JP2009250810A - Temperature control device of electronic component, and handler device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature control device of an electronic component for controlling the temperature of the electronic component with superior responsiveness, and to provide a handler device having the temperature control device of the electronic component. <P>SOLUTION: This temperature control device 10 of the electronic component performs control so that the electronic component 40 to be inspected keeps a predetermined temperature during inspection, and has a circulation circuit formed of pipes 17 and 18, where a refrigerant flows, and a compressor 1, condenser 2, expansion apparatus 6, and evaporator 7 disposed in its midway. The evaporator 7 cools the electronic component 40 by evaporating the refrigerant. The evaporator 7 comprises a housing 72, and a heat-dissipating member 71, that is stored in it and performs heat exchange between it and the refrigerant, and the heat dissipation member 71 is made of a foam metal material. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a temperature control device for an electronic component that controls the temperature of the electronic component to a predetermined temperature in a characteristic inspection of the electronic component, and a handler device including the temperature control device for such an electronic component.

  In a characteristic inspection of an electronic component such as an IC (Integrated Circuit), there is a temperature load test in which the electronic component is inspected while being held at a predetermined temperature. In this temperature load test, it is necessary to inspect the electronic component under an accurate temperature condition by complementing the temperature change due to self-heating of the electronic component. In particular, recently, as represented by a CPU of a personal computer, electronic components have been increased in speed, integration, and miniaturization, and the amount of heat generated by the electronic components has been increasing. For this reason, temperature control apparatuses that control the temperature of electronic components during inspection have been proposed (for example, Patent Documents 1 to 3).

Such a temperature control device includes, for example, a flow path through which a refrigerant flows, and a compressor, a condenser, an expander, and an evaporator provided in the middle of the flow path. Among these, the evaporator has a heat radiating member that exchanges heat with the refrigerant, and is configured to cool the electronic component brought into contact with the evaporator by cooling the heat radiating member with the refrigerant. .
As this heat radiating member, as disclosed in Patent Document 1, a block body made of a material having high thermal conductivity (for example, a metal material or a ceramic material), or a fin body formed on the block body is used. . A heat radiating member having a fin structure has a large surface area, so that the efficiency of heat exchange with the refrigerant can be increased. However, recent electronic components have a large amount of heat generation, so that the cooling rate cannot keep up.

US Pat. No. 5,821,505 US Pat. No. 5,325,052 JP-A-8-340030

  An object of the present invention is to provide a temperature control device for an electronic component capable of controlling the temperature of the electronic component with excellent responsiveness, and a handler device provided with the temperature control device for the electronic component.

The above object is achieved by the present invention described below.
The temperature control device for an electronic component according to the present invention includes a flow path through which a refrigerant flows, a heat absorption part and a heat dissipation part provided in the middle of the flow path, and directly or indirectly contacts the heat absorption part. And a cooling device that cools the electronic component by exchanging heat of the electronic component absorbed by the heat absorption unit with the refrigerant in the heat dissipation unit;
A heating device for heating the electronic component;
A controller that controls the temperature of the electronic component by controlling the operation of the heating device;
A heat radiating member made of a foam metal material is installed in the heat radiating part of the cooling device.
This makes it possible to control the temperature of the electronic component with excellent responsiveness even for an electronic component with a large amount of heat generation, thereby maintaining the temperature of the electronic component accurately at a predetermined temperature, An electronic component temperature control device that makes it possible to perform characteristic inspection is obtained.

In the electronic component temperature control apparatus of the present invention, it is preferable that the foam metal material is mainly composed of at least one of Al, Ti, Fe and Cu.
As a result, even if the heat dissipation member has a disadvantageous shape in mechanical strength including a large number of holes, it has sufficient mechanical strength and excellent heat exchange efficiency with the refrigerant. .
In the temperature control device for an electronic component according to the present invention, it is preferable that at least some of the plurality of holes included in the foam metal material are connected to each other.
Thereby, the heat radiating member has a large surface area and a low flow resistance of the refrigerant. For this reason, the further improvement of the heat exchange efficiency between a refrigerant | coolant and a thermal radiation member can be aimed at.

In the temperature control device for an electronic component according to the present invention, it is preferable that the foam metal material has a three-dimensional network structure formed by connecting particles of metal powder.
As a result, the adjacent network structure acts to reinforce each other, so the foam metal material with such a structure prevents the network structure from being destroyed no matter what direction external force is applied. can do. As a result, even if the ratio of the holes is increased, a heat radiating member having sufficient mechanical strength and particularly high heat exchange efficiency with the refrigerant can be obtained.

In the temperature control apparatus for an electronic component according to the present invention, it is preferable that the average particle size of the metal powder is 0.5 to 30 μm.
Accordingly, the surface area of the metal foam material is sufficiently widened, and the particles of the metal powder are easily and reliably contacted and joined. For this reason, the thermal conductivity between the particles of the metal powder becomes very large, and a heat dissipation member having a particularly high heat dissipation property is obtained.
In the temperature control apparatus for electronic parts according to the present invention, the porosity of the foam metal material is preferably 60 to 99.5%.
Thereby, coexistence with the increase in the surface area in a metal foam material and the improvement of mechanical strength can be aimed at.

In the temperature control device for an electronic component according to the present invention, it is preferable that the average diameter of the pores included in the metal foam material is 1-1000 μm.
Thereby, a heat radiating member having high mechanical strength and low refrigerant flow resistance is obtained.
In the electronic component temperature control device of the present invention, it is preferable that the pores included in the metal foam material have a substantially spherical shape.
Thereby, the structure of the metal foam material inevitably becomes a highly isotropic structure, in other words, a structure having low anisotropy. As a result, the isotropy in mechanical strength of the metal foam material is improved. In addition, the flow resistance of the refrigerant flowing through the holes is particularly small. For this reason, the heat exchange efficiency between a refrigerant | coolant and a thermal radiation member becomes especially high.

