JP2005158584A - Pattern formation method and manufacturing method of display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a pattern without breaking it by facilitating the separation of an original plate from a pattern formation material. <P>SOLUTION: A method for forming a predetermined pattern by pressing the original plate 3 having unevenness corresponding to a predetermined pattern against the pattern formation material 2 disposed on a base 1 to pattern the pattern formation material 2 comprises: a process for disposing a reversible film 4 having wettability changed depending on a first heating condition and a second heating condition on a pressing surface 3a of the original plate 3 to press the original plate 3 heated in the first heating condition against the pattern formation material 2; a process for heating the original plate 3 in the second heating condition with the original plate 3 pressed against the pattern formation material 2; and a process for separating the original plate 3 from the pattern formation material 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a pattern forming method and a display device manufacturing method.

  Conventionally, for forming a pixel interval wall for separating each pixel in a display device such as an organic EL device or forming a wiring pattern in a semiconductor device, the resist material is exposed to projection light and then developed. A photolithography method for forming a pattern by doing so is generally used. However, this photolithography method has a plurality of complicated steps as is well known, and it is difficult to form a pattern with time and cost.

For this reason, in recent years, a so-called nanoimprinting technique has been proposed as a technique for improving pattern formation throughput. This nano-imprinting is a method of forming a predetermined pattern by patterning the pattern forming material by pressing an original plate having irregularities corresponding to the pattern against the pattern forming material arranged on the base.
Japanese Patent Laid-Open No. 2002-100079

  However, the pattern in recent years has been increasingly miniaturized, and the pattern width has been reduced accordingly. When trying to form a pattern with such a high aspect ratio (height / width ratio) by the nanoimprinting method, the unevenness of the original plate also has a high aspect ratio as the pattern becomes finer. There is a problem that the pattern forming material and the original plate are difficult to be peeled when dissociating after being pressed against the forming material. If the original and the pattern forming material are not easily separated in this way, the pattern transferred to the pattern forming material is broken when the original is dissociated.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to form a pattern without breaking it by facilitating peeling between the original and the pattern forming material.

  In order to achieve the above object, a pattern forming method according to the present invention presses an original plate having irregularities corresponding to a predetermined pattern against a pattern forming material disposed on a base, and patterns the pattern forming material. A reversible film whose wettability changes depending on the first heating condition and the second heating condition is disposed on the pressing surface of the original plate, and in the first heating condition, A step of pressing the heated original plate against the pattern forming material; a step of heating the original plate under the second heating condition in a state where the original plate is pressed against the pattern forming material; and And a step of dissociating from the pattern forming material.

  According to the pattern forming method according to the present invention having such characteristics, the wettability of the reversible film disposed on the pressing surface of the original plate is changed by changing the heating condition. For this reason, for example, when the reversible membrane is lyophilic by being heated under the first heating condition and lyophobic by being heated under the second heating condition, the reversible membrane is lyophilic. Since the original is pressed against the pattern forming material in the state, the pattern forming material is likely to enter the irregularities formed on the original, and the original is dissociated in a state where the reversible film is lyophobic. The pattern forming material is easily peeled off. Therefore, the pattern can be formed without breaking by facilitating the peeling between the original and the pattern forming material. As described above, when the original is pressed against the pattern forming material, the reversible film is made lyophilic so that the pattern forming material can easily enter the irregularities formed on the original. And the pattern forming material can be prevented from forming a gap, and the pattern forming material can be patterned into a predetermined profile.

Moreover, it is preferable that the pattern formation method which concerns on this invention has the process of removing the residue which remains between the said pattern formation materials, after patterning the said pattern formation material.
Since it is virtually impossible to make the pressing surface of the base and the original plate completely flat, when patterning the pattern forming material, there is a slight pattern between the tip of the convex portion formed on the original and the base. The forming material remains, and this becomes a residue remaining between the patterned pattern forming materials. For example, when a pixel interval wall is formed by the pattern forming method according to the present invention and a residue remains in the pixel interval wall, that is, in the pixel region, good light emission characteristics cannot be obtained. For this reason, it becomes possible to set it as the display apparatus which has a favorable light emission characteristic by having the process of removing the residue which remains between the said pattern formation materials.

