JP2010016205A - Sheet peeling device and peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet peeling device and a sheet peeling method capable of peeling an adhesive sheet by preventing adhesives of a peeling tape from adhering to a portion except the adhesive sheet. <P>SOLUTION: The sheet peeling device has: a table 11 for holding a semiconductor wafer W to which the adhesive sheet S is stuck; a delivery means 12 for delivering a beltlike master roll R to which a base sheet BS has been temporarily adhered via an adhesive layer A to a peeling sheet RL; first and second cutting means 13, 14 for forming first and second notchings C1, C2 in the middle of the delivery of the master roll to form the peeling tape PT with a gripping section 28 and an adhesive section 29; a peel plate 15 for peeling the peeling tape; a holding means 16 for holding the peeling tape; a sticking means 17 for sticking the peeling tape to the adhesive sheet; a gripping means 18 at the gripping section; and a single-axis robot 19 relatively moving the gripping means and the table. The adhesive sheet is peeled from the semiconductor wafer by relatively moving the gripping means and the table. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method. More specifically, the present invention reliably peels from an edge portion of an adhesive sheet and suppresses consumption of a peeling tape for peeling an adhesive sheet attached to an adherend. The present invention relates to a sheet peeling apparatus and a peeling method that can be used.

In a processing process of a semiconductor wafer (hereinafter simply referred to as “wafer”), an adhesive sheet is attached to protect the circuit surface and the like of the wafer. Such an adhesive sheet is peeled from the wafer using a sheet peeling device or the like after a predetermined processing step.
As a sheet peeling apparatus, it is disclosed by patent document 1, for example. The sheet peeling apparatus in the document adheres a strip-shaped peeling tape so as to cross the radial direction of a circular adhesive sheet affixed to the wafer, and winds the peeling tape to remove the adhesive sheet from the wafer. The structure which peels is employ | adopted.
JP 2007-43047 A

  However, in the sheet peeling apparatus disclosed in Patent Document 1, when the peeling tape is attached to the adhesive sheet, the adhesive of the peeling tape adheres to a portion other than the adhesive sheet, There are inconveniences in that peeling is hindered or the adhesive adheres to the table or the like on which the adherend is placed and becomes dirty. Further, since a peeling tape having a length longer than the diameter of the wafer is required, there is a disadvantage that the consumption of the peeling tape is large and the running cost is increased. In recent years, since a wafer having a large diameter is adopted, such inconvenience appears remarkably.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the purpose of the present invention is to prevent the adhesive sheet from being peeled off by adhering the adhesive of the peeling tape to a portion other than the adhesive sheet. An object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of reliably peeling the adhesive sheet without contaminating a table or the like on which the body is placed with an adhesive.
Another object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of peeling an adhesive sheet while suppressing consumption of a peeling tape for peeling the adhesive sheet.

  In order to achieve the above object, the present invention applies a peeling tape to an adhesive sheet affixed to an adherend, and peels the adhesive sheet from the adherend by relative movement between the peeling tape and the adherend. In the sheet peeling apparatus, the support means for supporting the adherend to which the adhesive sheet is affixed, the first cut in a closed loop shape reaching the adhesive layer from the release sheet side, and the release sheet from the base sheet side, Formed by a closed loop-shaped second notch that forms a grip part that partially overlaps with the first notch, and in which the other region becomes an adhesive part having an outer edge corresponding to the outer edge shape of the adhesive sheet A feeding means for feeding the strip-shaped raw material temporarily attached to the release sheet, a peeling means for peeling the peeling tape, and a holding means for holding the peeling tape; Affixing at least part of the outer edge of the adhesive part and at least part of the outer edge of the adhesive sheet, and affixing the peeling tape to the adhesive sheet with the gripping part protruding outward of the adherend And a moving means for moving the gripping means and the holding means relative to each other.

