JP2009246040A - Laser light source device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser light source device easy to reduce a manufacturing cost and easy to make the device with desired performance. <P>SOLUTION: The laser light source device 50 is structured to comprise: semiconductor laser 20 carried in a holder 10; and optical elements 40a and 40b carried in a base 30. The holder is equipped with: a first through-hole 3 into which the semiconductor laser is inserted and fixed; an inner peripheral protrusion 5 for surrounding one end of the first through-hole; and an outer peripheral protrusion divided into three or more segments via three or more notches and surrounding the inner peripheral protrusion. The base is equipped with a second through-hole 23 into which the optical elements are inserted and fixed and an upper surface 30a brought into tight contact with the upper surface of the inner peripheral protrusion. The first through-hole and the second through-hole are made to communicate with each other. The upper surface of the inner peripheral protrusion and the upper surface of the base are brought into tight contact with each other. Thus the holder and the base are bonded to each other with a first adhesive 43 poured into an aperture between the inner peripheral protrusion and the outer peripheral protrusion. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laser light source device in which a member holding a semiconductor laser and a member holding an optical element are integrated, and laser light oscillated from the semiconductor laser is condensed by the optical element and emitted.

  One of the laser light source devices is one in which a member holding a semiconductor laser and a member holding an optical element are integrated. For example, Patent Document 1 discloses a laser light source device that is integrated by screwing a substrate on which a semiconductor laser is fixed, a base having a through-hole into which the semiconductor laser is press-fitted, and a holder that holds a lens barrel. Are listed. In this laser light source device, a lens barrel is inserted into one end side of a through hole formed in the holder and fixed with an adhesive, and a collimator lens is fixed in the lens barrel. The semiconductor laser is fixed in a state where a light emitting end is inserted into the other end side of the through hole formed in the holder.

Japanese Patent Laid-Open No. 5-22530

  From the viewpoint of reducing the manufacturing cost of the laser light source device, it is desired to reduce the number of parts. For example, if the base and the holder in the laser light source device described in Patent Document 1 can be made into one member, the manufacturing cost can be reduced.

  Further, from the viewpoint of improving the performance of the laser light source device, it is desired to align the optical axis of the semiconductor laser and the optical axis of the optical element with high accuracy. For example, when the member holding the semiconductor laser and the member holding the optical element are fixed with screws as in the laser light source device described in Patent Document 1, the optical axis of the semiconductor laser and the optical axis of the optical element are fixed when screwed. From the viewpoint of aligning the optical axis of the semiconductor laser and the optical axis of the optical element with high accuracy, it is desirable that these members are fixed to each other with an adhesive.

  However, the members that hold the semiconductor laser and the members that hold the optical element are usually made of a metal or alloy having high thermal conductivity in order to dissipate the heat generated when the semiconductor laser is driven. If a photocurable adhesive is used to fix the adhesives to each other, light irradiation to the adhesive is insufficient, and the adhesive tends to be insufficiently cured. Insufficient curing of the adhesive causes the optical axis of the semiconductor laser to deviate from the optical axis of the optical element after assembly of the laser light source device, or volatilizes from the uncured adhesive after assembly of the laser light source device. The light emitting end of the semiconductor laser and the surface of the optical element may be contaminated by the sex component (outgas). The deviation between the optical axis of the semiconductor laser and the optical axis of the optical element, and the contamination of the light emitting end of the semiconductor laser and the surface of the optical element all cause degradation of the performance of the laser light source device.

  If a thermosetting adhesive is used instead of the photocurable adhesive, the adhesive can be sufficiently cured, but the thermosetting adhesive has a slow curing speed, and the productivity of the laser light source device is significantly reduced. Of course, if a curing accelerator is used, the thermosetting adhesive can be cured in a short time, but if a liquid curing accelerator is used, the light emitting end of the semiconductor laser and the surface of the optical element are contaminated by the curing accelerator. It becomes easy to be done. In addition, when a solid curing accelerator is used, when the member holding the semiconductor laser and the member holding the optical element are bonded, the solid curing accelerator is left outside without entering the bonding interface, and is thermally cured. The adhesive adhesive may be insufficiently cured.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to obtain a laser light source device that can easily reduce the manufacturing cost and easily manufacture a product having a desired performance.

