JP5561320B2 - Electronic component inspection equipment - Google Patents

Description

  The present invention relates to an electronic component inspection apparatus.

  An electronic component such as an IC is inspected for its electrical characteristics by an IC handler or the like, and it is determined whether or not it is a non-defective product based on an inspection result obtained by the inspection. The inspection of the electrical characteristics of the electronic component includes a temperature load test in which the inspection is performed with the electronic component held at a predetermined temperature. Since the temperature load test is an inspection in which an electronic component is inspected under an accurate temperature (temperature load), it is not preferable that the temperature of the electronic component changes due to self-heating based on the inspection during the inspection. Therefore, in the temperature load test, in order to maintain the temperature of the electronic component at an accurate temperature, the IC handler needs to supplement the electronic component with a temperature corresponding to the temperature change due to the self-heating of the electronic component. In recent years, as represented by the CPU of a personal computer, the speed of electronic components has increased, the integration has become finer, and the amount of heat generated by electronic components has been increasing. There is a need for a high level of temperature control technology that enables inspection while maintaining temperature.

  Therefore, a method has been proposed in which the temperature of the electronic component is maintained at an accurate temperature by cooling and heating the electronic component in the inspection (Patent Document 1). In Patent Document 1, the lower surface of the electric heater is coupled to the upper surface of the electronic component, and the lower surface of the heat sink in which the refrigerant circulates is coupled to the upper surface of the heater. As a result, the electronic component is cooled when the refrigerant is circulated through the heat sink and heated when the electric heater generates heat.

  As described above, in order to increase the responsiveness for cooling the electronic component or increase the cooling capacity, it is necessary to always circulate a low-temperature refrigerant through the refrigerant circulation path to keep the heat sink at a low temperature. However, in an IC handler that transports electronic parts to be inspected, a part of the refrigerant circulation path operates at high speed and high frequency as the electronic parts are transported. It used a hose that was durable and hardened when the temperature was low. In other words, hoses such as resin hoses and rubber hoses have a problem that durability is lowered due to hardening and deterioration of flexibility when cooled to low temperatures.

  In view of this, there has been proposed a method of controlling the temperature of the cooling section by controlling the flow of the refrigerant with a metering valve and cooling the cooling section with the heat of vaporization of the refrigerant, which has an effect of not excessively cooling the return pipe (Patent Document). 2). In Patent Document 2, the lower surface of the cooling part cooled by the evaporation heat of the refrigerant is coupled to the upper surface of the electronic component, and the electric heater is coupled to the upper surface of the cooling part. Thereby, the time for cooling the refrigerant in advance is eliminated, and the force for pressing the electronic component is not directly applied to the electric heater. Further, the supply of the refrigerant to the evaporator is controlled by a metering valve so that the temperature of the cooling unit is accurately controlled to a predetermined target temperature. Due to the temperature control of the cooling section, the refrigerant did not flow excessively in the return pipe.

JP 2001-526837 A JP-T-2004-527764

  However, in Patent Document 2, for example, when cooling is started from a state where the cooling is stopped, it is necessary to cause the refrigerant to flow and to evaporate the flowing refrigerant in the cooling unit. For this reason, it takes some time until the cooling section is cooled after flowing the refrigerant, and the cooling of the electronic components is delayed. Further, when heating, the electric heater also heats the cooling part, so that it takes time to heat the electronic component. That is, there is a delay in cooling and heating of the electronic component, and the responsiveness when the electronic component is brought to the target temperature is poor.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component inspection apparatus with high durability and responsiveness.

  The electronic component inspection apparatus of the present invention transports the electronic component gripped on the lower surface of the heat conducting member for placement in the inspection socket, and places the electronic component arranged in the inspection socket on the lower surface of the heat conducting member. An electronic device inspection apparatus that presses and compresses a cooling body disposed so as to be able to contact with and separate from the upper surface of the heat conducting member and a supply refrigerant that is connected to the cooling body and cools the cooling body A refrigerant supply pipe that is supplied from a machine, a refrigerant recovery pipe that is connected to the cooling body and collects the recovered refrigerant consisting of the supplied refrigerant that has evaporated in the cooling body, to the refrigerant compressor, and accompanying the transportation of the electronic components The flexible movable pipe provided in the refrigerant recovery pipe, which is movable, and the recovered refrigerant which is provided in the refrigerant recovery pipe and flows through the movable pipe are heated to a temperature at which the movable pipe is not cured. In order to join the refrigerant collecting heater and a part of the supplied refrigerant to the recovered refrigerant, the movable refrigerant pipe of the refrigerant recovery pipe and the refrigerant compressor are connected to each other and the refrigerant supply pipe. And a first bypass pipe.

  According to the inspection apparatus for electronic parts of the present invention, the temperature of the recovered refrigerant flowing through the movable pipe of the refrigerant recovery pipe that moves along with the conveyance of the part is heated to a temperature at which the movable pipe is not cured by the recovered refrigerant heater. In addition, a first bypass pipe is provided to join a part of the supplied refrigerant to the recovered refrigerant after flowing through the movable pipe. Therefore, with respect to a movable pipe whose durability is deteriorated due to a decrease in flexibility and the like at low temperatures, it is possible to extend the life by circulating a recovered refrigerant at a temperature that does not cause the movable pipe to deteriorate. In addition, when the temperature of the recovered refrigerant is high, the temperature of the recovered refrigerant to be recovered can be lowered and the life of the refrigerant compressor can be increased with respect to the refrigerant compressor that is overheated and has a short life. As a result, it is possible to provide an electronic device inspection apparatus with high durability and responsiveness.

In the electronic component inspection apparatus, it is preferable that the movable pipe is a high-pressure hose that is cured at a low temperature.
According to this electronic component inspection apparatus, since the movable pipe is a flexible high-pressure hose, long-term durability can be maintained even when the electronic component is frequently conveyed. In addition, the hose is cured at a low temperature and the flexibility is lowered and the durability is deteriorated, but the durability can be maintained longer by circulating the recovered refrigerant heated to a temperature at which the hose is not cured.

In the electronic component inspection apparatus, it is preferable that the first bypass pipe is provided with an expander.
According to this electronic component inspection apparatus, the supply refrigerant merged with the recovered refrigerant is easily evaporated by the expander provided in the first bypass pipe, so that the temperature becomes low. Therefore, the refrigerant recovered to a temperature at which the movable pipe is not cured can be efficiently lowered to be recovered by the refrigerant compressor. Moreover, the lifetime of a refrigerant | coolant compressor can be lengthened more by lowering | hanging the temperature of a collection | recovery refrigerant | coolant.

  In order to measure the density of the recovered refrigerant flowing through the movable pipe, the electronic component inspection apparatus includes a refrigerant density sensor provided in the refrigerant recovery pipe and an externally provided in the first bypass pipe. For comparison between a first solenoid valve whose opening degree is adjusted by a control signal, a measured value based on the refrigerant density measured by the refrigerant density sensor, and a first target value based on a predetermined refrigerant density. More preferably, first opening adjusting means for adjusting the opening of the first electromagnetic valve based on the first opening is provided.

