JP2009253137A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the connection reliability of an electronic component after being mounted. <P>SOLUTION: The electronic component has a slit for dividing a bottom face terminal into an inner part and an outer part or a slit for dividing a side face terminal into an upper part and a lower part. Due to the existence of the slit, the torque of the side face terminal is suppressed, reducing local stress acting on the solder after the electronic component is mounted. Consequently, the connection reliability of the electronic component after being mounted can be improved. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component such as an inductance component.

  As shown in FIG. 6, this type of electronic component 1 conventionally includes an insulator 2, lower surface terminals 3 </ b> A and 3 </ b> B formed on the lower surface of the insulator 2, and side surface terminals 4 </ b> A formed on the side surfaces of the insulator 2. 4B, the side surface terminal 4A or the lower surface terminal 3A, and the side surface terminal 4B or the lower surface terminal 3B are connected to both ends, and a coil 5 formed in the insulator 2 is provided.

The electronic component 1 is mounted on the substrate 6 with solder 7.
Japanese Patent Laid-Open No. 9-270355

  Such a conventional electronic component 1 has a problem that connection reliability with the substrate 6 is low at the time of mounting.

That is, since there is a difference in thermal expansion coefficient between the substrate 6 and the insulator 2 of the electronic component 1, when the insulator 2 expands and contracts due to external environmental factors, the expansion force acts as an external force on the side terminals 4A and 4B. To do. At this time, in the conventional configuration, the side terminals 4A and 4B are constrained by the bottom terminals 3A and 3B close to the substrate 6, so that the rotational force based on the bottom terminals 3A and 3B acts on the side terminals 4A and 4B.
Since this rotational force acts as a lever and acts locally on the solder 7 after mounting, the solder 7 may be cracked or peeled off, resulting in poor connection.

  Accordingly, an object of the present invention is to improve the connection reliability of an electronic component with a substrate.

  And in order to achieve this object, this invention shall have the slit which divides a lower surface terminal inside and outside, or the slit which divides a side terminal up and down.

  With this configuration, the present invention can improve the connection reliability of the electronic component with the substrate.

  The reason is that the side terminals are not easily restrained by the lower surface terminals due to the slits. Therefore, the rotational force of the side terminal is suppressed, and the entire side terminal is uniformly deformed according to the expansion and contraction of the insulator. As a result, the stress load on the solder is dispersed, and the reliability of connection between the electronic component and the substrate can be improved after mounting.

(Embodiment 1)
Hereinafter, the electronic component according to Embodiment 1 of the present invention will be described with reference to the drawings.

  In FIG. 1, a pair of lower surface terminals 9 and 10 are provided on the left and right ends of the lower surface of a sheet-like insulator 8 made of an insulating resin such as an epoxy resin, and the opposite side surfaces (left and right) of the insulator 8 are also provided. Side terminals 11 and 12 are provided at both ends. In the present embodiment, these side terminals 11 and 12 are connected to the ends of the coil 13 shown in FIGS. 2 (A) to 2 (G), respectively.

  In the present embodiment, the slits 14 are provided so as to divide the lower surface terminals 9 and 10 into regions of inner 9A and 10A and regions of outer 9B and 10B, respectively. The slit 14 is preferably provided in the vicinity of the boundary region between the lower surface terminal 9 and the side surface terminal 11 and between the lower surface terminal 10 and the side surface terminal 12 as much as possible. In this embodiment, the slit 14 is located outside the center of the lower surface terminals 9 and 10. Each was formed at the position.

  Moreover, the insulator 8 is comprised by the laminated structure of each insulator layer 8A, 8B, 8C, 8D, 8E, 8F, 8G, as shown to FIG. 2 (A)-(G).

  As shown in FIG. 2A, the lower surface terminals 9 and 10 are formed in the lowermost layer of the electronic component, and the inside of the slit 14 is filled with the resin of the insulating layer 8A. In the present embodiment, the slit 14 penetrates from the upper surface to the lower surface of the lower surface terminals 9 and 10. In this case, the slit 14 can be formed in one step of forming the lowermost layer shown in FIG. 2A, and the production efficiency is high.

  Moreover, the side terminal is comprised by the laminated structure of each side terminal layer 11B-11G and 12B-12G, as shown to FIG. 2 (B)-(G).

  As shown in FIG. 2 (B), the insulating layer 8B is formed with a side surface terminal layer 11B (extraction electrode) electrically connected to the lower surface terminal (9 in FIG. 2 (A)). As shown in FIG. 2C, an insulating layer 8C in which a via 15 electrically connected to the side surface terminal layer (11B in FIG. 2B) is embedded is laminated on the insulating layer 8B. ing.

  As shown in FIG. 2 (D), an insulator layer 8D in which a coil 13 whose one end is electrically connected to a via (15 in FIG. 2 (C)) is embedded in the upper layer of the insulator layer 8C. As shown in FIG. 2E, a via 15 electrically connected to the other end of the coil (13 in FIG. 2D) is embedded in the upper layer of the insulator layer 8D. The insulating layers 8E are stacked.