  In the pattern forming method according to the present invention, the first heating condition is a state where the reversible film is in contact with the liquid or vapor, and the second heating condition is the liquid reversible film and the liquid or vapor. Can be assumed to be in a non-contact state. Reversible membranes whose wettability changes under such heating conditions are well known and can be easily employed in the reversible membranes of the present invention.

  In the pattern forming method according to the present invention, a resist can be used as the pattern forming material. As described above, by using a resist as a pattern forming material, a process similar to a pattern formed by a conventional photolithography method can be performed after the pattern is formed, so that a process after the pattern formation can be performed in an existing processing apparatus. .

  Next, a manufacturing method of a display device according to the present invention is a manufacturing method of a display device having a plurality of light emitting regions and a pixel interval wall arranged between the light emitting regions, and the pattern forming method according to the present invention. Using the step of forming the pixel interval wall.

  According to the manufacturing method of the display device according to the present invention having such a feature, the pixel interval walls are formed by the pattern forming method according to the present invention, so that the pixel interval walls can be reliably formed.

Next, a method for manufacturing a display device according to the present invention is a method for manufacturing a display device having a plurality of pixel regions and pixel interval walls arranged between the pixel regions, wherein the pixel interval walls are formed on one surface of a substrate. A step of disposing the material, a step of forming a mask on the material of the pixel interval wall using the pattern forming method according to the present invention, a step of exposing the material of the pixel interval wall through the mask, The pixel spacing wall is formed by developing the exposed material of the pixel spacing wall.
As described above, the pattern forming method according to the present invention can also be applied to the formation of a mask, which is one step in forming the pixel interval wall by photolithography.

  Hereinafter, an embodiment of a pattern forming method and a display device manufacturing method according to the present invention will be described with reference to the drawings. In each drawing used for the following description, the scale of each member is appropriately changed in order to make each member a recognizable size.

(Pattern formation method)
FIG. 1 is a cross-sectional view of a substrate 1 (base) on which a predetermined pattern is formed. As shown in this figure, a patterned resist 2 (pattern forming material) is disposed on the substrate 1, and a predetermined pattern is formed by the resist 2.

Next, a pattern forming method according to the present embodiment will be described with reference to FIG.
First, as shown in FIG. 2A, a resist 2 is applied to the entire surface of the substrate 1 by, eg, spin coating. Subsequently, as shown in FIG. 2B, the original plate 3 is disposed to face the substrate 1. Concavities and convexities corresponding to a predetermined pattern are formed on the surface 3a (pressing surface) of the original 3 facing the substrate 1, and a reversible film 4 is disposed on the surface 3a.

  The reversible membrane 4 is lyophilic by being heated in a state where it is in contact with the liquid or vapor (first heating condition), and is heated in a state where the liquid or vapor is not in contact (second heating condition). As a result, liquid repellency is achieved. Such substances that change the wettability according to the heating conditions are disclosed in, for example, Japanese Patent Application Laid-Open No. 5-305764 and are well known. Specifically, it is an organic compound in which a hydrophobic group is arranged on the surface. Further, nickel or the like can be used as a constituent material of the original plate 3.

Then, the reversible membrane 4 is heated in a state of being in contact with a liquid or vapor in advance in FIG.
Examples of the liquid include water, an aqueous solution containing an electrolyte, a polar liquid such as an alcohol such as ethanol and n-butanol, a polyhydric alcohol such as glycerin and ethylene glycol, and a ketone such as methyl ethyl ketone, and n- Nonpolar liquids such as linear hydrocarbons such as nonane and n-octane, cyclic hydrocarbons such as cyclohexane, and aromatic hydrocarbons such as m-xylene and benzene can be used. As the vapor, in addition to water vapor, any vapor of the above liquid can be used, but it is particularly preferable to use vapor of an organic compound such as ethanol vapor or m-xylene vapor.

  As a means for heating the reversible film 4, any heating means may be used as long as the reversible film 4 is heated. For example, a contact heating means such as a heater or a thermal head may be used. Further, non-contact heating means using electromagnetic waves may be used. The heating temperature is 50 to 250 ° C., and the heating time is about 0.1 msec to 1 second.

  Next, as shown in FIG. 2C, the original 3 is pressed against the resist 2. At this time, the original 3 is pressed until the convex portion 3 a 1 of the facing surface 3 a of the original 3 contacts the substrate 1. Since the resist 2 is solid but has fluidity, the reversible film 4 is made lyophilic here, so that the resist 2 uniformly enters the concave portion 3a2 of the facing surface 3a of the original plate 3.

