JP2010033790A - Electronic component and method of manufacturing same - Google Patents

Electronic component and method of manufacturing same Download PDF

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Publication number
JP2010033790A
JP2010033790A JP2008192975A JP2008192975A JP2010033790A JP 2010033790 A JP2010033790 A JP 2010033790A JP 2008192975 A JP2008192975 A JP 2008192975A JP 2008192975 A JP2008192975 A JP 2008192975A JP 2010033790 A JP2010033790 A JP 2010033790A
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conductor
terminal
end portion
conductor end
electronic component
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JP5262396B2 (en
Inventor
Satoshi Ueda
智 上田
Masahito Hasegawa
雅人 長谷川
Hideo Nakanishi
英夫 中西
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Panasonic Corp
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Panasonic Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component improving connection reliability of a weld part for connecting a conductor part to a terminal part. <P>SOLUTION: The electronic component comprises a body part 7; a coated conductor 8 comprising a conductor wiring part 9 wired to the body part 7, and a conductor end 11 provided at the end of the conductor wiring part 9; a terminal part 12 inserted in the body part 7; and the weld part 13 connecting the conductor end 11 to the terminal part 12. At least a part of the conductor end 11 is provided with a plurality of groove parts 14 in a circumferential direction with an extended direction of the conductor end 11 as an axis. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は各種電子機器に使用される電子部品および電子部品の製造方法に関するものである。   The present invention relates to an electronic component used in various electronic devices and an electronic component manufacturing method.

以下、従来の電子部品およびその製造方法について図面を用いて説明する。   A conventional electronic component and a manufacturing method thereof will be described below with reference to the drawings.

図12は従来の電子部品の端子溶接部の斜視図であり、本体部1に植設した端子部2に導体3を溶接部4により接合するものであった。   FIG. 12 is a perspective view of a terminal welding portion of a conventional electronic component, in which a conductor 3 is joined to a terminal portion 2 implanted in the main body portion 1 by a welding portion 4.

また、その溶接の方法としては図13の断面図に示すように、本体部1に植設した端子部2に導体3を密着させ、そこに例えば半田により溶接部4を形成する、あるいは端子部2と導体3との間に電流を流し、端子部2と導体3との接触部5に存在する接触抵抗により生じる熱により、端子部2と導体3の一部を溶融させることにとって溶接部4を形成させるものであった。   As a welding method, as shown in the cross-sectional view of FIG. 13, the conductor 3 is brought into close contact with the terminal portion 2 implanted in the main body 1, and the welded portion 4 is formed therewith by soldering, for example, or the terminal portion. The welded portion 4 is used for flowing a current between the terminal portion 2 and the conductor 3 and melting a part of the terminal portion 2 and the conductor 3 by heat generated by the contact resistance existing in the contact portion 5 between the terminal portion 2 and the conductor 3. Was formed.

なお、この出願の発明に関する先行技術文献情報としては例えば特許文献1が知られている。
特開2007−073874号公報
For example, Patent Document 1 is known as prior art document information relating to the invention of this application.
JP 2007-073874 A

しかしながら、従来の電子部品では図12における溶接部4が小さな領域となる場合や、あるいは少量となる場合は、端子部2と導体3との接続が電気的にも機械的強度においても十分な信頼性を得られなくなる可能性があった。   However, in the conventional electronic component, when the welded portion 4 in FIG. 12 is a small region or a small amount, the connection between the terminal portion 2 and the conductor 3 is sufficiently reliable in terms of electrical and mechanical strength. There was a possibility that it might not be possible to obtain.

例えば、溶接部4の領域を大きくし、かつその量を安定させる場合には、端子部2の幅Wや接合部4の長さLに十分に余裕のある寸法を与えなければ、安定した電気的接続や機械的強度の維持が困難となるものであった。   For example, when the area of the welded portion 4 is enlarged and the amount thereof is stabilized, stable electric power can be obtained unless sufficient dimensions are given to the width W of the terminal portion 2 and the length L of the joint portion 4. Connection and maintenance of mechanical strength becomes difficult.

つまり、溶接部4においては接続信頼性を維持するために、端子部2の寸法や十分な溶接量を維持するための厳密な管理を必要とする課題点があった。   That is, the welded part 4 has a problem that requires strict management for maintaining the dimensions of the terminal part 2 and a sufficient welding amount in order to maintain the connection reliability.

一方、その溶接部4の形成方法においては、例えば図13に示す端子部2と導体3との接触部5に存在する接触抵抗を利用した抵抗溶接等を行う場合、十分な溶接部4の領域を維持するために接触部5を長くし過ぎると、接触面が大きくなることで接触抵抗が低下し、非常に大きな電流の供給を行うために能力の高い電源が必要となることから、抵抗溶接を行う制約が多くなること、および、接触部5の状態によっては接触抵抗の発生し易い位置が変化するため、目的とする位置に溶接部4を形成することが難しいという課題点があった。   On the other hand, in the formation method of the welded part 4, for example, when performing resistance welding using the contact resistance existing in the contact part 5 between the terminal part 2 and the conductor 3 shown in FIG. If the contact portion 5 is made too long in order to maintain the resistance, the contact surface becomes large and the contact resistance is lowered, so that a power source with high ability is required to supply a very large current. There are problems that it is difficult to form the welded portion 4 at the target position because the position where the contact resistance is likely to be generated changes depending on the state of the contact portion 5 and the position where the contact resistance easily occurs.

