JP2009518872A - 基板を処理する方法及び装置 - Google Patents

基板を処理する方法及び装置 Download PDF

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Publication number
JP2009518872A
JP2009518872A JP2008544516A JP2008544516A JP2009518872A JP 2009518872 A JP2009518872 A JP 2009518872A JP 2008544516 A JP2008544516 A JP 2008544516A JP 2008544516 A JP2008544516 A JP 2008544516A JP 2009518872 A JP2009518872 A JP 2009518872A
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JP
Japan
Prior art keywords
substrate
edge
polishing film
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008544516A
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English (en)
Japanese (ja)
Other versions
JP2009518872A5 (https=
Inventor
エリック， シー． ワッシンガー，
ギャリー， シー． エッティンガー，
センーホウ コー，
ウェイ−ユン ヒュー，
リアン−ユー チェン，
ホー， セオン シン，
ドナルド オルガド，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/298,555 external-priority patent/US20070131653A1/en
Priority claimed from US11/299,295 external-priority patent/US7993485B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2009518872A publication Critical patent/JP2009518872A/ja
Publication of JP2009518872A5 publication Critical patent/JP2009518872A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2008544516A 2005-12-09 2006-12-07 基板を処理する方法及び装置 Pending JP2009518872A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/298,555 US20070131653A1 (en) 2005-12-09 2005-12-09 Methods and apparatus for processing a substrate
US11/299,295 US7993485B2 (en) 2005-12-09 2005-12-09 Methods and apparatus for processing a substrate
PCT/US2006/046765 WO2007070353A2 (en) 2005-12-09 2006-12-07 Methods and apparatus for processing a substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012100094A Division JP2012183637A (ja) 2005-12-09 2012-04-25 基板を処理する方法及び装置

Publications (2)

Publication Number Publication Date
JP2009518872A true JP2009518872A (ja) 2009-05-07
JP2009518872A5 JP2009518872A5 (https=) 2011-10-20

Family

ID=38163413

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008544516A Pending JP2009518872A (ja) 2005-12-09 2006-12-07 基板を処理する方法及び装置
JP2012100094A Pending JP2012183637A (ja) 2005-12-09 2012-04-25 基板を処理する方法及び装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012100094A Pending JP2012183637A (ja) 2005-12-09 2012-04-25 基板を処理する方法及び装置

Country Status (5)

Country Link
EP (1) EP1976806A4 (https=)
JP (2) JP2009518872A (https=)
KR (1) KR101236855B1 (https=)
TW (1) TWI362697B (https=)
WO (1) WO2007070353A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012231191A (ja) * 2007-12-03 2012-11-22 Ebara Corp 研磨装置および研磨方法
JP2017087305A (ja) * 2015-11-02 2017-05-25 日本電気硝子株式会社 円板状ワークの研磨加工方法及び研磨加工装置
JP6414353B1 (ja) * 2018-03-27 2018-10-31 株式会社不二越 フィルムラップ加工装置
KR20200010073A (ko) * 2018-07-20 2020-01-30 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7993485B2 (en) 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US7976361B2 (en) 2007-06-29 2011-07-12 Ebara Corporation Polishing apparatus and polishing method
JP2014083647A (ja) * 2012-10-25 2014-05-12 Avanstrate Inc ガラス基板研磨用磁性流動体
TWI620240B (zh) * 2013-01-31 2018-04-01 應用材料股份有限公司 用於化學機械平坦化後的基板清潔之方法及設備
WO2015061741A1 (en) 2013-10-25 2015-04-30 Applied Materials, Inc Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning
DE102015008814A1 (de) 2015-07-10 2017-01-12 Thielenhaus Technologies Gmbh Andrückschuh mit Expansionskammer
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081494A (ja) * 1994-06-27 1996-01-09 Sanshin:Kk ウエハー材縁端部研磨装置
JP2002154041A (ja) * 2000-11-17 2002-05-28 I M T Kk 研磨装置
JP2002208572A (ja) * 2001-01-09 2002-07-26 Ebara Corp 研磨装置
JP2004241434A (ja) * 2003-02-03 2004-08-26 Ebara Corp 基板処理装置
JP2005186176A (ja) * 2003-12-24 2005-07-14 Shinko Electric Ind Co Ltd ウエハ端面研磨装置
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533399A (en) * 1983-04-12 1985-08-06 Minnesota Mining And Manufacturing Company Contact lens cleaning method
JP2924890B2 (ja) * 1998-04-20 1999-07-26 トヨタ自動車株式会社 研摩方法
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081494A (ja) * 1994-06-27 1996-01-09 Sanshin:Kk ウエハー材縁端部研磨装置
JP2002154041A (ja) * 2000-11-17 2002-05-28 I M T Kk 研磨装置
JP2002208572A (ja) * 2001-01-09 2002-07-26 Ebara Corp 研磨装置
JP2004241434A (ja) * 2003-02-03 2004-08-26 Ebara Corp 基板処理装置
JP2005186176A (ja) * 2003-12-24 2005-07-14 Shinko Electric Ind Co Ltd ウエハ端面研磨装置
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012231191A (ja) * 2007-12-03 2012-11-22 Ebara Corp 研磨装置および研磨方法
JP2017087305A (ja) * 2015-11-02 2017-05-25 日本電気硝子株式会社 円板状ワークの研磨加工方法及び研磨加工装置
JP6414353B1 (ja) * 2018-03-27 2018-10-31 株式会社不二越 フィルムラップ加工装置
KR20200010073A (ko) * 2018-07-20 2020-01-30 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
KR102764016B1 (ko) 2018-07-20 2025-02-07 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법

Also Published As

Publication number Publication date
TWI362697B (en) 2012-04-21
JP2012183637A (ja) 2012-09-27
KR101236855B1 (ko) 2013-02-26
WO2007070353A2 (en) 2007-06-21
TW200735200A (en) 2007-09-16
WO2007070353A3 (en) 2007-11-29
EP1976806A2 (en) 2008-10-08
KR20080075001A (ko) 2008-08-13
EP1976806A4 (en) 2011-08-10

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