JP2007139877A - Method for manufacturing optical module and optical module - Google Patents

Method for manufacturing optical module and optical module Download PDF

Info

Publication number
JP2007139877A
JP2007139877A JP2005330213A JP2005330213A JP2007139877A JP 2007139877 A JP2007139877 A JP 2007139877A JP 2005330213 A JP2005330213 A JP 2005330213A JP 2005330213 A JP2005330213 A JP 2005330213A JP 2007139877 A JP2007139877 A JP 2007139877A
Authority
JP
Japan
Prior art keywords
barrel
optical
optical module
cap
curable resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005330213A
Other languages
Japanese (ja)
Other versions
JP4732139B2 (en
Inventor
Masahiro Onishi
雅裕 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAE Magnetics HK Ltd
Original Assignee
SAE Magnetics HK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SAE Magnetics HK Ltd filed Critical SAE Magnetics HK Ltd
Priority to JP2005330213A priority Critical patent/JP4732139B2/en
Publication of JP2007139877A publication Critical patent/JP2007139877A/en
Application granted granted Critical
Publication of JP4732139B2 publication Critical patent/JP4732139B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a module without inducing misalignment of optical axes of a can and a barrel. <P>SOLUTION: The method for manufacturing an optical module includes steps of: applying a UV curable resin 4 to partially adhere the outer circumference of a cap 25 of a can 2 to a side wall 35 forming a recess 36 of a barrel 3 which is made of a material transmitting UV rays; adjusting the optical axes of the barrel 3 and the can 2; irradiating the UV-curing resin 4 with UV rays from the outside of the barrel 3 through the barrel 3 to cure the UV-curing resin 4; applying a thermosetting resin 5 in a gap between an open edge of the recess 36 of the barrel 3 and the can 2; and curing the applied thermosetting adhesive 5 by atmospheric heating. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、本発明は光モジュールの製造方法および光モジュールに関する。特に、TOSA(Transmitter Optical Sub-assembly)やROSA(Receiver Optical Sub-assembly)等の光モジュールの構造および製造方法に関する。   The present invention relates to an optical module manufacturing method and an optical module. In particular, the present invention relates to a structure and a manufacturing method of an optical module such as TOSA (Transmitter Optical Sub-assembly) and ROSA (Receiver Optical Sub-assembly).

光モジュールのうち、TOSAやROSAは、光通信や光信号による情報処理などに広く用いられている。TOSAとは、発光素子(レーザーダイオード等)を搭載する送信用小型光デバイスであり、ROSAとは受光素子(フォトダイオード等)を搭載する受信用小型光デバイスである。これらの光モジュールは、発光素子および受光素子などの光半導体素子が金属等のキャップで覆われて構成されるキャンと、TOSAではレンズが配設されたバレルが、ROSAではレンズがないバレルとが接合された構造である。   Of the optical modules, TOSA and ROSA are widely used for optical communication and information processing using optical signals. TOSA is a small optical device for transmission on which a light emitting element (laser diode or the like) is mounted. ROSA is a small optical device for reception on which a light receiving element (such as a photodiode) is mounted. These optical modules include a can configured by covering an optical semiconductor element such as a light emitting element and a light receiving element with a cap such as a metal, a barrel in which a lens is disposed in TOSA, and a barrel without a lens in ROSA. It is a joined structure.

このようなTOSAおよびROSAを製造する際、通常、キャンの光半導体素子とバレルのレンズとの光軸を高精度で合わせた後、キャンにバレルを固定する。キャンの光半導体素子とバレルのレンズとの光軸のずれの許容差は、マルチモードのTOSAの場合で±5μm程度、ROSAの場合でも±25μm程度、シングルモードの場合ではさらに高い精度が必要とされており、キャンとバレルの接合精度を確保することが重要である。   When manufacturing such TOSA and ROSA, the optical axis of the optical semiconductor element of the can and the lens of the barrel are usually aligned with high accuracy, and then the barrel is fixed to the can. The tolerance of optical axis misalignment between the can optical semiconductor element and the barrel lens is about ± 5 μm for the multi-mode TOSA, about ± 25 μm for the ROSA, and higher accuracy is required for the single mode. It is important to ensure the accuracy of joining the can and the barrel.

このため、キャンとバレルの固定において、光半導体素子とレンズとの光軸ずれを引き起こさないようにすることが求められている。   For this reason, in the fixation of the can and the barrel, it is required not to cause an optical axis shift between the optical semiconductor element and the lens.

しかし、従来、キャンとバレルは熱硬化性樹脂を用いて接合されていた為、樹脂の硬化には長時間の加熱が必要であり、作業性・作業効率の悪化や、硬化中に樹脂が変形して光軸がずれてしまうという問題が指摘されていた。そこで、紫外線硬化型樹脂を用いて瞬間的に接合することも検討されているが、紫外線硬化型樹脂は接着強度が低く、未硬化部分が生じやすく、耐候性も十分でないという問題が指摘されている。   However, since the can and barrel are conventionally joined using a thermosetting resin, it takes a long time to cure the resin, resulting in deterioration of workability and work efficiency and deformation of the resin during curing. As a result, the problem that the optical axis is shifted has been pointed out. Therefore, it is also considered to use an ultraviolet curable resin to bond instantaneously, but the ultraviolet curable resin has a low adhesive strength, tends to cause an uncured portion, and has insufficient weather resistance. Yes.

かかる観点から、特許文献1は、図5に示すように、キャン101とバレル102の接合面に紫外線・加熱兼用硬化性樹脂103を塗布し、光軸合わせが完了した状態で、紫外線照射によってキャン101とバレル102との仮固定を行った後、紫外線・加熱兼用硬化性樹脂103の外側に熱硬化性樹脂104を塗布して接着補強する方法を開示している。
特開2002−090587号公報
From this point of view, as shown in FIG. 5, Patent Document 1 discloses a method in which ultraviolet / heating combined use curable resin 103 is applied to the joint surface between the can 101 and the barrel 102 and the optical axis alignment is completed, and then the can is irradiated by ultraviolet irradiation. After temporarily fixing 101 and the barrel 102, a method is disclosed in which a thermosetting resin 104 is applied to the outside of the UV / heating curable resin 103 to reinforce and bond.
JP 2002-090587 A

