JP2009224557A - Cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device that is improved in cooling capability while reducing pressure loss of a cooling medium. <P>SOLUTION: Partition plates 20-1 and 20-2 connecting upstream cooling fins 14 and downstream cooling fins 15 form communication flow passages 18 making upstream cooling medium flow passages 16 and downstream cooling medium flow passages 17 communicate with each other between a reverse surface 12b of a cooling plate 12 and the partition plates 20-1 and 20-2. A pair of partition plates 20-1 and 20-2 which gradually increase in interval from an upstream cooling fin 14 to a downstream cooling fin 15 is coupled to the upstream cooling fin 14, and the pair of partition plates 20-1 and 20-2 which gradually increase in interval from a downstream cooling fin 15 to an upstream cooling fin 14 is coupled to the downstream cooling fin 15. The upstream cooling fin 14 to which the pair of partition plates 20-1 and 20-2 are coupled gradually decreases in thickness from the upstream side to the downstream side of a cooling medium flow. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a cooling device for removing heat generated by a heating element.

  As an example of a cooling device for removing heat generated by a heating element, a microchannel type cooling device is known (for example, Patent Documents 1 and 2 and Non-Patent Document 1). In the microchannel cooling device, a large number of micro flow channels (microchannels) through which a coolant flows are formed inside, thereby increasing the heat transfer area and increasing the heat transfer coefficient. In Patent Document 1, each of the plurality of microchannels is formed by overlapping at least a first and second plate-like laminate, and a microchannel channel portion and a second plate of the first plate-like laminate. The microchannel channel portion of the laminated laminate is formed so as to be shifted in position so as to form a continuous passage in the coolant flow direction. In this way, a micro vortex is created using the meandering channel structure to improve the heat exchange capability.

  Further, in Patent Document 2 and Non-Patent Document 1, short-length microchannels are integrated, and the refrigerant is, as shown in FIG. 26, the inter-fin flow path 1 → the fin upper flow path 3 → the inter-fin flow path 2. The heat exchange with the cooling fin 4 is performed by flowing in this order.

JP 2007-12719 A International Publication No. 07/065705 Pamphlet Jurgen J. Brandner et al., "A new Enhanced Microstructure Heat Exchanger with Reduced Pressure Drop", 4th International Workshop on Micro Chemical Process Technology, Forschungszentrum Karlsruhe, January 26,2006

  In the microchannel cooling device, a large number of microchannels are formed to increase the heat transfer area and increase the heat transfer coefficient. However, since the flow area of the refrigerant flow path (microchannel) through which the refrigerant flows is small, The pressure loss increases. When the pressure loss increases, the refrigerant flow rate in the microchannel cannot be increased, and the temperature rise amount of the refrigerant flowing through the microchannel increases. As a result, it becomes difficult to cool the heating element uniformly, leading to a decrease in cooling capacity.

  In the above-mentioned Patent Document 2 and Non-Patent Document 1, although the pressure loss is relatively small as a microchannel by shortening the flow path length of the fin upper flow path 3, it is between the inlets of the inter-fin flow path 1. There is a wall surface (B in FIG. 26), and this wall surface B has an area corresponding to the thickness of the inter-fin flow path 2 and the cooling fin 4, so that the pressure loss generated when the refrigerant flows into the inter-fin flow path 1 increases. To do. Similarly, since there is a wall surface (C in FIG. 26) having an area corresponding to the thickness of the inter-fin channel 1 and the cooling fin 4 between the outlets of the inter-fin channel 2, the refrigerant flows out from the inter-fin channel 2. The pressure loss that occurs is increased. Further, when the refrigerant flows from the inter-fin flow path 1 to the fin upper flow path 3, stagnation of the refrigerant flow occurs in a region indicated by E in FIG. Similarly, when the refrigerant flows from the fin upper flow path 3 to the inter-fin flow path 2, the stagnation of the refrigerant flow occurs in the region indicated by D in FIG. 26, thereby increasing the pressure loss.

  An object of this invention is to provide the cooling device which can improve a cooling capability, reducing the pressure loss of a refrigerant | coolant.

  The cooling device according to the present invention employs the following means in order to achieve the above-described object.

