JP2009523323A - Low profile anchored electronics enclosure with improved air cooling system - Google Patents

Abstract

A system for housing electronic components comprises an enclosure comprising an interior, a door for accessing the interior, and a chassis. A component is attached to the chassis, and the chassis is pivotally connected to the enclosure for movement between a retracted position and a deployed position. In the former, the chassis is inside. In the latter, the chassis rotates or swings out of the front of the enclosure, allowing components to be accessed while minimizing the depth / size of the enclosure. The enclosure includes an air intake in the base of the enclosure and an air exhaust port in the rear of the enclosure, both protected by buffers / louvers. Air is drawn through the intake (using a fan), through the interior for cooling, and out of the rear of the enclosure through the exhaust port. This passage was found to minimize the ingress of sprayed liquid so as to comply with IEC IP44.

Description

  The present invention relates to cabinets or enclosures and, more particularly, to cabinets or enclosures for securely holding electronic components.

  Metal or polymer cabinets or other enclosures are often used to accommodate dissimilar or related electronic components at the deployment point. For example, computer terminal components (eg, disk drives and processor boards) include an outer enclosure, an inner support frame or structure to securely hold the components against each other, and a user accessing the interior of the enclosure. May be housed in a case having one or more doors or hatches. Such enclosures are provided to protect the components from external contamination (especially when the components do not have sufficient protection of their own) and to protect the components from tampering or illegal removal. . The enclosure is also regular, and for thermal management (eg, for proper air flow between components) and to facilitate placement of cables or other electrical interconnects between components. Used to separate components from each other in a predetermined manner.

  Many types of electronics enclosures are not intended to withstand harsh or fluctuating environmental conditions. For example, a computer case can protect internal components to a limited extent, but keeps the computer in an environmentally controlled location such as an office, bedroom, or even a dedicated server room. It is generally recommended that However, certain electronic components must be located where environmental control is less stringent, or perhaps where environmental conditions are more likely to vary or where the risk of contamination is greater. For example, electronics for mobile phone network base stations are usually housed in certain small buildings or huts, but are inevitably deployed in places that are more exposed to extreme elements, such as hilltops. It may be. Also, junction boxes or distribution boxes containing electronic components for controllably distributing telecommunication links within buildings must be installed in basements, utility rooms, closets, or similar locations. All of these are likely to be subject to greater temperature fluctuations and greater risk of environmental contamination.

  In addition to being more likely to be exposed to environmental contaminants such as dust, debris, and liquids, the placement of enclosures in certain locations presents problems with space limitations and / or thermal management, such as cooling. For example, if the connection / distribution box is deployed in a utility or other closet with a narrow compartment, the electronics are properly cooled in the distribution box, given the space constraints of the closet and / or the distribution box itself. It can be difficult to arrange to do so.

  It is an object of the present invention to provide a cabinet or enclosure that securely holds electronic components.

  Certain embodiments of the invention relate to an enclosure system for housing electronic components. The system includes an enclosure having an interior, a base, and a rear sidewall. An air refrigerant passage extends from an air intake in the base (near the bottom of the enclosure), through the interior, and out of an air outlet in the rear sidewall. In another embodiment, baffles are placed in the air intake and outlet to limit contaminant ingress.

  In another embodiment, the base has a front portion, a rear portion, and left and right sides. An air intake is disposed on one of the sides of the base. There may be two air intakes, one on each side of the base. Also, the depth of the enclosure may be significantly less than the width of the enclosure (eg, less than or equal to one-half the width of the enclosure) so that when the enclosure is mounted on the wall, it is close to the wall.

  In another embodiment, the enclosure has several air outlets in the rear sidewall, each air outlet allowing air to escape while minimizing possible ingress of environmental pollutants. Have louvers.

  In another embodiment, a wall mounting bracket is used to mount the enclosure to the wall. The bracket may comprise a bracket frame with side flanges. The side flanges overlap the left and right side walls of the enclosure when the enclosure is in contact with the bracket, for example when the rear side wall is placed facing the wall to which the bracket is connected. The flange is slightly spaced from the enclosure sidewall to provide a clearance for the exhausted air to pass through. In other words, air is exhausted through the vents in the rear sidewall, through the space between the enclosure, brackets, and walls, and through the gap toward the front of the enclosure.

