JP2009229296A - Magnetic sensor package - Google Patents

Magnetic sensor package Download PDF

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Publication number
JP2009229296A
JP2009229296A JP2008076172A JP2008076172A JP2009229296A JP 2009229296 A JP2009229296 A JP 2009229296A JP 2008076172 A JP2008076172 A JP 2008076172A JP 2008076172 A JP2008076172 A JP 2008076172A JP 2009229296 A JP2009229296 A JP 2009229296A
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magnetic sensor
axis magnetic
axis
substrate
package
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JP5154275B2 (en
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Toshiaki Konno
敏明 紺野
Masashi Fuse
雅志 布施
Nobuaki Haga
宣明 芳賀
Naoki Kitaura
尚樹 北浦
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnetic sensor package for enabling size reduction. <P>SOLUTION: An IC 2 as a semiconductor element is mounted on the main surface of a substrate 1. An X-axis magnetic sensor 3a and a Y-axis magnetic sensor 3b are mounted on the main surface of the IC 2. A Z-axis magnetic sensor 3c is mounted on the main surface of the substrate 1. The X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are directly electrically connected to the IC 2, and the Z-axis magnetic sensor 3c is electrically connected to the IC 2 via wiring 1b. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、電子コンパスなどに使用する磁気センサパッケージに関する。   The present invention relates to a magnetic sensor package used for an electronic compass or the like.

地磁気を検出する磁気センサを備えてなる電子コンパスは、例えば、Ｘ軸用磁気センサ、Ｙ軸用磁気センサ及びＺ軸用磁気センサで地磁気を検出する。このような電子コンパスは、基材上にＩＣと、磁気センサとを実装し、例えばワイヤボンディングなどで電気的に接続した後にパッケージングして構成されている（特許文献１）。   An electronic compass including a magnetic sensor for detecting geomagnetism detects geomagnetism using, for example, an X-axis magnetic sensor, a Y-axis magnetic sensor, and a Z-axis magnetic sensor. Such an electronic compass is configured by mounting an IC and a magnetic sensor on a base material, and electrically packaging them, for example, by wire bonding or the like (Patent Document 1).

このようなパッケージは、例えば、図５に示すように、基材１１の主面上にＩＣ１２が実装されており、その同じ主面上にＸ軸用磁気センサ１３ａ、Ｙ軸用磁気センサ１３ｂ及びＺ軸用磁気センサ１３ｃが実装されている。それぞれのＸ軸用磁気センサ１３ａ、Ｙ軸用磁気センサ１３ｂ及びＺ軸用磁気センサ１３ｃは、ＩＣ１２に対してワイヤ１４により電気的に接続されている。また、この基材１１は、パッケージ材１５によりパッケージングされている。
特開２００５−２７７３６４号公報 In such a package, for example, as shown in FIG. 5, an IC 12 is mounted on the main surface of the substrate 11, and the X-axis magnetic sensor 13a, the Y-axis magnetic sensor 13b, and the like are mounted on the same main surface. A Z-axis magnetic sensor 13c is mounted. Each of the X-axis magnetic sensor 13 a, the Y-axis magnetic sensor 13 b, and the Z-axis magnetic sensor 13 c is electrically connected to the IC 12 by a wire 14. The base material 11 is packaged by a package material 15.
JP 2005-277364 A

しかしながら、図５に示す磁気センサパッケージにおいては、基材１１上に、ＩＣ１２並びにＸ軸用磁気センサ１３ａ、Ｙ軸用磁気センサ１３ｂ及びＺ軸用磁気センサ１３ｃを実装しているので、４チップ分の実装領域を確保する必要があり、全体としてデバイスが大きくなってしまう。近年、パッケージの小型化が顕著に進展しており、さらなるパッケージの小型化が必要であるが、図５に示す構成では、この小型化の要請に対応することができない。   However, in the magnetic sensor package shown in FIG. 5, the IC 12, the X-axis magnetic sensor 13a, the Y-axis magnetic sensor 13b, and the Z-axis magnetic sensor 13c are mounted on the base material 11, and therefore, for four chips. As a whole, the device becomes large. In recent years, downsizing of the package has been remarkably progressed and further downsizing of the package is necessary. However, the configuration shown in FIG. 5 cannot meet the demand for downsizing.

