JP2009281947A - Equipment and method for measuring position, system and method for forming pattern, system and method for exposure and method for manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide equipment for measuring a position which enables accurate measurement of positional information on a moving body. <P>SOLUTION: The position measuring equipment measures the positional information on the moving body which moves within a plane of movement. The equipment has a light source which radiates light onto a movable grating disposed on a first surface of the moving body, a fixed optical member which is fixed in the positional relation with the light source and has a second surface whereon the light diffracted by the movable grating is incident, and which diffracts or reflects the incident light and returns it to the movable grating, and a detecting device which detects the light interfered again through the intermediary of the movable grating. The first and second surfaces are almost parallel with each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a position measuring apparatus and a position measuring method for measuring position information of a moving body, a pattern forming apparatus and a pattern forming method for forming a pattern on a substrate, an exposure apparatus and an exposure method for exposing a substrate, and a device manufacturing method.

In the manufacturing process of a micro device such as a semiconductor device or an electronic device, a pattern forming apparatus that forms a device pattern on a substrate, such as an exposure apparatus or an inkjet apparatus, is used. The pattern forming apparatus includes a moving body such as a substrate stage that moves while holding the substrate, and forms a device pattern on the substrate while measuring position information of the moving body with the position measuring device. The following patent document discloses an example of a technique for measuring position information of a moving body using an encoder system.
US Patent Application Publication No. 2006/0227309

  The encoder system irradiates the scale plate with light emitted from the light source, and the light passing through the scale plate is detected by a detector. For example, if the temperature fluctuation (refractive index fluctuation) of the atmosphere on the optical path occurs due to the heat of the light source or the like, there is a possibility that the position information of the moving body cannot be accurately measured. Further, when the moving body is thermally deformed by heat, there is a possibility that the position information of the moving body cannot be accurately measured, or the moving performance of the moving body may be deteriorated. As a result, pattern formation defects such as pattern defects may occur, and defective devices may occur.

  An object of an aspect of the present invention is to provide a position measurement device and a position measurement method that can accurately measure position information of a moving object. Another object of the present invention is to provide a pattern forming apparatus and a pattern forming method capable of suppressing pattern formation defects. Another object of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, there is provided a position measuring device for measuring position information of a moving body that moves in a moving surface, and a light source that irradiates light on a moving grid disposed on the first surface of the moving body. And a fixed optical member having a second surface on which the light diffracted by the moving grating is incident, a fixed optical member that diffracts or reflects the incident light and returns the moving grating to the moving grating, and the moving grating again. There is provided a position measuring device including a detection device that detects light interfered through the first surface and the first surface and the second surface being substantially parallel.

  According to a second aspect of the present invention, there is provided a pattern forming apparatus for forming a pattern on a substrate, wherein the position information of a movable body that is movable while holding the substrate is measured. A pattern forming apparatus including a position measuring device is provided.

  According to a third aspect of the present invention, there is provided an exposure apparatus for exposing a substrate with exposure light, wherein the position information of the movable body that is movable while holding the substrate is measured. An exposure apparatus including a position measurement device is provided.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the third aspect described above and developing the exposed substrate.

  According to the fifth aspect of the present invention, there is provided a position measurement method for measuring position information of a moving body that moves in a moving plane, and irradiating light on a moving grid arranged on the first surface of the moving body. And making the light diffracted by the moving grating incident on a fixed optical member having a second surface substantially parallel to the first surface, the positional relationship with the light source being fixed and diffracting or reflecting the incident light, A position measurement method is provided that includes diffracting or reflecting light incident on the fixed optical member and returning the light to the moving grating, and detecting the light interfered again through the moving grating.

  According to a sixth aspect of the present invention, there is provided a pattern forming method for forming a pattern on a substrate, the position information of a movable body that is movable while holding the substrate, and the position measuring method according to the fifth aspect described above. There is provided a pattern forming method including measuring using and forming a pattern on a substrate held by a moving body.

  According to the seventh aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light, the position information of a movable body that is movable while holding the substrate, and the position measurement method according to the fifth aspect described above. An exposure method is provided that includes measuring using and exposing a substrate held on a moving body.

  According to an eighth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method of the seventh aspect described above and developing the exposed substrate.

  According to the present invention, it is possible to accurately measure the position information of the moving body, and to suppress the pattern formation failure and the exposure failure of the substrate held by the moving body. Therefore, generation | occurrence | production of a defective device can be suppressed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as the X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and a direction orthogonal to each of the X-axis direction and Y-axis direction (that is, the vertical direction) is defined as the Z-axis direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the present embodiment. In this embodiment, the exposure apparatus EX includes, for example, US Pat. No. 6,341,007, US Pat. No. 6,400,491, US Pat. No. 6,549,269, US Pat. No. 6,590,634, and US Pat. No. 6,208,407. , U.S. Pat.No. 6,262,796, U.S. Pat.No. 6,674,510, U.S. Pat.No. 6,208,407, U.S. Pat.No. 6,710,849, U.S. Pat. A case where the exposure apparatus is a twin stage type exposure apparatus including a plurality of (two) substrate stages 1 and 2 that can move while holding the substrate P will be described. That is, in the present embodiment, the exposure apparatus EX includes a first substrate stage 1 that can move while holding the substrate P, and a second substrate that can move while holding the substrate P independently of the first substrate stage 1. And a substrate stage 2.