In the electronic component temperature control apparatus of the present invention, it is preferable that the foam metal material has a compressive strength of 5 MPa or more.
Thereby, even if a high voltage | pressure refrigerant | coolant is supplied in the hole of a metal foam material, it can prevent that a thermal radiation member destroys easily.
In the electronic component temperature control apparatus according to the present invention, the shape of the heat dissipation member is preferably a plate shape or a block shape having a surface including the electronic component.
As a result, the entire electronic component can be uniformly cooled, and it is possible to prevent abnormalities in the characteristics of the electronic component due to uneven cooling and the occurrence of defects due to thermal expansion differences in the electronic component. it can.

In the electronic component temperature control device of the present invention, the electronic component temperature control device further includes a temperature sensor for detecting the temperature of the electronic component,
Preferably, the control unit controls the temperature of the electronic component by controlling the operation of the heating device based on the temperature of the electronic component detected by the temperature sensor.
Thus, the temperature of the electronic component can be monitored in real time, and the detected value can be fed back to the control of the heating device, so that the temperature of the electronic component can be reliably controlled to a predetermined temperature.

In the electronic component temperature control device of the present invention, the heat absorption part is a container that houses the heat radiation member as the heat radiation part and the refrigerant that exchanges heat with the heat radiation member,
The container has a contact surface that directly or indirectly contacts the electronic component on its outer surface and absorbs heat of the electronic component;
The heat radiating member is preferably joined to a portion of the inner wall surface of the container corresponding to the contact surface.
Thereby, since the thermal radiation member can cool the electronic component side especially efficiently among the wall parts of a container, it can cool an electronic component especially efficiently.

In the electronic component temperature control device of the present invention, it is preferable that the heat dissipating member is configured such that the porosity on the contact surface side is smaller than the porosity on the side opposite to the contact surface.
As a result, the heat dissipation member has a sufficiently large contact area with the inner wall surface on the electronic component side of the container, so that the thermal resistance with the container can be reduced. Since the rate is large, a sufficient contact area with the refrigerant can be secured. Therefore, it is possible to obtain a heat radiating member capable of efficiently transferring the heat of the electronic component to the refrigerant side and efficiently radiating the heat to the refrigerant.

In the electronic component temperature control device of the present invention, it is preferable that the heating device is provided so as to be positioned between the container and the electronic component.
In the present invention, since the cooling rate in the heat radiating part is particularly large, when the electronic component is cooled, the electronic component is cooled through the heating device, thereby balancing the heating rate by the heating device and the cooling rate by the heat radiating unit. Can be kept optimal.
In the electronic component temperature control apparatus of the present invention, it is preferable that the heating device is provided on a surface different from the contact surface in the outer surface of the container.
Thereby, even when the volume of the heat radiating member is small and the cooling capacity is small, sufficient responsiveness can be obtained in cooling the electronic component, so that the size of the heat radiating portion can be reduced. On the other hand, since the cooling capacity of the heat radiating portion can be particularly increased, the electronic component can be cooled with high responsiveness even when the heat generation amount of the electronic component is particularly large.

In the electronic component temperature control device of the present invention, the electronic component temperature control device further includes a compressor, a condenser, and an expander provided in the middle of the pipe,
The refrigerant is preferably configured to be subjected to a cooling cycle of compression, condensation, expansion, and evaporation by sequentially passing the refrigerant through the compressor, the condenser, the expander, and the evaporator.
As a result, the cooling device has a high cooling capacity despite a small amount of refrigerant.

The handler device of the present invention includes a temperature control device for an electronic component of the present invention,
A holding device that presses the electronic component against a tester that inspects characteristics of the electronic component while holding the electronic component;
The evaporator is incorporated in the holding device.
Accordingly, a handler device including an electronic component temperature control device that can control the temperature of the electronic component with excellent responsiveness can be obtained.

Hereinafter, a temperature control device and a handler device for an electronic component according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
<Temperature control device for electronic parts>
<< First Embodiment >>
First, a first embodiment of a temperature control device for an electronic component according to the present invention will be described.
FIG. 1 is a schematic diagram showing a configuration of a first embodiment of a temperature control device for an electronic component according to the present invention. FIG. 2 is a portion of a portion that contacts the electronic component in the temperature control device for an electronic component shown in FIG. It is an enlarged view.

  The electronic component temperature control device of the present invention is a device that controls the temperature of an electronic component in order to supplement self-heating caused by energization of the electronic component when performing a characteristic inspection of the electronic component such as an IC. In other words, the temperature control device needs to cool or heat the electronic component almost in real time according to the heat generation amount of the electronic component. For this reason, the electronic component temperature control device of the present invention realizes high responsiveness in heating and cooling of the electronic component, thereby enabling the characteristic inspection to be performed while maintaining the temperature of the electronic component at a predetermined temperature. it can. Therefore, according to the temperature control apparatus for an electronic component of the present invention, various characteristics of the electronic component can be accurately measured without being affected by temperature.

An electronic component temperature control apparatus 10 shown in FIG. 1 includes a circulation circuit (closed circuit) composed of pipes (flow paths) 17, 18, a compressor 1, a condenser 2, an expander (for example, an expansion valve) 6, and The evaporator 7 is provided in this order in the middle of the circulation circuit.
Further, the pipes 17 and 18 are configured such that the refrigerant flows, and the refrigerant passes through the compressor 1, the condenser 2, the expander 6 and the evaporator 7 in order, so that the refrigerant is compressed and condensed. This causes an expansion and evaporation state change (cooling cycle), which cools the surface of the evaporator 7. That is, the piping 17, 17 and the compressor 1, the condenser 2, the expander 6, and the evaporator 7 constitute a cooling cycle device (cooling device). A cooling cycle apparatus using such a cooling cycle has a high cooling capacity despite a small amount of refrigerant.

  A heat conduction block 9 having a first heater (heating device) 91 is provided on the lower surface of the evaporator 7. Furthermore, the lower surface (hereinafter also referred to as “contact surface”) 9 </ b> A of the heat conduction block 9 is held in a state where the upper surface of the electronic component 40 is pressed. That is, the lower surface of the evaporator 7 is indirectly in contact with the upper surface of the electronic component 40 through the heat conduction block 9. In addition, the evaporator 7 and the heat conduction block 9 are movable up and down so that the contact surface 9A can contact and separate from the electronic component 40.