  As shown in FIG. 2 (F), an insulator layer 8F in which a coil 13 whose one end is electrically connected to a via (15 in FIG. 2 (E)) is embedded is formed above the insulator layer 8E. The other end of the coil 13 is electrically connected to the side terminal layer 12F.

  Further, as shown in FIG. 2G, a layer made up of the insulator layer 8G and the side terminal layers 11G and 12G is laminated on the insulator layer 8F, thereby forming an inductance component.

  In the present embodiment, one end of the coil 13 is connected to the lower surface terminal 9 and the other end is connected to the side surface terminal 12. For example, one end is the lower surface terminal 9, the other end is the lower surface terminal 10, or one end is the side surface. The terminal 11 and the other end may be connected to the side terminal 12 and can be selected as appropriate.

  The effect in this Embodiment is demonstrated below.

  In this embodiment, connection reliability after mounting can be improved.

  The reason is that by providing the slits 14 in the lower surface terminals 9 and 10, it is possible to prevent the stress generated by the expansion and contraction of the insulator 8 from becoming the rotational force of the side terminals 11 and 12.

  That is, as shown in FIG. 6, since there is a difference in the coefficient of thermal expansion between the substrate 6 made of glass epoxy or the like and the insulator 2, when the insulator 2 expands and contracts due to external environmental factors, the expansion and contraction force is a side terminal. Acts as an external force on 4A and 4B. At this time, in the conventional configuration, the side terminals 4A and 4B are constrained by the lower surface terminals 3A and 3B close to the substrate 6, so that a rotational force based on the lower surface terminals 3A and 3B acts on the side terminals 4A and 4B. Since this rotational force acts as a lever and acts locally on the solder 7 after mounting, the solder 7 may be cracked or peeled off, resulting in poor connection.

  In contrast, in the present embodiment, as shown in FIG. 1, since the slits 14 are provided in the lower surface terminals 9 and 10, the side terminals 11 and 12 are not easily restrained by the lower surface terminals 9 and 10. That is, the generation of rotational force at the side terminals 11 and 12 can be suppressed, and uniform stress acts on the entire side terminals 11 and 12. Therefore, the maximum value of the stress acting on the solder can be reduced, and as a result, the connection reliability after mounting can be improved.

  Further, in the present embodiment, the slit 14 is provided outside the center of the lower surface terminals 9, 10 to reduce the area of the lower surface terminals 9, 10 connected to the side terminals 11, 12. Therefore, restraint from the lower surface terminals 9 and 10 can be suppressed, and the stress load acting on the side terminals 11 and 12 can be further dispersed.

  In the present embodiment, the lower surface terminals 9, 10 are divided into the inner 9A, 10A and the outer 9B, 10B at the slit 14, respectively, and the divided areas are electrically connected with solder. be able to.

  The width of the slit 14 is suitably about one third or less of the width of the lower surface terminals 9 and 10. The resin of the insulator 8 filled in the slit 14 has low adhesiveness to the solder. However, with this slit width, soldering is easy from the bottom terminal 9 to the side terminal 11 and from the bottom terminal 10 to the side terminal 12. Therefore, even if the terminal area is reduced, a decrease in the adhesion between the solder and the terminal can be suppressed.

  Further, in the present embodiment, since the inside of the slit 14 is filled with the resin of the insulator 8, the surface can be formed substantially flush. Therefore, the insulator 8 and the like can be easily laminated thereon, and since there is no unevenness, accumulation of dust and the like can be prevented.

  In the present embodiment, one slit 14 is provided for each lower surface terminal 9, 10, but a plurality of slits may be provided, for example.

  Further, in the present embodiment, both ends of the electronic component are entirely covered with side terminals 11 and 12 made of metal. Therefore, when a plurality of electronic components are formed on a single substrate, if the side terminals 11 and 12 and the resin region such as the insulator 8 are arranged adjacent to each other, the side terminals 11 and 12 and the resin region Can be easily divided at the interface, and the efficiency of the singulation process is high.

(Embodiment 2)
The difference between the present embodiment and the first embodiment is that the slit 14 has a bottomed groove shape as shown in FIG. That is, in the present embodiment, the slit 14 is formed on the inner side of the lower surface terminals 9 and 10 while leaving the outer surface (lower surface).

  As shown in FIG. 4A, such slits 14 are formed with lower surface terminal layers 16A and 17A having no slits 14 in the lowermost layer of the electronic component in the manufacturing process, and FIG. The lower terminal layers 16B and 17B provided with the slits 14 shown in FIG.

  In the present embodiment, in the region where the slit 14 is provided, the lower surface terminals 9 and 10 become thinner and the elasticity becomes smaller (softer). Therefore, the restraining force to the side terminals 11 and 12 is suppressed, and the rotational force of the side terminals 11 and 12 can be reduced. As a result, the stress load on the side terminals 11 and 12 when the insulator 8 expands and contracts is dispersed, and the connection reliability between the electronic component and the board on which the electronic component is mounted can be improved.

  In the present embodiment, since the outer surfaces (lower surfaces) of the lower surface terminals 9 and 10 are made of metal, the affinity with solder is high, and the connection reliability can be improved.