  Subsequently, in the state shown in FIG. 2C (the state in which the original plate 3 is pressed against the resist 2), the entire substrate 1, that is, the reversible film 4 is heated. In this state, since the reversible film 4 is not in contact with the liquid and vapor, it is made liquid repellent by heating. In this case, the heating temperature is 50 to 300 ° C., and the heating time is about 0.1 msec to 10 sec.

  Then, as shown in FIG. 2D, the resist 2 is patterned by dissociating the original 3. At this time, since the reversible film 4 is made liquid repellent, the original 3 and the resist 2 are easily peeled off. Therefore, it is possible to dissociate the original 3 without destroying the shape of the patterned resist 2.

  On the substrate 1 between the resists 2 and 2 thus patterned, as shown in FIG. 2D, the resist remaining between the convex portion 3a1 of the opposing surface 3a of the original plate 3 and the substrate 1 is present. Residue X remains. For this reason, the residue X remaining on the substrate 1 between the resists 2 and 2 is removed by performing a light etching process. Thereafter, the substrate 1 is baked and the resist 2 is cured to form a pattern as shown in FIG.

  According to such a pattern forming method according to the present embodiment, the reversible film 4 exhibits lyophilicity by being heated in contact with the liquid or vapor, and is heated in a non-contact state with the liquid or vapor. Since the liquid repellency is exhibited, the original and the pattern forming material can be easily separated, and the pattern shape can be formed without breaking.

(Display device)
FIG. 3 is a schematic diagram of an active matrix organic EL device 100 which is a display device according to the present embodiment. The illustrated organic EL device 100 employs an active driving method using thin film transistors.

  The organic EL device 100 includes a circuit element unit 14 including a thin film transistor as a circuit element on a substrate 20, a pixel electrode (anode) 111, an organic functional layer 110 including an organic EL layer (light emitting layer), a counter electrode (cathode) 12, and A plurality of organic EL elements 10 having a structure in which the sealing portions 3 and the like are sequentially laminated are arranged in a matrix.

  As the substrate 20, a glass substrate is used in the present embodiment. As the substrate 20, various known substrates used for electro-optical devices and circuit substrates such as a silicon substrate, a quartz substrate, a ceramic substrate, a plastic substrate, and a plastic film substrate can be used in addition to a glass substrate. The surface of the substrate 20 (the lower surface in FIG. 1) is preferably subjected to a dereflection treatment that suppresses reflection of external light. Since the reflection of external light can be suppressed by subjecting the surface of the substrate 20 to the anti-reflection treatment, the contrast of the organic EL device 100 can be improved. In the substrate 20, a plurality of pixel areas A as light emitting areas are arranged in a matrix. When color display is performed, for example, each of red (R), green (G), and blue (B) colors is supported. Pixel areas A to be arranged are arranged in a predetermined arrangement. In each pixel region A, a pixel electrode 111 is arranged, and in the vicinity thereof, a signal line 132, a power supply line 133, a scanning line 131, scanning lines for other pixel electrodes (not shown), and the like are arranged. As the planar shape of the pixel region A, an arbitrary shape such as a circle or an oval is applied in addition to a rectangle as illustrated.

  The sealing portion 30 prevents the cathode 12 or the organic functional layer 110 from being oxidized by preventing water and oxygen from entering, and the sealing resin applied to the substrate 20 and the sealing bonded to the substrate 20. A stop substrate 30b (sealing can) and the like are included. As the material of the sealing resin, for example, a thermosetting resin or an ultraviolet curable resin is used, and in particular, an epoxy resin which is a kind of thermosetting resin is preferably used. The sealing resin is circularly applied to the periphery of the substrate 20, and is applied by, for example, a microdispenser. The sealing substrate 30b is made of glass, metal, or the like, and the substrate 20 and the sealing substrate 30b are bonded together via a sealing resin.

  FIG. 4 shows a circuit structure of the organic EL device 100. In FIG. 4, a plurality of scanning lines 131, a plurality of signal lines 132 extending in a direction intersecting the scanning lines 131, and a plurality of power supply lines 133 extending in parallel with the signal lines are wired on the substrate 20. ing. Further, the pixel region A is formed at each intersection of the scanning line 131 and the signal line 132. For example, the data line driving circuit 103 including a shift register, a level shifter, a video line, and an analog switch is connected to the signal line 132. Further, the scanning line drive circuit 104 including a shift register and a level shifter is connected to the scanning line 131.