  The laser light source device of the present invention that achieves the above object includes a holder having a first through hole, a semiconductor laser inserted into the first through hole and held by the holder, a base having a second through hole, And an optical element that is inserted into the through hole and held by the base, and the holder is formed on one end side of the first through hole and surrounds one end side of the first through hole, and the periphery of the inner peripheral protrusion An outer peripheral convex portion divided into a plurality of segments by a plurality of notches, and the holder and the base are formed by bringing the upper surface of the inner peripheral convex portion and one end surface of the base into close contact with each other. Are fixed to each other by the first adhesive injected into the gap between the outer peripheral convex portion and the outer peripheral convex portion.

  In the laser light source device of the present invention, the holder that holds the semiconductor laser and the base that holds the optical element are fixed to each other with the first adhesive, and therefore, compared with the laser light source device described in Patent Document 1, for example. In addition to reducing the number of points, it is possible to easily prevent the optical axis of the semiconductor laser from deviating from the optical axis of the optical element in the process of assembling the laser light source device.

  Further, the inner peripheral convex portion and the outer peripheral convex portion are formed on one end side of the first through hole formed in the holder, and the holder is fixed to the base with the upper surface of the inner peripheral convex portion being in close contact with the one end surface of the base. Therefore, even if outgas is generated from the first adhesive, the movement of the outgas toward the first through hole side or the second through hole side is suppressed by the inner circumferential convex portion. As a result, it is possible to prevent the light emitting end of the semiconductor laser and the surface of the optical element from being contaminated by the outgas from the first adhesive. At least one of the notches formed in the outer peripheral convex portion can also be used as an outgas vent.

  Furthermore, by appropriately selecting the height of the inner peripheral convex part and the width of the notch part on the outer peripheral convex part, a thermosetting or thermosetting combined photocurable adhesive containing a solid curing accelerator is provided. Even if it uses as a 1st adhesive agent, when a holder and a base are press-contacted, it can prevent easily that a solid hardening accelerator does not enter into a joining interface and is left outside. As a result, it becomes easy to reliably cure the uncured product of the first adhesive in a short time. Moreover, it becomes easy to raise the adhesive strength of a holder and a base by using a thermosetting adhesive or a thermosetting combined use type photocurable adhesive as a 1st adhesive agent.

  For these reasons, according to the present invention, it is possible to obtain a laser light source device that can easily reduce the manufacturing cost and easily manufacture a product having a desired performance.

  Hereinafter, embodiments of a laser light source device of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below.

Embodiment 1 FIG.
1-1 is a partial cross-sectional view schematically showing an example of the laser light source device of the present invention. FIGS. 1-2 and 1-3 respectively show the laser light source device shown in FIG. 1-1. It is the fragmentary sectional view cut | disconnected by the cut surface of an azimuth angle different from the cut surface in 1-1. 2 is a bottom view schematically showing a holder in the laser light source device shown in FIGS. 1-1 to 1-3, and FIG. 3 is a laser shown in FIGS. 1-1 to 1-3. It is a bottom view which shows roughly distribution of the 1st adhesive agent and the 2nd adhesive agent in the holder in a light source device.

  A laser light source device 50 shown in FIGS. 1-1 to 1-3 includes a semiconductor laser 20 held by a holder 10 and optical elements 40a and 40b held by a base 30, and is oscillated from the semiconductor laser 20. Laser light is condensed and emitted by the optical elements 40a and 40b.

  The holder 10 is made of a metal material or alloy material having a high thermal conductivity, such as copper or aluminum, and excellent workability, and if necessary, nickel is used to prevent surface corrosion in a humid environment. A metal plating film such as is formed. The holder 10 is a columnar object, and a first through hole 3 that penetrates the holder 10 in the height direction is provided at a central portion in plan view.

