JP2009231343A - Circuit board unit and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board unit and an electronic apparatus which can surely load a shield cover to a frame. <P>SOLUTION: Solder paste is coated on the front surface of a circuit board 22 for manufacturing of the circuit board unit 21. A lower end of the frame 25 is arranged on the solder paste. When the solder paste fuses, the solder paste is diffused up to the frame 25 because of its wettablity and spreadability. In this timing, the shield cover 24 accepts a projection 31 of the frame 25 with a second accepting hole 33. Therefore, the shield cover 24 is located at the position of upper stage. The solder paste is wettable and can be spread, but upward diffusion of solder paste to the projection 31, second accepting hole 33, and first accepting hole 32 can be avoided. As a result, after the solder paste is hardened, the first accepting hole 32 can surely accept the projection 31. The shield cover 24 can surely be loaded to the frame 25. Fall of the shield cover 24 from the frame 25 can be avoided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate unit including, for example, a substrate, a component mounted on the surface of the substrate, and a shield cover that covers the component on the surface of the substrate.

  For example, a printed circuit board unit is incorporated in a mobile phone terminal device. The printed circuit board unit includes a printed circuit board. An LSI chip is mounted on the surface of the printed circuit board based on, for example, BGA (ball grid array). A shield cover covers the LSI chip. The shield cover is attached to a surface mounting frame extending around the LSI chip. The lower end of the frame is soldered to the surface of the printed circuit board.

  In manufacturing such a printed circuit board unit, an LSI chip is arranged on the surface of the printed circuit board. A BGA is formed in advance on the back surface of the LSI chip. At the same time, a frame is arranged on the surface of the printed circuit board. The lower end of the frame is received by the solder material. The printed circuit board is placed in a reflow furnace, for example. BGA and solder material melt on heating. The printed circuit board is removed from the reflow furnace. The LSI chip and the frame are mounted on the printed circuit board based on the hardening of the BGA and the solder material.

  When the frame is mounted, a shield cover is attached to the frame for transporting the frame. For example, an adsorption nozzle is adsorbed on the surface of the shield cover. At this time, the protrusion formed on the shield cover is received in the first through hole formed on the frame. Thus, the shield cover is positioned at the upper position. A clearance is secured between the shield cover and the LSI chip. Contact between the shield cover and the LSI chip is reliably avoided. Misalignment of the LSI chip is avoided when the BGA is melted.

After the solder material is cured, the LSI chip is visually inspected for misalignment. During inspection, the shield cover is temporarily removed from the frame. After the inspection is completed, the shield cover is attached again to the frame. At this time, the projection of the shield cover is received in the second through hole of the frame. The second through hole is formed at a position closer to the surface of the printed board than the first through hole. Thus, the shield cover is positioned at the lower position. The clearance formed between the shield cover and the LSI chip is reduced. As a result, the height of the shield cover decreases from the surface of the printed circuit board. Such a printed circuit board unit contributes to thinning of the mobile phone terminal device.
JP 2008-34713 A JP 2004-179594 A Japanese Utility Model Publication No. 5-20389 Japanese Utility Model Publication No. 5-53296

  When the solder material melts, the solder material goes up into the frame based on the wetting and spreading of the solder material. For example, the second through hole is blocked by such a solder material. Particularly, since the height of the frame decreases with the recent thinning of the mobile phone terminal device, the position of the second through hole approaches the printed circuit board. The effect of solder material wetting spreads more and more. Thus, if the solder material blocks the second through hole, the second through hole cannot accept the projection of the shield cover. The shield cover can be easily removed from the frame.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate unit and an electronic apparatus that can securely attach a shield cover to a frame.

  To achieve the above object, the board unit includes a board, a frame mounted on the surface of the board, a solder material that joins a lower end of the frame to the surface of the board, and a protrusion formed on the frame. A conductive shield cover that is mounted on the frame and covers an electronic component disposed in a space inside the frame; and a projection formed on the shield cover that receives the protrusion of the frame; A first receiving hole for positioning the shield cover; and a second receiving hole formed in the shield cover for receiving the projection of the frame and positioning the shield cover at an upper position farther from the lower end of the shield cover than the lower position. And a hole.