  In the pixel region A, a switching thin film transistor 123 in which a scanning signal is supplied to the gate electrode through the scanning line 131 and a storage capacitor for holding an image signal supplied from the signal line 132 through the switching thin film transistor 123. 135, a driving thin film transistor 124 to which an image signal held by the storage capacitor 135 is supplied to the gate electrode, and the power line 133 when electrically connected to the power line 133 through the driving thin film transistor 124 A pixel electrode (anode) 111 into which a driving current flows and an organic functional layer 110 sandwiched between the pixel electrode 111 and the cathode 12 are provided. The organic functional layer 110 includes a light emitting layer as an organic EL element.

  In the pixel region A, when the scanning line 131 is driven and the switching thin film transistor 123 is turned on, the potential of the signal line 132 at that time is held in the holding capacitor 135, and the driving thin film transistor according to the state of the holding capacitor 135. The conduction state of 124 is determined. In addition, a current flows from the power supply line 133 to the pixel electrode 111 through the channel of the driving thin film transistor 124, and further a current flows to the cathode 12 through the organic functional layer 110. The organic functional layer 110 emits light according to the amount of current at this time.

  FIG. 5 is an enlarged view of the cross-sectional structure of the display region in the organic EL device 100. FIG. FIG. 5 shows a cross-sectional structure of three pixel regions corresponding to each color of red (R), green (G), and blue (B). As described above, the organic EL device 100 includes the circuit element unit 14 in which a circuit such as a TFT is formed on the substrate 20, the light emitting element unit 11 in which the pixel electrode 111 and the organic functional layer 110 are formed, the cathode 12, and the like. Are sequentially stacked. In the organic EL device 100, light emitted from the organic functional layer 110 to the substrate 20 side is transmitted through the circuit element unit 14 and the substrate 20 and emitted to the lower side (observer side) of the substrate 20, and the organic functional layer 110. Then, the light emitted from the opposite side of the substrate 20 is reflected by the cathode 12, passes through the circuit element portion 14 and the substrate 20, and is emitted to the lower side (observer side) of the substrate 20.

  In the circuit element portion 14, a base protective film 2c made of a silicon oxide film is formed on the substrate 20, and an island-like semiconductor film 141 made of polycrystalline silicon is formed on the base protective layer 2c. Note that a source region 141a and a drain region 141b are formed in the semiconductor film 141 by high concentration P ion implantation. A portion where P is not introduced is a channel region 141c. Further, a transparent gate insulating film 142 covering the base protective film 2c and the semiconductor film 141 is formed in the circuit element portion 14, and a gate electrode 143 made of Al, Mo, Ta, Ti, W, or the like is formed on the gate insulating film 142. (Scanning lines) are formed, and a transparent first interlayer insulating film 144 a and a second interlayer insulating film 144 b are formed on the gate electrode 143 and the gate insulating film 142. The gate electrode 143 is provided at a position corresponding to the channel region 141c of the semiconductor film 141. Also, contact holes 145 and 146 are formed through the first and second interlayer insulating films 144a and 144b and connected to the source and drain regions 141a and 141b of the semiconductor film 141, respectively.

  On the second interlayer insulating film 144b, a transparent pixel electrode 111 made of ITO or the like is formed by patterning into a predetermined shape, and one contact hole 145 is connected to the pixel electrode 111. In this manner, the driving switching thin film transistor 123 connected to each pixel electrode 111 is formed in the circuit element portion 14. The circuit element unit 14 is also formed with the storage capacitor 135 and the driving thin film transistor 124 described above, but these are not shown in FIG.

  The light emitting element unit 11 mainly includes an organic functional layer 110 stacked on each of the plurality of pixel electrodes 111 and a bank unit 112 disposed between the organic functional layers 110 to partition each organic functional layer 110. It is configured. A cathode 12 is disposed on the organic functional layer 110. The organic EL element 10 that is a light emitting element includes a pixel electrode 111, a cathode 12, an organic functional layer 110, and the like. Here, the pixel electrode 111 is made of ITO, and is formed by patterning into a substantially rectangular shape in plan view. The thickness of the pixel electrode 111 is preferably in the range of 50 to 200 nm, particularly about 150 nm.