特許文献1に開示された方法では、熱硬化性樹脂で紫外線硬化型樹脂の接着強度不足を補っているが、熱硬化性樹脂を塗布する工程で、紫外線硬化型樹脂の上に、熱硬化型樹脂を塗布するため、機械的な接触により接着箇所が破壊されてしまうことがあった。また、接着位置(すなわち樹脂の塗布位置)が、被接着部品のエッジ部分に限られていることと、熱硬化型樹脂をもともと接着強度の弱い紫外線硬化型樹脂の上に塗布するため、熱硬化型樹脂の特性が十分発揮できないことにより、十分な接着強度が得られなかった。   In the method disclosed in Patent Document 1, the thermosetting resin compensates for the insufficient adhesive strength of the ultraviolet curable resin, but in the step of applying the thermosetting resin, the thermosetting resin is formed on the ultraviolet curable resin. Since the resin is applied, the bonded portion may be destroyed by mechanical contact. In addition, the bonding position (that is, the position where the resin is applied) is limited to the edge portion of the part to be bonded, and the thermosetting resin is originally applied onto the UV curable resin with weak adhesive strength, so thermosetting A sufficient adhesive strength could not be obtained due to the insufficient performance of the mold resin.

特に、特許文献1に開示された方法を密閉型の光モジュールに応用する場合は、バレルとキャンとの接合により形成されるバレル内側の密閉空間の内圧が、紫外線硬化型樹脂を硬化させるときの雰囲気加熱により上昇する。その結果、内圧上昇の負荷に紫外線硬化型樹脂が耐え切れず、バレルとキャンの接合状態が歪み、光軸ずれの不良が大量に発生していた。なお、特許文献1に開示された構成は、図5に示されるようにバレル102に貫通孔102aが設けられているので、膨張した気体が逃げ、このような問題は生じにくい。しかし、接合完了後に貫通孔102aを接着剤などで封止する必要があり、その分作業工程や製造コストが増加する。また、貫通孔を封止しないと、キャン上に配設された部品が外気、特に水分と接触し、劣化することになり、光モジュールの信頼性が低下する。したがって、貫通孔102aが設けられていないバレルを用いて密閉型の光モジュールを製造することが望ましかったが、上述したとおり、特許文献1によるバレルとキャンとの接合方法では、光軸ずれの不良が起きていた。   In particular, when the method disclosed in Patent Document 1 is applied to a sealed optical module, the internal pressure of the sealed space inside the barrel formed by joining the barrel and the can causes the ultraviolet curable resin to cure. Raised by atmospheric heating. As a result, the ultraviolet curable resin could not withstand the load of increasing internal pressure, the joining state of the barrel and the can was distorted, and a large amount of optical axis misalignment occurred. In the configuration disclosed in Patent Document 1, since the through hole 102a is provided in the barrel 102 as shown in FIG. 5, the expanded gas escapes and such a problem hardly occurs. However, it is necessary to seal the through-hole 102a with an adhesive or the like after the completion of joining, which increases the work process and manufacturing cost. Further, if the through hole is not sealed, the components disposed on the can come into contact with the outside air, particularly moisture, and deteriorate, and the reliability of the optical module is lowered. Accordingly, it has been desired to manufacture a sealed optical module using a barrel in which the through hole 102a is not provided. However, as described above, in the method of joining the barrel and the can according to Patent Document 1, the optical axis shift is not caused. There was a defect.

そこで、本発明は、上述した従来技術の課題に鑑み、キャンとバレルとの光軸のずれを引き起こさないように製造できる光モジュールの製造方法、及びこれを用いた光モジュールを提供することを目的とする。   SUMMARY OF THE INVENTION In view of the above-described problems of the prior art, an object of the present invention is to provide an optical module manufacturing method that can be manufactured without causing an optical axis shift between a can and a barrel, and an optical module using the same. And

本発明の光モジュールの製造方法は、光半導体素子がキャップで覆われて構成されるキャンと、該キャップが入る凹部が形成され、光半導体素子と光結合する光ファイバーが接続されるように構成されたバレルとを接合して光モジュールを製造する方法である。本製造方法は、キャンに配設されたキャップと、紫外線を透過する材料でできたバレルの凹部を形成する側壁とを接着するように、紫外線硬化型樹脂を塗布する第1の塗布工程と、バレルとキャンとの光軸を調整する光軸調整工程と、紫外線をバレルの外側からバレルを通して紫外線硬化型樹脂に照射し、紫外線硬化型樹脂を硬化させる第1の硬化工程と、バレルの凹部の開口縁とキャンとの間の隙間に熱硬化型樹脂を塗布する第2の塗布工程と、塗布された前記熱硬化型接着剤を雰囲気加熱によって硬化させる第2の硬化工程とを有している。   The optical module manufacturing method of the present invention is configured so that an optical semiconductor element is covered with a cap, a recess into which the cap is inserted is formed, and an optical fiber that is optically coupled to the optical semiconductor element is connected. This is a method of manufacturing an optical module by joining a barrel. The present manufacturing method includes a first application step of applying an ultraviolet curable resin so as to adhere a cap disposed in a can and a sidewall forming a concave portion of a barrel made of a material that transmits ultraviolet rays, An optical axis adjustment step of adjusting the optical axis of the barrel and the can; a first curing step of irradiating the ultraviolet curable resin from outside the barrel through the barrel to cure the ultraviolet curable resin; It has the 2nd application | coating process which apply | coats a thermosetting resin to the clearance gap between an opening edge and a can, and the 2nd hardening process which hardens | cures the apply | coated said thermosetting adhesive by atmospheric heating. .

上記のように第1の硬化工程では、紫外線を用いるため、光モジュールの温度上昇が抑えられ、光軸調整後のバレルとキャンは熱膨張を起こさない。このため、調整された光軸がずれることなく、バレルとキャンを固定することができる。   As described above, since ultraviolet rays are used in the first curing step, the temperature rise of the optical module is suppressed, and the barrel and the can after the optical axis adjustment do not cause thermal expansion. For this reason, the barrel and the can can be fixed without the adjusted optical axis being displaced.

