JP2009297789A5 - - Google Patents

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Publication number
JP2009297789A5
JP2009297789A5 JP2009200353A JP2009200353A JP2009297789A5 JP 2009297789 A5 JP2009297789 A5 JP 2009297789A5 JP 2009200353 A JP2009200353 A JP 2009200353A JP 2009200353 A JP2009200353 A JP 2009200353A JP 2009297789 A5 JP2009297789 A5 JP 2009297789A5
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JP
Japan
Prior art keywords
mass
solder alloy
less
solder
order
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009200353A
Other languages
English (en)
Japanese (ja)
Other versions
JP5182258B2 (ja
JP2009297789A (ja
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Publication date
Application filed filed Critical
Priority to JP2009200353A priority Critical patent/JP5182258B2/ja
Priority claimed from JP2009200353A external-priority patent/JP5182258B2/ja
Publication of JP2009297789A publication Critical patent/JP2009297789A/ja
Publication of JP2009297789A5 publication Critical patent/JP2009297789A5/ja
Application granted granted Critical
Publication of JP5182258B2 publication Critical patent/JP5182258B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2009200353A 2003-12-01 2009-08-31 はんだ合金と電子機器用モジュール部品 Expired - Lifetime JP5182258B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009200353A JP5182258B2 (ja) 2003-12-01 2009-08-31 はんだ合金と電子機器用モジュール部品

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003401925 2003-12-01
JP2003401925 2003-12-01
JP2009200353A JP5182258B2 (ja) 2003-12-01 2009-08-31 はんだ合金と電子機器用モジュール部品

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004161396A Division JP4407385B2 (ja) 2003-12-01 2004-05-31 はんだ付け部の引け巣防止方法とはんだ合金と電子機器用モジュール部品

Publications (3)

Publication Number Publication Date
JP2009297789A JP2009297789A (ja) 2009-12-24
JP2009297789A5 true JP2009297789A5 (enrdf_load_stackoverflow) 2010-07-08
JP5182258B2 JP5182258B2 (ja) 2013-04-17

Family

ID=41545225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009200353A Expired - Lifetime JP5182258B2 (ja) 2003-12-01 2009-08-31 はんだ合金と電子機器用モジュール部品

Country Status (1)

Country Link
JP (1) JP5182258B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3027441B2 (ja) * 1991-07-08 2000-04-04 千住金属工業株式会社 高温はんだ
JPH11221694A (ja) * 1998-02-06 1999-08-17 Hitachi Ltd 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
WO2000018536A1 (en) * 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
JP3544904B2 (ja) * 1999-09-29 2004-07-21 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
JP3599101B2 (ja) * 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法

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