JP2009238912A - Laminated transformer and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated transformer which is suitably comprised by using a material having high magnetic permeability, and to provide a manufacturing method therefor. <P>SOLUTION: A common mode filter 1a is provided with a conductive magnetic substrate 11a (12a); a laminate, wherein coil conductors 51 and 52 and an insulation resin layer 20a having extraction electrode conductors 61-64 connected with the coil conductors 51 and 52 are stacked; terminal electrodes 41a-44a, which are arranged on the side of the laminate and are connected with the extraction electrode conductors 61-64; and an insulation area which is provided between the conductive magnetic substrate 11a (12a) and the terminal electrodes 41a-44a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laminated transformer component and a manufacturing method thereof, and more particularly to a laminated transformer component suitably configured using a material having a high magnetic permeability and a manufacturing method thereof.

  Conventionally, coil parts have been realized by winding a conducting wire around a toroidal core or the like (for example, a common mode choke transformer of Patent Document 1), but in recent years, it has been realized by using a spiral conductor patterned on a film. Has also increased.

  FIG. 17 shows a common mode filter 100 as an example of a transformer component (laminated transformer component) configured using a spiral conductor printed on a film.

  The common mode filter 100 has magnetic substrates 101 and 102 on the upper and lower sides, and has an insulating resin body layer 110 composed of insulating layers 111 to 115, a magnetic sheet 103, and an adhesive layer 121 therebetween. ing. Further, two terminal electrodes 141 and 142 are arranged on the left side surface of the common mode filter 100, and two terminal electrodes 143 and 144 are arranged on the right side surface, respectively.

  Spiral conductors 151 and 152 are printed on the insulating layers 112 and 113, respectively. The outer peripheral end of the spiral conductor 151 is connected to the terminal electrode 141 via the extraction electrode 161, and the outer peripheral end of the spiral conductor 152 is connected to the terminal electrode 142 via the extraction electrode 162. On the other hand, the inner peripheral end of the spiral conductor 151 is connected to the extraction electrode 163 printed on the insulating layer 111 through the through hole, and the extraction electrode 163 is connected to the terminal electrode 143. Similarly, the inner peripheral end of the spiral conductor 152 is connected to the extraction electrode 164 printed on the insulating layer 114 through the through hole, and the extraction electrode 164 is connected to the terminal electrode 144. With the above configuration, the spiral conductors 151 and 152 function as a common mode choke coil.

  In addition, the central part of the insulating layers 111 to 115 is filled with the same magnetic material as the magnetic material constituting the magnetic material sheet 103 and constitutes the magnetic leg of the common mode choke coil.

  Patent Document 2 discloses an example of an inductor configured using a spiral conductor printed on a film. In this example, the coil conductor forms an inductor portion formed by laminating a plurality of magnetic sheets on which a coil conductor pattern is formed and laminating magnetic sheets on which no coil conductor is formed one above the other. It is sandwiched between two margin portions formed by laminating a plurality of magnetic sheets that are not formed. Each sheet in the margin portion is made of Mn—Zn ferrite having a relatively high magnetic permeability, and each sheet in the inductor portion is made of Ni—Zn ferrite having a relatively low magnetic permeability.

The technique disclosed in Patent Document 2 uses two types of ferrite in this way for the following reason. That is, the higher the magnetic permeability, the better the magnetic flux efficiency. Therefore, if possible, it is preferable that all sheets be made of Mn—Zn-based ferrite having a high magnetic permeability. However, since Mn-Zn ferrite has a low specific resistance, it cannot be brought into contact with the coil conductor (see paragraph 0032 of Patent Document 2). Therefore, only the sheet in contact with the coil conductor, that is, each sheet of the inductor portion is made of Ni—Zn ferrite having a certain degree of magnetic permeability and high specific resistance.
Japanese Patent Laid-Open No. 11-135330 JP-A-6-196332

  Also in the laminated transformer component, similar to the inductor of Patent Document 2, it is possible to obtain good characteristics when the material of the member constituting the magnetic path is made of a material having a high magnetic permeability. For example, in the common mode filter 100 shown in FIG. 17, when the magnetic substrates 101 and 102 and the magnetic sheet 103 are made of a material having high magnetic permeability, the cut-off frequency can be lowered.

  However, if the magnetic substrates 101 and 102 and the magnetic sheet 103 are made of a material having a high magnetic permeability in the common mode filter 100 shown in FIG. There arises a problem that electrical conduction occurs between the electrodes. Such a problem does not occur only in the common mode filter, but occurs in the same manner in all of the multilayer transformer parts.

  Accordingly, one of the objects of the present invention is to provide a laminated transformer component that is suitably configured using a material having high magnetic permeability and a method for manufacturing the same.

  A laminated transformer component according to the present invention is disposed on a side surface of a laminated body in which a conductive magnetic substrate, a coil conductor, and an insulating resin body layer having an extraction electrode conductor connected to the coil conductor are laminated. And a terminal electrode connected to the lead electrode conductor, and an insulating region disposed between the conductive magnetic substrate and the terminal electrode.

  According to the present invention, since the insulating region prevents conduction between the conductive magnetic substrate and the terminal electrode, it is possible to provide a laminated transformer component that is suitably configured using a material having high magnetic permeability.

  In the laminated transformer component, the side surface of the conductive magnetic substrate is retreated from the side surface of the laminated body at least in a portion facing the terminal electrode, and the insulating region is formed by the retreat. It is good also as providing in the space which arises between the side surface of a board | substrate and the said terminal electrode. According to this, an insulation area | region can be provided using the said space.

  In the laminated transformer component, the insulating resin body layer may be laminated in the space, and the insulating region may be constituted by the insulating resin body layer laminated in the space. An insulating magnetic substrate is also laminated on the laminate, and one surface and the other surface of the conductive magnetic substrate are bonded to the insulating magnetic substrate and the insulating resin layer, respectively, and the insulating magnetic substrate It is good also as having the convex part which protruded in the said space. According to the former, a part of the insulating resin layer can be used as the insulating region, and according to the latter, the convex portion of the insulating magnetic substrate can be used as the insulating region.