As shown in FIG. 5, the bank unit 112 is configured by laminating an inorganic bank layer 112 a positioned on the substrate 20 side and an organic bank layer 112 b (pixel interval wall) positioned away from the substrate 20. The inorganic bank layer 112a is made of an inorganic material such as SiO ₂ or TiO ₂ , for example. The organic bank layer 112b is formed of a resist having heat resistance and solvent resistance such as acrylic resin and polyimide resin. The organic bank layer 112b is formed by the pattern forming method described above.

  The organic functional layer 110 includes a hole injection / transport layer 110a laminated on the pixel electrode 111, a light emitting layer (organic EL layer) 110b formed adjacent to the hole injection / transport layer 110a, and a light emitting layer. 110b and an electron injection / transport layer 110c formed on the bank 112 and over the entire surface. The hole injection / transport layer 110a has a function of injecting holes into the light emitting layer 110b and a function of transporting holes inside the hole injection / transport layer 110a. The electron injection / transport layer 110c has a function of injecting electrons into the light emitting layer 110b and a function of transporting electrons inside the electron injection / transport layer 110c. By providing such a hole injection / transport layer 110a between the pixel electrode 111 and the light emitting layer 110a and providing an electron injection / transport layer 110c between the cathode 12 and the light emitting layer 110b, the luminous efficiency of the light emitting layer 110b, The device characteristics such as lifetime are improved. In the light emitting layer 110b, the holes injected from the hole injection / transport layer 110a and the electrons injected from the electron injection / transport layer 110c are recombined in the light emitting layer 110b to obtain light emission.

In the light emitting layer 110b, the red light emitting layer 110b ₁ that emits red (R), the green light emitting layer 110b ₂ that emits green (G), and the blue light emitting layer 110b ₃ that emits blue (B) have different wavelength bands. It consists three different types, each emitting layer 110b ₁ ~110b ₃ are arranged in a predetermined array (e.g., stripes).

Next, the cathode 12 is formed on the entire surface of the light emitting element portion 11, and plays a role of injecting electrons into the electron injection / transport layer 110c. The cathode 12 is configured by laminating a calcium layer 12a and an aluminum layer 12b. The layer thickness of the calcium layer is preferably in the range of 2 to 50 nm, for example. The aluminum layer 12b reflects the light emitted from the light emitting layers 110b _{1 to} 110b ₃ to the substrate 20 side, and is preferably made of an Ag film, an Al / Ag laminated film, or the like in addition to the Al film. The thickness is preferably in the range of 100 to 1000 nm, for example.

  Next, a method for manufacturing the organic EL device 100 will be described with reference to FIGS. On the substrate 20, the circuit element portion 14 including the switching and driving thin film transistors 123 and 124, the inorganic bank layer 112 a, and the pixel electrode 111 shown in FIG. 5 are already formed. To do.

  The manufacturing method of this embodiment includes (1) an organic bank layer forming step, (2) a hole injection / transport layer forming step, (3) a light emitting layer forming step, (4) an electron injection / transport layer forming step, (5 ) A cathode forming step and (6) a sealing step. In addition, the manufacturing method demonstrated here is an example, Comprising: Another process is added as needed, A part of said process is removed. The (2) hole injection / transport layer forming step and (3) light emitting layer forming step were performed using a liquid discharge method (inkjet method) using a droplet discharge device.

(1) Organic Bank Layer Forming Step This organic bank layer forming step is a step of forming the organic bank layer 112b by the above pattern forming method. First, as shown in FIG. A resist 40, which is a material for forming the organic bank layer 112b, is applied to the entire surface of the substrate 20 on which the inorganic bank layer 112a is formed by, for example, spin coating. Subsequently, as shown in FIG. 6B, the original 50 having the reversible film 4 that exhibits lyophilicity is pressed against the resist 40 by being heated in contact with a liquid or vapor. In addition, an uneven portion corresponding to each pixel region is formed on the pressing surface of the original 50. Then, the substrate 20 is heated, that is, the reversible film 4 and the liquid or vapor are heated in a non-contact state to make the reversible film 4 liquid repellent, and then the original 50 is dissociated from the substrate 20. As a result, as shown in FIG. 6C, the resist 40 is patterned so as to correspond to each pixel region. Then, after the residue remaining between the resists 40 and 40 is removed by a light etching process or the like, the resist 4 is cured by baking the substrate 20, and the organic bank layer 112b is formed.