  The cooling device according to the present invention is arranged so as to face the cooling plate on which the heating element is placed on one main surface and the back surface of the one main surface of the cooling plate at an interval, and the refrigerant flow between the back surface of the cooling plate. A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other, and between the upstream cooling fins adjacent to each other. A plurality of upstream cooling fins formed on the back surface of the cooling plate, and a plurality of downstream cooling fins arranged at intervals from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins. A plurality of downstream cooling fins in which a downstream refrigerant flow path is formed between adjacent downstream cooling fins, and an upright cooling fin and a downstream cooling fin arranged in a standing state on the bottom member. A plurality of partition plates to be connected, the upstream refrigerant flow path and the downstream cooling A plurality of partition plates formed between the back surface of the cooling plate and a communication flow channel that communicates with the flow channel, and at least some of the upstream cooling fins include the upstream cooling fins and the downstream cooling fins. The partition plates that are gradually increased in distance from each other are connected to each other, and at least some of the downstream cooling fins are gradually increased from the downstream cooling fins toward the upstream cooling fins. The upstream cooling fin to which the partition plates are connected is a fin whose area of a cross section perpendicular to the refrigerant flow direction gradually decreases from the downstream side to the upstream side in the refrigerant flow direction. To do.

  In the present invention, the refrigerant flowing through the communication channel collides with the back surface of the cooling plate, whereby heat exchange with the cooling plate can be promoted, and the cooling capacity can be improved. Further, by gradually decreasing the area of the cross section orthogonal to the refrigerant flow direction in the upstream cooling fin from the downstream side to the upstream side in the refrigerant flow direction, the refrigerant flow near the upstream end of the upstream cooling fin. It is possible to suppress the occurrence of a stagnation region, and it is possible to reduce pressure loss that occurs when the refrigerant flows into the upstream refrigerant flow path.

  Further, the cooling device according to the present invention is disposed between the cooling plate on which the heating element is placed on one main surface, and the back surface of the one main surface of the cooling plate with a space therebetween, and between the back surface of the cooling plate. A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged on the back surface of the cooling plate and spaced apart from each other, and between the upstream cooling fins adjacent to each other. A plurality of upstream cooling fins in which flow paths are formed, and a plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins A plurality of downstream cooling fins in which a downstream refrigerant flow path is formed between adjacent downstream cooling fins, and an upstream cooling fin and a downstream cooling fin arranged in a standing state on the bottom member. A plurality of partition plates connecting the upstream refrigerant flow path and the lower A plurality of partition plates formed between the back surface of the cooling plate and a communication channel that communicates with the side refrigerant channel, and at least some of the upstream cooling fins are located downstream from the upstream cooling fins. Partition plates that gradually increase in distance from each other toward the cooling fins are connected, and at least some of the downstream cooling fins gradually increase from each other toward the upstream cooling fins. Partition plates are connected, and the partition plates connected to the upstream side cooling fins are coupled to each other at or near the connection portion with the upstream side cooling fins, and the upstream side cooling fins to which the partition plates are connected are The gist is that the fin is a thin plate.

  In the present invention, the refrigerant flowing through the communication channel collides with the back surface of the cooling plate, whereby heat exchange with the cooling plate can be promoted, and the cooling capacity can be improved. Further, the partition plates connected to the upstream side cooling fins are coupled to each other at or near the connection portion with the upstream side cooling fins, and the upstream side cooling fins connected to the partition plates are thin plate-shaped fins. As a result, it is possible to suppress the occurrence of a stagnation region of the refrigerant flow in the vicinity of the upstream end of the upstream cooling fin, and to reduce the pressure loss that occurs when the refrigerant flows into the upstream refrigerant flow path. be able to.

  In one aspect of the present invention, the downstream cooling fin to which the partition plate is connected is a fin whose area of a cross section perpendicular to the refrigerant flow direction gradually decreases from the upstream side to the downstream side in the refrigerant flow direction. Is preferred. In one aspect of the present invention, the partition plates connected to the downstream cooling fins are coupled to each other at or near the connection portion with the downstream cooling fin, and the downstream cooling to which the partition plates are connected. The fins are preferably thin plate-shaped fins.