本発明はかかる点に鑑みてなされたものであり、より小型化を図ることができる磁気センサパッケージを提供することを目的とする。   This invention is made | formed in view of this point, and it aims at providing the magnetic sensor package which can achieve size reduction more.

本発明の磁気センサパッケージは、半導体素子が実装された基板と、前記半導体素子上に実装されたＸ軸用磁気センサ及びＹ軸用磁気センサと、前記基板上に実装されたＺ軸用磁気センサと、を具備することを特徴とする。   A magnetic sensor package of the present invention includes a substrate on which a semiconductor element is mounted, an X-axis magnetic sensor and a Y-axis magnetic sensor mounted on the semiconductor element, and a Z-axis magnetic sensor mounted on the substrate. It is characterized by comprising.

この構成によれば、基材上にＸ軸用磁気センサ及びＹ軸用磁気センサのための実装領域を設ける必要がないので、磁気センサパッケージの小型化を図ることができる。   According to this configuration, since it is not necessary to provide a mounting area for the X-axis magnetic sensor and the Y-axis magnetic sensor on the base material, the size of the magnetic sensor package can be reduced.

本発明の磁気センサパッケージにおいては、前記Ｚ軸用磁気センサが、絶縁基材と、前記基材の一面に形成された磁気素子とを有し、前記磁気素子が前記一面と平行な感度軸を有することが好ましい。この場合において、前記磁気素子が巨大磁気抵抗効果素子であり、前記Ｚ軸用磁気センサが、前記磁気素子の前記感度軸の向きを前記基板面と直交するように実装されたことが好ましい。   In the magnetic sensor package of the present invention, the Z-axis magnetic sensor has an insulating base and a magnetic element formed on one surface of the base, and the magnetic element has a sensitivity axis parallel to the one surface. It is preferable to have. In this case, it is preferable that the magnetic element is a giant magnetoresistive element, and the Z-axis magnetic sensor is mounted so that the direction of the sensitivity axis of the magnetic element is orthogonal to the substrate surface.

本発明の磁気センサパッケージにおいては、前記Ｚ軸用磁気センサは、前記基板に対してバンプを用いて電気的に接続されていることが好ましい。   In the magnetic sensor package of the present invention, it is preferable that the Z-axis magnetic sensor is electrically connected to the substrate using bumps.

本発明の磁気センサパッケージにおいては、前記Ｚ軸用磁気センサは、前記半導体素子に対してバンプを用いて電気的に接続されていることが好ましい。この構成によれば、磁気センサパッケージのさらなる小型化を図ることが可能となる。   In the magnetic sensor package of the present invention, it is preferable that the Z-axis magnetic sensor is electrically connected to the semiconductor element using bumps. According to this configuration, it is possible to further reduce the size of the magnetic sensor package.

本発明の磁気センサパッケージは、半導体素子が実装された基板と、前記半導体素子上に実装されたＸ軸用磁気センサ及びＹ軸用磁気センサと、前記基板上に実装されたＺ軸用磁気センサと、を具備するので、より小型化を図ることができるものである。   A magnetic sensor package of the present invention includes a substrate on which a semiconductor element is mounted, an X-axis magnetic sensor and a Y-axis magnetic sensor mounted on the semiconductor element, and a Z-axis magnetic sensor mounted on the substrate. Therefore, further downsizing can be achieved.

本発明者らは、Ｘ軸用磁気センサ、Ｙ軸用磁気センサ、Ｚ軸用磁気センサのうち、特性上、基材上に実装すべき磁気センサがＺ軸用磁気センサであることに着目し、このＺ軸用磁気センサのみは基材上に実装し、その他の磁気センサを半導体素子上に実装することによりパッケージ全体の小型化ができることを見出し本発明をするに至った。   The present inventors pay attention to the fact that, among the X-axis magnetic sensor, the Y-axis magnetic sensor, and the Z-axis magnetic sensor, the magnetic sensor to be mounted on the substrate is the Z-axis magnetic sensor due to its characteristics. Only the Z-axis magnetic sensor is mounted on a base material, and the other package is mounted on a semiconductor element, and it has been found that the entire package can be reduced in size.

