JP2009224732A - Manufacturing method of multiple patterning circuit board, and intermediate product of multiple patterning circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multiple patterning circuit board which can uniformly vacuum-suck a mask for solder ball alignment and can improve the yield of ball loading. <P>SOLUTION: The multiple patterning circuit board 100 is a board provided with a product region wherein a plurality of parts to be the product of a circuit board 10 are arrayed in a matrix along a plane direction and not provided with a waste selvage region around the product region. The multiple patterning circuit board 100 includes a buildup layer having a structure for which a resin insulating layer and a conductor layer are laminated and also having a plurality of terminal pads to which an IC chip can be connected. The multiple patterning circuit board 100 is provided with a plurality of through-holes 105 for vacuum-sucking the mask for solder ball alignment in the state of being dispersed to be a uniform density. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  According to the present invention, a solder ball is mounted on a plurality of external terminals in a multi-piece wiring board in which a plurality of wiring boards having a plurality of external terminals to which a semiconductor element can be connected are arranged vertically and horizontally along a plane direction. The present invention relates to a method of manufacturing a multi-cavity wiring board and an intermediate product of the multi-cavity wiring board.

  In recent years, semiconductor integrated circuit elements (IC chips) used as computer microprocessors and the like have become increasingly faster and more functional, with an accompanying increase in the number of terminals and a tendency to narrow the pitch between terminals. . In general, a large number of terminals are densely arranged on the bottom surface of an IC chip, and such a terminal group is connected to a terminal group on the motherboard side in the form of a flip chip. However, it is difficult to connect the IC chip directly on the mother board because there is a large difference in the pitch between the terminals on the IC chip side terminal group and the mother board side terminal group. For this reason, a method is generally employed in which a package is prepared by mounting an IC chip on an IC chip mounting wiring board, and the package is mounted on a motherboard.

  In an IC chip mounting wiring board that constitutes this type of package, build-up layers in which resin interlayer insulating layers and conductor layers are alternately laminated are formed on the front and back surfaces of a core substrate. Terminal pads for connecting the IC chip are formed in an array on one buildup layer of the wiring board, and terminal pads for connecting to the motherboard are formed in an array on the other buildup layer. .

  At the intermediate product stage, the IC chip mounting wiring board is manufactured in a large format (multiple wiring board) in which multiple products are integrated vertically and horizontally, and a conductive layer is formed to form a build-up layer. Processes and various plating processes are performed collectively for all intermediate products. As shown in FIG. 9, the multi-cavity wiring board 200 includes a product area 210 in which a plurality of parts to be products of the wiring board are arranged vertically and horizontally, and a waste ear area 211 provided around the product area 210. (Areas that do not become products). By dividing the multi-piece wiring board 200 and simultaneously obtaining a plurality of pieces of the wiring board, the wiring board is efficiently manufactured.

  In general, the IC chip mounting wiring board is shipped with solder bumps provided on the terminal pads on the flip chip connection surface. More specifically, after a buildup layer is formed in the state of a multi-piece wiring board, a ball mounting process is performed on the wiring board. In this ball mounting process, by using a solder ball mounting device, a solder ball alignment mask is arranged on the upper surface of the multi-piece wiring substrate, and the solder balls are stored in the respective through holes provided in the alignment mask. A solder ball is mounted on each terminal pad. Thereafter, the solder balls are heated to a predetermined temperature and reflowed to form solder bumps on the terminal pads.

Incidentally, Patent Document 1 discloses a solder ball mounting apparatus for mounting a solder ball on an electrode of a BGA (Ball Grid Array) type chip.
JP 2001-358450 A

  By the way, as shown in FIG. 9, through-holes 215 (positioning holes for exposure, guide holes for fixing the substrate, etc.) used in the build-up layer forming process etc. ) Is formed. In the solder ball mounting apparatus, the solder ball alignment mask is vacuum-sucked through the through-holes 215 provided in the throwing-off region 211 of the multi-piece wiring board 200, so that the solder ball alignment mask is placed on the upper surface of the wiring board 200. Fixed. It should be noted that in addition to the through hole 215 for forming the build-up layer, there may be a case where a through hole dedicated for vacuum suction is provided in the discard ear region 211 of the multi-cavity wiring board 200.