  In manufacturing such a substrate unit, for example, a solder paste is applied to the surface of the substrate. The lower end of the frame is disposed on the solder paste. When the solder paste melts, the solder paste rises into the frame based on the wet spread. At this time, the shield cover receives the projection of the frame through the second receiving hole. Thus, the shield cover is positioned at the upper position. Despite the wetting and spreading of the solder paste, the solder paste is prevented from rising up to the protrusion, the second receiving hole, and the first receiving hole. As a result, the first receiving hole can reliably receive the protrusion after the solder paste is cured. The shield cover is securely attached to the frame. Omission of the shield cover from the frame is avoided. Such a substrate unit is incorporated in an electronic device, for example.

  The substrate unit defines a substrate that defines a through-hole penetrating from the front surface to the back surface, a pin that is received in the through-hole of the substrate, a frame that is mounted on the surface of the substrate, and a through-hole of the substrate that is filled. A solder material that joins the pins to the substrate, and a predetermined lower position and an upper position that is farther from the substrate than the lower position, and is mounted on the frame so as to move up and down. And a conductive shield cover for covering the electronic component disposed on the board.

  In manufacturing such a board unit, the pins of the frame are received in the through holes of the board. The shield cover is positioned at the upper position. The back surface of the substrate is immersed in, for example, molten solder in a solder bath. The molten solder goes up in the through hole. If the time of immersion in the solder bath is adjusted, an excessive rise to the frame can be avoided despite the spread of wetness of the molten solder. As a result, the shield cover is positioned at the lower position after the molten solder is cured. Thus, the shield cover is securely attached to the frame. Omission of the shield cover from the frame is avoided. Such a substrate unit is incorporated in an electronic device, for example.

  Such a substrate unit further includes a protrusion formed on the pin and received on the surface of the substrate. When the frame is placed on the surface of the substrate, the protrusion is received on the surface of the substrate. In this way, the frame can maintain a predetermined posture. The frame is accurately positioned with respect to the substrate. The frame placement operation can be easily performed.

  As described above, the board unit and the electronic device can securely attach the shield cover to the frame.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 schematically shows a specific example of an electronic apparatus according to the present invention, that is, a foldable mobile phone terminal 11. The mobile phone terminal 11 includes a transmitter 12 and a receiver 13. The transmitter 12 includes a first housing, that is, a main body housing 14. A printed circuit board unit to be described later is incorporated in the main body casing 14. The printed circuit board unit includes a processing circuit such as a CPU (Central Processing Unit) and a memory.

  An input button 15 such as an on-hook button, an off-hook button, or a dial key is embedded in the front flat surface of the transmitter 12. Depending on the operation of the input button 15, the CPU executes various processes. The main body housing 14 may be formed from, for example, a reinforced resin material.

  The handset 13 includes a second housing, that is, a display housing 16. A flat display panel such as a liquid crystal display (LCD) panel 17 is incorporated in the display housing 16. A display opening 18 is defined on the front flat surface of the display housing 16. The screen of the LCD panel 17 faces the display opening 18. Various texts and graphics are displayed on the screen of the LCD panel 17 in accordance with the processing operation of the CPU. The display housing 16 may be molded from a reinforced resin material, for example.

  The handset 13 can swing around the horizontal axis 19 with respect to the handset 12. The horizontal axis 19 is set at one end of the main body housing 14 in parallel with the front flat surface. In this way, the front flat surface of the display housing 16 is superimposed on the front flat surface of the main housing 14 inward. The mobile phone terminal 11 is closed. A folded state is established.

