JPH09312213A - Laminated impedance element and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a laminated impedance element, which is superior in noise absorption characteristics and lessens the distortion of a signal wave and the delay of a signal, by a method wherein magnetic material layers between adjacent conductor layers are formed into a structure formed by laminating alternately Ni and Mn ferrites. SOLUTION: A laminated impedance element is constituted of a magnetic material 1, dielectric materials 2, a magnetic material layer 3, a magnetic material layer 4 and a magnetic material layer 5. Here, the layers 3 and 5 are formed into a structure formed by laminating alternately Ni and Mn ferrites and the layer 4 is formed into an element consisting of an Ni ferrite. Therefore, the laminated impedance element, which makes very small distortion of a signal waveform and the effect of a phase lag, makes a noise signal flow backward to a signal generation source and does never make unstable the operation of this signal generation source, can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount multilayer impedance element including a magnetic material and a coiled conductor, and a method for manufacturing the same.

[0002]

2. Description of the Related Art As electronic devices have become smaller and higher in frequency, E
MI measures are becoming increasingly important. Generally, in an impedance element, noise at a target frequency is shielded by impedance characteristics to take measures against EMI.

That is, it is generally practiced to mount an impedance element in series with a signal system to block noise.

Also, for the current line system of the active element such as the power amplifier, an impedance element is mounted in series to suppress noise of the signal frequency from leaking from the active element to the current line. Is being done.

The impedance at this time is composed of two reactances X (= ωL) derived from the inductance L component and a resistance R which is a loss (Z ² = X ² +).
R ² ).

The attenuation characteristic of the noise component is the same regardless of the ratio of X and R if the impedance is the same. Generally, the X component is usually larger than the R component.

In recent years, with the progress of miniaturization of electronic devices, there has been an increasing demand for miniaturization of electronic components, and in order to meet the demand, the mainstream of electronic components typified by impedance elements has shifted to the laminated type. It's starting.

The laminated impedance element used in the form of being mounted on a printed wiring board or the like is usually a magnetic layer composed of Ni-based soft magnetic ferrite powder and a binder, and a conductor composed of conductive powder and a binder. After alternately stacking layers,
It is formed by simultaneous sintering.

[0009]

However, in the case where the signal frequency has become higher as in the present day, when a conventional impedance element is used as a countermeasure against such EMI, an impedance having many inductance components is used. Elements will be installed in series with the signal system,
There is a fatal defect that the influence of signal waveform distortion and phase delay becomes extremely large, making it impossible to transmit information accurately.

With respect to the noise signal, the resistance R absorbs the signal by converting the signal energy into heat, but the reactance X reflects most of the signal energy without absorbing the signal energy. The signal has the serious drawback of flowing back into the signal source, destabilizing the operation of this signal source and possibly even destroying it.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the related art, to provide a laminated impedance element having excellent noise absorption characteristics and less distortion and delay of signal waves, and a method of manufacturing the same.

[0012]

DISCLOSURE OF THE INVENTION The present invention provides a multilayer impedance element having a structure in which a magnetic layer between adjacent conductor layers has a structure in which Ni-based ferrite and Mn-based ferrite are alternately laminated and a multilayer impedance element thereof. The present invention relates to a manufacturing method.

That is, according to the present invention, in a multilayer impedance element in which a coil of a spiral conductor is provided in a magnetic material, and a magnetic material layer and a conductive material layer are laminated and fired, the magnetic material layer is Ni-based. A laminated impedance element comprising ferrite and Mn-based ferrite.

Further, according to the present invention, in the above laminated impedance element, the magnetic layers above and below the conductor coil in the laminating direction are formed by alternately laminating Ni-based ferrite and Mn-based ferrite. Is a laminated impedance element.

Further, according to the present invention, in the above laminated impedance element, the magnetic material layer between the adjacent conductor layers is Ni.
A multi-layered impedance element characterized by alternately laminating a series ferrite and a Mn series ferrite.

Further, the present invention is the above-mentioned laminated impedance element, wherein all laminated magnetic layers are formed by alternately laminating Ni series ferrite and Mn series ferrite. .

Further, according to the present invention, on the laminated magnetic layer,
A method of manufacturing a laminated impedance element, comprising stacking magnetic layers having a spiral conductor coil formed thereon, and laminating and firing a magnetic layer on the magnetic layer, wherein the magnetic layer includes the magnetic layer and the spiral conductor coil. In the method of manufacturing a laminated impedance element, at least one of the body layers is formed by alternately laminating Ni-based ferrite and Mn-based ferrite.

