JP2009515171A - ツールからの電流及び電圧に対する回路の曝露を監視するための監視装置 - Google Patents

ツールからの電流及び電圧に対する回路の曝露を監視するための監視装置 Download PDF

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Publication number
JP2009515171A
JP2009515171A JP2008539092A JP2008539092A JP2009515171A JP 2009515171 A JP2009515171 A JP 2009515171A JP 2008539092 A JP2008539092 A JP 2008539092A JP 2008539092 A JP2008539092 A JP 2008539092A JP 2009515171 A JP2009515171 A JP 2009515171A
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JP
Japan
Prior art keywords
voltage
circuit board
circuit
signal
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008539092A
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English (en)
Japanese (ja)
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JP2009515171A5 (enExample
Inventor
ブラディミル・クラッツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009515171A publication Critical patent/JP2009515171A/ja
Publication of JP2009515171A5 publication Critical patent/JP2009515171A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
    • G01R19/16566—Circuits and arrangements for comparing voltage or current with one or several thresholds and for indicating the result not covered by subgroups G01R19/16504, G01R19/16528, G01R19/16533
    • G01R19/1659—Circuits and arrangements for comparing voltage or current with one or several thresholds and for indicating the result not covered by subgroups G01R19/16504, G01R19/16528, G01R19/16533 to indicate that the value is within or outside a predetermined range of values (window)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Measurement Of Current Or Voltage (AREA)
  • Emergency Protection Circuit Devices (AREA)
JP2008539092A 2005-11-02 2006-11-02 ツールからの電流及び電圧に対する回路の曝露を監視するための監視装置 Pending JP2009515171A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/266,094 US7576304B2 (en) 2005-11-02 2005-11-02 Monitor device for monitoring the exposure of circuits to current and voltage from a tool
PCT/US2006/043097 WO2007056222A2 (en) 2005-11-02 2006-11-02 Monitor device for monitoring the exposure of circuits to current and voltage from a tool

Publications (2)

Publication Number Publication Date
JP2009515171A true JP2009515171A (ja) 2009-04-09
JP2009515171A5 JP2009515171A5 (enExample) 2009-12-17

Family

ID=37994903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008539092A Pending JP2009515171A (ja) 2005-11-02 2006-11-02 ツールからの電流及び電圧に対する回路の曝露を監視するための監視装置

Country Status (4)

Country Link
US (1) US7576304B2 (enExample)
EP (1) EP1951469A4 (enExample)
JP (1) JP2009515171A (enExample)
WO (1) WO2007056222A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013195154A (ja) * 2012-03-16 2013-09-30 Houzan Kogu Seisakusho:Kk アースラインマーカー
WO2016046917A1 (ja) * 2014-09-24 2016-03-31 東芝三菱電機産業システム株式会社 電気製品の組み立て工程の管理方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4932672B2 (ja) * 2007-10-26 2012-05-16 株式会社 シンワ 形状記憶合金部材の加熱装置
US9367166B1 (en) * 2007-12-21 2016-06-14 Cypress Semiconductor Corporation System and method of visualizing capacitance sensing system operation
US8384554B1 (en) 2009-01-09 2013-02-26 Kevin M. Curtis Audible current monitoring device
US9076806B1 (en) * 2012-05-31 2015-07-07 Vladimir Kraz Device and method for reduction of overstress in soldering process
US9149981B2 (en) * 2012-09-28 2015-10-06 Chao-Chih Liu Soldering device for plastics adhering
CN103869207B (zh) * 2014-03-06 2017-05-31 京东方科技集团股份有限公司 Dc‑dc器件焊接检测装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63235823A (ja) * 1987-03-25 1988-09-30 Toshiba Corp 記録装置
US5083117A (en) * 1988-06-07 1992-01-21 Hoigaard Jan C Apparatus for monitoring and controlling electrostatic discharge
JPH06304746A (ja) * 1993-04-22 1994-11-01 Nakajima Doukou Kk 熱加工装置
JP2005010067A (ja) * 2003-06-20 2005-01-13 Fuji Xerox Co Ltd 交流回路の異常検知機能を備えた電気機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939453A (en) 1988-02-22 1990-07-03 Pace Incorporated Probe for use with circuitry for monitoring signals emanating from heated tip of soldering iron or solder extractor or the like
EP0435047A3 (en) 1989-12-19 1992-07-15 National Semiconductor Corporation Electrostatic discharge protection for integrated circuits
US5073758A (en) * 1990-03-30 1991-12-17 Cooper Industries, Inc. Resistance measurement in an active and high temperature environment
US5359319A (en) * 1990-08-13 1994-10-25 Minnesota Mining And Manufacturing Company Electrostatic discharge detector and display
US5659245A (en) * 1996-06-03 1997-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. ESD bypass and EMI shielding trace design in burn-in board
US6310557B1 (en) 1999-03-17 2001-10-30 Novx Corporation Circuit and device to detect grounding problems in electrical soldering irons
US6605965B1 (en) * 2001-09-26 2003-08-12 Micrel, Incorporated Differential window comparator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63235823A (ja) * 1987-03-25 1988-09-30 Toshiba Corp 記録装置
US5083117A (en) * 1988-06-07 1992-01-21 Hoigaard Jan C Apparatus for monitoring and controlling electrostatic discharge
JPH06304746A (ja) * 1993-04-22 1994-11-01 Nakajima Doukou Kk 熱加工装置
JP2005010067A (ja) * 2003-06-20 2005-01-13 Fuji Xerox Co Ltd 交流回路の異常検知機能を備えた電気機器

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013195154A (ja) * 2012-03-16 2013-09-30 Houzan Kogu Seisakusho:Kk アースラインマーカー
WO2016046917A1 (ja) * 2014-09-24 2016-03-31 東芝三菱電機産業システム株式会社 電気製品の組み立て工程の管理方法
KR20170034421A (ko) 2014-09-24 2017-03-28 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 전기 제품의 조립 공정의 관리 방법
JPWO2016046917A1 (ja) * 2014-09-24 2017-06-22 東芝三菱電機産業システム株式会社 電気製品の組み立て工程の管理方法
US10234489B2 (en) 2014-09-24 2019-03-19 Toshiba Mitsubishi-Electric Industrial Systems Corporation Method for managing assembling process of electrical product

Also Published As

Publication number Publication date
US7576304B2 (en) 2009-08-18
WO2007056222A3 (en) 2007-07-05
WO2007056222A2 (en) 2007-05-18
US20070095798A1 (en) 2007-05-03
EP1951469A2 (en) 2008-08-06
EP1951469A4 (en) 2012-07-25

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