  However, in the multi-cavity wiring board 200, the product area 210 where the build-up layer is formed and the surrounding edge area 211 around the product area 210 are different in thickness and have a level difference. Moreover, since each through-hole 215 formed in the disposal ear region 211 is a through-hole used for different applications, the sizes thereof are not uniform, and the positions to be formed are different and formed at equal intervals. Absent. For this reason, the entire solder ball alignment mask cannot be vacuum-sucked evenly. Further, since the through hole for vacuum suction is not formed in the product region 210, the solder ball alignment mask partially floats. As a result, the solder ball cannot be properly mounted on each terminal pad, and the yield of mounting the ball is deteriorated.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to uniformly vacuum-suck a solder ball alignment mask disposed on a substrate and to improve the yield of ball mounting. It is an object of the present invention to provide a manufacturing method of a multi-cavity wiring board and an intermediate product of the multi-cavity wiring board.

  As means (means 1) for solving the above-mentioned problem, a product area and a throw-away area provided around the product area are provided, and the wiring board is vertically and horizontally along the plane direction in the product area. In a method for manufacturing a plurality of multi-cavity wiring boards arranged in plural, the semiconductor device has a structure in which an interlayer insulating layer and a conductor layer are laminated using a positioning hole provided in the abandoned lug region, and a semiconductor element can be connected A wiring laminated portion forming step for forming a wiring laminated portion having a plurality of external terminals in the product region, and a through hole arrangement in which a plurality of through holes are dispersed so as to have a uniform density in the product region After the step, the cutting and removing step of cutting and removing the abandoned ear region to make only the product region, the wiring stacking portion forming step, the through hole arranging step and the cutting and removing step, the multi-cavity wiring board The In this state, the solder ball alignment mask having a plurality of through-holes at positions corresponding to the plurality of external terminals is vacuum-sucked through the plurality of through-holes. There is a method for manufacturing a multi-piece wiring board, comprising: a ball mounting step of fixing the mask on a single-piece wiring board and mounting solder balls on the plurality of external terminals.

  Therefore, according to the manufacturing method of the multi-cavity wiring board of the means 1, in the wiring laminated portion forming step, after the wiring laminated portion is formed in the product area of the multi-cavity wiring substrate, the product A plurality of through-holes are provided in a dispersed state so as to have a uniform density in the region. Thereafter, in the cutting / removing step, the discarded lug area provided around the product area is cut and removed, so that the wiring board of only the product area is obtained. This wiring board does not have a step due to the thickness between the product area and the lapping area unlike the conventional wiring board, and has a substantially uniform thickness. In the ball mounting process, a multi-piece wiring board of only the product area is set in the solder ball mounting device, and the solder ball alignment mask is vacuum-sucked through a plurality of through holes provided to have a uniform density. Is done. In this way, the entire solder ball alignment mask can be uniformly vacuum-sucked and securely fixed, and the problem that the alignment mask partially floats can be avoided. As a result, the solder balls can be reliably aligned and mounted on the plurality of external terminals, and the yield of ball mounting can be improved. In addition, since the wiring board only for the product area is set in the ball mounting apparatus, the board size is reduced as compared with a conventional wiring board having a throw-away area, and the solder ball mounting apparatus can be downsized.

  The plurality of through holes are preferably provided on a planned cutting line when the product region is cut into a plurality of wiring boards. The cutting lines of the multi-cavity wiring board are set at equal intervals at positions where the conductor layer of the wiring laminated portion is not formed in the product region. For this reason, by forming the through holes on the planned cutting line, it is possible to disperse the plurality of through holes so as to obtain a uniform density without impairing the function of the wiring board.

  It is preferable that the plurality of through holes are also provided on the outline of the product region. In this way, when the product area is divided into individual wiring boards, all the wiring boards can have the same shape.

  The plurality of through holes may be provided on points where the planned cutting lines intersect when the product region is cut into a plurality of wiring boards. Thus, by forming the through holes at the intersections between the planned cutting lines, it is possible to disperse the plurality of through holes so as to obtain a uniform density without impairing the function of the wiring board.

