connected to the light emitting element is disposed at the position, and the feeder line electrically connected to the connection part connected to the connection receiving part is connected to the lighting circuit board main body of the lighting circuit board. The element circuit board body is opposed to the other main surface side of the element board body by electrically connecting to the lighting circuit at a position near the end on the element board side shifted from the center line. The position of the power supply line and the position of the connection receiving part approach each other in the state of being arranged in the direction intersecting with the power supply line, and the length of the power supply line can be suppressed, and the lighting circuit side is simply connected to the connection receiving part. And the light emitting element side can be easily connected.

請求項２記載のランプ装置によれば、請求項１記載のランプ装置の効果に加えて、点灯回路基板を円筒状のケース体に軸方向に沿って収容する際に最もスペースを取ることができる点灯回路基板本体の中心線上に接続部よりも高さが高い回路素子を配置することで、回路素子の配置スペースを確保できる。   According to the lamp device of the second aspect, in addition to the effect of the lamp device of the first aspect, the most space can be taken when the lighting circuit board is accommodated in the cylindrical case body along the axial direction. By arranging a circuit element having a height higher than that of the connection portion on the center line of the lighting circuit board body, it is possible to secure an arrangement space for the circuit elements.

以下、本発明の一実施の形態を図面を参照して説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１はランプ装置の縦断面図、図２はランプ装置のケース体の一部を示す平面図、図３はランプ装置の素子基板を示す斜視図、図４は素子基板を示す図３のＩ−Ｉ断面図である。   1 is a longitudinal sectional view of the lamp device, FIG. 2 is a plan view showing a part of a case body of the lamp device, FIG. 3 is a perspective view showing an element substrate of the lamp device, and FIG. 4 is an I of FIG. It is -I sectional drawing.

図１において、11はランプ装置としての電球型ランプである電球型ＬＥＤランプを示し、この電球型ＬＥＤランプ11は、略円筒状のケース体12と、このケース体12内に収容された素子基板であるＬＥＤ基板13および点灯回路基板14と、ケース体12に接続された口金15とを備えている。   In FIG. 1, reference numeral 11 denotes a light bulb type LED lamp which is a light bulb type lamp as a lamp device. The light bulb type LED lamp 11 includes a substantially cylindrical case body 12 and an element substrate accommodated in the case body 12. The LED board 13 and the lighting circuit board 14 and the base 15 connected to the case body 12 are provided.

ケース体12は、熱伝導性を有し内部にＬＥＤ基板13を収容する略円筒状のケース21と、このケース21に取り付けられ内部に点灯回路基板14を収容する略円筒状のカバー体22とを有している。   The case body 12 has a substantially cylindrical case 21 that has thermal conductivity and accommodates the LED board 13 therein, and a substantially cylindrical cover body 22 that is attached to the case 21 and accommodates the lighting circuit board 14 therein. have.

ケース21は、例えば熱伝導性が良好なアルミニウムなどの金属材料、あるいは樹脂材料などにより一体成形され、一端21a側から他端21b側へと拡開状に形成され、他端21b側の端部が照射開口21cとなっている。また、ケース21の底部21dには、開口21eが形成されており、この開口21eを除く位置がＬＥＤ基板13を取り付ける基板取付部21fとなっている。   The case 21 is integrally formed of, for example, a metal material such as aluminum having good thermal conductivity, or a resin material, and is formed in an expanded shape from the one end 21a side to the other end 21b side, and an end portion on the other end 21b side Is the irradiation opening 21c. In addition, an opening 21e is formed in the bottom 21d of the case 21, and a position excluding the opening 21e is a board attaching part 21f to which the LED board 13 is attached.

照射開口21cには、透光性カバーである前面レンズ24が取り付けられている。   A front lens 24, which is a translucent cover, is attached to the irradiation opening 21c.

基板取付部21fには、ＬＥＤ基板13を固定するとともにケース21とカバー体22とを固定するためのねじ25を挿入するねじ孔21gが、例えば周方向に３箇所、互いに略等間隔に離間されてそれぞれ形成されている。   Screw holes 21g for inserting screws 25 for fixing the LED substrate 13 and fixing the case 21 and the cover body 22 are spaced apart from each other at approximately equal intervals, for example, at three locations in the circumferential direction. Each is formed.