  As shown in FIG. 2, a printed circuit board unit 21 is accommodated in the main body housing 14. The printed circuit board unit 21 includes a printed circuit board 22 made of resin, for example. A plurality of electronic components 23 such as a CPU chip and a memory are mounted on the surface of the printed circuit board 22. A shield cover 24 is attached to the surface of the printed circuit board 22. The shield cover 24 may be formed of, for example, a thin plate of white or stainless steel, aluminum, magnesium, or copper.

  As shown in FIG. 3, the shield cover 24 is attached to a frame 25 for surface mounting. An electronic component 23 is mounted on the surface of the printed circuit board 22 in the space inside the frame 25. The frame 25 is composed of a thin skeleton member 26. The skeleton members 26 facing each other may extend in parallel to each other. The skeletal member 26 may be formed of, for example, a thin plate of any one of white, stainless steel, aluminum, magnesium, and copper. The skeleton members 26 are integrated with each other.

  FIG. 4 schematically shows the structure of the printed circuit board unit 21 according to the first embodiment of the present invention. The electronic component 23 is covered with a shield cover 24. The electronic component 23 is fixed to the surface of the printed circuit board 22 by a plurality of terminal bumps 27. The terminal bumps 27 constitute a BGA (ball grid array). The height of the electronic component 23 from the surface of the printed circuit board 22 is set to be smaller than 1.5 mm, for example. Since the electronic component 23 is thus covered by the shield cover 24, noise components generated by the electronic component 23 are blocked by the frame 25 and the shield cover 24. Components such as a radio circuit and an antenna accommodated in the mobile phone terminal 11 can operate normally.

  The skeleton member 26 of the frame 25 includes a side wall 26 a that rises from the surface of the printed circuit board 22. Here, the height of the upper end of the side wall 26a is set to about 1.5 mm, for example. A protruding piece 26b extending in parallel with the surface of the printed circuit board 22 is integrated with the upper end of the side wall 26a. The projecting pieces 26 b spread toward the electronic component 23 mutually outside the contour of the electronic component 23. The shield cover 24 is received on the upward surface of the protruding piece 26b. The side wall 26a and the protruding piece 26b have a thickness of about 0.1 mm to 0.2 mm, for example.

  The lower end of the side wall 26 a is soldered to the surface of the printed circuit board 22 based on the solder material 28. Solder material 28 is received on pads 29 formed on the surface of printed circuit board 22. In this way, the solder material 28 joins the lower end of the side wall 26 a and the pad 29. The pad 29 is partially formed along a part of the lower edge of the side wall 26a. For the solder material 28, for example, tin containing silver or copper, or gold is used.

  The shield cover 24 includes a top plate 24 a that extends parallel to the surface of the printed circuit board 22. A side wall 24b protruding in the vertical direction from the top plate 24a toward the surface of the printed circuit board 22 is integrated with the periphery of the top plate 24a. The downward surface of the top plate 24a is partially received by the upward surface of the protruding piece 26b. The top plate 24 a has the same outline as the outline of the frame 25. Here, a predetermined clearance is ensured between the downward surface of the top plate 24 a and the surface of the electronic component 23.

  A protrusion 31 is formed on the side wall 26 a of the frame 25. The protrusion 31 swells outward on the outward surface of the side wall 26a. The protrusion 31 is formed near the upper end of the side wall 26a. On the other hand, a through hole 32 and a recess 33 for receiving the projection 31 of the frame 25 are formed in the side wall 24b of the shield cover 24. The through holes 32 and the recesses 33 are arranged in a vertical direction orthogonal to the surface of the printed circuit board 22. The through hole 32 is separated from the surface of the printed circuit board 22 by the recess 33. The top plate 24a and the side wall 24b have a thickness of about 0.1 mm to 0.2 mm, for example. The thickness of the top plate 24a may be different from the thickness of the side wall 24b.

