JP2010033036A - Method for treating substrate, method for manufacturing color filter, and method for manufacturing organic electroluminescent device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem of difficulty in forming a film over a region enclosed by a barrier wall by the conventional process method of substrate. <P>SOLUTION: The method for treating a substrate includes: a step of preparing a substrate 41a having an insulating film 63 made of a material containing an organic material, disposed to section a pixel forming region in a plan view; a lyophilicity-imparting step of imparting lyophilicity to at least part of the insulating film 63, the lyophilicity being higher than the lyophilicity of the insulating film 63 to a liquid material; and a heating step of heating the substrate 41a after the lyophilicity-imparting step. In the lyophilicity imparting step, the substrate 41a is irradiated with UV rays in an environment of an oxygen-containing gas. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate processing method, a color filter manufacturing method, and an organic EL device manufacturing method.

  Conventionally, as a treatment for a substrate having a partition wall provided so as to partition a pixel formation region in a plan view, lyophilicity is imparted to the region surrounded by the partition wall in a plan view, and the surface of the partition wall is made liquid repellent. Is known (see, for example, Patent Document 1).

Japanese Patent No. 3698138

  In the process described in Patent Document 1, lyophilicity is imparted to a region surrounded by the partition wall in a plan view by irradiating the substrate with ultraviolet rays in a gas containing oxygen. And the liquid repellency is provided to a partition by irradiating the board | substrate with which lyophilic property was provided in the gas containing a fluorine compound with an ultraviolet-ray. According to these treatments, when the liquid material is applied in the region surrounded by the partition walls, the liquid material tends to wet and spread over the region surrounded by the partition walls. On the other hand, the partition surface tends to repel the liquid. For this reason, the liquid is difficult to get over the partition. As a result, when the film is formed from the liquid material, the film can be easily formed over the region surrounded by the partition walls.

  By the way, when the barrier rib contains a positive photosensitive material, when the barrier rib is irradiated with ultraviolet rays, the ultraviolet rays induce photodecomposition of the photosensitive material in the barrier ribs. In this state, when the liquid material is applied to the region surrounded by the partition walls, the partition walls are easily dissolved in the liquid material. As a result, it becomes easier for the liquid to get over the partition.

  That is, in the conventional substrate processing method, there is a problem that it is difficult to form a film over a region surrounded by the partition walls.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] A step of preparing a substrate in which a partition wall made of a material containing an organic material partitions a pixel formation region in a plan view, and a lyophilic property of the partition wall with respect to a liquid material A lyophilic step for imparting a large lyophilic property to at least a part of the partition wall, and a heating step for heating the substrate after the lyophilic step, wherein the lyophilic step includes oxygen. A method for treating a substrate, comprising irradiating the substrate with ultraviolet light in an environment containing gas.

The substrate processing method of this application example includes a step of preparing a substrate, a lyophilic step, and a heating step. A partition wall for partitioning a pixel formation region is provided on the substrate. The partition is made of a material containing an organic material.
In the lyophilic step, lyophilicity greater than the lyophilic property of the partition is imparted to at least a part of the partition. In the lyophilic step, the substrate is irradiated with ultraviolet rays in an environment containing a gas containing oxygen. In the heating step, the substrate is heated.
According to this substrate processing method, when the liquid material is applied to the pixel formation region surrounded by the partition walls, the partition walls can be made difficult to dissolve in the liquid material. For this reason, when forming a film | membrane from a liquid, it can make it easy to form a film | membrane over the pixel formation area enclosed by the partition.

  Application Example 2 In the substrate processing method described above, in the heating step, the substrate is heated in a range of 50 ° C. or higher and lower than 280 ° C.

  In this application example, the substrate is heated in a range of 50 ° C. or higher and lower than 280 ° C. in the heating step. If it is less than 280 degreeC, it can make it easy to avoid damaging the partition comprised with the material containing an organic material. Moreover, if it is 50 degreeC or more, a partition can be made hard to melt | dissolve in a liquid.

  Application Example 3 In the substrate processing method described above, a photosensitive material is included in the material including the organic material, and the substrate processing method is characterized in that:

  In this application example, since the photosensitive material is included in the material including the organic material, the partition wall can be formed by utilizing the photolithography technique.

  Application Example 4 In the substrate processing method described above, the photosensitive material has positive photosensitivity.

  In this application example, since the photosensitive material has positive photosensitivity, the partition wall can be formed by peeling the exposed portion.

  Application Example 5 In the above substrate processing method, the partition is more lyophobic than the partition made lyophilic with respect to the liquid. Method.

  In this application example, the partition has more liquid repellency than the partition made lyophilic with respect to the liquid, so that the liquid can easily stay in the pixel formation region surrounded by the partition. Can do.

  Application Example 6 In the above substrate processing method, after the lyophilic step, the lyophobic step of imparting to the partition a larger liquid repellency than the partition made lyophilic with respect to the liquid. A substrate processing method characterized by comprising:

  In this application example, after the lyophilic step, there is a lyophobic step for imparting to the partition a larger liquid repellency than the partition made lyophilic with respect to the liquid material. Can do.

  Application Example 7 In the substrate processing method described above, the substrate processing method includes the liquid repellency step before the heating step.

  In this application example, since there is a liquid repellency step before the heating step, liquid repellency can be imparted to the partition walls before the heating step.

  Application Example 8 A substrate processing method according to the above-described method, which includes the liquid repellency step after the heating step.

  In this application example, since there is a liquid repellency step after the heating step, liquid repellency can be imparted to the partition walls after the heating step.

  Application Example 9 In the substrate processing method described above, in the liquid repellency step, the substrate is subjected to plasma processing in an environment containing a gas containing at least one of fluorine and a fluorine compound. A substrate processing method.

  In this application example, in the liquid repellency step, the substrate is subjected to plasma treatment in an environment containing a gas containing at least one of fluorine and a fluorine compound, so that the partition walls can be provided with liquid repellency.

  Application Example 10 In the above substrate processing method, the material containing the organic material contains the liquid-repellent substance.

  In this application example, since the material including the organic material includes a substance having liquid repellency, a partition wall having liquid repellency can be formed.

  Application Example 11 In the substrate processing method described above, the substrate having liquid repellency contains at least one of fluorine and a fluorine compound.

  In this application example, since the liquid-repellent substance includes at least one of fluorine and a fluorine compound, a liquid-repellent partition wall can be configured.

  [Application Example 12] A step of preparing a substrate in which a partition wall made of a material containing an organic material partitions a pixel formation region in a plan view, and a liquid material containing a coloring material A lyophilic step of imparting lyophilicity greater than the lyophilic property of the partition to at least a part of the partition, a heating step of heating the substrate after the lyophilic step, and after the heating step, Disposing the liquid material in the pixel formation region surrounded by the partition; and forming a film with the coloring material by drying at least a part of the liquid contained in the liquid material; In the lyophilic step, the substrate is irradiated with ultraviolet rays in an environment containing a gas containing oxygen.

The color filter manufacturing method of this application example includes a step of preparing a substrate, a lyophilic step, a heating step, a step of disposing a liquid material, and a step of forming a film.
A partition wall for partitioning a pixel formation region is provided on the substrate. The partition is made of a material containing an organic material.
In the lyophilic step, lyophilicity greater than the lyophilic property of the partition is imparted to at least a part of the partition. The liquid material contains a coloring material. In the lyophilic step, the substrate is irradiated with ultraviolet rays in an environment containing a gas containing oxygen. In the heating step, the substrate is heated. In the step of arranging the liquid material, the liquid material is arranged in the pixel formation region surrounded by the partition walls. In the step of forming the film, the film is formed of a coloring material by drying at least a part of the liquid contained in the liquid.
According to this color filter manufacturing method, when the liquid material is applied to the pixel formation region surrounded by the partition walls, the partition walls can be made difficult to dissolve in the liquid material. For this reason, when forming a film | membrane from a liquid, it can make it easy to form a film | membrane over the pixel formation area enclosed by the partition.

  Application Example 13 In the color filter manufacturing method described above, in the heating step, the substrate is heated in a range of 50 ° C. or higher and lower than 280 ° C.

  In this application example, the substrate is heated in a range of 50 ° C. or higher and lower than 280 ° C. in the heating step. If it is less than 280 degreeC, it can make it easy to avoid damaging the partition comprised with the material containing an organic material. Moreover, if it is 50 degreeC or more, a partition can be made hard to melt | dissolve in a liquid.

  Application Example 14 A method for manufacturing a color filter as described above, wherein the material containing the organic material contains a photosensitive substance.

  In this application example, since the photosensitive material is included in the material including the organic material, the partition wall can be formed by utilizing the photolithography technique.

  [Application Example 15] A method for manufacturing a color filter as described above, wherein the photosensitive material has positive photosensitivity.

  In this application example, since the photosensitive material has positive photosensitivity, the partition wall can be formed by peeling the exposed portion.