  In the laminated transformer component, the insulating region may be constituted by an insulating coating applied to a part of a side surface of the laminated body. According to this, the insulating region can be formed by the insulator coating.

  In this laminated transformer component, the coil conductor may include a first spiral conductor and a second spiral conductor, and the first spiral conductor and the second spiral conductor may be arranged to be magnetically coupled to each other. Good.

  Furthermore, in this laminated transformer component, the extraction electrode conductor may be disposed between the spiral conductors. According to this, the area of the insulator coating can be increased.

  Each laminated transformer component may have a conductive magnetic leg penetrating the central portion of each spiral conductor. According to this, the characteristics of the laminated transformer component can be improved. As an example, it is possible to lower the cut-off frequency when a common mode filter is configured by laminated transformer components.

  The manufacturing method according to the present invention is a method of manufacturing a laminated transformer component in which the terminal electrode is disposed on the side surface, and the side surface facing the terminal electrode recedes from the side surface on the first insulating magnetic substrate. A first step of forming the first conductive magnetic substrate, and an insulating resin body having a coil conductor and an extraction electrode conductor connected to the coil conductor on the laminate obtained by the first step A second step of forming a layer, a third step of forming, on the insulating resin layer, a second conductive magnetic substrate having a side surface facing the terminal electrode receding from the side surface, A fourth step of bonding a second insulating magnetic substrate on the laminate obtained by the third step, and a side surface of the laminate obtained by the fourth step so as to be connected to the extraction electrode conductor. And a fifth step of forming a terminal electrode. To.

  According to the present invention, the space between the conductive magnetic substrate and the terminal electrode can be filled with the insulating resin layer, and the filled insulating resin layer is placed between the conductive magnetic substrate and the terminal electrode. It can be an insulating region for preventing conduction.

  In the above manufacturing method, the second step may be to form the insulating resin body layer on the laminate obtained by the first step by using a spin coating method. In the step, the insulating resin body layer may be formed, and the formed insulating resin body layer may be bonded onto the laminate obtained in the first step.

  A manufacturing method according to another aspect of the present invention is a manufacturing method of a laminated transformer component in which a terminal electrode is disposed on a side surface. A first step of generating a first base substrate by fitting a first conductive magnetic substrate to a magnetic substrate, and a second insulating magnetism having a convex portion at least in a portion facing the terminal electrode A second step of generating a second base substrate by fitting a second conductive magnetic substrate to the body substrate; and a surface of the first base substrate on the first conductive magnetic substrate side. A third step of forming an insulating resin body layer having a coil conductor and an extraction electrode conductor connected to the coil conductor, the second base substrate, and the surface on the second conductive magnetic substrate side 4th process which adheres to this insulating resin body layer toward an insulating resin body layer If, on the sides of the resulting laminate by said fourth step, characterized in that it comprises a fifth step of forming the terminal electrode so as to be connected to the extraction electrode conductor.

  According to the present invention, an insulator (insulating magnetic substrate) is fitted into the space between the conductive magnetic substrate and the terminal electrode, and the inserted insulator is inserted between the conductive magnetic substrate and the terminal electrode. It can be an insulating region for preventing conduction.

  According to still another aspect of the present invention, there is provided a manufacturing method of a laminated transformer component in which terminal electrodes are arranged on a side surface, wherein the first insulating magnetic substrate, the first conductive magnetic material, A first step of producing a first base substrate by bonding together, a second step of producing a second base substrate by bonding the second insulating magnetic substrate and the second conductive magnetic body, A third step of forming an insulating resin body layer having a coil conductor and an extraction electrode conductor connected to the coil conductor on a surface of the first base substrate on the first conductive magnetic body side; The base substrate of the fourth step is bonded to the insulating resin body layer with the surface on the second conductive magnetic body side facing the insulating resin body layer, and the side surface of the laminate obtained by the fourth step At least the portion of the exposed portions of the first and second conductive magnetic bodies. A fifth step of applying an insulator coating to the portion facing the child electrode, and a sixth step of forming the terminal electrode on the side surface of the laminate obtained by the fifth step so as to be connected to the lead electrode conductor. It is characterized by providing.

  According to the present invention, the insulating coating can be an insulating region for preventing conduction between the conductive magnetic substrate and the terminal electrode.

  In the above manufacturing method, in the fifth step, the insulator coating may be applied using a sputtering method or a CVD (Chemical Vapor Deposition) method. In this way, the insulator coating can be easily applied with the minimum necessary material and on the extension line of the conventional thin film lamination method.

  Thus, according to the present invention, it is possible to provide a laminated transformer component that is suitably configured using a material having high magnetic permeability.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]
FIG. 1 is a schematic exploded perspective view showing the outer shape and structure of a common mode filter 1a according to a preferred first embodiment of the present invention. 2 is a cross-sectional view taken along line AA ′ of the common mode filter 1a shown in FIG. Hereinafter, the configuration of the common mode filter 1a will be described with reference to these drawings.

  As shown in FIGS. 1 and 2, the common mode filter 1a according to the present embodiment includes an insulating magnetic substrate 11a, a conductive magnetic substrate 13a, an insulating resin layer 20a, a conductive magnetic substrate 14a, and an insulating magnetic substrate 11a. The magnetic substrate 12a includes a laminated body (hereinafter referred to as a common mode filter laminated body) laminated in this order, and four terminal electrodes 41a to 44a arranged on the side surfaces. In practice, there is an adhesive layer for bonding substrates and the like, but this is omitted in FIG. 1 and the following drawings.

  As the material of the insulating magnetic substrates 11a and 12a, a material having a relatively high specific resistance and can be regarded as an insulator and having a certain degree of magnetic permeability, for example, Ni—Cu—Zn ferrite is used.

  On the other hand, a material having higher magnetic permeability is used as the material of the conductive magnetic substrates 13a and 14a. This is because the magnetic characteristics originally required for the common mode filter can be enhanced by using a material having a magnetic permeability as high as possible as the material of the conductive magnetic substrates 13a and 14a. In general, a material with high magnetic permeability has a low specific resistance. Specific examples of such a material include Mn—Zn ferrite.