  According to this electronic component inspection apparatus, the amount of the supplied refrigerant that flows through the first bypass pipe and merges with the recovered refrigerant is based on the refrigerant density measured by the refrigerant density sensor from the first opening degree adjusting means. It was adjusted by an electromagnetic valve whose opening was adjusted by a control signal based on a measured value (for example, temperature or pressure) and a target value (for example, temperature or pressure) based on the density of the refrigerant. Accordingly, the recovered refrigerant can be efficiently recovered at a low temperature and recovered by the refrigerant compressor.

  In the electronic component inspection apparatus, the refrigerant supply pipe includes a filter dryer and an expander provided after the filter dryer, and the first bypass pipe is the filter dryer of the refrigerant supply pipe. And the inflator is preferably connected.

  According to this electronic component inspection apparatus, the supply refrigerant in a more easily evaporated state flows through the first bypass pipe and merges with the recovered refrigerant. Therefore, the recovered refrigerant can be suitably cooled to be recovered by the refrigerant compressor.

  In this electronic component inspection apparatus, in order to join at least a part of the high-temperature / high-pressure supply refrigerant from the refrigerant compressor to the recovered refrigerant, the high-temperature / high-pressure supply refrigerant from the refrigerant compressor in the refrigerant supply pipe It is desirable to provide a second bypass pipe between the circulating position and the movable pipe of the refrigerant recovery pipe and the refrigerant compressor.

  According to the electronic component inspection apparatus, at least a part of the high-temperature and high-pressure supply refrigerant is joined to the recovered refrigerant. Therefore, the refrigerant compressor is already mixed with the high-pressure and high-pressure supply refrigerant with a small compression burden in the recovered refrigerant, so that the load for compressing the recovered refrigerant is reduced and the life is extended. Further, it is possible to suppress the supply refrigerant supplied to the cooling body from being reduced, the cooling capacity of the cooling body from being lowered, and the recovered refrigerant flowing through the movable pipe from reaching a temperature at which the movable pipe is cured. As a result, it is possible to provide an electronic device inspection apparatus with high durability and responsiveness.

  The electronic component inspection apparatus includes a second solenoid valve provided in the second bypass pipe, the opening of which is adjusted by an external control signal, and a measurement based on the refrigerant density measured by the refrigerant density sensor. More preferably, a second opening degree adjusting means for adjusting the opening degree of the second solenoid valve based on a comparison between the value and a second target value based on a predetermined refrigerant density is provided. .

  According to this electronic component inspection apparatus, the amount of the supply refrigerant that flows through the second bypass and merges with the recovered refrigerant is measured based on the refrigerant density measured by the refrigerant density sensor from the second opening adjustment means. It adjusts with the solenoid valve by which the opening degree was adjusted with the control signal based on the 2nd target value based on the value and the density of a refrigerant | coolant. Therefore, the amount of the high-temperature and high-pressure supply refrigerant mixed with the recovered refrigerant can be suitably adjusted. In addition, the supply refrigerant supplied to the cooling body can be increased or decreased more flexibly, that is, the cooling capacity of the cooling body can be changed flexibly so that the recovered refrigerant flowing through the movable pipe does not reach a temperature at which the movable pipe is cured. It can suppress suitably.

The top view which shows the whole structure of the IC handler in this embodiment. It is sectional drawing which shows the cross-section of the measurement hand in this embodiment, Comprising: (a) is a figure which shows the state which has isolate | separated the evaporator from the heat conductive block, (b) is an evaporator contacted with the heat conductive block. The figure which shows the state. Explanatory drawing explaining the structure of the cooling cycle apparatus in this embodiment. The block diagram which shows the electrical structure regarding the temperature control of the measurement hand in this embodiment. The flowchart figure which shows the temperature control of the electronic component in this embodiment.

Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing the IC handler 10.
The IC handler 10 includes a base 11, a safety cover 12, a high temperature chamber 13, a supply robot 14, a collection robot 15, a first shuttle 16, a second shuttle 17, and a plurality of conveyors C1 to C6.

  The base 11 has the above elements mounted on the upper surface thereof. The safety cover 12 surrounds a large area of the base 11, and the supply robot 14, the recovery robot 15, the first shuttle 16, and the second shuttle 17 are accommodated therein.

  The plurality of conveyors C <b> 1 to C <b> 6 are provided on the base 11 such that one end thereof is located outside the safety cover 12 and the other end is located inside the safety cover 12. Each of the conveyors C1 to C6 conveys a tray 18 containing a plurality of IC chips T such as electronic components from the outside of the safety cover 12 to the inside of the safety cover 12, and conversely, the tray 18 is moved to the inside of the safety cover 12. To the outside of the safety cover 12.

  The supply robot 14 includes an X-axis frame FX, a first Y-axis frame FY1, and a supply-side robot hand unit 20. The collection robot 15 includes the X-axis frame FX, the second Y-axis frame FY2, and the collection-side robot hand unit 21. The X-axis frame FX is disposed in the X direction. The first Y-axis frame FY1 and the second Y-axis frame FY2 are arranged to be parallel to each other along the Y direction, and are supported so as to be movable in the X direction with respect to the X-axis frame FX. . The first Y-axis frame FY1 and the second Y-axis frame FY2 are reciprocated in the X direction along the X-axis frame FX by respective motors (not shown) provided on the X-axis frame FX.

  On the lower side of the first Y-axis frame FY1, the supply-side robot hand unit 20 is supported so as to be movable in the Y direction. The supply-side robot hand unit 20 reciprocates in the Y direction along the first Y-axis frame FY1 by respective motors (not shown) provided on the first Y-axis frame FY1. Then, the supply-side robot hand unit 20 supplies, for example, the IC chip T before inspection accommodated in the tray 18 of the conveyor C1 to the first shuttle 16, for example.

  A collection-side robot hand unit 21 is supported below the second Y-axis frame FY2 so as to be movable in the Y direction. The collection-side robot hand unit 21 reciprocates in the Y direction along the second Y-axis frame FY2 by respective motors (not shown) provided on the second Y-axis frame FY2. Then, the collection-side robot hand unit 21 supplies, for example, the inspected IC chip T supplied to the first shuttle 16 to, for example, the tray 18 of the conveyor C6.

  On the upper surface of the base 11, between the supply robot 14 and the collection robot 15, a first rail 24A and a second rail 24B are respectively disposed in parallel with the X-axis direction. The first rail 24A is provided with a first shuttle 16 that can reciprocate in the X-axis direction. The second rail 24B is provided with a second shuttle 17 that can reciprocate in the X-axis direction.

  The first shuttle 16 includes a substantially plate-like base member 16A that is long in the X-axis direction, and is in sliding contact with the first rail 24A by a rail receiver (not shown) on the bottom surface thereof. Then, it is reciprocated along the first rail 24 </ b> A by a motor (not shown) provided in the first shuttle 16. Change kits 25 and 27 are fixed to both ends of the upper surface of the base member 16A in a replaceable manner with screws or the like, so that the IC chips T are held in the pockets 26 of the change kits 25 and 27, respectively.

  The second shuttle 17 includes a substantially plate-like base member 17A that is long in the X-axis direction, and is in sliding contact with the second rail 24B by a rail receiver (not shown) on the bottom surface. Then, it is reciprocated along the second rail 24 </ b> B by a motor (not shown) provided in the second shuttle 17. Change kits 25 and 27 are fixed to both ends of the upper surface of the base member 17A in a replaceable manner with screws or the like, so that the IC chips T are held in the pockets 26 of the change kits 25 and 27, respectively.