つまり、図12における溶接部4は、形状における課題の解決を優先する場合には形成時の課題が大きくなり、またあるいは、形成時における課題の解決を優先する場合には形状の課題を大きくするという、相反する課題点が存在するものであった。   That is, the welding part 4 in FIG. 12 has a larger problem at the time of formation when priority is given to the solution of the problem in the shape, or the problem of the shape is increased when priority is given to the solution of the problem at the time of formation. There were conflicting issues.

そこで本発明は、導体部と端子部との接続信頼性を向上させた電子部品およびその製造方法を提供するものである。   Therefore, the present invention provides an electronic component having improved connection reliability between a conductor portion and a terminal portion, and a method for manufacturing the same.

そしてこの目的を達成するために、
本体部と、
この本体部に配線した導体配線部およびこの導体配線部の端部に設けた導体端部とからなる導体部と、
前記本体部に植設した端子部と、
前記導体端部と前記端子部とを接続する溶接部とを備え、
少なくとも前記導体端部の一部には前記導体端部の延伸方向を軸とした外周方向に複数の溝部を設けた
ことを特徴としたものである。
And to achieve this goal,
The main body,
A conductor portion comprising a conductor wiring portion wired to the main body portion and a conductor end portion provided at an end portion of the conductor wiring portion;
A terminal portion implanted in the main body portion;
A welding portion connecting the conductor end portion and the terminal portion;
At least a part of the conductor end portion is provided with a plurality of groove portions in the outer peripheral direction with the extending direction of the conductor end portion as an axis.

本発明によれば、溶接部の領域やその量にかかわらず、的確な接合状態を確保することを可能とするものであり、同時にその接合部を常に安定して形成することを可能とするものである。   According to the present invention, it is possible to ensure an accurate joining state regardless of the area and the amount of the welded portion, and at the same time, it is possible to always stably form the joined portion. It is.

以下、本発明の一実施形態における電子部品を、図を用いて説明する。   Hereinafter, an electronic component according to an embodiment of the present invention will be described with reference to the drawings.

(実施の形態1)
図1は本発明の一実施形態における電子部品の斜視図であり、ここではコイル部品6を一例として説明するものとする。コイル部品6は、本体部7に被覆導体8を巻回した導体配線部9と、被覆導体8の端部に設け被覆部10を剥離除去した部位である導体端部11を接合する端子部12とにより主なる構成としている。
(Embodiment 1)
FIG. 1 is a perspective view of an electronic component according to an embodiment of the present invention. Here, a coil component 6 will be described as an example. The coil component 6 includes a terminal portion 12 that joins a conductor wiring portion 9 in which a covering conductor 8 is wound around a main body portion 7 and a conductor end portion 11 that is provided at an end portion of the covering conductor 8 and is peeled and removed. The main structure.

ここで、導体端部11と端子部12との接合部13は、導体端部11と端子部12との間に大電流を通電し、導体端部11と端子部12との接触部に存在する接触抵抗に生じる熱による抵抗溶接のような方法の溶接により形成している。また、導体端部11の一部には導体端部11を延伸した方向を軸とした円周方向に複数の溝部14を設けている。   Here, the joint portion 13 between the conductor end portion 11 and the terminal portion 12 energizes a large current between the conductor end portion 11 and the terminal portion 12 and exists at the contact portion between the conductor end portion 11 and the terminal portion 12. It is formed by welding such as resistance welding by heat generated in contact resistance. Further, a plurality of groove portions 14 are provided in a part of the conductor end portion 11 in the circumferential direction about the direction in which the conductor end portion 11 is extended.

この構成によれば、導体端部11に溝部14を設けることにより、接合部13と導体端部11との接触面積が大きくなることから、導体端部11と端子部12との接合部13を介しての抵抗値を小さくすることができるものである。これは溝部14における断面図と溝部14でない部分の断面図である、図2(a)および図2(b)に示すように、端子部12の上側に位置する導体端部11の円周方向に対する接合部13の回り込み量は、図1に示す溝部14において大きくなるものであり、当然ながら接触面積も大きくなるものである。   According to this configuration, since the contact area between the joint portion 13 and the conductor end portion 11 is increased by providing the groove portion 14 in the conductor end portion 11, the joint portion 13 between the conductor end portion 11 and the terminal portion 12 is formed. The resistance value can be reduced. This is a cross-sectional view of the groove portion 14 and a cross-sectional view of a portion that is not the groove portion 14, as shown in FIGS. 2 (a) and 2 (b), the circumferential direction of the conductor end portion 11 located above the terminal portion 12. 1 is increased in the groove 14 shown in FIG. 1, and the contact area is naturally increased.