(2) Hole Injection / Transport Layer Formation Step As shown in FIG. 7, a hole injection / transport layer 110a is formed on the substrate 20 on which the pixel electrode 111 is formed. In the hole injection / transport layer forming step, for example, a composition containing a hole injection / transport layer forming material is discharged onto the pixel electrode 111 by using a liquid discharge method. Thereafter, a drying process and a heat treatment are performed to form the hole injection / transport layer 110 a on the pixel electrode 111. The subsequent steps including the hole injection / transport layer forming step are preferably performed in an inert gas atmosphere such as a nitrogen atmosphere or an argon atmosphere.

  As a procedure for forming a hole injection / transport layer by a liquid discharge method, a discharge head (not shown) for discharging a liquid is filled with a composition ink containing a material for the hole injection / transport layer, and then the discharge head is used. The discharge nozzle is opposed to the pixel electrode 111 located in the opening of the bank portion 112, and the discharge head and the substrate 20 are moved relative to each other, and an ink droplet with a controlled liquid amount is discharged from the discharge nozzle. To do. Thereafter, the ejected ink droplets are dried to evaporate the polar solvent (liquid material) contained in the composition ink, thereby forming the hole injection / transport layer.

  As the composition used here, for example, a composition obtained by dissolving a mixture of a polythiophene derivative such as polyethylenedioxythiophene (PEDOT) and polystyrenesulfonic acid (PSS) in a polar solvent can be used. Examples of the polar solvent include isopropyl alcohol (IPA), normal butanol, γ-butyrolactone, N-methylpyrrolidone (NMP), 1,3-dimethyl-2-imidazolidinone (DMI) and its derivatives, carbitol acetate And glycol ethers such as butyl carbitol acetate. More specifically, the composition of the PEDOT: PSS mixture (PEDOT / PSS = 1: 20): 12.52 wt%, PSS: 1.44 wt%, IPA: 10 wt%, NMP: 27.48 A weight%, DMI: 50 weight% can be illustrated. The viscosity of the composition is preferably about 2 to 20 Ps, particularly about 4 to 15 cPs.

(3) Light-Emitting Layer Formation Step Next, as shown in FIG. 8, the light-emitting layer 110b is formed on the pixel electrode 111 on which the hole injection / transport layer 110a is stacked. In FIG. 5, the blue light emitting layer 110b ₃ is formed, and then the red light emitting layer 110b ₁ and the green light emitting layer 110b ₂ are sequentially formed as shown in FIG. Here, the composition ink containing the light emitting layer material is discharged onto the hole injection / transport layer 110a by a liquid discharge method, and then dried and heat-treated to emit light of each color in the opening formed in the bank portion 112. forming a layer 110b ₁ ~110b _3.

  In the light emitting layer forming step, non-polarity that is insoluble in the hole injecting / transporting layer 110a is used as a solvent for the composition ink used in forming the light emitting layer in order to prevent re-dissolution of the hole injecting / transporting layer 110a. Use solvent. In this case, in order to improve the wettability of the surface of the hole injection / transport layer 110a with respect to the nonpolar solvent, it is preferable to perform a surface modification step before forming the light emitting layer. The surface modification step is performed, for example, by applying the same solvent as the nonpolar solvent or a similar solvent on the hole injection / transport layer 110a by a liquid discharge method, a spin coating method, a dip method, or the like and then drying. Examples of the surface modifying solvent used here are cyclohexylbenzene, dihydrobenzofuran, trimethylbenzene, tetramethylbenzene and the like as the nonpolar solvent of the composition ink. Examples of the solvent are toluene, xylene and the like.

As procedure of forming the light emitting layer by the liquid discharge method, the time of formation of the blue light-emitting layer First, filled with the composition ink containing the material for forming the blue light emitting layer 110b ₃ to the ejection head (not shown), the ejection head The discharge nozzle is opposed to the blue (B) hole injection / transport layer 110a located in the opening of the bank 112, and the liquid per droplet is discharged from the discharge nozzle while relatively moving the discharge head and the substrate 20. An ink droplet whose amount is controlled is ejected. The ejected ink droplet spreads on the hole injection / transport layer 110a and fills the opening of the bank 112. Subsequently, the non-polar solvent contained in the composition ink is evaporated by drying the ejected ink droplets, and the blue light emitting layer 110b ₃ is formed.