  In FIG. 1, an exposure apparatus EX includes a mask stage 3 that can move while holding a mask M, a first substrate stage 1 that can move while holding a substrate P, and a substrate that is independent of the first substrate stage 1. A second substrate stage 2 movable while holding P, a mask stage drive system 4 for moving the mask stage 3, a substrate stage drive system 5 for moving the first substrate stage 1 and the second substrate stage 2, An interferometer system 6 including a plate member 12 having a guide surface 11 that movably supports the first substrate stage 1 and the second substrate stage 2, a laser interferometer that measures position information of the mask stage 3, and a first substrate stage An encoder system 50 for measuring positional information of the first and second substrate stages 2, an illumination system IL for illuminating the mask M with the exposure light EL, and an exposure light E. In comprises a projection optical system PL which projects an image of a pattern of the mask M illuminated is projected onto the substrate P, and a control device 7 for controlling the operation of the entire exposure apparatus EX.

  Further, the exposure apparatus EX includes an exposure station ST1 having a first area SP1 including a first position irradiated with the exposure light EL, and a second position for measuring position information of the substrate P, and includes the first area SP1. And a measurement station ST2 having a second area SP2 different from the first area SP2. The exposure station ST1 exposes the substrate P. The measurement station ST2 performs predetermined measurement related to exposure and replacement of the substrate P.

  In the exposure station ST1, an illumination system IL, a mask stage 3, a projection optical system PL, and the like are arranged. Of the plurality of optical elements of the projection optical system PL, the first optical element 8 closest to the image plane of the projection optical system PL has an emission surface (lower surface) for emitting the exposure light EL. The first position where the exposure light EL is irradiated includes a position facing the first optical element 8.

  Various measurement systems capable of performing measurement related to exposure of the substrate P, such as an alignment system 9 for acquiring position information of the substrate P and a focus / leveling detection system 10, are arranged in the measurement station ST2. The alignment system 9 has a plurality of optical elements including the second optical element 15, and acquires position information of the substrate P using these optical elements. The focus / leveling detection system 10 also includes a plurality of optical elements, and acquires position information of the substrate P using these optical elements. The second position for measuring the position information of the substrate P includes a position facing the second optical element 15.

  Each of the first and second substrate stages 1 and 2 is movable while holding the substrate P within a predetermined region of the guide surface 11 including the first region SP1 and the second region SP2. In the present embodiment, the guide surface 11 is substantially parallel to the XY plane. Each of the first and second substrate stages 1 and 2 is movable in the guide surface 11 between the exposure station ST1 and the measurement station ST2.

  Further, the exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes the substrate P with the exposure light EL through the liquid LQ. The exposure apparatus EX includes a nozzle member (seal member) 14 that can form an immersion space LS with the liquid LQ so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space LS is a space filled with the liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ. In this embodiment, the nozzle member 14 includes a sealing member as disclosed in, for example, US Patent Publication No. 2004/136494. The nozzle member 14 is disposed in the vicinity of the first optical element 8 and is immersed so that the optical path of the exposure light EL between the first optical element 8 and the object disposed at the first position is filled with the liquid LQ. A space LS is formed. The object disposed at the first position includes the first and second substrate stages 1 and 2 and the substrate P held by the first and second substrate stages 1 and 2. At least during exposure of the substrate P, the nozzle member 14 forms an immersion space LS so that a partial region (local region) on the surface of the substrate P including the projection region of the projection optical system PL is covered with the liquid LQ. To do. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. The exposure apparatus EX moves the substrate P in a predetermined scanning direction with respect to the projection area of the projection optical system PL, and sets a mask M on the illumination area of the illumination system IL in synchronization with the movement of the substrate P. The substrate P is exposed with the exposure light EL through the projection optical system PL and the liquid LQ while moving in the scanning direction. As a result, an image of the pattern of the mask M is projected onto the substrate P.

  The exposure apparatus EX includes, for example, a body 19 including a column 16 disposed on a floor surface in a clean room and a support frame 18 disposed on the column 16 via a vibration isolator 17. The column 16 has a support surface 20 that supports the plate member 12 via the vibration isolator 21. The support frame 18 supports the projection optical system PL, the alignment system 9, the focus / leveling detection system 10, and the like.

The illumination system IL illuminates a predetermined illumination area on the mask M with exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as a bright line (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, Vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In the present embodiment, ArF excimer laser light is used as the exposure light EL.

  The mask stage 3 is movable in three directions of the X axis, the Y axis, and the θZ direction while holding the mask M by a mask stage driving system 4 including an actuator such as a linear motor. Position information of the mask stage 3 (mask M) is measured by a laser interferometer of the interferometer system 6. The laser interferometer uses the measurement mirror 3 </ b> R provided on the mask stage 3 to measure position information regarding the three directions of the mask stage 3 including the X axis, the Y axis, and the θZ direction. The control device 7 operates the mask stage drive system 4 based on the measurement result of the interferometer system 6 to control the position of the mask stage 3 (mask M).

  The projection optical system PL projects an image of the pattern of the mask M onto the substrate P at a predetermined projection magnification. A plurality of optical elements of the projection optical system PL are held by a lens barrel. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, 1/8 or the like. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z-axis direction. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  Next, the first and second substrate stages 1 and 2 and the substrate stage drive system 5 will be described with reference to FIGS. FIG. 2 is a plan view of the first and second substrate stages 1 and 2 and the substrate stage driving system 5 as viewed from above. FIG. 3 is a side view showing the vicinity of the first substrate stage 1 disposed in the exposure station ST1. FIG.

  The first substrate stage 1 includes a stage main body 22 and a first substrate table 23 supported by the stage main body 22 and having a substrate holder 23H to which the substrate P can be attached and detached. A support device 25 capable of forming a gas bearing is provided on the lower surface of the stage main body 22 as disclosed in, for example, WO 2006/009254. The first substrate stage 1 is supported on the guide surface 11 in a non-contact manner by a gas bearing formed by the support device 25. The first substrate table 23 has a recess 23C. The substrate holder 23H is disposed in the recess 23C. The substrate holder 23H holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The first substrate table 23 has an upper surface 27A disposed around the recess 23C. The upper surface 27A is substantially flat. The surface of the substrate P held by the substrate holder 23H and the upper surface 27A are disposed in substantially the same plane (they are flush). The first substrate stage 1 can be moved in six directions of the X axis, Y axis, Z axis, θX, θY, and θZ directions while holding the substrate P by the substrate stage drive system 5.