  Further, the present invention provides a sheet peeling apparatus for attaching a peeling tape to an adhesive sheet attached to an adherend, and peeling the adhesive sheet from the adherend by relative movement of the peeling tape and the adherend. A supporting means for supporting the adherend to which the adhesive sheet is affixed; a feeding means for feeding the belt-like original fabric in which the base sheet is temporarily attached to the release sheet via the adhesive layer; A first incision means for forming a closed loop-shaped first incision reaching from the release sheet side to the adhesive layer; and reaching the release sheet from the base sheet side and partially overlapping the first incision A second incision means for forming a gripping portion and forming a closed loop-shaped second incision in which the other region is an adhesive portion having an outer edge corresponding to the outer edge shape of the adhesive sheet; Remove the tape A peeling means for holding, a holding means for holding the peeling tape, at least a part of the outer edge of the adhesive part and an edge of the adhesive sheet are aligned with each other, and the grip part is placed outwardly of the adherend. A sticking means for sticking the peeling tape to the adhesive sheet in a state of projecting to the adhesive sheet, a gripping means for gripping the gripping portion, and a moving means for relatively moving the gripping means and the holding means. ing.

  In this invention, the said holding means can take the structure that the adsorption | suction head provided with the same planar shape as the said adhesion part is included.

  The first cutting means includes marking means for applying a predetermined mark to the original fabric, while the second cutting means includes detection means for detecting a mark, based on the position of the mark. The second notch is formed.

  Furthermore, the present invention is a sheet peeling method in which a peeling tape is affixed to an adhesive sheet affixed to an adherend, and the adhesive sheet is peeled off the adherend by relative movement between the peeling tape and the adherend. A step of supporting the adherend to which the adhesive sheet is affixed, a step of feeding a belt-like original fabric in which a base sheet is temporarily attached to the release sheet via an adhesive layer, and a release sheet in the middle of feeding the original fabric Forming a closed loop-shaped first notch reaching from the side to the adhesive layer, reaching the release sheet from the base sheet side, and forming a gripping part partially overlapping with the first notch; and , A step of forming a closed loop-shaped second incision in which the other region becomes an adhesive portion having an outer edge corresponding to the outer edge shape of the adhesive sheet, a step of peeling the peeling tape, and the peeling tape And holding the peeling tape in a state in which at least a part of the outer edge of the adhesive part and at least a part of the outer edge of the adhesive sheet coincide with each other and the grip part protrudes outward of the adherend. Attaching the adhesive sheet to the adhesive sheet, a step of gripping the grip portion, and a relative movement of the gripping means and the adherend while being held by the adherend and the peeling tape means And a process of peeling from the body.

According to the present invention, in the course of unwinding the original fabric, a peeling tape to be attached to the adhesive sheet is formed, and the attaching means matches at least part of the outer edge of the adhesive part with at least part of the outer edge of the adhesive sheet, With the structure in which the peeling tape is applied to the adhesive sheet with the gripping portion protruding outward from the adherend, the adhesive of the peeling tape adheres to a part other than the adhesive sheet, and the adhesive sheet The adhesive sheet is peeled off by holding the gripping part and moving it relative to the adherend. can do. In addition, when the peeling tape is a single-wafer type that is large enough to adhere to a part of the adhesive sheet, the peeling tape as compared with the conventional sheet peeling apparatus that applies the peeling tape along the direction crossing the adhesive sheet It becomes possible to suppress the consumption amount.
Further, in the configuration in which the suction head constituting the holding means is provided in the same plane shape as the bonding portion, the peeling tape can be bonded with the outer edge of the bonding portion being aligned with the outer edge of the bonding sheet. Can be reliably peeled from the outer edge.
Furthermore, in the configuration including the marking means and the detection means, the peeling tape can be formed while maintaining the formation positional relationship between the first cut and the second cut with high accuracy.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet peeling apparatus according to this embodiment. In this figure, a sheet peeling apparatus 10 includes a table 11 as a support means for supporting a semiconductor wafer W as an adherend to which an adhesive sheet S is adhered, and a base sheet through an adhesive layer A on the release sheet RL. A feeding means 12 for feeding out a strip-shaped original fabric R on which a BS is temporarily attached, and a first cutting means 13 and a second cutting device for forming a peeling tape PT by making a cut in a predetermined shape while feeding the original fabric R. A stripping means 14, a peel plate 15 as a peeling means for peeling the peeling tape PT from the original fabric R, a holding means 16 for adsorbing and holding the peeling tape PT, and an adhesive for sticking the peeling tape PT to the adhesive sheet S Single-axis robot as means 17, gripping means 18 for gripping gripping portion 28 constituting a part of peeling tape PT, and moving means for relatively moving gripping means 18 and table 11 It is constituted by a 9. The wafer W has a substantially circular shape, and the adhesive sheet S is provided in a planar shape corresponding to the wafer W.