また同時に、図2(a)に示す接合部13の回り込み量が大きくなることにより、導体端部11の端子部12に対する固着力も大きくすることとなる。よって、接合部13に該当する部分の金属をはじめとする接合部材の量が少ない場合であっても、電気的接合や機械的強度に関して信頼性向上を図ることができる。当然ながら、量産を行う上での接合部13に適用する接合部材の量的管理においても適用範囲を大きくすることができるものである。   At the same time, the amount of wraparound of the joint portion 13 shown in FIG. 2A is increased, so that the fixing force of the conductor end portion 11 to the terminal portion 12 is also increased. Therefore, even when the amount of the joining member including the metal corresponding to the joining portion 13 is small, it is possible to improve the reliability with respect to electrical joining and mechanical strength. Naturally, the application range can be enlarged also in the quantitative management of the joining member applied to the joining part 13 in mass production.

ここで図1においては、溝部14を導体端部11の全周に渡って設けた形態としているが、図2(a)に示すように、接合部13の回り込み量を重視する観点から、図1に示す溝部14は導体端部11の側面部に設けることで十分な効果を得ることが可能である。   Here, in FIG. 1, the groove portion 14 is provided over the entire circumference of the conductor end portion 11, but as shown in FIG. 2A, from the viewpoint of placing importance on the amount of wraparound of the joint portion 13. It is possible to obtain a sufficient effect by providing the groove portion 14 shown in 1 on the side surface portion of the conductor end portion 11.

さらに、導体端部11の端子部12に対する固着力という点においては、図3の断面図に示すように、溝部14に位置する接合部13は楔の機能を有することとなり、図中の矢印方向Aに加わる力、例えば導体端部11の温度変化等による伸縮力に対しても固着力を大きくすることができるものである。またあるいは、溝部14の深さを異なるものとし、より深い溝部14を少なくとも1本設けることにより、上述の固着に関する効果をより大きくすることができる。ここで溝部14を深くした場合、その部分では図中の矢印方向Aにおける断面積が小さくなるため、導体端部11の延伸方向における直流抵抗が大きくなるものの、溝部14には接合部13が存在することにより、直流抵抗に関しては特に問題となることはない。   Furthermore, in terms of the fixing force of the conductor end portion 11 to the terminal portion 12, as shown in the sectional view of FIG. 3, the joint portion 13 located in the groove portion 14 has a wedge function, and the direction of the arrow in the figure. The fixing force can be increased even with respect to the force applied to A, for example, the expansion / contraction force due to the temperature change of the conductor end 11 or the like. Alternatively, it is possible to further increase the above-described effect of fixing by making the depth of the groove portion 14 different and providing at least one deeper groove portion 14. Here, when the groove portion 14 is deepened, the cross-sectional area in the arrow direction A in the figure is reduced at that portion, so that the DC resistance in the extending direction of the conductor end portion 11 is increased, but the joint portion 13 exists in the groove portion 14. By doing so, there is no particular problem with respect to DC resistance.

ここで仮に図2(a)および図2(b)に示す導体端部11が下地層16に対して直接に溶接する状態となった場合、図3に示す接合部13は存在しなくなり、楔の機能は有さないこととなる。しかしながらその場合においても、図2(a)および図2(b)に示す導体端部11と下地層16との溶接によるほぼ類似の金属どうしの合金化により、導体端部11と端子部12との機械的固着力および電気的接合は非常に強固なものとなる。   If the conductor end 11 shown in FIGS. 2 (a) and 2 (b) is directly welded to the base layer 16, the joint 13 shown in FIG. It will not have the function of. However, even in that case, the conductor end portion 11 and the terminal portion 12 are formed by alloying the substantially similar metals by welding the conductor end portion 11 and the base layer 16 shown in FIGS. 2 (a) and 2 (b). The mechanical fixing force and the electrical connection are very strong.

一方、図2(a)に示すように、端子部12は例えば基材15として鉄もしくは鉄合金、下地層16として銅もしくは銅合金、外層17として錫もしくは錫合金などを使用することが望ましい。上記の端子部12の構成とすることにより、端子部12の十分な機械的強度を得ることができるのは当然ながら、外層17に比較的融点温度の低い金属を配置することにより、容易に接合部13の形成を行うことが可能である。また、より高い温度により溶接を行い、導体端部11が下地層16や基材15と直接に溶接し、それらの合金による溶接部13を形成しても構わない。   On the other hand, as shown in FIG. 2A, the terminal portion 12 preferably uses, for example, iron or an iron alloy as the base material 15, copper or a copper alloy as the base layer 16, and tin or a tin alloy as the outer layer 17. By adopting the configuration of the terminal portion 12 described above, it is possible to obtain sufficient mechanical strength of the terminal portion 12, but it is easy to join by arranging a metal having a relatively low melting point temperature in the outer layer 17. It is possible to form the portion 13. Further, welding may be performed at a higher temperature, and the conductor end portion 11 may be directly welded to the base layer 16 or the base material 15 to form the welded portion 13 of those alloys.