  Application Example 16 In the color filter manufacturing method described above, the partition wall is more lyophobic than the partition wall made lyophilic with respect to the liquid. Manufacturing method.

  In this application example, the partition has more liquid repellency than the partition made lyophilic with respect to the liquid, so that the liquid can easily stay in the pixel formation region surrounded by the partition. Can do.

  Application Example 17 In the above color filter manufacturing method, after the lyophilic step, the lyophobic property is imparted to the partition wall, which has a greater liquid repellency than the partition wall lyophilic to the liquid. A method for producing a color filter, comprising a step.

  In this application example, after the lyophilic step, there is a lyophobic step for imparting to the partition a larger liquid repellency than the partition made lyophilic with respect to the liquid material. Can do.

  [Application Example 18] A method for manufacturing a color filter as described above, wherein the liquid repellent step is included before the heating step.

  In this application example, since there is a liquid repellency step before the heating step, liquid repellency can be imparted to the partition walls before the heating step.

  Application Example 19 A method for manufacturing a color filter as described above, wherein the liquid repellent step is provided after the heating step.

  In this application example, since there is a liquid repellency step after the heating step, liquid repellency can be imparted to the partition walls after the heating step.

  Application Example 20 In the above color filter manufacturing method, in the liquid repellency step, the substrate is subjected to plasma treatment in an environment containing a gas containing at least one of fluorine and a fluorine compound. A method for producing a color filter.

  In this application example, in the liquid repellency step, the substrate is subjected to plasma treatment in an environment containing a gas containing at least one of fluorine and a fluorine compound, so that the partition walls can be provided with liquid repellency.

  [Application Example 21] A method for manufacturing a color filter as described above, wherein the material including the organic material contains the liquid-repellent substance.

  In this application example, since the material including the organic material includes a substance having liquid repellency, a partition wall having liquid repellency can be formed.

  Application Example 22 In the color filter manufacturing method described above, the substance having liquid repellency contains at least one of fluorine and a fluorine compound.

  In this application example, since the liquid-repellent substance includes at least one of fluorine and a fluorine compound, a liquid-repellent partition wall can be configured.

  Application Example 23 For each pixel of a plurality of pixels, the pixel includes a pair of electrodes facing each other, an organic layer interposed between the pair of electrodes, and a partition wall surrounding the organic layer in plan view, A method of manufacturing an organic EL device having a plurality of layers, the step of preparing a substrate having the partition wall made of a material containing an organic material, and one of the plurality of layers A lyophilic step of imparting a lyophilic property greater than the lyophilic property of the partition to the liquid material containing the material constituting the lyophilic step, and after the lyophilic step, A heating step of heating the substrate; a step of arranging the liquid material in a pixel formation region surrounded by the partition wall after the heating step; and drying at least a part of the liquid contained in the liquid material. To make the one layer Forming a film corresponding to the one layer with a material, and in the lyophilic step, the substrate is irradiated with ultraviolet light in an environment containing a gas containing oxygen. Manufacturing method of organic EL device.

An organic EL device according to the manufacturing method of this application example includes, for each pixel of a plurality of pixels, a pair of electrodes facing each other, an organic layer interposed between the pair of electrodes, a partition wall surrounding the organic layer in plan view, have. In this organic EL device, the organic layer has a plurality of layers.
The manufacturing method of this application example includes a step of preparing a substrate, a lyophilic step, a heating step, a step of disposing a liquid material, and a step of forming one layer.
A partition wall for partitioning a pixel formation region is provided on the substrate. The partition is made of a material containing an organic material.
In the lyophilic step, lyophilicity greater than the lyophilic property of the partition is imparted to at least a part of the partition. The liquid material includes a material constituting one layer of the plurality of layers. In the lyophilic step, the substrate is irradiated with ultraviolet rays in an environment containing a gas containing oxygen. In the heating step, the substrate is heated. In the step of arranging the liquid material, the liquid material is arranged in the pixel formation region surrounded by the partition walls. In the step of forming one layer, by drying at least a part of the liquid contained in the liquid, a film corresponding to one layer is formed with the material constituting the one layer.
According to this method for manufacturing an organic EL device, when a liquid material is applied to a pixel formation region surrounded by the partition walls, the partition walls can be made difficult to dissolve in the liquid material. For this reason, when forming a film | membrane from a liquid, it can make it easy to form a film | membrane over the pixel formation area enclosed by the partition.
As a result, it is possible to easily reduce the occurrence of defective pixels and the like in a plurality of pixels. For this reason, the display quality of the organic EL device can be easily improved.

  Application Example 24 In the method for manufacturing the organic EL device described above, in the heating step, the substrate is heated in a range of 50 ° C. or higher and lower than 280 ° C.

  In this application example, the substrate is heated in a range of 50 ° C. or higher and lower than 280 ° C. in the heating step. If it is less than 280 degreeC, it can make it easy to avoid damaging the partition comprised with the material containing an organic material. Moreover, if it is 50 degreeC or more, a partition can be made hard to melt | dissolve in a liquid.

  Application Example 25 A method for manufacturing an organic EL device according to the above-described method, wherein the material including the organic material contains a photosensitive substance.

  In this application example, since the photosensitive material is included in the material including the organic material, the partition wall can be formed by utilizing the photolithography technique.

  [Application Example 26] A method of manufacturing an organic EL device according to the above-described method, wherein the photosensitive material has positive photosensitivity.

  In this application example, since the photosensitive material has positive photosensitivity, the partition wall can be formed by peeling the exposed portion.

  Application Example 27 In the method of manufacturing the organic EL device described above, the partition is more lyophobic than the partition made lyophilic with respect to the liquid. Manufacturing method of EL device.

  In this application example, the partition has more liquid repellency than the partition made lyophilic with respect to the liquid, so that the liquid can easily stay in the pixel formation region surrounded by the partition. Can do.

  Application Example 28 In the method of manufacturing the organic EL device described above, after the lyophilic step, the liquid repellency is imparted to the partition wall with a liquid repellency greater than that of the partition wall lyophilic with respect to the liquid. A method for producing an organic EL device, comprising a liquefaction step.

  In this application example, after the lyophilic step, there is a lyophobic step for imparting to the partition a larger liquid repellency than the partition made lyophilic with respect to the liquid material. Can do.

  Application Example 29 A method for manufacturing an organic EL device according to the above-described method, wherein the liquid repellency step is included before the heating step.

  In this application example, since there is a liquid repellency step before the heating step, liquid repellency can be imparted to the partition walls before the heating step.

  Application Example 30 A method for manufacturing an organic EL device according to the above-described method, which includes the liquid repellency step after the heating step.

  In this application example, since there is a liquid repellency step after the heating step, liquid repellency can be imparted to the partition walls after the heating step.

  [Application Example 31] In the method of manufacturing an organic EL device described above, in the liquid repellency step, the substrate is subjected to plasma treatment in an environment containing a gas containing at least one of fluorine and a fluorine compound. A method of manufacturing an organic EL device characterized by the above.

  In this application example, in the liquid repellency step, the substrate is subjected to plasma treatment in an environment containing a gas containing at least one of fluorine and a fluorine compound, so that the partition walls can be provided with liquid repellency.

  Application Example 32 In the above-described organic EL device manufacturing method, the material including the organic material includes the liquid-repellent substance.

  In this application example, since the material including the organic material includes a substance having liquid repellency, a partition wall having liquid repellency can be formed.

  Application Example 33 In the above-described organic EL device manufacturing method, the substance having liquid repellency includes at least one of fluorine and a fluorine compound. Method.

  In this application example, since the liquid-repellent substance includes at least one of fluorine and a fluorine compound, a liquid-repellent partition wall can be configured.

The top view which shows the display apparatus in 1st Embodiment. Sectional drawing in the AA in FIG. FIG. 3 is a plan view showing a part of a plurality of pixels in the first embodiment. The figure which shows the circuit structure of the display apparatus in 1st Embodiment. Sectional drawing in the CC line | wire in FIG. The figure explaining the manufacturing process of the element substrate in 1st Embodiment. The figure explaining the manufacturing process of the element substrate in 1st Embodiment. Sectional drawing which shows the schematic structure of an example of the UV ozone treatment apparatus applied to the UV ozone treatment in 1st Embodiment. Sectional drawing which shows the structure of an example of the plasma processing apparatus applied to the oxygen plasma processing in 1st Embodiment. The figure explaining the manufacturing process of the element substrate in 1st Embodiment. Sectional drawing in the CC line in FIG. 3 of the display apparatus in 2nd Embodiment. The figure explaining the manufacturing process of the sealing substrate in 2nd Embodiment. The figure explaining the manufacturing process of the sealing substrate in 2nd Embodiment. The perspective view of the electronic device to which the display apparatus in this embodiment is applied.

Embodiments will be described with reference to the drawings, taking a display device using an organic EL device as an example.
The display device 1 according to the first embodiment has a display surface 3 as shown in FIG.

