JP2009522441A - Electrolyte and process for depositing a matte metal layer - Google Patents
Electrolyte and process for depositing a matte metal layer Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Abstract
Description
本発明は基板上に乳濁液および/あるいは分散液形成物または湿潤剤から構成される電解液から艶消し金属層を堆積するための電解液及び工程に関する。 The present invention relates to an electrolyte and process for depositing a matte metal layer from an electrolyte comprised of an emulsion and / or dispersion former or wetting agent on a substrate.
基板上に金属層の製造において目的は一般的に平滑で高い光沢のある被覆をむしろ得ることである。しかし、特別な応用においては、光沢がなく艶消し金属被覆を得ることがしばしば望まれる。その理由は被覆の光学的外観およびまた技術的性質、すなわちこのような被覆の輝きのないことである。基板上の艶消し堆積金属層の応用の分野はこれらの被覆の輝きのないことが特に重要である例えば宝石工業、家具類工業、自動車工業、また光学および精密工業である。従来の技術でコバルト層と同様に艶消しの堆積されたニッケルあるいはニッケル合金層が知られている。このような電位的にアレルギーを引き起こす金属の堆積は多くの分野で致命的ではないけれども、宝石工業分野あるいはまた台所器具や台所用品の分野においてこれらの金属を避けることが望ましい。光学あるいは精密工業の分野において多くの異なる金属の艶消し金属層の堆積はそれぞれの金属の異なる性質のため望まれる。付け加えると、広い範囲に亘る堆積金属層の艶消しの程度を調節することが望まれる。 In the production of a metal layer on a substrate, the aim is generally to obtain a rather smooth and highly glossy coating. However, in special applications it is often desirable to obtain a matte metal coating with no gloss. The reason is the optical appearance and also the technical nature of the coating, i.e. the lack of brightness of such a coating. The field of application of matte deposited metal layers on substrates is particularly important in the absence of shine of these coatings, for example in the jewelry industry, furniture industry, automotive industry, and optics and precision industry. A nickel or nickel alloy layer with a matte deposit as well as a cobalt layer is known in the prior art. Although such potential allergenic metal deposits are not fatal in many fields, it is desirable to avoid these metals in the jewelry industry or also in the field of kitchen utensils and kitchenware. In the field of optics or precision industry, the deposition of matte metal layers of many different metals is desired due to the different properties of each metal. In addition, it is desirable to adjust the degree of matting of the deposited metal layer over a wide range.
基板上に艶消し金属層の堆積するための工程の電解液を提供し、この方法により種々の金属が多くの異なる基板上に異なる艶消しの程度で堆積することが本発明の目的である。 It is an object of the present invention to provide an electrolyte for a process for depositing a matte metal layer on a substrate and to deposit various metals on many different substrates to different matte degrees by this method.
この目的は乳濁液および/あるいは分散液形成物あるいは湿潤剤からなる電解質により達成され、電解質はAl、Ti、V、Cr、Mn、Fe、Co、Ni、Cu、Zn、As、Se、Mo、Ru、Rh、Pd、Ag、Cd、In、Sn、Sb、Te、W、Re、Pt、Au、Tl、Pb、Biあるいはこれらの金属の合金からなるグループの金属を堆積するための金属を含んでいること、乳濁液および/あるいは分散液形成物は置換されたあるいは置換されていないポリアルキレン酸化物あるいはその誘導体であること、湿潤剤はフッ化あるいはペルフッ化疎水性鎖を含んでいるかあるいはポリアルキレン酸化物置換の第4級アンモニウム化合物であること、そして電解質、乳濁液および/あるいは分散液形成物あるいは湿潤剤はミクロ乳濁液および/あるいは分散液を形成することを特徴としている。 This object is achieved by an electrolyte consisting of an emulsion and / or dispersion former or wetting agent, the electrolyte being Al, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, As, Se, Mo. , Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, W, Re, Pt, Au, Tl, Pb, Bi, or a metal for depositing a group of metals consisting of alloys of these metals. Contain, emulsion and / or dispersion formation is a substituted or unsubstituted polyalkylene oxide or derivative thereof, does the wetting agent contain fluorinated or perfluorinated hydrophobic chains? Or a polyalkylene oxide substituted quaternary ammonium compound, and the electrolyte, emulsion and / or dispersion former or wetting agent is micromilk It is characterized by forming a liquid and / or dispersions.