  The insulating resin body layer 20a is a laminated body in which five insulating layers 21a to 25a are laminated in this order. A conductor pattern is formed on the predetermined insulating layer, and a coil conductor and an extraction electrode conductor connected to the coil conductor are formed. The insulating layer 25a is provided to insulate and separate the conductor pattern and the conductive magnetic substrate 14a. The material of the insulating layers 21a to 25a is not particularly limited, but it is preferable to use a polyimide resin or the like.

  Hereinafter, the internal configuration of the insulating resin layer 20a will be described in detail first, and then the configuration for preventing conduction between the conductive magnetic substrates 13a and 14a and the terminal electrodes 41a to 44a will be described. .

  As shown in FIG. 1, the conductor pattern formed in the insulating layer includes spiral coil conductors (spiral conductors) 51 and 52 and lead electrode conductors 61 and 62 respectively formed on the surfaces of the insulating layers 22a and 23a. It includes lead electrode conductors 63 and 64 formed on the surfaces of the insulating layers 21a and 22a, respectively. The spiral conductors 51 and 52 are both planar coils parallel to the main surfaces of the substrates 11a and 12a.

  The spiral conductors 51 and 52 are disposed so as to face each other via the insulating layer 23a. For this reason, both are magnetically coupled to each other.

  The outer peripheral end of the spiral conductor 51 is connected to the terminal electrode 41 a through the extraction electrode conductor 61 in the same layer, and the inner peripheral end is connected to the terminal electrode 43 a through the through hole and the extraction electrode conductor 63. Further, the outer peripheral end of the spiral conductor 52 is connected to the terminal electrode 42a via the extraction electrode conductor 62 in the same layer, and the inner peripheral end is connected to the terminal electrode 44a via the through hole and the extraction electrode conductor 64. Yes. 1, the spiral conductors 51 and 52 are both wound counterclockwise (counterclockwise) from the outer peripheral end toward the inner peripheral end. Therefore, if the terminal electrodes 41a and 42a are a pair of input terminals, the spiral conductors 51 and 52 are magnetically coupled in the same direction. Here, “magnetic coupling in the same direction as each other” means that magnetic coupling is performed so that the magnetic flux is strengthened with respect to the in-phase component and the magnetic flux is canceled with respect to the differential component. Thereby, the common mode filter 1a according to the present embodiment functions as a common mode filter.

  The insulating layers 21a to 25a have a through hole 71 penetrating the central portion. The through-hole 71 is filled with a material having conductivity and magnetism similar to the constituent material of the conductive magnetic substrates 13a and 14a (for example, a material mixed with resin in Mn-Zn ferrite to have fluidity). And constitutes (conductive) magnetic legs of the common mode choke coil constituted by the spiral conductors 51 and 52. By providing this magnetic leg, it is possible to lower the cut-off frequency of the common mode choke coil constituted by the spiral conductors 51 and 52 as compared with the case where no magnetic leg is provided.

  From here, the structure for preventing conduction | electrical_connection between the electroconductive magnetic substrate 13a, 14a and terminal electrode 41a-44a is demonstrated.

  An insulating region is disposed between the conductive magnetic substrates 13a and 14a and the terminal electrodes 41a to 44a. In the present embodiment, the side surfaces of the conductive magnetic substrates 13a and 14a recede from the side surfaces of the common mode filter laminate at portions facing the terminal electrodes 41a to 44a (side surfaces on which the terminal electrodes 41a to 44a are disposed). The insulating region is provided in a space formed between the side surfaces of the conductive magnetic substrates 13a and 14a and the terminal electrodes 41a to 44a by the retreat. In FIG. 1, this space is indicated by reference numerals S1 and S2.

  An insulating resin body layer 20a is laminated in the space S1, and constitutes an insulating region between the conductive magnetic substrate 13a and the terminal electrodes 41a to 44a. FIG. 1 shows a convex portion T1 projecting downward from the insulating layer 21a, and the convex portion T1 is fitted into the space S1 to constitute the insulating layer.

  The space S2 is filled with an insulating adhesive 26 to form an insulating region between the conductive magnetic substrate 14a and the terminal electrodes 41a to 44a. The adhesive 26 may be used when the conductive magnetic substrate 14a and the insulating magnetic substrate 12a are bonded to each other in a manufacturing process described later.

  Next, a method for manufacturing the common mode filter 1a will be described.

  3 and 4 are explanatory views of a method for manufacturing the common mode filter 1a. 3 (a) to 3 (g) sequentially show the steps in manufacturing a large number of common mode filters 1a on one circular insulating magnetic substrate. FIGS. 4 (a) to 4 (g) FIG. 4 shows one common mode filter extracted from (a) to (g) of FIG. 3. FIG. 4 (h) shows the finally manufactured common mode filter 1a. Hereinafter, a method for manufacturing the common mode filter 1a will be described with reference to these drawings.

  First, a circular insulating magnetic substrate 11a is prepared (FIGS. 3 (a) and 4 (a)), and a side surface facing the terminal electrodes 41a to 44a is a side surface of each common mode filter laminate. Then, the conductive magnetic substrate 13a that is retracted from is formed (FIGS. 3B and 4B). As shown in FIG. 3B, a strip-like conductive magnetic substrate 13a is formed on the circular insulating magnetic substrate 11a, and the gap between the conductive magnetic substrates 13a creates a space S1. Will be composed. The strip-shaped conductive magnetic substrate 13a is preferably formed by cutting (dicing) the circular conductive magnetic substrate 13a bonded on the insulating magnetic substrate 11a with a dicer. is there. Hereinafter, the stacked body obtained through the above steps is referred to as a first base substrate.

  Next, an insulating resin body layer 20a having a coil conductor and an extraction electrode conductor connected to the coil conductor is formed on the first base substrate. 3C and 4C show a state in which the insulating layers 21a and 22a are formed in the insulating resin body layer 20a, and FIGS. 3D and 4D show the state on the insulating layer 22a. FIG. 3E and FIG. 4E show a state where the spiral conductor 51 is formed, and FIG. 4E shows a state where the entire insulating resin layer 20a is formed.

