JP2009243747A - Heat pump type hot water supply heater - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat pump type hot water supply heater for transmitting heat of a refrigerant to water of a floor heating pipe more than to water in a hot water supply pipe as a result. <P>SOLUTION: In a heat exchanger 14, a refrigerant pipe 41 into which the refrigerant circulating in a heat pump cycle flows, the floor heating pipe 42 into which water or an antifreezing solution circulating in a floor heating circuit flows, and the hot water supply pipe 43 having a smaller pipe diameter than the floor heating pipe 42 and in which water supplied to a hot water supply circuit flows, are repeatedly contacted and laminated in this order. Each pair of the refrigerant pipe 41 and the floor heating pipe 42, the floor heating pipe 42 and the hot water supply pipe 43, the hot water supply pipe 43 and the refrigerant pipe 41, are thermally connected. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  TECHNICAL FIELD The present invention relates to a heat pump hot water heater having a heat exchanger that heats water for floor heating or hot water supply by heat exchange with a refrigerant circulated in a heat pump cycle, and particularly relates to a piping structure in the heat exchanger. Is.

Conventionally, a heat pump cycle to which a compressor, an expansion valve, a water heat exchanger, an outdoor air heat exchanger, and the like are connected, and a heat exchanger that heats water by heat exchange with a refrigerant circulated in the heat pump cycle are provided. A heat pump hot water supply system is known. For example, Patent Document 1 discloses a heat pump bath water heater that heats water used for hot water supply and a bathtub by heat exchange with a refrigerant.
Here, FIGS. 5A and 5B are diagrams in which the reference numerals are changed with reference to FIGS. As shown in FIGS. 5 (a) and 5 (b), in the water heat exchanger 100 disclosed in Patent Document 1, hot water supply piping in which hot water is circulated on both sides of the refrigerant piping 102 through which the refrigerant is circulated. 101 and the piping 103 for bathtubs through which the water for bathtubs distribute | circulates so that it may contact. The refrigerant pipe 102 and the hot water supply pipe 101, and the refrigerant pipe 102 and the bathtub pipe 103 are brazed. Thereby, in the water heat exchanger 100, the water flowing through the hot water supply pipe 101 and the bathtub pipe 103 can be heated by heat exchange with the refrigerant circulated through the refrigerant pipe 102.
JP 2003-65602 A

By the way, as disclosed in Patent Document 1, when using hot water heated by heat exchange with a refrigerant for hot water supply and a bathtub, a large amount of hot water is required to be biased to either one of them. Very Hard to think.
However, instead of the bathtub pipe 103, a pipe for circulating hot water (hereinafter referred to as “floor heating pipe 103”) is provided in the floor heating device, and the hot water heated by heat exchange with the refrigerant is provided. Considering the use of water for hot water supply and floor heating, the floor heating side requires a larger amount of hot water than hot water supply in order to distribute hot water throughout the floor surface.
However, in the water heat exchanger 100, as shown in FIG. 5B, the hot water supply pipe 101 and the floor heating pipe 103 have the same diameter, and the hot water supply pipe 101 and the floor heating pipe are the same. The amount of water 103 is the same. Therefore, it is conceivable to supply a larger amount of hot water than hot water supply to the floor heating side by increasing the flow rate of water in the floor heating pipe 103 or increasing the pipe diameter of the floor heating pipe 103. However, in that case, a heat pump such as increasing the flow rate of the refrigerant in the refrigerant pipe 101 or increasing the diameter of the refrigerant pipe 101 in order to sufficiently heat a large amount of hot water flowing through the floor heating pipe 103. There is a problem that high performance of the cycle is required and the cost is increased. Further, when the pipe diameter of the refrigerant pipe 101 is increased, for example, when only hot water supply is executed, originally unnecessary energy consumption occurs.
In addition, heat transfer from the refrigerant in the refrigerant pipe 101 to the water in the floor heating pipe 103 is performed only at one location of the brazing portion of these pipes, and thus the amount of heat transfer is limited. In the water heat exchanger 100, the hot water supply pipe 101 and the bathtub pipe 103 are not brazed and cannot be said to be thermally coupled. Therefore, even if the pipe diameter of the hot water supply pipe 101 is made smaller than the pipe diameter of the floor heating pipe 103 as in the present invention, heat transfer from the water in the hot water supply pipe 101 to the water in the floor heating pipe 103 is performed. It is hard to say that it is done.
Accordingly, the present invention has been made in view of the above circumstances, and the object of the present invention is to be able to transmit more heat of the refrigerant to the water of the floor heating pipe than the water of the hot water supply pipe as a result. The object is to provide a heat pump hot water heater.