  Here, a plurality of pixels 5 are set in the display device 1. The plurality of pixels 5 are arranged in the X direction and the Y direction in the drawing within the display area 7, and constitute a matrix M in which the X direction is the row direction and the Y direction is the column direction. The display device 1 can display an image on the display surface 3 by selectively emitting light from the plurality of pixels 5 to the outside of the display device 1 via the display surface 3. The display area 7 is an area where an image can be displayed. In FIG. 1, the pixels 5 are exaggerated and the number of the pixels 5 is reduced for easy understanding of the configuration.

The display device 1 includes an element substrate 11 and a sealing substrate 13 as shown in FIG. 2 which is a cross-sectional view taken along the line AA in FIG.
The element substrate 11 is provided with an organic EL element, which will be described later, corresponding to each of the plurality of pixels 5 on the display surface 3 side, that is, the sealing substrate 13 side. The surface 15 of the element substrate 11 opposite to the display surface 3 side is set as the bottom surface of the display device 1. Hereinafter, the surface 15 is referred to as a bottom surface 15.

The sealing substrate 13 is provided in a state facing the element substrate 11 on the display surface 3 side with respect to the element substrate 11. The element substrate 11 and the sealing substrate 13 are bonded via an adhesive 16. In the display device 1, the organic EL element is covered with the adhesive 16 from the display surface 3 side.
Further, the element substrate 11 and the sealing substrate 13 are sealed with a sealing material 17 that surrounds the display region 7 inside the periphery of the display device 1. That is, in the display device 1, the organic EL element and the adhesive 16 are sealed with the element substrate 11, the sealing substrate 13, and the sealing material 17.

Here, each of the plurality of pixels 5 in the display device 1 has a red color (R), a green color (G), and a blue color (B) as shown in FIG. Is set to one of these. That is, the plurality of pixels 5 constituting the matrix M include a pixel 5r that emits R light, a pixel 5g that emits G light, and a pixel 5b that emits B light.
In the following description, the expression “pixel 5” and the expressions “pixels 5r, 5g, and 5b” are appropriately used.

  Here, the color of R is not limited to a pure red hue, and includes orange and the like. The color of G is not limited to a pure green hue, and includes bluish green and yellowish green. The color of B is not limited to a pure blue hue, and includes bluish purple and blue-green. From another viewpoint, light exhibiting the color of R can be defined as light having a light wavelength peak in a range of 570 nm or more in the visible light region. The light exhibiting the color G can be defined as light having a light wavelength peak in the range of 500 nm to 565 nm. Light exhibiting the color B can be defined as light having a light wavelength peak in the range of 415 nm to 495 nm.

In the matrix M, a plurality of pixels 5 arranged along the Y direction form one pixel column 18. A plurality of pixels 5 arranged along the X direction form one pixel row 19.
Each pixel 5 in one pixel column 18 has a light color set to one of R, G, and B. That is, the matrix M includes a pixel column 18r in which a plurality of pixels 5r are arranged in the Y direction, a pixel column 18g in which the plurality of pixels 5g are arranged in the Y direction, and a pixel column 18b in which the plurality of pixels 5b are arranged in the Y direction. have. In the display device 1, the pixel column 18r, the pixel column 18g, and the pixel column 18b are repeatedly arranged in this order along the X direction.
In the following, the notation of the pixel column 18 and the notation of the pixel column 18r, the pixel column 18g, and the pixel column 18b are appropriately used.

The display device 1 includes a selection transistor 21, a drive transistor 23, a capacitor element 25, and an organic EL element 27 for each pixel 5, as shown in FIG. The organic EL element 27 includes a pixel electrode 29, an organic layer 31, and a common electrode 33. Each of the selection transistor 21 and the driving transistor 23 is configured by a TFT (Thin Film Transistor) element and has a function as a switching element.
In addition, the display device 1 includes a scanning line driving circuit 34, a data line driving circuit 35, a plurality of scanning lines GT, a plurality of data lines SI, and a plurality of power supply lines PW.

The plurality of scanning lines GT are respectively connected to the scanning line driving circuit 34, and extend in the X direction with a space therebetween in the Y direction.
The plurality of data lines SI are respectively connected to the data line driving circuit 35 and extend in the Y direction with a space therebetween in the X direction.
The plurality of power supply lines PW extend in the X direction in a state in which the power supply lines PW are spaced from each other in the Y direction, and the power supply lines PW and the scanning lines GT are spaced in the Y direction.

Each pixel 5 is set corresponding to the intersection of each scanning line GT and each data line SI. Each scanning line GT and each power supply line PW correspond to each pixel row 19 shown in FIG. Each data line SI corresponds to each pixel column 18 shown in FIG.
The gate electrode of each selection transistor 21 shown in FIG. 4 is electrically connected to each corresponding scanning line GT. The source electrode of each select transistor 21 is electrically connected to each corresponding data line SI. The drain electrode of each select transistor 21 is electrically connected to the gate electrode of each drive transistor 23 and one electrode of each capacitive element 25.

The other electrode of the capacitive element 25 and the source electrode of the driving transistor 23 are electrically connected to the corresponding power supply line PW.
The drain electrode of each drive transistor 23 is electrically connected to each pixel electrode 29. Each pixel electrode 29 and the common electrode 33 constitute a pair of electrodes having the pixel electrode 29 as an anode and the common electrode 33 as a cathode.
Here, the common electrode 33 is provided in a series of states between the plurality of pixels 5 constituting the matrix M, and functions in common between the plurality of pixels 5.
The organic layer 31 interposed between each pixel electrode 29 and the common electrode 33 is made of an organic material and has a configuration including a light emitting layer to be described later.

  The selection transistor 21 is turned on when a selection signal is supplied to the scanning line GT connected to the selection transistor 21. At this time, a data signal is supplied from the data line SI connected to the selection transistor 21, and the drive transistor 23 is turned on. The gate potential of the driving transistor 23 is held for a certain period by holding the potential of the data signal in the capacitor 25 for a certain period. As a result, the ON state of the drive transistor 23 is held for a certain period. Each data signal is generated at a potential corresponding to the gradation display.

When the ON state of the driving transistor 23 is maintained, a current corresponding to the gate potential of the driving transistor 23 flows from the power supply line PW to the common electrode 33 through the pixel electrode 29 and the organic layer 31. Then, the light emitting layer included in the organic layer 31 emits light with a luminance corresponding to the amount of current flowing through the organic layer 31. Thereby, the display device 1 can perform gradation display.
The display device 1 is one of top emission type organic EL devices in which a light emitting layer included in the organic layer 31 emits light, and light from the light emitting layer is emitted from the display surface 3 through the sealing substrate 13. In the display device 1, the expression “display surface 3 side” is also expressed as the upper side, and the expression “bottom surface 15 side” is also expressed as the lower side.

Here, the details of the configurations of the element substrate 11 and the sealing substrate 13 will be described.
The element substrate 11 has a first substrate 41 as shown in FIG. 5 which is a cross-sectional view taken along the line CC in FIG. In FIG. 5, the selection transistor 21, the capacitor 25, the data line SI, and the power supply line PW are omitted for easy understanding of the configuration.
The first substrate 41 is made of a light-transmitting material such as glass or quartz, for example, and includes a first surface 42a facing the display surface 3 side and a second surface 42b facing the bottom surface 15 side. have.

A gate insulating film 43 is provided on the first surface 42 a of the first substrate 41. An insulating film 45 is provided on the display surface 3 side of the gate insulating film 43. An insulating film 47 is provided on the display surface 3 side of the insulating film 45.
A semiconductor layer 51 is provided on the first surface 42 a of the first substrate 41 corresponding to the drive transistor 23 of each pixel 5. The semiconductor layer 51 is covered with the gate insulating film 43 from the display surface 3 side. As a material of the gate insulating film 43, for example, a material such as silicon oxide can be adopted.

  On the display surface 3 side of the gate insulating film 43, a gate electrode 53 is provided in a region overlapping the semiconductor layer 51 in plan view. As a material of the gate electrode 53, for example, a metal such as aluminum, copper, molybdenum, tungsten, or chromium, or an alloy containing these metals can be used. The gate electrode 53 is covered with the insulating film 45 from the display surface 3 side.

  On the display surface 3 side of the insulating film 45, a source electrode 55 is provided in a region overlapping a source region (not shown) of the semiconductor layer 51 in plan view. The source electrode 55 is connected to a source region (not shown) of the semiconductor layer 51 through a contact hole 57 provided in the insulating film 45 and the gate insulating film 43. As a material of the source electrode 55, for example, a metal such as aluminum, copper, molybdenum, tungsten, or chromium, or an alloy containing these metals can be employed. The source electrode 55 is covered with the insulating film 47 from the display surface 3 side.

  A pixel electrode 29 is provided on the display surface 3 side of the insulating film 47. The pixel electrode 29 is connected to a drain region (not shown) of the semiconductor layer 51 through a contact hole 59 provided in the insulating film 47, the insulating film 45, and the gate insulating film 43. As a material of the pixel electrode 29, for example, a light-reflective metal such as silver, platinum, aluminum, or copper, or an alloy containing these metals can be employed.

