JP2010027683A - Exposure apparatus, exposure method, and production method of device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus suppressing the occurrence of an exposure defect and/or the lowering of the throughput. <P>SOLUTION: This exposure apparatus exposes a substrate to exposing light through a liquid. The exposure apparatus comprises: an optical member irradiating exposing light; an immersion member located in the vicinity of the optical member and forming an immersion space so that a light path of the exposing light between the optical member and an object is filled with a liquid; a feed opening feeding the liquid onto the object; and a recover opening recovering the liquid on the object. The exposure apparatus performs a liquid recovering action using the recover opening in at least a part of an unirradiated period during which the exposing light is not irradiated from the optical member, and moves the object relative to the optical member in a first state in which a liquid feeding action using the feed opening is stopped. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method.

As an exposure apparatus used in a photolithography process, there is known an immersion exposure apparatus that exposes a substrate with exposure light through a liquid, as disclosed in Patent Document 1.
US Patent Application Publication No. 2005/259234

  In the immersion exposure apparatus, when the substrate is moved at a high speed, it may be difficult to continuously fill the space between the optical member such as the projection optical system and the substrate with the liquid. In addition, when the substrate is moved at a high speed, the liquid may leak from the predetermined space, or the liquid (film, droplet, etc.) may remain on the substrate. As a result, there is a possibility that an exposure failure such as a defect occurs in a pattern formed on the substrate or a defective device may occur. On the other hand, when the movement speed of the substrate is lowered in order to hold the liquid satisfactorily, the throughput may be lowered.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure and / or suppress a decrease in throughput. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices and / or suppress a decrease in throughput.

  According to the first aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, an optical member that emits exposure light, and an optical member and an object that are disposed in the vicinity of the optical member. An immersion member capable of forming an immersion space so that the optical path of the exposure light is filled with liquid, a supply port capable of supplying the liquid onto the object, and a recovery port capable of collecting the liquid on the object In a first state in which the liquid recovery operation using the recovery port is performed and the liquid supply operation using the supply port is stopped in at least part of the non-irradiation period in which the exposure light is not emitted from the optical member, An exposure apparatus that moves an object relative to an optical member is provided.

  According to a second aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first aspect and developing the exposed substrate.

  According to a third aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light from an optical member through a liquid, wherein at least part of a non-irradiation period in which the exposure light is not emitted from the optical member. In the first state where the liquid recovery operation using the recovery port is executed and the liquid supply operation using the supply port is stopped, the substrate is moved relative to the optical member, and the recovery is performed at least during a non-irradiation period. In the second state in which the liquid recovery operation using the mouth and the liquid supply operation using the supply port are performed, the substrate is moved with respect to the optical member, and in the second state, between the substrate and the optical member. Irradiating the substrate with exposure light from an optical member via a liquid from a supply port filled in a space including the optical path.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method of the third aspect and developing the exposed substrate.

  According to the present invention, it is possible to suppress a decrease in throughput while suppressing the occurrence of exposure failure and manufacture a desired device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the present embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A measuring stage 3 mounted with a measuring instrument C to be moved, an illumination system IL for illuminating the mask M with the exposure light EL, and a projection for projecting an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P An optical system PL, a liquid immersion member 4 capable of forming the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ, a control device 5 that controls the operation of the entire exposure apparatus EX, A storage device 16 is provided which is connected to the control device 5 and stores various information relating to exposure.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask in which a predetermined pattern is formed on a transparent plate such as a glass plate using a light shielding film such as chromium. A reflective mask can also be used as the mask M. The substrate P is a substrate for manufacturing a device. The substrate P includes a base material such as a semiconductor wafer such as a silicon wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes the irradiation position of the exposure light EL emitted from the illumination system IL. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 1 can move to the illumination region IR while holding the mask M. The mask stage 1 is movable in three directions, for example, an X axis, a Y axis, and a θZ direction by the operation of a drive system 6 including a linear motor, for example.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes the irradiation position of the exposure light EL emitted from the projection optical system PL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 is movable to the projection region PR while holding the substrate P. The substrate stage 2 is movable on the guide surface 8 of the base member 7 including the projection region PR. The guide surface 8 is substantially parallel to the XY plane.

  The measurement stage 3 is movable to the projection region PR with the measuring instrument C mounted. The measurement stage 3 is movable on the guide surface 8 of the base member 7 including the projection region PR. The measuring instrument C can measure the exposure light EL. As the measuring instrument C mounted on the measuring stage 3, for example, at least a part of an aerial image measuring system capable of measuring an aerial image by the projection optical system PL as disclosed in US Patent Application Publication No. 2002/0041377. For example, at least a part of an illuminance unevenness measurement system capable of measuring the illuminance unevenness of the exposure light EL as disclosed in US Pat. No. 4,465,368, for example, as disclosed in US Pat. No. 6,721,039 At least a part of a measurement system capable of measuring the amount of change in the transmittance of the exposure light EL of the projection optical system PL, for example, an irradiation amount measurement system (for example, as disclosed in US Patent Application Publication No. 2002/0061469) At least part of the illuminance measuring system) and, for example, as disclosed in EP 1079223 At least a portion or the like of the wavefront aberration measuring system can be mentioned. An example of an exposure apparatus that includes a substrate stage that can move while holding a substrate and a measurement stage that can move by mounting a measuring instrument that measures exposure light without holding the substrate is, for example, It is disclosed in US Pat. No. 6,897,963, European Patent Application No. 1713113, and the like.

  In the present embodiment, each of the substrate stage 2 and the measurement stage 3 is operated on the guide surface 8 by an operation of a drive system 9 including a linear motor, for example, on the X axis, Y axis, Z axis, θX, θY, and It can move in six directions of θZ direction.

  In the present embodiment, the position information of the mask stage 1, the substrate stage 2, and the measurement stage 3 is measured by an interferometer system 10 including laser interferometer units 10A and 10B. The laser interferometer unit 10 </ b> A can measure position information of the mask stage 1 using a measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 10 </ b> B can measure the positional information of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2 </ b> R disposed on the substrate stage 2 and the measurement mirror 3 </ b> R provided on the measurement stage 3. When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 5 operates the drive systems 6 and 9 based on the measurement result of the interferometer system 10 to thereby operate the mask stage 1 (mask M), position control of the substrate stage 2 (substrate P) and the measurement stage 3 (measuring instrument C) is executed.