  The formation of each insulating layer constituting the insulating resin layer 20a is preferably performed by spin coating using a polyimide resin as a raw material solution. In this case, it is necessary to sufficiently spread the polyimide resin in the space S1. Moreover, it is preferable to form a conductor pattern for forming a coil conductor or an extraction electrode conductor on the insulating layer by a so-called thin film process such as a sputtering method, a vapor deposition method, or a plating method.

  Each through hole is preferably formed by photolithography and etching. Filling the through hole 71 with the conductive magnetic material is performed by pouring a fluid conductive magnetic material. A conductor is embedded in the through hole between the coil conductor and the extraction electrode conductor when the conductor pattern is formed.

  Here, an example in which the respective insulating layers are sequentially laminated on the first base substrate is shown, but the insulating resin body layer 20a is formed similarly to the manufacturing method described in the fifth embodiment to be described later. The insulating resin body layer 20a may be formed by forming it as a separate body and bonding it to the first base substrate. In this case, it is preferable to fill the space S <b> 1 with an adhesive used for bonding to form a constituent material of the insulating region.

  Next, a conductive magnetic substrate 14a is formed on the insulating resin layer 20a with the side surfaces facing the terminal electrodes 41a to 44a receding from the side surfaces of the individual common mode filter laminates (FIG. 3 (f ), FIG. 4 (f)). As shown in FIG. 3F, the conductive magnetic substrate 14a has a strip shape similar to that of the conductive magnetic substrate 13a. Further, the gap between the conductive magnetic substrates 14a constitutes the space S2. The strip-shaped conductive magnetic substrate 14a is also preferably formed by dicing similar to the conductive magnetic substrate 13a.

  Subsequently, the insulating magnetic substrate 12a is bonded onto the laminated body obtained through the steps so far (FIGS. 3 (g) and 4 (g)). The adhesive used at this time is also filled into the space S2 as the adhesive 26 to form an insulating region.

  When the steps up to here are completed, an operation of cutting out each common mode filter laminate by dicing is performed. The laminated body shown in FIG. 4G is a common mode filter laminated body cut out in this way. Then, as shown in FIG. 4H, terminal electrodes 41a to 44a are formed on the side surfaces of the common mode filter laminates so as to be connected to the extraction electrode conductors. The terminal electrodes 41a to 44a are preferably formed using a sputtering method or a CVD method and etching.

  As described above, according to the present embodiment, an insulating region is provided between the conductive magnetic substrates 13a and 14a and the terminal electrodes 41a to 44a, and the insulating region is formed of the conductive magnetic substrates 13a and 14a and the terminals. Since conduction between the electrodes 41a to 44a is prevented, a common mode filter suitably configured using a material having high magnetic permeability can be provided.

  In addition, according to the present embodiment, the insulating region can be provided by utilizing the space generated by retreating the side surface of the conductive magnetic substrate from the side surface of the common mode filter laminate. As a specific constituent material of the insulating region, the same material as the insulating resin body layer 20a or the adhesive 26 can be used. Since these are materials that are used even if they do not constitute an insulating region, it is possible to avoid the disadvantage that the number of materials and the manufacturing process increase in order to constitute the insulating region.

  Moreover, although a common mode filter may be produced | generated by baking, when Ni-Cu-Zn type | system | group ferrite and Mn-Zn type ferrite are mixed like the common mode filter 1a, since baking atmospheres mutually differ, by baking. Cannot be generated. That is, Ni—Cu—Zn based ferrite is fired in the air atmosphere, but Mn—Zn based ferrite is fired in the nitrogen atmosphere and therefore cannot be fired simultaneously. However, according to the present embodiment, since the firing is not performed using the thin film method, the common mode filter 1a can be generated without any problem even if the firing atmosphere is different.

[Second Embodiment]
FIG. 5 is a schematic exploded perspective view showing the outer shape and structure of a common mode filter 1b according to a preferred second embodiment of the present invention. FIG. 6 is a sectional view taken along line BB ′ of the common mode filter 1b shown in FIG. 5 and 6, the same components as those described in the first embodiment are denoted by the same reference numerals as those in FIGS. 1 and 2. Hereinafter, the configuration of the common mode filter 1b will be described with reference to these drawings.

  The common mode filter 1b is identical to the common mode filter 1a in that a space is formed by retreating the side surfaces of the conductive magnetic substrates 13a and 14a from the side surfaces of the common mode filter laminate, and an insulating region is formed in the space. However, it differs from the common mode filter 1a in that an insulating magnetic substrate is used as a constituent material of the insulating region. Hereinafter, the difference will be mainly described.

  As shown in FIGS. 5 and 6, the common mode filter 1b replaces the insulating magnetic substrates 11a and 12a with the insulating magnetic substrates 11b and 12b in the common mode filter 1a to insulate the insulating resin layer 20a. The resin resin layer 20b is replaced.

  The insulating resin body layer 20b has a configuration in which the insulating layer 21a is replaced with the insulating layer 21b in the insulating resin body layer 20a. The insulating layer 21b has a configuration in which the convex portion T1 is removed from the insulating layer 21a, and the other points are the same as the insulating layer 21a.

  The insulating magnetic substrate 11b is different from the insulating magnetic substrate 11a in that the insulating magnetic substrate 11b has convex portions T2 at portions facing the terminal electrodes 41a to 44a. The convex portion T2 is disposed on the insulating magnetic substrate 11b so as to protrude into the space S1 when the insulating magnetic substrate 11b and the conductive magnetic substrate 13a are bonded together.

  The insulating magnetic substrate 12b is different from the insulating magnetic substrate 12a in that the insulating magnetic substrate 12b has a convex portion T3 in a portion facing the terminal electrodes 41a to 44a. The convex portion T3 is disposed on the insulating magnetic substrate 12b so as to protrude into the space S2 when the insulating magnetic substrate 12b and the conductive magnetic substrate 14a are bonded together.