すなわち、本発明の骨子は、半導体素子が実装された基板と、前記半導体素子上に実装されたＸ軸用磁気センサ及びＹ軸用磁気センサと、前記基板上に実装されたＺ軸用磁気センサと、を具備することにより、磁気センサパッケージのさらなる小型化を図ることである。   That is, the gist of the present invention is a substrate on which a semiconductor element is mounted, an X-axis magnetic sensor and a Y-axis magnetic sensor mounted on the semiconductor element, and a Z-axis magnetic sensor mounted on the substrate. And further miniaturizing the magnetic sensor package.

以下、本発明の実施の形態について添付図面を参照して詳細に説明する。
（実施の形態１）
図１は、本発明の実施の形態１に係る磁気センサパッケージを説明するための図である。図１に示す磁気センサパッケージは、基材１を備えている。基材１の主面上には、半導体素子であるＩＣ２が実装されている。すなわち、基材１の主面上には、実装部（図示せず）が形成されており、この実装部上にＩＣ２が接着剤などでダイボンドされる。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
(Embodiment 1)
FIG. 1 is a diagram for explaining a magnetic sensor package according to Embodiment 1 of the present invention. The magnetic sensor package shown in FIG. An IC 2 that is a semiconductor element is mounted on the main surface of the substrate 1. That is, a mounting portion (not shown) is formed on the main surface of the substrate 1, and the IC 2 is die-bonded with an adhesive or the like on the mounting portion.

また、このＩＣ２の主面上には、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂが実装されている。すなわち、ＩＣ２の主面上には、電極パッド２ａ及び実装部（図示せず）が形成されており、この実装部上にＸ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂが接着剤などでダイボンドされ、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂに設けられた電極パッド３ｄと、電極パッド２ａとがワイヤ４でワイヤボンディングされている。Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂは、それぞれ絶縁基板上に形成された薄膜巨大磁気抵抗効果素子によって、素子形成面に平行な感度軸を有している。すなわち、素子形成面をＩＣ２の主面と略平行になるように実装されている。   An X-axis magnetic sensor 3a and a Y-axis magnetic sensor 3b are mounted on the main surface of the IC2. That is, an electrode pad 2a and a mounting portion (not shown) are formed on the main surface of the IC 2, and the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are formed on the mounting portion with an adhesive or the like. The electrode pads 3 d and the electrode pads 2 a that are die-bonded and provided on the X-axis magnetic sensor 3 a and the Y-axis magnetic sensor 3 b are wire-bonded with wires 4. Each of the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b has a sensitivity axis parallel to the element formation surface by a thin film giant magnetoresistive effect element formed on an insulating substrate. That is, the element formation surface is mounted so as to be substantially parallel to the main surface of the IC 2.

また、基材１の主面上には、Ｚ軸用磁気センサ３ｃが実装されている。すなわち、基材１の主面上には、配線１ｂ及び実装部（図示せず）が形成されており、この実装部上にＺ軸用磁気センサ３ｃが接着剤などでダイボンドされ、図２に示すように、Ｚ軸用磁気センサ３ｃの側面下方に設けられた電極パッド３ｅと、配線１ｂとがバンプ５により電気的に接続されている（コーナーバンプボンディング）。また、配線１ｂと、ＩＣ２の電極パッド２ａとがワイヤ４によりワイヤボンディングされている。さらに、基材１の主面上に形成された電極パッド１ａと、ＩＣ２の電極パッドとがワイヤ４によりワイヤボンディングされている。   A Z-axis magnetic sensor 3 c is mounted on the main surface of the substrate 1. That is, the wiring 1b and the mounting part (not shown) are formed on the main surface of the substrate 1, and the Z-axis magnetic sensor 3c is die-bonded with an adhesive or the like on the mounting part. As shown, an electrode pad 3e provided below the side surface of the Z-axis magnetic sensor 3c and the wiring 1b are electrically connected by a bump 5 (corner bump bonding). Further, the wiring 1 b and the electrode pad 2 a of the IC 2 are wire bonded by the wire 4. Further, the electrode pad 1 a formed on the main surface of the substrate 1 and the electrode pad of the IC 2 are wire-bonded by a wire 4.