  Further, the cooling device according to the present invention is disposed between the cooling plate on which the heating element is placed on one main surface, and the back surface of the one main surface of the cooling plate with a space therebetween, and between the back surface of the cooling plate. A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged on the back surface of the cooling plate and spaced apart from each other, and between the upstream cooling fins adjacent to each other. A plurality of upstream cooling fins in which flow paths are formed, and a plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins A plurality of downstream cooling fins in which a downstream refrigerant flow path is formed between adjacent downstream cooling fins, and an upstream cooling fin and a downstream cooling fin arranged in a standing state on the bottom member. A plurality of partition plates connecting the upstream refrigerant flow path and the lower A plurality of partition plates formed between the back surface of the cooling plate and a communication channel that communicates with the side refrigerant channel, and at least some of the upstream cooling fins are located downstream from the upstream cooling fins. Partition plates that gradually increase in distance from each other toward the cooling fins are connected, and at least some of the downstream cooling fins gradually increase from each other toward the upstream cooling fins. The partition plate is connected, and the downstream side cooling fin to which the partition plate is connected is a fin whose area of a cross section perpendicular to the refrigerant flow direction gradually decreases from the upstream side to the downstream side in the refrigerant flow direction. The gist.

  In the present invention, the refrigerant flowing through the communication channel collides with the back surface of the cooling plate, whereby heat exchange with the cooling plate can be promoted, and the cooling capacity can be improved. Further, the area of the cross section perpendicular to the refrigerant flow direction in the downstream cooling fin is gradually reduced from the upstream side to the downstream side of the refrigerant flow, so that the refrigerant flow is reduced in the vicinity of the downstream end of the downstream cooling fin. Occurrence of a stagnation region can be suppressed, and pressure loss that occurs when the refrigerant flows out of the downstream refrigerant flow path can be reduced.

  Further, the cooling device according to the present invention is disposed between the cooling plate on which the heating element is placed on one main surface, and the back surface of the one main surface of the cooling plate with a space therebetween, and between the back surface of the cooling plate. A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged on the back surface of the cooling plate and spaced apart from each other, and between the upstream cooling fins adjacent to each other. A plurality of upstream cooling fins in which flow paths are formed, and a plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins A plurality of downstream cooling fins in which a downstream refrigerant flow path is formed between adjacent downstream cooling fins, and an upstream cooling fin and a downstream cooling fin arranged in a standing state on the bottom member. A plurality of partition plates connecting the upstream refrigerant flow path and the lower A plurality of partition plates formed between the back surface of the cooling plate and a communication channel that communicates with the side refrigerant channel, and at least some of the upstream cooling fins are located downstream from the upstream cooling fins. Partition plates that gradually increase each other toward the cooling fins are connected, and at least some of the downstream cooling fins gradually increase each other as they go from the downstream cooling fins to the upstream cooling fins. Partition plates are connected, and the partition plates connected to the downstream cooling fins are connected to each other at or near the connection portion with the downstream cooling fins, and the downstream cooling fins connected to the partition plates are The gist is that the fin is a thin plate.

  In the present invention, the refrigerant flowing through the communication channel collides with the back surface of the cooling plate, whereby heat exchange with the cooling plate can be promoted, and the cooling capacity can be improved. Further, the partition plates connected to the downstream cooling fins are coupled to each other at or near the connection portion with the downstream cooling fins, and the downstream cooling fins connected to the partition plates are thin plate-shaped fins. As a result, it is possible to suppress the occurrence of a stagnation region of the refrigerant flow in the vicinity of the downstream end of the downstream side cooling fin, and to reduce the pressure loss that occurs when the refrigerant flows out of the downstream side refrigerant flow path. be able to.

  In one aspect of the present invention, it is preferable that the bottom member is provided with an upstream inclined portion in which the distance from the back surface of the cooling plate gradually decreases as it goes from the upstream refrigerant flow path to the communication flow path. . In one aspect of the present invention, the bottom member is preferably provided with a downstream inclined portion in which the distance from the back surface of the cooling plate gradually increases as it goes from the communication flow path to the downstream refrigerant flow path. It is.

  Further, the cooling device according to the present invention is disposed between the cooling plate on which the heating element is placed on one main surface, and the back surface of the one main surface of the cooling plate with a space therebetween, and between the back surface of the cooling plate. A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged on the back surface of the cooling plate and spaced apart from each other, and between the upstream cooling fins adjacent to each other. A plurality of upstream cooling fins in which flow paths are formed, and a plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins A plurality of downstream cooling fins in which a downstream refrigerant flow path is formed between adjacent downstream cooling fins, and an upstream cooling fin and a downstream cooling fin arranged in a standing state on the bottom member. A plurality of partition plates connecting the upstream refrigerant flow path and the lower A plurality of partition plates formed between the back surface of the cooling plate and a communication channel that communicates with the side refrigerant channel, and at least some of the upstream cooling fins are located downstream from the upstream cooling fins. Partition plates that gradually increase in distance from each other toward the cooling fins are connected, and at least some of the downstream cooling fins gradually increase from each other toward the upstream cooling fins. The gist is that the partition plate is connected, and the bottom member is provided with an upstream inclined portion in which the distance from the back surface of the cooling plate gradually decreases as it goes from the upstream refrigerant flow path to the communication flow path.