To achieve the above object, the present invention includes a heat pump cycle in which a refrigerant is circulated, a heat exchanger that exchanges heat between the refrigerant circulated in the heat pump cycle and water or antifreeze, and the heat exchanger. Applicable to a heat pump hot water heater comprising a floor heating circuit for circulating heated hot water or antifreeze liquid to a floor heating device, and a hot water supply circuit for storing or supplying hot water heated by the heat exchanger. The heat exchanger includes a refrigerant pipe through which a refrigerant circulated through the heat pump cycle, a floor heating pipe through which water or an antifreeze liquid circulated through the floor heating circuit, and the floor A hot water supply pipe having a pipe diameter smaller than that of the heating pipe and through which water supplied to the hot water supply circuit is repeatedly contacted in this order and laminated, and the refrigerant pipe and the floor heating pipe The floor heating pipe and the hot water supply pipe, configured as a heat pump hot-water heating units, wherein each of the refrigerant pipe and the hot water supply pipe, which are thermally coupled. For example, it is conceivable that each pipe is thermally coupled using welding, soldering, brazing, a thermally conductive adhesive, or the like. Further, the heat exchanger can be considered to be bent into any one of a substantially rectangular shape, a substantially flat shape, a substantially circular shape, and a substantially elliptical shape in plan view.
According to the present invention, since the pipe diameter of the hot water supply pipe is smaller than the pipe diameter of the floor heating pipe, the water in the hot water supply pipe and the floor heating pipe is exchanged by heat exchange with the refrigerant in the refrigerant pipe. When the water is heated, the temperature of the water is higher in the hot water supply pipe than in the floor heating pipe.
In the heat exchanger, since the floor heating pipe and the hot water supply pipe are thermally coupled, heat is generated between the hot water flowing through the hot water supply pipe and the hot water flowing through the floor heating pipe. Exchange is performed. That is, the water in the floor heating pipe is heated by the water in the hot water supply pipe. Therefore, as a result, the amount of heat transferred from the refrigerant in the refrigerant pipe to the water in the floor heating pipe is heated by the refrigerant in the refrigerant pipe to the amount of heat directly transferred by heat exchange with the refrigerant. Furthermore, the amount of heat indirectly transmitted by heat exchange with the water in the hot water supply pipe is added.
In this way, in the heat pump hot water heater, the amount of heat that is deficient by increasing the amount of water by increasing the pipe diameter of the floor heating pipe is reduced to the hot water supply pipe having a pipe diameter smaller than that of the floor heating pipe. By supplementing with the amount of heat transmitted from the water, the heat pump cycle can be configured as simply as possible without increasing the flow rate and flow rate of the refrigerant in the refrigerant pipe as much as possible.