紫外線硬化型樹脂の塗布位置がバレルの凹部内であるため、バレルの凹部の開口縁とキャンとの間の隙間に熱硬化型樹脂を塗布する際、紫外線硬化型樹脂による接着箇所が機械的な接触により破壊されるおそれは無くなる。さらに、バレルの凹部の開口縁とキャンとを熱硬化型樹脂のみで接着するので、熱硬化型樹脂の特性が十分発揮でき、十分な接着強度が得られる。このため、熱硬化型樹脂を雰囲気加熱によって硬化させる際、熱硬化型樹脂により密閉された内部空間の気体が膨張しても、その負荷に熱硬化型樹脂が耐えて、キャンとバレルとの光軸のずれは生じない。   Since the application position of the UV curable resin is in the recess of the barrel, when the thermosetting resin is applied to the gap between the opening edge of the recess of the barrel and the can, the adhesion location by the UV curable resin is mechanical. There is no risk of destruction by contact. Furthermore, since the opening edge of the concave portion of the barrel and the can are bonded only by the thermosetting resin, the characteristics of the thermosetting resin can be sufficiently exhibited, and sufficient adhesive strength can be obtained. For this reason, when the thermosetting resin is cured by atmospheric heating, even if the gas in the internal space sealed by the thermosetting resin expands, the thermosetting resin can withstand the load, and the light of the can and the barrel There is no shaft misalignment.

なお、上記の第2の硬化工程は、キャンとバレルからなる光モジュール全体を密閉容器に封入して行なわれることが望ましい。   The second curing step is preferably performed by sealing the entire optical module composed of a can and a barrel in a sealed container.

また、本発明の光モジュールは、光半導体素子がキャップで覆われて構成されるキャンと、キャップが入る凹部が形成され、光半導体素子と光結合する光ファイバーが接続されるように構成されたバレルと、キャンに配設されたキャップとバレルの凹部を形成する側壁とを接着する紫外線硬化型樹脂と、バレルの凹部の開口縁とキャンとの間の隙間を封止する熱硬化型樹脂とを有している。また、バレルが紫外線を透過する材料でできている。   Also, the optical module of the present invention is a barrel configured so that an optical semiconductor element is covered with a cap, and a recess into which the cap is inserted is formed, and an optical fiber that is optically coupled to the optical semiconductor element is connected to the optical module. And an ultraviolet curable resin that bonds the cap disposed on the can and the side wall that forms the concave portion of the barrel, and a thermosetting resin that seals a gap between the opening edge of the concave portion of the barrel and the can. Have. The barrel is made of a material that transmits ultraviolet rays.

以上説明したように、本発明によれば、キャンとバレルとの光軸のずれを引き起こさないように製造できる。   As described above, according to the present invention, it can be manufactured without causing the optical axis shift between the can and the barrel.

以下、図面を参照して本発明の光モジュールについて説明する。本発明はTOSAとROSAの両者に、同様の形態で適用可能であるが、以下の説明はTOSAを例におこなう。図1は、本発明の光モジュールの概略断面図である。また、図2は図1のA部の部分拡大図である。   The optical module of the present invention will be described below with reference to the drawings. The present invention can be applied to both TOSA and ROSA in the same form, but the following description will be made using TOSA as an example. FIG. 1 is a schematic cross-sectional view of an optical module of the present invention. FIG. 2 is a partially enlarged view of part A in FIG.

図1(a)は光半導体素子が設けられたキャンの断面図である。キャン2のベース21上(図面では下側)には、発光素子22と受光素子23とが配置されている。発光素子22はレーザーダイオードが代表例であり、受光素子23はフォトダイオードが代表例である。受光素子23は発光素子22の使用時に発光量をモニターするために備えられている。発光素子22と受光素子23の動作を制御する複数本の端子24がベース21の反対側に延びている。ベース21の上には発光素子22と受光素子23とを気密封止するために、金属性のキャップ25が設けられている。キャップ25の中央付近には光路の確保のため、半透明の鏡やガラス(図示せず)が付けられている。キャップ25はFe−Ni系合金やCo−Ni系合金等の金属で作られており、抵抗溶接によって接合されている。   FIG. 1A is a cross-sectional view of a can provided with an optical semiconductor element. A light emitting element 22 and a light receiving element 23 are disposed on the base 21 (lower side in the drawing) of the can 2. The light emitting element 22 is typically a laser diode, and the light receiving element 23 is typically a photodiode. The light receiving element 23 is provided to monitor the light emission amount when the light emitting element 22 is used. A plurality of terminals 24 for controlling operations of the light emitting element 22 and the light receiving element 23 extend to the opposite side of the base 21. A metallic cap 25 is provided on the base 21 in order to hermetically seal the light emitting element 22 and the light receiving element 23. Near the center of the cap 25, a semi-transparent mirror or glass (not shown) is attached to secure an optical path. The cap 25 is made of a metal such as an Fe—Ni alloy or a Co—Ni alloy, and is joined by resistance welding.

図1(b)はバレルの断面図である。バレル3は本体部分であるハウジング31と、ハウジング31に支持されたレンズ32を備えている。ハウジング31は、紫外線を透過する材料(例えばプラスチック)で作られている。ハウジング31の先端部分には開口部33が設けられており、発光素子22と光結合する光ファイバーを保持するフェルール(図示せず)が嵌合保持される。フェルールは開口部33と一体形成されていてもよい。開口部33の内側は光路孔34となっており、その先に半球状のレンズ32が設けられている。発光素子22とフェルールに保持された光ファイバーとの光結合は、レンズ32および光路孔34を介して行われる。光結合を精度よく行なうため、レンズ32の取り付けには高い調芯精度が求められるが、方向性のない球形レンズを用いてもよい。   FIG.1 (b) is sectional drawing of a barrel. The barrel 3 includes a housing 31 which is a main body portion, and a lens 32 supported by the housing 31. The housing 31 is made of a material that transmits ultraviolet rays (for example, plastic). An opening 33 is provided at the tip of the housing 31, and a ferrule (not shown) that holds an optical fiber that is optically coupled to the light emitting element 22 is fitted and held. The ferrule may be formed integrally with the opening 33. The inside of the opening 33 is an optical path hole 34, and a hemispherical lens 32 is provided at the end. Optical coupling between the light emitting element 22 and the optical fiber held by the ferrule is performed through the lens 32 and the optical path hole 34. In order to perform optical coupling with high accuracy, high alignment accuracy is required for mounting the lens 32, but a spherical lens having no directivity may be used.