  In another embodiment, the enclosure includes a door for accessing the interior of the enclosure. A support chassis is also pivotally connected to the enclosure. The chassis is used to hold or support electronic components. In other words, various electronic devices, modules, or other components can be attached to the chassis. The chassis can be pivoted laterally between a retracted position and a deployed position. In the retracted position, the chassis is inside the enclosure, where the door may be closed to secure the chassis and seal the interior. In the deployed position (the door is open), the chassis rotates out of the enclosure. In this position, the user can more easily access the electronic components supported by the chassis, and the enclosure can have a shallower depth for placement in places with limited space become. The chassis has a pivot axis on the same side as the door for movement in cooperation with the door.

  The present invention will be better understood upon reading the following description of the non-limiting embodiment below with reference to the accompanying drawings.

  With reference to FIGS. 1-9B and 10B, embodiments of the present invention relate to an articulated enclosure system 20 for housing electronic components. The system 20 includes an outer frame or enclosure 21 having a base 22, all of which define an enclosure interior 34, left and right side walls 24, 26, front and rear side walls 28, 30, and an upper side wall 32. Is provided. One or more air intakes 36, such as passageways through which air can flow, extend from the base 22 (at the outer bottom of the enclosure 21) into the enclosure interior 34. The rear side wall 30 has one or more air exhaust ports 38 extending therethrough. The discharge ports 38 each include a baffle such as a louver 40 attached to the rear side wall 30. The air intake 36 also includes a baffle 42. The baffles 40, 42 allow air to pass through while restricting the entry of environmental pollutants such as dust, debris, and sprayed liquid. During operation, air is drawn into the enclosure through the air intake 36 using a standard fan unit 44 for thermal management (eg, cooling). Air circulates through the interior 34 and is exhausted through the exhaust port 38 to the rear of the enclosure. This air flow pattern or passage substantially reduces the possibility of liquid contaminants entering the enclosure.

  The enclosure 21 also includes an internal support frame or chassis 46 for holding electronic components 48, such as devices such as computers or telecommunications cards or boards, electronics modules, and the like. The enclosure system 20 is effectively associated, meaning that the chassis 46 is pivotally attached to the enclosure 21 using a pivot point 50 such as a hinge. Accordingly, the chassis 46 can be rotated laterally out of the front of the enclosure 21 from the retracted position shown in FIG. 5 to the deployed position of FIGS. 6 and 10B. In the deployed position, it is easy for the user to access the component 48 supported by the chassis. Also, in situations where the electronic component 48 has a pre-established dimension that is set regardless of the dimensions of the enclosure 21, the chassis 46 causes the component 48 to move laterally rather than vertically (eg, rear sidewalls). Can be oriented (compare FIGS. 10A and 10B). This allows the enclosure 21 to have a lower profile than conventional enclosures, eg, shallow depth.

  Returning to FIGS. 1 to 4, the overall shape of the enclosure 21 is substantially rectangular. For use in certain applications, the enclosure 21 may be much wider than it is deep, so the enclosure depth will be no more than about one-half the width of the enclosure. (In other words, the width of the front or rear side walls 28, 30 may be at least about twice the width of the left or right side walls 24, 26.) This is much deeper, such as in closets and utility cabinets. Facilitates the placement of the enclosure 21 where there is no space and / or where space is at a premium. Under the relative dimensions shown in the drawings, when the enclosure is configured for use in holding a standard telecommunications connection / distribution plug-in circuit pack, approximately 250 mm (eg, 250 ± 1 mm) It has been found that it can have a depth D1 (see FIG. 10B) of less than and as low as about 203 mm. Such circuit packs usually have a depth of at least 260 mm. For example, the card portion of the circuit pack is typically at least 220 mm deep with additional clearance for a connection of at least 40 mm at the front of the card. This is to a typical depth D2 (see FIG. 10A) of at least 300 mm for a standard enclosure for holding such electronic devices, eg, at least 260 for a circuit pack, and the card cage portion of the chassis and enclosure. Compared to at least an additional 40 mm and generally more.

  The front side wall 28 of the enclosure 21 is configured to be used as a door to access the interior 34. Accordingly, the front side wall 28 is attached to the right side wall 26 using the hinge 52. The front sidewall 28 typically has a peripheral, rear-facing flange 54 to shield or seal the seam between the door and the other sidewall when the door is closed. A key lock 56 may be attached to the front side wall 28 to lock the door to prevent unauthorized access to the interior 34.