  According to the present invention, since the pipe diameter of the hot water supply pipe is smaller than the pipe diameter of the floor heating pipe and the hot water supply pipe and the floor heating pipe are thermally coupled, the refrigerant pipe The heat of the refrigerant can be transmitted not only directly to the water of the floor heating pipe but also to the water of the floor heating pipe via the water of the hot water supply pipe. In this way, in the heat pump hot water heater, the amount of heat deficient by increasing the amount of water by increasing the pipe diameter of the floor heating pipe can be reduced by using the hot water supply pipe having a pipe diameter smaller than that of the floor heating pipe. By supplementing with the amount of heat transmitted from the water, the heat pump cycle can be configured as simply as possible without increasing the flow rate and flow rate of the refrigerant in the refrigerant pipe as much as possible.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings so that the present invention can be understood. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.
FIG. 1 is a block diagram showing a schematic configuration of a heat pump type hot water heater / heater X according to an embodiment of the present invention, and FIG. 2 is a water heat exchange provided in the heat pump type hot water heater / heater X according to an embodiment of the present invention. FIG. 3 is a partially enlarged view of the section taken along the line AA in FIG. 2, and FIG. 4 is a diagram for explaining another example of the water heat exchanger 14.
First, the schematic configuration of the heat pump hot water supply / room heater X according to the embodiment of the present invention will be described with reference to FIG.
As shown in FIG. 1, the heat pump type hot water heater / heater X is roughly divided into a heat pump cycle (refrigeration cycle) 1 in which refrigerant is circulated, and a floor heating circuit 2 for circulating hot water in a floor heating device 21 described later. And a hot water supply circuit 3 for storing or supplying hot water. Here, as the refrigerant circulated in the heat pump cycle 1, for example, a carbon dioxide refrigerant such as CO ₂ refrigerant (a kind of natural refrigerant) or an HFC refrigerant such as R410A is used.

The heat pump cycle 1 includes a compressor 11 that compresses refrigerant, and a water heat exchanger 14 that heats the water by exchanging heat between the refrigerant flowing out of the compressor 11 and water (an example of a heat exchanger). And the expansion valve 13 that expands the refrigerant that has flowed out of the water heat exchanger 14, and the refrigerant is heated by exchanging heat between the refrigerant expanded by the expansion valve 13 and the outdoor air (that is, the evaporator). As an outdoor air heat exchanger 12. In the water heat exchanger 14, heat is exchanged between the refrigerant circulated in the heat pump cycle 1 and water.
The floor heating circuit 2 includes a floor heating device 21 that realizes floor heating by circulating hot water heated by heat exchange with the refrigerant in the water heat exchanger 14 under the floor, the water heat exchanger 14, and the floor heating. A circulation pump 22 for circulating water between the devices 21 is provided. In the floor heating circuit 2, it may be considered that brine (antifreeze) is used instead of water.
The hot water supply circuit 3 includes a hot water storage tank 31 for storing hot water (for example, about 60 ° C.) heated by heat exchange with the refrigerant in the water heat exchanger 14, and the water heat exchanger 14 from the lower layer of the hot water storage tank 31. A circulating pump 32 for circulating water to the upper layer of the hot water storage tank 31, an electromagnetic three-way valve 34 for switching the water supply destination from the water supply port 33, and a temperature for hot water supplied from the hot water supply port 35. And an electromagnetic three-way valve 36.
In addition, about operation | movement of the heat pump cycle 1, the floor heating circuit 2, and the hot water supply circuit 3 in the heat pump type hot water heater / heater X, since there is no difference with the past, description is abbreviate | omitted here.
The heat pump hot water supply / room heater X according to the embodiment of the present invention is characterized by a piping structure in the water heat exchanger 14, and this point will be described below with reference to FIGS.

As shown in FIG. 2, the water heat exchanger 14 includes a refrigerant pipe 41 through which refrigerant circulated in the heat pump cycle 1, a floor heating pipe 42 through which water circulated through the floor heating circuit 2, and hot water supply And a hot water supply pipe 43 through which water supplied to the circuit 3 flows. Specifically, each of the refrigerant pipe 41, the floor heating pipe 42, and the hot water supply pipe 43 is connected to the heat pump cycle 1, the floor heating circuit 2, and the hot water supply circuit 3, and is a part of the circuit. Is forming.
Although not shown in the drawing, the water heat exchanger 14 has a flat shape (for example, a shape like a track in an athletics stadium) that is composed of a straight portion and a curved portion when viewed from above (plan view). Of course, the water heat exchanger 14 may be formed in a substantially rectangular shape, a substantially elliptical shape, a substantially circular shape or the like in plan view.