  The liquid immersion member 4 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. The liquid immersion member 4 is disposed in the vicinity of the terminal optical element 11 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 4 is an annular member and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 4 is disposed around the terminal optical element 11.

  The last optical element 11 has an exit surface 12 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, the immersion space LS is an optical path of the exposure light EL between the terminal optical element 11 and an object disposed at the irradiation position (projection region PR) of the exposure light EL emitted from the terminal optical element 11. Is filled with the liquid LQ. In the present embodiment, the object that can be arranged in the projection region PR includes at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measuring instrument C mounted on the measurement stage 3. .

  In the present embodiment, the liquid immersion member 4 has a lower surface 13 that can face an object disposed in the projection region PR. By holding the liquid LQ between the emission surface 12 and the lower surface 13 and the surface of the object, the immersion space so that the optical path of the exposure light EL between the last optical element 11 and the object is filled with the liquid LQ. LS is formed.

  In this embodiment, when the exposure light EL is irradiated to the substrate P, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 13 of the liquid immersion member 4 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  The substrate stage 2 has an upper surface 14 that can face the emission surface 12 and the lower surface 13. The measurement stage 3 has an upper surface 15 that can face the emission surface 12 and the lower surface 13. In the present embodiment, the upper surfaces 14 and 15 are flat surfaces substantially parallel to the XY plane.

  FIG. 2 is a view showing an example of the operation of the exposure apparatus EX. In the present embodiment, as disclosed in, for example, U.S. Patent Application Publication No. 2007/0127006, the control device 5 approaches or contacts the upper surface 14 of the substrate stage 2 and the upper surface 15 of the measurement stage 3. In this state, at least one of the upper surface 14 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 is opposed to the emission surface 12 of the final optical element 11 and the lower surface 13 of the liquid immersion member 4, and the final optical element 11 and liquid The substrate stage 2 and the measurement stage 3 can be synchronously moved in the XY directions with respect to the immersion member 4. As a result, the control device 5 is capable of forming the immersion space LS between the terminal optical element 11 and the liquid immersion member 4 and the substrate stage 2, and the terminal optical element 11, the liquid immersion member 4 and the measurement stage 3. In the meantime, it is possible to change from one of the states in which the immersion space LS can be formed to the other.

  In the following description, at least one of the upper surface 14 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 and the terminal optical element 11 in a state where the upper surface 14 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 are close to or in contact with each other. The operation of moving the substrate stage 2 and the measurement stage 3 synchronously in the XY directions with respect to the last optical element 11 and the liquid immersion member 4 while making the emission surface 12 and the lower surface 13 of the liquid immersion member 4 face each other is appropriately performed by scram. This is called movement.

  In the present embodiment, when the scram movement is performed, the control device 5 causes the upper surface 14 of the substrate stage 2 so that the upper surface 14 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 are arranged in substantially the same plane. And the positional relationship between the measurement stage 3 and the upper surface 15 of the measurement stage 3 are adjusted.

  FIG. 3 is a side sectional view showing an example of the substrate stage 2 according to the present embodiment. In FIG. 3, the substrate stage 2 includes a first holding unit 17 that holds the substrate P in a releasable manner. The first holding portion 17 includes a so-called pin chuck mechanism as disclosed in, for example, US Patent Publication No. 2007/0177125. The upper surface 14 of the substrate stage 2 is disposed around the first holding unit 17. The first holding unit 17 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The surface of the substrate P held by the first holding unit 17 can be opposed to the emission surface 12 of the last optical element 11 and the lower surface 13 of the liquid immersion member 4. The surface of the substrate P held by the first holding unit 17 and the upper surface 14 of the substrate stage 2 are arranged in substantially the same plane (substantially flush).

  In the present embodiment, the substrate stage 2 includes a plate member T disposed around the substrate P as disclosed in US Patent Publication No. 2007/0177125 and the like. The substrate stage 2 includes a second holding unit 18 that is disposed around the first holding unit 17 and holds the plate member T in a releasable manner. The second holding unit 18 is disposed around the first holding unit 17. The plate member T has an opening TK in which the substrate P can be placed. The plate member T held by the second holding unit 18 is disposed around the substrate P held by the first holding unit 17. In the present embodiment, the upper surface 14 of the substrate stage 2 includes the upper surface of the plate member T. Note that the plate member T may not be releasable.

  Next, the liquid immersion member 4 will be described with reference to FIG. FIG. 4 is a side sectional view parallel to the YZ plane showing the vicinity of the liquid immersion member 4. In the following, in order to simplify the description, a description will be mainly given of an example in which the terminal optical element 11 and the liquid immersion member 4 are opposed to the substrate P. As described above, objects other than the substrate P, such as the substrate stage 2 and the measurement stage 3, can be arranged at positions facing the terminal optical element 11 and the liquid immersion member 4.

  In the present embodiment, the liquid immersion member 4 has a plate portion 19 that is at least partially disposed between the exit surface 12 of the last optical element 11 and the surface of the substrate P in the Z-axis direction. The plate portion 19 has an opening 20 in the center. The exposure light EL emitted from the emission surface 12 can pass through the opening 20. For example, during the exposure of the substrate P, the exposure light EL emitted from the emission surface 12 passes through the opening 20 and is irradiated onto the surface of the substrate P through the liquid LQ.

  Further, the liquid immersion member 4 includes a supply port 23 that can supply the liquid LQ onto the substrate P, and a recovery port 24 that can recover the liquid LQ on the substrate P. The supply port 23 is connected to the liquid supply device 26 via the flow path 27. The liquid supply device 26 can supply clean and temperature-adjusted liquid LQ to the supply port 23. The flow path 27 includes a supply flow path 27 </ b> A formed inside the liquid immersion member 4 and a flow path 27 </ b> B formed of a supply pipe that connects the supply flow path 27 </ b> A and the liquid supply device 26. The liquid LQ delivered from the liquid supply device 26 is supplied to the supply port 23 via the flow path 27. The supply port 23 is disposed at a predetermined position of the liquid immersion member 4 facing the optical path in the vicinity of the optical path. In the present embodiment, the supply port 23 supplies the liquid LQ to the space 21 between the emission surface 12 and the upper surface of the plate portion 19. The liquid LQ supplied from the supply port 23 to the space 21 is supplied onto the substrate P through the opening 20.