工程に関して、目的は基板上に艶消し金属を電気的に堆積する工程により解決され、基板は本発明に従う電解液と対電極からなるガルヴァーニ浴内の電源に接続され、基板上に金属層を堆積するに適した電圧が基板と対電極の間にかけられる。 With respect to the process, the object is solved by the step of electrically depositing matte metal on the substrate, the substrate being connected to a power source in a galvanic bath consisting of an electrolyte and a counter electrode according to the present invention, and depositing a metal layer on the substrate A suitable voltage is applied between the substrate and the counter electrode.
電解液中のミクロ乳濁液の形成は対応する電解液から多くの異なる金属の艶消しの堆積に適していることが発見された。さらに、堆積するための多くの異なる金属の電解液中のミクロ乳濁液の形成のために、ポリアルキレングリコール(複数)あるいはこれらの誘導体、フッ化あるいはペルフッ化疎水性の鎖を持つ湿潤剤およびポリアルキレン酸化物鎖によって置換された第4級アンモニウム化合物が適していることが発見された。これらの化合物は広い範囲の多くの異なる金属の電解質中の乳濁液の製造に使用できそして独立して使用できる。 It has been discovered that the formation of a microemulsion in an electrolyte is suitable for the matte deposition of many different metals from the corresponding electrolyte. Furthermore, for the formation of microemulsions in many different metal electrolytes for deposition, polyalkylene glycols or their derivatives, wetting agents with fluorinated or perfluorinated hydrophobic chains and It has been found that quaternary ammonium compounds substituted by polyalkylene oxide chains are suitable. These compounds can be used for the preparation of emulsions in a wide range of many different metal electrolytes and can be used independently.
ポリアルキレングリコールが乳濁液および/あるいは分散液の形成体として使用されるなら、異なるパーセントの親水性および疎水性構造で、望ましくは、ポリエチレンとポリプロピレングリコールからなる特別なポリマーが均一構造のポリマーとして添加に適していることが分かった。この場合において、なかでも平均分子量に依存する堆積金属層の艶消しの程度を決めるのは親水性および疎水性構造のパーセントであり、そこでは平均分子量は>200g/mol、高いパーセントの疎水性構造では望ましくは200から2000g/molであり、そしてさらに高いパーセントの親水性構造を持つポリマーに対しては望ましくは>4000g/molが通常適している。 If a polyalkylene glycol is used as the emulsion and / or dispersion former, a special polymer consisting of different percentages of hydrophilic and hydrophobic structures, preferably polyethylene and polypropylene glycols, is preferably used as a homogeneous polymer. It was found to be suitable for addition. In this case, it is the percentage of hydrophilic and hydrophobic structures that determines the degree of matting of the deposited metal layer depending on the average molecular weight, where the average molecular weight is> 200 g / mol, a high percentage of hydrophobic structures Is preferably 200 to 2000 g / mol, and preferably> 4000 g / mol for polymers with a higher percentage of hydrophilic structure.
フッ化物あるいはペルフッ化物の湿潤剤を使用するとき、一般的な湿潤剤の化学式は
RfCH2CH2O(CH2CH2O)XH (式1)
Rf=F(CF2CF2)nで、ここでX=6から15そしてn=2から10が特に適している。フッ化物あるいはペルフッ化物の湿潤剤の平均分子量は、本発明に従えば、約550と約1000g/molの間であり、望ましくは約700と約1000g/molの間である。この場合において、また平均分子量は艶消しの程度に影響を持っている。
When a fluoride or perfluoride wetting agent is used, a general wetting agent chemical formula is R f CH 2 CH 2 O (CH 2 CH 2 O) X H (Formula 1)
R f = F (CF 2 CF 2 ) n , where X = 6 to 15 and n = 2 to 10 are particularly suitable. The average molecular weight of the fluoride or perfluoride wetting agent is between about 550 and about 1000 g / mol, and preferably between about 700 and about 1000 g / mol according to the present invention. In this case, the average molecular weight also has an influence on the degree of matting.