  The table 11 has a substantially square planar shape, and the upper surface side is formed as a suction surface (not shown), and is supported by the single-axis robot 19 so as to be movable in the left-right direction in FIG.

  The feeding means 12 includes a support roller 20 that supports the original fabric R, a driving roller 22 that is rotated by a motor M, and an unnecessary original fabric portion R1 after the peeling tape PT is peeled between the driving roller 22. And a take-up roller 24 that rotates synchronously with the drive roller 22 and winds up the unnecessary raw fabric portion R1. The feeding means 12 is supported by a frame (not shown).

  The first cutting means 13 includes a die plate 30A that is arranged to be movable up and down on the release sheet RL side, and a first cutting that forms a closed loop-shaped first cut C1 provided on the die plate 30A. A first cutter die 30 composed of a blade 30B, a platen 31 arranged on the base sheet BS side, and a stamper 32 as a marking means for applying a mark M to a predetermined position of the release sheet RL in synchronization with the cutter die 30 Including. As shown in FIG. 2, the first cut C <b> 1 is set to a depth that reaches the adhesive layer A from the release sheet RL side.

  The second incision means 14 is a die plate 35A disposed so as to be movable up and down on the base sheet BS side, and a second incision C2 provided on the die plate 35A to form a closed loop second notch C2. It includes a second cutter die 35 composed of a cutting blade 35B, a platen 36 disposed on the release sheet RL side, and a detection means 37 that is attached to the platen 36 and detects the mark M. As shown in FIG. 2, the second cut C <b> 2 is set to a depth reaching from the base sheet BS side to the release sheet RL. Further, a grip portion 28 is formed to partially overlap with the first cut C1, and a closed loop second cut is formed in which the non-overlapping region becomes an adhesive portion 29 having an outer edge corresponding to the outer edge shape of the adhesive sheet S. It has come to give.

  As shown in FIG. 2, the first cut C1 includes a side end cut C1a that forms both ends in the width direction, a front end cut C1b that connects the downstream side of the side end cut C1a in the feeding direction, and the opposite. It is a closed loop composed of a curved rear end cut C1c located on the side, and both ends of the rear end cut C1c and the side end cut C1a are connected via an arc-shaped connecting portion cut C1d. Is formed. The rear end cut C1c is a curved edge that matches the outer edge portion of the adhesive sheet S.

  As shown in FIG. 2, the second cut C2 includes an upper surface side end cut C2a, an upper surface front end cut C2b, and a front end cut C2b that coincide with the side end cut C1a, the front end cut C1b, and the joint cut C1d, respectively. Upper surface connecting portion notch C2d, shoulder portion notch C2e directed outward in the width direction from upper surface connecting portion notch C2d, upper surface side end notch C2f continuous to shoulder portion notch C2e, and these upper surface side ends It is set as the closed loop containing the upper surface rear end notch C2g which connects the feed direction upstream of the notch C2f. In the peeling tape PT in the present embodiment, the shoulder cut C2e of the bonding portion 29 and the rear end cut C1c of the gripping portion 28 coincide with the outer edge portion of the adhesive sheet S without being cut off in plan view. Thus, the adhesive portion 29 is provided in a planar shape having an outer edge corresponding to the outer edge shape of the adhesive sheet S. In addition, the adhesive portion 29 is inevitably formed in a wide planar shape with respect to the grip portion 28, so that a peeling force described later extends widely to the adhesive sheet S.