Further, an annular inner peripheral convex portion 5 surrounding one end side of the first through hole 3 is formed on one end side of the first through hole 3, and four notches CS _{1 to} CS are formed around the inner peripheral convex portion 5. _4, the outer peripheral convex part 7 divided | segmented into four segments 7a-7d (refer FIG. 2 and FIG. 3) is formed. The individual segments 7 a to 7 d have an arc shape, and a gap G is formed between the four segments 7 a to 7 d and the inner peripheral convex portion 5. That is, a gap G is formed between the outer peripheral convex portion 7 and the inner peripheral convex portion 5.

The height H (see FIGS. 1 to 3) of the inner circumferential convex portion 5 is set to, for example, 0.02 mm or more so that a solid curing accelerator used for the thermosetting adhesive can be accommodated in the gap G. Moreover, the upper surface of the inner peripheral convex part 5 is formed into a flat surface. The upper surface of the outer peripheral convex portion 7 (the upper surfaces of the segments 7 a to 7 d) is also formed into a flat surface, and the upper surface of the outer peripheral convex portion 7 is flush with the upper surface of the inner peripheral convex portion 5. The width in plan view of each of the inner peripheral convex portion 5 and the outer peripheral convex portion 7 is set to 0.5 mm or more, for example, and the widths (widths when viewed from the front) of the notches CS _{1 to} CS ₄ are also set to, for example, 0. Set to 5 mm.

  The semiconductor laser 20 is obtained by packaging a semiconductor laser element (not shown). The semiconductor laser 20 shown in the figure includes a cylindrical portion 13 that houses the semiconductor laser element, and a flange portion formed on one end side of the cylindrical portion 13. 15 and a metal CAN package having three connection terminals 17, 17, 17 connected to the semiconductor laser element via a flange portion 15. The semiconductor laser 20 is press-fitted into the first through hole 3 of the holder 10 with the light emitting end directed to the second through hole 23 side of the base 30 and each connection terminal 17 facing outward, and is inserted into the holder 10. Is retained.

  The base 30 is made of, for example, a metal material or alloy material such as aluminum, and is subjected to a surface treatment for imparting corrosion resistance as necessary. For example, when the base 30 is produced using aluminum, the surface is anodized as necessary to impart corrosion resistance. The outline shape of the base 30 is, for example, a disk shape, and a second through hole 23 that penetrates the base 30 in the thickness direction is provided at the center. The inner dimension of the second through-hole 23 extends from the end surface 30a (hereinafter referred to as “upper surface 30a”) of the base 30 to the end surface 30b (hereinafter referred to as “lower surface 30b”) facing the upper surface 30a. It is increasing step by step. The upper surface 30a of the base 30 is formed into a flat surface, and the inner peripheral convex portion 5 and the outer peripheral convex portion 7 of the holder 10 are in close contact with the upper surface 30a.

  Each of the optical elements 40 a and 40 b is a condenser lens that condenses the laser light oscillated from the semiconductor laser 20. The optical elements 40 a and 40 b are inserted into the second through hole 23 of the base 30, fixed, and held by the base 30. Yes. The optical element 40a is disposed on the upper surface 30a side of the base 30, and the optical element 40b is disposed on the lower surface 30b side.

In the laser light source device 50, the holder 10 and the base 30 described above cause the first through hole 3 and the second through hole 23 to communicate with each other, and the upper surface of the inner peripheral convex portion 5 and the upper surface 30a of the base 30 are brought into close contact with each other. The first adhesive 43 and the second adhesive 45 are fixed to each other. As shown in FIGS. 1-1 and 3, the first adhesive 43 is formed between the notches CS ₁ between the segments 7 a and 7 d and the segments 7 b and 7 c on the outer peripheral convex portion 7 formed on the holder 10. It is injected from each of the notches CS ₃ into the gap G between the inner peripheral convex portion 5 and the outer peripheral convex portion 7 and hardened. Moreover, as shown in FIGS. 1-2 and 3, the 2nd adhesive agent 45 is apply | coated and hardened over the upper surface 30a of the base 30 from the outer peripheral surface of each segment 7a-7d and the upper direction. In FIG. 3, for the sake of convenience, each of the first adhesive 43 and the second adhesive 45 is smudged at different densities.

