JP2009277718A - Semiconductor inspection device and method of inspecting semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor inspection device that shortens an inspection time. <P>SOLUTION: The semiconductor inspection device includes a plurality of light sources 105 to 107 that irradiate a semiconductor device 109 with irradiation light beams of colors different from each other at angles different from each other, a plurality of line sensors 102a to 102c which detect the light beams of the colors different from each other to generate detection signals and detect reflected light beams reflected by the semiconductor device 109, and an image processing section 104 which processes the detection signals of the line sensors 102a to 102c respectively to generate image data for each of the line sensors 102a to 102c. A combination of the colors of the light beams emitted by the light sources 105 to 107 is the same with a combination of colors that the line sensors 102a to 102c detect. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor inspection apparatus and a semiconductor device inspection method capable of reducing the inspection time.

The semiconductor device is subjected to an appearance inspection for detecting defective products. As a technique related to the appearance inspection of a semiconductor device, for example, there is a technique described in Patent Document 1. This technology relates to an apparatus for inspecting leads and the like when a semiconductor device is mounted on a circuit board, and one imager simultaneously captures four types of images obtained by irradiating four types of illumination light on the same lead. To do. The imaging means is a line sensor and forms images different from each other in the four regions. The four types of irradiation light are coaxial epi-illumination, two oblique illuminations, and slit light illumination. The two oblique illuminations irradiate light on different side surfaces of the lead, and are red light and blue light, respectively. The two optical systems for oblique illumination each include a filter that selectively reflects red light and a filter that selectively reflects blue light.
JP-A-5-340725

  However, in the above-described technique, since one line sensor is divided into a plurality of regions, the range that can be imaged by one scan is narrowed when the resolution is not lowered. For this reason, in order to obtain the entire image of the inspection object, it is necessary to scan the inspection object a plurality of times, and the inspection time is long.

According to the present invention, a movable stage on which a semiconductor device is placed;
A plurality of light sources for irradiating the semiconductor devices on the stage with different colors of irradiation light at different angles;
A plurality of line sensors, each detecting light of a different color to generate a detection signal, and detecting reflected light reflected by the semiconductor device;
An image processing unit that generates image data for each of the plurality of line sensors by processing detection signals of the plurality of line sensors;
With
There is provided a semiconductor inspection apparatus in which a combination of colors of light emitted from the plurality of light sources is the same as a combination of colors detected by the plurality of line sensors.

  According to this invention, the combination of the light colors of the plurality of light sources and the combination of the colors detected by the plurality of line sensors are the same. Therefore, the plurality of image data generated by the image processing unit is image data corresponding to any of the plurality of light sources. For this reason, a plurality of types of whole images can be obtained in one scan. Therefore, the inspection time can be shortened.

According to the present invention, the plurality of light sources that irradiate the semiconductor devices on the stage with different colors of irradiation light at different angles, and the combinations of colors that detect the different colors of light and detect the colors. A plurality of line sensors that are the same as the light source of
While the relative positions of the plurality of line sensors and the stage are moved, the plurality of light sources irradiate the semiconductor device with irradiation light, and the plurality of line sensors detect reflected light reflected by the semiconductor device. To generate a detection signal
There is provided a semiconductor device inspection method for generating image data for each of the plurality of line sensors by processing detection signals of the plurality of line sensors.

  According to the present invention, the inspection time can be shortened.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic perspective view showing a configuration of an appearance inspection apparatus according to the present embodiment. This appearance inspection apparatus includes a stage 108, a coaxial illumination illumination 105 (light source), an oblique illumination 106 (light source), a side illumination 107 (light source), a line sensor camera 101, and an image processing unit 104. The stage 108 is movable, and the semiconductor device 109 is placed thereon. The coaxial illumination illumination 105, the oblique illumination 106, and the side illumination 107 irradiate the semiconductor device 109 on the stage 108 with illumination light of different colors at different angles. The line sensor camera 101 includes a plurality of line sensors 102a, 102b, and 102c that detect reflected light reflected by the semiconductor device 109. Each of the line sensors 102a, 102b, and 102c detects light of different colors and generates a detection signal. The image processing unit 104 processes the detection signals of the line sensors 102a, 102b, and 102c, thereby generating image data for each of the line sensors 102a, 102b, and 102c.

  The combination of light colors of the coaxial illumination 105, the oblique illumination 106, and the side illumination 107 is the same as the combination of colors detected by the line sensors 102a, 102b, and 102c. Therefore, the plurality of pieces of image data generated by the image processing unit 104 are image data corresponding to any one of the coaxial illumination 105 (light source), the oblique illumination 106 (light source), and the side illumination 107 (light source), respectively. Become. For this reason, a plurality of types of whole images can be obtained in one scan. Therefore, the inspection time can be shortened. This will be described in detail below.

  The appearance inspection apparatus illustrated in FIG. 1 further includes a lens 103. The lens 103 is located between the coaxial illumination illumination 105, the oblique illumination 106, the side illumination 107, and the line sensor camera 101.