  The second substrate stage 2 includes a stage main body 28 and a second substrate table 29 supported by the stage main body 28 and having a substrate holder 29H to which the substrate P can be attached and detached. A support device 31 capable of forming a gas bearing is provided on the lower surface of the stage body 28 as disclosed in, for example, WO 2006/009254. The second substrate stage 2 is supported on the guide surface 11 in a non-contact manner by a gas bearing formed by the support device 31. The second substrate table 29 has a recess 29C. The substrate holder 29H is disposed in the recess 29C. The substrate holder 29H holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The second substrate table 29 has an upper surface 33A disposed around the recess 29C. The upper surface 33A is substantially flat. The surface of the substrate P held by the substrate holder 29H and the upper surface 33A are disposed in substantially the same plane (they are flush with each other). The second substrate stage 2 can be moved in six directions of the X axis, Y axis, Z axis, θX, θY, and θZ directions while holding the substrate P by the substrate stage drive system 5.

  The substrate stage drive system 5 includes an actuator such as a linear motor, and can move each of the first substrate stage 1 and the second substrate stage 2. The substrate stage drive system 5 includes a coarse motion system that moves the stage body 22 and the stage body 28 in the X-axis, Y-axis, and θZ directions, and the first substrate table 23 with respect to the stage body 22 in the Z-axis, θX, and A fine movement system that moves in the θY direction and a fine movement system that moves the second substrate table 29 in the Z-axis, θX, and θY directions with respect to the stage main body 28 are included. The first and second substrate stages 1 and 2 can be moved between the exposure station ST1 and the measurement station ST2 by a coarse motion system. Each of the first and second substrate tables 23 and 29 can be moved in six directions of the X axis, Y axis, Z axis, θX, θY, and θZ directions by the coarse movement system and the fine movement system.

  Next, an example of the encoder system 50 that measures the position information of the first and second substrate stages 1 and 2 will be described. The encoder system 50 includes a first encoder unit 50A that measures position information of the first and second substrate stages 1 and 2 disposed in the exposure station ST1, and a first and second substrate disposed in the measurement station ST2. A second encoder unit 50B that measures position information of the stages 1 and 2; The first encoder unit 50A includes an X encoder body 51 that measures position information about the X axis direction of the first and second substrate stages 1 and 2, and a Y encoder body 52 that measures position information about the Y axis direction. The second encoder unit 50B includes an X encoder body 53 that measures position information about the X axis direction of the first and second substrate stages 1 and 2, and a Y encoder body 54 that measures position information about the Y axis direction.

  The encoder system 50 includes fixed scales 61, 62, 63, 64 arranged at predetermined positions so as to correspond to the encoder bodies 51, 52, 53, 54. The fixed scales 61 and 62 are arranged in the exposure station ST1. The fixed scales 63 and 64 are arranged in the measurement station ST2. In the present embodiment, each of the fixed scales 61, 62, 63, 64 is supported by the support frame 18. The fixed scales 61, 62, 63, and 64 are made of the same material such as ceramics or low expansion glass.

  Each encoder main body 51-54 has a substantially equivalent structure. Moreover, each fixed scale 61-64 also has a substantially equivalent structure. Hereinafter, the Y encoder main body 52 and the fixed scale 62 corresponding to the Y encoder main body 52 will be described with reference to FIGS. 4 is a plan view schematically showing a part of the fixed scale 62 and the first substrate stage 1, FIG. 5 is a perspective view showing the Y encoder main body 52 and the fixed scale 62, and FIG. 6 is a principle of the encoder system 50. It is a schematic diagram for demonstrating.

  In the present embodiment, the first substrate table 23 is mounted on the stage body 22 via an actuator such as a voice coil motor, mounted on the reflecting member 23A having the reflecting surface 76, the reflecting member 23A, and the substrate holder 23H. And a holding member 23B having an upper surface 27A. The holding member 23B is fixed to the reflecting member 23A. That is, the positional relationship between the reflecting member 23A and the holding member 23B is fixed. The reflective surface 76 is disposed at the −Y side end of the first substrate table 23. The reflective surface 76 can face the encoder body 52. The reflection surface 76 is formed of, for example, an aluminum film. The reflecting surface 76 intersects the XY plane at an acute angle in the YZ plane. In the present embodiment, the reflecting surface 76 is inclined 45 degrees with respect to the XY plane.

  The holding member 23B includes a substrate holder 23H that holds the substrate P, an upper surface 27A that is disposed around the substrate holder 23H, and a moving scale 71 that includes a diffraction grating 72 formed on the upper surface 27A. In the present embodiment, the diffraction grating 72 is a one-dimensional grating whose periodic direction is the Y-axis direction. In the present embodiment, the moving scale 71 forms a part of the holding member 23B. The moving scale 71 is transparent. In other words, the moving scale 71 is a transmissive phase grating on which a diffraction grating 72 having a periodic direction in the Y-axis direction and disposed in a part of the holding member 23B is formed. Of the holding member 23B, at least the moving scale 71 is a parallel plate. In other words, the upper surface 27A of the moving scale 71 on which the diffraction grating 72 is formed and the lower surface 27B opposite to the upper surface 27A are substantially parallel. As described above, the upper surface 27A is substantially parallel to the XY plane. Therefore, the upper surface 27A and the lower surface 27B are substantially parallel to the XY plane.

  The moving scale 71 is disposed above the reflection surface 76 (+ Z side). The lower surface 27B of the moving scale 71 and the reflecting surface 76 face each other. The reflective surface 76 is inclined with respect to the upper surface 27A and the lower surface 27B.