  Further, in this configuration, the lower surface terminal 9 and the side surface terminal 11 and the lower surface terminal 10 and the side surface terminal 12 are electrically connected. Therefore, if either one of the lower surface terminal 9 and the side surface terminal 11 and either one of the lower surface terminal 10 and the side surface terminal 12 are in contact with the solder, both can be electrically connected to the coil 13. Therefore, the connection reliability between the substrate and the electronic component can be improved.

  Description of other configurations and effects similar to those of the first embodiment is omitted.

(Embodiment 3)
The difference between the present embodiment and the first embodiment is that the slits 14 are formed in the side terminals 11 and 12, respectively, as shown in FIG.

  The slit 14 is provided so as to partition the side terminals 11 and 12 into an upper region and a lower region.

  In the present embodiment, the slit 14 is formed immediately above the boundary portion between the lower surface terminal 9 and the side surface terminal 11 and between the lower surface terminal 10 and the side surface terminal 12. That is, it is the structure formed below the center of the side terminals 11 and 12.

  Further, the slit 14 has a bottomed groove shape, and is formed on the inner side of the side terminals 11 and 12 while leaving the outer surfaces. The slit 14 is filled with the resin of the insulator 8.

  The electronic component in the present embodiment can be formed by narrowing the width of some layers in the step of laminating the side terminals 11 and 12.

  In the present embodiment, in the region where the slit 14 is provided, the side terminals 11 and 12 become thin and the elasticity becomes small (soft). Therefore, when the thin portion is elastically deformed, the restraining force from the lower surface terminals 9 and 10 can be buffered, and the rotational force acting on the side terminals 11 and 12 can be reduced. As a result, the stress load on the side terminals 11 and 12 when the insulator 8 expands and contracts is dispersed, and the connection reliability between the electronic component and the board can be improved.

  Here, since the rotational force acting on the side terminals 11 and 12 works with the respective joint portions with the lower surface terminals 9 and 10 as base points, the rotational force increases as the distance from the base point becomes longer according to the lever principle. Therefore, in order to reduce this rotational force, it is preferable to provide the slit 14 as close to the lower surface terminals 9 and 10 as possible. Therefore, in this embodiment, the slit 14 is formed below the side terminals 11 and 12 to efficiently reduce the rotational force.

  The slit 14 may be groove-shaped as in the present embodiment, or may be formed so as to penetrate the left and right surfaces of the side terminals 11 and 12, and in either case, the rotation of the side terminals 11 and 12 The power can be reduced. However, the singulation process can be simplified by making the slit 14 into a groove shape as in the present embodiment. In other words, in the present embodiment, the entire left and right side surfaces of the electronic component are made of the metal of the side terminals 11 and 12. Therefore, it can be easily divided on this side, and the efficiency of the singulation process is increased.

  In the present embodiment, the slit 14 is provided only on the side terminals 11 and 12, but it may be provided on the lower surface terminals 9 and 10.

  Description of other configurations and effects similar to those of the first embodiment is omitted.

  Although the above embodiment has been described using an inductance component, it is also useful in other electronic components such as an LC composite component in which a capacitor or the like is provided in the insulator 8.

  The electronic component according to the present invention is characterized in that the connection reliability after mounting can be improved, and is useful in various electric devices such as a mobile phone.

The perspective view of the electronic component in Embodiment 1 of this invention (A)-(G) The sectional view which decomposed | disassembled the electronic component The perspective view of the electronic component in Embodiment 2 of this invention (A) (B) Cross-sectional view of the essential parts of the electronic component exploded The perspective view of the electronic component in Embodiment 3 of this invention Sectional view of conventional electronic components

Explanation of symbols

8 Insulator 8A-8G Insulator layer 9, 10 Lower surface terminal 9A, 10A Inner 9B, 10B Outer 11, 12 Side terminal 11B-11G, 12B-12G Side terminal layer 13 Coil 14 Slit 15 Via 16A, 16B, 17A, 17B Bottom terminal layer

Claims (7)

An insulator;
A lower surface terminal formed on the lower surface of the insulator;
A side terminal formed on a side surface of the insulator;
It is connected to at least one of the side surface terminal or the bottom surface terminal, and includes a coil formed inside the insulator,
An electronic component having a slit that divides the lower surface terminal into an inside and an outside. The electronic component according to claim 1, wherein the slit is formed outside a center of the lower surface terminal. An insulator;
A lower surface terminal formed on the lower surface of the insulator;
A side terminal formed on a side surface of the insulator;
It is connected to at least one of the side surface terminal or the bottom surface terminal, and includes a coil formed inside the insulator,
An electronic component having a slit that divides the side terminal vertically. The electronic component according to claim 3, wherein the slit is formed below the center of the side terminal. The slit is a bottomed groove shape,
Leaving the outer surface of the bottom terminal or the side terminal,
The electronic component according to claim 1, wherein the electronic component is formed inside thereof. Inside the slit,
The electronic component according to claim 1 or 3, which is filled with an insulator. 4. The electronic component according to claim 1, wherein a width of the slit is one third or less of a width of a terminal in which the slit is formed.

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