Hereinafter, the structure of each part of the temperature control apparatus 10 of an electronic component is explained in full detail.
The pipe 17 has one end connected to the compressor 1 and the other end connected to the evaporator 7. Further, a condenser 2, a strainer 3, a filter dryer 4, a valve 5 and an expander 6 are provided in this order from the compressor 1 side between the compressor 1 and the evaporator 7 in the pipe 17. . Then, the refrigerant flows from the compressor 1 toward the evaporator 7.
On the other hand, the pipe 18 has one end connected to the evaporator 7 and the other end connected to the compressor 1. Moreover, between the evaporator 7 and the compressor 1 of the piping 18, the 2nd heater 12 and the refrigerant | coolant supply source 25 are provided in this order from the evaporator 7 side. Then, the refrigerant flows from the evaporator 7 toward the compressor 1.
The refrigerant is configured to circulate in the circulation circuit constituted by the pipe 17 and the pipe 18 while repeating the state change.

The compressor 1 is a device that changes a refrigerant into high-temperature and high-pressure steam by compressing the refrigerant. Such a compressor 1 is composed of, for example, a compressor.
The condenser 2 provided in the middle of the pipe 17 is a device that radiates and condenses (liquefies) high-temperature and high-pressure steam while maintaining high pressure. The condenser 2 includes, for example, a pipe 17 that is formed in a zigzag manner and a condenser fan 2A that radiates heat from the pipe 17.
The strainer 3 serves to absorb the change in the refrigerant amount in the evaporator 7 due to the change in the cooling load of the electronic component 40.

Further, the filter dryer 4 includes, for example, a desiccant that removes moisture in the refrigerant. As such a desiccant, for example, silica gel, buckwheat bead, molecular sheep or the like is used. It is particularly recommended that such a filter dryer 4 be installed when a solvent that does not dissolve water such as Freon is used.
The valve 5 opens and closes a pipe 17 between the filter dryer 4 and the expander 6 to adjust the amount of refrigerant directed to the expander 6 and the evaporator 7. By appropriately opening and closing the valve 5, the operation of the evaporator 7 can be controlled and the cooling rate (cooling capacity) of the electronic component 40 can be adjusted.

The expander 6 passes the refrigerant condensed into the room-temperature and high-pressure liquid by the condenser 2 through, for example, a capillary tube (capillary tube) or the like, or sprays it with an expansion valve. The state is changed to a fluid mixed with.
The evaporator 7 includes a heat radiating member 71 and a box-shaped housing (container) 72 that houses the heat radiating member 71.
The mixed fluid (refrigerant) of the low-pressure liquid and vapor supplied into the housing 72 spreads so as to be in contact with the entire heat radiating member 71. Then, by exchanging heat with the heat radiating member 71, the low-pressure liquid evaporates and flows into the pipe 18 as low-temperature and low-pressure steam. During the heat exchange, the heat radiating member 71 is rapidly cooled.

The heat radiating member 71 is joined to the bottom surface 7 </ b> A of the inner wall surface of the housing 72. Thereby, the heat radiating member 71 can cool especially the lower part of the housing 72 efficiently, and can cool the electronic component 40 especially efficiently.
Although it does not specifically limit as this joining method, For example, it is preferable to use the joining method excellent in heat conduction, such as welding, brazing, and soldering. Thereby, the thermal resistance between the heat dissipation member 71 and the housing 72 can be further reduced.

In the present invention, the heat radiating member 71 is made of a foam metal material. For this reason, the surface area of the heat radiating member 71 becomes very large, and the area where the heat radiating member 71 and the refrigerant come into contact with each other becomes very large. As a result, the heat radiating member 71 having extremely high heat exchange efficiency with the refrigerant is obtained.
The detailed configuration of the heat dissipation member 71 will be described later.
The heat conduction block 9 is made of a metal material such as Al, Ti, Fe, or Cu having excellent heat conductivity, or a ceramic material such as aluminum nitride or silicon nitride.

  The heat conduction block 9 is preferably detachable from the evaporator 7. Thereby, the contact surface 9 </ b> A has a shape exhibiting excellent adhesion to the upper surface of the electronic component 40. Therefore, by replacing the heat conducting block 9 with a heat conducting block having a different shape of the contact surface 9A according to the type of the electronic component 40, the evaporator 7 and the heat conducting block are used regardless of the type of the electronic component 40. 9 and the thermal resistance between the electronic component 40 can be reduced.

The first heater 91 is built in the heat conduction block 9. As the first heater 91, for example, various heaters such as an alumina heater, an aluminum nitride heater, a silicon nitride heater, a silicon carbide heater, a ceramic heater such as a boron nitride heater, a carbon heater, and a nichrome wire heater can be used.
The heat conduction block 9 is formed with holes or grooves, in which a first temperature sensor (platinum resistor or the like) 11 is a heat conduction material (a thermoplastic resin or the like mixed with a high heat conductivity substance). It is closely attached and fixed using. Thereby, the temperature of the heat conduction block 9 can always be accurately monitored. In addition, when the evaporator 7 and the heat conduction block 9 are pressed against the electronic component 40, the heat conduction material functions as a buffer material, thereby preventing an impact from being transmitted to the first temperature sensor 11. Thereby, failure of the first temperature sensor 11 can be reliably prevented.

  In addition, when the electronic component 40 is a multi-core type and there are a plurality of heat generation points, the first temperature sensor 11 and the first heater are adapted to correspond to the heat generation points in order to monitor the temperature of the electronic component 40 at the plurality of points. It is preferable to install a plurality of each. A high-speed, highly-integrated CPU or the like has a very high heat density, and thus a temperature gradient is likely to occur on the surface of the electronic component 40. Accordingly, by dividing the temperature control area for the electronic component 40 into a plurality of parts and performing the temperature control individually, the temperature gradient described above is eased and the electronic component 40 becomes locally hot. Can be avoided.