  As the first adhesive 43, for example, a thermosetting adhesive that is cured only by heating or a thermosetting combined photocurable adhesive that is cured by either heating or irradiation with light in a predetermined wavelength range is used. Specific examples of thermosetting adhesives include amine curable and phenol curable epoxy adhesives, and specific examples of thermosetting combined photocurable adhesives include cationic polymerization type UV curable. Examples thereof include an epoxy adhesive. Further, as the second adhesive 45, for example, a photo-curing or thermosetting combined photo-curing adhesive that is cured by irradiation with light in a predetermined wavelength range is used. Specific examples of the photocurable adhesive include an acrylate ultraviolet curable adhesive and a cationic polymerization type ultraviolet curable epoxy adhesive.

  FIG. 1-1 is a cross-sectional view of the laser light source device 50 cut along a cutting plane including the AA line shown in FIG. 3, and FIG. 1-2 is a cross-sectional view taken along the line BB shown in FIG. FIG. 1-3 is a cross-sectional view when the laser light source device 50 is cut along a cut surface including a line, and FIG. 1-3 is a cross-sectional view when the laser light source device 50 is cut along a cut surface including a CC line illustrated in FIG. FIG.

  In the laser light source device 50 having the configuration described above, the holder 10 holding the semiconductor laser 20 and the base 30 holding the optical elements 40a and 40b are fixed to each other with the first adhesive 43 and the second adhesive 45. Therefore, for example, the number of components can be reduced as compared with the laser light source device described in Patent Document 1, and the optical axis of the semiconductor laser 20 and the optical elements 40a and 40b in the process of assembling the laser light source device 50 can be reduced. It is possible to easily prevent the optical axis from deviating.

Further, since the inner peripheral convex portion 5 is formed on the holder 10 and the upper surface of the inner peripheral convex portion 5 is in close contact with the upper surface 30a of the base 30, even if outgas is generated from the first adhesive 43, the first through-hole of the outgas The movement toward the third side or the second through-hole 23 side is suppressed by the inner circumferential convex portion 5. As a result, it is possible to prevent the light emitting end of the semiconductor laser 20 and the surfaces of the optical elements 40a and 40b from being contaminated by the outgas. The notches CS ₂ and CS ₄ formed in the outer peripheral convex portion 7 function as the above-described outgas vent holes.

Moreover, since the height of the inner peripheral convex part 5 is set to 0.02 mm or more and the width of each notch CS _{1 to} CS _{4 in} the outer peripheral convex part 7 is set to 0.5 mm or more, the first adhesion Even if a thermosetting or thermosetting combined photocurable adhesive containing a solid curing accelerator is used as the agent 43, the particle size of the solid curing accelerator is generally less than 0.02 mm. When the uncured product of one adhesive 43 is poured into the gap G, it is possible to easily prevent the solid curing accelerator from being left outside without entering the gap G.

  As a result, it is easy to reliably cure the uncured product of the first adhesive 43 in a short time. It is also easy to ensure a sufficiently wide bonding area. And since the thermosetting adhesive or the thermosetting combined photocurable adhesive is used as the first adhesive 43, the adhesive strength between the holder 10 and the base 30 is increased as compared with the case where the photocurable adhesive is used. easy. For these reasons, in the laser light source device 50, it is easy to reduce the manufacturing cost, and it is easy to manufacture a product having a desired performance with a high yield. Since the number of parts is reduced, it is possible to reduce the amount of raw materials, save energy, reduce the environmental load at the disposal stage, and the like.

  The laser light source device 50 that exhibits the technical effects described above can be manufactured, for example, as follows. First, the semiconductor laser 20 is press-fitted into the first through hole 3 of the holder 10 by a predetermined depth, and the semiconductor laser 20 is held by the holder 10. Further, the optical elements 40 a and 40 b are inserted into the second through holes 23 of the base 30 and fixed, and the optical elements 40 a and 40 b are held on the base 30.

