JP2009520352A5 - - Google Patents

Download PDF

Info

Publication number
JP2009520352A5
JP2009520352A5 JP2008545593A JP2008545593A JP2009520352A5 JP 2009520352 A5 JP2009520352 A5 JP 2009520352A5 JP 2008545593 A JP2008545593 A JP 2008545593A JP 2008545593 A JP2008545593 A JP 2008545593A JP 2009520352 A5 JP2009520352 A5 JP 2009520352A5
Authority
JP
Japan
Prior art keywords
door
substrate carrier
opening mechanism
door opening
load port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008545593A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009520352A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2006/042669 external-priority patent/WO2007078406A2/en
Publication of JP2009520352A publication Critical patent/JP2009520352A/ja
Publication of JP2009520352A5 publication Critical patent/JP2009520352A5/ja
Pending legal-status Critical Current

Links

JP2008545593A 2005-12-16 2006-10-30 基板キャリヤを開閉するための方法及び装置 Pending JP2009520352A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75108505P 2005-12-16 2005-12-16
PCT/US2006/042669 WO2007078406A2 (en) 2005-12-16 2006-10-30 Methods and apparatus for opening and closing substrate carriers

Publications (2)

Publication Number Publication Date
JP2009520352A JP2009520352A (ja) 2009-05-21
JP2009520352A5 true JP2009520352A5 (enExample) 2009-11-26

Family

ID=38228680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008545593A Pending JP2009520352A (ja) 2005-12-16 2006-10-30 基板キャリヤを開閉するための方法及び装置

Country Status (5)

Country Link
JP (1) JP2009520352A (enExample)
KR (1) KR20070064383A (enExample)
CN (1) CN101000882B (enExample)
TW (1) TW200730412A (enExample)
WO (1) WO2007078406A2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4488255B2 (ja) * 2008-05-27 2010-06-23 Ｔｄｋ株式会社 密閉容器の蓋開閉システム、当該蓋開閉システムを含む収容物挿脱システム、及び当該蓋開閉システムを用いた基板処理方法
JP5324231B2 (ja) * 2009-01-08 2013-10-23 日東電工株式会社 半導体ウエハのアライメント装置
US10453726B2 (en) * 2016-11-10 2019-10-22 Applied Materials, Inc. Electronic device manufacturing load port apparatus, systems, and methods

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5674123A (en) * 1995-07-18 1997-10-07 Semifab Docking and environmental purging system for integrated circuit wafer transport assemblies
US5772388A (en) * 1996-05-28 1998-06-30 Clark; Richard J. Combination hauler for vehicle and trailered boat
US6261044B1 (en) * 1998-08-06 2001-07-17 Asyst Technologies, Inc. Pod to port door retention and evacuation system

Similar Documents

Publication Publication Date Title
IL192071A0 (en) Device and method for the surface treatment of substrates
WO2010010275A3 (fr) Procede de transfert d'une portion de film fonctionnel
WO2009076322A3 (en) Methods and devices for processing a precursor layer in a group via environment
JP2009523325A5 (enExample)
JP2009533844A5 (enExample)
WO2008125302A3 (de) Verfahren zum übertragen einer nanoschicht
TW200503097A (en) Method and apparatus for removing a target layer from a substrate using reactive gases
WO2007055744A3 (en) Methods for growing and harvesting carbon nanotubes
EP1344652A3 (en) Transfer of organic material from a donor to form a layer in an oled device
JP2009527676A5 (enExample)
WO2007008677A3 (en) Load port module
WO2009042028A3 (en) Lanthanide dielectric with controlled interfaces
WO2008069930A3 (en) Flexible substrates having a thin-film barrier
EP1837896A4 (en) SUBSTRATE MAINTAINING APPARATUS, EXPOSURE APPARATUS, AND METHOD FOR MANUFACTURING THE DEVICE
WO2006014590A3 (en) A network device architecture for centralized packet processing
WO2008039702A3 (en) Substrate handling system and method
CN100521144C (zh) 基板保持装置
WO2011071231A3 (ko) 필름 부착장치 및 부착방법
WO2008019277A3 (en) Substrate bonding process with integrated vents
TW200738543A (en) Method and apparatus for transporting a substrate using non-newtonian fluid
WO2007040587A3 (en) Method for forming a multiple layer passivation film and a deice
TW200632995A (en) Single wafer dryer and drying methods
TW200606540A (en) Method of bonding substrates and apparatus for bonding substrates
JP2009520352A5 (enExample)
WO2009151665A3 (en) Methods and devices for processing a precursor layer in a group via environment