以上のように、ここでは図1に示すようにコイル部品6を一例として挙げたが、これは特に、非常に長く配線時に蛇行させる頻度が高い被覆導体8を重要な構成要素とするデバイスであるために効果が大きいことにより代表例としたものである。よって、容量性デバイス(図示せず)や抵抗体(図示せず)、あるいはこれらの複合デバイスに適用することも可能であり、端子部12に導体端部11を接合するものであれば全てのデバイスに対して適用が可能である。   As described above, the coil component 6 has been exemplified here as shown in FIG. 1, and this is a device having an especially important component of the coated conductor 8 that is extremely long and frequently meandered during wiring. Therefore, it is a representative example because of its large effect. Therefore, the present invention can be applied to a capacitive device (not shown), a resistor (not shown), or a composite device thereof, and any device that joins the conductor end 11 to the terminal portion 12 can be used. Applicable to devices.

(実施の形態2)
次に、上述の電子部品に関しての製造方法、特に溶接方法について図を用いて説明する。ここでもまた、図1に示すコイル部品6を一例として説明するものとする。コイル部品6は、本体部7に被覆導体8を巻回した導体配線部9と、被覆導体8の端部に設け被覆部10を剥離除去した部位である導体端部11を接合する端子部12とにより主なる構成としている。
(Embodiment 2)
Next, a manufacturing method for the above-described electronic component, particularly a welding method will be described with reference to the drawings. Here again, the coil component 6 shown in FIG. 1 will be described as an example. The coil component 6 includes a terminal portion 12 that joins a conductor wiring portion 9 in which a covering conductor 8 is wound around a main body portion 7 and a conductor end portion 11 that is provided at an end portion of the covering conductor 8 and is peeled and removed. The main structure.

このコイル部品6の製造方法としては、大きく分類して3つの工程からなり、被覆部10の除去を行う第1の工程と、導体端部11を端子部12に接触、押圧させる第2の工程と、導体端部11と端子部とを溶接する第3の工程とにより構成している。   The method for manufacturing the coil component 6 is roughly divided into three steps, a first step for removing the covering portion 10 and a second step for contacting and pressing the conductor end portion 11 against the terminal portion 12. And the third step of welding the conductor end portion 11 and the terminal portion.

まず第1の工程として図4に示すように被覆導体8の被覆部10をバイト18により除去する。このとき、バイト18の被覆導体8への食い込み量を被覆部10の厚みよりも大きな値とし、被覆部10の除去と同時に導体部19の表面に溝部14を形成する。   First, as a first step, as shown in FIG. 4, the covering portion 10 of the covering conductor 8 is removed by a cutting tool 18. At this time, the biting amount of the cutting tool 18 into the covered conductor 8 is set to a value larger than the thickness of the covering portion 10, and the groove portion 14 is formed on the surface of the conductor portion 19 simultaneously with the removal of the covering portion 10.

図4においては、被覆部10を除去する領域に比較して細い寸法のバイト18を、回転する被覆導体8に対して被覆導体8の軸方向に移動させながら被覆部10を除去し、同時に螺旋状で1本に繋がった溝部14を形成する方法を示している。別の方法としては、図5に示すように第2のバイト20が、被覆導体8が1回転することにより複数の溝部14を形成することが可能な幅を有し、この第2のバイト20により複数回、あるいはこの第2のバイト20を複数個用いることにより、被覆部10を除去する領域を決定し、それぞれが独立した複数本の溝部14を形成するものもある。前者の方法の場合、溝部14の深さや幅を細かく制御することが可能であり、第3の工程における溶接の方法や溶接状態を細かく変化させることが可能となる。一方、後者の方法の場合、短時間で所定の領域の被覆部10を除去が可能となる。また、被覆部10の除去を行う工程では被覆部10の厚み以上の深さで刃物により機械的除去を行うため、図4に示す導体部19には溶接に対して障害となる有機物等が残存し難いため、後に説明する溶接工程においての接合信頼性を向上させることができる。   In FIG. 4, the covering portion 10 is removed while the cutting tool 10 is moved in the axial direction of the covering conductor 8 with respect to the rotating covering conductor 8, and the spiral portion 18 is simultaneously spiraled. The method of forming the groove part 14 connected to one by the shape is shown. Alternatively, as shown in FIG. 5, the second cutting tool 20 has a width that allows the plurality of groove portions 14 to be formed by one turn of the covered conductor 8. In some cases, the region where the covering portion 10 is removed is determined by using a plurality of times or by using a plurality of the second cutting tools 20, and a plurality of independent groove portions 14 are formed. In the former method, the depth and width of the groove 14 can be finely controlled, and the welding method and welding state in the third step can be finely changed. On the other hand, in the latter method, the covering portion 10 in a predetermined region can be removed in a short time. Further, in the step of removing the covering portion 10, since mechanical removal is performed with a blade at a depth equal to or greater than the thickness of the covering portion 10, organic matter or the like that obstructs welding remains in the conductor portion 19 shown in FIG. 4. Therefore, it is possible to improve the joining reliability in the welding process described later.