Ｚ軸用磁気センサ３ｃは、絶縁基板上に形成された薄膜巨大磁気抵抗効果素子によって、素子形成面に平行な感度軸を有している。すなわち、素子形成面が基材１の主面と略直交し、感度軸が基材１の主面と略直交するように実装されている。また、Ｚ軸用磁気センサ３ｃの素子形成面は、基材１と垂直な方向に短辺を有する略長方形形状とするとパッケージ全体の厚みを薄く形成することが可能となるため望ましい。   The Z-axis magnetic sensor 3c has a sensitivity axis parallel to the element formation surface by a thin film giant magnetoresistive effect element formed on an insulating substrate. That is, the element formation surface is mounted so as to be substantially orthogonal to the main surface of the substrate 1 and the sensitivity axis is approximately orthogonal to the main surface of the substrate 1. Further, it is desirable that the element forming surface of the Z-axis magnetic sensor 3c has a substantially rectangular shape having a short side in a direction perpendicular to the substrate 1, because the entire package can be formed thin.

したがって、図１に示す構成においては、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂは、それぞれＩＣ２とワイヤ４により直接電気的に接続されており、Ｚ軸用磁気センサ３ｃは、配線１ｂを介してワイヤ４によりＩＣ２と電気的に接続されている。また、基材１のセンサ実装側の主面は、図示しないパッケージ材によりパッケージングされている。一方、基材１のセンサ実装側と反対側の主面には、電極パッドや配線（いずれも図示せず）が形成されており、これにより、この磁気センサパッケージは、他のデバイスやプリント配線板に実装されたときに、この電極パッドを介して電気的接続を図るようになっている。   Therefore, in the configuration shown in FIG. 1, the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are directly electrically connected to the IC 2 and the wire 4, respectively, and the Z-axis magnetic sensor 3c is connected to the wiring 1b. And is electrically connected to the IC 2 by the wire 4. The main surface of the substrate 1 on the sensor mounting side is packaged with a package material (not shown). On the other hand, electrode pads and wiring (both not shown) are formed on the main surface of the substrate 1 opposite to the sensor mounting side, so that this magnetic sensor package can be used for other devices and printed wiring. When mounted on a plate, electrical connection is made through this electrode pad.

図１に示す構成においては、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂは、ＩＣ２上に実装していても、ＩＣ２の厚さ方向の平行度の影響は受けにくいので正確にＸ軸方向及びＹ軸方向の磁気検出を行うことができる。これに対して、Ｚ軸用磁気センサについては、基材１の主面に対して垂直方向の地磁気を検出するため、基材１の主面に対して垂直方向に配置するように基材１上に直接実装している。このため、Ｚ軸方向の磁気検出に関して、基材１上にＩＣ２を実装する際の実装傾きなどの影響がない。このように、３軸方向の磁気検出を正確に行うことができる。   In the configuration shown in FIG. 1, even if the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are mounted on the IC 2, the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are not easily affected by the parallelism in the thickness direction of the IC 2. And magnetic detection in the Y-axis direction can be performed. On the other hand, the Z-axis magnetic sensor detects the geomagnetism in the direction perpendicular to the main surface of the base material 1 so that the base material 1 is arranged in the direction perpendicular to the main surface of the base material 1. Implemented directly above. For this reason, the magnetic detection in the Z-axis direction is not affected by the mounting inclination when the IC 2 is mounted on the substrate 1. Thus, the magnetic detection in the triaxial direction can be performed accurately.