  The fixed scale 62 is disposed above the first substrate stage 1 (+ Z side). As described above, the fixed scale 62 is fixed to the support frame 18. The fixed scale 62 is a plate-like member that is long in the Y-axis direction. The fixed scale 62 has a lower surface 74 that can face the upper surface 27A of the moving scale 71. The lower surface 74 is long in the Y-axis direction and is substantially parallel to the XY plane. The size (length) of the lower surface 74 of the fixed scale 62 in the Y-axis direction is larger (longer) than the size (length) of the upper surface 27A of the moving scale 71.

  The fixed scale 62 has a diffraction grating 77 having a periodic direction in the Y-axis direction on the lower surface 74. That is, the fixed scale 62 includes a one-dimensional lattice having the Y-axis direction as a periodic direction. The fixed scale 62 is a reflective scale on which a diffraction grating 77 having a periodic direction in the Y-axis direction is formed.

  As described above, the upper surface 27A of the moving scale 71, the lower surface 74 of the fixed scale 62, and the guide surface 11 are substantially parallel to the XY plane, and the upper surface 27A of the moving scale 71, the lower surface 74 of the fixed scale 62, and the guide surface. 11 is substantially parallel.

  The encoder body 52 includes a light source 73 that emits light for irradiating the diffraction grating 72 disposed on the upper surface 27 </ b> A of the moving scale 71, a beam splitter 78 that receives light from the light source 73, and light from the beam splitter 78. And a detector 75 for detecting. In the present embodiment, the encoder body 52 including the light source 73 is supported by a predetermined support mechanism and fixed at a predetermined position. Therefore, in this embodiment, the positional relationship between the light source 73 and the fixed scale 62 is fixed.

  The light source 73 emits, for example, coherent light, for example, laser light having a wavelength λ (= 850 nm) substantially parallel to the Y-axis direction. The beam splitter 78 is disposed between the light source 73 and the reflecting surface 76, and the light emitted from the light source 73 passes through the beam splitter 78 and enters the reflecting surface 76. The reflecting surface 76 reflects light from the light source 73 and guides it to the lower surface 27 </ b> B of the moving scale 71. The light incident on the lower surface 27B passes through the moving scale 71 and is irradiated on the diffraction grating 72 on the upper surface 27A. As described above, in the present embodiment, the light source 73 irradiates the diffraction grating 72 disposed on the upper surface 27 </ b> A of the moving scale 71 with light via the reflecting surface 76.

  At least a part of the light diffracted by the diffraction grating 72 is incident on the lower surface 74 of the fixed scale 62 disposed above the diffraction grating 72. The diffraction grating 77 of the fixed scale 62 diffracts (reflects) the incident light and returns it to the diffraction grating 72 of the moving scale 71. The light that is returned from the diffraction grating 72 and irradiated again to the diffraction grating 72 is incident on the reflection surface 76 via the moving scale 71, reflected by the reflection surface 76, and then incident on the beam splitter 78. The light incident on the beam splitter 78 is reflected by the beam splitter 78 and enters the detector 75. The detector 75 receives light from the beam splitter 78.

  Next, the principle of the encoder system 50 will be described with reference to FIG. As shown in FIG. 6, in the encoder main body 52, the light emitted from the light source 73 passes through the beam splitter 78 and enters the transmission type moving scale 71. Then, a plurality of diffracted lights having different orders are generated by the diffraction grating 72 formed on the moving scale 71. Here, in order to simplify the explanation, it is assumed that the diffraction grating 72 generates + 1st order diffracted light and −1st order diffracted light.

  The + 1st order diffracted light and the −1st order diffracted light generated by the diffraction grating 72 are incident on the lower surface 74 of the fixed scale 62 including the diffraction grating 77. The fixed scale 62 further diffracts the diffracted light incident on the lower surface 74. That is, the fixed scale 62 further diffracts the −1st order diffracted light generated by the moving scale 71 to generate + 1st order diffracted light, and further diffracts the + 1st order diffracted light generated by the moving scale 71 to generate the −1st order diffracted light. Generate.

  Instead of the fixed scale 62 having the diffraction grating 77, a fixed optical element such as a prism 134 as shown in FIG. 7 or reflecting mirrors 135A and 135B as shown in FIG. 8 may be used.

  The + 1st order diffracted light and the −1st order diffracted light generated by the fixed scale 62 travel toward the moving scale 71 and overlap each other at the same position on the upper surface 27A of the moving scale 71 where the diffraction grating 72 is formed. That is, the + 1st order diffracted light and the −1st order diffracted light from the fixed scale 62 interfere on the moving scale 71.

  The interference light that has interfered on the moving scale 71 enters the beam splitter 78 via the reflecting surface 76, and then enters the detector 75 via the beam splitter 78. The detector 75 receives the interference light.

  In the encoder system 50 having the above-described configuration, the incident position of the light from the light source 73 with respect to the fixed scale 62 changes as the first substrate stage 1 moves in the Y-axis direction. The light intensity distribution changes. Depending on the wavelength of light emitted from the light source 73 and the pitch of the diffraction grating 72 of the moving scale 71, the diffraction angle of each diffracted light generated by the diffraction grating 72 is determined. Further, the diffraction angle of ± first-order diffracted light generated on the fixed scale 62 (that is, ± 1 generated on the moving scale 71) in accordance with the wavelength of the light emitted from the light source 73 and the pitch of the diffraction grating 77 of the fixed scale 62. The apparent bending angle of the next diffracted light is determined. By adjusting the wavelength of the light emitted from the light source 73, the pitch of the diffraction grating 72 of the moving scale 71, and the pitch of the diffraction grating 77 of the fixed scale 62, a light quantity distribution of the sinusoidal interference light is generated in the detector 75. be able to. Therefore, the detector 75 can measure position information regarding the Y-axis direction of the first substrate stage 1 by detecting the light quantity distribution of the interference light.