The present invention has a large loss in a high frequency range,
By using Mn-based ferrite in which μ disappears in the impedance element, the R component in the high frequency region becomes extremely larger than the X component.

Further, the Mn-based ferrite has a smaller specific resistance than the conventional Ni-based ferrite, and there is a possibility that the Mn-based ferrite alone cannot provide insulation between the conductor layers.
A sufficient insulation resistance can be obtained by alternately stacking Ni-based ferrites.

Therefore, by stacking Ni-based ferrite and Mn-based ferrite alternately, it is possible to obtain a multilayer impedance element having excellent noise absorption characteristics in a high frequency region and having less distortion and delay of signal waves.

[0021]

Embodiments of the present invention will be described in detail with reference to the drawings.

(Example 1) Ni-Cu-Zn ferrite powder (specific surface area 5.2 m ² / g) 100 parts by weight Binder (polyvinyl butyral) 5 parts by weight Solvent (ethyl cellosolve) 70 parts by weight The above composition was used in a spiral mixer. And mix with
The mixture was kneaded and dispersed in a sand mill to obtain a Ni-based ferrite paste.

Mn-Zn ferrite powder (specific surface area 7.3 m ² / g) 100 parts by weight Binder (polyvinyl butyral) 5 parts by weight Solvent (ethyl cellosolve) 70 parts by weight The above composition was mixed using a spiral mixer, and further mixed. ,
The mixture was kneaded and dispersed in a sand mill to obtain a Mn-based ferrite paste.

Binder (ethyl cellulose) 5 parts by weight Solvent (α-terpineol) 15 parts by weight Solvent (butyl carbitol acetate) 10 parts by weight Palladium powder (average particle size 0.1 μm) 25 parts by weight Silver fine powder (average particle size) 0.2 μm) 75 parts by weight The above composition was kneaded and dispersed with a three-roll to obtain a conductor paste.

Next, the produced Ni-based and Mn-based ferrite pastes were alternately laminated by a printing method until a predetermined thickness (500 μm) was reached.

Printed lamination was performed thereon by using a conductor paste and a Ni-based ferrite paste so as to form a laminated winding of a conductor having 3.5 turns.

Further, Ni-based and Mn-based ferrite pastes were alternately laminated to a thickness of 500 μm by a printing method, cut into a predetermined size (2.4 mm × 1.5 mm), and debindered. Then, it was integrally baked at 900 ° C.

A conductive paste containing Ag as a main component is applied to the exposed surface of the laminated winding of the fired body and baked at about 600 ° C. to form an external electrode, thereby forming a laminated impedance. A device was produced.

FIG. 1 is a sectional view (external electrodes are omitted) of a laminated impedance element according to an embodiment of the present invention. The laminated impedance element of the present invention is the magnetic body 1
And a conductor 2, a magnetic layer A3, a magnetic layer B4, and a magnetic layer C5. In this embodiment, the magnetic layer A
3, C5 has a structure in which Ni-based ferrite and Mn-based ferrite are alternately laminated, and the magnetic layer B4 is made of Ni-based ferrite.

In Example 1, a paste was prepared with the above composition, but other components and compounding ratios may be used as long as a printable paste can be obtained.

Example 2 Ni-based ferrite paste was laminated by a printing method until it had a predetermined thickness (500 μm).

Printed lamination was performed thereon by using a conductor paste and a Ni-based or Mn-based ferrite paste to form a laminated winding of a conductor having 3.5 turns.

At this time, Ni-based ferrite and Mn-based ferrite were alternately laminated in the magnetic layer between the adjacent conductors.

Further, a Ni-based ferrite paste was laminated thereon to a thickness of 500 μm by a printing method to form a laminated body.

Other than the above, FIG.
A multilayer impedance element in which the magnetic layer B4 has a structure in which Ni-based and Mn-based ferrites are alternately laminated and the magnetic layers A3 and C5 are Ni-based ferrites was manufactured.

Example 3 Ni-based and Mn-based ferrite pastes were alternately laminated by a printing method until a predetermined thickness (500 μm) was reached.

Print lamination was performed thereon by using a conductor paste and a Ni-based or Mn-based ferrite paste so as to form a laminated winding of a conductor having 3.5 turns.