本発明に従う電解液から金属層の堆積に適した他の型の湿潤剤は望ましくは次の一般式に従うポリアルキレン酸化物置換第4級アンモニウム化合物であり、
ここで、少なくとも一つのR1、R2、R3あるいはR4基はポリアルキレン酸化物の置換基でそして残りの基は独立して同じかあるいは異なる直鎖か側鎖の飽和あるいは不飽和のC1からC18のアルキル鎖でX−はハロゲン陰イオン、硫酸陰イオンあるいはC1からC6の炭酸陰イオンである。特に一般式2の第4級のアンモニウム化合物が適していることがわかり、R1およびR2はC8からC12で、望ましくはC10アルキル側鎖、R3はC1からC3で、望ましくはC1アルキル側鎖、R4は一般式[CH2-CH2-O]nHに一致し、n=1から5、そしてX−はC2からC4の炭酸陰イオンである。
Another type of wetting agent suitable for depositing a metal layer from an electrolyte according to the present invention is desirably a polyalkylene oxide substituted quaternary ammonium compound according to the following general formula:
Here, at least one R 1 , R 2 , R 3 or R 4 group is a substituent of the polyalkylene oxide and the remaining groups are independently the same or different linear or side chain saturated or unsaturated. In the C 1 to C 18 alkyl chain, X − is a halogen anion, a sulfate anion, or a C 1 to C 6 carbonate anion. It has been found that quaternary ammonium compounds of general formula 2 are particularly suitable, wherein R 1 and R 2 are C 8 to C 12 , preferably C 10 alkyl side chains, R 3 is C 1 to C 3 , Desirably the C 1 alkyl side chain, R 4 corresponds to the general formula [CH 2 —CH 2 —O] n H, n = 1 to 5 and X − is a C 2 to C 4 carbonate anion.
電解液に添加される第4級アンモニウム化合物の平均分子量は、本発明に従えば、約200と約1000g/molの間で、望ましくは約400と約500g/molの間で、さらに望ましくは約450と約460g/molの間である。 According to the present invention, the average molecular weight of the quaternary ammonium compound added to the electrolyte is between about 200 and about 1000 g / mol, preferably between about 400 and about 500 g / mol, more preferably about Between 450 and about 460 g / mol.
さらに本発明に従った電解液へのポリテトラフルオロエチレン粒子の添加は堆積した艶消し金属層の性質に影響を持つ。従って、ポリテトラフルオロエチレン粒子を添加して含む本発明に従った電解液からの艶消し金属層の堆積において、ポリテトラフルオロエチレン粒子の添加のない本発明に従う電解液から堆積した艶消し表面と比較して表面は感触性に関して相当柔らかでそして指のプリント(触れることは自由)に明らかに低い感受性を示すことが明白である。 Furthermore, the addition of polytetrafluoroethylene particles to the electrolyte according to the invention has an influence on the properties of the deposited matte metal layer. Thus, in the deposition of a matte metal layer from an electrolyte according to the present invention with the addition of polytetrafluoroethylene particles, a matte surface deposited from the electrolyte according to the present invention without the addition of polytetrafluoroethylene particles; By comparison, it is clear that the surface is quite soft with respect to the feel and shows a clearly low sensitivity to finger prints (free to touch).
添加したポリテトラフルオロエチレン粒子の平均粒子直径は約10から約1000nm、望ましくは、約100から約300nmの範囲であることが発見された。 It has been discovered that the average particle diameter of the added polytetrafluoroethylene particles ranges from about 10 to about 1000 nm, desirably from about 100 to about 300 nm.
本発明に従って、ポリテトラフルオロエチレン粒子は約0.1と1000mg/Lの間、望ましくは、約0.5と5mg/Lの間の濃度で添加される。 In accordance with the present invention, polytetrafluoroethylene particles are added at a concentration between about 0.1 and 1000 mg / L, desirably between about 0.5 and 5 mg / L.
次の実施例は本発明に従う電解液の実施態様と同様に本発明に従う工程を示すが本発明はこれらの実施例の実施態様に制約されるものではない。 The following examples illustrate the process according to the present invention as well as the embodiments of the electrolyte according to the present invention, but the present invention is not limited to these example embodiments.
