JP2010010600A5 - - Google Patents

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Publication number
JP2010010600A5
JP2010010600A5 JP2008171067A JP2008171067A JP2010010600A5 JP 2010010600 A5 JP2010010600 A5 JP 2010010600A5 JP 2008171067 A JP2008171067 A JP 2008171067A JP 2008171067 A JP2008171067 A JP 2008171067A JP 2010010600 A5 JP2010010600 A5 JP 2010010600A5
Authority
JP
Japan
Prior art keywords
electrode
substrate
circuit board
recess
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008171067A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010010600A (ja
JP5253016B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008171067A priority Critical patent/JP5253016B2/ja
Priority claimed from JP2008171067A external-priority patent/JP5253016B2/ja
Publication of JP2010010600A publication Critical patent/JP2010010600A/ja
Publication of JP2010010600A5 publication Critical patent/JP2010010600A5/ja
Application granted granted Critical
Publication of JP5253016B2 publication Critical patent/JP5253016B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008171067A 2008-06-30 2008-06-30 回路基板 Expired - Fee Related JP5253016B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008171067A JP5253016B2 (ja) 2008-06-30 2008-06-30 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008171067A JP5253016B2 (ja) 2008-06-30 2008-06-30 回路基板

Publications (3)

Publication Number Publication Date
JP2010010600A JP2010010600A (ja) 2010-01-14
JP2010010600A5 true JP2010010600A5 (cg-RX-API-DMAC10.html) 2011-08-25
JP5253016B2 JP5253016B2 (ja) 2013-07-31

Family

ID=41590695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008171067A Expired - Fee Related JP5253016B2 (ja) 2008-06-30 2008-06-30 回路基板

Country Status (1)

Country Link
JP (1) JP5253016B2 (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101719699B1 (ko) * 2010-10-05 2017-03-27 삼성전자주식회사 메모리 모듈 및 이의 제조 방법
JP6254421B2 (ja) * 2013-11-01 2017-12-27 センサータ テクノロジーズ マサチューセッツ インコーポレーテッド コネクター
CN108075276B (zh) * 2016-11-11 2020-01-07 泰科电子(上海)有限公司 连接器和连接器组件
JP6991782B2 (ja) 2017-08-23 2022-01-13 センサータ テクノロジーズ インコーポレーテッド ソケット
KR102808379B1 (ko) * 2020-05-26 2025-05-16 주식회사 케이엠더블유 Pcb 조립체
JP7834452B2 (ja) * 2021-11-08 2026-03-24 日本端子株式会社 カードエッジ型プリント配線基板
JP7475010B2 (ja) * 2022-01-21 2024-04-26 太陽インキ製造株式会社 立体組み立て回路部品、立体組み立て回路構造
WO2025135928A1 (ko) * 2023-12-22 2025-06-26 엘지이노텍 주식회사 인쇄회로기판

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302975A (ja) * 1994-03-09 1995-11-14 Yazaki Corp 回路板の端末処理方法
JP3904321B2 (ja) * 1998-03-13 2007-04-11 タイコエレクトロニクスアンプ株式会社 プリント基板
JP2000113920A (ja) * 1998-10-01 2000-04-21 Mitsubishi Electric Corp モジュール
JP2007266618A (ja) * 2001-07-30 2007-10-11 Seiko Epson Corp 回路基板、及びこれを用いたインクカートリッジ、回路基板用接続装置およびこれを用いたインクジェット式記録装置

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