  Next, the holder 10 holding the semiconductor laser 20 is clamped by a predetermined device and pressed against the upper surface 30a of the base 30, and the holder 10 is positioned by active alignment while sliding on the upper surface 30a. When the positioning of the holder 10 is completed, an uncured material of the second adhesive 45 is applied from the outer peripheral surface of the holder 10 to the upper surface 30a of the base 30 while maintaining the state, and the uncured material is irradiated by light in a predetermined wavelength region. The material is cured to form a second adhesive 45. Note that a plurality of holders 10 (holding the semiconductor laser 20) may be bonded onto the base 30, and in that case, positioning and bonding with the second adhesive 45 are sequentially performed on the individual holders 10.

Next, the holder 10 is unclamped by the above-described device, and the gap between the inner peripheral convex portion 5 and the outer peripheral convex portion 7 from each of the notches CS ₁ and CS ₃ formed in the outer peripheral convex portion 7 of the holder 10. A predetermined amount of uncured material of the first adhesive 43 is injected into G. At this time, as the uncured product of the first adhesive 43, an uncured product of the thermosetting combined type photo-curing adhesive is used, and a part of the uncured product protrudes to the outside of the cut-out portions CS ₁ and CS _3. If the uncured product is cured or semi-cured by irradiation with light in a predetermined wavelength region, it is possible to easily prevent the uncured product in the gap G from flowing out in the process of shifting to the subsequent process. .

Thereafter, the holder 10 and the base 30 that have been subjected to the injection of the uncured material into the gap G are put in an oven and heated to, for example, about 80 ° C. to 150 ° C. to cure the uncured material in the gap G. Thus, the first adhesive 43 is obtained. When there is the first adhesive 43 that is hardened or semi-cured by protruding to the outside of the notches CS ₁ and CS ₃ when the uncured product of the first adhesive 43 is injected into the gap G, the oven Curing of the protruding first adhesive 43 further proceeds by heating at.

  By forming the first adhesive 43 as described above, the laser light source device 50 can be obtained. When the laser light source device 50 is used, for example, each connection terminal 17 of the semiconductor laser 20 is connected to a predetermined drive circuit, and a cooler (not shown) such as a Peltier cooler is provided on the upper surface of the holder 10 via a heat sink (not shown). Connected). Heat generated at the time of oscillation of the laser light by the semiconductor laser 20 is conducted from an internal member (not shown) of the semiconductor laser 20 to the holder 10 through the flange portion 15, and from the holder 10 to the Peltier cooler through the heat sink. The heat is transferred to the cooler and absorbed. Stable laser oscillation light intensity can be obtained by efficiently releasing the heat generated in the semiconductor laser 20 to the cooler.

Embodiment 2. FIG.
In the laser light source device of the present invention, the holder holding the semiconductor laser and the base holding the optical element may be fixed to each other only by the first adhesive. In this case, as the first adhesive, it is preferable to use a thermosetting combined photocurable adhesive.

  FIG. 4 schematically shows an example of the distribution of the first adhesive in the holder in the laser light source device in which the holder holding the semiconductor laser and the base holding the optical element are fixed to each other only by the first adhesive. It is a bottom view. Since the components shown in FIG. 3 have already been described with reference to FIG. 3, the same reference symbols as those used in FIG. Further, since the entire configuration of the laser light source device can be the same as that of the laser light source device described in the first embodiment, for example, illustration thereof is omitted here.

The fixing of the holder (holding the semiconductor laser) and the base (holding the optical element) with only the first adhesive can be performed as follows, for example. First, similarly to the active alignment described in the first embodiment, the holder 10 (see FIG. 4) is positioned on the base. Next, with the holder 10 kept in pressure contact with the base, the remaining notch portions excluding at least one notch portion formed on the outer peripheral convex portion 7 of the holder 10, for example, notches CS ₁ and CS ₃ (FIG. 4). A predetermined amount of uncured material of the first adhesive 43 (see FIG. 4) is injected into the gap G between the inner peripheral convex portion 5 and the outer peripheral convex portion 7, and then the injection port (injected with the uncured material) A part of the uncured material is cured by irradiating light in a predetermined wavelength range with the aim of the notch), and the holder 10 is temporarily fixed to the base.