そして、第1の工程の最後に、図6に示すように、被覆部10を除去して露出した導体部19を所定の長さに切断することにより、導体端部11を形成する。   Then, at the end of the first step, as shown in FIG. 6, the conductor end portion 11 is formed by cutting the conductor portion 19 exposed by removing the covering portion 10 into a predetermined length.

ここで、導体端部11は図7に示すように、複数の頂部21を有することが望ましい。導体端部11には平坦部22があっても構わないが、頂部21が複数箇所に存在することにより第3の工程における溶接時の接触点を多くすることができ、より的確な溶接を可能とするものである。   Here, as shown in FIG. 7, the conductor end portion 11 desirably has a plurality of top portions 21. The conductor end portion 11 may have a flat portion 22, but the presence of the top portion 21 at a plurality of locations can increase the number of contact points at the time of welding in the third step, thereby enabling more accurate welding. It is what.

ここで説明した第1の工程では図4もしくは図5に示すように、1つのバイト18によって被覆部10の剥離や除去を行っているが、複数のバイト(図示せず)を被覆導体8の中心に対して放射状に配置したうえで、複数のバイトあるいは被覆導体8を回転させることにより、第1の工程の要素を構成しても構わない。   In the first step described here, as shown in FIG. 4 or 5, the covering portion 10 is peeled off or removed by one cutting tool 18, but a plurality of cutting tools (not shown) are attached to the covering conductor 8. The elements of the first step may be configured by rotating the plurality of cutting tools or the covered conductors 8 after arranging them radially with respect to the center.

次に、第2の工程として、図8に示すように導体端部11の外周と端子部12とを接触させる。ここで、導体端部11の外周と端子部12とが単に接触している状態において、導体端部11を押圧する第1の押圧端子23と端子部12を押圧する第2の押圧端子24との間隔を初期値D0とする。そしてその後、図9に示すように、第1の押圧端子23と第2の押圧端子24とに、導体端部11と端子部12とが互いに押圧し合う力を加える。このときの第1の押圧端子23と第2の押圧端子24との間隔を押圧値D1とする。   Next, as a second step, the outer periphery of the conductor end portion 11 and the terminal portion 12 are brought into contact as shown in FIG. Here, in a state where the outer periphery of the conductor end portion 11 and the terminal portion 12 are simply in contact with each other, a first pressing terminal 23 that presses the conductor end portion 11 and a second pressing terminal 24 that presses the terminal portion 12; Is an initial value D0. Then, as shown in FIG. 9, a force is applied to the first pressing terminal 23 and the second pressing terminal 24 so that the conductor end portion 11 and the terminal portion 12 press each other. The distance between the first pressing terminal 23 and the second pressing terminal 24 at this time is defined as a pressing value D1.

以上の導体端部11と端子部12とを互いに押圧させることにより、導体端部11の外周にあたる、図7に示す頂部21は変形して図9に示す導体端部11と端子部12とが接触する平坦頂部25となる。これにより、導体端部11と端子部12とは複数の導体端部11と端子部12とは複数の接触点26により接触することとなる。   By pressing the conductor end portion 11 and the terminal portion 12 together, the top portion 21 shown in FIG. 7 corresponding to the outer periphery of the conductor end portion 11 is deformed so that the conductor end portion 11 and the terminal portion 12 shown in FIG. It becomes the flat top part 25 which contacts. Thereby, the conductor end portion 11 and the terminal portion 12 come into contact with each other at the plurality of contact points 26 between the plurality of conductor end portions 11 and the terminal portion 12.

また、導体端部11と端子部12との接触は製品毎に常に安定した状態とするために、第1の押圧端子23と第2の押圧端子24との間隔の押圧前後の変位値である(D0−D1)を管理する。これにより、平坦頂部25をそれぞれ類似した形状とすることができるものである。   Further, the contact between the conductor end portion 11 and the terminal portion 12 is a displacement value before and after the pressing of the distance between the first pressing terminal 23 and the second pressing terminal 24 in order to always keep a stable state for each product. (D0-D1) is managed. Thereby, the flat top part 25 can be made into the respectively similar shape.

次に、第3の工程として、第1の押圧端子23と第2の押圧端子24との間に電流を流す。この電流により、接触点26に存在する接触抵抗に熱が生じ、接触点26を中心として導体端部11と端子部12とが溶接を行うこととなる。ここで端子部12は図2(a)に示すように、端子部12は例えば基材15として鉄もしくは鉄合金、下地層16として銅もしくは銅合金、外層17として錫もしくは錫合金などを使用することが望ましい。上記の端子部12の構成とすることにより、端子部12の十分な機械的強度を得ることができるのは当然ながら、外層17に比較的融点温度の低い金属を配置することにより、容易に溶接による接合部13の形成を行うことが可能である。   Next, as a third step, a current is passed between the first pressing terminal 23 and the second pressing terminal 24. Due to this current, heat is generated in the contact resistance existing at the contact point 26, and the conductor end portion 11 and the terminal portion 12 are welded around the contact point 26. Here, as shown in FIG. 2A, the terminal portion 12 uses, for example, iron or an iron alloy as the base material 15, copper or a copper alloy as the base layer 16, and tin or a tin alloy as the outer layer 17. It is desirable. By adopting the configuration of the terminal portion 12 described above, it is possible to obtain sufficient mechanical strength of the terminal portion 12, and it is easy to weld by disposing a metal having a relatively low melting point temperature in the outer layer 17. It is possible to form the joint portion 13 by.