  The plurality of through-holes preferably have a smaller diameter than the positioning holes in the abandoned ear region. By reducing the diameter of the through holes in this way, it is possible to disperse and provide more through holes in the product region, and the solder ball alignment mask can be vacuum-sucked more evenly.

  It is preferable that the plurality of through holes are used as component positioning recesses for positioning the wiring board by forming a semicircular recess through the cutting step. In this way, it is not necessary to separately provide a component positioning recess in the wiring board, and the manufacturing cost of the wiring board can be reduced.

  The wiring board has a rectangular shape having four sides, and preferably has the component positioning recesses on two opposing sides. In this case, the wiring board can be reliably positioned using the two component positioning recesses.

  Further, as another means (means 2) for solving the above-described problem, a part of the wiring board to be a product has a product area in which a plurality of parts are arranged vertically and horizontally along the plane direction, while the periphery of the product area An intermediate product of a multi-cavity wiring board that does not have an abandoned ear region, and has a structure in which an interlayer insulating layer and a conductor layer are laminated, and a wiring laminated portion having a plurality of external terminals to which a semiconductor element can be connected A plurality of through-holes for vacuum-adsorbing the solder ball alignment mask are provided in a state of being distributed so as to have a uniform density in the product region. There are intermediate products.

  Therefore, according to the intermediate product of the multi-cavity wiring board of the means 2, since there is no discarded ear area around the product area, it is caused by the thickness of the product area and the discarded ear area as in the conventional wiring board. The level difference is eliminated and the thickness becomes almost uniform. In addition, since the plurality of through holes are provided in a state of being distributed so as to have a uniform density in the product region, the entire solder ball alignment mask can be vacuum-sucked uniformly through each through hole. . Therefore, if an intermediate product of a multi-piece wiring board is used, the solder ball alignment mask can be securely fixed on the upper surface, and the problem that the solder ball alignment mask partially floats can be avoided. it can. As a result, solder balls can be reliably mounted on the plurality of external terminals, and the yield of ball mounting can be improved.

  Examples of the wiring board include a multilayer wiring board in which the wiring laminated portion is formed on a core substrate mainly composed of a resin material or a ceramic material. Specific examples of the core substrate composed mainly of the resin material include an EP resin (epoxy resin) substrate, a PI resin (polyimide resin) substrate, a BT resin (bismaleimide / triazine resin) substrate, and a PPE resin (polyphenylene ether resin). ) There is a substrate. In addition, a substrate made of a composite material of these resins and organic fibers such as glass fibers (glass woven fabric or glass nonwoven fabric) or polyamide fibers may be used. Alternatively, a substrate made of a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin with a three-dimensional network fluorine-based resin base material such as continuous porous PTFE may be used. Specific examples of the core substrate mainly composed of a ceramic material include a substrate made of a ceramic material such as alumina, aluminum nitride, boron nitride, silicon carbide, or silicon nitride.

  The wiring laminated portion constituting the wiring board has a structure in which an interlayer insulating layer mainly composed of a polymer material and a conductor layer are laminated. The wiring laminated portion may be formed only on one of the core main surface and the core back surface of the core substrate, or may be formed on both the core main surface and the core back surface. However, it is preferably formed on both the core main surface and the core back surface. With this configuration, an electric circuit can be formed in both the wiring laminated portion formed on the core main surface and the wiring laminated portion formed on the back surface of the core, thereby further enhancing the functionality of the wiring board. Can be planned.

  The conductor layer is patterned on the core substrate or the interlayer insulating layer by a known method such as a subtractive method, a semi-additive method, or a full additive method. Examples of the metal material used for forming the conductor layer include copper, a copper alloy, nickel, a nickel alloy, tin, and a tin alloy.