Here, as shown in FIG. 3, in the water heat exchanger 14, the refrigerant pipe 41, the floor heating pipe 42, and the hot water supply pipe 43 are laminated so as to repeatedly contact in this order. That is, the refrigerant pipe 41, the floor heating pipe 42, the hot water supply pipe 43, the refrigerant pipe 41, the floor heating pipe 42, the hot water supply pipe 43,. Note that each of the refrigerant pipe 41, the floor heating pipe 42, and the hot water supply pipe 43 is disposed so that the centers thereof are positioned on a straight line.
The refrigerant pipe 41 and the floor heating pipe 42, the floor heating pipe 42 and the hot water supply pipe 43, and the hot water supply pipe 43 and the refrigerant pipe 41 are thermally coupled by brazing. Thereby, the heat exchange between each other is performed efficiently. For the brazing of the refrigerant pipe 41, the floor heating pipe 42, and the hot water supply pipe 43, brazing materials such as silver brazing, copper brazing, brass brazing, and phosphor copper brazing are used. In addition, the present invention is not limited to brazing, and it is also conceivable as another embodiment that, for example, thermal bonding is performed by welding, soldering, an adhesive having high thermal conductivity, or the like.

By the way, in general, the floor heating circuit 2 requires a larger amount of hot water than the hot water supply circuit 2 in order to distribute the hot water under the floor.
Therefore, in the heat pump hot water heater X according to the embodiment of the present invention, a pipe having a larger diameter than the hot water supply pipe 43 is used for the floor heating pipe 42 as shown in FIG. In other words, the pipe diameter of the hot water supply pipe 43 is designed to be smaller than the pipe diameter of the floor heating pipe 42. As a result, the amount of water in the floor heating pipe 42 becomes larger than the amount of water in the hot water supply pipe 43, and a large amount of hot water necessary for the floor heating circuit 2 can be obtained. The refrigerant pipe 41 and the hot water supply pipe 43 may have different pipe diameters.
In the water heat exchanger 14 configured as described above, since the pipe diameter of the hot water supply pipe 43 is smaller than the pipe diameter of the floor heating pipe 42, the floor heating pipe 42 is exchanged by heat exchange with the refrigerant in the refrigerant pipe 41. When the water in the hot water supply pipe 43 is heated, the temperature of the water becomes higher in the hot water supply pipe 43 than in the floor heating pipe 42. Further, the hot water supply pipe 43 is warmed faster than the floor heating pipe 42.

As described above, in the water heat exchanger 14, the floor heating pipe 42 and the hot water supply pipe 43 are thermally coupled to each other, so that the hot water in the hot water supply pipe 43 and the hot water in the floor heating pipe 42 are heated. If there is a temperature difference between the two, the heat exchange will take place between the hot water. That is, the water in the floor heating pipe 42 is heated by the water in the hot water supply pipe 43.
In particular, in the situation where the hot water supply operation or the hot water storage operation is not executed in the heat pump type hot water heater X and the flow of water in the hot water supply pipe 43 is stopped, floor heating is executed and the refrigerant circulates in the heat pump cycle 1. Then, in the water heat exchanger 14, the water remaining in the hot water supply pipe 43 is quickly warmed by heat exchange with the refrigerant. When the temperature of the water stored in the hot water supply pipe 43 exceeds the temperature of the water flowing in the floor heating pipe 42, the water flowing in the floor heating pipe 42 thereafter stops in the hot water supply pipe 43. Heat is also transmitted by the heat transfer from the warm water, and the water in the floor heating pipe 42 is efficiently heated.
Thus, in the water heat exchanger 14, as a result, the amount of heat transferred from the refrigerant in the refrigerant pipe 42 to the water in the floor heating pipe 42 is changed to the amount of heat directly transferred by heat exchange with the refrigerant. The amount of heat indirectly transmitted by heat exchange with the water in the hot water supply pipe 43 heated by the refrigerant in the refrigerant pipe 41 is added (arrow shown in FIG. 3B). Therefore, in the heat pump hot water heater / heater X, the amount of heat deficient by increasing the amount of water by increasing the pipe diameter of the floor heating pipe 42 is reduced to a hot water supply pipe 43 having a pipe diameter smaller than that of the floor heating pipe 42. By supplementing with the amount of heat transmitted from the water, the heat pump cycle 1 can be configured as simply as possible without increasing the flow rate and flow rate of the refrigerant in the refrigerant pipe 41 as much as possible.