カバー体22は、例えばアルミダイキャストにより形成され、一端22a側から他端22b側へと順次拡開するように形成され、他端22b側の端部が開口部22cとなっており、この開口部22cの周囲が、ケース21の基板取付部21fと熱的に結合されるカバー体接続部22dとなっている。また、このカバー体接続部22dには、円環状の溝部22eが形成され、この溝部22eには、シール部材であるＯリング22fが取り付けられている。また、溝部22eの内周側には、上記ねじ25の先端側がねじ止めされるねじ止め孔22gが、上記各ねじ孔21gに対応して例えば周方向に３箇所、互いに略等間隔に離間されて形成されている。   The cover body 22 is formed by, for example, aluminum die casting, and is formed so as to sequentially expand from the one end 22a side to the other end 22b side, and the end portion on the other end 22b side is an opening portion 22c. The periphery of the portion 22c is a cover body connection portion 22d that is thermally coupled to the substrate mounting portion 21f of the case 21. The cover body connecting portion 22d is formed with an annular groove portion 22e, and an O-ring 22f as a seal member is attached to the groove portion 22e. Further, on the inner peripheral side of the groove 22e, screwing holes 22g to which the distal end side of the screw 25 is screwed are spaced apart from each other at approximately equal intervals, for example, at three locations in the circumferential direction corresponding to the screw holes 21g. Is formed.

また、カバー体22の内部には、点灯回路基板14を内部に収容する絶縁性の絶縁カバー31が取り付けられている。この絶縁カバー31は、例えばＰＢＴ樹脂などにより、カバー体22の内部の形状に沿って略円筒状に形成されている。したがって、絶縁カバー31は、一端31a側から他端31b側へと順次拡開するように形成され、この絶縁カバー31の内部が点灯回路基板14の収容空間となっている。また、この絶縁カバー31の一端31a側には、カバー体22の一端22a側から突出する突出部31cが一体に形成されており、この突出部31cに口金15が取り付けられることにより、口金15がケース体12に対して絶縁されるように構成されている。さらに、突出部31cには、絶縁カバー31内の内圧が高まった際の減圧用の孔部31dが形成されている。なお、絶縁カバー31の内部には、点灯回路基板14を埋没させるように放熱性および絶縁性を有する充填材であるシリコーン系の樹脂などを充填してもよい。   An insulating insulating cover 31 that houses the lighting circuit board 14 is attached to the inside of the cover body 22. The insulating cover 31 is formed in a substantially cylindrical shape along the shape inside the cover body 22 by using, for example, PBT resin or the like. Therefore, the insulating cover 31 is formed so as to expand sequentially from the one end 31a side to the other end 31b side, and the inside of this insulating cover 31 is a housing space for the lighting circuit board 14. Further, a projecting portion 31c projecting from the one end 22a side of the cover body 22 is integrally formed on the one end 31a side of the insulating cover 31, and the base 15 is attached to the projecting portion 31c so that the base 15 is The case body 12 is configured to be insulated. Furthermore, a hole 31d for pressure reduction when the internal pressure in the insulating cover 31 is increased is formed in the protrusion 31c. The insulating cover 31 may be filled with a silicone-based resin, which is a filler having heat dissipation and insulation properties, so that the lighting circuit board 14 is buried.

また、ＬＥＤ基板13は、平面視円形状の素子基板本体であるＬＥＤ基板本体34と、このＬＥＤ基板本体34の一主面34a側に実装された複数の発光素子であるＬＥＤ35と、ＬＥＤ基板本体34の他主面34b側に実装された接続受部としてのコネクタ受部36とを有しており、ケース体12の軸方向と交差(直交)する方向に沿ってケース21内に収納されている。また、このＬＥＤ基板13には、ＬＥＤ35からの光を反射拡散させるための反射体37が一体的に取り付けられている。   The LED substrate 13 includes an LED substrate body 34 that is a circular element substrate body in plan view, a plurality of LEDs 35 that are light emitting elements mounted on one main surface 34a side of the LED substrate body 34, and an LED substrate body. Connector receiving portion 36 as a connection receiving portion mounted on the other main surface 34b side of 34, and is housed in case 21 along a direction intersecting (orthogonal) with the axial direction of case body 12. Yes. In addition, a reflector 37 for reflecting and diffusing light from the LED 35 is integrally attached to the LED substrate 13.