  An inspection socket 23 is provided on the upper surface of the base 11 and between the first and second shuttles 16 and 17. Each inspection socket 23 is fitted with an IC chip T accommodated in a pocket 26.

  Above the first and second shuttles 16 and 17 and the inspection socket 23, the IC chip T is transported between the shuttles 16 and 17 and the inspection socket 23, and the measurement is movable in the Y direction. A robot 22 is provided.

  As shown in FIG. 2, a measurement hand 22 </ b> A is held below the measurement robot 22 so as to be movable up and down with respect to the measurement robot 22. The measurement hand 22 </ b> A sucks and holds the IC chip T on the bottom surface thereof, and is moved downward relative to the measurement robot 22 to press the IC chip T against the inspection socket 23.

  More specifically, the IC chip T supplied by each of the shuttles 16 and 17 is acquired by the measuring hand 22A of the measuring robot 22 and is arranged at a position immediately above the inspection socket 23. Thereafter, the IC chip T is fitted into the inspection socket 23 by the downward movement of the measuring robot 22. The IC chip T fitted in the inspection socket 23 is further moved downward by the downward movement of the measuring hand 22A, and each connection terminal of the IC chip T comes into contact with the contact terminal of the inspection socket 23 from above, and the spring. The test socket 23 is mounted by pushing the pin downward.

  The IC chip T mounted in the inspection socket 23 is subjected to electrical inspection. When the inspection is completed, the IC chip T mounted on the inspection socket 23 is moved upward by the upward movement of the measuring hand 22A, and is extracted from the inspection socket 23 by the measuring robot 22 and is then changed on the collection side. 27 are arranged directly above the corresponding pockets 26. Thereafter, the IC chip T is moved downward by the measurement robot 22 and is accommodated in the pocket 26 of the corresponding change kit 27 on the collection side. These operations are repeated until the IC chip T supplied by the shuttles 16 and 17 runs out.

  As shown in FIGS. 2A and 2B, the measurement hand 22 </ b> A includes a substantially disk-shaped upper frame 30 on the upper part thereof. The upper frame 30 is connected and held at the top (below the tip) of a pressing device (not shown) provided at the bottom of the measurement robot 22. Accordingly, when the tip of the pressing device extends downward, the upper frame 30 is moved downward relative to the measurement robot 22. In the center of the upper frame 30, a communication hole 30A penetrating from the upper surface to the lower surface is formed.

  On the lower surface of the upper frame 30, a plurality of, for example, three cylinder chambers 30B having openings below are recessed (only one is shown in FIG. 2). Each of the pressure pistons 31 is housed so as to be slidable in the vertical direction of the cylinder chamber 30B.

  The pressing piston 31 has a convex pressing portion 31A on the distal end side (lower portion in the drawing), and has a flat pressure receiving surface on the proximal end side (upper portion in the drawing) opposite to the pressing portion 31A. ing. As shown in FIG. 2A, when the pressing piston 31 is stored in the cylinder chamber 30 </ b> B, the pressing portion 31 </ b> A does not protrude from the lower surface of the upper frame 30. On the other hand, as shown in FIG. 2 (b), when the pressure receiving surface is pressed and moved below the cylinder chamber 30 </ b> B, the pressing piston 31 protrudes from the lower surface of the upper frame 30. Yes.

  An airtight packing 31 </ b> B is fitted in a recess formed in the outer peripheral surface of the pressing piston 31. The airtight packing 31B is configured to be slidable in the vertical direction together with the pressing piston 31 along the inner peripheral surface of the cylinder chamber 30B while maintaining airtightness between the inner peripheral surface of the cylinder chamber 30B and the pressing piston 31.

  An air supply hole 30 </ b> C communicating with the cylinder chamber 30 </ b> B is formed on the upper surface of the upper frame 30. The tip of an air supply pipe 32A is tightly connected to the air supply hole 30C via a joint 32. The cylinder chamber 30B is supplied with compressed air from the outside through the air supply pipe 32A.

  As shown in FIG. 3, the proximal end of the air supply pipe 32A is connected to the air pressure source AR1 through the electromagnetic valve V1 and the dryer AR2. When the electromagnetic valve V1 is opened, the electromagnetic valve V1 supplies the second pneumatic compressed air to the supply pipe 32A, and when the electromagnetic valve V1 is closed, the second pneumatic compressed air supplied to the supply pipe 32A is released to the atmosphere. It is like that.

  Therefore, when the solenoid valve V1 is closed and the compressed air of the second air pressure is supplied from the supply pipe 32A to the proximal end side of the cylinder chamber 30B, the pressure piston 31 has a pressure receiving surface of the compressed piston 31 that 2 is pressed downward by the air pressure. The pressing piston 31 slides downward on the inner peripheral surface of the cylinder chamber 30 </ b> B so that the pressing portion 31 </ b> A protrudes from the lower surface of the upper frame 30. In this embodiment, when the compressed air is supplied, the pressing piston 31 is a piston that protrudes at a high speed from the pressing portion 31A, for example, a tapping piston.

  A cylindrical heat insulating cylinder 33 having an outer periphery substantially the same size as the outer periphery of the upper frame 30 is fixed to the lower surface of the upper frame 30. In the heat insulating cylinder 33, a substantially cylindrical evaporator 35 as a cooling body is fitted so as to be slidable in the vertical direction. The evaporator 35 is formed so that the length in the vertical direction is shorter than the length in the vertical direction of the heat insulating cylinder 33, and slides between the upper end surface and the lower end surface of the heat insulating cylinder 33 inside the heat insulating cylinder 33. It can be moved.

  A recess is formed on the inner side surface of the heat insulating cylinder 33, and a packing 33B is fitted into the formed recess. The packing 33B blocks the flow of air above and below the evaporator 35 with the position of the side surface of the evaporator 35 in contact with the packing 33B as a boundary, and the side surface of the evaporator 35 is slidable.

A convex portion 35 </ b> A that penetrates the communication hole 30 </ b> A of the upper frame 30 and protrudes from the upper surface of the upper frame 30 is formed on the upper portion of the evaporator 35.
An air supply hole 33 </ b> C penetrating between the upper surface and the lower surface is formed on one side wall of the heat insulating cylinder 33. The lower end of the air supply hole 33 </ b> C extends to the inner side surface of the heat insulating cylinder 33. An upper end of the air supply hole 33 </ b> C is connected to an air supply hole 30 </ b> D formed in the upper frame 30. The air supply hole 30 </ b> D is formed so as to penetrate from the upper surface to the lower surface of the upper frame 30.

  A tip of an air supply pipe 36A is tightly connected to the air supply hole 30D via a joint 36, and compressed air is supplied from the outside through the air supply pipe 36A. The proximal end of the air supply pipe 36A is connected to the air pressure source AR1 via the pneumatic regulator AR4 and the dryer AR2. The air pressure regulator AR4 is a device that maintains the air pressure at its output end at a predetermined constant pressure. In this embodiment, the air pressure regulator AR4 receives a constant first air pressure from the output end of the air pressure regulator AR4. The air supply pipe 36A (air supply hole 33C) is always supplied.

  A heat conduction block 37 constituting a heat conduction member formed in a substantially disk shape having substantially the same size as the outer periphery of the heat insulation cylinder 33 is airtightly fixed to the lower surface of the heat insulation cylinder 33. The heat conduction block 37 is made of a metal having good heat conductivity, for example, copper.