When the pixel electrode 29 functions as an anode, it is preferable to use a material having a relatively high work function such as silver or platinum as the material of the pixel electrode 29. Further, ITO (Indium Tin Oxide), indium zinc oxide (Indium Zinc Oxide) or the like is used as the material of the pixel electrode 29, and a light reflective member is provided between the pixel electrode 29 and the first substrate 41. Can also be employed. In this embodiment, ITO is used as the material of the pixel electrode 29.
Further, as the material of the insulating films 45 and 47, for example, materials such as silicon oxide, silicon nitride, and acrylic resin can be adopted.

  Between the adjacent pixel electrodes 29, an insulating film (first partition) 61 that partitions each pixel 5 is provided over the region 62. The insulating film 61 is made of a light transmissive material such as silicon oxide, silicon nitride, or acrylic resin. The insulating film 61 is provided in a lattice shape over the display region 7 in plan view. For this reason, the display region 7 is partitioned into regions of the plurality of pixels 5 by the insulating film 61. When attention is paid to one pixel 5, the insulating film 61 is provided in an annular shape in plan view. Each pixel electrode 29 overlaps the area of each pixel 5 surrounded by the insulating film 61 in plan view. In the present embodiment, silicon oxide is used as the material of the insulating film 61.

On the display surface 3 side of the insulating film 61, an insulating film (second partition) 63 surrounding the area of each pixel 5 is provided. The insulating film 63 is made of, for example, an organic material such as an acrylic resin or a polyimide resin containing a material having a high light absorption property such as carbon black or chromium, and has a lattice shape along the insulating film 61 in a plan view. Is provided. Focusing on one pixel 5, the insulating film 63 surrounds the area of each pixel 5 in plan view. For this reason, the insulating film 63 can be considered to be provided in a ring shape for each pixel 5. In the present embodiment, an acrylic resin is employed as the material of the insulating film 63.
On the display surface 3 side of the pixel electrode 29, an organic layer 31 is provided in a region surrounded by the insulating film 63 (hereinafter referred to as a pixel formation region).

The organic layer 31 is provided corresponding to each pixel 5 and includes a hole injection layer 65, a hole transport layer 67, and a light emitting layer 69.
The hole injection layer 65 is made of an organic material, and is provided on the display surface 3 side of the pixel electrode 29 in the pixel formation region surrounded by the insulating film 63 in plan view.
As the organic material for the hole injection layer 65, a mixture of a polythiophene derivative such as 3,4-polyethylenedioxythiophene (PEDOT) and polystyrene sulfonic acid (PSS) or the like may be employed. As the organic material for the hole injection layer 65, polystyrene, polypyrrole, polyaniline, polyacetylene, derivatives thereof, and the like may be employed.

The hole transport layer 67 is made of an organic material, and is provided on the display surface 3 side of the hole injection layer 65 in the pixel formation region surrounded by the insulating film 63 in plan view.
As the organic material of the hole transport layer 67, for example, a configuration including a triphenylamine-based polymer such as TFB shown as the following compound 1 can be adopted.

The light emitting layer 69 is made of an organic material, and is provided on the display surface 3 side of the hole transport layer 67 in the pixel formation region surrounded by the insulating film 63 in plan view.
As the organic material of the light emitting layer 69 corresponding to the R pixel 5r, for example, a mixture of F8 (polydioctylfluorene) shown as the following compound 2 and a perylene dye may be employed.

  As the organic material of the light emitting layer 69 corresponding to the G pixel 5g, for example, a mixture of F8BT shown as the following compound 3, TFB shown as the compound 1, and F8 shown as the compound 2 is adopted. Can be done.

  As an organic material of the light emitting layer 69 corresponding to the B pixel 5b, for example, F8 shown as the compound 2 can be adopted.

On the display surface 3 side of the organic layer 31, as shown in FIG. 5, an electron injection layer 71 is provided in the pixel formation region surrounded by the insulating film 63. As a material of the electron injection layer 71, for example, an alloy containing magnesium and silver, calcium, or the like can be adopted. In this embodiment, an alloy containing magnesium and silver is employed as the material of the electron injection layer 71.
A common electrode 33 is provided on the display surface 3 side of the electron injection layer 71. As the common electrode 33, for example, a thin film made of a metal such as aluminum can be used. The common electrode 33 can also be configured by, for example, a thin film made of an alloy containing magnesium and silver to provide light transmission. In the present embodiment, an aluminum thin film is employed as the common electrode 33. The common electrode 33 covers the electron injection layer 71 and the insulating film 63 across the plurality of pixels 5 from the display surface 3 side.

  In the display device 1, the region that emits light in each pixel 5 can be defined as a region where the pixel electrode 29, the organic layer 31, and the common electrode 33 overlap in a plan view. In addition, a group of elements constituting a region that emits light for each pixel 5 may be defined as one organic EL element 27. In the display device 1, one organic EL element 27 includes one pixel electrode 29, one organic layer 31, one electron injection layer 71, and a common electrode 33 corresponding to one pixel 5. have.

The sealing substrate 13 is made of a light-transmitting material such as glass or quartz, for example, and has an outward surface 13a facing the display surface 3 side and an opposing surface 13b facing the bottom surface 15 side. is doing.
In the element substrate 11 and the sealing substrate 13 having the above-described configuration, the common electrode 33 of the element substrate 11 and the facing surface 13 b of the sealing substrate 13 are bonded via an adhesive 16.

  In the display device 1, the sealing material 17 illustrated in FIG. 2 is sandwiched between the first surface 42 a of the first substrate 41 and the facing surface 13 b of the sealing substrate 13 illustrated in FIG. 5. That is, in the display device 1, the organic EL element 27 and the adhesive 16 are sealed with the first substrate 41, the sealing substrate 13, and the sealing material 17. The sealing material 17 may be provided between the facing surface 13 b and the common electrode 33. In this case, the organic EL element 27 and the adhesive 16 can be regarded as being sealed by the element substrate 11, the sealing substrate 13, and the sealing material 17.

Here, a method for manufacturing the display device 1 will be described.
The manufacturing method of the display device 1 is roughly divided into a step of manufacturing the element substrate 11 and a step of assembling the display device 1.
In the process of manufacturing the element substrate 11, first, the drive element layer 81 is formed on the first surface 42 a of the first substrate 41 as shown in FIG. The drive element layer 81 includes the selection transistor 21 (FIG. 4), the drive transistor 23, the capacitor element 25 (FIG. 4), the power supply line PW (FIG. 4), the pixel electrode 29, the gate insulating film 43, and the insulating film 45. Insulating film 47 is included.

  Next, as illustrated in FIG. 6B, the insulating film 61 is formed in a region overlapping the periphery of the pixel electrode 29 and the insulating film 47 (region 62 illustrated in FIG. 5) in plan view. In forming the insulating film 61, first, a silicon oxide film that covers the pixel electrode 29 and the insulating film 47 in a plan view is formed by utilizing a CVD technique or the like. Next, the silicon oxide film is patterned by utilizing, for example, a photolithography technique and an etching technique. Thereby, the insulating film 61 can be formed.

Next, as shown in FIG. 6C, an insulating film 63 is formed in a region overlapping the insulating film 61 in plan view. In forming the insulating film 63, first, a resin film that covers the pixel electrode 29 and the insulating film 61 in a plan view is formed with an acrylic resin containing a positive photosensitive material. In the formation of the resin film, spin coating technology, printing technology, or the like can be used. Next, the resin film is patterned by using, for example, a photolithography technique. Thereby, the insulating film 63 can be formed.
The first substrate 41 on which the configuration from the drive element layer 81 to the insulating film 63 is formed is hereinafter referred to as a substrate 41a.

Next, as shown in FIG. 7A, the substrate 41a is subjected to UV ozone treatment. Thereby, lyophilicity is imparted to the liquid materials 65a, 67a, and 69a described later to the pixel electrode 29 and the insulating film 61 than before the UV ozone treatment. In the present embodiment, a method of generating ultraviolet rays in the processing chamber while introducing a gas containing oxygen into the processing chamber while the substrate 41a is accommodated in the processing chamber is employed.
Here, an example of a UV ozone treatment apparatus applied to the UV ozone treatment in the present embodiment will be described. As shown in FIG. 8 which is a cross-sectional view showing a schematic configuration, the UV ozone treatment apparatus 83 includes a chamber (treatment chamber) 85, a table 87, a low-pressure mercury lamp 89, an introduction pipe 91, an exhaust pipe 93, ,have.

  Connected to the chamber 85 are an introduction pipe 91 that guides the processing gas from the outside into the chamber 85 and an exhaust pipe 93 that discharges the decomposition gas from the inside of the chamber 85 to the outside. The table 87 is disposed in the chamber 85. The low-pressure mercury lamp 89 is provided in the chamber 85 so as to face the table 87. In the present embodiment, the low-pressure mercury lamp 89 emits ultraviolet light having a wavelength of about 254 nm and ultraviolet light having a wavelength of about 185 nm. The energy ratio between the ultraviolet light having a wavelength of about 254 nm and the ultraviolet light having a wavelength of about 185 nm is set to about 4: 1.