  In the present invention, the refrigerant flowing through the communication channel collides with the back surface of the cooling plate, whereby heat exchange with the cooling plate can be promoted, and the cooling capacity can be improved. Further, by providing an upstream inclined portion in the bottom member in which the distance from the back surface of the cooling plate gradually decreases from the upstream refrigerant flow path to the communication flow path, the refrigerant flow is communicated from the upstream refrigerant flow path to the communication flow path. It is possible to suppress the occurrence of a stagnation region when shifting to, and to reduce the pressure loss that occurs when the refrigerant flows from the upstream refrigerant flow path into the communication flow path. By providing the upstream inclined portion, the collision of the refrigerant with the back surface of the cooling plate can be further strengthened, and heat exchange with the cooling plate can be further promoted.

  Further, the cooling device according to the present invention is disposed between the cooling plate on which the heating element is placed on one main surface, and the back surface of the one main surface of the cooling plate with a space therebetween, and between the back surface of the cooling plate. A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged on the back surface of the cooling plate and spaced apart from each other, and between the upstream cooling fins adjacent to each other. A plurality of upstream cooling fins in which flow paths are formed, and a plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins A plurality of downstream cooling fins in which a downstream refrigerant flow path is formed between adjacent downstream cooling fins, and an upstream cooling fin and a downstream cooling fin arranged in a standing state on the bottom member. A plurality of partition plates connecting the upstream refrigerant flow path and the lower A plurality of partition plates formed between the back surface of the cooling plate and a communication channel that communicates with the side refrigerant channel, and at least some of the upstream cooling fins are located downstream from the upstream cooling fins. Partition plates that gradually increase in distance from each other toward the cooling fins are connected, and at least some of the downstream cooling fins gradually increase from each other toward the upstream cooling fins. The gist is that the partition plates are connected, and the bottom member is provided with a downstream inclined portion in which the distance from the back surface of the cooling plate gradually increases as it goes from the communication channel toward the downstream refrigerant channel.

  In the present invention, the refrigerant flowing through the communication channel collides with the back surface of the cooling plate, whereby heat exchange with the cooling plate can be promoted, and the cooling capacity can be improved. Further, by providing the bottom member with a downstream inclined portion that gradually increases in distance from the back surface of the cooling plate as it goes from the communication channel toward the downstream refrigerant channel, the refrigerant flow is changed from the communication channel to the downstream refrigerant channel. It is possible to suppress the occurrence of a stagnation region when shifting to, and to reduce the pressure loss that occurs when the refrigerant flows from the communication channel into the downstream refrigerant channel.

  According to the present invention, the cooling capacity can be improved while reducing the pressure loss of the refrigerant.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as embodiments) will be described with reference to the drawings.

  1-4 is a figure which shows schematic structure of the cooling device 10 which concerns on embodiment of this invention. 1 shows an internal schematic configuration viewed from the upper surface side, FIG. 2 shows an internal schematic configuration viewed from the side surface side, and FIGS. 3 and 4 show perspective views of the internal schematic configuration. A heating element 30 is placed on the surface (one main surface) 12 a of the cooling plate 12. The surface area of the cooling plate 12 (the area of the surface 12a) is set larger than the area of the heating element 30. On the back surface (back surface of one main surface) 12b side of the cooling plate 12, a bottom plate 22 is disposed as a bottom member so as to face the back surface 12b of the cooling plate 12 with a gap. The cooling plate 12 and the bottom plate 22 are connected to each other via a pair of side plates 24 arranged to face each other with a space therebetween, and more specifically between the back surface 12b of the cooling plate 12 and the bottom plate 22. In the space surrounded by the back surface 12 b of the plate 12, the bottom plate 22, and the pair of side plates 24, a refrigerant flow path through which the refrigerant flows is formed. A refrigerant inlet 36 and a refrigerant outlet 46 are respectively formed at both ends of the cooling device 10 in the longitudinal direction of the side plate (left and right direction in FIG. 1). The refrigerant flows into the refrigerant flow path from the refrigerant inlet 36. It flows out from the refrigerant outlet 46. In addition, as a specific example of the heat generating body 30 here, for example, a semiconductor element (power device) such as an IGBT or a power MOSFET can be cited, but other electronic components may be used. Moreover, as a specific example of a refrigerant | coolant here, liquid refrigerants, such as water and a fluorocarbon, can be mentioned, for example.