さらに、図１に示す構成においては、基材１に、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂのための実装領域を設ける必要がないので、磁気センサパッケージの小型化を図ることができる。さらに、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂの厚みを、Ｚ軸用磁気センサ３ｃの厚みよりも薄く形成しても良い。この構成を取ることにより、パッケージ全体の厚みを薄く形成することが可能となり、またＺ用磁気センサ３ｃと基材１の接合面積も十分に確保できるため、実装する際の傾きの影響を小さくできる。   Further, in the configuration shown in FIG. 1, since it is not necessary to provide mounting regions for the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b on the base material 1, the size of the magnetic sensor package can be reduced. it can. Furthermore, the thickness of the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b may be formed thinner than the thickness of the Z-axis magnetic sensor 3c. By adopting this configuration, it becomes possible to reduce the thickness of the entire package, and since the bonding area between the magnetic sensor 3c for Z and the base material 1 can be sufficiently secured, the influence of the inclination during mounting can be reduced. .

（実施の形態２）
図３は、本発明の実施の形態２に係る磁気センサパッケージを説明するための図である。図３に示す磁気センサパッケージは、基材１を備えている。基材１の主面上には、半導体素子であるＩＣ２が実装されている。すなわち、基材１の主面上には、実装部（図示せず）が形成されており、この実装部上にＩＣ２が接着剤などでダイボンドされる。 (Embodiment 2)
FIG. 3 is a diagram for explaining the magnetic sensor package according to the second embodiment of the present invention. The magnetic sensor package shown in FIG. An IC 2 that is a semiconductor element is mounted on the main surface of the substrate 1. That is, a mounting portion (not shown) is formed on the main surface of the substrate 1, and the IC 2 is die-bonded with an adhesive or the like on the mounting portion.

また、このＩＣ２の主面上には、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂが実装されている。すなわち、ＩＣ２の主面上には、電極パッド２ａ及び実装部（図示せず）が形成されており、この実装部上にＸ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂが接着剤などでダイボンドされ、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂに設けられた電極パッド３ｄと、電極パッド２ａとがワイヤ４でワイヤボンディングされている。   An X-axis magnetic sensor 3a and a Y-axis magnetic sensor 3b are mounted on the main surface of the IC2. That is, an electrode pad 2a and a mounting portion (not shown) are formed on the main surface of the IC 2, and the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are formed on the mounting portion with an adhesive or the like. The electrode pads 3 d and the electrode pads 2 a that are die-bonded and provided on the X-axis magnetic sensor 3 a and the Y-axis magnetic sensor 3 b are wire-bonded with wires 4.

また、基材１の主面上には、Ｚ軸用磁気センサ３ｃが実装されている。すなわち、基材１の主面上には、実装部（図示せず）が形成されており、この実装部上にＺ軸用磁気センサ３ｃが接着剤などでダイボンドされ、図４に示すように、Ｚ軸用磁気センサ３ｃの側面上方に設けられた電極パッド３ｅと、ＩＣ２の電極パッド２ａとがバンプ５により直接電気的に接続されている（コーナーバンプボンディング）。   A Z-axis magnetic sensor 3 c is mounted on the main surface of the substrate 1. That is, a mounting portion (not shown) is formed on the main surface of the substrate 1, and the Z-axis magnetic sensor 3c is die-bonded with an adhesive or the like on the mounting portion, as shown in FIG. The electrode pad 3e provided above the side surface of the Z-axis magnetic sensor 3c and the electrode pad 2a of the IC 2 are directly electrically connected by the bump 5 (corner bump bonding).

したがって、図３に示す構成においては、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂは、それぞれＩＣ２とワイヤ４により直接電気的に接続されており、Ｚ軸用磁気センサ３ｃは、バンプ５によりＩＣ２と直接電気的に接続されている。また、基材１のセンサ実装側の主面は、図示しないパッケージ材によりパッケージングされている。一方、基材１のセンサ実装側と反対側の主面には、電極パッドや配線（いずれも図示せず）が形成されており、これにより、この磁気センサパッケージは、他のデバイスやプリント配線板に実装されたときに、この電極パッドを介して電気的接続を図るようになっている。   Therefore, in the configuration shown in FIG. 3, the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are directly electrically connected to the IC 2 and the wire 4, respectively, and the Z-axis magnetic sensor 3c is connected to the bump 5 Thus, it is electrically connected to the IC 2 directly. The main surface of the substrate 1 on the sensor mounting side is packaged with a package material (not shown). On the other hand, electrode pads and wiring (both not shown) are formed on the main surface of the substrate 1 opposite to the sensor mounting side, so that this magnetic sensor package can be used for other devices and printed wiring. When mounted on a plate, electrical connection is made through this electrode pad.