In the step of performing the UV ozone treatment on the substrate 41a, the processing gas is introduced into the chamber 85 while the low-pressure mercury lamp 89 is turned on with the substrate 41a placed on the table 87. In the present embodiment, the processing gas contains oxygen. Oxygen is decomposed by ultraviolet rays having a wavelength of about 185 nm and converted into ozone. Thereby, the UV ozone treatment is performed on the substrate 41a.
Note that ozone in the chamber 85 is decomposed by ultraviolet rays having a wavelength of about 254 nm, and changes to oxygen. The cracked gas changed from ozone to oxygen is discharged to the outside of the chamber 85 through the exhaust pipe 93.

Following the step of performing UV ozone treatment on the substrate 41a, as shown in FIG. 7B, the substrate 41a is subjected to CF ₄ plasma treatment. Thereby, than before the CF ₄ plasma treatment, the insulating film 63, described later liquid material 65a, 67a, liquid repellency is imparted to 69a. In the present embodiment, a method is employed in which plasma is generated in the processing chamber while introducing a processing gas into the processing chamber while the processing chamber is kept at a predetermined degree of vacuum. In the present embodiment, CF ₄ gas that is a gas containing a fluorine compound is employed as the processing gas.
Here, an example of a plasma processing apparatus applied to the CF ₄ plasma processing in the present embodiment will be described. The plasma processing apparatus 95 has a chamber (processing chamber) 97, a table 99, a coil 101, and a shower plate 103, as shown in FIG.

Connected to the chamber 97 are an introduction pipe 105 for introducing a processing gas into the chamber 97 from the outside and an exhaust pipe 107 for discharging the gas from the chamber 97 to the outside. A dielectric plate 109 made of a dielectric is provided on the top plate portion of the chamber 97.
The table 99 is disposed in the chamber 97. The coil 101 is provided outside the chamber 97 so as to face the dielectric plate 109. The shower plate 103 is provided in a state facing the dielectric plate 109 in the chamber 97. A gap is provided between the dielectric plate 109 and the shower plate 103.
A high frequency bias power supply 113 is connected to the table 99 via a matching unit 111. A high frequency power source 117 is connected to one end of the coil 101 via a matching unit 115. The other end of the coil 101 is grounded.

The introduction pipe 105 extends from the outside of the chamber 97 into the gap between the dielectric plate 109 and the shower plate 103. A valve 119 is connected to the introduction pipe 105 outside the chamber 97. The processing gas passes through the valve 119 and then through the introduction pipe 105 and is guided into the gap between the dielectric plate 109 and the shower plate 103. The processing gas introduced into the gap between the dielectric plate 109 and the shower plate 103 is introduced into the chamber 97 through the shower plate 103.
A vacuum pump 121 is connected to the exhaust pipe 107 outside the chamber 97. The pressure in the chamber 97 is reduced by discharging the gas in the chamber 97 to the outside of the chamber 97 through the exhaust pipe 107 by the vacuum pump 121.

In the step of performing the CF ₄ plasma treatment on the substrate 41a, first, the substrate 41a is placed on the table 99.
Next, the vacuum pump 121 is driven to keep the pressure in the chamber 97 in a reduced pressure state.
Next, the valve 119 is opened to introduce CF ₄ gas into the chamber 97.
Next, the high frequency power source 117 and the high frequency bias power source 113 are driven to apply a high frequency voltage to the coil 101 and a bias voltage to the table 99.
As a result, CF ₄ plasma is induced in the chamber 97.

In this embodiment, the CF ₄ plasma processing conditions are as follows: the pressure in the chamber 97 is about 133 Pa (1 Torr), the amount of CF ₄ gas introduced is about 900 SCCM, the plasma irradiation intensity is 1 W / cm ² , and the processing time is set. 30 minutes.
The processing gas is not limited to CF ₄ gas, and halogen gas such as SF ₆ or CHF ₃ , fluorine gas, or the like may be employed.

Subsequent to the step of subjecting the substrate 41a to CF ₄ plasma treatment, the substrate 41a is subjected to heat treatment. In the present embodiment, as a heat treatment method, a method is employed in which the substrate 41a is held for a predetermined holding time in an environment maintained in a predetermined temperature range. As the conditions for the heat treatment, in the present embodiment, a temperature range of 50 ° C. or higher and lower than 280 ° C. and a holding time of about 10 minutes may be employed. If it is less than 50 degreeC, the time required for the effect mentioned later to be acquired will become long. For this reason, it is unpreferable from a viewpoint of efficiency to fall below 50 degreeC. Further, at 280 ° C. or higher, the insulating film 63 made of an organic material may be softened or the weight may be reduced. For this reason, 280 degreeC or more is not preferable.

Following the step of performing the heat treatment on the substrate 41a, as shown in FIG. 10A, the liquid material 65a is disposed in the region (pixel formation region) of each pixel 5 surrounded by the insulating film 63. The liquid material 65 a contains an organic material that forms the hole injection layer 65. For the arrangement of the liquid material 65a, an ink jet method using a droplet discharge head 131 can be used.
The technique for ejecting the liquid material 65a and the like as the droplet 65b from the droplet ejection head 131 is called an inkjet technique. And the method of arrange | positioning the liquid body 65a etc. in a predetermined position using an inkjet technique is called the inkjet method. This ink jet method is one of coating methods.

  A hole injection layer 65 shown in FIG. 10B can be formed by drying the liquid material 65a arranged in the region of each pixel 5 by a reduced pressure drying method and then performing firing. In addition, the liquid material 65a may employ a configuration in which a mixture of PEDOT and PSS is dissolved in a solvent. As the solvent, for example, diethylene glycol, isopropyl alcohol, normal butanol and the like can be employed. The reduced pressure drying method is a drying method performed under a reduced pressure environment, and is also called a vacuum drying method. The firing conditions for the liquid 65a are an environmental temperature of about 200 ° C. and a holding time of about 10 minutes.

Next, as illustrated in FIG. 10B, the liquid material 67 a is discharged as droplets 67 b from the droplet discharge head 131 into the pixel formation region surrounded by the insulating film 63, thereby being surrounded by the insulating film 63. A liquid 67a is disposed in the pixel formation region. The liquid material 67 a contains an organic material that constitutes the hole transport layer 67.
At this time, the hole injection layer 65 is covered with the liquid 67a. In addition, the liquid material 67a may employ a configuration in which TFB is dissolved in a solvent. As the solvent, for example, cyclohexylbenzene can be employed.

  Next, after the liquid 67a is dried by a reduced pressure drying method, the hole transport layer 67 shown in FIG. 10C can be formed by firing in an inert gas. The firing conditions for the liquid 67a are an environmental temperature of about 130 ° C. and a holding time of about 1 hour.

  Next, as illustrated in FIG. 10C, the liquid material 69 a is disposed in each region surrounded by the insulating film 63. The liquid material 69 a contains an organic material that constitutes the light emitting layer 69. The liquid material 69a is disposed by discharging the liquid material 69a from the droplet discharge head 131 as droplets 69b. At this time, the hole transport layer 67 is covered with the liquid 69a. In addition, the liquid material 69a may employ a configuration in which the organic material described above corresponding to each of the pixels 5r, 5g, and 5b is dissolved in a solvent. As the solvent, for example, cyclohexylbenzene can be employed.

  Next, after the liquid 69a is dried by a reduced pressure drying method, the light emitting layer 69 shown in FIG. 5 can be formed by firing in an inert gas. The firing conditions of the liquid 69a are an environmental temperature of about 130 ° C. and a holding time of about 1 hour.

Next, an electron injection layer 71 shown in FIG. 5 can be formed by using a vapor deposition technique or the like to form a film of calcium or the like in the pixel formation region surrounded by the insulating film 63. At this time, the electron injection layer 71 can be formed in a state where the insulating film 63 is covered from the display surface 3 side with a mask.
Next, the common electrode 33 shown in FIG. 5 can be formed by forming a film of aluminum or the like by utilizing a vapor deposition technique using a mask. Thereby, the element substrate 11 can be manufactured.

In the process of assembling the display device 1, as shown in FIG. 2, the element substrate 11 and the sealing substrate 13 are joined via an adhesive 16 and a sealing material 17.
At this time, the element substrate 11 and the sealing substrate 13 are joined in a state where the first surface 42a of the first substrate 41 and the facing surface 13b of the sealing substrate 13 face each other, as shown in FIG. Thereby, the display apparatus 1 can be manufactured.

In the present embodiment, the insulating film 63 corresponds to the partition, the substrate 41a corresponds to the substrate, and the pixel electrode 29 and the common electrode 33 in each pixel 5 correspond to a pair of electrodes.
Further, the step of performing the heat treatment on the substrate 41a corresponds to the heating step. Moreover, the process of performing the UV ozone treatment on the substrate 41a corresponds to the lyophilic process. Further, the process of performing the CF ₄ plasma treatment on the substrate 41a corresponds to the liquid repellency process.

