JP2010034441A5 - - Google Patents

Claims (7)

  A horizontally installed disk-shaped base having an outer diameter smaller than the wafer diameter, a plurality of ejection holes having the same diameter formed on the entire surface, and a hollow portion communicating with the ejection holes formed inside the base,
  Comprising pure water supply means for jetting pure water from the plurality of jet holes through the hollow portion to a uniform height over the entire surface of the base;
  A disk-shaped wafer placed concentrically with the base above the base by the ejected pure water is floated horizontally, and the lower surface of the wafer is washed with pure water ejected from the base. Cleaning device.   One or more downward cleaning nozzles are further provided above the base, and pure water is supplied to the upper surface of the wafer by the cleaning nozzle from above the wafer that floats from the base when the lower surface of the wafer is cleaned. The cleaning apparatus according to claim 1 for cleaning.   A part of the plurality of ejection holes is provided with an inclination of 15 to 60 degrees with respect to the vertical direction, and the wafer floating from the base by the ejection of pure water from the ejection holes is horizontally rotated in the circumferential direction thereof. The cleaning apparatus according to claim 1 or 2, wherein the cleaning apparatus is configured.   4. The structure according to claim 1, wherein a plurality of guides that are higher than a position of the floating wafer are erected on an outer peripheral portion of the base so as to prevent the floating wafer from being detached from above the base. 5. The cleaning device described.   Pure water is ejected from a horizontally installed disc-shaped base having an outer diameter smaller than the wafer diameter over the entire surface of the base to a uniform height, and is placed concentrically with the base above the base by the ejected pure water. A wafer cleaning method, wherein a disk-shaped wafer is floated horizontally, and the lower surface of the wafer is cleaned with pure water ejected from the base. The cleaning method according to claim 5, wherein the upper surface of the wafer is cleaned by supplying pure water to the upper surface of the wafer by one or more cleaning nozzles from above the wafer that floats from the base when cleaning the lower surface of the wafer. The cleaning method according to claim 5 or 6 , wherein the wafer floating from the base is horizontally rotated in the circumferential direction by supplying water from the cleaning nozzle and ejecting pure water from the base.