  A groove is formed along the outer periphery of the contact surface 9A of the heat conduction block 9, and an O-ring 8 is embedded in the groove. Further, a vacuum suction channel 81 having one end opened inside the O-ring 8 of the contact surface 9A and the other end connected to a vacuum pump (not shown) is provided. By depressurizing the space inside the O-ring 8 through the evacuation channel 81, the electronic component 40 brought into contact with the contact surface 9A can be more reliably vacuum-sucked with respect to the contact surface 9A. Thereby, the further reduction of the thermal resistance between the electronic component 40 and the heat conductive block 9 can be aimed at.

In the present embodiment, the heat conduction block 9 including the first heater 91 is provided on the lower surface of the housing 72. That is, the evaporator 7 and the electronic component 40 are in contact with each other via the heating device. In the electronic component temperature control apparatus 10 having such a configuration, when the electronic component 40 is cooled, the electronic component 40 is cooled via the heat conduction block 9. On the other hand, when the electronic component 40 is heated, the electronic component 40 is heated by the first heater 91.
In the temperature control device 10 for an electronic component, since the heat radiating member 71 made of a foam metal material is used, the cooling rate can be particularly increased as compared with the heating rate. The first heater 91 exhibits a sufficient function even if it is very thin. Considering these, while providing the first heater 91 at a location closest to the electronic component 40 and providing the evaporator 7 at a location slightly away from it, the balance between the heating rate and the cooling rate can be kept optimal. it can.

On the other hand, the second heater 12 is provided in the middle of the pipe 18. Thereby, the refrigerant that has not been completely evaporated by the evaporator 7 can be reliably vaporized.
Also, in the vicinity of the second heater 12, a second temperature sensor 13 as a temperature detector for detecting the temperature of the second heater 12, and the temperature of the second heater 12 is overheated to a preset temperature or more. A thermostat 14 is provided as an overheat prevention device for preventing the temperature rise. In addition, when the 2nd heater 12 is provided in the distance close | similar to the evaporator 7, between the 2nd heater 12 and the evaporator 7 so that the heat of the 2nd heater 12 may not affect the evaporator 7 It is preferable to provide a heat insulating material etc. in the piping part between.
Further, although not shown, dry gas may be supplied to the space in the housing 72. In this way, it is possible to prevent the evaporator 7 from condensing.

Furthermore, when there is a refrigerant that has not been completely evaporated by the evaporator 7, an accumulator (not shown) for separating the liquid refrigerant may be provided in the middle of the pipe 18.
In the present embodiment, as shown in FIG. 1, a heat exchanger 16 that exchanges heat between the pipe 17 and the pipe 18 is provided. Thereby, the heat of the refrigerant in the pipe 17 can be transmitted to the refrigerant in the pipe 18, and the refrigerant that has not completely evaporated can be reliably vaporized.
Further, a refrigerant supply source 25 that supplies a refrigerant to the pipe 18 is connected to the pipe 18. Further, a pressure regulating valve 26 as a pressure regulator is provided between the pipe 18 and the refrigerant supply source 25. The pressure regulating valve 26 supplies the refrigerant from the refrigerant supply source 25 when the pressure in the pipe 18 is reduced, and supplies the refrigerant in the pipe 18 to the refrigerant supply source when the pressure in the pipe 18 increases. It is adjusted to return to 25. By such a refrigerant supply source 25 and the pressure regulating valve 26, the pressure of the refrigerant in the pipes 17 and 18 is maintained constant, and temperature control with higher accuracy is possible.

  The electronic component temperature control apparatus 10 includes a control unit 30. The control unit 30 includes a processing circuit (arithmetic circuit) such as an IC, an LSI (Large Scale Integration), or a programmable controller. The first temperature sensor 11, the second temperature sensor 13, the first heater 91, the second heater 12, and the pressure adjustment valve 26 are electrically connected to the control unit 30. Thereby, for example, the temperature of the electronic component 40 can be controlled to a predetermined temperature by appropriately adjusting the heat generation amount of the first heater 91 based on the temperature measurement result by the first temperature sensor 11. Further, for example, by appropriately adjusting the heat generation amount of the second heater 12 based on the temperature measurement result by the second temperature sensor 13, the refrigerant that has not been completely evaporated by the evaporator 7 can be surely vaporized.

The refrigerant flowing in the pipes 17 and 18 is not particularly limited. For example, CFC (chlorofluorocarbon), HCFC (hydrochlorofluorocarbon), HFC (hydrofluorocarbon), propane, isobutane, ammonia, carbon dioxide, etc. Can be used.
Here, the heat dissipation member 71 described above will be described in detail.
FIG. 3 is an example of an observation image obtained by an electron microscope of the foam metal material constituting the heat dissipating member provided in the temperature control device for the electronic component shown in FIG. 1, and FIG. 4 is a partially enlarged image of the observation image shown in FIG.

  In the temperature control device for an electronic component of the present invention, the heat radiating member 71 is made of a foam metal material. As described above, since the heat radiating member 71 having such a configuration has a very large surface area, the area where the heat radiating member 71 and the refrigerant are in contact with each other is extremely large. For this reason, the heat exchange efficiency between the refrigerant and the heat radiating member 71 becomes extremely high. Thereby, since the heat conductive block 9 and the electronic component 40 can be cooled rapidly, the heat radiating member 71 with especially high responsiveness of a cooling rate with respect to the temperature change of the electronic component 40 is obtained.

  Further, as described above, the heat dissipation member 71 is bonded and fixed to the bottom surface 7 </ b> A of the inner wall surface of the housing 72. For this reason, even if there is a pulsation or the like in the flow of the refrigerant, the heat radiating member 71 is not vibrated, and there is no possibility of malfunctioning the electronic component. For this reason, according to the temperature control apparatus 10 for an electronic component according to the present embodiment, the temperature of the electronic component 40 can be easily and accurately controlled without impairing the reliability of the electronic component 40. Such an action / effect is exhibited only when the heat exchange efficiency between the refrigerant and the heat radiating member 71 is extremely high because the heat radiating member 71 is made of a foam metal material.