  The recovery port 24 can recover the liquid LQ on the substrate P facing the liquid immersion member 4. The recovery port 24 is connected to the liquid recovery device 28 via the flow path 29. The liquid recovery device 28 includes a vacuum system and can recover the liquid LQ by sucking it from the recovery port 24. The flow path 29 includes a recovery flow path 29A formed inside the liquid immersion member 4 and a flow path 29B formed of a recovery pipe that connects the recovery flow path 29A and the liquid recovery device 28. The liquid LQ recovered from the recovery port 24 is recovered by the liquid recovery device 28 via the flow path 29.

  In the present embodiment, the recovery port 24 is disposed around the optical path of the exposure light EL. The recovery port 24 is disposed at a predetermined position of the liquid immersion member 4 that can face the surface of the substrate P. The recovery port 24 can recover at least a part of the liquid LQ on the substrate P facing the lower surface 13 of the liquid immersion member 4. In the present embodiment, a porous member 25 is disposed in the recovery port 24. The porous member 25 is a plate-like member including a plurality of holes (openings or pores). In the present embodiment, the porous member 25 includes a mesh plate in which a large number of small holes are formed in a mesh shape. The recovery port 24 recovers the liquid LQ through the hole of the porous member 25. As the porous member 25, a sintered member (for example, a sintered metal) in which a large number of pores are formed, a foamed member (for example, a foamed metal), or the like may be used.

  In the present embodiment, the lower surface 13 of the liquid immersion member 4 is disposed around the opening 20 and is disposed around the lower surface 19T of the plate portion 19 that can face the substrate P and the lower surface 19T, and can be opposed to the substrate P. And a lower surface 25T of the porous member 25. The recovery port 24 can recover the liquid LQ on the substrate P that is in contact with the lower surface 25T of the porous member 25.

  In the present embodiment, the control device 5 is in parallel with the liquid supply operation using the supply port 23 in order to form the immersion space LS with the liquid LQ between the terminal optical element 11 and the liquid immersion member 4 and the substrate P. Then, the liquid recovery operation using the recovery port 24 is executed. A liquid recovery operation using the recovery port 24 is executed, and a liquid recovery operation using the supply port 23 is executed, so that the terminal optical element 11 and the liquid immersion member 4 on one side and the substrate P on the other side are interposed. A liquid immersion space LS is formed.

  In addition, as the liquid immersion member 4, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  FIG. 5 is a plan view of the substrate P held on the substrate stage 2. As shown in FIG. 5, on the substrate P, a plurality of shot areas S (S1 to S21) which are exposure target areas are set in a matrix. As shown in FIG. 5, in the present embodiment, the projection region PR has a slit shape whose longitudinal direction is the X-axis direction.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. During exposure of the shot region S of the substrate P, the mask M and the substrate P are moved in a predetermined scanning direction in the XY plane. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 5 moves the shot region S of the substrate P in the Y-axis direction with respect to the projection region PR, and in synchronization with the movement of the substrate P in the Y-axis direction, The substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS while moving in the pattern forming region in the Y-axis direction. Thereby, the shot area S of the substrate P is exposed through the liquid LQ with the exposure light EL from the projection optical system PL (terminal optical element 11), and the pattern image of the mask M is projected onto the shot area S of the substrate P. Is done.

  In the present embodiment, the control device 5 uses the substrate stage so that the projection region PR (terminal optical element 11) and the substrate P relatively move along the movement locus indicated by the arrow R1 in FIG. While moving 2, the exposure light EL is emitted from the last optical element 11, and the projection light PR is irradiated with the exposure light EL to expose each of the shot regions S <b> 1 to S <b> 21 on the substrate P. When exposing each of the shot areas S1 to S21, the control device 5 controls the substrate stage 2 to move the substrate P in the Y-axis direction with respect to the projection area PR (terminal optical element 11).

  In addition, after the exposure of a certain shot area (for example, the first shot area S1) is completed, the control device 5 performs exposure from the last optical element 11 in order to expose the next shot area (for example, the second shot area S2). With the emission of the light EL stopped, the substrate stage 2 is controlled so that the projection region PR is arranged at the exposure start position of the next shot region S, and the substrate P is placed on the XY plane with respect to the terminal optical element 11. It moves in a predetermined direction.

  Further, for example, the substrate stage 2 may be moved so that the projection region PR (terminal optical element 11) and the substrate P move relatively along the movement locus indicated by the arrow R2 in FIG.

  In the following description, moving the substrate P in the Y-axis direction with respect to the last optical element 11 in order to expose the shot area S will be referred to as scan movement as appropriate. In addition, after the exposure for a certain shot area is completed, the substrate P is placed relative to the last optical element 11 so that the projection area PR is arranged at the exposure start position of the next shot area in order to expose the next shot area. Is referred to as step movement as appropriate. Further, for example, as in the movement locus R2, the substrate P is moved with respect to the terminal optical element 11 in a state where the terminal optical element 11 and the liquid immersion member 4 are opposed to the substrate P except for the scanning movement and the step movement. This is appropriately referred to as long distance movement.

  During the scan movement for exposing the shot area S, the exposure light EL is emitted from the last optical element 11, and the projection area PR (substrate P) is irradiated with the exposure light EL. Even during measurement using the measuring instrument C, the exposure light EL is emitted from the terminal optical element 11 with the terminal optical element 11 and the measuring instrument C facing each other.

  On the other hand, during step movement and long distance movement, the emission of the exposure light EL from the last optical element 11 is stopped, and the projection light PR (substrate P) is not irradiated with the exposure light EL.