  A plurality of upstream cooling fins 14 are provided upright on the back surface 12 b of the cooling plate 12 on the back side (directly below) of the heating element 30, and the leading end portions of the upstream cooling fins 14 are joined to the bottom plate 22. Yes. In the example shown in FIGS. 1-4, the standing direction (up-down direction of FIG. 2) of each upstream cooling fin 14 is perpendicular to the back surface 12b of the cooling plate 12, and the thickness direction of each upstream cooling fin 14 ( The vertical direction in FIG. 1 is perpendicular to the plate surface of the side plate 24. The plurality of upstream cooling fins 14 are arranged at intervals with respect to the thickness direction, and are arranged to face the refrigerant inlet 36 in the longitudinal direction of the side plate. Between the upstream side cooling fins 14 adjacent to each other in the thickness direction, an upstream side refrigerant flow path 16 through which the refrigerant flows is formed.

  In addition, a plurality of downstream cooling fins 15 are erected on the back surface (directly below) of the heating element 30 on the back surface 12 b of the cooling plate 12, and the front ends of the respective downstream cooling fins 15 are also joined to the bottom plate 22. Has been. In the example shown in FIGS. 1-4, the standing direction (up-down direction of FIG. 2) of each downstream side cooling fin 15 is also a perpendicular | vertical direction with the back surface 12b of the cooling plate 12, and the thickness direction ( The vertical direction in FIG. 1 is also perpendicular to the plate surface of the side plate 24. The plurality of downstream cooling fins 15 are also arranged at intervals with respect to the thickness direction, and the arrangement direction of the downstream cooling fins 15 is parallel (or substantially parallel) to the arrangement direction of the upstream cooling fins 14. is there. The plurality of downstream cooling fins 15 are disposed at positions downstream of the plurality of upstream cooling fins 14 in the refrigerant flow direction (left-right direction in FIG. 1), and are disposed opposite to the refrigerant outlet 46 in the side plate longitudinal direction. Has been. Between the downstream cooling fins 15 adjacent to each other in the thickness direction, a downstream refrigerant flow path 17 through which the refrigerant flows is formed. In the example shown in FIGS. 1-4, the space | interval between the downstream cooling fins 15 is set equal to the space | interval between the upstream cooling fins 14, and the flow-path cross-sectional area of the downstream refrigerant flow path 17 is an upstream refrigerant flow path. It is set equal to 16 channel cross-sectional areas. The upstream cooling fins 14 and the downstream cooling fins 15 can be formed integrally with the cooling plate 12 or can be formed separately from the cooling plate 12 and joined together.

  Further, a plurality of partition plates 20-1 and 20-2 are erected at a position on the bottom plate 22 on the back side (directly below) of the heating element 30. The plurality of partition plates 20-1 and 20-2 standing on the bottom plate 22 are arranged at positions between the upstream side cooling fins 14 and the downstream side cooling fins 15 with respect to the refrigerant flow direction. 14 and the downstream cooling fins 15 are arranged at a distance from each other in the thickness direction (vertical direction in FIG. 1, hereinafter referred to as fin thickness direction). Each of the partition plates 20-1 and 20-2 is connected to the upstream side cooling fin 14 at one end and is connected to the downstream side cooling fin 15 at the other end. The cooling fin 15 is connected. Between each partition plate 20-1, 20-2 and the back surface 12 b of the cooling plate 12, a communication channel 18 that connects the upstream refrigerant channel 16 and the downstream refrigerant channel 17 is formed. 1-4, the partition plates 20-1 and 20-2 are not in direct contact with the back surface 12b of the cooling plate 12, and the partition plate 20-1 (or the partition plate 20-2) and the cooling plate 12 are not in contact with each other. A communication flow path 18 is formed in a space surrounded by the back surface 12b of the first, the upstream cooling fins 14, and the downstream cooling fins 15. That is, in the example shown in FIGS. 1 to 4, the communication flow path 18 extends from one end of the partition plate 20-1 (or the partition plate 20-2) to the other end (from the upstream side cooling fin 14 to the downstream side cooling fin 15. Is formed). 1-4, the height of the partition plates 20-1 and 20-2 is constant from one end to the other end, and the height of the communication channel 18 is from one end to the other end. It is constant. The partition plates 20-1 and 20-2 can be formed integrally with the upstream cooling fins 14 and the downstream cooling fins 15, or separately from the upstream cooling fins 14 and the downstream cooling fins 15. It can also be formed and joined. Further, the partition plates 20-1 and 20-2 can be formed integrally with the bottom plate 22, or can be formed separately from the bottom plate 22 and joined.