As the light emitting material for forming the blue light emitting layer 110b _3, it can be used, for example distyryl biphenyl and its derivatives, coumarin and its derivatives, those made of an organic EL material such as tetraphenylbutadiene and its derivatives. On the other hand, as the nonpolar solvent, those insoluble in the hole injection / transport layer are preferable. For example, cyclohexylbenzene, dihydrobenzofuran, trimethylbenzene, tetramethylbenzene, and the like can be used.

Subsequently, on the hole injection / transport layer 110a are stacked red (R) and green (G) for the pixel electrode 111, to form a red light-emitting layer 110b ₁ and the green light emitting layer 110b _2, respectively. The red and green light emitting layer forming steps are performed in the same procedure as the blue light emitting layer forming step described above. That is, the liquid discharging method, dried and heat treated after discharging a composition ink containing the material for forming the green light-emitting layer 110b ₂ green (G) hole injection / transport layer 110a for the bank portion 112 forming the green light-emitting layer 110b ₂ in the opening formed in. Further, the bank portion 112 is subjected to a drying process and a heat treatment after discharging a composition ink containing a material for forming the red light emitting layer 110b ₁ onto the red (R) hole injection / transport layer 110a by a liquid discharge method. forming the red light-emitting layer 110b ₁ in the opening formed in. Note that the light-emitting material for forming the green light-emitting layer 110b _2, for example, there can be used those made of organic EL material such as quinacridone and its derivatives, as a luminescent material for forming the red light-emitting layer 110b _1, for example, rhodamine and What consists of organic electroluminescent materials, such as the derivative | guide_body, can be used.

(4) Electron Injection / Transport Layer Formation Step Next, as shown in FIG. 9, the electron injection / transport layer 110c is formed on the entire surface of the light emitting layer 110b and the bank layer 112. The electron injecting / transporting layer 110c is preferably formed by a vapor deposition method, a sputtering method, a CVD method, or the like. In particular, the electron injection / transport layer 110c is preferably formed by a vapor deposition method from the viewpoint of preventing damage to the light emitting layer 110b due to heat.

(5) Cathode Formation Step Next, as shown in FIG. 10, the cathode 12 that forms a pair with the pixel electrode (anode) 111 is formed. That is, the entire region of the substrate 20 including the color light emitting layers 110b ₁ ~110b ₃ and bank portions 112 are sequentially laminated a calcium layer 12a and the aluminum layer 12b to form the cathode 12. Thus, the entire formation region of each color light emitting layer 110b ₁ ~110b _3, the cathode 12 is laminated, red (R), green (G), the organic EL elements ₁₀ 1 to 10 ₃ corresponding to the respective colors of blue (B) Are formed respectively.

The cathode 12 is preferably formed by, for example, a vapor deposition method, a sputtering method, a CVD method, or the like, and particularly preferably formed by a vapor deposition method in terms of preventing damage to the light emitting layers 110b _{1 to} 110b ₃ due to heat. Further, a protective layer such as SiO ₂ or SiN may be provided on the cathode 12 to prevent oxidation.

(6) Sealing process Finally, the substrate 20 on which the organic EL element (light emitting element) is formed and the sealing substrate 30b (see FIG. 3) are sealed with a sealing resin. For example, a sealing resin made of a thermosetting resin or an ultraviolet curable resin is applied to the peripheral portion of the substrate 20, and the sealing substrate 30b is disposed on the sealing resin. The sealing step is preferably performed in an inert gas atmosphere such as nitrogen, argon, or helium. If it is carried out in the air, when a defect such as a pinhole has occurred in the cathode 12, water or oxygen may enter the cathode 12 from the defective portion and the cathode 12 may be oxidized, which is not preferable.

  Thereafter, the cathode 12 is connected to the wiring of the substrate 20, and the wiring of the circuit element unit 14 (see FIG. 3) is connected to a driving IC (driving circuit) provided on or outside the substrate 20. The organic EL device 100 is completed.