  As is apparent from FIG. 4, when the projection 31 is received in the through hole 32, the shield cover 24 is positioned at a specified lower position near the lower end of the side wall 26 a of the frame 25. In the lower position, the downward surface of the top plate 24 a is received by the upward surface of the projecting piece 26 b of the frame 25. At this time, a minimum clearance is ensured between the downward surface of the shield cover 24 and the surface of the electronic component 23.

  On the other hand, when the shield cover 24 is lifted, the recess 33 receives the protrusion 31 of the frame 25 based on the elastic deformation of the side wall 24b, as shown in FIG. Thus, the shield cover 24 is positioned at an upper position farther from the lower end of the side wall 26a of the frame 25 than the lower position. In the upper position, a predetermined gap is secured between the downward surface of the top plate 24a and the upward surface of the protruding piece 26b. At the same time, a maximum clearance is ensured between the downward surface of the top plate 24 a and the surface of the electronic component 23.

  Thus, the shield cover 24 is mounted on the frame 25 so as to move up and down between the lower position and the upper position based on the elastic deformation of the side wall 24b. When the shield cover 24 is further lifted from the upper position, the protrusion 31 is detached from the recess 33 due to elastic deformation of the side wall 24b. As a result, the shield cover 24 is removed from the frame 25. Thus, the shield cover 24 is detachably attached to the frame 25.

  For example, as shown in FIG. 6, in the frame 25, two protrusions 31 are formed on the skeleton member 26 at a predetermined interval. The protrusion 31 may be formed in a hemispherical shape, for example. Such protrusions 31 have a diameter of about 0.5 mm, for example. The protrusion 31 protrudes at about 0.3 mm, for example. On the other hand, in the shield cover 24, the through holes 32 and the depressions 33 are formed at predetermined intervals on the side wall 24b. The through hole 32 and the recess 33 may be formed to have a size that allows the protrusion 31 to be received. The protrusion 31 and the recess 33 are formed based on, for example, a punching process.

  Next, a method for manufacturing the printed circuit board unit 21 will be described. As shown in FIG. 7, a solder paste 41 is applied on the pad 29 or at a predetermined position on the surface of the printed circuit board 22. As shown in FIG. 8, the electronic component 23 is disposed on the solder paste 41. The electronic component 23 is received on the solder paste 41 by a solder ball 42 attached to the back surface. Thereafter, the frame 25 is disposed on the solder paste 41. The frame 25 is received on the solder paste 41 at the lower end. A shield cover 24 is attached to the frame 25 in advance. At the time of arrangement, the suction nozzle 43 is sucked onto the surface of the shield cover 24. The shield cover 24 is positioned at the upper stage position. The protrusion 31 is received in the recess 33. In the upper position, the maximum clearance is ensured between the downward surface of the top plate 24a and the surface of the electronic component 23. The contact between the top plate 24a and the electronic component 23 is avoided.

  Subsequently, the printed circuit board 22 is placed in a reflow furnace. Heat is applied to the printed circuit board 22. The solder paste 41 melts between the side wall 26a and the pad 29. The solder paste 41 rises to the side wall 26a based on the wet spread. Similarly, the solder paste 41 and the solder balls 42 are melted between the electronic component 23 and the printed board 22. Thereafter, the printed circuit board 22 is taken out from the reflow furnace. The printed circuit board 22 is cooled. The solder paste 41 and the solder balls 42 are solidified. In this way, the frame 25 and the electronic component 23 are soldered to the surface of the printed circuit board 22 as shown in FIG. Thereafter, the shield cover 24 is removed from the frame 25. The position of the electronic component 23 is visually confirmed, for example. The displacement of the electronic component 23 is inspected.

  Thereafter, as shown in FIG. 10, the shield cover 24 is attached to the frame 25 again. The shield cover 24 is positioned at the lower position based on the elastic deformation of the side wall 24b. The protrusion 31 is received in the through hole 32. The downward surface of the top plate 24a is received by the upward surface of the protruding piece 26b. As described above, since the minimum clearance is ensured between the downward surface of the top plate 24a and the surface of the electronic component 23 at the lower position, the height of the shield cover 24 on the surface of the printed circuit board 22 is as follows. Reduced. Thinning of the printed circuit board unit 21 is realized. Such a printed circuit board unit 21 can contribute to reducing the thickness of the main body casing 14, that is, the mobile phone terminal 11.

