JP2010003856A5

JP2010003856A5 -

Info

Publication number: JP2010003856A5
Application number: JP2008161065A
Authority: JP
Filing date: 2008-06-20
Publication date: 2011-06-23
Anticipated expiration: 2028-06-20

Claims

When mounting the first electronic component around the second electronic component on the circuit board on which the second electronic component is mounted, an adhesive sheet for fixing the first electronic component is affixed to the region to be mounted A pasting device for
An adhesive tape having the adhesive sheet;
A guide member for feeding out the adhesive tape and guiding the adhesive sheet to the planned mounting area;
A sticking tool for sticking the adhesive sheet to the region to be mounted by heating and pressing;
An affixing device, wherein a heat insulating material is attached to both front and rear sides of the affixing tool toward the direction of feeding out the adhesive tape .

The part which contacts the said adhesive tape in the lower part of the said heat insulating material is R chamfering. The sticking apparatus of Claim 1 characterized by the above-mentioned.

The adhesive tape is a three-layer tape composed of a surface release liner, an adhesive film, and a back surface release liner.
The sticking device according to claim 1 or 2, wherein

The guide member has a first roller disposed behind the application tool and a second roller disposed in front of the application tool in a direction in which the adhesive tape is fed out.
The sticking device according to any one of claims 1 to 3, wherein

A sticking device according to any one of claims 1 to 4,
An installation device for installing the first electronic component on the adhesive sheet affixed to the mounting scheduled area;
A crimping device for crimping and fixing the first electronic component installed on the adhesive sheet to the circuit board.
A mounting apparatus characterized by that.

When mounting the first electronic component around the second electronic component on the circuit board on which the second electronic component is mounted, an adhesive sheet for fixing the first electronic component is affixed to the region to be mounted A method of applying,
A first step of feeding out an adhesive tape having the adhesive sheet with the guide member and guiding the adhesive sheet to the area to be mounted;
A second step of applying the adhesive sheet to the region to be mounted by heating and pressing with a sticking tool;
As the affixing tool, a heat insulating material is attached to both the front and rear sides in the direction of feeding out the adhesive tape, and a part in contact with the adhesive tape at the lower part is chamfered.
The sticking method characterized by this.

In the second step, the guide member is disposed above the periphery of the planned mounting area.
The sticking method according to claim 6.

As the adhesive tape, a tape having a three-layer structure composed of a surface release liner, an adhesive film, and a back surface release liner is used,
As the guide member, one having a first roller disposed behind the application tool and a second roller disposed in front of the application tool in the direction of feeding out the adhesive tape is used. ,
In the first step, the first roller is used to send out the part of the adhesive tape on which the backside release liner is rolled,
In the second step, the part of the adhesive film having the adhesive sheet with respect to the part of the adhesive tape on which the back surface release liner is wound with the pasting tool via the part of the surface release liner Heating and pressurizing,
After the second step, the portion of the surface release liner is peeled off from the portion of the adhesive film having the adhesive sheet by the second roller.
The sticking method according to claim 6 or 7, wherein:

Affixing step of affixing the adhesive sheet on the mounting scheduled area in the affixing method according to any one of claims 6 to 8,
An installation step of installing the first electronic component on the adhesive sheet affixed to the mounting area;
A crimping step of fixing the first electronic component placed on the adhesive sheet to the circuit board by crimping.
An implementation method characterized by that.