In the present embodiment, lyophilicity is imparted to the pixel electrode 29 and the insulating film 61 by UV ozone treatment. In addition, liquid repellency is imparted to the insulating film 63 by the CF ₄ plasma treatment. For this reason, when the liquid material 65a is disposed in the region surrounded by the insulating film 63 on the substrate 41a, the liquid material 65a is likely to wet and spread on the pixel electrode 29 and the insulating film 61, and the liquid material 65a is formed into the insulating film 63. Easy to be repelled. For this reason, it is difficult for the liquid material 65 a to get over the insulating film 63. As a result, the hole injection layer 65 can be easily formed over the pixel electrode 29 and the insulating film 61 in the region surrounded by the insulating film 61. That is, in each pixel 5, it is possible to easily suppress the occurrence of a defect that a part of the hole injection layer 65 is lost, for example.

In the present embodiment, the substrate 41a is subjected to heat treatment after the UV ozone treatment and the CF ₄ plasma treatment.
Here, the insulating film 63 is formed of a resin containing a photosensitive material having positive photosensitivity. When this resin is irradiated with ultraviolet rays, photodecomposition of the photosensitive material is likely to be induced. When the liquid body 65a, the liquid body 67a, the liquid body 69a, or the like comes into contact with the resin irradiated with ultraviolet rays, the resin may be dissolved into the liquid body 65a, the liquid body 67a, the liquid body 69a, or the like.

However, in this embodiment, the substrate 41a is heated after the UV ozone treatment. As a result, it is possible to keep the insulating film 63 from dissolving into the liquid body 65a, the liquid body 67a, and the liquid body 69a extremely low. For this reason, the liquid repellency of the insulating film 63 can be easily maintained from after the CF ₄ plasma treatment to after the organic layer 31 is formed. Therefore, each of the hole injection layer 65, the hole transport layer 67, and the light emitting layer 69 can be easily formed over a region surrounded by the insulating film 63. As a result, in the plurality of pixels 5, for example, it is possible to suppress the occurrence of defective pixels in which a part of each layer is missing in the pixel 5. For this reason, the display quality in the display of the display device 1 can be easily improved.

  In the present embodiment, the display device 1 in which a plurality of pixels 5 are set and the organic EL element 27 is provided for each pixel 5 has been described as an example, but the embodiment is not limited thereto. As an embodiment, there is also a form such as a lighting device in which the organic EL elements 27 are arranged in a series over the display region 7. Such an illuminating device is suitable for a light source such as a liquid crystal display device.

In the present embodiment, the case where liquid repellency is imparted to the insulating film 63 by performing CF ₄ plasma treatment on the substrate 41a has been described as an example, but the method of imparting liquid repellency is not limited thereto. By forming the insulating film 63 with, for example, a fluororesin, liquid repellency can be imparted to the insulating film 63. As a result, the step of performing the CF ₄ plasma treatment can be omitted, and the efficiency in manufacturing can be improved.

Further, the method for imparting liquid repellency to the insulating film 63 is not limited to the insulating film 63 being made of a fluororesin. Giving liquid repellency to the insulating film 63 can also be achieved by mixing a fluorine compound with a resin containing a positive photosensitive material. Examples of the fluorine compound include a fluorine-based surfactant.
In the formation of the insulating film 63 shown in FIG. 6C, first, a resin film that covers the pixel electrode 29 and the insulating film 61 in a plan view is formed with a resin that forms the insulating film 63. At this time, as the resin constituting the resin film (the resin constituting the insulating film 63), a resin obtained by mixing a fluorosurfactant with an acrylic resin containing a positive photosensitive material is employed.
Next, the resin film is patterned by using, for example, a photolithography technique. Thereby, the insulating film 63 having liquid repellency can be formed. As a result, the step of performing the CF4 plasma treatment can be omitted, and the manufacturing efficiency can be improved.
In addition, as a fluorosurfactant, Megafac BL-20 made by DIC Corporation, Megafac MCF-350SF made by DIC Corporation, etc. can be employed, for example.

By the way, in the method of forming the insulating film 63 by patterning the resin film covering the pixel electrode 29 and the insulating film 61 shown in FIG. 6C, a residue is likely to be generated in the pixel electrode 29 and the insulating film 61.
In the method of forming the insulating film 63 by patterning a resin film (hereinafter referred to as a liquid repellent resin film) formed of a fluororesin or a resin containing a fluorine compound (hereinafter referred to as a liquid repellent resin), FIG. The residue generated in the pixel electrode 29 and the insulating film 61 shown in c) has liquid repellency. If the residue generated in the pixel electrode 29 and the insulating film 61 has liquid repellency, for example, the droplet 65b and the liquid 65a shown in FIG. 10A are repelled on the pixel electrode 29 and the insulating film 61. It becomes easy to be done. As a result, the thickness variation of the organic layer 31 increases in the region of the pixel 5 (pixel formation region), and the display quality may be impaired.
In contrast, in this embodiment, since the substrate 41a is subjected to UV ozone treatment after the formation of the insulating film 63, residues generated in the pixel electrodes 29 and the insulating film 61 are easily removed (ashed). Thereby, the lyophilicity with respect to the droplet 65b of the pixel electrode 29 and the insulating film 61 and the liquid material 65a is improved. As a result, the thickness variation of the organic layer 31 in the region of the pixel 5 (pixel formation region) can be easily reduced, and the display quality can be easily improved.

Note that a method for removing residues generated in the pixel electrode 29 and the insulating film 61 is not limited to the UV ozone treatment. As a method for removing residues generated in the pixel electrode 29 and the insulating film 61, for example, oxygen plasma treatment may be employed.
In the oxygen plasma processing, first, the substrate 41a is placed on the table 99 of the plasma processing apparatus 95 shown in FIG.
Next, the vacuum pump 121 is driven to keep the pressure in the chamber 97 in a reduced pressure state.
Next, the valve 119 is opened to introduce oxygen gas into the chamber 97.
Next, the high frequency power source 117 and the high frequency bias power source 113 are driven to apply a high frequency voltage to the coil 101 and a bias voltage to the table 99.
As a result, oxygen plasma is induced in the chamber 97.
Even in the oxygen plasma treatment, residues in the pixel electrode 29 and the insulating film 61 are easily removed. Thereby, the lyophilicity with respect to the droplet 65b of the pixel electrode 29 and the insulating film 61 and the liquid material 65a is improved. As a result, the thickness variation of the organic layer 31 in the region of the pixel 5 (pixel formation region) can be easily reduced, and the display quality can be easily improved.

Further, in the present embodiment, after performing CF ₄ plasma treatment on the substrate 41a, but the order is subjected to a heat treatment to the substrate 41a is employed, the order of the heat treatment and the CF ₄ plasma treatment is not limited to this. The order of the CF ₄ plasma treatment and heat treatment, the order of applying the CF ₄ plasma treatment after the heat treatment may also be employed.

  In the present embodiment, a configuration in which the hole transport layer 67 is the second layer is employed, but the configuration is not limited to this. If a layer capable of generating holes and sending holes to the light emitting layer 69 is provided as the first layer, a configuration in which the light emitting layer 69 is the second layer may be employed.

In this embodiment, the top emission type organic EL device that emits light from the organic layer 31 from the display surface 3 through the sealing substrate 13 is described as an example. However, the organic EL device is not limited to this. As the organic EL device, a bottom emission type in which light from the organic layer 31 is emitted from the bottom surface 15 through the element substrate 11 may be employed.
In the case of the bottom emission type, since the light from the organic layer 31 is emitted from the bottom surface 15, the display surface 3 is set on the bottom surface 15 side. That is, in the bottom emission type, the bottom surface 15 of the display device 1 and the display surface 3 are interchanged. In the bottom emission type, the bottom surface 15 side corresponds to the upper side, and the display surface 3 side corresponds to the lower side.

  In the case of the bottom emission type, ITO, indium zinc oxide, or the like can be adopted as the material of the pixel electrode 29. In addition, calcium or the like can be adopted as a material for the electron injection layer 71. Aluminum or the like can be used as the material of the common electrode 33.

A second embodiment will be described.
The display device 10 according to the second embodiment includes a sealing substrate 20 as illustrated in FIG. 11 which is a cross-sectional view taken along the line CC in FIG. The display device 10 has the same configuration as the display device 1 except that the sealing substrate 13 in the display device 1 is replaced with the sealing substrate 20. For this reason, in the following second embodiment, in order to avoid redundant description, the same components as those in the first embodiment are denoted by the same reference numerals, detailed description thereof is omitted, and different points from the first embodiment. Only that will be described.