ＬＥＤ基板本体34は、図１、図３および図４に示すように、例えば放熱性が良好なアルミニウムなどの金属材料、あるいは絶縁材料などにより形成されたメタル基板であり、基板取付部21fに対して面接触するように密着固定されている。なお、このＬＥＤ基板本体34は、基板取付部21fに対して、例えば放熱性に優れたシリコーン系の接着剤などにより接着してもよい。   As shown in FIGS. 1, 3 and 4, the LED substrate body 34 is a metal substrate formed of a metal material such as aluminum having a good heat dissipation property or an insulating material, for example, with respect to the substrate mounting portion 21f. It is fixed tightly so that it is in surface contact. The LED board main body 34 may be bonded to the board mounting portion 21f with, for example, a silicone adhesive having excellent heat dissipation.

ＬＥＤ35は、例えば青色の光を発する図示しないベアチップと、このベアチップを覆うシリコーン樹脂などにより形成された図示しない樹脂部とを備え、この樹脂部内に、ベアチップが発する青色光の一部により励起されて青色の補色である黄色の光を主として放射する図示しない蛍光体が混入されており、各ＬＥＤ35が白色系の照明光を得られるように構成されている。そして、これらＬＥＤ35は、ＬＥＤ基板本体34の一主面34aの中心位置に１つが配置され、その中心位置を中心とする同一円周上に複数、例えば６つが略均等に配置され、互いに略等しい距離となっている。換言すれば、これらＬＥＤ35は、ＬＥＤ基板本体34の中心位置を中心とする正六角形の各頂点と中心とにそれぞれ配置されている。したがって、これらＬＥＤ35は、互いに隣接する３つが、それぞれ正三角形の頂点の位置となるように配置されている。   The LED 35 includes, for example, a bare chip (not shown) that emits blue light and a resin part (not shown) formed of a silicone resin or the like that covers the bare chip. A phosphor (not shown) that mainly emits yellow light, which is a complementary color of blue, is mixed therein, and each LED 35 is configured to obtain white illumination light. One LED 35 is arranged at the center position of one main surface 34a of the LED board main body 34, and a plurality of, for example, six LEDs are arranged substantially equally on the same circumference centered on the center position, and are substantially equal to each other. It is a distance. In other words, the LEDs 35 are respectively arranged at the apexes and the center of a regular hexagon centering on the center position of the LED substrate body 34. Accordingly, these LEDs 35 are arranged so that three adjacent to each other are located at the vertices of an equilateral triangle.

コネクタ受部36は、各ＬＥＤ35に対して電気的に接続されているとともに、点灯回路基板14側と接続される受電端子となるコネクタウェハ(コネクタ台)であり、例えば合成樹脂などにより形成され、ＬＥＤ基板本体34の中心位置に対してずれた、外縁寄りの位置で、ＬＥＤ35側である表面(主面)側のＬＥＤ35を避ける位置に配置されている。そして、このコネクタ受部36は、開口21eおよび開口部22cにそれぞれ挿入されてカバー体22(点灯回路基板14)側へと露出している。なお、このコネクタ受部36は、ＬＥＤ基板本体34の背面側(裏面側)に配置してもよい。   The connector receiving part 36 is a connector wafer (connector base) that is electrically connected to each LED 35 and serves as a power receiving terminal connected to the lighting circuit board 14 side, and is formed of, for example, synthetic resin, The LED board main body 34 is disposed at a position near the outer edge, shifted from the center position of the LED board body 34, so as to avoid the LED 35 on the surface (main surface) side that is the LED 35 side. The connector receiving portion 36 is inserted into the opening 21e and the opening 22c, and is exposed to the cover body 22 (lighting circuit board 14). The connector receiving portion 36 may be disposed on the back side (back side) of the LED board main body 34.