  Chassis 46 provides a support frame for mounting and holding electronic components / devices 48. Chassis 46 holds components 48 in a fixed, spaced manner for thermal management and to facilitate an ordered and regular arrangement of cables, jumpers, patches, and the like. The chassis also provides support for intermediate cable terminations, connectors, ports, and the like. For example, such a port removably interconnects an electronic component within the enclosure with an external feed or cable, allowing the external feed to be disconnected without the need to access the component. May be used. The chassis may be configured in a number of different ways to hold different types of electronic components.

  The chassis 46 is dimensioned to fit within the enclosure interior 34 as shown in FIG. 5, in combination with the electronic components 48 supported thereby. Typically, the chassis will occupy almost all of the interior space 34 to minimize the outer dimensions of the enclosure 21. (In other words, it is normal that the enclosure 21 does not have to be much larger than the chassis). As indicated above, the chassis 46 is pivotally connected laterally to the enclosure 21 using a pivot point 50 such as a hinge. Thus, when the front side wall 28 is in the open position, the chassis 46 is swung or rotated along the longitudinal pivot axis defined by the pivot point 50 out of the front of the enclosure and the side of the chassis. Located along the direction / side edge. That is, when retracted, the chassis is in the interior 34 as shown in FIG. When rotated from inside to outside, the chassis is deployed as shown in FIGS. 6 and 10B. Although removal and insertion of certain standard size electronic devices usually requires the enclosure to have a corresponding depth, as shown by the prior art enclosure shown in FIG. 10A, pivoting the chassis 46 Such a device makes it possible to be encapsulated in a equally reliable but much shallower space as well. Also, because the chassis 46 can pivot outward, it is easier for the user to access the electronic components as a whole.

  As shown in the drawings, the pivot axis of the chassis 46 is on the same side as the front side wall (door) 28 of the enclosure 21 so as to move in cooperation with the door. In other words, the door and the chassis are arranged to open in the same direction.

  One or more standard guide assemblies 58 may be attached to the enclosure 21 and the chassis 46 to support the chassis 46 during movement between the retracted position and the deployed position. As shown in FIG. 6, such a guide assembly includes a slide bracket pivotally connected to the enclosure 21 and a bolt-like pin attached to a chassis 46 that slides along the track of the bracket. May be.

  For deployment and placement of the enclosure 21, the enclosure 21 is typically placed with the base 22 in contact with the floor surface 60 and the rear side wall 30 facing the wall 62 (see FIGS. 7 and 8). Enclosure 21 may be mounted on wall 62 for support and / or to prevent removal of the enclosure. For wall mounting and to further limit the potential for contamination (especially from sprayed water), the system 20 includes a wall mounting bracket 64. The wall mounting bracket 64 is a rectangular frame having a top cross member 68, a bottom cross member 70, and left and right flanges 72, 74 facing forward, as best seen in FIG. (The top and bottom cross members 68, 70 may also be front facing flanges). The bracket 64 also includes various mounting openings and the like for connecting the bracket to the wall 62. The wall mounting bracket 64 is substantially complementary to the rear sidewall 30 and allows the rear of the enclosure to be positioned within the bracket 64 and flanges 68, 70, 72, 74. Enclosure 21 is attached to bracket 64 in a standard fashion through interior 34 using fasteners or the like. In order to allow the discharged refrigerant air to escape from the rear of the enclosure, the flange or cross member 68, depending on the direction in which one or more gaps 76 are desired to direct the discharged air, 70, 72, 74 and the enclosure 21. For example, as shown in FIGS. 1, 4, and 8, the bracket 64 and the enclosure 21 have left and right flanges 72, 74 and left and right walls 24, 26 when the enclosure 21 is placed against the bracket 64. It may be configured to be slightly separated from. In the configurations shown in FIGS. 1, 4 and 8, the top and bottom flanges 68, 70 abut the top sidewall 32 and base 30, respectively, to provide a means for sealing between them. (As shown in FIGS. 1 and 3, the base 30 may have a smaller footprint than the side walls. In such a case, the bottom flange 70 abuts the bottom lip of the rear side wall 30. .)