At this time, Ni-based ferrite and Mn-based ferrite were alternately laminated in the magnetic layer between the adjacent conductors.

Further thereon, Ni-based and Mn-based ferrite pastes were alternately laminated by a printing method to a thickness of 500 μm to obtain a laminate.

Other than that, in the same manner as in Example 1, FIG.
A multilayer impedance element having a structure in which all of the magnetic layers A3, B4 and C5 of Ni-based ferrite and Mn-based ferrite were alternately laminated was manufactured.

(Comparative Example) Ni-based ferrite paste
The layers were laminated by a printing method until a predetermined thickness (500 μm) was reached.

Printed lamination was performed thereon by using a conductor paste and a Ni-based ferrite paste so as to form a laminated winding of a conductor having 3.5 turns.

Further, a Ni-based ferrite paste was laminated thereon to a thickness of 500 μm by a printing method to form a laminated body.

Other than that, in the same manner as in Example 1, FIG.
A multilayer impedance element in which all of the magnetic layers A3, B4, and C5 of Ni-based ferrite were manufactured.

(Evaluation) The reactance, resistance, and frequency characteristics of impedance of the manufactured laminated impedance element were evaluated using an impedance analyzer HP4191A manufactured by YHP.

The evaluation results of Example 1 are shown in FIG. 2, Example 2 in FIG. 3, Example 3 in FIG. 4 and Comparative Example in FIG. A in FIGS. 2, 3, 4, and 5 is impedance | Z |,
B represents reactance X and C represents resistance R.

Comparing Examples 1 to 3 with Comparative Example, FIG.
From FIG. 5, it can be seen that there is almost no difference in the impedance values in the high frequency region around 50 to 100 MHz, but the R component is extremely larger than the X component.

Therefore, the influence of the distortion of the signal waveform and the delay of the phase is extremely small, and the noise signal flows back to the signal generating source, and the laminated impedance element which does not destabilize the operation of the signal generating source is obtained. You can

[0049]

As is apparent from the above, the present invention provides a laminated impedance element having excellent noise absorption characteristics in a high frequency region and less distortion and delay of signal waves and a method for manufacturing the same, as compared with the conventional one. Can be provided.

[Brief description of drawings]

FIG. 1 is a sectional view of a laminated impedance element showing an embodiment of the present invention.

FIG. 2 is a diagram showing frequency characteristics of reactance, resistance, and impedance of the laminated impedance element according to the first embodiment of the present invention.

FIG. 3 is a diagram showing frequency characteristics of reactance, resistance, and impedance of the laminated impedance element according to the second embodiment of the present invention.

FIG. 4 is a diagram showing frequency characteristics of reactance, resistance, and impedance of a laminated impedance element according to Example 3 of the present invention.

FIG. 5 is a diagram showing frequency characteristics of reactance, resistance, and impedance of a laminated impedance element of a comparative example.

[Explanation of symbols]

 1 magnetic material 2 conductor 3 magnetic material layer A 4 magnetic material layer B 5 magnetic material layer C A impedance | Z | B reactance X C resistance R

Claims (5)

[Claims] 1. A laminated impedance element comprising a spiral coil of a conductor provided in a magnetic material, and a magnetic material layer and a conductive material layer being laminated and fired, wherein the magnetic material layer is a Ni-based ferrite and a Mn-based material. A laminated impedance element comprising a ferrite. 2. The laminated impedance element according to claim 1, wherein the magnetic layers above and below the conductor coil in the laminating direction are formed by alternately laminating Ni-based ferrite and Mn-based ferrite. And a laminated impedance element. 3. The laminated impedance element according to claim 1 or 2, wherein the magnetic layer between adjacent conductor layers is formed by alternately laminating Ni-based ferrite and Mn-based ferrite. Multilayered impedance element. 4. The laminated impedance element according to claim 1, 2, or 3, wherein all laminated magnetic layers are formed by alternately laminating Ni-based ferrite and Mn-based ferrite. A laminated impedance element characterized by the following. 5. A method of manufacturing a laminated impedance element, comprising: laminating a magnetic material layer having a spiral conductor coil formed on the laminated magnetic material layer, and further laminating and firing the magnetic material layer thereon. A laminated impedance element, wherein at least one of the magnetic layer and the magnetic layer including the spiral conductor coil is formed by alternately stacking Ni-based ferrite and Mn-based ferrite. Production method.