  The interlayer insulating layer can be appropriately selected in consideration of insulation, heat resistance, moisture resistance, and the like. Preferred examples of the polymer material for forming the interlayer insulating layer include thermosetting resins such as epoxy resin, phenol resin, urethane resin, silicone resin, polyimide resin, polycarbonate resin, acrylic resin, polyacetal resin, polypropylene resin, etc. And other thermoplastic resins. In addition, composite materials of these resins and organic fibers such as glass fibers (glass woven fabrics and glass nonwoven fabrics) and polyamide fibers, or three-dimensional network fluorine-based resin base materials such as continuous porous PTFE, epoxy resins, etc. A resin-resin composite material impregnated with a thermosetting resin may be used.

  The metal that forms the solder ball may be appropriately selected according to the material of the connection terminal of the semiconductor element to be mounted, etc. Examples of the solder include Sn—Sb solder, Sn—Ag solder, Sn—Ag—Cu solder, Au—Ge solder, Au—Sn solder. The solder ball is for connecting to a connection terminal of a semiconductor element, and preferably has a diameter of 100 μm or less.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view showing a multi-piece wiring board 100 of the present embodiment.

  The multi-cavity wiring board 100 is a substantially square plate material, and has an upper surface and a lower surface. In the multi-cavity wiring board 100, a plurality of wiring board regions 101 (parts to be products of the wiring board 10) having a substantially square shape are arranged in the vertical and horizontal directions along the plane direction. The alternate long and short dash line drawn in FIG. By dividing the multi-piece wiring board 100 on the planned cutting line 103, a plurality of wiring boards 10 can be obtained simultaneously. In each wiring board region 101, the central portion of the upper surface thereof is a semiconductor element mounting portion 23, and a plurality of solder bumps 45 are provided in an array in that portion.

  In the multi-cavity wiring substrate 100, a plurality of through holes 105 are formed at equal intervals on the planned cutting line 103 and at positions corresponding to each side of each wiring substrate region 101. Each through hole 105 is used for adsorbing a solder ball alignment mask in a ball mounting process described later. Each through hole 105 has a size of about 3 mm in diameter.

  Further, the multi-cavity wiring board 100 is formed with a semicircular recess 107 at a position corresponding to the through hole 105 in the outline (left side and right side in FIG. 1). By providing the semicircular recess 107, the individual wiring boards 10 have the same shape when the multi-piece wiring board 100 is divided. Specifically, the wiring substrate 10 has a rectangular shape having four sides, and a semicircular recess 107 is formed on each of two opposing sides. These recesses 107 are used as component positioning recesses for positioning the wiring board 10.

  FIG. 2 is a cross-sectional view of the wiring board 10. As shown in FIG. 2, the wiring substrate 10 includes a substantially rectangular plate-shaped core substrate 11 made of glass epoxy, a buildup layer 31 (wiring laminated portion) formed on the upper surface 12 of the core substrate 11, a core The buildup layer 32 is formed on the lower surface 13 of the substrate 11. Via conductors 16 are formed at a plurality of locations on the core substrate 11. The via conductor 16 connects and connects the upper surface 12 side and the lower surface 13 side of the core substrate 11. A conductor layer 41 made of copper is patterned on the upper surface 12 and the lower surface 13 of the core substrate 11, and each conductor layer 41 is electrically connected to the via conductor 16.

  The build-up layer 31 formed on the upper surface 12 of the core substrate 11 is formed by alternately laminating two resin insulating layers 33 and 35 (so-called interlayer insulating layers) made of epoxy resin and a conductor layer 42 made of copper. It has a structure. Terminal pads 44 (external terminals) are formed in an array at a plurality of locations on the surface of the second resin insulating layer 35. The surface of the resin insulating layer 35 is almost entirely covered with a solder resist 37. An opening 46 for exposing the terminal pad 44 is formed at a predetermined position of the solder resist 37. A plurality of solder bumps 45 are provided on the surface of the terminal pad 44. Each solder bump 45 is electrically connected to the surface connection terminal 22 of the IC chip 21 which is a semiconductor element. In the build-up layer 31, the region where each terminal pad 44 and each solder bump 45 is formed becomes the semiconductor element mounting portion 23. In addition, via conductors 43 are provided in the resin insulating layers 33 and 35, respectively. These via conductors 43 electrically connect the conductor layers 41 and 42 and the terminal pads 44 to each other.