  The holding means 16 is disposed on the tip side of the peel plate 15 and is constituted by a suction head 41 that is connected to a decompression pump (not shown) and is provided so as to suck and hold the peeling tape PT peeled off by the peel plate 15. Yes. The suction surface of the suction head 41 is provided in the same planar shape as the planar shape of the bonding portion 29. As a result, the shoulder portion cut C2e and the rear end cut C1c are made to coincide with the outer edge portion of the adhesive sheet S, and the peeling tape PT is attached to the adhesive sheet S in a state where the grip portion 28 is projected from the outer edge of the adhesive sheet S. It is possible to affix to. In the present embodiment, the operation of causing the shoulder cut C2e and the rear end cut C1c to coincide with the outer edge portion of the adhesive sheet S is controlled by counting pulses output from the single-axis robot 19 by a control means (not shown). However, the configuration is such that the later-described pasting means 17 side is moved with respect to the table 11, or both the table 11 and the pasting means 17 are moved, so that the shoulder portion cut C2e and the rear end cut C1c May coincide with the outer edge of the adhesive sheet S.

  The sticking means 17 includes a linear motion motor 39, and a suction head 41 is fixed to the output shaft 40. Thus, the peeling tape PT held by the suction head 41 can be attached to the adhesive sheet S on the table 11.

  The gripping means 18 includes a chuck holder 45, a rotatable upper claw member 46 supported by the chuck holder 45, and a lower claw member 47 that can move up and down, and these upper claw member 46 and lower claw member 47. Interact with each other so that the grip portion 21 can be gripped. The gripping means 18 is supported by a moving means such as a robot arm (not shown). For example, when the position shown in FIG. Yes.

  Next, a sheet peeling method using the sheet peeling apparatus 10 will be described with reference to FIGS.

  When an activation signal is input by a predetermined input operation, the motor M of the feeding means 12 is driven, and the original fabric R or the unnecessary original fabric portion R1 is wound around the winding roller 24 by a predetermined length and stopped. And the 1st cut C1 is formed from the peeling sheet RL side via the 1st cutting means 13, and the mark M is given to the one end side of the peeling sheet RL via the stamper 32 simultaneously. When the first cut C1 is formed, the motor M is driven again, the mark M is detected and stopped by the detection means 37, and the second cut C2 is formed by the second cut means 14. Thereby, the peeling tape PT provided with the adhesive portion 28 and the grip portion 29 is formed.

  The peeling tape PT formed in this way is intermittently fed next time and stopped at a predetermined position on the peel plate 15 to be in a standby state. Then, as shown in FIG. 1, when the wafer W having the adhesive sheet S stuck on the table 11 is placed on the table 11 by a conveying means (not shown), the next intermittent feeding is performed and the peel plate 15 peels off. The peeled tape PT is sucked and held by the suction head 41.

  On the other hand, when the table 11 moves via the single-axis robot 19 and detects that the wafer W has reached a predetermined position below the attaching means 17 via the pulse of the single-axis robot 19, the single-axis robot 19 is driven. To stop. At this time, as shown in FIG. 1, the left end portion of the wafer W is positioned on the right side of the lower claw member 47 of the gripping means 18.

  When the linear motion motor 39 of the sticking means 17 is driven, the suction head 41 is lowered, and the adhesive portion 29 is attached to the outer peripheral portion of the adhesive sheet S. At this time, the shoulder portion cut C2e and the rear end cut C1c are stuck so as to coincide with the outer edge portion of the adhesive sheet S, thereby preventing the adhesive layer A from adhering to a portion other than the adhesive sheet S. To do.

  And as FIG. 4 shows, the upper nail | claw member 46 and the lower nail | claw member 47 interact, and hold | grip the holding part 28 (refer FIG. 4). Thereafter, the suction head 41 returns to the raised position.

  Next, after the gripping means 18 is raised to a position where it does not interfere with the wafer W, the adhesive sheet S is peeled from the wafer W by the table 11 moving to the left as shown in FIG.