以上に示す方法において、図9に示すように平坦頂部が形成されるように導体端部11と端子部12とを互いに押圧したうえで第3の工程を行った場合においては、導体端部11や端子部12等は図10の斜視図に示すような形状となる。ここでは導体端部11の天面側は溝部14が消滅もしくは変形した凹凸状となり、導体端部11の側面側のみに明確な状態で溝部14が存在する状態となる。その場合であっても溝部14には溶接部13が入り込んだ状態となるため、溶接部13と溝部14との接触面積が大きくなり、導体端部11と端子部12との電気的接合および機械的接合の信頼性は向上するものとなる。   In the method described above, when the third step is performed after the conductor end 11 and the terminal portion 12 are pressed together so that a flat top is formed as shown in FIG. 9, the conductor end 11 The terminal portion 12 and the like are shaped as shown in the perspective view of FIG. Here, the top surface side of the conductor end portion 11 has an uneven shape in which the groove portion 14 disappears or is deformed, and the groove portion 14 exists in a clear state only on the side surface side of the conductor end portion 11. Even in that case, since the welded portion 13 enters the groove portion 14, the contact area between the welded portion 13 and the groove portion 14 is increased, and electrical connection between the conductor end portion 11 and the terminal portion 12 and the machine are performed. The reliability of the joint is improved.

また、より高い温度により溶接を行い、図11(a)の溶接前および図11(b)溶接後に示すように導体端部11を下地層16に対して直接に溶接させ、その周囲に錫合金による外層17からなる溶接部13を形成させる状態としても構わない。この場合、導体端部11と下地層16とは、同一の金属やあるいは類似の合金どうしを融点以上にさせたうえで溶接させるため、機械的にも電気的にも結合の強度を大幅に向上させることができるものである。ここでは断面図において導体端部11の天面側を円弧状としたものを示しているが先に述べたように、天面側は溝部(図示せず)が消滅もしくは変形した凹凸状となったものでも構わない。   Also, welding is performed at a higher temperature, and the conductor end 11 is directly welded to the base layer 16 as shown in FIG. 11A before and after FIG. The welded portion 13 made of the outer layer 17 may be formed. In this case, the conductor end 11 and the underlayer 16 are welded after the same metal or similar alloy is brought to the melting point or higher, so that the strength of the bond is greatly improved both mechanically and electrically. It can be made to. Here, in the cross-sectional view, the top surface side of the conductor end portion 11 is shown in an arc shape. However, as described above, the top surface side has an uneven shape in which a groove (not shown) disappears or is deformed. It does n’t matter.

以上のことからこの方法では、図9に示すように複数の接触点26に応じた部位において溶接が行われるため、複数の点として溶接が広い領域において平均的に行われることとなる。従って、溶接後の図1に示す接合部13も広い範囲に渡って存在することとなり、接合状態の安定性や信頼性を向上させることができる。そして同時に先にも述べたように、、図1に示すように溝部14へ溶接部13が位置することとなり、導体端部11と接合部13および端子部12との接触面積が大きくなることからも接合状態の安定性や信頼性を向上させることができるものである。   As described above, in this method, as shown in FIG. 9, welding is performed at sites corresponding to the plurality of contact points 26, so welding is performed on a wide area as a plurality of points on an average. Accordingly, the welded portion 13 shown in FIG. 1 after welding also exists over a wide range, and the stability and reliability of the joined state can be improved. At the same time, as described above, the welded portion 13 is positioned in the groove portion 14 as shown in FIG. 1, and the contact area between the conductor end portion 11 and the joint portion 13 and the terminal portion 12 is increased. Also, the stability and reliability of the joined state can be improved.

また、仮に図9に示す導体端部11と端子部12との接触状態が変動した場合であっても、その変動幅は複数の接触点26に分散されることとなるため、溶接時の接合状態はピンポイントにおいて行う場合等に比較して非常に安定させることができるものである。   Further, even if the contact state between the conductor end portion 11 and the terminal portion 12 shown in FIG. 9 fluctuates, the fluctuation range is distributed to a plurality of contact points 26. The state can be made very stable as compared with the case where it is performed at a pinpoint.