  As described above, the convex portions T2 and T3 constitute insulating regions for preventing conduction between the conductive magnetic substrates 13a and 14a and the terminal electrodes 41a to 44a, respectively.

  Next, a method for manufacturing the common mode filter 1b will be described.

  FIG. 7 is an explanatory diagram of a method for manufacturing the common mode filter 1b. 7A to 7D sequentially show steps in manufacturing a large number of common mode filters 1b on one circular insulating magnetic substrate. Hereinafter, a method for manufacturing the common mode filter 1b will be described with reference to FIG.

  First, a circular insulating magnetic substrate 11b is prepared (FIG. 7A). Then, the upper half of the insulating magnetic substrate 11b is cut into a strip shape using a dicer (FIG. 7B). The strip portion thus obtained constitutes the convex portion T2. The conductive magnetic substrate 13a is fitted into the gap between the convex portions T2 to generate a first base substrate (FIG. 7C).

  Although not shown, as in the previous steps, a circular insulating magnetic substrate 12b is prepared, the upper half is cut into a strip shape, and the conductive magnetic substrate is placed in the gap between the convex portions T3 obtained. 14a is fitted to generate a second base substrate.

  Next, an insulating resin body layer 20b having a coil conductor and an extraction electrode conductor connected to the coil conductor is formed on the first base substrate (FIG. 7D). The specific formation method of the insulating resin body layer 20b is the same as that of the insulating resin body layer 20a.

  Subsequently, the second base substrate is bonded to the insulating resin layer 20b with the surface on the conductive magnetic substrate 14a side facing the insulating resin layer 20b (FIG. 7E).

  When the steps up to here are completed, an operation of cutting out each common mode filter laminated body by dicing is performed in the same manner as the steps described in the first embodiment. And terminal electrode 41a-44a is formed in the side surface of each common mode filter laminated body so that it may connect with an extraction electrode conductor.

  As described above, according to this embodiment, an insulating region is provided between the conductive magnetic substrates 13a and 14a and the terminal electrodes 41a to 44a, and the insulating region is formed of the conductive magnetic substrates 13a and 14a and the terminal electrode. Since conduction with 41a-44a is prevented, a common mode filter suitably constituted using a material with high magnetic permeability can be provided.

  Also according to this embodiment, the insulating region can be provided by utilizing the space generated by retreating the side surface of the conductive magnetic substrate from the side surface of the common mode filter laminate. As a specific constituent material of the insulating region, insulating magnetic substrates 11b and 12b can be used. Since these are materials that are used even if they do not constitute an insulating region, it is possible to avoid the disadvantage that the number of materials and the manufacturing process increase in order to constitute the insulating region.

[Third Embodiment]
FIG. 8 is a schematic exploded perspective view showing the outer shape and structure of a common mode filter 1c according to a preferred third embodiment of the present invention. FIG. 9 is a cross-sectional view taken along the line CC ′ of the common mode filter 1c shown in FIG. In FIGS. 8 and 9, the same components as those described in the first embodiment are denoted by the same reference numerals as those in FIGS. Hereinafter, the configuration of the common mode filter 1c will be described with reference to these drawings.

  In the common mode filter 1c, the side surface of the common mode filter laminate is coated with an insulator to form an insulating region for preventing conduction between the conductive magnetic substrate and the terminal electrode. Hereinafter, the difference from the common mode filters 1a and 1b will be mainly described.

  As shown in FIGS. 8 and 9, the common mode filter 1c replaces the conductive magnetic substrates 13a and 14a with the conductive magnetic substrates 13c and 14c in the common mode filter 1a, respectively, and insulates the insulating resin layer 20a. The resin resin layer 20c is replaced.

  The insulating resin body layer 20c is a laminated body in which four insulating layers 21c to 24c are laminated in this order. A spiral conductor 51 and an extraction electrode conductor 61 are formed on the surface of the insulating layer 21c. Lead electrode conductors 63 and 64 are formed on the surface of the insulating layer 22c. A spiral conductor 52 and an extraction electrode conductor 62 are formed on the surface of the insulating layer 23c. That is, the extraction electrode conductors 63 and 64 are disposed between the two spiral conductors. The insulating layer 24c is provided to insulate and separate the conductor pattern and the conductive magnetic substrate 14c.

  The outer peripheral end of the spiral conductor 51 is connected to the terminal electrode 41 a through the extraction electrode conductor 61 in the same layer, and the inner peripheral end is connected to the terminal electrode 43 a through the through hole and the extraction electrode conductor 63. Further, the outer peripheral end of the spiral conductor 52 is connected to the terminal electrode 42a via the extraction electrode conductor 62 in the same layer, and the inner peripheral end is connected to the terminal electrode 44a via the through hole and the extraction electrode conductor 64. Yes.

  By forming the conductor pattern as described above, in the common mode filter 1c, the distance between the exposed regions of the extraction electrode conductors 63 and 64 on the side surface of the common mode filter laminate and the conductive magnetic substrates 13c and 14c is the common mode. It is longer than the filters 1a and 1b.

  The sizes of the main surfaces of the conductive magnetic substrates 13c and 14c are the same as those of the insulating magnetic substrates 11a and 12a. Therefore, the side surfaces of the conductive magnetic substrates 13c and 14c are flush with the side surface of the common mode filter laminate.

  Insulator coatings 81 and 82 are applied to a part of the side surface of the common mode filter laminate. Among these, the insulator coating 81 is provided so as to cover a portion of the side surface of the conductive magnetic substrate 13c facing each terminal electrode. Similarly, the insulator coating 82 is provided so as to cover a portion of the side surface of the conductive magnetic substrate 14c that faces each terminal electrode. Accordingly, the insulating coatings 81 and 82 constitute insulating regions for preventing conduction between the conductive magnetic substrates 13c and 14c and the terminal electrodes 41a to 44a, respectively.

  The insulator coatings 81 and 82 need to be provided so as not to cover the exposed regions of the extraction electrode conductors 61 to 64. In this respect, in this embodiment, the distance between the exposed regions of the lead electrode conductors 63 and 64 and the conductive magnetic substrates 13c and 14c is increased. Therefore, the exposed regions are formed on the side surfaces of the terminal electrodes 43a and 44a. It is relatively easy to provide the insulator coatings 81 and 82 so as not to cover them.