図３に示す構成においては、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂは、ＩＣ２上に実装していても、ＩＣ２の厚さ方向の平行度の影響は受けにくいので正確にＸ軸方向及びＹ軸方向の磁気検出を行うことができる。これに対して、Ｚ軸用磁気センサについては、基材１の主面に対して垂直方向の地磁気を検出するため、基材１の主面に対して垂直方向に配置するように基材１上に直接実装している。このため、Ｚ軸方向の磁気検出に関して、基材１上にＩＣ２を実装する際の実装傾きなどの影響がない。この場合において、Ｚ軸用磁気センサ３ｃは、その側面の上部でＩＣ２と電気的に接続されている。このため、Ｚ軸用磁気センサ３ｃとＩＣ２との間の接続部は、Ｚ軸用磁気センサ３ｃが基材１上に実装される際に用いられる接着剤のはみ出しなどの影響を受けることがない。このため、該接続部の信頼性が高い。このように、３軸方向の磁気検出を正確に行うことができる。さらに、Ｚ軸用磁気センサ３ｃとＩＣ２との間の接続部がコーナーバンプボンディングにより簡単な構成としているので、ボンディングの順序に関して自由度が大きくなり、より製造プロセスを簡略化することが可能となる。   In the configuration shown in FIG. 3, even if the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are mounted on the IC 2, the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are not easily affected by the parallelism in the thickness direction of the IC 2. And magnetic detection in the Y-axis direction can be performed. On the other hand, the Z-axis magnetic sensor detects the geomagnetism in the direction perpendicular to the main surface of the base material 1 so that the base material 1 is arranged in the direction perpendicular to the main surface of the base material 1. Implemented directly above. For this reason, the magnetic detection in the Z-axis direction is not affected by the mounting inclination when the IC 2 is mounted on the substrate 1. In this case, the Z-axis magnetic sensor 3c is electrically connected to the IC 2 at the upper part of the side surface. For this reason, the connection part between the Z-axis magnetic sensor 3c and the IC 2 is not affected by the sticking out of the adhesive used when the Z-axis magnetic sensor 3c is mounted on the substrate 1. . For this reason, the reliability of the connecting portion is high. Thus, the magnetic detection in the triaxial direction can be performed accurately. Furthermore, since the connecting portion between the Z-axis magnetic sensor 3c and the IC 2 has a simple configuration by corner bump bonding, the degree of freedom with respect to the bonding order is increased, and the manufacturing process can be further simplified. .

また、図３に示す構成においては、基材１に、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂのための実装領域を設ける必要がなく、しかもＺ軸用磁気センサ３ｃがＩＣ２と直接電気的に接続されているので、図１に示す配線１ｂの領域も不要となり、磁気センサパッケージのさらなる小型化を図ることができる。さらに、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂの厚みを、Ｚ軸用磁気センサ３ｃの厚みよりも薄く形成しても良い。この構成を取ることにより、パッケージ全体の厚みを薄く形成することが可能となり、またＺ用磁気センサ３ｃと基材１の接合面積も十分に確保できるため、実装する際の傾きの影響を小さくできる。   Further, in the configuration shown in FIG. 3, it is not necessary to provide a mounting area for the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b on the substrate 1, and the Z-axis magnetic sensor 3c is directly connected to the IC 2. Since it is electrically connected, the area of the wiring 1b shown in FIG. 1 is not required, and the magnetic sensor package can be further reduced in size. Furthermore, the thickness of the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b may be formed thinner than the thickness of the Z-axis magnetic sensor 3c. By adopting this configuration, it becomes possible to reduce the thickness of the entire package, and since the bonding area between the magnetic sensor 3c for Z and the base material 1 can be sufficiently secured, the influence of the inclination during mounting can be reduced. .