さらに、図4および図5に示すように、被覆導体8の被覆部10の除去は機械的な方法によって行っているため、被覆端部27において被覆部10の除去時の熱的劣化は一切生じていないこととなる。そのため、溶接時に溶接による熱が伝搬した場合においても、その熱による劣化は限定したものに抑制することができるものである。   Further, as shown in FIGS. 4 and 5, since the removal of the covered portion 10 of the covered conductor 8 is performed by a mechanical method, no thermal deterioration occurs at the time of removal of the covered portion 10 at the covered end portion 27. It will not be. Therefore, even when heat due to welding propagates during welding, deterioration due to the heat can be suppressed to a limited one.

この結果として、図1に示すように、導体配線部9と被覆端部27とが近接した場合であっても、導体交差部28における被覆部10の絶縁破壊の発生を抑制することが可能となり、絶縁に対する信頼性とともにコイル部品6の小型化という点に関しても効果を有するものである。特に被覆部10に3層銅線などの耐熱性の高いものを被覆導体8として使用している場合は、被覆部10を熱的に除去する場合における熱ストレスはコイル部品6の様々の多くの部位に影響を与えることとなる。従って熱による被覆部10の除去による影響を受けないこととすることによるコイル部品6トータルとしての信頼性向上においても効果を有するものである。   As a result, as shown in FIG. 1, even when the conductor wiring portion 9 and the covering end portion 27 are close to each other, it is possible to suppress the occurrence of dielectric breakdown of the covering portion 10 at the conductor intersection portion 28. In addition to the reliability with respect to insulation, the coil component 6 can be reduced in size. In particular, when a highly heat-resistant material such as a three-layer copper wire is used for the covering portion 10 as the covering conductor 8, the thermal stress in the case where the covering portion 10 is thermally removed may cause various coil components 6. It will affect the part. Therefore, it is effective in improving the reliability of the coil component 6 as a whole by not being affected by the removal of the covering portion 10 due to heat.

ここでは、第2の工程と第3の工程とは別の工程として説明したが、図8および図9におけるD0およびD1の値を管理できる状態であれば、これらの工程は同時に行っても構わないものである。   Here, the second step and the third step have been described as separate steps, but these steps may be performed simultaneously as long as the values of D0 and D1 in FIGS. 8 and 9 can be managed. There is nothing.

以上のように、ここでは図1に示すようにコイル部品6を一例とする製造方法としたが、これは特に図1に示すように、被覆導体8を重要な構成要素とし、被覆導体8どうしが接近および交差しやすいデバイスであるために効果が大きいことにより代表例としたものである。よって、容量性デバイス(図示せず)や抵抗体(図示せず)、あるいはこれらの複合デバイスに適用することも可能であり、端子部12に導体端部11を接合するものであれば全てのデバイスに対して適用が可能である。   As described above, the manufacturing method using the coil component 6 as an example as shown in FIG. 1 is described here. However, as shown in FIG. 1, the coated conductor 8 is an important component as shown in FIG. This is a representative example due to its large effect because it is a device that easily approaches and intersects. Therefore, the present invention can be applied to a capacitive device (not shown), a resistor (not shown), or a composite device thereof, and any device that joins the conductor end 11 to the terminal portion 12 can be used. Applicable to devices.

本発明の電子部品は、溶接部の領域やその量にかかわらず、的確な接合状態を確保することを可能とするものであり、同時にその接合部を常に安定して形成することを可能とする効果を有し、各種電子機器において有用である。   The electronic component of the present invention makes it possible to ensure an accurate joining state regardless of the area and the amount of the welded portion, and at the same time, it is possible to always stably form the joined portion. It has an effect and is useful in various electronic devices.

本発明の第一の実施形態における電子部品の斜視図The perspective view of the electronic component in 1st embodiment of this invention (a)本発明の第一の実施形態における電子部品の端子部の第1の断面図、(b)本発明の第一の実施形態における電子部品の端子部の第1の断面図(A) 1st sectional drawing of the terminal part of the electronic component in 1st embodiment of this invention, (b) 1st sectional view of the terminal part of the electronic component in 1st embodiment of this invention. 本発明の第一の実施形態における電子部品の端子部の断面図Sectional drawing of the terminal part of the electronic component in 1st embodiment of this invention 本発明の第二の実施形態における電子部品の製造方法における導体部の第1の斜視図The 1st perspective view of the conductor part in the manufacturing method of the electronic component in 2nd embodiment of this invention 本発明の第二の実施形態における電子部品の製造方法における導体部の第2の斜視図The 2nd perspective view of the conductor part in the manufacturing method of the electronic component in 2nd embodiment of this invention. 本発明の第二の実施形態における電子部品の製造方法における導体部の第3の斜視図3rd perspective view of the conductor part in the manufacturing method of the electronic component in 2nd embodiment of this invention 本発明の第二の実施形態における電子部品の製造方法における導体部の第4の斜視図The 4th perspective view of the conductor part in the manufacturing method of the electronic component in 2nd embodiment of this invention. 本発明の第二の実施形態における電子部品の製造方法における端子部の第1の側面図The 1st side view of the terminal part in the manufacturing method of the electronic component in 2nd embodiment of this invention 本発明の第二の実施形態における電子部品の製造方法における端子部の第2の側面図The 2nd side view of the terminal part in the manufacturing method of the electronic component in 2nd embodiment of this invention 本発明の第二の実施形態における電子部品の製造方法における端子部の斜視図The perspective view of the terminal part in the manufacturing method of the electronic component in 2nd embodiment of this invention (a)本発明の第二の実施形態における電子部品の製造方法における端子部の溶接前の断面図、(b)本発明の第二の実施形態における電子部品の製造方法における端子部の溶接後の断面図(A) Sectional view before welding of terminal part in manufacturing method of electronic component in second embodiment of present invention, (b) After welding of terminal part in manufacturing method of electronic component in second embodiment of present invention Cross section of 従来の電子部品の斜視図Perspective view of conventional electronic components 従来の電子部品の端子部の側面図Side view of the terminal part of a conventional electronic component