The sealing substrate 20 has a second substrate 141. The second substrate 141 is made of a light-transmitting material such as glass or quartz, for example, and has an outward surface 142a directed to the display surface 3 side and an opposing surface 142b directed to the bottom surface 15 side. is doing.
On the opposing surface 142b of the second substrate 141, an insulating film 143 is provided in a region overlapping the region 62 in plan view. The insulating film 143 is made of, for example, a resin containing a material having a high light absorption property such as carbon black or chrome, and is provided in a lattice shape along the region 62 in a plan view.

In addition, a color filter 145 is provided on the opposing surface 142b of the second substrate 141 to cover each region surrounded by the insulating film 143 from the bottom surface 15 side.
Here, the color filter 145 can transmit light in a predetermined wavelength region of incident light. The color filter 145 is composed of a resin colored in a different color for each of the pixels 5r, 5g, and 5b. The color filter 145 corresponding to the pixel 5r can transmit R light. The color filter 145 corresponding to the pixel 5g can transmit G light, and the color filter 145 corresponding to the pixel 5b can transmit B light. In the following, when R, G, and B are identified for each color filter 145, the notation of color filters 145r, 145g, and 145b is used.

  An overcoat layer 147 is provided on the bottom surface 15 side of the insulating film 143 and the color filter 145. The overcoat layer 147 is made of a light-transmitting resin or the like, and covers the insulating film 143 and the color filter 145 from the bottom surface 15 side.

Here, a method for manufacturing the display device 10 will be described.
The manufacturing method of the display device 10 is roughly divided into a step of manufacturing the element substrate 11, a step of manufacturing the sealing substrate 20, and a step of assembling the display device 10.
Since the process of manufacturing the element substrate 11 and the process of assembling the display device 10 are the same as those in the first embodiment, description thereof is omitted.

In the process of manufacturing the sealing substrate 20, as shown in FIG. 12A, first, an insulating film 143 is formed on the facing surface 142 b of the second substrate 141. In forming the insulating film 143, first, a resin film is formed on the opposing surface 142b with an acrylic resin containing a positive photosensitive material. In the formation of the resin film, spin coating technology, printing technology, or the like can be used. Next, the resin film is patterned by using, for example, a photolithography technique. Thereby, the insulating film 143 can be formed.
Note that the second substrate 141 on which the insulating film 143 is formed is hereinafter referred to as a substrate 141a.

  Next, as shown in FIG. 12B, the substrate 141a is subjected to UV ozone treatment. Thereby, lyophilicity is imparted to the opposing surface 142b with respect to the liquid 146a described later than before the UV ozone treatment. In the present embodiment, a method of generating ultraviolet rays in the processing chamber while introducing a gas containing oxygen into the processing chamber while the substrate 141a is accommodated in the processing chamber is employed. In addition, the UV ozone treatment apparatus 83 (FIG. 8) described above can be applied to the UV ozone treatment.

Next, as shown in FIG. 12C, the substrate 141a is subjected to CF ₄ plasma treatment. Thereby, the liquid repellency is imparted to the insulating film 143 with respect to the liquid 146a described later before the CF ₄ plasma treatment. In the present embodiment, a method is employed in which plasma is generated in the processing chamber while introducing a processing gas into the processing chamber while the processing chamber is kept at a predetermined degree of vacuum. In the present embodiment, CF ₄ gas that is a gas containing a fluorine compound is employed as the processing gas. Further, the above-described plasma processing apparatus 95 (FIG. 9) can be applied to the CF ₄ plasma processing.

  Next, heat treatment is performed on the substrate 141a. In the present embodiment, as a heat treatment method, a method is employed in which the substrate 141a is held for a predetermined holding time in an environment maintained in a predetermined temperature range. As the conditions for the heat treatment, in the present embodiment, a temperature range of 50 ° C. or higher and lower than 280 ° C. and a holding time of about 10 minutes may be employed. If it is less than 50 degreeC, the time required for the effect mentioned later to be acquired will become long. For this reason, it is unpreferable from a viewpoint of efficiency to fall below 50 degreeC. Further, at 280 ° C. or higher, the insulating film 143 made of an organic material may be softened or the weight may be reduced. For this reason, 280 degreeC or more is not preferable.

Following the step of heat-treating the substrate 141a, as shown in FIG. 13A, a liquid material 146a in which a colorant corresponding to each color filter 145 is contained in the pixel formation region surrounded by the insulating film 143. Place. A droplet discharge head 131 can be applied to the arrangement of the liquid material 146a. By discharging the liquid 146a from the droplet discharge head 131 as the droplet 146b, the liquid 146a can be disposed in the pixel formation region surrounded by the insulating film 143.
Next, the color filter 145 shown in FIG. 13B can be formed by drying the liquid material 146a by a reduced pressure drying method.

Next, an overcoat layer 147 (FIG. 11) is formed to cover the insulating film 143 and the color filter 145 in plan view. In the formation of the overcoat layer 147, a spin coating technique, a printing technique, or the like can be used.
Thereby, the sealing substrate 20 shown in FIG. 11 can be manufactured.

In the second embodiment, the insulating film 143 corresponds to the partition, the substrate 141a corresponds to the substrate, and the color filter 145 corresponds to the film.
Further, the step of performing the heat treatment on the substrate 141a corresponds to the heating step. Further, the step of performing UV ozone treatment on the substrate 141a corresponds to the lyophilic step. Further, the process of performing the CF ₄ plasma treatment on the substrate 141a corresponds to the liquid repellent process.

In the display device 10 according to the second embodiment, the sealing substrate 20 includes the color filter 145. The color filter 145 corresponding to the pixel 5r can transmit R light. The color filter 145 corresponding to the pixel 5g can transmit G light, and the color filter 145 corresponding to the pixel 5b can transmit B light.
Thereby, the color purity of the R light from the organic layer 31 of the pixel 5r is increased by the color filter 145r. Similarly, the color purity of the G light from the organic layer 31 of the pixel 5g is enhanced by the color filter 145g, and the color purity of the B light from the organic layer 31 of the pixel 5b is enhanced by the color filter 145b. For this reason, in the display apparatus 10, since the color purity in a display is improved, the display quality is improved.

In the present embodiment, lyophilicity is imparted to the facing surface 142b by UV ozone treatment. Further, liquid repellency is imparted to the insulating film 143 by the CF ₄ plasma treatment. For this reason, when the liquid material 146a is disposed in the region surrounded by the insulating film 143 in the substrate 141a, the liquid material 146a is likely to spread out on the facing surface 142b, and the liquid material 146a is likely to be repelled by the insulating film 143. . For this reason, the liquid 146a is unlikely to get over the insulating film 143. As a result, the color filter 145 can be easily formed over the opposing surface 142b in the region surrounded by the insulating film 143. That is, in each pixel 5, for example, it is possible to easily suppress the occurrence of a defect that a part of the color filter 145 is lost.

  In the second embodiment, the pixel 5r is provided with the light emitting layer 69 that emits R light, the pixel 5g is provided with the light emitting layer 69 that emits G light, and the pixel 5b is provided with the light emitting layer 69 that emits G light. Although the configuration is adopted, the configuration of the light emitting layer 69 is not limited to this. As the light-emitting layer 69, a light-emitting layer 69 that emits white light can also be employed. If the light emitting layer 69 that emits white light is employed, the composition of the light emitting layer 69 can be made equal between the pixels 5r, 5g, and 5b. For this reason, efficiency is achieved in the manufacture of the display device 10. Even when the light emitting layer 69 that emits white light is employed, the display device 10 is provided with the color filters 145r, 145g, and 145b, so that color display can be performed.

Here, examples and comparative examples will be described.
In the examples and comparative examples described below, samples obtained by forming positive photosensitive acrylic resin films on glass substrates were used as samples. Five samples in which films were formed under the same conditions were prepared. The film in each sample was pre-baked at about 80 ° C. for about 2 minutes without being exposed, and then post-baked at about 230 ° C. for about 30 minutes. The five samples are identified as Sample 1, Sample 2, Sample 3, Sample 4, and Sample 5.
Samples 1 and 2 were subjected to UV ozone treatment, CF ₄ plasma treatment, and heat treatment. The order and conditions of these processes were made the same as the order and conditions described above.
Sample 3 and sample 4 were subjected to UV ozone treatment, heat treatment, and CF ₄ plasma treatment in this order. The conditions for these treatments were the same as those described above.
To Sample 5, it was subjected to only UV ozone treatment and the CF ₄ plasma treatment. The order and conditions of these processes were made the same as the order and conditions described above.

Example 1
In the heat treatment for the sample 1, the temperature was set to 200 ° C. and the holding time was set to 10 minutes.
On the acrylic resin film in Sample 1, the liquid material 65a was applied and the contact angle was measured. For the measurement of the contact angle, a fine contact angle meter FTA4000 (manufactured by First Ten Angstroms) was used.
The contact angle in Sample 1 was 90 degrees.

(Example 2)
In the heat treatment for Sample 2, the temperature was set to 100 ° C. and the holding time was set to 10 minutes.
On the acrylic resin film in Sample 2, the liquid material 65a was applied and the contact angle was measured.
The contact angle in Sample 2 was 90 degrees.