また、ハウジング31にはレンズ32を囲むように側壁35が形成されており、その側壁によって、キャン2のキャップ25を入れることができる凹部36が形成されている。   Further, a side wall 35 is formed in the housing 31 so as to surround the lens 32, and a concave portion 36 into which the cap 25 of the can 2 can be put is formed by the side wall.

図1(c)は光モジュールの断面図である。光モジュール1は、キャン2のキャップ25をバレル3のハウジング31に形成された凹部36内に入れた状態で、キャン2とバレル3を紫外線硬化型樹脂4および熱硬化型樹脂5によって接合して形成されている。図2に示すように、紫外線硬化型樹脂4は、キャン2に配設されたキャップ25の外周面の一部である第1の接合面26および、これに対向する、バレル3のハウジング31に形成された側壁35の一部である第1の接合面37を互いに接着している。熱硬化型樹脂5は、バレル3のハウジング31に形成された凹部36の開口縁である第2の接合面38および、これに対向する、キャン2のベース21上の第2の接合面27を互い接着して、キャン2とバレル3との隙間を埋めている。これにより、キャン2とバレル3との間に、密閉された内部空間6が形成される。   FIG. 1C is a cross-sectional view of the optical module. In the optical module 1, the can 2 and the barrel 3 are joined with the ultraviolet curable resin 4 and the thermosetting resin 5 in a state where the cap 25 of the can 2 is placed in the recess 36 formed in the housing 31 of the barrel 3. Is formed. As shown in FIG. 2, the ultraviolet curable resin 4 is applied to the first joint surface 26 that is a part of the outer peripheral surface of the cap 25 disposed on the can 2 and the housing 31 of the barrel 3 that faces the first joint surface 26. The first joining surfaces 37 that are part of the formed side walls 35 are bonded to each other. The thermosetting resin 5 includes a second joining surface 38 that is an opening edge of the recess 36 formed in the housing 31 of the barrel 3 and a second joining surface 27 on the base 21 of the can 2 that faces the second joining surface 38. The gap between the can 2 and the barrel 3 is filled by adhering to each other. As a result, a sealed internal space 6 is formed between the can 2 and the barrel 3.

このように、光モジュール1は密閉構造型のモジュールである。キャン2およびバレル3には、内部空間6と外部とが連通する開口や貫通孔は設けられていない。このため、内部空間6に存在するキャップ25が外気、特に水分と接触し、光モジュールの信頼性が低下することが防止される。   Thus, the optical module 1 is a sealed structure type module. The can 2 and the barrel 3 are not provided with openings or through holes through which the internal space 6 communicates with the outside. For this reason, it is prevented that the cap 25 existing in the internal space 6 comes into contact with outside air, particularly moisture, and the reliability of the optical module is deteriorated.

ROSAは、図4に示すように、図1に示すTOSAと基本的に同一構造であるが、発光素子22の代わりに受光素子(フォトダイオード等)が設けられている。また、レンズはTOSAにおける半球状のレンズ32の代わりに球形レンズ39を用いることができる。その理由は、TOSAではレンズを通る光の位相を揃えて光ファイバーに供給する必要があるのに対して、ROSAではそのような必要がなく、通常は安価な球形レンズで十分であるためである。   As shown in FIG. 4, ROSA has basically the same structure as TOSA shown in FIG. 1, but a light receiving element (such as a photodiode) is provided instead of light emitting element 22. In addition, a spherical lens 39 can be used instead of the hemispherical lens 32 in TOSA. This is because in TOSA it is necessary to align the phase of light passing through the lens and supply it to the optical fiber, whereas in ROSA this is not necessary, and an inexpensive spherical lens is usually sufficient.

なお、図4に示すようにROSAの場合も、キャン2とバレル3の接合は紫外線硬化型樹脂4および熱硬化型樹脂5を使用している。具体的には、紫外線硬化型樹脂4は、キャン2に配設されたキャップ25の外周面の一部と、これに対向する、バレル3のハウジング31に形成された側壁35の一部とを互いに接着している。熱硬化型樹脂5は、バレル3のハウジング31に形成された凹部36の開口縁と、これに対向する、キャン2のベース21の上面とを互い接着して、キャン2とバレル3との隙間を埋めている。   As shown in FIG. 4, also in the case of ROSA, the joining between the can 2 and the barrel 3 uses an ultraviolet curable resin 4 and a thermosetting resin 5. Specifically, the ultraviolet curable resin 4 includes a part of the outer peripheral surface of the cap 25 disposed in the can 2 and a part of the side wall 35 formed on the housing 31 of the barrel 3 that faces the part. Adhere to each other. The thermosetting resin 5 adheres the opening edge of the recess 36 formed in the housing 31 of the barrel 3 and the upper surface of the base 21 of the can 2 opposite to each other so that the gap between the can 2 and the barrel 3 Is buried.

次に、以上説明した光モジュールの製造方法について、TOSAを例に図面を参照して説明する。図3A〜3Eは、本実施形態における光モジュールの製造工程を示す図である。なお、これらの図では、キャップ内の部品を省略してある。   Next, the optical module manufacturing method described above will be described with reference to the drawings, taking TOSA as an example. 3A to 3E are diagrams illustrating a manufacturing process of the optical module in the present embodiment. In these drawings, parts in the cap are omitted.

まず、図3Aに示すようにキャン2およびバレル3を用意する。   First, as shown in FIG. 3A, a can 2 and a barrel 3 are prepared.

次に、図3Bに示すように、キャン2に配設されたキャップ25の外周面の一部である第1の接合面26に紫外線硬化型樹脂4を塗布する(第1の塗布工程)。ただし、紫外線硬化型樹脂4はバレル3のハウジング31に形成された側壁35の第1の接合面37、または第1の接合面26,37の双方に塗布してもよい。紫外線硬化型樹脂4としては、例えばアクリルウレタン樹脂(粘度3Pa・s、熱変形温度Tg=20℃)を用いた。   Next, as shown in FIG. 3B, the ultraviolet curable resin 4 is applied to the first bonding surface 26 that is a part of the outer peripheral surface of the cap 25 disposed in the can 2 (first application step). However, the ultraviolet curable resin 4 may be applied to the first bonding surface 37 of the side wall 35 formed on the housing 31 of the barrel 3 or both the first bonding surfaces 26 and 37. As the ultraviolet curable resin 4, for example, an acrylic urethane resin (viscosity 3 Pa · s, thermal deformation temperature Tg = 20 ° C.) was used.