  Next, a method for manufacturing the common mode filter 1c will be described.

  FIG. 10 is an explanatory diagram of a method for manufacturing the common mode filter 1c. (A) to (d) of FIG. 10 sequentially show steps when manufacturing a large number of common mode filters 1c on one circular insulating magnetic substrate. (E)-(g) of FIG. 10 has shown the process after cutting out each common mode filter laminated body in order. Hereinafter, a method for manufacturing the common mode filter 1c will be described with reference to FIG.

  First, a circular insulating magnetic substrate 11a is prepared (FIG. 10 (a)), and a conductive magnetic substrate 13c having the same shape is adhered thereon to generate a first base substrate (FIG. 10 (b)). ).

  Although not shown, a circular insulating magnetic substrate 12a is prepared in the same manner as the steps so far, and the same shape of the conductive magnetic substrate 14c is bonded thereon to generate a second base substrate. To do.

  Next, an insulating resin body layer 20c having a coil conductor and an extraction electrode conductor connected to the coil conductor is formed on the first base substrate (FIG. 10C). The specific formation method of the insulating resin body layer 20c is the same as that of the insulating resin body layer 20a.

  Subsequently, the second base substrate is bonded to the insulating resin layer 20c with the surface on the conductive magnetic substrate 14c side facing the insulating resin layer 20c (FIG. 10D).

  When the steps up to here are completed, an operation of cutting out each common mode filter laminated body by dicing is performed in the same manner as the steps described in the first embodiment. The laminated body shown in FIG. 10E is a common mode filter laminated body cut out in this way.

  Next, insulator coatings 81 and 82 are applied to a part of the side surface of each common mode filter laminate (FIG. 10F). The coating treatment is preferably performed using either a sputtering method or a CVD method. After coating, etching is performed leaving only the portion of the side surface of the conductive magnetic substrate that covers the portion facing each terminal electrode.

  Finally, terminal electrodes 41a to 44a are formed on the side surface of each common mode filter laminate so as to be connected to the extraction electrode conductor (FIG. 10G). In the portion where the insulator coatings 81 and 82 are present, the terminal electrodes 41 a to 44 a are formed on the insulator coatings 81 and 82.

  As described above, also in this embodiment, an insulating region is provided between the conductive magnetic substrates 13c and 14c and the terminal electrodes 41a to 44a, and the insulating region is formed of the conductive magnetic substrates 13c and 14c and the terminal electrode. Since conduction with 41a-44a is prevented, a common mode filter suitably constituted using a material with high magnetic permeability can be provided.

  Moreover, in this embodiment, the insulator coating provided on the side surface of the common mode filter laminate can be used as a specific constituent material of the insulating region. This eliminates the need to process the conductive magnetic substrate as in the first and second embodiments, and thus has the effect of simplifying the laminated structure and method.

  Further, in the common mode filter 1d, since the insulating layer is reduced by one layer compared to the common mode filters 1a and 1b, the height is reduced and the number of steps for one layer is reduced.

  Here, a further modification of the common mode filter 1c will be described.

  FIG. 11 is a schematic exploded perspective view showing the outer shape and structure of a common mode filter 1d which is a modification of the common mode filter 1c. As shown in the figure, the common mode filter 1d has a configuration in which the insulating resin body layer 20c is replaced with an insulating resin body layer 20d in the common mode filter 1c.

  The insulating resin body layer 20d is a laminated body in which four insulating layers 21d, 22d, 23d, and 24c are laminated in this order. The spiral conductors 51 and 52 are formed on the surfaces of the insulating layers 21d and 23d, respectively, while the lead electrode conductors 61 to 64 are all formed on the surface of the insulating layer 22d.

  The outer peripheral end of the spiral conductor 51 is connected to the terminal electrode 41a via the through hole and the extraction electrode conductor 61, and the inner peripheral end is connected to the terminal electrode 43a via the through hole and the extraction electrode conductor 63. Further, the outer peripheral end of the spiral conductor 52 is connected to the terminal electrode 42a via the through hole and the extraction electrode conductor 62, and the inner peripheral end is connected to the terminal electrode 44a via the through hole and the extraction electrode conductor 64. .

  In this way, in the common mode filter 1d, the distance between all the exposed electrode conductors 61 to 64 on the side surface of the common mode filter multilayer body and the conductive magnetic substrates 13c and 14c is equal to the common mode filter 1a and 1b. It is longer than Therefore, it is relatively easy to provide the insulator coatings 81 and 82 so as not to cover the exposed regions not only on the side surfaces on the terminal electrodes 43a and 44a side but also on the side surfaces on the terminal electrode 41a and 42a side.

[Fourth Embodiment]
FIG. 12 is a schematic exploded perspective view showing the outer shape and structure of a common mode filter 1e according to a preferred fourth embodiment of the present invention. FIG. 13 is a cross-sectional view taken along line DD ′ of the common mode filter 1e shown in FIG. In FIGS. 12 and 13, the same components as those described in the first embodiment are denoted by the same reference numerals as those in FIGS.

  The common mode filter 1e has a configuration in which the insulating resin body layer 20a is replaced with an insulating resin body layer 20e in the common mode filter 1a. The insulating resin body layer 20e is a laminated body in which insulating layers 21e to 25e are laminated in this order.

  The insulating layers 21e to 25e differ from the insulating layers 21a to 25a of the insulating resin body layer 20a in that the through holes 71 are not provided. Therefore, the insulating resin body layer 20e does not have the magnetic leg of the common mode choke coil constituted by the spiral conductors 51 and 52, and does not have the effect of reducing the cutoff frequency of the common mode choke coil by the magnetic leg. Depending on the required performance, such a configuration may be used.

  Since the through-hole 71 is not provided, an empty space is created at the center of each spiral conductor, and this space may be used to increase the number of turns of each spiral conductor. By doing so, the cutoff frequency can be lowered to some extent.