(Example 3)
In the heat treatment for the sample 3, the temperature was set to 200 ° C. and the holding time was set to 10 minutes.
A liquid material 65a was applied on the acrylic resin film in Sample 3, and the contact angle was measured.
The contact angle in Sample 3 was 90 degrees.

Example 4
In the heat treatment for the sample 4, a condition was adopted in which the temperature was 100 ° C. and the holding time was 10 minutes.
The liquid material 65a was applied on the acrylic resin film in the sample 4, and the contact angle was measured.
The contact angle in Sample 4 was 90 degrees.

(Comparative example)
A liquid material 65a was applied on the acrylic resin film in Sample 5, and the contact angle was measured.
The contact angle in Sample 5 was 10 degrees.

  The results of Examples 1 to 4 and Comparative Example are shown in Table 1 below.

実施例１〜実施例４及び比較例の結果から、ＵＶオゾン処理の後に基板４１ａに加熱処理を施すことが好ましいことが理解される。また、この結果から、ＣＦ₄プラズマ処理と加熱処理との順序としては、いずれが先でも後でもかまわないことが理解される。

From the results of Examples 1 to 4 and the comparative example, it is understood that it is preferable to heat-treat the substrate 41a after the UV ozone treatment. Also, from this result, it is understood that any order of the CF ₄ plasma treatment and the heat treatment may be first or later.

  The display state of the display device 1 created under each condition in Examples 1 to 4 and the comparative example was observed. As a result, in the display device 1 corresponding to each of Examples 1 to 4, it was confirmed that the luminance unevenness was reduced as compared with the display device corresponding to the comparative example.

  The display device 1 and the display device 10 described above can be applied to, for example, the display unit 510 of the electronic device 500 illustrated in FIG. The electronic device 500 is a mobile phone. This electronic device 500 has an operation button 511. The display unit 510 can display various information including information input by the operation buttons 511 and incoming call information. In this electronic apparatus 500, since the display device 1 or the display device 10 is applied to the display unit 510, display quality in display can be improved.

  The electronic device 500 is not limited to a mobile phone, and includes various electronic devices such as mobile computers, digital still cameras, digital video cameras, in-vehicle devices such as display devices for car navigation systems, and audio devices.

  DESCRIPTION OF SYMBOLS 1,10 ... Display apparatus, 3 ... Display surface, 5 ... Pixel, 7 ... Display area, 11 ... Element substrate, 15 ... Bottom surface, 20 ... Sealing substrate, 27 ... Organic EL element, 29 ... Pixel electrode, 31 ... Organic Layer, 33 ... common electrode, 41 ... first substrate, 41a, 141a ... substrate, 61 ... insulating film, 62 ... region, 63, 143 ... insulating film, 65 ... hole injection layer, 65a ... liquid, 65b ... liquid Drops, 67 ... hole transport layer, 67a ... liquid, 67b ... droplet, 69 ... light emitting layer, 69a ... liquid, 69b ... droplet, 71 ... electron injection layer, 81 ... driving element layer, 83 ... UV ozone Processing apparatus, 95 ... Plasma processing apparatus, 131 ... Droplet discharge head, 141 ... Second substrate, 145 ... Color filter, 146a ... Liquid, 146b ... Droplet, 500 ... Electronic equipment, 510 ... Display unit.

Claims (33)

Preparing a substrate provided with partition walls made of a material containing an organic material so as to partition a pixel formation region in plan view;
A lyophilic step of imparting to the at least part of the partition a lyophilic property greater than the lyophilic property of the partition with respect to the liquid;
A heating step of heating the substrate after the lyophilic step;
Have
In the lyophilic step, the substrate is irradiated with ultraviolet rays in an environment containing a gas containing oxygen.   2. The substrate processing method according to claim 1, wherein in the heating step, the substrate is heated in a range of 50 ° C. or higher and lower than 280 ° C. 3.   The substrate processing method according to claim 1, wherein the material containing the organic material contains a photosensitive material.   4. The substrate processing method according to claim 3, wherein the photosensitive material has positive photosensitivity.   5. The substrate processing method according to claim 1, wherein the partition wall is more lyophobic than the partition wall lyophilic with respect to the liquid material. 6.   6. The method according to claim 1, further comprising a lyophobic step of imparting to the partition a greater lyophobic property than the partition made lyophilic to the liquid after the lyophilic step. The method for processing a substrate according to one item.   The substrate processing method according to claim 6, further comprising the liquid repellency step before the heating step.   The substrate processing method according to claim 6, further comprising the liquid repellency step after the heating step.   9. The plasma treatment is performed on the substrate in an environment containing a gas containing at least one of fluorine and a fluorine compound in the liquid repellency step. Substrate processing method.   The substrate processing method according to claim 5, wherein the liquid repellent substance is included in the material including the organic material.   The method for treating a substrate according to claim 10, wherein the substance having liquid repellency contains at least one of fluorine and a fluorine compound. Preparing a substrate provided with partition walls made of a material containing an organic material so as to partition a pixel formation region in plan view;
A lyophilic step of imparting a lyophilic property greater than the lyophilic property of the partition to a liquid containing a coloring material to at least a part of the partition;
A heating step of heating the substrate after the lyophilic step;
After the heating step, disposing the liquid material in the pixel formation region surrounded by the partition;
Forming a film with the coloring material by drying at least a part of the liquid contained in the liquid; and
Have
In the lyophilic step, the substrate is irradiated with ultraviolet rays in an environment containing an oxygen-containing gas.   The method for producing a color filter according to claim 12, wherein in the heating step, the substrate is heated in a range of 50 ° C or higher and lower than 280 ° C.   The method for producing a color filter according to claim 12 or 13, wherein the material containing the organic material contains a photosensitive material.   The method according to claim 14, wherein the photosensitive material has positive photosensitivity.   The method for producing a color filter according to claim 12, wherein the partition wall has a liquid repellency as compared with the partition wall made lyophilic with respect to the liquid material. .   17. The method according to claim 12, further comprising a lyophobic step of imparting to the partition a greater lyophobic property than the partition made lyophilic to the liquid after the lyophilic step. A method for producing a color filter according to one item.   The method for producing a color filter according to claim 17, further comprising the liquid repellency step before the heating step.   The method for producing a color filter according to claim 17, further comprising the liquid repellency step after the heating step.   The plasma treatment is performed on the substrate in an environment containing a gas containing at least one of fluorine and a fluorine compound in the liquid repellency step. A method for producing a color filter.   The method for manufacturing a color filter according to claim 16, wherein the material including the organic material includes the liquid-repellent substance.   The method for producing a color filter according to claim 21, wherein the substance having liquid repellency contains at least one of fluorine and a fluorine compound. Each of the plurality of pixels includes a pair of electrodes opposed to each other, an organic layer interposed between the pair of electrodes, and a partition wall surrounding the organic layer in plan view, and the organic layer includes a plurality of layers. A method of manufacturing an organic EL device having
Preparing a substrate having the partition walls made of a material containing an organic material;
A lyophilic solution that imparts, to at least a part of the partition wall, a lyophilic property that is greater than the lyophilic property of the partition wall with respect to a liquid that contains a material constituting one of the plurality of layers. Process,
A heating step of heating the substrate after the lyophilic step;
After the heating step, disposing the liquid material in a pixel formation region surrounded by the partition;
Forming a film corresponding to the one layer with a material constituting the one layer by drying at least a part of the liquid contained in the liquid;
Have
In the lyophilic step, the substrate is irradiated with ultraviolet rays in an environment containing an oxygen-containing gas.   The method for manufacturing an organic EL device according to claim 23, wherein, in the heating step, the substrate is heated in a range of 50 ° C or higher and lower than 280 ° C.   25. The method of manufacturing an organic EL device according to claim 23, wherein the material containing the organic material contains a photosensitive substance.   26. The method of manufacturing an organic EL device according to claim 25, wherein the photosensitive material has positive photosensitivity.   27. The manufacturing of an organic EL device according to claim 23, wherein the partition wall is more lyophobic than the partition wall made lyophilic with respect to the liquid material. Method.   28. The method according to claim 23, further comprising a lyophobic step of imparting to the partition a greater lyophobic property than the partition made lyophilic to the liquid after the lyophilic step. A method for producing an organic EL device according to one item.   29. The method of manufacturing an organic EL device according to claim 28, wherein the liquid repellency step is included before the heating step.   29. The method of manufacturing an organic EL device according to claim 28, further comprising the liquid repellency step after the heating step.   31. The plasma treatment according to claim 28, wherein in the liquid repellency step, the substrate is subjected to plasma treatment in an environment containing a gas containing at least one of fluorine and a fluorine compound. Manufacturing method of organic EL device.   28. The method of manufacturing an organic EL device according to claim 27, wherein the material including the organic material includes the liquid-repellent substance.   33. The method of manufacturing an organic EL device according to claim 32, wherein the substance having liquid repellency contains at least one of fluorine and a fluorine compound.

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