  In the following description, the period during which the exposure light EL is emitted from the last optical element 11 including during the scan movement is appropriately referred to as an irradiation period T1. Further, a period during which the exposure light EL is not emitted from the last optical element 11 including during step movement and during long distance movement is appropriately referred to as a non-irradiation period T2.

  In the present embodiment, at least a part of the operation of the exposure apparatus EX is executed based on predetermined control information (exposure control information) related to exposure. The exposure control information includes a control command group that defines the operation of the exposure apparatus EX, and is also called an exposure recipe. In the following description, the control information related to exposure is appropriately referred to as an exposure recipe.

  The exposure recipe is stored in advance in the storage device 16. The control device 5 controls the operation of the exposure apparatus EX based on the exposure recipe.

  The exposure recipe includes conditions for moving the substrate P relative to the last optical element 11 and the liquid immersion member 4. The movement conditions include at least one of the movement speed of the substrate P relative to the last optical element 11 and the liquid immersion member 4 and the movement trajectories R1 and R2. The movement trajectories R1 and R2 include a linear movement distance when the substrate P is moved from the first position to the second position in the XY plane. The conditions for moving the substrate P include acceleration (deceleration) when the substrate P moves with respect to the last optical element 11 and the liquid immersion member 4.

  That is, in the present embodiment, the movement conditions including the movement speed of the substrate P and the movement trajectories R1, R2, etc. are determined in advance, and the control device 5 moves the substrate P on the basis of the movement conditions. Move.

  In the present embodiment, the control device 5 executes the liquid recovery operation using the recovery port 24 in parallel with the liquid supply operation using the supply port 23 in the irradiation period T1 including during the scan movement, and the liquid LQ is used as the liquid LQ. The immersion space LS is formed. Accordingly, the control device 5 can expose each of the shot areas S1 to S21 of the substrate P with the exposure light EL emitted from the last optical element 11 through the liquid LQ in the immersion space LS.

  In the present embodiment, the control device 5 performs the liquid recovery operation using the recovery port 24 and the supply port 23 in at least a part of the non-irradiation period T2 including the scan movement and the long-distance movement. The liquid supply operation to be used can be set to the first state where it is stopped. In addition, the control device 5 can perform the liquid recovery operation using the recovery port 24 and set the second state in which the liquid supply operation using the supply port 23 is executed in at least a part of the non-irradiation period T2. .

  In the present embodiment, the control device 5 moves the substrate P with respect to the last optical element 11 and the liquid immersion member 4 in at least one of the first state and the second state in the non-irradiation period T2.

  In the present embodiment, the first state is set when the movement of the substrate P with respect to the last optical element 11 and the liquid immersion member 4 satisfies a predetermined condition. On the other hand, when the movement of the substrate P with respect to the last optical element 11 and the liquid immersion member 4 does not satisfy the predetermined condition, the substrate P is moved in the second state.

  The predetermined condition relating to the movement of the substrate P includes at least one of a condition relating to a linear movement distance when the substrate P is moved from the first position to the second position in the XY plane, and a condition relating to the moving speed of the substrate P.

  In the present embodiment, the first state is set when the linear movement distance when moving the substrate P from the first position to the second position in the XY plane is longer than a predetermined distance. The first state is set when the substrate P is moved at a speed faster than a predetermined speed.

  In the present embodiment, the predetermined condition regarding the movement of the substrate P is that when the substrate P is moved in a state where the immersion space LS is formed with the liquid LQ between the terminal optical element 11 and the liquid immersion member 4 and the substrate P, This includes a condition for moving the substrate P in which the liquid LQ in the immersion space LS is not maintained in a predetermined state.

  FIG. 6A is a schematic diagram showing the state of the immersion space LS when the substrate P is moved under the first condition with respect to the last optical element 11 and the immersion member 4 with the immersion space LS formed. FIG. 6B is a schematic diagram showing a state of the immersion space LS when the substrate P is moved under a second condition different from the first condition.

  FIG. 6A shows an example where the liquid LQ in the immersion space LS between the terminal optical element 11 and the immersion member 4 and the substrate P is maintained in a predetermined state. The predetermined state of the liquid LQ includes a state in which leakage of the liquid LQ from between the terminal optical element 11 and the liquid immersion member 4 and the substrate P is suppressed. Further, the liquid LQ in the predetermined state includes a state in which the liquid LQ remaining on the substrate P is suppressed. When the substrate P is moved under the first condition, the interface LG is arranged between the lower surface 13 of the liquid immersion member 4 and the surface of the substrate P, and the terminal optical element 11 and the liquid immersion member 4 on one side and the substrate on the other side. Leakage of the liquid LQ from the predetermined space with P is suppressed.

  FIG. 6B shows an example of the case where the liquid LQ in the immersion space LS between the terminal optical element 11 on one side and the liquid immersion member 4 and the substrate P on the other side is not maintained in a predetermined state. Depending on the conditions of movement of the substrate P, it may be difficult for the liquid LQ in the immersion space LS to maintain a predetermined state. For example, if the linear movement distance of the substrate P when moving from the first position to the second position in the XY plane is increased or the movement speed of the substrate P is increased, the liquid LQ cannot be maintained in a predetermined state, and the end point is reached. There is a high possibility of leaking outside a predetermined space between the optical element 11 and the liquid immersion member 4 and the substrate P, or remaining on the substrate P without being recovered by the recovery port 24.

  In the present embodiment, the storage device 16 has a predetermined condition regarding the movement of the substrate P in which the liquid LQ in the immersion space LS between the terminal optical element 11 and the liquid immersion member 4 and the substrate P is not maintained in a predetermined state. Information is stored in advance. Information about the predetermined condition can be obtained, for example, by experiment or simulation, and can be stored in the storage device 16 in advance.

  FIG. 7 is a diagram for explaining an example of the predetermined condition regarding the movement of the substrate P. In FIG. 7, the horizontal axis represents the linear movement distance of the substrate P, and the vertical axis represents the movement speed of the substrate P. As described above, the predetermined condition includes at least one of a condition related to the linear moving distance of the substrate P and a condition related to the moving speed of the substrate P.