  A heat conduction maintaining member 38 is provided on the upper surface of the heat conduction block 37 and facing the evaporator 35. The heat conduction maintaining member 38 is made of a very thin heat conductive material, for example, a thermosetting resin, heat conductive grease, silicon oil, or the like. The heat conduction maintaining member 38 is used to improve the heat conduction between the evaporator 35 and the heat conduction block 37 by reducing the air layer serving as the heat resistance between the evaporator 35 and the heat conduction block 37. Therefore, the thickness is set according to the flatness and surface roughness of each surface that the evaporator 35 and the heat conduction block 37 face each other. In the present embodiment, the thickness of the heat conduction maintaining member 38 is 100 μm.

  In other words, the evaporator 35 is constantly supplied with compressed air of a constant first air pressure from the air supply hole 33 </ b> C between its lower surface and the heat conduction maintaining member 38. The evaporator 35 slides on the inner peripheral surface of the heat insulating cylinder 33 by the first air pressure of the compressed air received on the lower surface thereof, that is, the bottom surface that is the surface facing the heat conduction maintaining member 38. The upper surface of the evaporator 35 moves to a position where it contacts the upper end surface of the heat insulating cylinder 33, that is, the lower surface of the upper frame 30. In the present embodiment, when the evaporator 35 moves to a position in contact with the upper frame 30, the bottom surface of the evaporator 35 and the heat conduction maintaining member 38 are separated by 600 μm, that is, a 600 μm air layer is formed. It has come to be.

  By the way, the first air pressure of the compressed air supplied by the pneumatic regulator AR4 has a force to push up the evaporator 35 based on the first air pressure, and the pressure piston 31 to which the compressed air of the second air pressure is supplied evaporates. It is set to be smaller than the force that presses the container 35 downward.

  The evaporator 35 is supplied with compressed air of the second air pressure to the pressing piston 31, and the upper surface is pressed by the pressing piston 31 to move downward. The evaporator 35 is moved to a position where the bottom surface of the evaporator 35 is in contact with the heat conduction maintaining member 38. The bottom surface of the evaporator 35 in contact with the heat conduction maintaining member 38 is configured to suitably conduct the heat of the evaporator 35 to the heat conduction block 37 by the heat conduction maintaining member 38.

  An electric heater H <b> 1 is closely fixed to the center position of the lower surface of the heat conduction block 37. The electric heater H1 generates heat when electric power is applied, and is formed of, for example, an alumina heater, an aluminum nitride heater, a silicon nitride heater, a silicon carbide heater, a boron nitride heater, or the like.

  On the lower surfaces of the heat conduction block 37 and the electric heater H1, an object block 40 constituting a heat conduction member formed in a disk shape having substantially the same outer periphery as the outer periphery of the heat conduction block 37 is fixedly fixed. The objective block 40 is in direct contact with the upper surface of the IC chip T to be inspected. Similar to the heat conduction block 37, the objective block 40 is made of a metal having good heat conductivity, for example, copper. The objective block 40 receives a pressing force from the measuring hand 22A to the IC chip T and prevents the pressing force from the measuring hand 22A to the IC chip T from being directly applied to the electric heater H1, so that the objective block 40 is applied to the joint portion of the electric heater H1. The internal crack is prevented from occurring and the electric heater H1 is prevented from being damaged.

  The bottom surface of the objective block 40 is provided with a plurality of vacuum suction pads (not shown) for sucking and holding the IC chip T on the objective block 40. The IC chip T is sucked and held on the measurement hand 22A, that is, the lower surface of the measurement robot 22, by a vacuum suction pad.

Next, the cooling cycle apparatus will be described with reference to FIG.
As shown in FIG. 3, a refrigerant supply pipe 48 and a refrigerant recovery pipe 49 are connected to the evaporator 35 at the upper part of the projection 35 </ b> A.

  The refrigerant supply pipe 48 supplies the evaporator 35 with the refrigerant (supplied refrigerant Ms) that has passed through the condenser 52, the liquid receiver 54, the filter dryer 55, and the expander 56 in order from the refrigerant compressor 51. That is, the evaporator 35 is supplied from the refrigerant supply pipe 48 with the supply refrigerant Ms in which the low-pressure liquid and the vapor are mixed in the expander 56.

  The refrigerant compressor 51 supplies the refrigerant to the condenser 52 as a high-temperature and high-pressure steam supply refrigerant Ms. The condenser 52 condenses the high-temperature high-pressure steam supply refrigerant Ms supplied from the refrigerant compressor 51 into a normal-temperature high-pressure liquid. The liquid receiver (strainer) 54 is disposed after the condenser 52 and temporarily stores the liquid of the supply refrigerant Ms liquefied by the condenser 52, and absorbs the change in the refrigerant amount in the evaporator 35. Thus, this is a container for reducing the influence on the operation of the condenser 52 and the like.

  The filter dryer 55 removes the moisture contained in the supplied refrigerant Ms and prevents the moisture contained in the supplied refrigerant Ms from freezing and closing the narrow holes of the capillary tube that forms the expander 56. As a result, moisture is frozen in the expander 56, and the flow of the supply refrigerant Ms in the expander 56 is prevented from stagnation. For the filter dryer 55, a moisture adsorbent for removing moisture contained in a refrigerant that does not dissolve water, such as Freon, for example, a desiccant such as silica gel, soba beads, molecular sheep, or the like is used. The expander 56 changes the supply refrigerant Ms to a supply refrigerant Ms (mixed refrigerant) that is a fluid in which a low-pressure liquid and gas are mixed. Then, the mixed refrigerant (supply refrigerant Ms) from the expander 56 is supplied to the evaporator 35. The evaporator 35 evaporates the mixed refrigerant (supplied refrigerant Ms) supplied therein and is cooled by the heat of vaporization accompanying the evaporation of the mixed refrigerant.

  By the way, when inspecting a high heat IC chip T, a large cooling capacity is required to quickly cool the IC chip T in response to a drastic temperature change of the IC chip T, and the temperature of the evaporator 35 is set to the IC chip temperature. It is necessary to make the temperature much lower than that for inspecting T, for example, 100 degrees or more lower than the temperature for inspecting IC chip T.

  For example, the thermal resistance between the internal temperature of the IC chip T and the surface temperature of the IC chip T is about 0.1 to 0.3 degrees / W. In addition, between the lower surface temperature of the objective block 40 and the surface temperature of the IC chip T of the measuring hand 22A that is inspected by pressing the IC chip T against the inspection socket 23, a microscopic air layer is formed due to the contact state of the contact surface. In the case where the thermal resistance is large, the thermal resistance is about 0.2 degrees / W. That is, the maximum thermal resistance between the internal temperature of the IC chip T and the lower surface temperature of the objective block 40 is 0.5 degrees / W. In order to maintain the internal temperature of the IC chip T when the IC chip T generates heat of 200 W under such conditions, the lower surface temperature for cooling the IC chip T is 100 degrees (= 200W × 0.5 degree / W) needs to be low. For example, when it is desired to maintain the internal temperature of the IC chip T that generates 200 W of heat at 80 degrees, the lower surface temperature for cooling the IC chip T needs to be minus 20 degrees.