符号の説明Explanation of symbols

6 コイル部品
7 本体部
8 被覆導体
9 導体配線部
10 被覆部
11 導体端部
12 端子部
13 接合部
14 溝部
15 基材
16 下地層
17 外層
18 バイト
19 導体部
20 第2のバイト
21 頂部
22 平坦部
23 第1の押圧端子
24 第2の押圧端子
25 平坦頂部
26 接触点
27 被覆端部
28 導体交差部
6 Coil parts 7 Body portion 8 Covered conductor 9 Conductor wiring portion 10 Cover portion 11 Conductor end portion 12 Terminal portion 13 Joint portion 14 Groove portion 15 Base material 16 Underlayer 17 Outer layer 18 Bit 19 Conductor portion 20 Second bit 21 Top portion 22 Flat Part 23 first pressing terminal 24 second pressing terminal 25 flat top part 26 contact point 27 covering end part 28 conductor crossing part

Claims (4)

本体部と、
この本体部に配線した導体配線部およびこの導体配線部の端部に設けた導体端部とからなる導体部と、
前記本体部に植設した端子部と、
前記導体端部と前記端子部とを接続する溶接部とを備え、
少なくとも前記導体端部の一部には前記導体端部の延伸方向を軸とした外周方向に複数の溝部を設けた電子部品。
The main body,
A conductor portion comprising a conductor wiring portion wired to the main body portion and a conductor end portion provided at an end portion of the conductor wiring portion;
A terminal portion implanted in the main body portion;
A welding portion connecting the conductor end portion and the terminal portion;
An electronic component in which a plurality of groove portions are provided in an outer peripheral direction with an extending direction of the conductor end portion as an axis at least at a part of the conductor end portion.
複数の溝部のうち少なくとも1つの溝部は、他の溝部と異なる深さとした請求項1に記載の電子部品。 The electronic component according to claim 1, wherein at least one of the plurality of grooves has a depth different from that of the other grooves. 本体部と、
この本体部に配線した被覆導体配線部およびこの被覆導体配線部の端部に設けた被覆導体端部とからなる被覆導体部と、
前記本体部に植設した端子部と、
前記被覆導体端部の被覆部を剥離した導体端部と前記端子部とを接続する溶接部とを備え、
前記被覆導体部の前記被覆部を剥離するとともに前記導体端部の外周に溝部を設ける第1の工程と、
前記導体端部の外周を前記端子部に接触させるとともに、互いに押圧させる第2の工程と、前記端子部と前記導体端部との間に電流を流す第3の工程とにより前記溶接部を設け、
前記端子部と前記導体端部とを接合させる電子部品の製造方法。
The main body,
A coated conductor portion comprising a coated conductor wiring portion wired to the main body portion and a coated conductor end portion provided at an end portion of the coated conductor wiring portion;
A terminal portion implanted in the main body portion;
A welded portion for connecting the terminal portion and the conductor end portion from which the covering portion of the coated conductor end portion is peeled off,
A first step of peeling the covering portion of the covering conductor portion and providing a groove on the outer periphery of the conductor end;
The welded portion is provided by a second step of bringing the outer periphery of the conductor end portion into contact with the terminal portion and pressing each other, and a third step of passing a current between the terminal portion and the conductor end portion. ,
The manufacturing method of the electronic component which joins the said terminal part and the said conductor edge part.
第2の工程と第3の工程とは同時に行うこととした請求項3に記載の電子部品の製造方法。 The method for manufacturing an electronic component according to claim 3, wherein the second step and the third step are performed simultaneously.
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US10720273B2 (en) 2017-03-07 2020-07-21 Murata Manufacturing Co., Ltd. Coil component
US20180261365A1 (en) * 2017-03-07 2018-09-13 Murata Manufacturing Co., Ltd. Coil component
JP2020178091A (en) * 2019-04-22 2020-10-29 Tdk株式会社 Coil component and manufacturing method thereof
WO2023119787A1 (en) * 2021-12-24 2023-06-29 太平洋精工株式会社 Substrate surface-mounted fuse and method for manufacturing substrate surface-mounted fuse
JP7470998B2 (en) 2021-12-24 2024-04-19 太平洋精工株式会社 Substrate surface mount fuse and method for manufacturing the same

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