  As described above, the encoder system 50 according to the present embodiment forms the reflecting surface 76 on the diffraction grating 72 disposed on the upper surface 27A of the first substrate stage 1 in order to form position information regarding the Y-axis direction of the first substrate stage 1. The positional relationship between the light source 73 that irradiates light via the light source 73 and the light source 73 is fixed, and has a lower surface 74 on which the light diffracted by the diffraction grating 72 is incident. And a detector 75 that detects the interference light that has interfered again through the diffraction grating 72 through the reflection surface 76. Further, in the encoder system 50 of the present embodiment, the upper surface 27A of the moving scale 71 on which the diffraction grating 72 is disposed and the lower surface 74 of the fixed scale 62 on which the diffraction grating 77 is disposed are substantially parallel and move. The scale 71 is a transmissive phase grating.

  In the foregoing, the Y encoder main body 52 and the fixed scale 62 for measuring the position information of the first substrate stage 1 in the Y axis direction have been mainly described. In the present embodiment, for example, as shown in FIG. 2, an X encoder main body 51 and a fixed scale 61 for measuring position information of the first substrate stage 1 in the X-axis direction are provided in the exposure station ST1. The X encoder body 51 and the fixed scale 61 have substantially the same configuration as the Y encoder body 52 and the fixed scale 62. A reflection surface 76 that can face the X encoder main body 51 and intersects the XY plane at an acute angle (at 45 degrees) in the XZ plane is disposed at the end of the reflection member 23A of the first substrate table 23 on the −X side. Yes. In addition, a moving scale 71 including a diffraction grating 72 whose periodic direction is the X-axis direction is disposed above the reflecting surface 76. In addition, a fixed scale 61 including a diffraction grating 77 having a periodic direction in the X-axis direction is disposed above the moving scale 71. Thereby, the encoder system 50 can measure the position information regarding the X-axis direction of the first substrate stage 1.

  The X and Y encoder bodies 53 and 54 and the fixed scales 63 and 64 of the measurement station ST2 have the same configuration as the X and Y encoder bodies 51 and 52 and the fixed scales 61 and 62 of the exposure station ST1, and are reflective members. Reflective surfaces 76 corresponding to the X and Y encoder bodies 53 and 54 and the fixed scales 63 and 64 are disposed at the + X side end and the + Y side end of 23A. Further, a moving scale 71 corresponding to the X and Y encoder bodies 53 and 54 and the fixed scales 63 and 64 is disposed on the holding member 23B. Therefore, the encoder system 50 can measure the position information of the first substrate stage 1 also in the measurement station ST2.

  Since the second substrate stage 2 has the same configuration as that of the first substrate stage 1, the encoder system 50 can measure the position information of the second substrate stage 2 at each of the exposure station ST1 and the measurement station ST2. .

  As shown in FIG. 2, in this embodiment, the X and Y encoder bodies 51 and 52 emit light from the light source 73 so as to intersect the optical axis of the first optical element 8 in the XY plane. The X and Y encoder bodies 53 and 54 emit light from the light source 73 so as to intersect the optical axis of the second optical element 15 in the XY plane.

  Further, for example, an encoder main body and a fixed scale that measure position information regarding the Y-axis direction (or X-axis direction) of the first and second substrate stages 1 and 2 are separated by a predetermined distance in the X-axis direction (or Y-axis direction). By arranging a plurality of (two), it is possible to measure position information regarding the θZ direction of the first and second substrate stages 1 and 2 based on the measurement results of the plurality of encoder bodies. In addition, the measurement results of a plurality of encoder bodies can be averaged.

  As described above, the first encoder unit 50A can measure the positional information regarding the three directions of the first and second substrate stages 1 and 2 arranged in the exposure station ST1 including the X axis, the Y axis, and the θZ direction. In addition, the second encoder unit 50B can measure position information regarding the three directions of the first and second substrate stages 1 and 2 arranged in the measurement station ST2 including the X axis, the Y axis, and the θZ direction.

  The control device 7 operates the substrate stage driving system 5 based on the measurement result of the first encoder unit 50A, and controls the position of the first and second substrate stages 1 and 2 (substrate P) existing in the exposure station ST1. It can be performed. Further, the control device 7 operates the substrate stage driving system 5 based on the measurement result of the second encoder unit 50B, and the first and second substrate stages 1 and 2 (substrate P) existing in the measurement station ST2. Position control can be performed.

  The alignment system 9 measures the position information of the substrate P. The first and second substrate stages 1 and 2 can move to a second position that holds the substrate P and faces the second optical element 15. The alignment system 9 is arranged on the alignment mark of the substrate P or the upper surfaces 27A and 33A of the first and second substrate tables 23 and 29 via the second optical element 15 in order to acquire the position information of the substrate P. Detect the fiducial mark.

  The focus / leveling detection system 10 is arranged at the measurement station ST2, and the surface position information (surface position information regarding the Z-axis, θX, and θY directions) of the surface of the substrate P held by the first and second substrate tables 23 and 29 is provided. ) Is detected. As shown in FIG. 1, the focus / leveling detection system 10 irradiates the surface of the substrate P held by the first and second substrate tables 23 and 29 disposed in the measurement station ST2 with detection light from an oblique direction. 10 A of projection apparatuses and the light-receiving device 10B which can receive the detection light irradiated on the surface of the board | substrate P and reflected on the surface of the board | substrate P are included.

  The control device 7 operates the substrate stage drive system 5 based on the measurement result of the alignment system 9 and the detection result of the focus / leveling detection system 10, and the substrates held on the first and second substrate tables 23 and 29. P position control is performed.

  Next, an example of the operation of the exposure apparatus having the above configuration will be described.

  For example, the substrate P before exposure is loaded onto the second substrate stage 2 present in the measurement station ST2. The control device 7 starts measurement processing of the substrate P held on the second substrate stage 2 at the measurement station ST2.