On the other hand, the refrigerant recovery pipe 49 includes a hand side pipe 49A, a hose pipe 49B, and a base side pipe 49C.
The hand side pipe 49 </ b> A is formed of a material having rigidity, and the base end thereof is connected to the evaporator 35. That is, the hand side piping 49A moves with the movement of the measuring robot 22 that moves the evaporator 35 and the measuring hand 22A. The recovered refrigerant heater H2 is fixed to the hand side pipe 49A.

  The recovered refrigerant heater H2 is located at a predetermined distance from the evaporator 35 of the hand side pipe 49A, for example, by a distance at which the heat of the hand side pipe 49A heated by the recovered refrigerant heater H2 is not substantially transmitted to the evaporator 35. Is provided. The recovered refrigerant heater H2 includes a nichrome wire heater, a cartridge heater, a silicon rubber heater, a sheathed heater, a ceramic heater, and the like. The recovered refrigerant heater H2 can raise the temperature by heating the recovered refrigerant Mr by the generated heat, and can set the temperature to, for example, a dew point or higher. For example, if the temperature around the IC handler 10 is 20 ° C. and the humidity is 50%, the dew point is 9.3 ° C. However, the recovered refrigerant heater H2 increases the temperature of the recovered refrigerant Mr. Condensation is prevented at temperatures above the dew point (9.3 degrees). Further, for example, the recovered refrigerant heater H2 can heat the recovered refrigerant Mr and prevent the refrigerant recovery pipe 49 from becoming a temperature below the freezing point and generating frost.

  A thermostat TM1 is attached to the recovered refrigerant heater H2. The thermostat TM1 forcibly cuts off the supply of power when the recovered refrigerant heater H2 reaches a predetermined temperature or higher, thereby preventing the recovered refrigerant heater H2 from exceeding a predetermined temperature. In addition, a heater temperature sensor TM2 as a refrigerant density sensor for measuring the density of the refrigerant (recovered refrigerant Mr) per unit volume is attached to the recovered refrigerant heater H2.

A hose pipe 49B is connected to the tip of the hand side pipe 49A.
The hose pipe 49B is a high-pressure hose formed of a flexible or flexible member, for example, a high-pressure resin hose or a high-pressure rubber hose, and these high-pressure hoses have a property of curing at a low temperature, for example, below freezing point. Yes. A base side pipe 49C is connected to the tip of the hose pipe 49B.

  The base side piping 49C is formed of a material having rigidity, and is relatively fixed to the base 11. That is, the hose pipe 49B absorbs the displacement of the relative position between the hand side pipe 49A and the base side pipe 49C caused by the movement of the measurement robot 22 or the measurement hand 22A due to its flexibility, and the base side 49A The circulation of the recovered refrigerant Mr to the side pipe 49C is ensured.

The tip of the base side pipe 49 </ b> C is connected to the refrigerant compressor 51 via the accumulator 58.
The accumulator 58 is a liquid separator that separates the liquid component of the refrigerant that has not been completely evaporated by the evaporator 35 contained in the recovered refrigerant Mr. The accumulator 58 removes the liquid content of the refrigerant from the recovered refrigerant Mr, thereby preventing the refrigerant compressor 51 from sucking the liquid and damaging the valve, the valve lid, and the like.

  That is, the recovered refrigerant Mr is warmed by the recovered refrigerant heater H2 and then circulated to the base side pipe 49C via the hose pipe 49B and is recovered to the refrigerant compressor 51 via the accumulator 58. The hose pipe 49B is prevented from being cured at a low temperature by the heated recovered refrigerant Mr, and the durability is improved by thinning or eliminating a heat insulating material that prevents dew condensation. As a result, it is possible to constantly flow the recovered refrigerant Mr through the refrigerant recovery pipe 49, and the cooling delay of the evaporator 35 can be shortened.

  By performing the cooling by evaporating the refrigerant, the evaporator 35 can be cooled in a short time, for example, about 2 minutes, when an electrical inspection of the IC chip T is performed. By the way, as a method of cooling the IC chip T, a method of cooling the IC chip T with a cooling liquid is also known. However, when the cooling liquid is used, the cooling liquid more than flowing through the path of the cooling system device is stored in the tank. It is necessary to cool the tank coolant to a predetermined temperature. The temperature is, for example, a temperature of 0 ° C. or less when the IC chip T that generates significant heat is cooled, and the time for cooling the coolant before the electrical inspection of the IC chip T is performed, for example, 1 It took more than an hour.

  Further, the cooling cycle device is provided with a first bypass pipe 59 branched from the output side pipe of the filter dryer 55 and connected to the base side pipe 49C in front of the accumulator 58. The first bypass pipe 59 mixes a part of the supplied refrigerant Ms that has passed through the filter dryer 55 with the collected refrigerant Mr before the accumulator 58.

  The first bypass pipe 59 is provided with an inflator 67 before being connected to the base side pipe 49C. The expander 67 has a capillary tube as an expander. The supply refrigerant Ms guided from the output side of the filter dryer 55 to the first bypass pipe 59 is mixed with the low-pressure liquid and the vapor (mixed). Refrigerant). That is, the first bypass pipe 59 is configured such that the supply refrigerant Ms is mixed in the expander 67 and mixed with the recovered refrigerant Mr in the base side pipe 49C.

  The mixed refrigerant mixed with the recovered refrigerant Mr from the first bypass pipe 59 is vaporized by the accumulator 58 to cool the recovered refrigerant Mr whose temperature has risen due to the heating of the recovered refrigerant heater H2. The temperature of the recovered refrigerant Mr is lowered by the cooling of the supplied refrigerant Ms, so that the temperature rise of the refrigerant compressor 51 that makes the recovered refrigerant Mr the supply refrigerant Ms of high-temperature and high-pressure steam is suppressed, and the life of the refrigerant compressor 51 is shortened. Can be long.

  Further, the cooling cycle apparatus includes a hot gas bypass as a second bypass pipe that is branched from the refrigerant supply pipe 48 closer to the refrigerant compressor 51 than the condenser 52 and connected to the base side pipe 49C before the accumulator 58. A pipe 68 is provided. The hot gas bypass pipe 68 mixes all or part of the high-temperature and high-pressure steam supply refrigerant Ms output from the refrigerant compressor 51 with the recovered refrigerant Mr before the accumulator 58. The hot gas bypass pipe 68 is provided with a hot gas solenoid valve V2 as a second solenoid valve before being connected to the refrigerant recovery pipe 49. The opening degree of the hot gas solenoid valve V2 is adjusted based on a control signal from the outside, and the supply refrigerant Ms of high-temperature and high-pressure steam is recovered by the base side pipe 49C according to the opening degree of the hot gas solenoid valve V2. The amount mixed with the refrigerant Mr is adjusted. That is, the hot gas bypass pipe 68 mixes the supply refrigerant Ms of high-temperature and high-pressure steam with the recovered refrigerant Mr of the base-side pipe 49C based on the opening degree of the hot gas solenoid valve V2.

  By mixing the high-temperature and high-pressure steam supply refrigerant Ms with the recovered refrigerant Mr through the hot gas bypass pipe 68, the flow rate of the supply refrigerant Ms supplied to the evaporator 35 side is reduced, and the cooling capacity of the evaporator 35 is lowered. Can be made. Since the supply refrigerant Ms supplied through the hot gas bypass pipe 68 is a high-temperature and high-pressure steam, even if it is supplied to the refrigerant compressor 51, the load on the refrigerant compressor 51 is not increased. Further, by controlling the amount of the supply refrigerant Ms flowing through the hot gas bypass pipe 68, the flow rate of the supply refrigerant Ms flowing through the evaporator 35 can be adjusted, and the cooling capacity of the evaporator 35 can be controlled. Thereby, the cooling capacity of the evaporator 35 can be adjusted appropriately, and the recovered refrigerant Mr flowing through the refrigerant recovery pipe 49 can be prevented from becoming extremely cold.