Further, the heat dissipation member 71 has a block shape (or plate shape) having a surface including the electronic component 40. As a result, the entire electronic component 40 can be uniformly cooled, and it is possible to prevent abnormalities in the characteristics of the electronic component 40 due to uneven cooling and the occurrence of defects due to the difference in thermal expansion in the electronic component 40. can do.
Furthermore, the heat dissipation member 71 shown in FIG. 2 is provided with a plurality of holes 73 from the upper surface to the inside. When the refrigerant enters the hole 73, the refrigerant can sufficiently penetrate into the heat radiating member 71. As a result, heat exchange with the refrigerant can be performed in a wider range of the heat radiating member 71.

  The metal foam material shown in FIG. 4 is produced by diffusing metal powder particles to each other by sintering and connecting (necking) the metal powder particles 711 together. In the metal foam material thus produced, the connected particles 711 construct a network structure 712 that spreads three-dimensionally (three-dimensionally). Since the network structure 712 acts so that the adjacent network structures 712 mutually reinforce each other, the foam metal material having such a structure breaks the network structure 712 regardless of the direction in which an external force is applied. Can be prevented. Thereby, even if the heat dissipation member 71 comprised with the foam metal material which has the network structure 712 raises the ratio of a void | hole, it has sufficient mechanical strength. Therefore, the heat radiating member 71 having particularly high heat exchange efficiency with the refrigerant can be produced.

In addition, pores 713 are formed (exist) between the mesh structures 712. The air holes 713 may be independent from each other, but it is preferable that at least a part of the air holes 713 are connected to each other as shown in FIGS. 3 and 4. Thereby, the heat radiating member 71 has a large surface area and a low flow resistance of the refrigerant. For this reason, the further improvement of the heat exchange efficiency between a refrigerant | coolant and the thermal radiation member 71 can be aimed at.
The holes 713 preferably have a spherical shape or a shape similar to a spherical shape (substantially spherical shape) as shown in FIG. When the holes 713 have such a shape, the network structure 712 inevitably has a highly isotropic structure, in other words, a structure having low anisotropy. As a result, the isotropy in mechanical strength of the metal foam material is further improved. Further, when the holes 713 have the shape as described above, the flow resistance of the refrigerant flowing in the holes 713 is particularly low. For this reason, the heat exchange efficiency between the refrigerant and the heat dissipation member 71 is particularly high.

When producing a foam metal material by the method as described above, the average particle size of the metal powder to be used is not particularly limited, but is preferably about 0.5 to 30 μm, more preferably about 1 to 20 μm. . When the average particle diameter of the metal powder is within the above range, the surface area of the foam metal material is sufficiently widened, and the metal powder particles 711 are easily and reliably contacted and joined. For this reason, the heat conductivity between the particles 711 becomes very large, and a heat dissipation member 71 having a particularly high heat dissipation property is obtained.
The metal powder may be produced by any method such as an atomizing method such as a water atomizing method, a gas atomizing method, a high-speed rotating water atomizing method, a reduction method, a carbonyl method, or a pulverizing method. However, those produced by the atomizing method are preferably used. According to the atomizing method, a fine metal powder having a narrow particle size distribution (uniform particle size) can be obtained efficiently. Therefore, according to the metal powder manufactured by the atomizing method, a homogeneous foam metal material can be easily manufactured.

On the other hand, the average diameter of the pores 713 in the foam metal material is preferably about 1 to 1000 μm, and more preferably about 5 to 500 μm. Thereby, the heat radiating member 71 having high mechanical strength and low refrigerant flow resistance is obtained.
When the average diameter of the holes 713 is less than the lower limit, the flow resistance of the refrigerant flowing through the holes 713 is remarkably increased, and the heat exchange efficiency between the refrigerant and the heat radiating member 71 is remarkably reduced. There is a fear. On the other hand, when the average diameter of the holes 713 exceeds the upper limit, the interval between the mesh structures 712 becomes very long, and stress is easily concentrated on some of the mesh structures 712, so Mechanical strength may be reduced.

Examples of the metal foam material include Fe, Ni, Co, Cr, Mn, Zn, Pt, Au, Ag, Cu, Pd, Al, W, Ti, Ta, V, Mo, Nb, Zr, Pr, and Nd. , Sm, or alloys containing one or more of these metals (for example, stainless steel, Fe—Ni alloy), intermetallic compounds, and the like.
Among these, as the metal foam material constituting the heat radiating member 71, a material mainly composed of at least one of Al, Ti, Fe and Cu is particularly preferable. These metal components have high thermal conductivity and excellent mechanical strength. For this reason, the foam metal material containing these metal components as a main component has sufficient mechanical strength even if it has a disadvantageous shape in mechanical strength that encloses a large number of pores. The heat radiating member 71 having excellent heat exchange efficiency can be obtained.

Moreover, such a heat radiating member 71 becomes excellent in thermal shock resistance. For this reason, even when the heat radiating member 71 is rapidly cooled, the heat radiating member 71 can be reliably prevented from being destroyed by the thermal shock by the refrigerant flowing into the heat radiating member 71 abruptly.
Further, the porosity of the foam metal material constituting the heat radiating member 71 is preferably about 60 to 99.5%, and more preferably about 70 to 99%. Thereby, coexistence with the increase in the surface area in a metal foam material and the improvement of mechanical strength can be aimed at.

  When the porosity of the foam metal material is lower than the lower limit, the ratio of the holes 713 is too low, so that the contact ratio between the refrigerant and the heat radiating member 71 is decreased, and the heat exchange efficiency may be significantly reduced. is there. On the other hand, when the porosity of the foam metal material exceeds the upper limit, the ratio of the pores 713 is too high, so that the ratio of the network structure 712 is remarkably reduced. For this reason, while the contact ratio of a refrigerant | coolant and the heat radiating member 71 becomes low, there exists a possibility that the mechanical strength of the heat radiating member 71 may fall remarkably.