本発明は上記実施の形態１，２に限定されず、種々変更して実施することが可能である。例えば、Ｘ軸用磁気センサ３ａ及びＹ軸用磁気センサ３ｂは、ＩＣ２上に直接形成された薄膜磁気センサ素子であってもよい。この構成によりさらにパッケージの薄型化を図ることが可能となる。また、本発明の範囲を逸脱しない限りにおいて、部材の数、配置、材質などについては適宜変更して実施することが可能である。その他、本発明の範囲を逸脱しないで適宜変更して実施することが可能である。   The present invention is not limited to Embodiments 1 and 2 above, and can be implemented with various modifications. For example, the X-axis magnetic sensor 3 a and the Y-axis magnetic sensor 3 b may be thin film magnetic sensor elements formed directly on the IC 2. With this configuration, the package can be further reduced in thickness. Further, the number, arrangement, material, and the like of the members can be changed as appropriate without departing from the scope of the present invention. Other modifications can be made without departing from the scope of the present invention.

本発明の実施の形態１に係る磁気センサパッケージを説明するための図である。It is a figure for demonstrating the magnetic sensor package which concerns on Embodiment 1 of this invention. 図１に示す磁気センサパッケージを矢印方向から見た図である。It is the figure which looked at the magnetic sensor package shown in FIG. 1 from the arrow direction. 本発明の実施の形態２に係る磁気センサパッケージの他の例を説明するための図である。It is a figure for demonstrating the other example of the magnetic sensor package which concerns on Embodiment 2 of this invention. 図３に示す磁気センサパッケージを矢印方向から見た図である。It is the figure which looked at the magnetic sensor package shown in FIG. 3 from the arrow direction. 従来の磁気センサパッケージを説明するための図である。It is a figure for demonstrating the conventional magnetic sensor package.

符号の説明Explanation of symbols

１ 基材
１ａ，２ａ，３ｄ，３ｅ 電極パッド
１ｂ 配線
２ ＩＣ
３ａ，３ｂ，３ｃ 磁気センサ
４ ワイヤ
５ バンプ 1 Substrate 1a, 2a, 3d, 3e Electrode pad 1b Wiring 2 IC
3a, 3b, 3c Magnetic sensor 4 Wire 5 Bump

Claims (5)

半導体素子が実装された基板と、前記半導体素子上に実装されたＸ軸用磁気センサ及びＹ軸用磁気センサと、前記基板上に実装されたＺ軸用磁気センサと、を具備することを特徴とする磁気センサパッケージ。   A substrate on which a semiconductor element is mounted, an X-axis magnetic sensor and a Y-axis magnetic sensor mounted on the semiconductor element, and a Z-axis magnetic sensor mounted on the substrate. Magnetic sensor package. 前記Ｚ軸用磁気センサが、絶縁基材と、前記基材の一面に形成された磁気素子とを有し、前記磁気素子が前記一面と平行な感度軸を有することを特徴とする請求項１記載の磁気センサパッケージ。   2. The Z-axis magnetic sensor has an insulating base and a magnetic element formed on one surface of the base, and the magnetic element has a sensitivity axis parallel to the one surface. The described magnetic sensor package. 前記磁気素子が巨大磁気抵抗効果素子であり、前記Ｚ軸用磁気センサが、前記磁気素子の前記感度軸の向きを前記基板面と直交するように実装されたことを特徴とする請求項２記載の磁気センサパッケージ。   The magnetic element is a giant magnetoresistive element, and the Z-axis magnetic sensor is mounted so that the direction of the sensitivity axis of the magnetic element is orthogonal to the substrate surface. Magnetic sensor package. 前記Ｚ軸用磁気センサは、前記基板に対してバンプを用いて電気的に接続されていることを特徴とする請求項１から請求項３のいずれかに記載の磁気センサパッケージ。   The magnetic sensor package according to claim 1, wherein the Z-axis magnetic sensor is electrically connected to the substrate using bumps. 前記Ｚ軸用磁気センサは、前記半導体素子に対してバンプを用いて電気的に接続されていることを特徴とする請求項１から請求項３のいずれかに記載の磁気センサパッケージ。   4. The magnetic sensor package according to claim 1, wherein the Z-axis magnetic sensor is electrically connected to the semiconductor element using a bump. 5.
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