反射体37は、例えば白色の合成樹脂などにより円板状に形成されており、各ＬＥＤ35に対応する位置に、光の照射方向すなわち照射開口側へと拡開状に湾曲した反射面37aが形成されている。また、この反射体37の周囲には、上記ねじ25が係止される切欠部37bが、上記各ねじ孔21gに対応して例えば周方向に３箇所、互いに略等間隔に離間されて形成されている。さらに、この反射体37の外周縁の一部には、コネクタ受部36が嵌合される接続受部用切欠部である嵌合切欠部37cが形成されている。   The reflector 37 is formed in a disk shape with, for example, a white synthetic resin, and a reflecting surface 37a that is curved in an expanding shape toward the light irradiation direction, that is, the irradiation opening side is formed at a position corresponding to each LED 35. Has been. Further, around the reflector 37, notches 37b to which the screws 25 are locked are formed, for example, at three locations in the circumferential direction so as to be spaced apart from each other at substantially equal intervals, corresponding to the screw holes 21g. ing. Further, a fitting notch 37c, which is a notch for connection receiving part to which the connector receiving part 36 is fitted, is formed on a part of the outer peripheral edge of the reflector 37.

また、図１および図２に示すように、点灯回路基板14は、ケース21の拡開形状に対応して一端側から他端側へと拡開された平板状の点灯回路基板本体41と、この点灯回路基板本体41に実装され点灯回路42を構成する複数の回路素子43と、点灯回路42に出力端子44を介して基端側が電気的に接続された給電線45と、この給電線45の先端側に電気的に接続された接続部46とを有しており、絶縁カバー31内で、ケース体12の軸方向に沿って、かつ、ＬＥＤ基板13のＬＥＤ基板本体34の他主面34b側に対向して配置された、いわゆる縦形基板である。なお、この点灯回路基板14は、本実施の形態において、全体が絶縁カバー31内に収容されているものの、例えば一部が口金15内に収容されるように構成してもよい。   Further, as shown in FIGS. 1 and 2, the lighting circuit board 14 includes a flat lighting circuit board main body 41 that is expanded from one end side to the other end side in correspondence with the expanded shape of the case 21. A plurality of circuit elements 43 that are mounted on the lighting circuit board main body 41 and constitute the lighting circuit 42, a power supply line 45 that is electrically connected to the lighting circuit 42 via an output terminal 44, and the power supply line 45 A connecting portion 46 that is electrically connected to the distal end side of the LED substrate 13 along the axial direction of the case body 12 within the insulating cover 31 and the other main surface of the LED substrate body 34 of the LED substrate 13 This is a so-called vertical substrate disposed to face the 34b side. In the present embodiment, the lighting circuit board 14 is entirely accommodated in the insulating cover 31, but a part of the lighting circuit board 14 may be accommodated in the base 15, for example.

点灯回路基板本体41は、平面視で幅方向に略対称な形状に形成されており、その幅方向の中心線Ｃが、ケース体12(カバー体22、絶縁カバー31)の中心軸に沿うように配置されている。すなわち、点灯回路基板本体41は、面方向がケース体12(カバー体22、絶縁カバー31)の直径方向に沿うように配置されている。また、この点灯回路基板本体41は、絶縁カバー31内に収容された状態で、ＬＥＤ基板本体34の他主面34bに対して所定の間隙48を介して離間されている。   The lighting circuit board main body 41 is formed in a shape that is substantially symmetrical in the width direction in plan view so that the center line C in the width direction is along the center axis of the case body 12 (the cover body 22 and the insulating cover 31). Is arranged. That is, the lighting circuit board main body 41 is arranged so that the surface direction is along the diameter direction of the case body 12 (the cover body 22 and the insulating cover 31). Further, the lighting circuit board main body 41 is separated from the other main surface 34b of the LED board main body 34 via a predetermined gap 48 while being accommodated in the insulating cover 31.