  In addition, the pores in the metal foam material may be distributed uniformly throughout, but the porosity on the bottom surface 7A side (lower side in FIG. 2) of the housing 72 is on the opposite side (upper side in FIG. 2). ) Is preferably distributed so as to be smaller than the porosity. Thereby, since the heat dissipation member 71 has a sufficiently large contact area with the bottom surface 7A, the thermal resistance with the housing 72 can be reduced. On the other hand, the upper portion of FIG. A sufficient contact area with the refrigerant can be ensured. Therefore, such a heat radiating member 71 can efficiently transfer the heat of the electronic component 40 toward the upper side of FIG. 2 and efficiently radiate heat to the refrigerant.

Such a foam metal material preferably has a compressive strength of 5 MPa or more, and more preferably 10 MPa or more. Thereby, even if a high-pressure refrigerant is supplied into the air holes 713 of the heat radiating member 71, it is possible to prevent the heat radiating member 71 from being easily broken.
The foam metal material constituting the heat dissipation member 71 may be manufactured by any method. For example, a porous substrate such as urethane foam is impregnated with a slurry obtained by suspending metal powder in a liquid. , A method of degreasing and sintering this, a method of adding a foaming agent or hollow particles to the slurry, molding this, then degreasing and sintering, a method of blowing gas into molten metal and foaming, etc. Can be manufactured.

Next, an operation (operation) of the electronic component temperature control apparatus 10 shown in FIG. 1 will be described.
The refrigerant compressed by the compressor 1 becomes high-temperature and high-pressure steam and is sent to the condenser 2. The condenser 2 condenses (liquefies) the heat by radiating the refrigerant while maintaining the pressure of the refrigerant at a high level, and changes the state of the refrigerant to a liquid at room temperature and high pressure.
Next, the refrigerant changes to a state in which a part of the liquid is evaporated in the expander 6 and the low-pressure liquid and gas are mixed. And the refrigerant | coolant which reached the evaporator 7 osmose | permeates in the void | hole of the heat radiating member 71 comprised with the foam metal material.

On the other hand, heat due to self-heating of the electronic component 40 is transmitted to the heat dissipation member 71 through the housing 72.
Here, when the heat dissipation member 71 having heat in this way comes into contact with the refrigerant, heat exchange is performed between them, and when the liquid refrigerant evaporates, the heat dissipation member 71 takes heat of vaporization. Thereby, the heat radiating member 71 is cooled. That is, the housing 72 functions as a heat absorbing portion that takes away the heat of the electronic component 40, and the heat radiating member 71 functions as a heat radiating portion that radiates heat by exchanging the heat with the refrigerant.

Moreover, you may supply a heat conductive liquid between the housing 72 of the evaporator 7, and the heat conductive block 9 as needed. In this case, as the heat conductive liquid, a liquid such as heat conductive grease, thermosetting resin, silicone oil, etc., which does not evaporate below 200 ° C. is preferably used.
Furthermore, a heat conductive liquid may be supplied between the heat conductive block 9 and the electronic component 40 as necessary. In this case, a thermally conductive liquid having excellent thermal conductivity and electrically insulating properties (electric resistance of 1 × 10 ¹⁰ Ω or more) is used. For example, a fluorine-based inert liquid is preferable. Used.

In addition to the above cooling, the electronic component 40 can be heated by operating the first heater 91.
During such a cooling process or heating process, the electronic component 40 is vacuum-adsorbed on the contact surface 9 </ b> A via the evacuation channel 81 by operating a decompression pump (not shown). Thereby, the thermal resistance between 9 A of contact surfaces and the electronic component 40 is reduced, and the responsiveness of cooling or a heating can be improved.

The controller 30 controls the amount of heat generated by the first heater 91 based on the temperature measurement result of the electronic component 40 by the first temperature sensor 11. Thus, by monitoring the temperature of the electronic component 40 in real time and feeding back the detected value, the heating capability of the first heater 91 is adjusted, and the temperature of the electronic component 40 is reliably controlled to a predetermined temperature. Can do.
In addition, the cooling rate (cooling capacity) of the electronic component 40 can be adjusted by appropriately adjusting the opening / closing amount of the valve 5.

In the present embodiment, the controller 30 adjusts the heat generation amount of the second heater 12 based on the temperature measurement result of the refrigerant in the pipe 18 by the second temperature sensor 13. Thereby, while preventing the refrigerant from being insufficiently heated or excessively heated, the refrigerant can be appropriately heated, and condensation of the pipe 18 can be reliably prevented. Note that such heating control may be controlled by an overheat prevention device such as a thermostat 14 or a thermal fuse shown in FIG.
According to the temperature control device 10 for an electronic component having the above-described configuration, even if the electronic component 40 has a large amount of heat generation, the electronic component 40 is rapidly cooled so as to cancel out the heat generation of the electronic component 40. The temperature of 40 can be reliably controlled to a predetermined temperature. That is, the temperature control device 100 excellent in the temperature control responsiveness of the electronic component 40 is obtained.

FIG. 5 is a schematic view showing another configuration example of the first embodiment of the temperature control apparatus for an electronic component according to the present invention.
In the evaporator 7 shown in FIG. 5, the pipe 17 is connected to the right side of the housing 72, while the pipe 18 is connected to the left side of the housing 72. In addition, a plurality of holes 73 are formed in the heat radiating member 71 shown in FIG.
In the evaporator 7, the refrigerant is supplied from the pipe 17 into the housing 72 in a state where the low-pressure liquid and gas are mixed. Then, heat exchange is performed between the heat radiating member 71 and the refrigerant, and heat of vaporization is taken from the heat radiating member 71 when the liquid refrigerant evaporates. Thereby, the heat radiating member 71 is cooled. Thereafter, the vaporized refrigerant is discharged from the left side of the housing 72 to the pipe 18.
In such an evaporator 7, the refrigerant supplied into the housing 72 is inevitably discharged through the entire heat radiating member 71. For this reason, heat exchange is performed without waste in the whole heat radiating member 71, and the heat radiating efficiency of the heat radiating member 71 can be further increased.