According to the method of manufacturing the organic EL device 100 according to this embodiment, the organic bank layer 112b is formed by the pattern forming method described above, and thus the organic bank layer 112b patterned into a desired shape is formed. be able to.
Further, since the residue remaining between the patterned resists 40 and 40 is removed by the light etching process, a display device having more excellent light emission characteristics can be obtained.

Next, an organic bank layer forming step (second organic bank forming step) different from the above-described organic bank layer forming step will be described with reference to FIG.
In the second organic bank forming step, the organic bank 112b is formed by a photolithography method using a mask patterned by the pattern forming method described above.
First, as shown in FIG. 11A, a second resist 60 having a property different from that of the resist 40 is applied on the resist 40. Subsequently, as shown in FIG. 11B, the original plate 70 having the reversible film 4 showing lyophilicity is pressed against the second resist 60 by being heated in contact with the liquid or vapor. In addition, an uneven portion corresponding to each pixel region is formed on the pressing surface of the original plate 70. Then, the substrate 20 is heated, that is, the reversible film 4 and the liquid or vapor are heated in a non-contact state to make the reversible film 4 liquid repellent, and then the original plate 70 is dissociated from the substrate 20. As a result, a mask M is formed as shown in FIG. Thereafter, the resist 40 is exposed through the mask M, further developed, and cured to form the organic bank layer 112b.
As described above, the pattern forming method described above can also be used in the case of forming a mask M for exposing such a resist 40.

It is sectional drawing of the board | substrate 1 with which the pattern which concerns on one Embodiment of this invention was formed. It is a figure for demonstrating the formation method of a pattern similarly. It is explanatory drawing which shows typically the structure of the organic electroluminescent apparatus concerning one Embodiment of this invention. It is a circuit diagram which shows the circuit of an active matrix type organic electroluminescent apparatus. It is an enlarged view which shows the cross-section of the display area of an organic electroluminescent apparatus. It is explanatory drawing for demonstrating the manufacturing method of an organic electroluminescent apparatus. It is explanatory drawing for demonstrating the manufacturing method of an organic electroluminescent apparatus. It is explanatory drawing for demonstrating the manufacturing method of an organic electroluminescent apparatus. It is explanatory drawing for demonstrating the manufacturing method of an organic electroluminescent apparatus. It is explanatory drawing for demonstrating the manufacturing method of an organic electroluminescent apparatus. It is explanatory drawing for demonstrating the manufacturing method of an organic electroluminescent apparatus.

Explanation of symbols

1, 20 ... Substrate (base), 2, 40 ... Resist (pattern forming material), 3, 50, 70 ... Original plate, 4 ... Reversible film

Claims (7)

A method of forming a predetermined pattern by pressing an original plate having irregularities corresponding to a predetermined pattern against a pattern forming material disposed on a base, and patterning the pattern forming material,
A reversible film whose wettability changes depending on the first heating condition and the second heating condition is disposed on the pressing surface of the original plate,
Pressing the original heated under the first heating condition against the pattern forming material;
Heating the original plate in the second heating condition with the original plate pressed against the pattern forming material;
A step of dissociating the original from the pattern forming material. The pattern forming method according to claim 1, wherein the reversible film is made lyophilic by being heated under the first heating condition, and is made lyophobic by being heated under the second heating condition. . 3. The pattern forming method according to claim 1, further comprising a step of removing a residue remaining between the pattern forming materials after patterning the pattern forming material. The first heating condition is a state where the reversible membrane is in contact with the liquid or vapor, and the second heating condition is a state where the reversible membrane is not in contact with the liquid or vapor. The pattern formation method according to any one of claims 1 to 3. The pattern forming method according to claim 1, wherein the pattern forming material is a resist. A method of manufacturing a display device having a plurality of light emitting regions and a pixel interval wall disposed between the light emitting regions,
A method for manufacturing a display device, comprising the step of forming the pixel interval wall using the pattern forming method according to claim 1. A method of manufacturing a display device having a plurality of pixel regions and a pixel interval wall disposed between the pixel regions,
Disposing the pixel spacing wall material on one surface of the substrate;
Forming a mask on the material of the pixel interval wall using the pattern forming method according to claim 1;
Exposing the material of the pixel spacing walls through the mask;
And developing the exposed material of the pixel spacing wall to form the pixel spacing wall.

Images