  The state of the liquid LQ in the immersion space LS changes according to at least one of the linear movement distance and the movement speed of the substrate P. For example, when the substrate P is moved at the speed V, if the linear movement distance of the substrate P is long, there is a high possibility that the liquid LQ in the immersion space LS is not maintained in a predetermined state, and the liquid LQ leaks or remains. It is more likely to occur. On the other hand, when the substrate P is moved at the speed V, if the linear movement distance of the substrate P is short, there is a high possibility that the liquid LQ in the immersion space LS is maintained in a predetermined state, and the liquid LQ leaks, remains, etc. Is likely to be suppressed.

  Further, when the linear movement distance when moving the substrate P from the first position to the second position in the XY plane is the distance L, when the moving speed of the substrate P is high, the liquid LQ in the immersion space LS is predetermined. There is a high possibility that the state is not maintained, and there is a high possibility that the liquid LQ leaks or remains. On the other hand, when the linear moving distance is the distance L, when the moving speed of the substrate P is low, there is a high possibility that the liquid LQ in the immersion space LS is maintained in a predetermined state, and the liquid LQ leaks and remains. The possibility of being suppressed increases.

  In the present embodiment, as shown in FIG. 7, the relationship between the moving speed of the substrate P and the linear moving distance in which the liquid LQ in the immersion space LS is maintained in a predetermined state is obtained in advance. As an example, in the present embodiment, the maximum movement speed V1 of the substrate P corresponding to each of the linear movement distances L1, L2,..., LN of the substrate P in which the liquid LQ in the immersion space LS is maintained in a predetermined state. V2,..., VN are obtained by experiment or simulation, and these values are subjected to a fitting process to derive a line RS. In FIG. 7, when the substrate P is moved under the condition of movement within the area A1, the liquid LQ in the immersion space LS is highly likely to be maintained in a predetermined state, and the substrate P is moved under the condition of movement within the area A2. In this case, there is a high possibility that the liquid LQ in the immersion space LS is not maintained in a predetermined state. That is, in the present embodiment, the predetermined condition relating to the movement of the substrate P includes a condition for movement in the area A2 (relationship between the movement speed of the substrate P and the linear movement distance).

  Further, the state of the liquid LQ in the immersion space LS changes according to the condition of the surface (liquid contact surface) of the substrate P in contact with the liquid LQ. For example, when the substrate P is moved under the same condition with respect to the last optical element 11 and the liquid immersion member 4 with the immersion space LS formed between the last optical element 11 and the liquid immersion member 4 and the substrate P, Depending on the surface condition of the substrate P, the state of the liquid LQ in the immersion space LS changes. The condition of the surface of the substrate P includes the condition of the film that forms the surface of the substrate P. Further, the condition of the surface of the substrate P includes the condition of the liquid repellency (contact angle) of the surface of the substrate P with respect to the liquid LQ. For example, when the contact angle of the surface of the substrate P with respect to the liquid LQ is large, even if the substrate P is moved at a high speed with respect to the terminal optical element 11 and the liquid immersion member 4 or the linear movement distance is increased, the liquid The liquid LQ in the immersion space LS is more likely to be maintained in a predetermined state. On the other hand, when the contact angle of the surface of the substrate P with respect to the liquid LQ is small, if the substrate P is moved at a high speed with respect to the last optical element 11 and the liquid immersion member 4 or the linear movement distance is increased, the liquid immersion space There is a high possibility that the liquid LQ of LS is not maintained in a predetermined state.

  In the present embodiment, a plurality of types of substrates P having different surface conditions are exposed. For example, a plurality of types of substrates P having different types (physical properties) of films forming the surface are exposed. The film forming the surface of the substrate P includes, for example, at least one of a photosensitive film, an antireflection film formed on the photosensitive film, and a topcoat film formed on the photosensitive film. In the present embodiment, the above-described line RS and predetermined conditions relating to the movement of the substrate P are derived for each of the surfaces of the plurality of types of substrates P. Thus, in this embodiment, the predetermined condition regarding the movement of the substrate P is determined according to the surface of the substrate P.

  In the present embodiment, in the non-irradiation period T2, the first state is set when the movement of the substrate P relative to the last optical element 11 and the liquid immersion member 4 determined by the exposure recipe satisfies a predetermined condition. On the other hand, in the non-irradiation period T2, the second state is set when the movement of the substrate P relative to the last optical element 11 and the liquid immersion member 4 determined by the exposure recipe does not satisfy the predetermined condition.

  That is, the control device 5 moves the substrate P in the first state in the non-irradiation period T2 in accordance with the movement conditions of the substrate P with respect to the last optical element 11 and the liquid immersion member 4 determined by the exposure recipe. It is determined whether the substrate P is moved in the second state.

  For example, when the linear movement distance when moving the substrate P from the first position to the second position at the speed V1 is longer than the predetermined distance L1 stored in the storage device 16, the control device 5 enters the first state. Set. Further, for example, when the substrate P is moved by the distance L2, when the substrate P is moved at a speed faster than a predetermined speed (maximum movement speed) V2 stored in the storage device 16, the control device 5 Set to 1 state.

  That is, in the present embodiment, when the substrate P is to be moved under a moving condition in which there is a high possibility that the liquid LQ in the immersion space LS is not maintained in a predetermined state, the control device 5 uses the recovery port 24 for the liquid. With the recovery operation executed, the liquid recovery operation using the supply port 23 is stopped.

  FIG. 8 is a schematic diagram illustrating an example of a state in which the substrate P moves with respect to the last optical element 11 and the liquid immersion member 4 in a state where the first state is set. In at least part of the period in which the first state is set, the immersion space LS substantially disappears. For example, the immersion space LS formed between the last optical element 11 and the liquid immersion member 4 and the substrate P substantially disappears after a predetermined time has elapsed since the first state was set.

  In order to maintain the liquid LQ in the immersion space LS in a predetermined state, it is desirable to suppress the moving speed of the substrate P. On the other hand, it is desirable that the moving speed of the substrate P is high from the viewpoint of improving the throughput.