点灯回路42は、例えばＬＥＤ35に対して定電流を供給する回路などである。   The lighting circuit 42 is a circuit that supplies a constant current to the LED 35, for example.

回路素子43は、例えばトランス43a、スイッチング素子であるトランジスタ43b、あるいは容量素子であるコンデンサ43cなどであり、これらは点灯回路基板本体41の中心線Ｃ上に中心線を沿わせて配置され、点灯回路基板本体41の一主面41a上に実装されている。また、これら回路素子43は、例えば接続部46よりも高さ寸法が高く設定されている。   The circuit element 43 is, for example, a transformer 43a, a transistor 43b that is a switching element, or a capacitor 43c that is a capacitive element. These are arranged along the center line C on the center line C of the lighting circuit board body 41, The circuit board main body 41 is mounted on one main surface 41a. The circuit elements 43 are set to have a height dimension higher than that of the connection portion 46, for example.

出力端子44は、点灯回路基板本体41の中心線Ｃに対してずれた位置、例えば点灯回路基板本体41の幅方向の一側、および、ＬＥＤ基板13側、すなわち点灯回路基板本体41の拡開側の端部近傍の位置で、この点灯回路基板本体41の一主面41a側に実装されている。なお、出力端子44は、少なくともその中心位置が点灯回路基板本体41の中心線Ｃに対してずれていれば、例えば一部が中心線Ｃに重なる位置であってもよい。   The output terminal 44 is shifted from the center line C of the lighting circuit board body 41, for example, one side in the width direction of the lighting circuit board body 41, and the LED board 13 side, that is, the lighting circuit board body 41 is expanded. It is mounted on the one main surface 41a side of the lighting circuit board main body 41 at a position near the end on the side. The output terminal 44 may be, for example, a portion partially overlapping with the center line C as long as the center position is deviated from the center line C of the lighting circuit board body 41.

給電線45は、点灯回路42側からの電力をＬＥＤ基板13側へと供給するためのものであり、ＬＥＤ基板13の取り付けを容易にするように、出力端子44とコネクタ受部36との距離よりもある程度長く、すなわち遊びを持たせた長さに形成されている。また、この給電線45は、開口21eを介してＬＥＤ基板13の表面側へと導出されている。なお、この給電線45の余剰な長さ部分は、上記間隙48に収容可能となっている。   The power supply line 45 is for supplying power from the lighting circuit 42 side to the LED board 13 side, and the distance between the output terminal 44 and the connector receiving part 36 so that the LED board 13 can be easily attached. It is formed to a length that is somewhat longer than that, that is, a length having play. The power supply line 45 is led out to the surface side of the LED substrate 13 through the opening 21e. Note that an excessive length portion of the power supply line 45 can be accommodated in the gap 48.

接続部46は、給電線45の先端側が接続された給電端子となるコネクタハウジングであり、ＬＥＤ基板13側のコネクタ受部36に挿入固定されることで、コネクタ受部36を介して給電線45(点灯回路42)をＬＥＤ35側に電気的に接続するように構成されている。なお、この接続部46のコネクタ受部36に対する挿入方向は、例えばＬＥＤ基板13のＬＥＤ基板本体34に対して交差する(垂直な)方向、あるいはこのＬＥＤ基板本体34に沿う方向など、任意に設定できる。なお、この接続部46は、本実施の形態において、給電線45と別体の部材としたが、例えば接続受部が端子台などである場合には、給電線45の先端側そのものとしてもよい。   The connection part 46 is a connector housing that serves as a power supply terminal to which the distal end side of the power supply line 45 is connected, and is inserted into and fixed to the connector receiving part 36 on the LED board 13 side, so The (lighting circuit 42) is configured to be electrically connected to the LED 35 side. Note that the insertion direction of the connection portion 46 with respect to the connector receiving portion 36 is arbitrarily set, for example, a direction perpendicular to the LED substrate body 34 of the LED substrate 13 or a direction along the LED substrate body 34. it can. In the present embodiment, the connection portion 46 is a separate member from the power supply line 45. However, for example, when the connection receiving portion is a terminal block, the connection portion 46 may be the front end side of the power supply line 45 itself. .