  Therefore, according to such an embodiment, the peeling tape PT provided with the grip portion 28 and the adhesive portion 29 can be formed in real time while the raw fabric R is being fed, and the grip portion 28 protrudes from the outer periphery of the adhesive sheet S. After adhering the adhesive part 29 to the adhesive sheet S in such a state, the adhesive sheet S can be peeled by holding the grip part 28. At this time, since a part of the outer edge of the bonding portion 29 coincides with a part of the outer edge of the adhesive sheet S, it is possible to avoid the inconvenience that the adhesive adheres to the table 11 or the like and becomes dirty.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the case where the second cut C2 is formed after the first cut C1 is formed is illustrated and described. However, after the second cut C2 is formed, the first cut C1 is formed. It may be. In this case, it is sufficient to reverse the arrangement of the first and second incision means 13 and 14 while maintaining the arrangement of the stamper 32 and the detection means 37 as in the embodiment. Furthermore, if the original fabric R in which the first cut C1 and the second cut C2 are formed in advance is employed, the first and second cut means 13 and 14 need not be provided.

  Moreover, in the said embodiment, although the structure which makes a part outer edge of the adhesion part 29 and the one part outer edge of the adhesive sheet S correspond was illustrated and demonstrated, all the outer edges of the adhesion part 29 and all the outer edges of the adhesive sheet S were demonstrated. It is good also as a structure in which. Even in this case, it is possible to eliminate the disadvantage that the adhesive A protruding from the outer edge of the adhesive sheet S adheres to a portion other than the adhesive sheet S to prevent peeling or stain the periphery.

  Furthermore, the planar shape of the peeling tape PT, that is, the planar shape of the grip portion 28 and the adhesive portion 29 is not limited to the illustrated configuration example, and can be changed according to the planar shape of the adhesive sheet S. it can.

  Further, the relative movement between the gripping means 18 and the table 11 when the adhesive sheet S is peeled can be achieved by at least one movement.

  Furthermore, the moving means is not limited to the single-axis robot 19, and a linear motor, a cylinder, or the like may be employed. The gripping means 18 is sufficient if it can grip the grip portion 28.

  Further, the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer can be a silicon wafer or a compound wafer. It may be.

  Furthermore, the adhesive layer A can employ a pressure-sensitive adhesive or a heat-sensitive adhesive, and the composition is not limited at all.

  Further, the gripping means 18 can be provided on the suction head 41. With this configuration, the linear motion motor 39 can be used without providing a driving means for raising the gripping means 18.

  Furthermore, with the first cut C1 and the second cut C2, the upper surface side end cut C2a, the upper surface front end cut C2b, and the upper surface with respect to the side end cut C1a, the front end cut C1b, and the joint cut C1d. It is not always necessary to match the connecting portion cut C2d, the first cut C1 and the second cut C2 overlap, and the shoulder cut C2e of the bonding portion 29 and the rear cut C1c of the grip portion 28. Is not necessary to be cut off in plan view, and it is sufficient to match the outer edge portion of the adhesive sheet S.

  Furthermore, in the above-described embodiment, the sheet peeling apparatus provided with the first and second cutting means 13 and 14 so as to form the grip portion 28 on the downstream side in the feed direction of the original fabric R is illustrated and described. The first and second incision means 13 and 14 may be provided so that the portion 28 is formed on the upstream side in the feeding direction of the original fabric R or in the left-right direction, and the first incision C1 and the second incision are made as such. An original fabric R in which C2 is formed in advance may be adopted. In this case, the gripping means 18 may be arranged in the direction in which the grip portion 28 is formed.

The schematic front view of the sheet peeling apparatus which concerns on this embodiment. Explanatory drawing which shows the correspondence of the 1st and 2nd cutting means, and the cutting shape formed by these cutting means. The schematic front view which shows the state which affixed the tape for peeling on the adhesive sheet. The principal part front view which shows the state which the holding means hold | gripped the holding part. The principal part front view which shows the state from which the adhesive sheet is peeled.