  To cool the electronics device 48, the enclosure includes an air passage 78 through which air is directed in a controlled manner. Initially, air (acting as a refrigerant) is drawn through the air intake 36 in the base 22. Usually, the air intake 36 will be arranged on one side of the base towards the bottom. Optionally, both the left and right sides of the base have such air intakes, and the two intakes form a common duct or other passage. Opening of the air intake is limited or shielded by the baffle 42. The baffle 42 may be a downward hood or louver specifically attached to the exterior of the enclosure sidewall, as shown in FIGS. 7 and 9A. (Baffle 42 is not shown in FIGS. 1-6). Alternatively, as shown in FIG. 9B, the baffle may have several opposing flanges that together define a curved path that allows air flow but constrains the passage of liquid and solid contaminants. Or it may be an internal baffle with a wall 79. Other baffle configurations are possible. Air is drawn through the air intake 36 using a powered fan unit 44 and a standard air filter (not shown). A fan unit 44 may be configured in the enclosure 21 or attached to the chassis 46. For the latter, the chassis 46, the enclosure 21 and the fan 44 are complementarily configured and / or arranged so that the fan 44 draws air through the air intake 36 when the chassis is in the retracted position. The In other words, when the chassis is retracted, the air intake and fan duct 80 is such that the fan effectively draws air into the enclosure 34 out of the rear of the fan unit through the air intake. Together to form a continuous passage sealed up to

  Once drawn into the enclosure 21, air passes through the interior 34 around the component 48 (for cooling) and out through the air exhaust port 38 and into the rear sidewall 30. Enclosure 21 is substantially sealed to ensure that air is exhausted through port 38 (and to minimize contaminant ingress). This allows for a slight stagger or gap between components resulting from manufacturing tolerances and / or a gap between moving parts when the front side wall 28 is closed. Except as well as, except for the air intake 36 and the exhaust port 38, it means that the enclosure is airtight. Thus, the air intake 36 and the exhaust port 38 each provide a first inlet and outlet point for air entering and exiting the enclosure. As described herein, a downward louver 40 attached to the rear side wall 30 is positioned over the discharge port 38 to constrain the entry of contaminants.

  Because air is exhausted through port 38 toward the rear of enclosure 21, when enclosure 21 is positioned against bracket 64, clearance 82 (see FIG. 8) includes rear sidewall 30, bracket 64, and walls. 62 is provided. Thus, after exiting the port 38, the exhausted air passes through the clearance 82 along the wall 62 and through the gap 76 between the side flanges 72, 74 of the bracket 64 and the side walls 24, 26 of the enclosure 21. Pass to exit. This directs the exhausted air towards the front of the enclosure.

  As will be appreciated, the air passage 78 of the present invention includes drawing air from the bottom of the enclosure and exhausting air toward the rear wall of the enclosure. This aisle / route has been found to facilitate enclosure compliance with certain environmental and / or product testing standards. For example, an enclosure manufactured in accordance with the present disclosure could meet IEC (International Institute of Electronics) IP44 standards. This standard includes a water spray test, which is generally difficult to pass when taking in and exhausting air. Under the IP44 standard, this means that the enclosure protects against intrusion of solid external objects with a diameter of 1 mm or more and that the enclosure is at least as sprayed or sprayed to the extent specified by the standard. It means protecting it. Mounting brackets 64 (eg, bracket flanges 68, 70, 72, 74) help shield the rear of the enclosure when the enclosure is wall mounted. Baffles 42 and louvers 40 also help prevent sprayed water or other liquids from entering the enclosure interior 34.

  Enclosure 21 and chassis 46 may be made of one or more durable materials such as metals, polymers, composites, and the like.

  11A-11C illustrate an alternative embodiment of the base 100 for the enclosure system 20. The base 100 is substantially similar to the base 22 described above, but includes two air intakes 102a, 102b at opposite ends of a common intake duct 104 extending along the longitudinal length of the base 100. Duct 104 is defined by front, rear, top and bottom members 106a-106d, respectively interconnected. Inwardly angled inner baffles 108a, 108b project downward from the top of the base into the duct. Baffles 108a, 108b also extend laterally across the width of the duct, as shown in FIG. 11A. The base 100 also optionally includes an additional intake slot 110, for example, in the base rear member 106b oriented in the same direction as the rear sidewall 30. A baffle 112 oriented inwardly to shield the rear intake slot 110 is attached to or integral with the rear portion 106b of the base 100. 11A-11C also shows an upper intake opening 114 in the base 100, over which a fan / filter unit may be arranged to draw air through the intakes 102a, 102b. Baffles 108a, 108b, 112 are generally distributed around the periphery of the air opening 114 to shield the opening 114 in its function as a common entry point for air into the fan / interior. Note that it may be.

  Since several modifications can be made to the articulated electronics enclosure described above without departing from the spirit and scope of the present invention as contained in the present invention, the above description or accompanying drawings. All of the subject matter presented in this section should be construed as merely an example of the concepts of the invention herein and should not be construed as limiting the invention.