  In the present embodiment, the first state is set when the movement of the substrate P satisfies a predetermined condition in the non-irradiation period T2. Therefore, even when the substrate P is moved at a high speed or moved over a long distance, the liquid P moves in a state where there is substantially no immersion space LS. It is suppressed. For example, when the substrate P is moved by the distance L2 with respect to the last optical element 11 and the liquid immersion member 4, the control device 5 is set to the first state, so that the liquid is not moved even if it moves at a speed V2m higher than the speed V2. Generation | occurrence | production of the leakage of LQ, a residue, etc. can be suppressed.

  Further, in the non-irradiation period T2, if the movement of the substrate P does not satisfy the predetermined condition, the substrate P is moved even when the substrate P is moved in the second state, that is, in a state where the immersion space LS is formed. However, the occurrence of leakage or residue of the liquid LQ is suppressed. For example, after the irradiation period T1 in which the second state is set, the second state is maintained even in the non-irradiation period T2, so that the switching operation between the first state and the second state is not necessary.

  The case where the substrate P is moved with respect to the terminal optical element 11 in the state where the terminal optical element 11 and the liquid immersion member 4 are opposed to each other has been described above, but the substrate stage 2 and the measurement stage 3 are also described. It is the same. During the period in which the substrate stage 2 moves with respect to the terminal optical element 11 in a state where the terminal optical element 11 and the liquid immersion member 4 and the upper surface 14 of the substrate stage 2 face each other, the terminal optical element 11 and the liquid immersion member 4 are measured. At least a part of the period during which the measurement stage 3 moves with respect to the last optical element 11 and the period during which the scram moves while the upper surface 15 of the stage 3 is facing includes a non-irradiation period. In at least a part of the non-irradiation period, the control device 5 can move the substrate stage 2 and the measurement stage 3 relative to the last optical element 11 in at least one of the first state and the second state.

  In the storage device 16, information about a predetermined condition regarding the movement of the substrate stage 2 in which the liquid LQ in the immersion space LS between the terminal optical element 11 and the liquid immersion member 4 and the substrate stage 2 is not maintained in a predetermined state is stored in advance. It is remembered. Similarly, in the storage device 16, the liquid LQ in the immersion space LS between the terminal optical element 11 and the liquid immersion member 4 and the measurement stage 3 is not maintained in a predetermined state. Information is stored in advance. These predetermined conditions are determined according to the upper surface 14 of the substrate stage 2 and the upper surface 15 of the measurement stage 3 that are in contact with the liquid LQ in the immersion space LS. The control device 5 sets the first state when the movement of the substrate stage 2 and the measurement stage 3 with respect to the last optical element 11 satisfies a predetermined condition in the non-irradiation period T2.

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  For example, in order to load (load) the unexposed substrate P onto the substrate stage 2, the control device 5 moves the substrate stage 2 to the substrate exchange position, and uses the transfer system (not shown) to the substrate exchange position. The substrate P before exposure is loaded onto the arranged substrate stage 2. The substrate exchange position exists at a position away from the irradiation position (projection region PR) of the exposure light EL emitted from the last optical element 11.

  As shown in FIG. 9, the measurement stage 3 is disposed at a position facing the terminal optical element 11 and the liquid immersion member 4, and the liquid is interposed between the terminal optical element 11 and the liquid immersion member 4 and the measurement stage 3. An immersion space LS is formed. The control device 5 emits the exposure light EL from the last optical element 11 as necessary, and executes a measurement operation using the measuring device C of the measurement stage 3. The measurement result of the measuring instrument C is reflected in the subsequent exposure of the substrate P.

  After the loading (loading) of the substrate P to the substrate stage 2 is completed, the control device 5 moves the substrate stage 2 to the projection region PR. The control device 5 performs scram movement so that an immersion space LS can be formed between the terminal optical element 11 and the liquid immersion member 4 and the measurement stage 3, and then the terminal optical element 11, the liquid immersion member 4 and the substrate. The immersion space LS is changed to a state where it can be formed between the stage 2 and the stage 2.

  The control device 5 controls the substrate stage 2 to execute a long distance movement so that the projection region PR is arranged at the exposure start position of the first shot region S1. And the control apparatus 5 exposes each of 1st-21st shot area | region S1-S21 by repeating a scanning movement and a step movement. At least during the scanning movement, the liquid immersion space LS is formed with the liquid LQ. After the exposure of the 21st shot region S21 is completed, the control device 5 controls the substrate stage 2 so that the immersion optical element 11 and the liquid immersion member 4 are immersed in a predetermined region on the upper surface 14 of the substrate stage 2. Long distance movement is executed on the movement locus R2 so that the space LS is formed. Thereafter, the control device 5 executes scram movement so that the immersion space LS can be formed between the terminal optical element 11 and the liquid immersion member 4 and the substrate stage 2, and then the terminal optical element 11 and the liquid immersion member. 4 and the measurement stage 3 are changed to a state where an immersion space LS can be formed.

  The control device 5 moves the substrate stage 2 to the substrate exchange position in order to unload the substrate P after exposure from the substrate stage 2. The control device 5 uses the transport system (not shown) to unload the exposed substrate P from the substrate stage 2 disposed at the substrate exchange position. Thereafter, the control device 5 loads the substrate P before exposure onto the substrate stage 2 using the transport system. The control device 5 moves the substrate stage 2 holding the substrate P before exposure, performs scram movement, and moves the substrate stage 2 to the irradiation position of the exposure light EL. Thereafter, the same processing is repeated.

  In the above-described procedure, the second state is set during the scan movement for exposing the shot areas S1 to S21 of the substrate P, and the immersion space LS is formed with the liquid LQ. In the second state, each of the shot areas S1 to S21 of the substrate P is irradiated with the exposure light EL emitted from the last optical element 11 through the liquid LQ in the immersion space LS.