Explanation of symbols

10 Sheet peeling device 11 Table (support means)
12 Feeding means 13 First cutting means 14 Second cutting means 15 Peel plate (peeling means)
16 holding means 17 sticking means 18 gripping means 19 single-axis robot (moving means)
28 Gripping part 29 Adhesive part 32 Stamper (marking means)
37 Detection means 41 Adsorption head A Adhesive layer BS Base sheet C1 First cut C2 Second cut M Mark PT Release tape R Original fabric RL Release sheet S Adhesive sheet W Semiconductor wafer (Substrate)

Claims (5)

In a sheet peeling apparatus that affixes a peeling tape to an adhesive sheet affixed to an adherend, and peels the adhesive sheet from the adherend by relative movement between the peeling tape and the adherend.
A support means for supporting the adherend to which the adhesive sheet is affixed;
A closed loop-shaped first notch reaching from the release sheet side to the adhesive layer, reaching the release sheet from the base sheet side, forming a gripping part partially overlapping with the first notch, and the others A feeding means for feeding out a strip-shaped raw material in which a release tape formed by a closed loop-shaped second cut which is an adhesive portion having an outer edge corresponding to the outer edge shape of the adhesive sheet is temporarily attached to the release sheet When,
Peeling means for peeling the peeling tape;
Holding means for holding the peeling tape;
Affixing the adhesive tape to the adhesive sheet in a state where at least a part of the outer edge of the adhesive part and the outer edge of at least a part of the adhesive sheet coincide with each other and the grip part protrudes outward of the adherend Means,
A gripping means for gripping the gripping portion;
A sheet peeling apparatus comprising a moving means for relatively moving the gripping means and the holding means. In a sheet peeling apparatus that affixes a peeling tape to an adhesive sheet affixed to an adherend, and peels the adhesive sheet from the adherend by relative movement between the peeling tape and the adherend.
A support means for supporting the adherend to which the adhesive sheet is affixed;
A feeding means for feeding out a belt-like original fabric in which the base sheet is temporarily attached to the release sheet via the adhesive layer;
A first incision means for forming a closed loop-shaped first incision reaching the adhesive layer from the release sheet side in the course of unwinding the original fabric;
An adhesive part that reaches the release sheet from the base sheet side, partially overlaps the first notch to form a grip part, and the other region has an outer edge corresponding to the outer edge shape of the adhesive sheet A second cutting means for forming a second closed loop-shaped cut, and a peeling means for peeling the peeling tape;
Holding means for holding the peeling tape;
Affixing the adhesive tape to the adhesive sheet in a state where at least a part of the outer edge of the adhesive part and the outer edge of at least a part of the adhesive sheet coincide with each other and the grip part protrudes outward of the adherend Means,
A gripping means for gripping the gripping portion;
A sheet peeling apparatus comprising a moving means for relatively moving the gripping means and the holding means.   The sheet peeling apparatus according to claim 1, wherein the holding unit includes a suction head having the same planar shape as the bonding portion.   The first cutting means includes marking means for applying a predetermined mark to the original fabric, while the second cutting means includes detection means for detecting a mark, and the first cutting means is based on the position of the mark. The sheet peeling apparatus according to claim 1, wherein two notches are formed. In the sheet peeling method in which a peeling tape is attached to the adhesive sheet affixed to the adherend, and the adhesive sheet is peeled off the adherend by relative movement between the peeling tape and the adherend,
A step of supporting the adherend to which the adhesive sheet is affixed;
A step of feeding a strip-shaped raw material in which a base sheet is temporarily attached to a release sheet via an adhesive layer;
A step of forming a first cut in a closed loop shape reaching the adhesive layer from the release sheet side in the course of feeding out the original fabric;
An adhesive part that reaches the release sheet from the base sheet side, partially overlaps the first notch to form a grip part, and the other region has an outer edge corresponding to the outer edge shape of the adhesive sheet Forming a closed loop second incision to be
Peeling the tape for peeling,
Holding the release tape;
A step of causing at least a part of the outer edge of the adhesive part to coincide with at least a part of the outer edge of the adhesive sheet and affixing the peeling tape to the adhesive sheet in a state in which the grip part protrudes outward of the adherend When,
Gripping the gripping part;
And a step of separating the adhesive sheet from the adherend by relatively moving the gripping means and the adherend while being held by the adherend and the stripping tape means.

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