  On the other hand, in the exposure station ST1, the first substrate stage 1 holding the substrate P that has already been subjected to the measurement process in the measurement station ST2 is disposed. The control device 7 starts exposure of the substrate P held on the first substrate stage 1 at the exposure station ST1. In the present embodiment, the operation of exposing the substrate P held on the first substrate stage 1 and at least a part of the operation of measuring the substrate P held on the second substrate stage 2 are performed in parallel.

  The control device 7 performs immersion exposure of the substrate P held on the first substrate stage 1 at the exposure station ST1. The control device 7 uses the substrate stage driving system 5 to move the first substrate stage 1 in the first region SP1 and to move the substrate P held on the first substrate stage 1 to the projection optical system PL and the liquid. Exposure through LQ.

  While the exposure process of the substrate P held on the first substrate stage 1 is being executed at the exposure station ST1, the measurement process of the substrate P held on the second substrate stage 2 is executed at the measurement station ST2. The control device 7 measures the position information of the substrate P held on the second substrate stage 2 arranged in the measurement station ST2.

  A plurality of shot areas are arranged on the substrate P. The position information of the substrate P includes position information of the plurality of shot areas in the X axis, Y axis, and θZ directions. The control device 7 starts measurement processing of position information in the X axis, Y axis, and θZ directions of a plurality of shot areas on the substrate P held on the second substrate stage 2.

  For example, as shown in FIG. 2, the control device 7 measures the positional information in the XY plane of the second substrate stage 2 holding the substrate P by the second encoder unit 50B at the measurement station ST2, while aligning the alignment system 9 with the second encoder unit 50B. Are used to detect a reference mark arranged on a part of the second substrate stage 2 and an alignment mark provided on the substrate P so as to correspond to each shot region of the substrate P. And the control apparatus 7 calculates | requires each positional information on the some shot area on the board | substrate P with respect to a predetermined | prescribed reference position by arithmetic processing. The control device 7 obtains position information of each shot area with respect to a reference position of the alignment system 9 in a coordinate system defined by the encoder system 50 (second encoder unit 50B).

  Further, the control device 7 uses the focus / leveling detection system 10 to obtain surface position information (position information in the Z-axis, θX, and θY directions) of the substrate P with respect to a predetermined reference surface.

  After the exposure process of the substrate P held on the first substrate stage 1 is completed at the exposure station ST1, and the measurement process of the substrate P held on the second substrate stage 2 is completed at the measurement station ST2, the control is performed. The apparatus 7 starts moving the second substrate stage 2 from the second area SP2 of the measurement station ST2 to the first area SP1 of the exposure station ST1.

  The control device 7 arranges the first substrate stage 1 at the first position facing the first optical element 8 even when the second substrate stage 2 is moved from the second region SP2 to the first region SP1. As a result, even when the second substrate stage 2 is performing the operation of moving from the second region SP2 to the first region SP1, the liquid LQ in the immersion space LS flows between the first optical element 8 and the first substrate stage 1 (substrate P). With the above operation, as shown in FIG. 9, both the first substrate stage 1 and the second substrate stage 2 are arranged in the first region SP1 of the exposure station ST1.

  Next, the control device 7 uses the substrate stage drive system 5 to expose the substrate P of the second substrate stage 2 in a state where the first substrate stage 1 and the first optical element 8 face each other ( From the state in which the liquid LQ is held between the first substrate stage 1 and the first optical element 8, the second substrate stage 2 and the first optical element 8 face each other (the second substrate stage 2 and the first optical element 8). In a state where the liquid LQ is held between the optical element 8 and the optical element 8. In the present embodiment, as disclosed in, for example, International Publication No. 2005/0774014, the substrate stage driving system 5 includes at least one of the first substrate stage 1 and the second substrate stage 2 in which the first optical element is the first optical element. The first substrate stage 1 and the second substrate stage 2 are moved close to or in contact with each other so that a space capable of holding the liquid LQ is formed between the first substrate stage 1 and the second substrate stage 2. As a result, the control device 7 causes the first substrate stage 1 and the first optical element 8 to face each other as shown in FIG. 9, and the liquid LQ is held between the first substrate stage 1 and the first optical element 8. As shown in FIG. 10, the second substrate stage 2 and the first optical element 8 face each other and the liquid LQ is held between the second substrate stage 2 and the first optical element 8. It can be changed to a state.

  Thereafter, the control device 7 controls the substrate stage drive system 5 while keeping the second substrate stage 2 and the first optical element 8 facing each other, and moves the first substrate stage 1 to the measurement station ST2. To do.

  The control device 7 performs immersion exposure of the substrate P held on the second substrate stage 2 at the exposure station ST1. The control device 7 measures the position information of the second substrate stage 2 using the first encoder unit 50A, and controls the position of the second substrate stage 2 using the substrate stage drive system 5 based on the measurement result. Then, each of the plurality of shot regions of the substrate P held on the second substrate stage 2 is sequentially exposed via the projection optical system PL and the liquid LQ. Further, the control device 7 uses the measurement results of the measurement station ST2 including the detection results of the alignment system 9 and the focus / leveling detection system 10 to adjust the position of the second substrate stage 2 in the exposure station ST1, while the substrate P To expose.

  On the other hand, the substrate P held on the first substrate stage 1 moved to the measurement station ST2 is unloaded at the substrate exchange position, and a new substrate P before exposure is loaded onto the first substrate stage 1. The control device 7 starts measurement processing and the like of the substrate P loaded on the first substrate stage 1 at the measurement station ST2. Thereafter, processing similar to the processing described above is repeated.