Next, an electrical configuration relating to temperature adjustment of the measurement hand 22A of the IC handler 10 configured as described above will be described with reference to FIG.
As shown in FIG. 4, the IC handler 10 includes a control device 60 as second opening degree adjusting means.

  The control device 60 includes a CPU (Central Processing Unit), ROM, and RAM. The CPU of the control device 60 executes various processes according to various data and various control programs stored in the ROM and RAM. In this embodiment, the temperature of the electronic component is controlled based on various data stored in the ROM or RAM, various control programs, and predetermined conditions, that is, the electronic component cooling process by the evaporator 35 or the electric heater H1. The electronic component heating process, the opening adjustment of the hot gas solenoid valve V2 and the like are performed based on the temperature of the recovered refrigerant Mr.

  The control device 60 is electrically connected to the electric heater drive circuit 61. The electric heater drive circuit 61 supplies the drive current Ih1 generated based on the electric heater control signal Sh1 input from the control device 60 to the electric heater H1 to drive and control the electric heater H1.

  The control device 60 is electrically connected to the recovered refrigerant heater drive circuit 62. Whether or not the recovered refrigerant heater drive circuit 62 is driven based on the recovered refrigerant heater control signal Sh2 input from the control device 60 is controlled.

  The recovered refrigerant heater drive circuit 62 is provided with a temperature controller 62C. The temperature controller 62C executes various processes according to a temperature control program stored in advance and a heating reference temperature stored in advance. The recovered refrigerant heater drive circuit 62 is electrically connected to the recovered refrigerant heater H2 and the heater temperature sensor TM2.

  That is, the temperature controller 62C calculates the recovered refrigerant temperature as a measurement value based on the density of the refrigerant based on the temperature signal Stm2 detected by the heater temperature sensor TM2, and the difference between the recovered refrigerant temperature and the heating reference temperature Is output, and the recovered refrigerant heater H2 is driven and controlled by the drive current Ih2. As a result, the recovered refrigerant heater drive circuit 62 quickly drives and controls the recovered refrigerant heater H2 based on the recovered refrigerant temperature.

  More specifically, when the recovered refrigerant temperature is lower than the heating reference temperature, the temperature controller 62C heats the hand side pipe 49A of the refrigerant recovery pipe 49 by flowing a predetermined drive current Ih2 through the recovered refrigerant heater H2. On the other hand, when the recovered refrigerant temperature is higher than the heating reference temperature, the hand side pipe 49A of the refrigerant recovery pipe 49 is not heated by preventing the drive current Ih2 from flowing through the recovered refrigerant heater H2.

  Further, the recovered refrigerant heater drive circuit 62 inputs a temperature signal Stm2 detected by the heater temperature sensor TM2 to the control device 60. The control device 60 calculates the recovered refrigerant temperature as a measurement value based on the density of the refrigerant based on the input temperature signal Stm2.

  The control device 60 is electrically connected to the refrigerant solenoid valve drive circuit 63. The refrigerant solenoid valve drive circuit 63 drives and controls the hot gas solenoid valve V2 based on the refrigerant solenoid valve control signal Sv2 input from the controller 60.

  The control device 60 is electrically connected to the gas solenoid valve drive circuit 64. The gas solenoid valve drive circuit 64 drives and controls the solenoid valve V <b> 1 based on the gas solenoid valve control signal Sv <b> 1 input from the control device 60.

  The control device 60 is electrically connected to the input / output device 65. The control device 60 receives various data DT and the like for the IC handler 10 to inspect the IC chip T from the input / output device 65 and stores them in the RAM. In addition, the control device 60 outputs display signals Sd indicating various states of the IC handler 10 to the input / output device 65. Based on the display signal Sd, the input / output device 65 causes the display device 66 to display the various states of the IC handler 10 to the outside.

Next, in the IC handler 10 configured as described above, the procedure of the temperature control process of the recovered refrigerant Mr in the cooling cycle device will be described with reference to the flowchart shown in FIG.
Note that the refrigerant compressor 51 always supplies the supplied refrigerant Ms to the cooling cycle circuit. It is assumed that an address for storing a second target temperature value as a second target value based on the refrigerant density is secured and a predetermined value is stored in the RAM memory. The second target temperature is a temperature lower than the heating reference temperature, and is a temperature for determining whether or not to raise the temperature of the recovered refrigerant Mr compared to the recovered refrigerant temperature.

  Now, the IC handler 10 is inspecting the electrical characteristics of the IC chip T, and the hose pipe 49B is moved at a high speed as the measurement robot 22 and the measurement hand 22A are transported at high speed. It is bent frequently. The evaporator 35 sequentially performs temperature control for causing the IC chip to follow the inspection temperature. Therefore, when the evaporator 35 is in contact with the heat conduction block 37 and cools the IC chip T, the evaporator 35 is warmed by heat from the IC chip T, and the temperature of the recovered refrigerant Mr recovered from the evaporator 35. Will be higher. On the contrary, when the evaporator 35 is separated from the heat conduction block 37, the evaporator 35 is at a low temperature when cooled by the evaporation of the supplied refrigerant Ms, and the temperature of the recovered refrigerant Mr recovered from the evaporator 35. Is cold.

  Then, the IC handler 10 recovers at predetermined intervals determined based on the response characteristics of the cooling cycle device in order to maintain the temperature of the recovered refrigerant Mr flowing through the hose pipe 49B at a temperature equal to or higher than the second target temperature. A temperature control step of the refrigerant Mr is performed.

In the temperature control process, the control device 60 calculates the temperature of the recovered refrigerant Mr based on the temperature signal Stm2 of the heater temperature sensor TM2 (step S1).
When the temperature of the recovered refrigerant Mr is calculated, the control device 60 determines whether or not the temperature of the recovered refrigerant Mr is equal to or lower than the second target temperature (step S2).

When the temperature of the recovered refrigerant Mr is equal to or lower than the second target temperature (YES in step S2), the control device 60 performs a process of heating the recovered refrigerant Mr.
In the process of heating the recovered refrigerant Mr, the control device 60 determines whether the hot gas solenoid valve V2 that is the refrigerant solenoid valve is closed based on the refrigerant solenoid valve control signal Sv2 (step S3).

  When the hot gas solenoid valve V2 is closed (YES in step S3), the control device 60 outputs the refrigerant solenoid valve control signal Sv2 for opening the hot gas solenoid valve V2 to the refrigerant solenoid valve drive circuit 63 to perform hot processing. The gas solenoid valve V2 is opened (step S4). As a result, the hot gas solenoid valve V2 is opened, and a part of the high-temperature and high-pressure steam supply refrigerant Ms is supplied to the accumulator 58 through the hot gas bypass pipe 68. When a part of the supply refrigerant Ms passes through the hot gas bypass pipe 68, the supply refrigerant Ms supplied to the evaporator 35 is reduced, the cooling capacity of the evaporator 35 is reduced, and the recovered refrigerant Mr from the evaporator 35 is reduced. The temperature is raised. And the control apparatus 60 complete | finishes the temperature control process of the collection | recovery refrigerant | coolant Mr ..