口金15は、例えばＥ２６型のものであり、点灯回路基板14の点灯回路42側と図示しない配線により電気的に接続されており、図示しない照明器具のランプソケットにねじ込まれて電源側と点灯回路42側とを電気的に接続するように構成されている。   The base 15 is of an E26 type, for example, and is electrically connected to the lighting circuit 42 side of the lighting circuit board 14 by wiring (not shown) and screwed into a lamp socket of a lighting fixture (not shown) to be connected to the power source side and the lighting circuit. It is configured to electrically connect the 42 side.

次に、上記一実施の形態の作用を説明する。   Next, the operation of the above embodiment will be described.

まず、電球型ＬＥＤランプ11を組み立てる際には、カバー体22内に絶縁カバー31を取り付け、この絶縁カバー31の内部に、点灯回路基板本体41に各回路素子43、出力端子44および給電線45などをそれぞれ実装した点灯回路基板14を、軸方向に沿って挿入する。   First, when assembling the bulb-type LED lamp 11, an insulating cover 31 is attached in the cover body 22, and each circuit element 43, the output terminal 44, and the feeder line 45 are connected to the lighting circuit board main body 41 inside the insulating cover 31. Etc. are inserted along the axial direction.

次いで、カバー体22のカバー体接続部22dの溝部22eにＯリング22fを嵌着した状態で、ケース21の基板取付部21fを対向させ、ＬＥＤ基板本体34にＬＥＤ35およびコネクタ受部36などを実装したＬＥＤ基板13を、点灯回路基板14側の接続部46をコネクタ受部36に接続した後、基板取付部21f上に載置する。このとき、余剰の給電線45は、間隙48内に収納する。   Next, with the O-ring 22f fitted in the groove 22e of the cover body connection part 22d of the cover body 22, the board mounting part 21f of the case 21 is made to face, and the LED 35 and the connector receiving part 36 are mounted on the LED board body 34 The LED board 13 is placed on the board attachment part 21f after the connecting part 46 on the lighting circuit board 14 side is connected to the connector receiving part 36. At this time, the surplus power supply line 45 is accommodated in the gap 48.

この後、反射体37をＬＥＤ基板13上に載置し、ねじ25を反射体37の切欠部37bおよびねじ孔21gに挿通してねじ止め孔22gにねじ込むことで、ＬＥＤ基板13および反射体37を一体的にケース21に固定する。   Thereafter, the reflector 37 is placed on the LED substrate 13, and the screw 25 is inserted into the notch 37b and the screw hole 21g of the reflector 37 and screwed into the screwing hole 22g, whereby the LED substrate 13 and the reflector 37 are placed. Are integrally fixed to the case 21.

そして、口金15を点灯回路基板14側と電気的に接続しながら突出部31cへと接続するとともに、ケース21の照射開口21cに前面レンズ24を取り付けて電球型ＬＥＤランプ11を完成する。   Then, the base 15 is connected to the protruding portion 31c while being electrically connected to the lighting circuit board 14 side, and the front lens 24 is attached to the irradiation opening 21c of the case 21 to complete the bulb-type LED lamp 11.

このように完成した電球型ＬＥＤランプ11は、口金15を所定のソケットに装着して通電すると、点灯回路基板14の点灯回路42が動作して、給電線45を介してＬＥＤ基板13側に電力が供給され、ＬＥＤ35が発光し、この光が反射体37の反射面37aにより配光制御されて、前面レンズ24を通過して前方へと照射される。   When the bulb-type LED lamp 11 thus completed is energized with the base 15 mounted in a predetermined socket, the lighting circuit 42 of the lighting circuit board 14 operates and power is supplied to the LED board 13 side via the feeder line 45. , LED 35 emits light, and this light is light-distributed by the reflecting surface 37a of the reflector 37, passes through the front lens 24, and is irradiated forward.