(実施例1)
次の組成を持つCu電解液:
55g/L Cu2+
66g/L H2SO4
100mg/L Cl−
200mg/L bis−(3−sulfopropyl)−disulfide,disodium salt が
分子質量900g/molを持つ2g/Lのポリプロピレングリコールと混合された。メッキを10分間、5A/dm2そして35℃、陰極を2m/分で動かしながら角のあるシートで行った。空気移動は要求しない。驚くべきことに、高いそして低い電流密度領域で均一な真珠光沢が得られた。少量の有機光沢剤のため電流中断の間付着の問題はなくその後付着層は酸性の青銅電解液からあるいは3価のクロム電解液から堆積できた。真珠光沢効果の艶消しの程度はポリマーの濃度によって制御できる。セライト(Celite)の1回の濾過により全ての真珠光沢の輝度物は除去される。
Example 1
Cu electrolyte with the following composition:
55 g / L Cu 2+
66 g / L H 2 SO 4
100 mg / L Cl −
200 mg / L bis- (3-sulfopropyl) -disulphide, disodium salt was mixed with 2 g / L polypropylene glycol having a molecular mass of 900 g / mol. Plating was done for 10 minutes on a square sheet with 5 A / dm 2 and 35 ° C., moving the cathode at 2 m / min. No air movement is required. Surprisingly, a uniform pearl luster was obtained at high and low current density regions. There was no adhesion problem during the current interruption due to the small amount of organic brightener, and then the adhesion layer could be deposited from acidic bronze electrolyte or from trivalent chromium electrolyte. The degree of matte pearl luster effect can be controlled by the polymer concentration. All pearlescent luster is removed by a single filtration of Celite.
(実施例2)
実施例1に記述したパラメーターを使用したとき、安定し均一な真珠光沢効果が26℃で実施例1に記述したポリプロピレングリコールの代わりに次のブロックポリマー構造を持つポリアルキレングコール300mg/Lを添加して得られる:
HO-(CH2-CH2-O)x-(CH2-CH(CH3)-O)Y-(CH2-CH2-O)z-H
平均分子量は分子質量の20%であるポリエチレン酸化物の分率(x+z)の1700g/molである。
(Example 2)
When using the parameters described in Example 1, a stable and uniform pearlescent effect was added at 26 ° C. in place of the polypropylene glycol described in Example 1 with 300 mg / L of polyalkylene glycol having the following block polymer structure: To get:
HO— (CH 2 —CH 2 —O) x — (CH 2 —CH (CH 3 ) —O) Y — (CH 2 —CH 2 —O) z —H
The average molecular weight is 1700 g / mol of the fraction (x + z) of polyethylene oxide which is 20% of the molecular mass.
(実施例3)
次の組成を持つ青銅電解液において:
12g/L Cu(II)
2g/L Sn(II)
10g/L メタンスルホン酸
2g/L ハイドロキノン
電流密度2A/dm2、25℃そして陰極移動1m/分で分子質量5000g/molで分率20%のポリプロピレン酸化物で実施例2に示されるブロックポリマー構造を持つ5mg/Lポリアルキレングリコールで均一な真珠光沢効果がまた得られた。
(Example 3)
In a bronze electrolyte with the following composition:
12g / L Cu (II)
2g / L Sn (II)
10 g / L methanesulfonic acid 2 g / L hydroquinone current density 2 A / dm 2 , 25 ° C. and block migration 1 m / min, molecular weight 5000 g / mol, 20% fraction block polymer structure shown in Example 2 A uniform pearlescent effect was also obtained with 5 mg / L polyalkylene glycol having
(実施例4)
次の組成を持つワット電解液において:
440g/L 硫酸ニッケル
30g/L ホウ酸
40g/L 塩化ニッケル
5g/L サッカリンナトリウム塩
700g/molの平均分子量をもつ、次式でX=5およびY=10で特徴づけられる主な組成の湿潤剤であるCF置換ポリエチレングリコール10g/Lの添加により、均一な艶消し効果が52℃の温度、pH値4.2、電流密度5A/dm2、陰極移動2m/分で10分後に均一な艶消し効果が得られた。
F-(CF2-CF2)X-(CH2-CH2-O)Y-H
(Example 4)
In a Watt electrolyte with the following composition:
440 g / L Nickel sulfate 30 g / L Boric acid 40 g / L Nickel chloride 5 g / L Saccharin sodium salt 700 g / mol average molecular weight with a main composition characterized by X = 5 and Y = 10 Addition of a certain CF-substituted polyethylene glycol 10 g / L gives a uniform matting effect at a temperature of 52 ° C., a pH value of 4.2, a current density of 5 A / dm 2 , and a cathode movement of 2 m / min after 10 minutes. was gotten.