  Each of the coaxial illumination 105, the oblique illumination 106, and the side illumination 107 has, for example, an LED as a light source. The light sources of the coaxial illumination 105, the oblique illumination 106, and the side illumination 107 emit light of different colors (for example, red, blue, and green). The coaxial illumination illumination 105, the oblique illumination 106, and the side illumination 107 have a half mirror inside. In these illuminations, the light from the light source irradiates the semiconductor device 109 through the half mirror. Then, the reflected light from the semiconductor device 109 passes through the half mirror, and then enters all of the line sensors 102a, 102b, and 102c through the lens 103.

  The line sensors 102a, 102b, and 102c are arranged side by side and are parallel to each other. Each of the line sensors 102a, 102b, and 102c has a configuration in which N-bit CCD elements are arranged in one row. The line sensors 102a, 102b, and 102c have a length necessary for imaging the semiconductor device 109 in one scan. Color filters of different colors are attached to the surfaces of the CCD elements of the line sensors 102a, 102b, and 102c. The combination of colors of the color filters is the same as the combination of colors of light emitted from the light sources of the coaxial illumination 105, the oblique illumination 106, and the side illumination 107 (for example, red, blue, and green). The color filter transmits only light of the color component. For this reason, the line sensors 102 a, 102 b, and 102 c detect light generated by reflecting light from different illuminations to the semiconductor device 109.

  For example, assume that the light source of the coaxial illumination 105 emits blue light, the oblique illumination 106 emits green light, and the side illumination 107 emits red light. Further, it is assumed that the line sensor 102a detects blue light, the line sensor 102b detects green light, and the line sensor 102c detects red light. In this case, the line sensor 102 a detects light generated by the semiconductor device 109 reflecting light irradiated by the coaxial irradiation illumination 105. The line sensor 102b detects light generated by the semiconductor device 109 reflecting light irradiated by the oblique illumination 106. Further, the line sensor 102 c detects light generated by the semiconductor device 109 reflecting light emitted from the side illumination 107.

  When the appearance inspection of the semiconductor device 109 is performed, the stage 108 moves at a constant speed in a direction (for example, an orthogonal direction) intersecting the line sensors 102a, 102b, and 102c with the semiconductor device 109 mounted. During this time, the coaxial illumination 105, the oblique illumination 106, and the side illumination 107 continue to emit light toward the stage 108, and the line sensors 102a, 102b, and 102c of the line sensor camera 101 send detection signals to the image processing unit 104. Continue to output.

  When the stage 108 moves once, the image processing unit 104 generates different two-dimensional image data for each of the line sensors 102a, 102b, and 102c. These three image data correspond to the coaxial illumination 105, the oblique illumination 106, and the side illumination 107, respectively, and show the entire image of the semiconductor device under different conditions.

  As described above, according to the present embodiment, the coaxial illumination illumination 105, the oblique illumination 106, and the side illumination 107 irradiate the semiconductor device 109 on the stage 108 with illumination light of different colors at different angles. The line sensors 102a, 102b, and 102c of the line sensor camera 101 detect light of different colors. For this reason, the range which can be imaged by one scan is not narrowed, and multiple types of whole images can be obtained by one scan. Therefore, the inspection time can be shortened.

  Further, since the line sensors 102a, 102b, and 102c are arranged side by side, the reflected lights of the coaxial illumination illumination 105, the oblique illumination 106, and the side illumination 107 can be collected in the same optical system. . For this reason, the appearance inspection apparatus is not increased in size and the manufacturing cost can be reduced. Further, since the increase in the optical system can be suppressed, the labor required for setting and adjusting the optical system can be reduced.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable. For example, in the above-described embodiment, the stage 108 is moved. However, the stage 108 may be fixed and the line sensors 102a, 102b, and 102c, the coaxial illumination light 105, the oblique illumination 106, and the side illumination 107 may be moved. .

It is a perspective schematic diagram showing composition of an appearance inspection device concerning an embodiment.

Explanation of symbols

101 Line Sensor Camera 102a Line Sensor 102b Line Sensor 102c Line Sensor 103 Lens 104 Image Processing Unit 105 Coaxial Irradiation Illumination 106 Oblique Illumination 107 Side Illumination 108 Stage 109 Semiconductor Device

Claims (3)

A stage that is movable and on which a semiconductor device is placed;
A plurality of light sources for irradiating the semiconductor devices on the stage with different colors of irradiation light at different angles;
A plurality of line sensors, each detecting light of a different color to generate a detection signal, and detecting reflected light reflected by the semiconductor device;
An image processing unit that generates image data for each of the plurality of line sensors by processing detection signals of the plurality of line sensors;
With
A semiconductor inspection apparatus in which a combination of colors of light emitted from the plurality of light sources is the same as a combination of colors detected by the plurality of line sensors. The semiconductor inspection apparatus according to claim 1,
The semiconductor inspection apparatus, wherein the plurality of line sensors are arranged side by side. A plurality of light sources that irradiate semiconductor devices on the stage with different colors of irradiation light at different angles and different color lights are detected, and the combination of the detected colors is the same as the plurality of light sources. With multiple line sensors,
While the relative positions of the plurality of line sensors and the stage are moved, the plurality of light sources irradiate the semiconductor device with irradiation light, and the plurality of line sensors detect reflected light reflected by the semiconductor device. To generate a detection signal
A semiconductor device inspection method for generating image data for each of the plurality of line sensors by processing detection signals of the plurality of line sensors.

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