  As described above, according to the present embodiment, the position information of the first and second substrate stages 1 and 2 can be measured using the encoder system 50. According to the present embodiment, since the light source 73 and the first and second substrate stages 1 and 2 are separated from each other, the temperature fluctuation (refractive index fluctuation) of the atmosphere on the optical path of the interference light is caused by, for example, the heat of the light source 73. Generation | occurrence | production can be suppressed and the positional information on the 1st, 2nd board | substrate stage 1 and 2 can be measured accurately. Further, the occurrence of thermal deformation of the first and second substrate stages 1 and 2 due to the heat of the light source 73 can be suppressed. Therefore, the substrate P can be exposed satisfactorily.

  In the present embodiment, since the upper surfaces 27A and 33A and the lower surface 74 are substantially parallel, the encoder system 50 can be used even if the postures (positions in the θX and θY directions) of the first and second substrate stages 1 and 2 change. Can accurately measure the positional information of the first and second substrate stages 1 and 2.

  Moreover, in this embodiment, since the fixed scales 61, 62, 63, 64 can be reduced in size, creation, installation, etc. of the fixed scales 61-64 can be performed smoothly. Moreover, deformation of the fixed scales 61 to 64 can be suppressed by downsizing the fixed scales 61 to 64. Therefore, a decrease in measurement accuracy of the encoder system 50 can be suppressed.

  Further, in the present embodiment, interference occurs between light passing through very close optical paths such as ± first-order diffracted light, so that the influence due to temperature fluctuation (refractive index fluctuation) of the surrounding atmosphere can be reduced.

  In the present embodiment, the case where the reflecting surface 76 inclined with respect to the XY plane is arranged at the ends of the first and second substrate stages 1 and 2 is described. However, the present invention is not limited to this, and as shown in FIG. It is also possible to adopt a simple configuration. That is, as shown in FIG. 11, by providing two sets of reflecting surfaces 125A and 125B on the first and second substrate stages 1 and 2, the same function as the reflecting surface 76 inclined by 45 degrees can be provided. it can. As shown in FIG. 12, the first and second substrate stages 1 and 2 may be provided with a prism 126 having transmission surfaces 126A and 126B.

  In the above-described embodiment, a part of the encoder system 50 may be arranged in the first and second substrate stages 1 and 2 or in the vicinity thereof. For example, as shown in FIG. 13, the detector 75 </ b> B can be arranged in the vicinity of the first and second substrate stages 1 and 2. In that case, the detector 75 </ b> B can detect the interference light interfered again through the diffraction grating 72 of the moving scale 71 without passing through the reflecting surface of the reflecting member. In the example shown in FIG. 13, a beam splitter 78B is disposed between the prism 126 having a reflecting surface and the upper surface 27A, and the detector 75B interferes with the interference light again through the diffraction grating 72 of the moving scale 71. Is detected via the beam splitter 78B. By doing so, the distance between the position where the interference light is generated and the detector 75B can be made closer, and the influence of temperature fluctuation (refractive index fluctuation) and the like can be reduced.

  In the above-described embodiment, measurement is performed using ± first-order diffracted light. However, the measurement is not limited to this, and measurement may be performed using ± second-order, third-order, n-th order diffracted light.

  In the above-described embodiment, the light source 73 (encoder main body) is disposed to face the side surfaces of the first and second substrate stages 1 and 2. For example, the light source is the first and second substrate stages 1 and 2. The light emitted from the light source may be transmitted using an optical member (for example, an optical fiber and / or a mirror). Further, when a plurality of encoder bodies are provided, the laser light from one light source may be branched into a plurality of parts and guided to each encoder body.

  In the above-described embodiment, the case where the encoder system 50 is used to measure the position information of the first and second substrate stages 1 and 2 has been described. However, the present invention is not limited to this, and the position information of the mask stage 3 is measured. It can also be used.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system in a state where the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like. The present invention can also be applied to an EUV light source exposure apparatus that exposes the substrate P with extreme ultraviolet light.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as the exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). The variable shaping mask is not limited to DMD, and a non-light emitting image display element described below may be used instead of DMD. Here, the non-light-emitting image display element is an element that spatially modulates the amplitude (intensity), phase, or polarization state of light traveling in a predetermined direction, and a transmissive liquid crystal modulator is a transmissive liquid crystal modulator. An electrochromic display (ECD) etc. are mentioned as an example other than a display element (LCD: Liquid Crystal Display). In addition to the DMD described above, the reflective spatial light modulator includes a reflective mirror array, a reflective liquid crystal display element, an electrophoretic display (EPD), electronic paper (or electronic ink), and a light diffraction type. An example is a light valve (Grating Light Valve).

  Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. In this case, an illumination system is unnecessary. Here, as a self-luminous image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission) Display), plasma display (PDP: Plasma Display Panel), and the like. Further, as a self-luminous image display element provided in the pattern forming apparatus, a solid light source chip having a plurality of light emitting points, a solid light source chip array in which a plurality of chips are arranged in an array, or a plurality of light emitting points on a single substrate A built-in type or the like may be used to form a pattern by electrically controlling the solid-state light source chip. The solid light source element may be inorganic or organic.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example, but the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens.

  As described above, the exposure apparatus according to the present embodiment assembles various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 14, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  In the above-described embodiment, the case where the substrate stage is applied to an exposure apparatus that generates a pattern by irradiating the substrate P with the exposure light EL has been described as an example. The encoder system that measures the position information of the stage can be applied to various pattern forming apparatuses that form a pattern on a substrate. As such a pattern forming apparatus, for example, an ink jet apparatus that forms a pattern on a substrate by ejecting ink droplets onto the substrate, an original plate on which a concavo-convex pattern is formed, and a substrate on which an organic material is applied are formed on the substrate glass. Examples include a nanoimprint apparatus that presses while heating to a temperature higher than the transition temperature, and then separates the original from the substrate and cools the substrate to transfer the pattern of the original to the substrate. When these apparatuses are provided with a substrate stage for holding a substrate, the pattern can be formed satisfactorily by applying the encoder system of the present invention.