  In the printed circuit board unit 21 as described above, the protrusion 31 is formed on the side wall 26 a of the frame 25. When the solder paste 41 is melted, the shield cover 24 receives the protrusion 31 in the recess 33. Thus, the shield cover 24 is positioned at the upper position. Despite the wet spread of the solder paste 41, the solder paste 41 is prevented from rising up to the protrusion 31, the recess 33 and the through hole 32. As a result, after the solder paste 41 is cured, the through hole 32 of the shield cover 24 can reliably receive the protrusion 31. The shield cover 24 can be attached to the frame 25. Omission of the shield cover 24 from the frame 25 is avoided.

  FIG. 11 schematically shows the structure of a printed circuit board unit 21a according to the second embodiment of the present invention. In the printed circuit board unit 21a, a through hole 51 is formed in the printed circuit board 22. The through hole 51 includes a through hole 52 that penetrates the printed circuit board 22 between the front surface and the back surface, and a cylindrical metal wall 53 formed in the through hole 52. The metal wall 53 is connected to the land pattern 54 on the front surface and the back surface of the printed circuit board 22. The metal wall 53 and the land pattern 54 are made of a conductive material such as copper. Here, for example, a plurality of through holes 51 may be formed in the printed circuit board 22 corresponding to one skeleton member 26.

  The through hole 51 receives a pin 55 protruding from the lower end of the side wall 26 a of the frame 25. The pin 55 is integrated with the side wall 26a. The tip of the pin 55 protrudes from the back surface of the printed circuit board 22. A protrusion 56 received on the surface of the printed circuit board 22 is integrated with the base end of the pin 55. The protrusion 56 protrudes parallel to the surface of the printed circuit board 22. The pin 55 and the protrusion 56 are joined to the through hole 51 based on the solder material 28. The solder material 28 forms a so-called fillet 57 on the back surface of the printed circuit board 22. Like reference numerals are attached to the structure or components equivalent to those of the aforementioned printed circuit board unit 21.

  Next, a method for manufacturing the printed circuit board unit 21a will be described. Similar to the above, the electronic component 23 is disposed on the solder paste 41. The printed circuit board 22 is placed in a reflow furnace. The solder paste 41 and the solder balls 42 are melted. The printed circuit board 22 is taken out from the reflow furnace. The electronic component 23 is soldered to the surface of the printed circuit board 22 based on the hardening of the solder paste 41. Thereafter, as shown in FIG. 12, the frame 25 is disposed on the surface of the printed circuit board 22. The pin 55 is received in the through hole 51. No solder paste is disposed in the through hole 51 or on the land pattern 54. The protrusion 56 is received by the land pattern 54. Such a projection 56 allows the frame 25 to maintain a predetermined posture on the surface of the printed circuit board 22. The arrangement work of the frame 25 is easily performed. The shield cover 24 is positioned at the upper stage position.

  As shown in FIG. 13, the printed circuit board 22 is immersed in the molten solder 58 in the solder bath on the back surface. The molten solder 58 rises into the through hole 51 from the back surface of the printed circuit board 22 by the action of the capillary phenomenon. The molten solder 58 goes up to the surface of the printed circuit board 22. Based on the wet spread of the molten solder 58, the molten solder 58 rises up to the side wall 26a. The molten solder 58 is uniformly filled in the through holes 51. After a predetermined time has elapsed, the printed circuit board 22 is pulled up from the solder bath. Thereafter, the molten solder 58 is cured based on the cooling. Thus, the through hole 51 is filled with the solder material 28. The pin 55 is joined to the through hole 51. A fillet 57 is formed at the tip of the pin 55.