  The buildup layer 32 formed on the lower surface 13 of the core substrate 11 has substantially the same structure as the buildup layer 31 described above. That is, the buildup layer 32 has a structure in which two resin insulating layers 34 and 36 made of epoxy resin and the conductor layer 42 are alternately laminated. BGA pads 48 electrically connected to the conductor layer 42 through via conductors 43 are formed in an array at a plurality of locations on the lower surface of the second resin insulating layer 36. The lower surface of the resin insulating layer 36 is almost entirely covered with a solder resist 38. An opening 50 for exposing the BGA pad 48 is formed at a predetermined position of the solder resist 38. Each BGA pad 48 is electrically connected to a mother board (not shown) by solder bumps 49 arranged on the surface thereof. Thereby, the wiring board 10 is mounted on the mother board.

  The multi-cavity wiring board 100 of the present embodiment is manufactured, for example, by the following procedure.

  First, a copper clad laminate having copper foil attached on both sides is prepared. Next, drilling is performed on the copper-clad laminate using a drill, and a through hole for forming the via conductor 16 is formed in advance at a predetermined position. And the electroconductive copper plating is given with respect to the whole surface of a copper clad laminated board, and the via conductor 16 is formed by filling the inside of each through-hole with copper plating. Further, the copper foil on both sides of the copper clad laminate is etched, and the conductor layer 41 is patterned by, for example, a subtractive method to obtain the core substrate 11.

  As shown in FIG. 3, the core substrate 11 is provided with a product region 110 and a throw-away region 111. The product region 110 is provided in a rectangular shape in plan view at a substantially central portion of the core substrate 11. The discarded ear region 111 is provided in a rectangular frame shape in plan view around the product region 110 (that is, the outer periphery of the substrate). In addition, a plurality of positioning holes 115 and the like are provided in the abandon ear region 111 in the core substrate 11, and the wiring laminated portion forming step is performed using each positioning hole 115 and the like. Each positioning hole 115 has a diameter of about 6 mm, for example.

  In the wiring laminated portion forming step, the buildup layer 31 is formed on the upper surface 12 of the core substrate 11 and the buildup layer 32 is formed on the lower surface 13 of the core substrate 11 based on a conventionally known buildup method. To do. More specifically, first, a sheet-like thermosetting epoxy resin is laminated on the upper surface 12 and the lower surface 13 of the core substrate 11, and the first layer having blind holes at positions where the via conductors 43 are to be formed by a laser processing machine. Resin insulating layers 33 and 34 are formed. The resin insulating layers 33 and 34 may be formed by applying a liquid thermosetting epoxy resin instead of laminating the sheet-like thermosetting epoxy resin. Next, electrolytic copper plating is performed according to a conventionally known method (for example, a semi-additive method) to form a via conductor 43 in the blind hole and a conductor layer 42 on the resin insulating layers 33 and 34.

  Then, a sheet-like thermosetting epoxy resin is laminated on the first resin insulating layers 33 and 34, and a second layer resin having a blind hole at a position where the via conductor 43 is to be formed by a laser processing machine. Insulating layers 35 and 36 are formed. Note that the resin insulation layers 35 and 36 may be formed by applying a liquid thermosetting epoxy resin instead of laminating the sheet-like thermosetting epoxy resin. Next, electrolytic copper plating is performed in accordance with a conventionally known method to form via conductors 43 in the blind holes, terminal pads 44 are formed on the resin insulating layer 35, and BGA pads are formed on the resin insulating layer 36. 48 is formed.

  Next, solder resists 37 and 38 are formed by applying and curing a photosensitive epoxy resin on the second resin insulation layers 35 and 36. Thereafter, exposure and development are performed with a predetermined mask placed, and the openings 46 and 50 are patterned in the solder resists 37 and 38. As a result, buildup layers 31 and 32 are formed on the upper surface 12 and the lower surface 13 of the core substrate 11.