次に、図3Cに示すように、キャン2とバレル3を近づけ、キャン2をバレル3に嵌合する。この結果、キャン2に配設されたキャップ25の外周面の一部と、これに対応する、バレル3のハウジング31に形成された側壁35とが、紫外線硬化型樹脂4を介して接続される。なお、あらかじめ、バレル3の開口部33には、光量の測定装置が付いたファイバ(不図示)を挿入しておく。そして、キャン2には仮の配線(不図示)を施して、発光素子(不図示)を駆動することができるように準備しておく。キャン2をバレル3に嵌合した後、バレル2に備えられたレンズ32とキャン3に配置された発光素子(不図示)との光軸が一致するように、バレル2とキャン3の相対位置を調整する(光軸調整工程)。具体的には、発光素子を動作させ、その出力光をファイバから取り出し、取り出した発光素子の出射光の光量が最大になるように、バレル2とキャン3の相対位置を調整する。紫外線硬化型樹脂4は後述するようにバレル2とキャン3との仮止めのために塗布されるものであり、塗布量も少量であるので、調整は容易である。   Next, as shown in FIG. 3C, the can 2 and the barrel 3 are brought close to each other, and the can 2 is fitted into the barrel 3. As a result, a part of the outer peripheral surface of the cap 25 disposed on the can 2 and the corresponding side wall 35 formed on the housing 31 of the barrel 3 are connected via the ultraviolet curable resin 4. . A fiber (not shown) with a light amount measuring device is inserted in advance into the opening 33 of the barrel 3. The can 2 is provided with provisional wiring (not shown) so that the light emitting element (not shown) can be driven. After the can 2 is fitted to the barrel 3, the relative position of the barrel 2 and the can 3 so that the optical axes of the lens 32 provided in the barrel 2 and the light emitting elements (not shown) arranged in the can 3 coincide. Is adjusted (optical axis adjustment step). Specifically, the light emitting element is operated, the output light is extracted from the fiber, and the relative position of the barrel 2 and the can 3 is adjusted so that the amount of light emitted from the extracted light emitting element is maximized. As will be described later, the ultraviolet curable resin 4 is applied for temporarily fixing the barrel 2 and the can 3, and the amount of application is small, so that adjustment is easy.

上記のように光軸を調整したら、バレル2とキャン3の光軸がずれないように、不図示の保持治具によってそれらを保持する。   Once the optical axes are adjusted as described above, they are held by a holding jig (not shown) so that the optical axes of the barrel 2 and the can 3 do not shift.

次に、図3Dに示すように、紫外線を透過できる材料からなるバレル3の周囲に複数の紫外線ランプ7を配置する。そして、紫外線を、バレル3の周囲からバレル3を通して、キャン2に配設されたキャップ25の外周面とバレル3のハウジング31に形成された側壁35との間に存在する紫外線硬化型樹脂4に照射し、紫外線硬化型樹脂4を硬化させる(第1の硬化工程)。紫外線照射中、バレル2とキャン3の光軸位置が変わらないように、不図示の保持治具によってそれらを保持し続ける。本例では、紫外線を40秒間照射した。紫外線の照度は紫外線ランプ一台当たり3W/cm2 とした。このような工程により、キャン2とバレル3とを仮止めした。 Next, as shown in FIG. 3D, a plurality of ultraviolet lamps 7 are arranged around the barrel 3 made of a material that can transmit ultraviolet rays. Then, ultraviolet rays are passed from the periphery of the barrel 3 through the barrel 3 to the ultraviolet curable resin 4 existing between the outer peripheral surface of the cap 25 disposed on the can 2 and the side wall 35 formed on the housing 31 of the barrel 3. Irradiate to cure the ultraviolet curable resin 4 (first curing step). During UV irradiation, the optical axis positions of the barrel 2 and the can 3 are kept held by a holding jig (not shown) so as not to change. In this example, ultraviolet rays were irradiated for 40 seconds. The illuminance of ultraviolet rays was 3 W / cm 2 per ultraviolet lamp. By such a process, the can 2 and the barrel 3 were temporarily fixed.

次に、図3Eに示すように、樹脂注入機8により、熱硬化型樹脂5を、バレル3のハウジング31に形成された凹部36の開口縁である第2の接合面38および、これに対向する、キャン2のベース21上の第2の接合面27との間に塗布する(図2参照)。具体的には、図3Eに示すように、仮止めしたキャン2とバレル3を回転させながら、熱硬化型樹脂5をバレル3の周辺から、第2の接合面27,38の間に流し込むようにして塗布する(第2の塗布工程)。この熱硬化型樹脂5により、キャン2とバレル3との間に、密閉された内部空間6が形成され、光モジュールの信頼性が向上する。なお、前述した紫外線硬化型樹脂4によっては内部空間6は密閉されていない。   Next, as shown in FIG. 3E, the thermosetting resin 5 is opposed to the second bonding surface 38 which is the opening edge of the recess 36 formed in the housing 31 of the barrel 3 by the resin injecting machine 8. It is applied between the second bonding surface 27 on the base 21 of the can 2 (see FIG. 2). Specifically, as shown in FIG. 3E, the thermosetting resin 5 is poured from the periphery of the barrel 3 between the second joining surfaces 27 and 38 while rotating the temporarily fixed can 2 and barrel 3. Then, it is applied (second application step). By this thermosetting resin 5, a sealed internal space 6 is formed between the can 2 and the barrel 3, and the reliability of the optical module is improved. The internal space 6 is not sealed by the ultraviolet curable resin 4 described above.

熱硬化型樹脂5はキャン2とバレル3の最終的な接合を目的とするものであるため、塗布量は紫外線硬化型樹脂4より大目とするのが望ましい。熱硬化型樹脂5としては、例えばエポキシ樹脂(粘度22.5Pa・s、熱変形温度Tg=94℃)を用いた。このように本例の熱硬化型樹脂5は紫外線硬化型樹脂4よりも高い硬化温度を有している。これは、熱硬化型樹脂5は最終的な接合のための接着剤であり、TOSAとしての信頼性を高めるためにはできるだけ硬化温度の高い樹脂を用いて、高い温度で硬化させることが望ましいからである。   Since the thermosetting resin 5 is intended for final joining of the can 2 and the barrel 3, it is desirable that the coating amount be larger than that of the ultraviolet curable resin 4. As the thermosetting resin 5, for example, an epoxy resin (viscosity 22.5 Pa · s, heat distortion temperature Tg = 94 ° C.) was used. Thus, the thermosetting resin 5 of this example has a higher curing temperature than the ultraviolet curable resin 4. This is because the thermosetting resin 5 is an adhesive for final bonding, and in order to increase the reliability as the TOSA, it is desirable to cure at a high temperature using a resin having a high curing temperature as much as possible. It is.