  Thereafter, the shield cover 24 is removed from the frame 25 in the same manner as described above. The position of the electronic component 23 is visually confirmed, for example. The displacement of the electronic component 23 is inspected. The shield cover 24 is attached to the frame 25 again. The shield cover 24 is positioned at the lower position based on the elastic deformation of the side wall 24b. At the lower position, a minimum clearance is secured between the downward surface of the top plate 24 a and the surface of the electronic component 23, so that the height of the shield cover 24 is reduced on the surface of the printed board 22. Thinning of the printed circuit board unit 21 is realized. Such a printed circuit board unit 21 can contribute to reducing the thickness of the main body casing 14, that is, the mobile phone terminal 11.

  In such a printed circuit board unit 21a, the projection 31 is formed on the side wall 26a of the frame 25 as described above. The molten solder 58 goes up in the through hole 51 from the back surface of the printed circuit board 22 toward the front surface. If the time of immersion in the solder bath is adjusted, the molten solder 58 can be prevented from rising up to the protrusions 31, the depressions 33, and the through holes 32, regardless of the spread of the molten solder 58. As a result, after the molten solder 58 is cured, the through hole 32 of the shield cover 24 can reliably receive the protrusion 31. The shield cover 24 can be attached to the frame 25. Omission of the shield cover 24 from the frame 25 is avoided.

  In manufacturing the printed circuit board 21 a as described above, the frame 25 may be mounted on the printed circuit board 22 at the same time as the electronic component 23 is mounted. In mounting, the solder paste 41 is applied on the land pattern 54 on the surface of the printed circuit board 22. The lower end of the frame 25 is received on the solder paste 41. Based on the reflow, the frame 25 is mounted on the surface of the printed circuit board 22 simultaneously with the electronic component 23. Thereafter, solder is filled into the through hole 51 from the back surface of the printed circuit board 22. A fillet 57 is formed based on such solder. In addition, the projection 56 may be omitted from the frame 25. At this time, the frame 25 may be received on the surface of the printed circuit board 22 at the lower end.

  As shown in FIG. 14, in the printed circuit board unit 21 a, the first dent 61 and the second dent 62 may be formed in the side wall 26 a of the frame 25. The first dent 61 and the second dent 62 are arranged in a vertical direction orthogonal to the surface of the printed circuit board 22. The first recess 61 is closer to the surface of the printed circuit board 22 than the second recess 62. On the other hand, a projection 63 is formed on the shield cover 24 adjacent to the lower end of the side wall 24b. When the protrusion 63 is received in the first recess 61, the shield cover 24 is positioned at the lower position. When the protrusion 63 is received in the second recess 62, the shield cover 24 is positioned at the upper position. Like reference numerals are attached to the structure or components equivalent to those described above.

  In manufacturing such a printed circuit board unit 21a, as described above, the molten solder 58 rises in the through hole 51 from the back surface of the printed circuit board 22 toward the front surface. If the immersion time in the solder bath is adjusted, the molten solder 58 can be prevented from rising up to the protrusion 63, the first recess 61, and the second recess 62, regardless of the wet spread of the molten solder 58. As a result, after the molten solder 58 is cured, the first recess 61 of the shield cover 24 can reliably receive the protrusion 63. The shield cover 24 can be attached to the frame 25. Omission of the shield cover 24 from the frame 25 is avoided. As shown in FIG. 15, the first depression 61 may be substituted with a through hole 64.

  The printed circuit board units 21 and 21a as described above may be incorporated in other electronic devices such as a notebook personal computer, a desktop computer, and an information processing terminal (PDA), for example, instead of the mobile phone terminal 11 described above. .