ＬＥＤ基板13にてＬＥＤ35から発生する熱は、基板取付部21fを介してケース21およびカバー体22にそれぞれ伝達され、これらケース21およびカバー体22を介して放熱される。   The heat generated from the LED 35 on the LED board 13 is transmitted to the case 21 and the cover body 22 via the board mounting portion 21f, and is radiated through the case 21 and the cover body 22.

以上のように、本実施の形態では、ＬＥＤ基板13のＬＥＤ基板本体34の一主面34a側に複数のＬＥＤ35を配置し、ＬＥＤ基板本体34の他主面34b側でかつＬＥＤ基板本体34の中心位置からずれた位置に、ＬＥＤ35と電気的に接続されたコネクタ受部36を配置するとともに、接続部46に電気的に接続された給電線45を、点灯回路基板14の点灯回路基板本体41の中心線Ｃに対してずれたＬＥＤ基板13側の端部近傍の位置で点灯回路42に電気的に接続して導出する構成とした。   As described above, in the present embodiment, a plurality of LEDs 35 are arranged on the one main surface 34a side of the LED substrate body 34 of the LED substrate 13, and the other main surface 34b side of the LED substrate body 34 and the LED substrate body 34 The connector receiving portion 36 electrically connected to the LED 35 is disposed at a position shifted from the center position, and the feeding line 45 electrically connected to the connecting portion 46 is connected to the lighting circuit board main body 41 of the lighting circuit board 14. The LED circuit 13 is electrically connected to the lighting circuit 42 at a position near the end on the LED substrate 13 side that is shifted from the center line C.

このため、点灯回路基板14をＬＥＤ基板本体34の他主面34b側に対向してＬＥＤ基板本体34と交差する方向に配置した状態で、給電線45の位置とコネクタ受部36の位置とが接近し、給電線45の長さを抑制できるとともに、給電線45をラッピングなどにより接続することなくコネクタ受部36に対して接続部46を挿入接続するだけで点灯回路42側とＬＥＤ35側とを容易に接続でき、給電線45の配線作業を容易化し、給電線45の配線の個体差を低減できる。   For this reason, in a state where the lighting circuit board 14 is arranged in a direction crossing the LED board main body 34 so as to face the other main surface 34b side of the LED board main body 34, the position of the feeder 45 and the position of the connector receiving portion 36 are The length of the power supply line 45 can be reduced, and the lighting circuit 42 side and the LED 35 side can be connected simply by inserting and connecting the connection part 46 to the connector receiving part 36 without connecting the power supply line 45 by wrapping or the like. It can be easily connected, the wiring work of the feeder 45 can be facilitated, and individual differences in the feeder 45 can be reduced.

さらに、図２に示すように、点灯回路基板14を円筒状のケース体12に軸方向に沿って収容する際には、ケース体12の中心軸位置に対応する位置、すなわち点灯回路基板本体41の中心線Ｃ上の位置が最もスペースを取ることができるので、この中心線Ｃ上に接続部46よりも高さが高い回路素子43を配置することで、回路素子43の配置スペースを確保できる。   Further, as shown in FIG. 2, when the lighting circuit board 14 is accommodated in the cylindrical case body 12 along the axial direction, the position corresponding to the central axis position of the case body 12, that is, the lighting circuit board body 41 is provided. Since the position on the center line C can take the most space, by arranging the circuit element 43 having a height higher than that of the connecting portion 46 on the center line C, a space for arranging the circuit element 43 can be secured. .

なお、上記一実施の形態において、ＬＥＤ基板13および点灯回路基板14の形状などは、上記構成に限定されるものではない。   In the embodiment, the shapes of the LED substrate 13 and the lighting circuit substrate 14 are not limited to the above configuration.

また、ケース体12の形状は、上記構成に限定されるものではない。   Further, the shape of the case body 12 is not limited to the above configuration.

さらに、コネクタ受部36の位置は、ＬＥＤ基板本体34の中心位置からずれた位置であれば、任意の位置とすることができる。   Furthermore, the position of the connector receiving portion 36 can be set to an arbitrary position as long as it is shifted from the center position of the LED board main body 34.