  In the subsequent through-hole arrangement process, the core substrate 11 on which the build-up layers 31 and 32 are formed is drilled using a drill machine, and as shown in FIG. A plurality of through holes 105 are formed. Each through-hole 105 is provided on the planned cutting line 103 including the outline of the product region 110. More specifically, the through-holes 105 are formed at equal intervals according to the width of the wiring board region 101 and are provided in a distributed state in the product region 110 so as to have an equal density.

  Then, after performing the through-hole arranging step, a cutting and removing step is performed to cut and remove the abandoned ear region 111 outside the product region 110 to obtain a substrate having only the product region 110. This board is an intermediate product 120 of the multi-piece wiring board 100 before mounting solder balls (see FIG. 5).

  Next, the intermediate product 120 of the multi-piece wiring board 100 is set on the solder ball mounting device 130 shown in FIGS. 6 and 7, and a ball mounting process is performed. The solder ball mounting device 130 includes a fixing stage 132 for fixing the intermediate product 120. On the upper surface of the fixed stage 132, a substrate setting portion 134 (concave portion) that matches the substrate size is formed. A step is formed on the substrate setting portion 134 so as to abut against and support the outer edge of the substrate, and the intermediate product 120 is set on the substrate setting portion 134. Then, a solder ball alignment mask 136 is disposed on the substrate of the intermediate product 120. In the alignment mask 136, solder balls 138 having a diameter of, for example, 100 μm or less are aligned in an array at a predetermined position of each wiring board region 101 (a position corresponding to the plurality of terminal pads 44 in the semiconductor element mounting portion 23). A plurality of through-holes 140 are formed for this purpose.

  In the fixed stage 132, a suction chamber 142 is provided below the substrate setting unit 134, and the suction chamber 142 is connected to a vacuum pump 146 through an exhaust duct 144. When the vacuum pump 146 is driven, the suction chamber 142 is in a negative pressure state. As a result, the solder ball alignment mask 136 is sucked through the through-hole 105 formed in the intermediate product 120, and the alignment mask 136 is fixed so as not to move. After the solder ball alignment mask 136 is fixed, the solder balls 138 are supplied onto the alignment mask 136 from a solder ball supply unit (not shown), and the solder balls 138 are accommodated in the respective through holes 140. As a result, the solder balls 138 are mounted on the terminal pads 44 of the semiconductor element mounting portion 23 in each wiring board region 101 of the intermediate product 120. Thereafter, the solder balls 138 are heated to a predetermined temperature and reflowed to form solder bumps 45 on the terminal pads 44.

  Through the above steps, a multi-piece wiring substrate 100 as shown in FIG. 1 is completed. Furthermore, a plurality of wiring boards 10 can be obtained simultaneously by dividing the multi-piece wiring board 100 by carrying out a board dividing step.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the present embodiment, the intermediate product 120 of the multi-piece wiring board 100 set in the solder ball mounting device 130 is a board having only the product area 110, so that the product area as in the conventional wiring board 200 is used. There is no level difference due to the thickness between 210 and the discarded ear region 211, and the thickness is almost uniform. In addition, the intermediate product 120 is provided with a plurality of through holes 105 dispersed in the product region 110 so as to have a uniform density. Therefore, the solder ball alignment mask 136 disposed on the upper surface of the intermediate product 120 through the plurality of through holes 105 can be uniformly vacuum-sucked and securely fixed. For this reason, the problem that the solder ball alignment mask 136 partially floats can be avoided. As a result, the solder balls 138 can be reliably aligned and mounted on the plurality of terminal pads 44, and the yield of ball mounting can be improved.

  (2) In the case of the present embodiment, since the intermediate product 120 having only the product area 110 is set in the solder ball mounting device 130, the board size is smaller than that of the conventional wiring board 200 having the discarded ear area 211. Thus, the solder ball mounting device 130 can be downsized.

  (3) In the multi-cavity wiring board 100 of the present embodiment, a plurality of through holes 105 are provided on the planned cutting lines 103 when the product region 110 is cut into a plurality of wiring boards 10. Thus, by forming each through-hole 105 on the planned cutting line 103, the plurality of through-holes 105 can be dispersed so as to obtain a uniform density without impairing the function of the wiring board 10. . Further, since each through hole 105 has a diameter smaller than that of the positioning hole 115 in the disposal ear region 111, it is possible to disperse and provide more through holes 105 in the product region 110.