[Fifth Embodiment]
FIG. 14 is a schematic exploded perspective view showing the outer shape and structure of a common mode filter 1f according to a preferred fifth embodiment of the present invention. FIG. 15 is a cross-sectional view of the common mode filter 1f shown in FIG. 14 taken along the line EE ′. In FIGS. 14 and 15, the same components as those described in the fourth embodiment are denoted by the same reference numerals as those in FIGS.

  The common mode filter 1f is formed by forming the spaces S1 and S2 by retreating the side surfaces of the conductive magnetic substrates 13a and 14a from the side surfaces of the common mode filter laminate, and forming insulating regions in the spaces S1 and S2. Although it is the same as the common mode filter 1e, it is different from the common mode filter 1e in that air that fills the space is used as a constituent material of the insulating region. This will be specifically described below.

  As shown in FIGS. 14 and 15, in the common mode filter 1f, the adhesive 26 filled in the space S2 in the common mode filter 1e is removed, and the insulating resin body layer 20e is replaced with the insulating resin body layer 20f. It has a configuration. The insulating resin body layer 20f is different from the insulating resin body layer 20e in that an insulating layer 21f that does not have the convex portion T1 is used instead of the insulating layer 21e that has the convex portion T1.

  Therefore, the spaces S1 and S2 created by the receding of the side surfaces of the conductive magnetic substrates 13a and 14a are not filled with substances other than air, and the air flows between the conductive magnetic substrates 13a and 14a and the terminal electrodes. An insulating region for preventing conduction is formed.

  The common mode filter 1f includes terminal electrodes 41f to 44f instead of the terminal electrodes 41a to 44a. The difference between the terminal electrodes 41a to 44a and the terminal electrodes 41f to 44f will be described in the description of the method for manufacturing the common mode filter 1f.

  Hereinafter, a method for manufacturing the common mode filter 1f will be described.

  FIG. 16 is an explanatory diagram of a method for manufacturing the common mode filter 1f. FIGS. 16A to 16D sequentially show steps in manufacturing a large number of common mode filters 1f on one circular insulating magnetic substrate. . FIGS. 16E and 16F sequentially show the steps after cutting out each common mode filter laminate. Hereinafter, a method for manufacturing the common mode filter 1f will be described with reference to FIG.

  First, a circular insulating magnetic substrate 11a is prepared (FIG. 16 (a)), on which the side surface facing the terminal electrodes 41f to 44f is retracted from the side surface of each common mode filter laminate. A magnetic substrate 13a is formed (FIG. 16B), which is used as a first base substrate. This process is the same as that described in the first embodiment.

  Although not shown, a circular insulating magnetic substrate 12a is prepared in the same manner as in the steps so far, and the side surface facing the terminal electrodes 41f to 44f is formed on each of the common mode filter laminates. A conductive magnetic substrate 14a that recedes from the side surface is formed as a second base substrate.

  Further, an insulating resin body layer 20f is formed (FIG. 16C). This formation is performed by preparing a separate substrate and forming an insulating layer and a conductor pattern thereon. After the formation, the insulating resin body layer 20f is separated from the substrate.

  Next, the insulating resin body layer 20f is sandwiched and bonded between the first base substrate and the second base substrate. The first base substrate is bonded to the insulating resin layer 20f with the surface on the conductive magnetic substrate 13a side facing the insulating resin layer 20f. Similarly, the second base substrate is bonded to the insulating resin layer 20f with the surface on the conductive magnetic substrate 14a side facing the insulating resin layer 20f.

  When the steps up to here are completed, an operation of cutting out each common mode filter laminated body by dicing is performed in the same manner as the steps described in the first embodiment. The laminated body shown in FIG. 16E is a common mode filter laminated body cut out in this way.

  Next, a terminal electrode is formed on the side surface of each common mode filter laminate. As shown in FIG. 16E, the side surface of the common mode filter laminate obtained in the present embodiment has irregularities. Therefore, the terminal electrode cannot be formed using a sputtering method or a CVD method. Therefore, a U-shaped fitting (a shape obtained by bending a straight line at two right angles in the same direction) is used for the terminal electrodes 41f to 44f. FIG. 16 (f) shows a common mode filter laminated body on which such terminal electrodes 41f to 44f are mounted.

  As described above, according to the present embodiment, an insulating region is provided between the conductive magnetic substrates 13a and 14a and the terminal electrodes 41f to 44f, and the insulating region is formed between the conductive magnetic substrates 13a and 14a and the terminal. Since conduction between the electrodes 41f to 44f is hindered, a common mode filter suitably configured using a material having high magnetic permeability can be provided.

  In addition, according to the present embodiment, the insulating region can be provided by utilizing the space generated by retreating the side surface of the conductive magnetic substrate from the side surface of the common mode filter laminate. Air can be used as a specific constituent material of the insulating region.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to such embodiment at all, and this invention can be implemented in various aspects in the range which does not deviate from the summary. Of course.

  For example, although the common mode filter is taken up in the above embodiment, the present invention is not limited to the common mode filter and can be widely applied to laminated transformer components.

1 is a schematic exploded perspective view showing an outer shape and structure of a common mode filter according to a preferred first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA ′ of the common mode filter illustrated in FIG. 1. It is explanatory drawing of the manufacturing method of the common mode filter by preferable 1st Embodiment of this invention. It is explanatory drawing of the manufacturing method of the common mode filter by preferable 1st Embodiment of this invention. It is a substantially exploded perspective view which shows the external shape and structure of the common mode filter by preferable 2nd Embodiment of this invention. FIG. 6 is a cross-sectional view of the common mode filter shown in FIG. 5 taken along the line BB ′. It is explanatory drawing of the manufacturing method of the common mode filter by preferable 2nd Embodiment of this invention. It is a substantially exploded perspective view which shows the external shape and structure of a common mode filter by preferable 3rd Embodiment of this invention. It is CC 'sectional view taken on the line of the common mode filter shown in FIG. It is explanatory drawing of the manufacturing method of the common mode filter by preferable 3rd Embodiment of this invention. It is a substantially exploded perspective view which shows the external shape and structure of the modification of the common mode filter by preferable 3rd Embodiment of this invention. It is a substantially exploded perspective view which shows the external shape and structure of the common mode filter by preferable 4th Embodiment of this invention. It is DD 'sectional view taken on the line of the common mode filter shown in FIG. It is a substantially exploded perspective view which shows the external shape and structure of the common mode filter by preferable 5th Embodiment of this invention. It is the EE 'line sectional view of the common mode filter shown in FIG. It is explanatory drawing of the manufacturing method of the common mode filter by preferable 5th Embodiment of this invention. 1 is a schematic exploded perspective view showing an outer shape and structure of a common mode filter 100 according to the background art of the present invention.