そして、給電線45は、点灯回路基板本体41の中心線Ｃに対してずれた位置であれば、任意の位置とすることができる。   The feed line 45 can be set at an arbitrary position as long as it is shifted from the center line C of the lighting circuit board main body 41.

本発明の一実施の形態を示すランプ装置の縦断面図である。It is a longitudinal cross-sectional view of the lamp device which shows one embodiment of this invention. 同上ランプ装置のケース体の一部を示す平面図である。It is a top view which shows a part of case body of a lamp device same as the above. 同上ランプ装置の素子基板を示す斜視図である。It is a perspective view which shows the element substrate of a lamp device same as the above. 同上素子基板を示す図３のＩ−Ｉ断面図である。It is II sectional drawing of FIG. 3 which shows an element substrate same as the above.

符号の説明Explanation of symbols

11 ランプ装置としての電球型ＬＥＤランプ
12 ケース体
13 素子基板であるＬＥＤ基板
14 点灯回路基板
34 素子基板本体であるＬＥＤ基板本体
35 発光素子であるＬＥＤ
36 接続受部としてのコネクタ受部
41 点灯回路基板本体
42 点灯回路
43 回路素子
45 給電線
46 接続部 11 Bulb-type LED lamp as a lamp device
12 Case body
13 LED substrate which is an element substrate
14 Lighting circuit board
34 LED substrate body, which is the element substrate body
35 LEDs as light emitting elements
36 Connector receptacle as connection receptacle
41 Lighting circuit board body
42 Lighting circuit
43 Circuit elements
45 Feed line
46 Connection

Claims (2)

素子基板本体、この素子基板本体の一主面側に配置された複数の発光素子、および、素子基板本体の他主面側でかつ素子基板本体の中心位置からずれた位置に配置され発光素子と電気的に接続された接続受部を備えた素子基板と；
点灯回路基板本体、この点灯回路基板本体に形成され発光素子を点灯制御する点灯回路、点灯回路基板本体から導出された給電線、および、この給電線と電気的に接続され素子基板の接続受部に接続される接続部を備え、素子基板の素子基板本体の他主面側に対向し素子基板に対して交差する方向に沿って配置され、かつ、給電線が点灯回路基板本体の中心線に対してずれた素子基板側の端部近傍の位置で点灯回路に電気的に接続されて導出されている点灯回路基板と；
を具備していることを特徴とするランプ装置。 An element substrate main body, a plurality of light emitting elements arranged on one main surface side of the element substrate main body, and a light emitting element arranged on the other main surface side of the element substrate main body and shifted from the center position of the element substrate main body; An element substrate having a connection receiving portion electrically connected;
Lighting circuit board main body, lighting circuit formed on the lighting circuit board main body for controlling lighting of the light emitting element, feeder line derived from the lighting circuit board main body, and connection receiving portion of the element substrate electrically connected to the feeder line Is connected to the other main surface side of the element substrate body of the element substrate, and is arranged along a direction intersecting the element substrate, and the feeder line is a center line of the lighting circuit board body A lighting circuit board that is electrically connected to the lighting circuit at a position near the end on the element substrate side that is offset from the lighting circuit board;
A lamp device comprising: 円筒状に形成され、素子基板を軸方向に交差する方向に沿って収容するとともに、点灯回路基板を軸方向に沿って収容するケース体を具備し、
点灯回路基板は、接続部よりも高さが高く点灯回路基板本体の中心線上に配置され点灯回路を構成する回路素子を備えている
ことを特徴とする請求項１記載のランプ装置。 It is formed in a cylindrical shape, and includes a case body that accommodates the element substrate along the direction intersecting the axial direction, and accommodates the lighting circuit substrate along the axial direction,
The lamp device according to claim 1, wherein the lighting circuit board includes a circuit element that is higher in height than the connection portion and is arranged on a center line of the lighting circuit board main body to constitute the lighting circuit.
JP2008199037A 2008-07-31 2008-07-31 Lamp apparatus Pending JP2010040223A (en)

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