1 is a perspective view of an articulated electronics enclosure system according to an embodiment of the present invention. FIG. 1 is a front elevational view of an enclosure system. FIG. FIG. 4 is a rear side elevational view of the enclosure system. FIG. 3 is a top plan view of the enclosure system. FIG. 3 is a side elevational view of the enclosure system with its door portion in the open position. FIG. 3 is a perspective view of an enclosure system showing an internal chassis in a deployed / rotated position. FIG. 3 is a partially cut away front elevation view of the enclosure system showing the flow of refrigerant air through the enclosure. FIG. 2 is a partially cut top plan view of an enclosure system showing the air flow through the enclosure. It is a detailed schematic diagram of an air intake baffle. It is a detailed schematic diagram of an air intake baffle. FIG. 6 is a schematic top plan view showing the operation of an enclosure according to the prior art. FIG. 6 is a schematic top plan view illustrating the operation of an embodiment of the enclosure of the present invention. FIG. 6 is a perspective view of an alternative embodiment of the base portion of the enclosure. FIG. 11B is a side elevational view of the base in FIG. 11A, partially shown cut away. FIG. 11B is a detailed view of the base shown in FIG. 11B.

Claims (10)

An enclosure system for containing electronic components,
An enclosure having an interior, a base defining the bottom of the enclosure, and a rear sidewall;
An air refrigerant passage extending from at least one air intake in the base through the interior to at least one air outlet in the rear sidewall.   At least one associated with the at least one air inlet and the at least one air outlet, respectively, to limit contaminant ingress through the inlet and outlet to the base and rear sidewall, respectively. The system of claim 1, wherein two baffles are attached.   The base has a front portion, a rear portion, and left and right sides, the left and right sides of the base being shorter in length than the front and rear portions of the base, and the at least one The system of claim 2, wherein an air intake comprises first and second air intakes disposed in the left and right sides of the base, respectively.   The system of claim 2, wherein a depth of the enclosure is about one half or less of the enclosure width.   And further comprising a plurality of air outlets in the rear sidewall, each of the air outlets having an associated louver to limit entry of contaminants through the outlet, the air outlet 3. The system of claim 2, wherein the system is distributed across the width of the rear sidewall proximate to the top of the enclosure. A wall mounting bracket for mounting the enclosure to the wall, the wall mounting bracket being complementary in shape to the rear side wall;
The bracket has at least one flange configured to overlap at least one of the side walls of the enclosure when the rear side wall of the enclosure is adapted to support the bracket; The system of claim 2, wherein there is at least one gap between the at least one flange and the at least one of the enclosure sidewalls for passing through.   When the bracket comprises a bracket frame and at least first and second side flanges extending along each side of the frame, and the rear wall of the enclosure is adapted to support the bracket; The system of claim 6, wherein the side flange is configured to overlap the left and right sides of the enclosure. A front side wall of the enclosure includes a door for accessing the interior, the door having a pivot shaft disposed on a selected one of the left and right side walls of the enclosure; and ,
The system further comprises a support chassis pivotally connected within the enclosure and configured to hold at least one electronics device, the support chassis being configured such that the chassis is completely within the interior. Pivoting laterally between a retracted position being deployed and a deployed position in which at least a portion of the chassis rotates out of the interior to access an electronic device attached to the chassis; and The system of claim 2, wherein the chassis has a pivot shaft disposed on the selected one of the left and right enclosure sidewalls for cooperative movement with the door. An enclosure having a door for defining and accessing the interior, the door having a pivot shaft disposed on a selected one of the left and right side walls of the enclosure When,
A support chassis pivotally connected to the enclosure and configured to hold at least one electronic component, the support chassis being disposed entirely within the enclosure. The chassis pivots laterally between a retracted position and a deployed position in which at least a portion of the chassis rotates out of the enclosure to access electronic components supported by the chassis; A pivot shaft disposed on the selected one of the left and right enclosure sidewalls substantially parallel to the door pivot shaft and for cooperating movement with the door; ,
Enclosure system for electronics. The enclosure includes a base, a rear sidewall, and a plurality of second sidewalls, the sidewall being attached to the base and defining the interior of the enclosure;
The base has at least one air intake, and the rear side wall has at least one air outlet;
The at least one air inlet and the at least one air outlet use the interior of the enclosure for passage of air from the at least one inlet, through the interior and out of the at least one outlet. In fluid communication,
The system according to claim 9.

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