  After that, the holder 10 and the base that have been temporarily fixed are put in an oven and heated to, for example, about 80 ° C. to 150 ° C. to cure the uncured material of the first adhesive 43 injected into the gap G. Thus, the first adhesive 43 is obtained. Thus, even if the holder 10 and the base are fixed to each other only by the first adhesive 43, the same technical effect as the laser light source device 50 described in the first embodiment (see, for example, FIG. 1-1) is obtained. A laser light source device can be obtained.

Embodiment 3 FIG.
In the laser light source device according to the present invention, when the holder holding the semiconductor laser and the base holding the optical element are fixed to each other by the first adhesive and the second adhesive, the thermosetting adhesive is used as the second adhesive. Can also be used. In this case, as the first adhesive, it is preferable to use a thermosetting combined photocurable adhesive.

  FIG. 5 shows a first adhesive and a second adhesive in a holder in a laser light source device in which a holder holding a semiconductor laser and a base holding an optical element are fixed to each other by a first adhesive and a second adhesive. It is a bottom view which shows the other example of distribution of an agent roughly. Since the components shown in the figure have already been described with reference to FIG. 3 except for the second adhesive 45a, the reference numerals used in FIG. 3 are used for the components other than the second adhesive 45a. The same reference numerals are given and description thereof is omitted. Further, since the entire configuration of the laser light source device can be the same as that of the laser light source device described in the first embodiment, for example, illustration thereof is omitted here.

  When a thermosetting adhesive is used as the second adhesive and the holder (the one holding the semiconductor laser) and the base (the one holding the optical element) are fixed to each other by the second adhesive and the first adhesive. First, as in the method described in the second embodiment, the holder 10 (see FIG. 5) is temporarily fixed to the base with the first adhesive. Next, an uncured material of the second adhesive 45a (see FIG. 5) is applied from the outer peripheral surface of each segment 7a to 7d at the outer peripheral convex portion 7 formed on the holder 10 to the upper surface of the base from above. To do.

  Thereafter, the holder 10 and the base that have been applied up to the application of the uncured product of the second adhesive 45a are put in an oven and heated to, for example, about 80 ° C. to 150 ° C., whereby the inner peripheral convex portion 5 and the outer peripheral convex portion in the holder 10 The uncured product of the first adhesive and the uncured product of the second adhesive 45a injected into the gap G between the first adhesive 43 and the second adhesive 45a are cured to form the first adhesive 43 and the second adhesive 45a. . Even if the holder 10 and the base are fixed to each other by the first adhesive 43 and the second adhesive 45a in this way, the laser light source device 50 described in the first embodiment (for example, see FIG. 1-1) is the same. It is possible to obtain a laser light source device that exhibits the technical effects of

  The laser light source device of the present invention has been described with reference to the embodiment. However, as described above, the present invention is not limited to the above-described embodiment. For example, the number of semiconductor lasers constituting the laser light source device can be set to a desired number of 1 or more, and a plurality of holders holding the semiconductor lasers may be fixed to one base. In this case, a plurality of second through holes can be provided in the base, or one second through hole having a long hole shape can be provided. It is also possible to hold a plurality of semiconductor lasers in one holder. Therefore, the shape of the holder and the shape of the base can be selected as appropriate except that the holder is provided with an inner peripheral convex portion and an outer peripheral convex portion. The shape of the optical element held on the base can be appropriately selected from a planoconvex lens, a biconvex lens, a cylindrical lens, and the like.