  (4) In the present embodiment, since the plurality of through holes 105 are also provided on the outline of the product region 110, when the product region 110 is divided into individual wiring substrates 10, all the wiring substrates 10 are all formed. The same shape can be used.

  (5) In the case of the present embodiment, the wiring board 10 obtained by dividing the multi-cavity wiring board 100 has a rectangular shape having four sides, and has the component positioning recesses 107 on the two opposing sides. is doing. In this case, the wiring substrate 10 can be positioned reliably using the two component positioning recesses 107. Further, the through-hole 105 for vacuum suction is formed into a semicircular recess 107 through a cutting process, and the recess 107 is used as a component positioning recess, so that it is not necessary to separately provide a component positioning recess. The manufacturing cost of 10 can be suppressed.

  In addition, you may change embodiment of this invention as follows.

  In the multi-cavity wiring board 100 of the above-described embodiment, the plurality of through holes 105 are formed on the planned cutting line 103 at positions that are two opposite sides of the wiring board 10. However, the present invention is not limited to this. For example, like the multi-cavity wiring board 100A shown in FIG. 8, the through holes 105 may be formed on the points where the planned cutting lines 103 intersect each other. Even in this case, a plurality of through holes 105 can be provided in a state of being distributed so as to have a uniform density in the product region 110, and the ball alignment mask 136 is uniformly vacuum-sucked through each through hole 105. can do. Each through hole 105 does not need to be provided on the planned cutting line 103. For example, the through hole 105 is formed at a position shifted from the planned cutting line 103 if it does not overlap the conductor layer 41 or the like in the buildup layers 31 and 32. May be.

  In the above embodiment, the shape of the through-hole 105 formed in the multi-piece wiring substrate 100, 100A is circular, but is not limited to this shape. For example, it penetrates in a polygonal shape such as a square or a triangle. It may be a hole. However, when the circular through hole 105 is provided as in the above embodiment, the ball alignment mask 136 can be adsorbed more uniformly. Moreover, if each through-hole 105 is circular, it can be easily formed by drilling or the like.

  In the above embodiment, the package form of the wiring board 10 is BGA (ball grid array), but is not limited to BGA, and may be, for example, PGA (pin grid array) or LGA (land grid array). Good.

  The wiring board 10 in the above embodiment is an organic type wiring board made of a resin material, but the present invention may be applied to a wiring board made of a ceramic material.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) An intermediate product of a multi-cavity wiring board having a product area in which a plurality of parts to be products of a wiring board have a plurality of vertical and horizontal arrangements along the plane direction and no surrounding area around the product area. A wiring board having a core substrate formed mainly of a resin material and a plurality of external terminals provided on the core substrate and having a structure in which an interlayer insulating layer and a conductor layer are stacked and to which a semiconductor element can be connected A plurality of through holes for vacuum-sucking the solder ball alignment mask, the plurality of through-holes being provided so as to have a uniform density in the product region. Intermediate product of single-sided wiring board.

  (2) The intermediate product of the multi-piece wiring board according to 1 above, wherein the solder balls arranged on the external terminals using the solder ball alignment mask have a diameter of 100 μm or less.

  (3) A product area and a lump area provided around the product area, and a plurality of wiring boards for mounting semiconductor elements arranged vertically and horizontally along the plane direction in the product area In the manufacturing method of a wiring board, a plurality of external terminals having a structure in which an interlayer insulating layer and a conductor layer are laminated using a positioning hole provided in the abandoned ear region and to which the semiconductor element can be connected A wiring laminated portion forming step for forming a wiring laminated portion having in the product region, and a plurality of through holes provided with a plurality of through holes having a diameter smaller than that of the positioning holes dispersed in a uniform density in the product region After the hole disposing step, the cutting / removing step of cutting and removing the abandoned ear region to make only the product region, the wiring laminated portion forming step, the through-hole disposing step, and the cutting / removing step, Take By setting the wiring board on the solder ball mounting device, and in this state, vacuum-adsorbing a solder ball alignment mask having a plurality of through holes at positions corresponding to the plurality of external terminals through the plurality of through holes, A method of manufacturing a multi-cavity wiring board, comprising: a ball mounting step in which the mask is fixed on the multi-cavity wiring board and solder balls are aligned and mounted on the plurality of external terminals.