Explanation of symbols

1a to 1f Common mode filters 11a, 11b, 12a and 12b Insulating magnetic substrates 13a, 13c, 14a and 14c Conductive magnetic substrates 20a to 20f Insulating resin layers 21a to 25a, 21b, 21c to 24c and 21e to 25e, 21f Insulating layer 26 Adhesives 41a-44a, 41f-44f Terminal electrodes 51, 52 Spiral conductors 61-64 Lead electrode conductor 71 Through hole 81, 82 Insulator coating S1, S2 Space T1-T3 Projection

Claims (14)

A laminate in which a conductive magnetic substrate, a coil conductor, and an insulating resin body layer having an extraction electrode conductor connected to the coil conductor are laminated;
A terminal electrode disposed on a side surface of the laminate and connected to the lead electrode conductor;
A laminated transformer component having an insulating region disposed between the conductive magnetic substrate and the terminal electrode. The side surface of the conductive magnetic substrate is retreated from the side surface of the multilayer body at least in a portion facing the terminal electrode,
The laminated transformer component according to claim 1, wherein the insulating region is provided in a space formed between a side surface of the conductive magnetic substrate and the terminal electrode by the retreat. The insulating resin body layer is laminated in the space,
The laminated transformer component according to claim 2, wherein the insulating region is constituted by the insulating resin body layer laminated in the space. The laminated body is also laminated with an insulating magnetic substrate,
One side and the other side of the conductive magnetic substrate are bonded to the insulating magnetic substrate and the insulating resin layer, respectively.
The laminated transformer component according to claim 2, wherein the insulating magnetic substrate has a protruding portion protruding into the space.   The laminated transformer component according to claim 1, wherein the insulating region is configured by an insulating coating applied to a part of a side surface of the laminated body. The coil conductor includes a first spiral conductor and a second spiral conductor;
6. The laminated transformer component according to claim 5, wherein the first spiral conductor and the second spiral conductor are arranged to be magnetically coupled to each other.   The multilayer transformer component according to claim 6, wherein the lead electrode conductor is disposed between the spiral conductors.   The laminated transformer component according to any one of claims 1 to 7, further comprising a conductive magnetic leg penetrating through a central portion of each spiral conductor. A method of manufacturing a laminated transformer component in which terminal electrodes are arranged on side surfaces,
Forming a first conductive magnetic substrate on the first insulating magnetic substrate, the first conductive magnetic substrate having a side surface facing the terminal electrode receding from the side surface;
A second step of forming an insulating resin body layer having a coil conductor and an extraction electrode conductor connected to the coil conductor on the laminate obtained by the first step;
A third step of forming a second conductive magnetic substrate having a side surface facing the terminal electrode receding from the side surface on the insulating resin body layer;
A fourth step of bonding a second insulating magnetic substrate on the laminate obtained by the third step;
A method of manufacturing a laminated transformer component, comprising: a fifth step of forming the terminal electrode so as to be connected to the lead electrode conductor on a side surface of the multilayer body obtained in the fourth step.   The multilayer transformer component according to claim 9, wherein in the second step, the insulating resin body layer is formed on the multilayer body obtained in the first step by using a spin coating method. Method.   The said 2nd process forms the said insulating resin body layer, and adhere | attaches the formed said insulating resin body layer on the laminated body obtained by the said 1st process. Manufacturing method of laminated transformer parts. A method of manufacturing a laminated transformer component in which terminal electrodes are arranged on side surfaces,
A first step of generating a first base substrate by fitting a first conductive magnetic substrate to a first insulating magnetic substrate having a convex portion at least in a portion facing the terminal electrode;
A second step of generating a second base substrate by fitting a second conductive magnetic substrate to a second insulating magnetic substrate having a convex portion at least in a portion facing the terminal electrode;
A third step of forming an insulating resin body layer having a coil conductor and an extraction electrode conductor connected to the coil conductor on the surface of the first base substrate on the first conductive magnetic substrate side;
A fourth step of bonding the second base substrate to the insulating resin body layer with the surface on the second conductive magnetic substrate side facing the insulating resin body layer;
A method of manufacturing a laminated transformer component, comprising: a fifth step of forming the terminal electrode so as to be connected to the lead electrode conductor on a side surface of the multilayer body obtained in the fourth step. A method of manufacturing a laminated transformer component in which terminal electrodes are arranged on side surfaces,
A first step of producing a first base substrate by bonding a first insulating magnetic substrate and a first conductive magnetic body;
A second step of producing a second base substrate by bonding a second insulating magnetic substrate and a second conductive magnetic body;
A third step of forming an insulating resin body layer having a coil conductor and an extraction electrode conductor connected to the coil conductor on a surface of the first base substrate on the first conductive magnetic body side;
A fourth step of adhering the second base substrate to the insulating resin body layer with the surface on the second conductive magnetic body side facing the insulating resin body layer;
A fifth step of applying an insulator coating to at least a portion facing the terminal electrode among the exposed portions of the first and second conductive magnetic bodies on the side surface of the laminate obtained by the fourth step;
A method for producing a laminated transformer component, comprising: a sixth step of forming the terminal electrode so as to be connected to the lead electrode conductor on a side surface of the multilayer body obtained in the fifth step.   14. The method of manufacturing a laminated transformer component according to claim 13, wherein in the fifth step, the insulator coating is performed using a sputtering method or a CVD method.

Images