On the other hand, when the hot gas solenoid valve V2 is not closed (NO in step S3), the control device 60 ends the temperature control process of the recovered refrigerant Mr.
When the temperature of the recovered refrigerant Mr is not less than or equal to the second target temperature (NO in step S2), the control device 60 performs a process of not heating the recovered refrigerant Mr.

In the step of not heating the recovered refrigerant Mr, the control device 60 determines whether or not the hot gas electromagnetic valve V2 is open based on the refrigerant electromagnetic valve control signal Sv2 (step S5).
When the hot gas solenoid valve V2 is open (YES in step S5), the control device 60 outputs the refrigerant solenoid valve control signal Sv2 that closes the hot gas solenoid valve V2 to the refrigerant solenoid valve drive circuit 63 to generate hot gas. The solenoid valve V2 is closed (step S6). Thereby, the hot gas solenoid valve V2 is closed, the amount of the supply refrigerant Ms supplied to the evaporator 35 is increased, the cooling capacity of the evaporator 35 is increased, and the temperature of the recovered refrigerant Mr from the evaporator 35 is increased. Be lowered. And the control apparatus 60 complete | finishes the temperature control process of the collection | recovery refrigerant | coolant Mr ..

On the other hand, when hot gas solenoid valve V2 is not open (NO in step S5), control device 60 ends the temperature control process of recovered refrigerant Mr.
Next, the effect of this embodiment is described below.

  (1) According to the present embodiment, the temperature of the recovered refrigerant Mr flowing in the hose pipe 49B that moves along with the conveyance of the IC chip T is heated to a temperature at which the hose pipe 49B is not cured by the recovered refrigerant heater H2. In addition, a first bypass pipe 59 was provided, and a part of the supplied refrigerant Ms was joined to the recovered refrigerant Mr after flowing through the hose pipe 49B. Therefore, it is possible to extend the life by circulating the recovered refrigerant Mr at a temperature that does not cause the hose pipe 49B to deteriorate with respect to the hose pipe 49B whose durability is deteriorated due to a decrease in flexibility and the like at low temperatures. In addition, the temperature of the recovered refrigerant Mr can be lowered and the life of the refrigerant compressor 51 can be extended with respect to the refrigerant compressor 51 whose life is shortened due to overheating when the temperature of the recovered refrigerant Mr is high. As a result, a highly durable and responsive IC handler can be provided.

  (2) According to this embodiment, the hose pipe 49B is a flexible high pressure hose. Therefore, long-term durability can be maintained even when the electronic components are frequently conveyed. In addition, the high-pressure hose is cured at a low temperature and the flexibility is lowered and the durability is deteriorated. However, a longer durability can be maintained by circulating the recovered refrigerant Mr heated to a temperature at which the high-pressure hose is not cured.

  (3) According to the present embodiment, the supply refrigerant Ms merged with the recovered refrigerant Mr is easily evaporated by the capillary tube provided in the first bypass pipe 59 and becomes low temperature. Accordingly, the recovered refrigerant Mr, which has been set to a temperature at which the hose pipe 49B is not cured, can be efficiently lowered to be recovered by the refrigerant compressor 51. Moreover, the lifetime of the refrigerant | coolant compressor 51 can be lengthened more by lowering | hanging the temperature of the collection | recovery refrigerant | coolant Mr ..

  (4) According to the present embodiment, the supply refrigerant Ms that is more easily evaporated flows through the first bypass pipe 59 and merges with the recovered refrigerant Mr. Therefore, the recovered refrigerant Mr can be suitably cooled to be recovered by the refrigerant compressor 51.

  (5) According to this embodiment, at least a part of the high-temperature and high-pressure supply refrigerant Ms is joined to the recovered refrigerant Mr. Accordingly, the refrigerant compressor 51 is already mixed with the recovered refrigerant Mr. the supplied refrigerant Ms with a high temperature and pressure and a small compression burden, so the load for compressing the recovered refrigerant Mr is reduced and the life is extended. Further, the supply refrigerant Ms supplied to the evaporator 35 is reduced, the cooling capacity of the evaporator 35 is reduced, and the recovered refrigerant Mr flowing through the hose pipe 49B is prevented from reaching a temperature at which the hose pipe 49B is cured. be able to. As a result, a highly durable and responsive IC handler can be provided.

  (6) According to the present embodiment, the amount of the supply refrigerant Ms that flows through the hot gas bypass pipe 68 and merges with the recovered refrigerant Mr is equal to the temperature measured by the heater temperature sensor TM2 from the control device 60 and the second value. It adjusted with the hot gas solenoid valve V2 by which the opening degree was adjusted with the solenoid valve control signal Sv2 for refrigerant | coolants based on target temperature. Therefore, the amount of the high-temperature and high-pressure supply refrigerant Ms mixed with the recovered refrigerant Mr can be suitably adjusted. Further, by increasing or decreasing the supply refrigerant Ms supplied to the evaporator 35 more flexibly, that is, by changing the cooling capacity of the evaporator 35 flexibly, the recovered refrigerant Mr flowing through the hose pipe 49B hardens the hose pipe 49B. It can suppress suitably so that it may not become the temperature to make.

In addition, you may change the said embodiment into the following aspects.
In the above embodiment, the electric heater H1 is used for heating the component, but the heater is not limited to the electric heater.

  In the above embodiment, the refrigerant recovery pipe 49 guided the refrigerant from the evaporator 35 to the recovered refrigerant heater H2. However, the present invention is not limited to this, and a pipe having heat insulation performance may be used between the evaporator 35 of the refrigerant recovery pipe 49 and the recovered refrigerant heater H2. If it does so, it can prevent that the high temperature of the collection | recovery refrigerant | coolant heater H2 transmits to the evaporator 35, and can maintain the cooling power of the evaporator 35 high.

In the above embodiment, a plurality of, for example, three pressing pistons 31 are provided. However, the present invention is not limited to this, and the number of pressing pistons 31 may be one, two, or four or more.
In the above embodiment, the IC chip T is sucked and held on the objective block 40 by the vacuum suction pad. May be.

  In the above embodiment, the case where the electromagnetic valve V1 is closed is the case where the evaporator 35 and the electric heater H1 or the IC chip T are no longer thermally coupled. However, the present invention is not limited to this, and a signal from a sensor that detects that the upper surface of the evaporator 35 is in contact with the upper frame, or after a predetermined time has elapsed from the electromagnetic valve V1, the evaporator 35 and the electric heater H1 or IC chip It may be determined that T is no longer thermally coupled.

  In the above embodiment, the hot gas solenoid valve V2 is driven and controlled by the recovered refrigerant temperature calculated from the temperature measured by the heater temperature sensor TM2. However, the present invention is not limited to this, and the hot gas solenoid valve V <b> 2 may be driven and controlled based on another temperature sensor provided at an arbitrary position of the refrigerant recovery pipe 49.

  Further, since there is a correlation between the temperature and the pressure of the recovered refrigerant Mr, the hot gas solenoid valve V2 is a measurement value measured by a pressure sensor as a refrigerant density sensor that measures the pressure of the refrigerant based on the density of the refrigerant. Drive control may be performed based on the above. For example, the hot gas solenoid valve V2 may be controlled to open when the pressure increases (temperature is low), and the hot gas solenoid valve V2 may be closed when the pressure decreases (temperature is high).