The top view which shows the multi-piece wiring board of this Embodiment. Sectional drawing which shows the wiring board of this Embodiment. The top view for demonstrating the product area | region and discard ear | edge area | region in a core board | substrate. The top view for demonstrating the formation position of the through-hole in the core board | substrate which laminated | stacked the buildup layer. The top view which shows the intermediate product of a multi-piece wiring board. Sectional drawing which shows a solder ball mounting apparatus. The top view which shows a solder ball mounting apparatus. The top view which shows the multi-piece wiring board of another embodiment. The top view which shows the conventional multi-piece wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Wiring board 21 ... IC chip as a semiconductor element 31 ... Build-up layer as a wiring lamination part 33, 35 ... Resin insulating layer as an interlayer insulating layer 42 ... Conductive layer 44 ... Terminal pad 100, 100A as an external terminal Multiple circuit board 103 ... Scheduled cutting line 105 ... Through hole 107 ... Recess 110 ... Product region 111 ... Disposal ear region 115 ... Positioning hole 120 ... Intermediate product 130 ... Solder ball mounting device 136 ... Solder ball alignment mask 138 ... Solder ball 140 ... through hole

Claims (7)

In the manufacturing method of a multi-piece wiring board comprising a product area and a disposal ear area provided around the product area, wherein a plurality of wiring boards are arranged vertically and horizontally along the plane direction in the product area,
A wiring layered portion having a structure in which an interlayer insulating layer and a conductor layer are stacked using a positioning hole provided in the discard ear region and having a plurality of external terminals to which a semiconductor element can be connected is formed in the product region. A wiring laminate forming step to be formed;
A through-hole disposing step of providing a plurality of through-holes in a dispersed state so as to have a uniform density in the product region;
A cutting and removing step of cutting and removing the abandoned ear region to make only the product region;
After the wiring laminated portion forming step, the through hole arranging step, and the cutting and removing step, the multi-piece wiring substrate is set on a solder ball mounting device, and in this state, a plurality of positions are provided at positions corresponding to the plurality of external terminals. A solder ball alignment mask having a plurality of through-holes is vacuum-adsorbed through the plurality of through-holes, thereby fixing the mask on the multi-piece wiring board and mounting solder balls on the plurality of external terminals. And a ball mounting step for manufacturing a multi-piece wiring board.   The method of manufacturing a multi-piece wiring board according to claim 1, wherein the plurality of through holes are provided on a planned cutting line when the product region is cut into a plurality of wiring boards.   The method for manufacturing a multi-cavity wiring board according to claim 2, wherein the plurality of through holes are also provided on an outline of the product region.   2. The multi-cavity wiring board according to claim 1, wherein the plurality of through holes are provided on points where the planned cutting lines intersect when the product region is cut into a plurality of wiring boards. Manufacturing method.   The plurality of through holes are used as component positioning recesses for positioning the wiring board by forming a semicircular recess through the cutting step. A method for manufacturing a multi-piece wiring board according to claim 1.   6. The method of manufacturing a multi-piece wiring board according to claim 5, wherein the wiring board has a rectangular shape having four sides, and the component positioning recesses are provided on two opposing sides. . While the product area of the wiring board has a product area in which a plurality of parts are arranged vertically and horizontally along the plane direction, it is an intermediate product of a multi-cavity wiring board that does not have a discarded ear area around the product area,
A wiring laminated portion having a plurality of external terminals to which a semiconductor element can be connected, having a structure in which an interlayer insulating layer and a conductor layer are laminated, and a plurality of through holes for vacuum adsorbing a solder ball alignment mask, An intermediate product of a multi-piece wiring board, characterized in that it is provided in a distributed state so as to have a uniform density in the product area.

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