また、上記熱硬化型樹脂5の塗布工程は、窒素環境下で行われることが望ましい。これによって、熱硬化型樹脂5によりキャン2とバレル3を密着させる際に、内部空間6が窒素ガスで充填され、空気中の酸素や水分による発光素子22,受光素子23や樹脂4,5の劣化を抑制することができる。   Moreover, it is desirable that the coating process of the thermosetting resin 5 is performed in a nitrogen environment. As a result, when the can 2 and the barrel 3 are brought into close contact with the thermosetting resin 5, the internal space 6 is filled with nitrogen gas, and the light emitting element 22, the light receiving element 23, and the resins 4, 5 are formed by oxygen or moisture in the air. Deterioration can be suppressed.

最後に、塗布された熱硬化型樹脂5を雰囲気加熱によって硬化させて、キャン2とバレル3とを固定する(第2の硬化工程)。雰囲気加熱は、一般的な加熱炉(オーブン)で行なうことができる。本例では、加熱炉において95℃、60分の加熱処理を行なって硬化させた。   Finally, the applied thermosetting resin 5 is cured by atmospheric heating to fix the can 2 and the barrel 3 (second curing step). The atmosphere heating can be performed in a general heating furnace (oven). In this example, curing was performed by performing a heat treatment at 95 ° C. for 60 minutes in a heating furnace.

この加熱の際、密閉された内部空間6の気体が熱膨張し、膨張した気体が熱硬化型樹脂5に入り込み、熱硬化型樹脂5に気泡が発生するおそれがある。このため、キャン2とバレル3からなる光モジュール全体を密閉容器に封入して加熱することが望ましい。すなわち、このように加熱することで、光モジュール全体と密閉容器との間に封入された気体と、内部空間6の気体との両方が熱膨張するので、内部空間6とこの外側との圧力差が小さくなる。その結果、熱硬化型樹脂5に対して内部空間6の内圧の影響が及びにくく、気泡の発生を防止することができる。   During this heating, the gas in the sealed internal space 6 is thermally expanded, and the expanded gas may enter the thermosetting resin 5, and bubbles may be generated in the thermosetting resin 5. For this reason, it is desirable to heat the entire optical module composed of the can 2 and the barrel 3 in a sealed container. That is, by heating in this way, both the gas sealed between the entire optical module and the sealed container and the gas in the internal space 6 are thermally expanded, so that the pressure difference between the internal space 6 and the outside thereof. Becomes smaller. As a result, it is difficult for the internal pressure of the internal space 6 to affect the thermosetting resin 5, and the generation of bubbles can be prevented.

以上説明したように、本発明では、バレル3がUV透過材料で形成されている。そして、キャン2に配設されたキャップ25の外周の一部と、バレル3の凹部36を形成する側壁35とを、紫外線硬化型樹脂4で接着し、バレル3とキャン2の光軸を合わせた状態で、バレル3の外側から紫外線により紫外線硬化型樹脂4を硬化させてバレル3とキャン2を仮止めしている。このように紫外線を用いるため、光モジュールの温度上昇が抑えられ、バレル3とキャン2は熱膨張を起こさない。このため、調整された光軸がずれることなく、バレル3とキャン2は固定される。   As described above, in the present invention, the barrel 3 is formed of a UV transmissive material. Then, a part of the outer periphery of the cap 25 disposed on the can 2 and the side wall 35 forming the recess 36 of the barrel 3 are bonded with the ultraviolet curable resin 4 so that the optical axes of the barrel 3 and the can 2 are aligned. In this state, the ultraviolet curable resin 4 is cured by ultraviolet rays from the outside of the barrel 3 to temporarily fix the barrel 3 and the can 2. Since ultraviolet rays are used in this way, the temperature rise of the optical module is suppressed, and the barrel 3 and the can 2 do not undergo thermal expansion. For this reason, the barrel 3 and the can 2 are fixed without the adjusted optical axis being displaced.

また、紫外線硬化型樹脂4の塗布位置がバレル3の凹部36内であるため、バレル3の凹部36の開口縁と、これに対向するキャン2のベース21との隙間に熱硬化型樹脂5を塗布する際、紫外線硬化型樹脂4による接着箇所が機械的な接触により破壊されるおそれは無くなる。さらに、バレル3の凹部36の開口縁と、これに対向するキャン2のベース21とを熱硬化型樹脂5のみで接着するので、熱硬化型樹脂の特性が十分発揮でき、十分な接着強度が得られる。このため、熱硬化型樹脂5を雰囲気加熱によって硬化させる際、熱硬化型樹脂5により密閉された内部空間6の気体が膨張しても、その負荷に熱硬化型樹脂5が耐えて、キャン2とバレル3との光軸のずれは生じない。   Further, since the application position of the ultraviolet curable resin 4 is in the concave portion 36 of the barrel 3, the thermosetting resin 5 is placed in the gap between the opening edge of the concave portion 36 of the barrel 3 and the base 21 of the can 2 facing this. At the time of application, there is no possibility that the bonded portion by the ultraviolet curable resin 4 is broken due to mechanical contact. Furthermore, since the opening edge of the concave portion 36 of the barrel 3 and the base 21 of the can 2 facing this are bonded only by the thermosetting resin 5, the characteristics of the thermosetting resin can be sufficiently exhibited, and sufficient adhesive strength can be obtained. can get. Therefore, when the thermosetting resin 5 is cured by atmospheric heating, even if the gas in the internal space 6 sealed by the thermosetting resin 5 expands, the thermosetting resin 5 can withstand the load, and the can 2 And the optical axis of the barrel 3 do not shift.