  The planar shape of the inner peripheral convex portion formed on the holder is not limited to an annular shape, and may be any shape that surrounds one end side of the first through hole. Similarly, the planar shape of the outer peripheral convex portion only needs to surround the inner peripheral convex portion by a plurality of segments. However, the number of segments in the outer peripheral convex portion, and hence the number of cutout portions, can cause at least one cutout portion to function as a degassing port for outgas from the adhesive, and the first from the remaining cutout portions. A desired number of 2 or more is selected so that the uncured material of the adhesive can be injected to fix the holder and the base to each other under a sufficient bonding area. In particular, it is desirable to arrange one or more sets of two notches located at symmetrical positions for injection of the adhesive, and to provide a total of three or more notches together with the notch for venting. If one set of two notches located at symmetrical locations is arranged for degassing, and a total of four notches are provided together with one set of notches for injecting adhesive, Good. The laser light source device of the present invention can be variously modified, modified, combined, etc. in addition to those described above.

  The laser light source device of the present invention can be used as a light source device in a display device such as a laser television, a printing device such as a laser printer, or an optical communication device.

It is a fragmentary sectional view which shows roughly an example of the laser light source apparatus of this invention. It is the fragmentary sectional view which cut | disconnected the laser light source apparatus shown to FIGS. 1-1 with the cut surface of an azimuth angle different from the cut surface in FIG. 1-1. It is the fragmentary sectional view which cut | disconnected the laser light source apparatus shown to FIGS. 1-1 by the cut surface of an azimuth angle different from the cut surface in FIGS. 1-1, 1-2. FIG. 4 is a bottom view schematically showing a holder in the laser light source device shown in FIGS. It is a bottom view which shows roughly distribution of the 1st adhesive agent and the 2nd adhesive agent in the holder in the laser light source apparatus shown to FIGS. 1-1 to 1-3. In the laser light source device of the present invention, an example of the distribution of the first adhesive in the holder in which the holder holding the semiconductor laser and the base holding the optical element are fixed to each other only by the first adhesive. FIG. Of the laser light source device of this invention, a first adhesive in a holder in which a holder holding a semiconductor laser and a base holding an optical element are fixed to each other by a first adhesive and a second adhesive, It is a bottom view showing roughly another example of distribution of the 2nd adhesive.

Explanation of symbols

3 1st through-hole 5 Inner peripheral convex part 7 Outer peripheral convex part 7a-7d Segment 10 Holder 20 Semiconductor laser 23 Second through-hole 30 Base 40a, 40b Optical element 43 First adhesive 45, 45a Second adhesive 50 Laser light source device CS _{1 to} CS ₄ notch

Claims (10)

A holder having a first through hole, a semiconductor laser inserted into the first through hole and held by the holder, a base having a second through hole, and a holder inserted into the second through hole and held by the base An optical element,
The holder is
An inner peripheral convex portion formed on one end side of the first through hole and surrounding one end side of the first through hole;
An outer peripheral convex portion formed around the inner peripheral convex portion and divided into a plurality of segments by a plurality of notches,
Have
The holder and the base are fixed to each other by the first adhesive injected into the gap between the inner peripheral convex portion and the outer peripheral convex portion, with the upper surface of the inner peripheral convex portion and one end surface of the base being in close contact with each other. ing,
A laser light source device.   2. The laser light source device according to claim 1, wherein an upper surface of the outer peripheral convex portion is flush with an upper surface of the inner peripheral convex portion.   3. The laser light source device according to claim 1, wherein a height of the inner circumferential convex portion is 0.02 mm or more. The outer peripheral convex portion is divided into three or more segments by three or more notches,
The first adhesive is injected into a gap between the inner peripheral convex portion and the outer peripheral convex portion from the remaining cutout portion except at least one of the three or more cutout portions. The laser light source device according to claim 1.   The laser light source device according to claim 1, wherein the first adhesive is a thermosetting adhesive.   The laser light source device according to claim 1, wherein the first adhesive is a thermosetting combined photocurable adhesive.   The said holder is adhere | attached on the said base also with the 2nd adhesive agent applied ranging from the outer peripheral surface of the said segment to the end surface by the side of the holder in the said base. The laser light source device according to one.   The laser light source device according to claim 7, wherein the second adhesive is a photocurable adhesive.   The laser light source device according to claim 7, wherein the second adhesive is a heat photocurable adhesive.   The laser light source device according to claim 7, wherein the second adhesive is a thermosetting combined photocurable adhesive.

Images