<< Second Embodiment >>
Next, a second embodiment of the electronic component temperature control apparatus of the present invention will be described.
FIG. 6 is a partial enlarged view of a portion in contact with an electronic component in the second embodiment of the temperature control device for an electronic component according to the present invention. In the following description, the upper side in FIG. 6 is referred to as “upper” and the lower side is referred to as “lower”.
Hereinafter, the temperature control device for an electronic component according to the second embodiment will be described. The difference from the first embodiment will be mainly described, and the description of the same matters will be omitted.

The temperature control apparatus for electronic components according to this embodiment is the same as that of the first embodiment except that the arrangement of the first heater 91 and the heat conduction block 9 is different.
In the electronic component temperature control apparatus 10 shown in FIG. 6, the heat conduction block 9 incorporating the first heater 91 is provided on the outer surface of the evaporator 7 (a surface different from the surface on the electronic component 40 side).

The heat conduction block 9 is integrated with the housing 72 of the evaporator 7, and the heat generated from the first heater 91 is configured to heat the electronic component 40 through the housing 72.
According to the temperature control apparatus 10 for an electronic component having such a configuration, the distance between the heat dissipation member 71 and the electronic component 40 is shorter than that in the first embodiment, and the electronic component 40 is not interposed via the first heater 9. Can be cooled. Thereby, even when the volume of the heat radiating member 71 is small and the cooling capacity is small, sufficient responsiveness can be obtained in cooling the electronic component 40. As a result, the evaporator 7 can be downsized. In addition, since the cooling capacity of the evaporator 7 can be particularly increased, the electronic component temperature control device 10 having excellent cooling response can be obtained even when the heat generation amount of the electronic component 40 is particularly large.

<Handler device>
Next, an embodiment of a handler device (the handler device of the present invention) including the temperature control device for electronic parts of the present invention will be described.
FIG. 7 is a perspective view showing the configuration of the embodiment of the handler device of the present invention. In the following description, the upper side in FIG. 7 is referred to as “upper” and the lower side is referred to as “lower”.
The handler device ensures the electrical connection between the tester and the electronic component by pressing the electronic component against the inspection position of the electronic component tester (inspection device), and performs the characteristic inspection of the electronic component in this state. A device provided with a device. In addition, the handling device includes the electronic component temperature control device of the present invention in order to maintain the temperature of the electronic component to be inspected at a predetermined temperature.

That is, the handler apparatus 300 shown in FIG. 7 has the apparatus main body 200 and the temperature control apparatus of the electronic component of this invention. The electronic component tester 70 is used by being incorporated in the apparatus main body 200.
The apparatus main body 200 accommodates a part of the temperature control device for the electronic component, and serves as a table for mounting a part of the temperature control device, an IC (electronic component) to be inspected, and the like.
That is, on the apparatus main body 200, an uninspected IC tray 61 for storing uninspected ICs, a supply hand 63 for holding uninspected ICs, a supply robot unit 62 for driving the supply hand 63, and an uninspected A supply shuttle 64 for temporarily placing the IC is provided.

Further, on the apparatus main body 200, a recovery shuttle 65 for temporarily placing the inspected IC, a recovery hand 66 for holding the inspected IC placed on the recovery shuttle 65, and the recovery hand 66 are driven. A recovery robot unit 67 that performs inspection and an inspected IC tray 68 that stores inspected IC held by the recovery hand 66 are provided.
Further, the apparatus main body 200 is provided with a measuring hand 60A for holding an uninspected IC mounted on the supply shuttle 64, and at least the evaporator 7 of the temperature control apparatus 10 for electronic components according to each of the above embodiments. In addition, a measurement robot unit (holding device) 60 incorporating the heat conduction block 9 is provided. In addition, the measurement robot unit 60 has a function of controlling the temperature of the IC to a predetermined temperature by heating or cooling the IC held by the measurement hand 60A.

In addition, the measuring robot unit 60 can be moved back and forth, left and right and up and down on the apparatus main body 200. Then, the measurement hand 60A transports the uninspected IC placed on the supply shuttle 64 to the inspection position of the tester 70, and transports the inspected IC from the inspection position to the recovery shuttle 65.
In addition, the compressor 1 and the condenser 2 of the electronic component temperature control device 10 are provided outside the apparatus main body 200. The compressor 1 and the condenser 2 are connected by pipes 17 and 18.

Next, the operation (operation) of the handler device 300 will be described.
First, an uninspected IC tray 61 containing uninspected ICs is placed on the apparatus main body 200. Next, the supply hand 63 is moved by the supply robot unit 62 and the uninspected IC in the uninspected IC tray 61 is held. Then, the uninspected IC is placed on the supply shuttle 64.
Next, the measurement robot unit 60 is moved, and the uninspected IC placed on the supply shuttle 64 is held by the measurement hand 60A. Then, the uninspected IC is pressed against the inspection position of the tester 70, and the uninspected IC is electrically connected to the tester 70. In this state, the electrical characteristics inspection of the uninspected IC is performed by the tester 70. At this time, when self-heating occurs in the IC due to energization, the heating capacity of the first heater 91 built in the measurement robot unit 60 is reduced and the cooling capacity of the evaporator 7 is increased to cool the IC. To do. Thereby, it is possible to perform IC characteristic inspection at a predetermined temperature while eliminating the influence of heat due to self-heating.

On the other hand, at the time of high temperature inspection in which the characteristic inspection is performed while maintaining the IC at a high temperature, the IC 7 is heated by reducing the cooling capacity of the evaporator 7 and increasing the heating capacity of the first heater 91.
In such temperature control, the control unit 30 controls the operation of the first heater 91 based on the measured temperature result by the first temperature sensor 11, thereby maintaining the IC temperature at a predetermined temperature. Done.
When the characteristic inspection is completed, the measurement robot unit 60 is moved, and the inspected IC placed at the inspection position of the tester 70 is held by the measurement hand 60A. Then, the inspected IC is transported to the recovery shuttle 65. Next, the collection hand 66 is moved by the collection robot unit 67, and the inspected IC is conveyed from the collection shuttle 65 to the inspected IC tray 68. At this time, the inspected ICs are classified into different inspected IC trays 68 according to the inspection result and conveyed.