  Further, in the step movement that is the non-irradiation period T2, at least one of the first state and the second state is selected and set according to the movement condition of the substrate P. For example, the conditions (movement speed, movement distance) of the substrate P when moving stepwise from the first shot area S1 to the second shot area S2, and when moving stepwise from the third shot area S3 to the fourth shot area S4 There is a possibility that the conditions (movement speed, movement distance) of the movement of the substrate P are different. For example, when the movement of the substrate P when the step movement from the first shot area S1 to the second shot area S2 does not satisfy a predetermined condition, the control device 5 moves the substrate P stepwise in the second state. Further, when the movement of the substrate P during the step movement from the third shot area S3 to the fourth shot area S4 satisfies a predetermined condition, the control device 5 sets the first state. The control device 5 scans in the second state and exposes the third shot region S3, and then performs a switching operation from the second state to the first state, and starts exposing the projection region PR to the fourth shot region S4. Perform step movement to move to position. Thereafter, the control device 5 cancels the first state, executes the switching operation from the first state to the second state, and in the state where the optical path of the exposure light EL is filled with the liquid LQ, the fourth shot region The exposure of S4 is started.

  Further, also in the long-distance movement that is the non-irradiation period T2, at least one of the first state and the second state is selected and set according to the movement condition of the substrate P. For example, when the movement of the substrate P when moving for a long distance satisfies a predetermined condition, the control device 5 sets the first state. For example, the control device 5 scans in the second state and exposes the 21st shot region S21, and then performs a switching operation from the second state to the first state to perform long-distance movement. Thereafter, the control device 5 cancels the first state, executes the switching operation from the first state to the second state, and moves the immersion space LS from the substrate stage 2 to the measurement stage 3. Scrum movement is executed, and measurement of the exposure light EL using the measuring device C is started in a state where the optical path of the exposure light EL is filled with the liquid LQ. The first state may be set during the scrum movement, and the first state may be released after the scrum movement in a state where the terminal optical element 11 and the liquid immersion member 4 face the measurement stage 3. It should be noted that the measurement stage 3 is disposed not only during the scram movement for changing from the state in which the substrate stage 2 is disposed to the state in which the measurement stage 3 is disposed at a position facing the terminal optical element 11 and the liquid immersion member 4. The first state may be set even during the scrum movement for changing from the raised state to the state where the substrate stage 2 is arranged, and the first state may be released after the scrum movement.

  In the present embodiment, for example, the first state is set before the object (substrate P, substrate stage 2, measurement stage 3) starts moving that satisfies a predetermined condition. In addition, the first state is canceled before the object finishes the movement that satisfies the predetermined condition.

  FIG. 10 is a diagram for explaining an example of a state in which an object is performing a movement that satisfies a predetermined condition. In the following description, as shown in FIG. 5, a long distance is traveled on the movement locus R2 so that the projection area PR moves relatively from the exposure end position E1 of the 21st shot area S21 to the predetermined position E2 of the substrate P. A case where the movement of the substrate P during the movement satisfies a predetermined condition will be described. In the description using FIG. 10, the distance between the position E1 and the position E2 is L2, and the substrate P is faster than the predetermined speed V2 in at least a part of the section relatively moving from the position E1 to the position E2. A case of moving at a high speed V2m will be described.

  As shown in FIG. 10, in the present embodiment, the first state is set before the substrate P starts moving that satisfies the predetermined condition. In the present embodiment, the liquid supply operation using the supply port 23 is performed in a state where the liquid recovery operation using the recovery port 24 is executed after the exposure of the 21st shot region S21 is finished and before the acceleration is started from the position E1. Stopped. The control device 5 starts the acceleration of the substrate P after stopping the liquid supply operation using the supply port 23. After a lapse of a predetermined time from the start of the acceleration of the substrate P, the substrate P reaches the speed V2. After the liquid supply operation using the supply port 23 is stopped (after the acceleration of the substrate P is started) and before the substrate P reaches the speed V2, the liquid recovery operation using the recovery port 24 performs the liquid immersion space. LS is virtually eliminated. Therefore, even if the substrate P moves at the speed V2m, the occurrence of leakage, remaining, etc. of the liquid LQ is suppressed.

  The substrate P is moved at the speed V2m, and the first state is released before the substrate P finishes the movement satisfying the predetermined condition. In the present embodiment, the liquid supply operation using the supply port 23 is started (restarted) while the substrate P is decelerated after a predetermined time has elapsed since the start of the movement of the substrate P at the speed V2m. In the present embodiment, after the deceleration of the substrate P moving at the speed V2m is started, the liquid supply operation using the supply port 23 is started before the speed of the substrate P reaches V2. Immediately after the liquid supply operation using the supply port 23 is started (restarted), the liquid immersion space LS is not sufficiently formed, so that the substrate P is moved in a state where the liquid immersion space LS is not sufficiently formed. Even if it moves by V2, the occurrence of leakage, residue, etc. of the liquid LQ is suppressed. The liquid immersion space is obtained by the liquid recovery operation using the recovery port 24 and the liquid supply operation using the supply port 23 between the start of the liquid supply operation using the supply port 23 and the arrival of the substrate P at the position E2. LS is sufficiently formed, and the optical path of the exposure light EL is filled with the liquid LQ. Thereby, it can move to the process using the liquid LQ of the subsequent immersion space LS quickly.

  In the description using FIG. 10, the case where the acceleration of the substrate P is started immediately after the liquid supply operation using the supply port 23 is stopped is described as an example. For example, the exposure of the 21st shot region S21 is performed. After the completion, the liquid recovery operation using the recovery port 24 is performed while the substrate P is almost stationary or the substrate P is moved at a low speed less than the speed V2 that does not satisfy the predetermined condition. The liquid recovery operation using the mouth 23 may be stopped, and the acceleration of the substrate P may be started after the immersion space LS has substantially disappeared.

  In the description using FIG. 10, the movement satisfying the predetermined condition has been described as an example in which the first state is released before the substrate P ends. However, the substrate P has arrived at the position E2. The first state may be released immediately after.

  In the description using FIG. 10, the case where the object is the substrate P has been described as an example, but the same applies to the case where the object is the substrate stage 2 and the measurement stage 3.

  As described above, according to the present embodiment, it is possible to suppress the occurrence of leakage, residue, and the like of the liquid LQ while suppressing a decrease in throughput, and a desired device can be manufactured with high productivity.