  Note that the requirements of the above-described embodiments can be combined as appropriate. In addition, the disclosures of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on this embodiment. It is a top view which shows the 1st, 2nd substrate stage and substrate stage drive system which concern on this embodiment. It is a side view for demonstrating an example of the encoder system which concerns on this embodiment. It is a top view for demonstrating an example of the encoder system which concerns on this embodiment. It is a perspective view for demonstrating an example of the encoder system concerning this embodiment. It is a mimetic diagram for explaining an example of an encoder system concerning this embodiment. It is a mimetic diagram for explaining an example of an encoder system concerning this embodiment. It is a mimetic diagram for explaining an example of an encoder system concerning this embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on this embodiment. It is a mimetic diagram for explaining an example of an encoder system concerning this embodiment. It is a mimetic diagram for explaining an example of an encoder system concerning this embodiment. It is a mimetic diagram for explaining an example of an encoder system concerning this embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... 1st substrate stage, 2 ... 2nd substrate stage, 5 ... Substrate stage drive system, 8 ... 1st optical element, 11 ... Guide surface, 15 ... 2nd optical element, 23 ... 1st substrate table, 23A ... Reflection Member, 23B ... Holding member, 23H ... Substrate holder, 27A ... Upper surface, 50 ... Encoder system, 50A ... First encoder unit, 50B ... Second encoder unit, 51-54 ... Encoder body, 61-64 ... Fixed scale, 71 ... Moving scale, 72 ... Diffraction grating, 73 ... Light source, 74 ... Lower surface, 75, 75B ... Detector, 76 ... Reflection surface, 77 ... Diffraction grating, 78, 78B ... Beam splitter, EL ... Exposure light, EX ... Exposure device , P ... substrate, SP1 ... first area, SP2 ... second area, ST1 ... exposure station, ST2 ... measurement station

Claims (23)

A position measuring device that measures position information of a moving body that moves in a moving plane,
A light source for irradiating light to a moving grid disposed on the first surface of the moving body;
A fixed optical member that has a fixed positional relationship with the light source, has a second surface on which light diffracted by the moving grating is incident, and diffracts or reflects the incident light to return to the moving grating;
A detection device for detecting the light interfered through the moving grating again,
The position measuring device in which the first surface and the second surface are substantially parallel.   The position measuring device according to claim 1, wherein the first surface and the second surface are substantially parallel to the moving surface.   The position measuring device according to claim 1, wherein the moving grating is a one-dimensional grating having a predetermined direction in the moving plane as a periodic direction.   The position measurement apparatus according to claim 3, wherein position information regarding the predetermined direction of the moving body is measured.   The position measuring device according to claim 3, wherein the fixed optical member includes a one-dimensional grating having the predetermined direction as a periodic direction.   The position measuring apparatus according to claim 1, wherein the moving grating is a transmissive phase grating arranged on a scale member of the moving body.   The position measuring device according to claim 6, wherein the scale member is a parallel plate. The moving body has a reflecting surface inclined with respect to the first surface,
The position measurement device according to claim 1, wherein the light source irradiates light to the first surface through the reflection surface.   The position measurement device according to claim 8, wherein the detection device detects light interfered through the moving grating again through the reflection surface. At least a part of the detection device is disposed on the moving body,
The position measuring device according to any one of claims 1 to 9, wherein the detecting device detects light that has interfered with the moving grating again without passing through the reflecting surface. A separation optical element is provided between the reflection surface and the first surface,
The position measurement device according to claim 10, wherein the detection device detects light interfered again through the moving grating through the separation optical element.   The position measuring device according to claim 1, wherein a size of the second surface with respect to the predetermined direction is larger than a size of the first surface. The predetermined direction includes a first direction in the moving plane and a second direction that intersects the first direction in the moving plane;
The position measuring device according to any one of claims 1 to 12, wherein a plurality of the moving grating and the fixed optical member are arranged corresponding to the first direction and the second direction. A pattern forming apparatus for forming a pattern on a substrate,
A pattern forming apparatus comprising the position measuring device according to claim 1, in order to measure position information of a movable body that is movable while holding the substrate. An exposure apparatus that exposes a substrate with exposure light,
An exposure apparatus comprising the position measuring device according to any one of claims 1 to 13, in order to measure position information of a movable body that is movable while holding the substrate. The moving body has a holding portion for holding a substrate,
The exposure apparatus according to claim 15, wherein the first surface is disposed around the holding unit.   The exposure apparatus according to claim 16, wherein the surface of the substrate held by the holding unit and the first surface are arranged in substantially the same plane.   The exposure apparatus according to any one of claims 15 to 17, comprising at least two moving bodies. Exposing the substrate using the exposure apparatus according to any one of claims 15 to 18,
Developing the exposed substrate; and a device manufacturing method. A position measurement method for measuring position information of a moving object moving in a moving plane,
Irradiating a moving grating disposed on the first surface of the moving body with light;
Allowing the light diffracted by the moving grating to enter a fixed optical member having a second surface substantially parallel to the first surface, the positional relationship with the light source being fixed and diffracting or reflecting incident light; ,
Diffracting or reflecting light incident on the fixed optical member and returning it to the moving grating;
Detecting the light interfered again through the moving grating. A pattern forming method for forming a pattern on a substrate,
Measuring position information of a movable body that is movable while holding the substrate, using the position measurement method according to claim 20;
Forming a pattern on the substrate held by the movable body. An exposure method for exposing a substrate with exposure light,
Measuring position information of a movable body that is movable while holding the substrate, using the position measurement method according to claim 20;
Exposing the substrate held by the movable body. Exposing the substrate using the exposure method according to claim 22;
Developing the exposed substrate; and a device manufacturing method.

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