The IC characteristic inspection is completed through the above process.
As mentioned above, although the temperature control apparatus and handler apparatus of the electronic component of this invention were demonstrated based on embodiment of illustration, this invention is not limited to these.
For example, in the temperature control device and the handler device for electronic parts of the present invention, the configuration of each part can be replaced with any configuration that exhibits the same function, and any configuration can be added. .

Further, for example, the electronic component temperature control apparatus of the present invention may be combined with any one of the arbitrary configurations of the first and second embodiments.
In the handler device of the present invention, the compressor 1 and the condenser 2 may be accommodated in the apparatus main body 200.

It is a schematic diagram which shows the structure of 1st Embodiment of the temperature control apparatus of the electronic component of this invention. It is the elements on larger scale of the site | part which contacts an electronic component among the temperature control apparatuses of the electronic component shown in FIG. It is an example of the observation image by the electron microscope of the foam metal material which comprises the heat radiating member with which the temperature control apparatus of the electronic component shown in FIG. FIG. 4 is a partially enlarged image of the observation image shown in FIG. 3. It is a schematic diagram which shows the other structural example of 1st Embodiment of the temperature control apparatus of the electronic component of this invention. It is the elements on larger scale of the site | part which contacts an electronic component among 2nd Embodiment of the temperature control apparatus of the electronic component of this invention. It is a perspective view which shows the structure of embodiment of the handler apparatus of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Compressor 2 ... Condenser 2A ... Condenser fan 3 ... Strainer 4 ... Filter dryer 5 ... Valve 6 ... Expander 7 ... Evaporator 7A ... Bottom 71 ... Radiating member 711 ... ... Particles 712 ... Network structure 713 ... Holes 72 ... Housing 73 ... Holes 8 ... O-ring 81 ... Vacuum suction flow path 9 ... Heat conduction block 9A ... Contact surface 91 ... First heater 10 …… Temperature control device for electronic parts 11 …… First temperature sensor 12 …… Second heater 13 …… Second temperature sensor 14 …… Thermostat 16 …… Heat exchanger 17, 18 …… Piping 25 …… Refrigerant supply source 26 …… Pressure adjusting valve 30 …… Control unit 40 …… Electronic component 60 …… Measurement robot unit 60A …… Measurement hand 61 …… Uninspected IC tray 62 …… Supply robot unit 63 …… Supply hand 64 …… Supply shuttle 65 …… Supply shuttle 66 …… Recovery hand 67 …… Recovery robot section 68 …… Inspected IC tray 70 …… Tester 200 …… Main body 300 …… Handler device

Claims (17)

The electronic component having a flow path through which a refrigerant flows, a heat absorbing portion and a heat radiating portion provided in the middle of the flow path, and the electronic component is directly or indirectly brought into contact with the heat absorbing portion and absorbed by the heat absorbing portion A cooling device that cools the electronic component by exchanging heat of the heat with the refrigerant in the heat radiating portion;
A heating device for heating the electronic component;
A controller that controls the temperature of the electronic component by controlling the operation of the heating device;
An electronic component temperature control device, wherein a heat radiating member made of a metal foam material is installed in the heat radiating portion of the cooling device.   2. The temperature control device for an electronic component according to claim 1, wherein the metal foam material is mainly composed of at least one of Al, Ti, Fe, and Cu.   The temperature control device for an electronic component according to claim 1, wherein at least some of the plurality of holes included in the metal foam material are connected to each other.   The temperature control apparatus for an electronic component according to any one of claims 1 to 3, wherein the foam metal material is configured by a three-dimensional network structure in which particles of metal powder are connected to each other.   The temperature control device for an electronic component according to claim 4, wherein an average particle diameter of the metal powder is 0.5 to 30 μm.   The temperature control device for an electronic component according to any one of claims 1 to 5, wherein a porosity of the metal foam material is 60 to 99.5%.   The temperature control device for an electronic component according to any one of claims 1 to 6, wherein an average diameter of pores included in the metal foam material is 1-1000 µm.   The temperature control device for an electronic component according to any one of claims 1 to 7, wherein the holes included in the metal foam material have a substantially spherical shape.   The temperature control device for an electronic component according to any one of claims 1 to 8, wherein the compressive strength of the metal foam material is 5 MPa or more.   The temperature control device for an electronic component according to any one of claims 1 to 9, wherein a shape of the heat radiating member is a plate shape or a block shape having a surface including the electronic component. The temperature control device for the electronic component further includes a temperature sensor for detecting the temperature of the electronic component,
The said control part controls the temperature of the said electronic component by controlling operation | movement of the said heating apparatus based on the temperature of the said electronic component detected by the said temperature sensor. Electronic component temperature control device. The heat absorbing part is a container that houses the heat radiating member as the heat radiating part and the refrigerant that exchanges heat with the heat radiating member,
The container has a contact surface that directly or indirectly contacts the electronic component on its outer surface and absorbs heat of the electronic component;
The temperature control device for an electronic component according to any one of claims 1 to 11, wherein the heat radiating member is joined to a portion of the inner wall surface of the container corresponding to the contact surface.   The temperature control device for an electronic component according to claim 12, wherein the heat dissipation member is configured such that a porosity on the contact surface side is smaller than a porosity on the side opposite to the contact surface.   The temperature control device for an electronic component according to claim 12 or 13, wherein the heating device is provided so as to be positioned between the container and the electronic component.   The temperature control device for an electronic component according to claim 12 or 13, wherein the heating device is provided on a surface different from the contact surface in the outer surface of the container. The temperature control device for the electronic component further includes a compressor, a condenser, and an expander provided in the middle of the pipe,
The refrigerant according to any one of claims 1 to 15, wherein the refrigerant is sequentially passed through the compressor, the condenser, the expander, and the evaporator to be used for a cooling cycle of compression, condensation, expansion, and evaporation. A temperature control device for an electronic component according to claim 1. A temperature control device for an electronic component according to any one of claims 1 to 16,
A holding device that presses the electronic component against a tester that inspects characteristics of the electronic component while holding the electronic component;
A handler device, wherein the evaporator is incorporated in the holding device.

Images