F- (CF 2 -CF 2 ) X- (CH 2 -CH 2 -O) Y -H
(実施例5)
実施例4において、CF2置換ポリエチレングリコールをポリエチレングリコールで置換されたアンモニウム化合物で置き換えると、均一な艶消し効果が実施例4よりも異なる構造を持って得られた。例えば、真珠光沢効果を持つニッケルメッキ真鍮シートが実施例4と同様のワット電解液に8mg/Lのdidecylmethylpoly−(oxethyl)anmmonium propionateの添加によって得られた。
(Example 5)
In Example 4, when the CF 2 -substituted polyethylene glycol was replaced with an ammonium compound substituted with polyethylene glycol, a uniform matte effect was obtained with a different structure than in Example 4. For example, a nickel-plated brass sheet having a pearly luster effect was obtained by adding 8 mg / L didemethylmethyl- (oxethyl) ammonium propionate to the same watt electrolyte as in Example 4.
(実施例6)
実施例5で製造されたポリエチレングリコール置換アンモニウム塩の乳濁液は1mL/LのPTFE懸濁液(Zonyl TE3367−N、Dupont)が添加され、それにより層の異なった構造と性質が得られた。
(Example 6)
The polyethylene glycol substituted ammonium salt emulsion prepared in Example 5 was added with 1 mL / L of PTFE suspension (Zonyl TE3367-N, Dupont), which resulted in different structure and properties of the layers. .
かくして製造された表面は強い疎水性の埃をはねつける効果を示した。 The surface thus produced showed the effect of repelling strong hydrophobic dust.
Claims (11)
電解液はAl、Ti、V、Cr、Mn、Fe、Co、Ni、Cu、Zn、As、Se、Mo、Ru、Rh、Pd、Ag、Cd、In、Sn、Sb、Te、W、Re、Pt、Au、Tl、Pb、Biあるいはこれらの金属の合金からなるグループの金属を堆積するための金属を含んでいること、乳濁液および/あるいは分散液形成物は置換されたあるいは置換されていないポリアルキレン酸化物あるいはその誘導体であること、湿潤剤はフッ化あるいはペルフッ化疎水性鎖を含んでいるかあるいはポリアルキレン酸化物置換の第4級アンモニウム化合物であること、そして電解質、乳濁液および/あるいは分散液形成物あるいは湿潤剤がミクロ乳濁液および/あるいは分散液を形成することを特徴としている。 An electrolyte for depositing a matte metal layer on a substrate from an electrolyte consisting of an emulsion and / or a dispersion former or wetting agent,
The electrolytes are Al, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, As, Se, Mo, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, W, Re Pt, Au, Tl, Pb, Bi or containing metals for depositing metals of the group consisting of these metals, emulsions and / or dispersion formations are substituted or substituted Non-polyalkylene oxide or derivative thereof, the wetting agent contains a fluorinated or perfluorinated hydrophobic chain or is a polyalkylene oxide-substituted quaternary ammonium compound, and an electrolyte, emulsion And / or the dispersion former or wetting agent is characterized by forming a microemulsion and / or dispersion.
RfCH2CH2O(CH2CH2O)XH
Rf=F(CF2CF2)nで、ここでX=6から15そしてn=2から10。 The electrolyte of claim 1, wherein the fluorinated or perfluorinated wetting agent desirably has the general formula:
R f CH 2 CH 2 O ( CH 2 CH 2 O) X H
R f = F (CF 2 CF 2 ) n , where X = 6 to 15 and n = 2 to 10.
少なくとも一つのR1、R2、R3あるいはR4基はポリアルキレン酸化物の置換体でそして残りの基は独立して同じかあるいは異なる直鎖か側鎖の飽和あるいは不飽和のC1からC18のアルキル鎖でそしてX−はハロゲン陰イオン、硫酸陰イオンあるいはC1からC6の炭酸陰イオンである請求項1の電解液。 The polyalkylene oxide substituted quaternary ammonium compound used as a wetting agent has the general formula:
At least one R 1 , R 2 , R 3 or R 4 group is a polyalkylene oxide substituent and the remaining groups are independently from the same or different linear or side chain saturated or unsaturated C 1. alkyl chains a and X a C 18 - is a halogen anion, the electrolytic solution of claim 1 which is carbonate anions to C 6 sulfate anions or C 1.
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JP2017095807A (en) * | 2011-09-09 | 2017-06-01 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | Low internal stress copper electroplating method |
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US20120298519A1 (en) | 2012-11-29 |
US8192607B2 (en) | 2012-06-05 |
CN101400830A (en) | 2009-04-01 |
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ATE507327T1 (en) | 2011-05-15 |
US20080302668A1 (en) | 2008-12-11 |
CN101400830B (en) | 2012-07-04 |
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DE502006009414D1 (en) | 2011-06-09 |
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