In the above embodiment, the expander 67 has a capillary tube. However, the present invention is not limited to this, and the expander 67 may have an expansion valve as a first electromagnetic valve.
The expander 67 may be controlled to open and close based on the temperature detected by the heater temperature sensor TM2. Specifically, when the temperature detected by the heater temperature sensor TM2 is higher than the first target temperature as the first target value based on the density of the predetermined refrigerant, the control device as the first opening degree adjusting means 60 opens the inflator 67. By opening the expander 67, the mixed refrigerant is supplied from the first bypass pipe 59 to the refrigerant recovery pipe 49, and the recovered refrigerant Mr is cooled by the supplied mixed refrigerant. On the other hand, when the temperature detected by the heater temperature sensor TM2 is lower than the predetermined first target temperature, that is, when the recovered refrigerant Mr is low temperature, the control device 60 closes the expander 67. By closing the expander 67, the mixed refrigerant is not supplied from the first bypass pipe 59 to the refrigerant recovery pipe 49. As a result, the liquid component contained in the mixed refrigerant is further added to the low-temperature recovered refrigerant Mr that already has a large amount of liquid in the refrigerant, and the liquid component of the recovered refrigerant Mr that cannot be separated by the accumulator 58 is sucked into the refrigerant compressor 51. It is possible to prevent damage to the valve of the compressor 51 and the like.

  At this time, since there is a correlation between the temperature and the pressure of the recovered refrigerant Mr, the expansion valve is based on a measurement value measured by a pressure sensor as a refrigerant density sensor that measures the pressure of the refrigerant based on the density of the refrigerant. And may be driven and controlled. For example, when the pressure increases (temperature is low), the expansion valve is closed, and when the pressure decreases (temperature is high), the expansion valve may be opened.

  T ... IC chip, C1 to C6 ... conveyor, FX ... X-axis frame, FY1 ... first Y-axis frame, FY2 ... second Y-axis frame, H1 ... electric heater, H2 ... recovered refrigerant heater, Mr ... recovered Refrigerant, Ms ... Supply refrigerant, AR1 ... Air pressure source, AR2 ... Dryer, AR4 ... Pneumatic pressure regulator, TM1 ... Thermostat, TM2 ... Heater temperature sensor, V1 ... Solenoid valve, V2 ... Hot gas solenoid valve, 10 ... IC handler, DESCRIPTION OF SYMBOLS 11 ... Base, 12 ... Safety cover, 13 ... High temperature chamber, 14 ... Supply robot, 15 ... Collection | recovery robot, 16 ... 1st shuttle, 16A ... Base member, 17 ... 2nd shuttle, 17A ... Base member, 18 ... Tray, 20 ... Supply side robot hand unit, 21 ... Recovery side robot hand unit, 22 ... Measurement robot, 22A ... Measurement hand, 23 ... For inspection 24A ... first rail, 24B ... second rail, 25,27 ... change kit, 26 ... pocket, 30 ... upper frame, 30A ... communication hole, 30B ... cylinder chamber, 30C, 30D ... air supply hole, 31 ... Pressing piston, 31A ... Pressing part, 31B ... Packing, 32,36 ... Joint, 32A, 36A ... Air supply pipe, 33 ... Heat insulation cylinder, 33B ... Packing, 33C ... Air supply hole, 35 ... Evaporator, 35A ... Protrusion, 37 ... Heat conduction block, 38 ... Heat conduction maintenance member, 40 ... Objective block, 48 ... Refrigerant supply piping, 49 ... Refrigerant recovery piping, 49A ... Hand side piping, 49B ... Hose piping, 49C ... Base side piping, 51 ... Refrigerant Compressor, 52 ... Condenser, 54 ... Liquid receiver, 55 ... Filter dryer, 56 ... Expander, 58 ... Accumulator, 59 ... First bypass pipe, 60 ... Control 61: Electric heater drive circuit, 62 ... Recovered refrigerant heater drive circuit, 62C ... Temperature controller, 63 ... Solenoid solenoid valve drive circuit, 64 ... Gas solenoid valve drive circuit, 65 ... I / O device, 66 ... Display Apparatus, 67 ... Expander, 68 ... Hot gas bypass piping.

Claims (6)

An electronic component inspection apparatus that conveys an electronic component gripped on a lower surface of a heat conducting member for placement in an inspection socket and presses the electronic component placed on the inspection socket against the lower surface of the heat conducting member. And
A cooling body disposed so as to be able to contact and separate from the upper surface of the heat conducting member;
A refrigerant supply pipe for supplying a supply refrigerant connected to the cooling body to cool the cooling body from a refrigerant compressor;
A refrigerant recovery pipe connected to the cooling body and recovering the recovered refrigerant consisting of the supplied refrigerant evaporated in the cooling body to the refrigerant compressor;
A movable pipe having flexibility and provided in the refrigerant recovery pipe, which is movable along with the conveyance of the electronic component;
A recovered refrigerant heater that is provided in the refrigerant recovery pipe and heats the recovered refrigerant flowing through the movable pipe to a temperature that does not cure the movable pipe;
A first bypass pipe connecting between the movable pipe of the refrigerant recovery pipe and the refrigerant compressor and the refrigerant supply pipe in order to join a part of the supply refrigerant to the recovered refrigerant; ,
In order to measure the density of the recovered refrigerant flowing through the movable pipe, a refrigerant density sensor provided in the refrigerant recovery pipe;
A first solenoid valve provided in the first bypass pipe, the opening of which is adjusted by an external control signal;
A first adjusting the opening of the first electromagnetic valve based on a comparison between a measured value based on the density of the refrigerant measured by the refrigerant density sensor and a first target value based on a predetermined refrigerant density. Opening adjustment means;
An inspection apparatus for electronic parts, comprising: The electronic component inspection apparatus according to claim 1,
2. The electronic component inspection apparatus according to claim 1, wherein the movable pipe is a high-pressure hose that hardens at a temperature below freezing point . The electronic component inspection apparatus according to claim 1 or 2,
An electronic component inspection apparatus, wherein the first bypass pipe is provided with an expander. In the electronic component inspection apparatus according to any one of claims 1 to 3,
In the refrigerant supply pipe,
A filter dryer;
An inflator provided after the filter dryer,
The electronic component inspection apparatus, wherein the first bypass pipe is connected between the filter dryer of the refrigerant supply pipe and the expander. In the electronic component inspection apparatus according to any one of claims 1 to 4,
A position at which the high-temperature high-pressure supply refrigerant from the refrigerant compressor circulates in the refrigerant supply pipe in order to join at least a part of the high-temperature high-pressure supply refrigerant from the refrigerant compressor to the recovered refrigerant; An electronic component inspection apparatus, wherein a second bypass pipe is provided between the movable pipe of the pipe and the refrigerant compressor. The electronic component inspection apparatus according to claim 5,
A second electromagnetic valve provided in the second bypass pipe, the opening of which is adjusted by an external control signal;
A second adjusting the opening of the second solenoid valve based on a comparison between a measured value based on the refrigerant density measured by the refrigerant density sensor and a second target value based on a predetermined refrigerant density; And an opening degree adjusting means.

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