Further, in the water heat exchanger 14 described in the present embodiment, as shown in FIG. 3, the refrigerant pipe 41, the floor heating pipe 42, and the hot water supply pipe 43 are positioned so that their centers are aligned. Although an example of the case of being stacked on is given, it is not limited to this.
For example, as shown in FIG. 4, the water heat exchanger 14 is arranged so that either the refrigerant pipe 41, the floor heating pipe 42, or the hot water supply pipe 43 is aligned inside or outside (the dashed line in the figure). It is conceivable to form. In this configuration, at the time of manufacturing the water heat exchanger 14, the refrigerant pipe 41, the floor heating pipe 42, and the hot water supply pipe 43 can be easily bent at the same time. Further, the height dimension of the water heat exchanger 14 can be made as small as possible. Note that the configuration in which the refrigerant pipe 41 is arranged outside the floor heating pipe 42 also has an effect that the pipe length of the refrigerant pipe 41 in the bent portion of the water heat exchanger 14 can be increased as much as possible.

The block diagram which shows schematic structure of the heat pump type hot-water supply heater X which concerns on embodiment of this invention. The external appearance schematic diagram of the water heat exchanger 14 with which the heat pump type hot-water supply heater X which concerns on embodiment of this invention is provided. The elements on larger scale of the AA arrow cross section in FIG. The figure for demonstrating the other example of the water heat exchanger. The figure for demonstrating the structure of the conventional water heat exchanger (citation of FIG. 5 and FIG. 7 of patent document 1).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Heat pump cycle 2 ... Floor heating circuit 3 ... Hot water supply circuit 11 ... Compressor 12 ... Outdoor air heat exchanger 13 ... Expansion valve 14 ... Water heat exchanger (an example of a heat exchanger)
DESCRIPTION OF SYMBOLS 21 ... Floor heating apparatus 22 ... Circulation pump 31 ... Hot water storage tank 32 ... Circulation pump 33 ... Water supply port 34, 36 ... Electromagnetic three-way valve 35 ... Hot water supply port 41 ... Refrigerant piping 42 ... Floor heating piping 43 ... Hot water supply piping X ... Heat pump Hot water heater

Claims (2)

A heat pump cycle in which the refrigerant is circulated, a heat exchanger for exchanging heat between the refrigerant circulated in the heat pump cycle and water or antifreeze, and hot water or antifreeze heated in the heat exchanger are supplied to the floor heating device. A heat pump type hot water heater comprising a floor heating circuit for circulation and a hot water supply circuit for storing or supplying hot water heated by the heat exchanger,
The heat exchanger has a refrigerant pipe through which a refrigerant circulated through the heat pump cycle flows, a floor heating pipe through which water or antifreeze liquid circulated through the floor heating circuit, and a pipe diameter larger than the floor heating pipe. And a hot water supply pipe through which the water supplied to the hot water supply circuit circulates repeatedly in this order and is laminated,
Each of the refrigerant pipe and the floor heating pipe, the floor heating pipe and the hot water supply pipe, and the hot water supply pipe and the refrigerant pipe are thermally coupled to each other.   2. The heat pump hot water heater according to claim 1, wherein the heat exchanger is bent into any one of a substantially rectangular shape, a substantially flat shape, a substantially circular shape, and a substantially elliptical shape in plan view.

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