JP2010016267A5 - - Google Patents
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- JP2010016267A5 JP2010016267A5 JP2008176453A JP2008176453A JP2010016267A5 JP 2010016267 A5 JP2010016267 A5 JP 2010016267A5 JP 2008176453 A JP2008176453 A JP 2008176453A JP 2008176453 A JP2008176453 A JP 2008176453A JP 2010016267 A5 JP2010016267 A5 JP 2010016267A5
- Authority
- JP
- Japan
- Prior art keywords
- heat receiving
- flow path
- heat
- plate
- base body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (6)
前記配管の一部は、金属製の２枚の板状部材を互いに対向して配置することにより形成された空間によって構成され、前記各板状部材の対向面は、それぞれ塑性加工されており、 A part of the pipe is constituted by a space formed by arranging two metal plate-like members facing each other, and the opposing surfaces of the plate-like members are each plastically processed,
前記受熱部への冷媒液の流入ポートおよび流出ポートは、前記板状部材により形成された配管の流路方向に延在して設けられ、該受熱部は、前記２枚の板状部材で形成された冷媒液の注入ヘッダ部と、前記注入ヘッダ部の下端側に対向配置される受熱ベース体とで構成され、前記受熱ベース体は、平板部材であって、前記平板部材の一平面内部の所定の領域に切り込み加工により流路を形成され、前記流路が、前記受熱ベース体の前記流路の形成されていない前記一平面の外部と等しい高さであって、前記受熱ベース体の外部平面と前記板状部材とを接合して密閉空間によって受熱部を構成して、前記注入ヘッダ部から前記流路の上部より冷媒を通流することを特徴とする電子機器。 The refrigerant liquid inflow port and the outflow port to the heat receiving part are provided to extend in a flow path direction of a pipe formed by the plate member, and the heat receiving part is formed by the two plate members. The refrigerant liquid injection header portion and a heat receiving base body disposed opposite to the lower end side of the injection header portion, the heat receiving base body being a flat plate member, A flow path is formed by cutting in a predetermined region, and the flow path has a height equal to the outside of the one plane where the flow path of the heat receiving base body is not formed, and the outside of the heat receiving base body An electronic apparatus comprising: a flat surface and the plate-shaped member joined together to form a heat receiving portion by a sealed space, and a coolant is allowed to flow from the upper portion of the flow path from the injection header portion.
前記冷却装置は、 The cooling device is
前記第１の発熱体と熱的に接続され、内部を通流する冷媒液によって受熱する第１の受熱部と、前記第２の発熱体と熱的に接続され、内部を通流する冷媒液によって受熱する第２の受熱部と、冷媒液の熱を放熱する放熱部とを有し、前記第１及び第２の受熱部と前記放熱部とを配管によって接続し、前記冷媒液を液駆動部材によって循環駆動するように構成されており、 A first heat receiving portion that is thermally connected to the first heating element and receives heat by the refrigerant liquid flowing inside, and a refrigerant liquid that is thermally connected to the second heating element and flows inside A second heat receiving portion that receives heat by the heat sink, and a heat radiating portion that dissipates the heat of the refrigerant liquid. It is configured to circulate and drive by members,
前記第２の受熱部と前記配管の一部は、金属製の２枚の板状部材を互いに対向して配置することにより形成された空間によって構成され、前記各板状部材の対向面は、それぞれ塑性加工されており、 The second heat receiving portion and a part of the pipe are configured by a space formed by disposing two metal plate-like members facing each other, and the opposing surfaces of the plate-like members are: Each is plastic processed,
前記第１の受熱部への冷媒液の流入ポートおよび流出ポートは、前記板状部材により形成された配管の流路方向に延在して設けられ、該第１の受熱部は、前記２枚の板状部材で形成された冷媒液の注入ヘッダ部と、前記注入ヘッダ部の下端側に対向配置される受熱ベース体とで構成され、前記受熱ベース体は、平板部材であって、前記平板部材の一平面内部の所定の領域に切り込み加工により流路を形成され、前記流路が、前記受熱ベース体の前記流路の形成されていない前記一平面の外部と等しい高さであって、前記受熱ベース体の外部平面と前記板状部材とを接合して密閉空間によって第１の受熱部を構成して、前記注入ヘッダ部から前記流路の上部より冷媒を通流することを特徴とする電子機器。 The refrigerant liquid inflow port and the outflow port to the first heat receiving portion are provided to extend in the flow path direction of the pipe formed by the plate-like member, and the first heat receiving portion includes the two sheets. And a heat receiving base body disposed opposite to the lower end side of the injection header section, the heat receiving base body being a flat plate member, A flow path is formed by cutting in a predetermined region inside one plane of the member, and the flow path has a height equal to the outside of the one plane where the flow path of the heat receiving base body is not formed, The outer flat surface of the heat receiving base body and the plate-like member are joined to form a first heat receiving portion by a sealed space, and the refrigerant flows from the upper part of the flow path from the injection header portion. Electronic equipment.