  For example, if the liquid LQ in the immersion space LS cannot maintain a predetermined state and the liquid LQ leaks, the substrate stage 2, the measurement stage 3, or peripheral devices may be affected. Further, if the liquid LQ remains on the substrate P, the heat of vaporization of the liquid LQ may affect the substrate P. As a result, a defective exposure may occur, such as a defect in the pattern formed on the substrate P. As a result, a defective device may be manufactured. According to the present embodiment, it is possible to suppress the occurrence of exposure failure, the occurrence of defective devices, and the like.

  In the above-described embodiment, for example, a suction port capable of collecting the liquid LQ may be provided in a part of the lower surface 19T of the liquid immersion member 4 (plate portion 19). By executing the liquid recovery operation using the suction port in at least a part of the non-irradiation period, the immersion space LS can be substantially eliminated quickly after setting to the first state.

  In the projection optical system PL in the above-described embodiment, the optical path on the exit side (image plane side) of the last optical element 11 is filled with the liquid LQ. However, as a projection optical system PL, International Publication No. 2004/019128. It is also possible to employ a projection optical system in which the optical path on the incident side (object surface side) of the last optical element 11 is filled with a liquid as disclosed in the pamphlet.

  In addition, although the liquid LQ of each above-mentioned embodiment is water, liquids other than water may be sufficient. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  The substrate P of the present embodiment is not limited to a semiconductor wafer for manufacturing a semiconductor device, but a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask (reticle) used in an exposure apparatus (synthesis). Quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  Further, as the exposure apparatus EX, a twin stage type having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, etc. It can also be applied to other exposure apparatuses.

  Furthermore, as disclosed in US Pat. No. 6,897,963, European Patent Application No. 1713113, etc., a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and / or various photoelectric devices. The present invention can also be applied to an exposure apparatus that includes a measurement stage equipped with a sensor. An exposure apparatus including a plurality of substrate stages and measurement stages can be employed.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In the above-described embodiment, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL.

  The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. The In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 11, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from a mask and developing the exposed substrate according to the above-described embodiment, device assembly It is manufactured through steps (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. In addition, the disclosures of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on this embodiment. It is a figure for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a sectional side view showing an example of a substrate stage concerning this embodiment. It is a sectional side view which shows an example of the liquid immersion member which concerns on this embodiment. It is a figure for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a schematic diagram for demonstrating an example of the behavior of immersion space. It is a figure for demonstrating the predetermined conditions regarding the movement of the board | substrate which concerns on this embodiment. It is a figure for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a figure for demonstrating an example of the exposure method which concerns on this embodiment. It is a flowchart which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 3 ... Measurement stage, 4 ... Liquid immersion member, 5 ... Control apparatus, 11 ... Terminal optical element, 12 ... Ejection surface, 16 ... Memory | storage device, 23 ... Supply port, 24 ... Recovery port, C ... Measurement EL, exposure light, EX, exposure device, LQ, liquid, LS, immersion space, P, substrate

Claims (19)

An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member for emitting the exposure light;
An immersion member disposed in the vicinity of the optical member and capable of forming an immersion space so that the optical path of the exposure light between the optical member and the object is filled with liquid;
A supply port capable of supplying liquid onto the object;
A recovery port capable of recovering the liquid on the object,
In at least a part of the non-irradiation period in which the exposure light is not emitted from the optical member, in a first state in which the liquid recovery operation using the recovery port is performed and the liquid supply operation using the supply port is stopped, An exposure apparatus that moves the object relative to the optical member.   The exposure apparatus according to claim 1, wherein the first state is set when a movement of the object with respect to the optical member satisfies a predetermined condition.   The exposure apparatus according to claim 2, wherein the first state is set before the object starts moving to satisfy the predetermined condition.   The exposure apparatus according to claim 2 or 3, wherein the first state is released before the object finishes moving to satisfy the predetermined condition.   The exposure apparatus according to any one of claims 2 to 4, wherein the first state is set when a linear movement distance when moving the object from the first position to the second position is longer than a predetermined distance.   The exposure apparatus according to claim 2, wherein the first state is set when the object is moved at a speed faster than a predetermined speed.   When the movement of the object relative to the optical member does not satisfy the predetermined condition, the liquid recovery operation using the recovery port is executed and the object is moved in the second state in which the liquid supply operation using the supply port is executed. The exposure apparatus according to any one of claims 2 to 6.   The exposure apparatus according to any one of claims 1 to 7, wherein the immersion space is substantially eliminated during at least a part of the period in which the first state is set.   The exposure apparatus according to claim 1, wherein the object includes the substrate.   The exposure apparatus according to claim 1, wherein the object includes a stage.   The exposure apparatus according to claim 10, wherein the stage holds the substrate. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 11,
Developing the exposed substrate; and a device manufacturing method. An exposure method for exposing a substrate through a liquid with exposure light from an optical member,
In at least a part of the non-irradiation period in which the exposure light is not emitted from the optical member, the liquid recovery operation using the recovery port is performed, and the optical supply operation using the supply port is stopped in the first state. Moving the substrate relative to the member;
In at least part of the non-irradiation period, the substrate is moved relative to the optical member in a second state in which a liquid recovery operation using the recovery port is performed and a liquid supply operation using the supply port is performed. And
Irradiating the substrate with exposure light from the optical member via the liquid from the supply port filled in a space including an optical path between the substrate and the optical member in the second state. Including an exposure method.   The exposure according to claim 13, further comprising: determining whether to move the object in the first state or to move the object in the second state according to a condition of movement of the object with respect to the optical member. Method.   The exposure method according to claim 14, wherein the substrate is moved in the first state when the movement of the object with respect to the optical member satisfies a predetermined condition.   The exposure method according to claim 15, wherein the first state is set before the object starts moving to satisfy the predetermined condition.   The exposure method according to claim 15 or 16, wherein the first state is released before the object finishes moving to satisfy the predetermined condition.   The exposure method according to claim 13, wherein the predetermined condition is determined according to a liquid contact surface of the substrate. Exposing the substrate using the exposure method according to any one of claims 13 to 18,
Developing the exposed substrate; and a device manufacturing method.

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