本発明が適用されるTOSAの概略断面図である。It is a schematic sectional drawing of TOSA with which this invention is applied. 図1のA部の部分拡大図である。It is the elements on larger scale of the A section of FIG. 本実施形態における光モジュールの製造工程を示す図である。It is a figure which shows the manufacturing process of the optical module in this embodiment. 本実施形態における光モジュールの製造工程を示す図である。It is a figure which shows the manufacturing process of the optical module in this embodiment. 本実施形態における光モジュールの製造工程を示す図である。It is a figure which shows the manufacturing process of the optical module in this embodiment. 本実施形態における光モジュールの製造工程を示す図である。It is a figure which shows the manufacturing process of the optical module in this embodiment. 本実施形態における光モジュールの製造工程を示す図である。It is a figure which shows the manufacturing process of the optical module in this embodiment. 本発明が適用されるROSAの概略断面図である。It is a schematic sectional drawing of ROSA to which this invention is applied. 従来の光モジュールにおけるキャンとバレルの接合方法を説明するための断面図である。It is sectional drawing for demonstrating the joining method of the can and barrel in the conventional optical module.

符号の説明Explanation of symbols

1 光モジュール
2 キャン
22 発光素子
23 受光素子
26 第1の接合面
27 第2の接合面
3 バレル
31 ハウジング
32 レンズ
35 側壁
36 凹部
37 第1の接合面
38 第2の接合面
39 球形レンズ
4 紫外線硬化型樹脂
5 熱硬化型樹脂
6 内部空間
7 紫外線ランプ
8 樹脂注入機
DESCRIPTION OF SYMBOLS 1 Optical module 2 Can 22 Light emitting element 23 Light receiving element 26 1st junction surface 27 2nd junction surface 3 Barrel 31 Housing 32 Lens 35 Side wall 36 Recessed part 37 1st junction surface 38 2nd junction surface 39 Spherical lens 4 Ultraviolet light Curing resin 5 Thermosetting resin 6 Internal space 7 UV lamp 8 Resin injection machine

Claims (3)

光半導体素子がキャップで覆われて構成されるキャンと、該キャップが入る凹部が形成され、前記光半導体素子と光結合する光ファイバーが接続されるように構成されたバレルとを接合して光モジュールを製造する方法であって、
前記キャンに配設された前記キャップと、紫外線を透過する材料でできた前記バレルの前記凹部を形成する側壁とを接着するように、紫外線硬化型樹脂を塗布する第1の塗布工程と、
前記バレルと前記キャンとの光軸を調整する光軸調整工程と、
紫外線を前記バレルの外側から前記バレルを通して前記紫外線硬化型樹脂に照射し、前記紫外線硬化型樹脂を硬化させる第1の硬化工程と、
前記バレルの前記凹部の開口縁と前記キャンとの間の隙間に熱硬化型樹脂を塗布する第2の塗布工程と、
塗布された前記熱硬化型樹脂を雰囲気加熱によって硬化させる第2の硬化工程と、
を有する、光モジュールの製造方法。
An optical module is formed by joining a can formed by covering an optical semiconductor element with a cap and a barrel formed with a recess into which the cap is inserted and configured to connect an optical fiber that is optically coupled to the optical semiconductor element. A method of manufacturing
A first application step of applying an ultraviolet curable resin so as to adhere the cap disposed on the can and a side wall forming the concave portion of the barrel made of a material that transmits ultraviolet rays;
An optical axis adjustment step of adjusting the optical axis of the barrel and the can;
A first curing step of irradiating the ultraviolet curable resin with ultraviolet rays from the outside of the barrel through the barrel to cure the ultraviolet curable resin;
A second application step of applying a thermosetting resin to a gap between the opening edge of the concave portion of the barrel and the can;
A second curing step of curing the applied thermosetting resin by atmospheric heating;
An optical module manufacturing method comprising:
前記第2の硬化工程は、前記キャンと前記バレルからなる光モジュール全体を密閉容器に封入して行なわれる、請求項1に記載の光モジュールの製造方法。   The method of manufacturing an optical module according to claim 1, wherein the second curing step is performed by enclosing the entire optical module including the can and the barrel in a sealed container. 光半導体素子がキャップで覆われて構成されるキャンと、
前記キャップが入る凹部が形成され、前記光半導体素子と光結合する光ファイバーが接続されるように構成されたバレルと、
前記キャンに配設された前記キャップと前記バレルの前記凹部を形成する側壁とを接着する紫外線硬化型樹脂と、
前記バレルの前記凹部の開口縁と前記キャンとの間の隙間を封止する熱硬化型樹脂と、を有し、
前記バレルが紫外線を透過する材料でできている、光モジュール。
A can composed of an optical semiconductor element covered with a cap;
A barrel formed with a recess into which the cap enters, and an optical fiber that is optically coupled to the optical semiconductor element;
An ultraviolet curable resin for adhering the cap disposed on the can and a side wall forming the concave portion of the barrel;
A thermosetting resin that seals a gap between the opening edge of the concave portion of the barrel and the can;
An optical module in which the barrel is made of a material that transmits ultraviolet rays.
JP2005330213A 2005-11-15 2005-11-15 Optical module manufacturing method and optical module Active JP4732139B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005330213A JP4732139B2 (en) 2005-11-15 2005-11-15 Optical module manufacturing method and optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005330213A JP4732139B2 (en) 2005-11-15 2005-11-15 Optical module manufacturing method and optical module

Publications (2)

Publication Number Publication Date
JP2007139877A true JP2007139877A (en) 2007-06-07
JP4732139B2 JP4732139B2 (en) 2011-07-27

Family

ID=38202860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005330213A Active JP4732139B2 (en) 2005-11-15 2005-11-15 Optical module manufacturing method and optical module

Country Status (1)

Country Link
JP (1) JP4732139B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009246040A (en) * 2008-03-28 2009-10-22 Mitsubishi Electric Corp Laser light source device
JP2010210920A (en) * 2009-03-10 2010-09-24 Sumitomo Electric Ind Ltd Optical module
JP2010263070A (en) * 2009-05-07 2010-11-18 Nichia Corp Semiconductor laser module and manufacturing method thereof
JP2015041736A (en) * 2013-08-23 2015-03-02 ウシオ電機株式会社 Semiconductor laser device
WO2016121725A1 (en) * 2015-01-29 2016-08-04 三菱電機株式会社 Light-source device