It is a perspective view which shows roughly the external appearance of one specific example, ie, a mobile telephone terminal, of the electronic device which concerns on this invention. 1 is a partially exploded perspective view of a cellular phone terminal schematically showing a structure of a substrate unit according to an example of the present invention. 1 is a partially exploded perspective view of a cellular phone terminal schematically showing a structure of a substrate unit according to an example of the present invention. FIG. 4 is a partial enlarged cross-sectional view taken along line 4-4 of FIG. 2 and schematically shows the structure of the substrate unit according to the first embodiment of the present invention. It is a partial expanded sectional view which shows a mode that a shield cover is positioned by the upper stage position with respect to a flame | frame. It is a disassembled perspective view which shows the structure of a shield cover and a frame roughly. It is a partial expanded sectional view which shows a mode that a solder paste is apply | coated on a printed circuit board roughly. It is a partial expanded sectional view which shows a mode that a shield cover and a flame | frame are hold | maintained with a suction nozzle. It is a partial expanded sectional view which shows a mode that a flame | frame is mounted on a printed circuit board roughly. It is a partial expanded sectional view which shows a mode that a shield cover is positioned in a lower stage position with respect to a flame | frame. It is a partial expanded sectional view which shows roughly the structure of the board | substrate unit which concerns on 2nd Embodiment of this invention. It is a partial expanded sectional view which shows a mode that a flame | frame is arrange | positioned on a printed circuit board roughly. It is a partial expanded sectional view which shows roughly a mode that the back surface of a printed circuit board is immersed in the molten solder of a solder tank. It is a partial expanded sectional view which shows roughly the structure of the board | substrate unit which concerns on the modification of 2nd Embodiment of this invention. It is a partial expanded sectional view which shows roughly the structure of the board | substrate unit which concerns on the other modification in 2nd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 Electronic device (mobile phone terminal), 14 Case (main body case), 21 / 21a Substrate unit (printed circuit board unit), 22 Substrate (printed circuit board), 23 Electronic component, 24 Shield cover, 25 frame, 28 Solder material , 31 projection, 32 second receiving hole (through hole), 33 first receiving hole (dent), 52 through hole, 55 pin, 56 projection.

Claims (5)

A substrate,
A frame mounted on the surface of the substrate;
A solder material for joining the lower end of the frame to the surface of the substrate;
A protrusion formed on the frame;
A conductive shield cover that is mounted on the frame and covers an electronic component disposed in a space inside the frame;
A first receiving hole formed on the shield cover for receiving the projection of the frame and positioning the shield cover at a predetermined lower position;
A board unit comprising: a second receiving hole formed on the shield cover for receiving the projection of the frame and positioning the shield cover at an upper position farther from the lower end of the shield cover than the lower position. .   A housing, a substrate incorporated in the housing, a frame fixed to the surface of the substrate, a protrusion formed on the frame, and a frame that is attached to the frame and disposed in the space inside the frame A conductive shield cover for covering the electronic component; a first receiving hole formed on the shield cover for receiving the projection of the frame; and positioning the shield cover at a predetermined lower position; and the shield cover formed on the shield cover An electronic apparatus comprising: a second receiving hole configured to receive a projection of a frame and position the shield cover at an upper position farther from the lower end of the shield cover than the lower position. A substrate defining a through-hole penetrating from the front surface to the back surface;
A pin that is received in the through hole of the substrate, and a frame that is mounted on the surface of the substrate;
A solder material that fills the through hole of the substrate and joins the pin to the substrate;
A conductive shield cover that is mounted on the frame so as to be vertically movable between a predetermined lower position and an upper position that is farther from the substrate than the lower position, and covers an electronic component that is disposed inside the frame; A board unit comprising:   4. The substrate unit according to claim 3, further comprising a protrusion formed on the pin and received on the surface of the substrate.   A housing, a substrate incorporated in the housing and defining a through-hole penetrating from the front surface to the back surface, a pin that is received in the through-hole of the substrate, and a frame mounted on the surface of the substrate; A solder material that fills the through hole of the board and joins the pin to the board, and a predetermined lower stage position and an upper stage position that is farther from the board than the lower stage position can move up and down on the frame. An electronic apparatus comprising: a conductive shield cover that is mounted and covers an electronic component disposed inside the frame.

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