前記第２の受熱部と前記配管の一部は、金属製の２枚の板状部材を互いに対向して配置することにより形成された空間によって構成され、前記各板状部材の対向面は、それぞれ塑性加工されており、The second heat receiving portion and a part of the pipe are configured by a space formed by disposing two metal plate-like members facing each other, and the opposing surfaces of the plate-like members are: Each is plastic processed,
前記第１の受熱部は、前記板状部材によって形成される前記第２の受熱部の、前記発熱体と熱接続される平面と、前記流路を形成する配管との間隔内において設置されていることを特徴とする電子機器。The first heat receiving part is installed in a space between a plane of the second heat receiving part formed by the plate-like member and thermally connected to the heating element and a pipe forming the flow path. An electronic device characterized by
前記第２の受熱部に段差が形成されることを特徴とする電子機器。 A step is formed in the second heat receiving part.
前記第１の発熱体は前記第２の発熱体よりも発熱が大きいことを特徴とする電子機器。 The electronic device according to claim 1, wherein the first heating element generates heat more than the second heating element.
前記第１の受熱部は、前記第２の受熱部よりも熱伝導率が高いことを特徴とする電子機器。 The electronic apparatus according to claim 1, wherein the first heat receiving unit has a higher thermal conductivity than the second heat receiving unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008176453A JP4972615B2 (en) | 2008-07-07 | 2008-07-07 | Electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008176453A JP4972615B2 (en) | 2008-07-07 | 2008-07-07 | Electronics |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010016267A JP2010016267A (en) | 2010-01-21 |
| JP2010016267A5 true JP2010016267A5 (en) | 2011-05-12 |
| JP4972615B2 JP4972615B2 (en) | 2012-07-11 |
Family
ID=41702074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008176453A Expired - Fee Related JP4972615B2 (en) | 2008-07-07 | 2008-07-07 | Electronics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4972615B2 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4856960B2 (en) * | 2006-01-24 | 2012-01-18 | 日本電気株式会社 | Liquid-cooled heat dissipation device |
| JP4892493B2 (en) * | 2006-01-24 | 2012-03-07 | 日本電気株式会社 | Liquid-cooled heat dissipation device |
| JP4234722B2 (en) * | 2006-02-28 | 2009-03-04 | 株式会社東芝 | Cooling device and electronic equipment |
| JP4572174B2 (en) * | 2006-03-29 | 2010-10-27 | Ｎｅｃパーソナルプロダクツ株式会社 | Cooling device for electronic equipment |
| JP2007281279A (en) * | 2006-04-10 | 2007-10-25 | Matsushita Electric Ind Co Ltd | Cooling device, and electronic equipment having same |
-
2008
- 2008-07-07 JP JP2008176453A patent/JP4972615B2/en not_active Expired - Fee Related
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