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08110448A (en) * 1994-10-12 1996-04-30 Hitachi Ltd Semiconductor optical coupling device and its assembling method
JPH08110447A (en) * 1994-10-12 1996-04-30 Hitachi Ltd Optical semiconductor module and its assembling method
JPH08234058A (en) * 1995-02-24 1996-09-13 Hamamatsu Photonics Kk Optical module device
JPH08234059A (en) * 1995-02-24 1996-09-13 Hamamatsu Photonics Kk Optical module device
JPH08335744A (en) * 1995-06-06 1996-12-17 Hitachi Ltd Optical semiconductor module and its assembling method
JPH0933763A (en) * 1995-07-20 1997-02-07 Matsushita Electric Ind Co Ltd Light receiving element module and its assembling method
JPH11186608A (en) * 1997-12-25 1999-07-09 Sumitomo Electric Ind Ltd Optical module
JPH11186609A (en) * 1997-12-25 1999-07-09 Sumitomo Electric Ind Ltd Optical module
JP2000155251A (en) * 1998-09-16 2000-06-06 Rohm Co Ltd Method for coupling members and optical parts formed by using the same
JP2002090587A (en) * 2000-07-07 2002-03-27 Nippon Sheet Glass Co Ltd Method for manufacturing optical module
JP2003075687A (en) * 2001-08-30 2003-03-12 Kyocera Corp Optical device
JP2006190783A (en) * 2005-01-05 2006-07-20 Sumitomo Electric Ind Ltd Optical module and method of manufacturing the same
JP2006201392A (en) * 2005-01-19 2006-08-03 Sumitomo Electric Ind Ltd Optical module
JP2007127925A (en) * 2005-11-07 2007-05-24 Seiko Epson Corp Optical module and method of manufacturing optical module

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08110448A (en) * 1994-10-12 1996-04-30 Hitachi Ltd Semiconductor optical coupling device and its assembling method
JPH08110447A (en) * 1994-10-12 1996-04-30 Hitachi Ltd Optical semiconductor module and its assembling method
JPH08234058A (en) * 1995-02-24 1996-09-13 Hamamatsu Photonics Kk Optical module device
JPH08234059A (en) * 1995-02-24 1996-09-13 Hamamatsu Photonics Kk Optical module device
JPH08335744A (en) * 1995-06-06 1996-12-17 Hitachi Ltd Optical semiconductor module and its assembling method
JPH0933763A (en) * 1995-07-20 1997-02-07 Matsushita Electric Ind Co Ltd Light receiving element module and its assembling method
JPH11186608A (en) * 1997-12-25 1999-07-09 Sumitomo Electric Ind Ltd Optical module
JPH11186609A (en) * 1997-12-25 1999-07-09 Sumitomo Electric Ind Ltd Optical module
JP2000155251A (en) * 1998-09-16 2000-06-06 Rohm Co Ltd Method for coupling members and optical parts formed by using the same
JP2002090587A (en) * 2000-07-07 2002-03-27 Nippon Sheet Glass Co Ltd Method for manufacturing optical module
JP2003075687A (en) * 2001-08-30 2003-03-12 Kyocera Corp Optical device
JP2006190783A (en) * 2005-01-05 2006-07-20 Sumitomo Electric Ind Ltd Optical module and method of manufacturing the same
JP2006201392A (en) * 2005-01-19 2006-08-03 Sumitomo Electric Ind Ltd Optical module
JP2007127925A (en) * 2005-11-07 2007-05-24 Seiko Epson Corp Optical module and method of manufacturing optical module

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009246040A (en) * 2008-03-28 2009-10-22 Mitsubishi Electric Corp Laser light source device
JP2010210920A (en) * 2009-03-10 2010-09-24 Sumitomo Electric Ind Ltd Optical module
US8480313B2 (en) 2009-03-10 2013-07-09 Sumitomo Electric Industries, Ltd. Optical subassembly having sleeve and optical device assembled with sleeve by ribs and hollow
JP2010263070A (en) * 2009-05-07 2010-11-18 Nichia Corp Semiconductor laser module and manufacturing method thereof
JP2015041736A (en) * 2013-08-23 2015-03-02 ウシオ電機株式会社 Semiconductor laser device
WO2016121725A1 (en) * 2015-01-29 2016-08-04 三菱電機株式会社 Light-source device
JPWO2016121725A1 (en) * 2015-01-29 2017-04-27 三菱電機株式会社 Light source device
US10539280B2 (en) 2015-01-29 2020-01-21 Mitsubishi Electric Corporation Light-source device

Also Published As

Publication number Publication date
JP4732139B2 (en) 2011-07-27

Similar Documents

Publication Publication Date Title
JP4732139B2 (en) Optical module manufacturing method and optical module
US7207731B2 (en) Optical module and method of manufacturing the same
JP2007012682A (en) Manufacturing method of optical module
JP4093435B2 (en) Manufacturing method of optical module
JP2010139626A (en) Optical apparatus, imaging apparatus, and manufacturing method for optical apparatus
US6812057B2 (en) Method of producing an optical module
US6742938B2 (en) Optical module for coupling an optical semiconductor element having a sealing cap with an optical fiber
US20210033804A1 (en) Transistor outline package and method for producing a transistor outline package
US8790483B2 (en) Method of weldbonding and a device comprising weldbonded components
US20050175298A1 (en) Optical module aligned after assembly
JP4765563B2 (en) Optical module
JP2007193270A (en) Lens with cap and manufacturing method therefor
JP2000155251A (en) Method for coupling members and optical parts formed by using the same
JP2009093041A (en) Optical module
JP2002090587A (en) Method for manufacturing optical module
JP2008116553A (en) Optical assembly
KR20110020174A (en) Optical device and method of manufacturing the same
JP2008116552A (en) Optical assembly
JP2010210920A (en) Optical module
US11879611B2 (en) Light module with a bulb shield and method for fastening a bulb shield in a position precisely
US6880984B2 (en) Laser platform
JP2004271817A (en) Optical module, and method for manufacturing optical module
JP2022038900A (en) Imaging module, manufacturing method therefor, and imaging apparatus
US7374348B2 (en) Optoelectronic device
JPH08234059A (en) Optical module device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080930

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101208

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110303

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110323

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110420

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140428

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4732139

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S633 Written request for registration of reclamation of name

Free format text: JAPANESE INTERMEDIATE CODE: R313633

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250