  The upstream side cooling fins 14 and the downstream side cooling fins 15 are arranged so that the positions in the fin thickness direction are shifted from each other, and the upstream side cooling fins 14 are arranged to face the downstream side refrigerant flow path 17 with respect to the side plate longitudinal direction. The downstream side cooling fins 15 are arranged to face the upstream side refrigerant flow path 16. A pair of partition plates 20-1 and 20-2 adjacent to each other in the fin thickness direction is connected to each upstream cooling fin 14 (or at least a part of the upstream cooling fins 14). The pair of partition plates 20-1 and 20-2 connected to the upstream side cooling fins 14 has a predetermined angle so that the distance between them increases gradually from the upstream side cooling fins 14 toward the downstream side cooling fins 15. And are connected to a pair of downstream cooling fins 15 adjacent to each other in the fin thickness direction. A pair of communication channels 18 formed between the pair of partition plates 20-1 and 20-2 and the back surface 12 b of the cooling plate 12 are connected to the pair of partition plates 20-1 and 20-2. It communicates with a downstream refrigerant passage 17 formed between a pair of downstream cooling fins 15 connected to each other. In addition, a pair of partition plates 20-1 and 20-2 adjacent to each other in the fin thickness direction is also connected to each downstream cooling fin 15 (or at least a part of the downstream cooling fins 15). The pair of partition plates 20-1 and 20-2 connected to the downstream side cooling fins 15 have a predetermined angle so that the distance between them gradually increases from the downstream side cooling fins 15 toward the upstream side cooling fins 14. Are connected to a pair of upstream cooling fins 14 adjacent to each other in the fin thickness direction. A pair of communication channels 18 formed between the pair of partition plates 20-1 and 20-2 and the back surface 12 b of the cooling plate 12 are connected to the pair of partition plates 20-1 and 20-2. It communicates with an upstream refrigerant flow path 16 formed between a pair of upstream cooling fins 14 connected to each other.

  In this embodiment, each upstream side cooling fin 14 to which the pair of partition plates 20-1 and 20-2 is connected has a shape in which the thickness gradually decreases from the downstream side to the upstream side in the refrigerant flow direction. Presents. Due to this shape, each upstream-side cooling fin 14 gradually decreases in area from the cross section perpendicular to the refrigerant flow direction from the downstream side to the upstream side in the refrigerant flow direction. And each downstream side cooling fin 15 with which a pair of partition plates 20-1 and 20-2 was connected is exhibiting the shape which the thickness decreases gradually as it goes to the downstream from the upstream in a refrigerant | coolant flow direction. . Due to this shape, each downstream cooling fin 15 gradually decreases in area from the cross section perpendicular to the refrigerant flow direction from the upstream side to the downstream side in the refrigerant flow direction. In the example shown in FIGS. 1 to 4, each upstream cooling fin 14 has a wedge shape with an acute tip at the upstream side facing the refrigerant inlet 36, and each downstream cooling fin 15 has a refrigerant flow The downstream end facing the outlet 46 has a wedge shape with an acute angle.

  Furthermore, in the present embodiment, at the position on the back side (directly below) of the heating element 30 in the bottom plate 22, the distance from the back surface 12 b of the cooling plate 12 gradually decreases as it goes from the upstream refrigerant flow path 16 to the communication flow path 18. Thus, an upstream inclined portion 26 having an upstream inclined surface 26 a inclined with respect to the back surface 12 b of the cooling plate 12 is provided. The upstream inclined portion 26 has an upstream end connected to the adjacent upstream cooling fin 14, a downstream end connected to the downstream cooling fin 15, and an upstream end and a downstream end The part between is connected to the adjacent partition plates 20-1 and 20-2. The height of the upstream inclined portion 26 (upstream inclined surface 26a) gradually increases from the upstream end to the downstream end, and the height of the downstream end is the partition plate 20-. It is set equal to (or substantially equal to) the height of 1,20-2. Then, at the position on the back side (directly below) of the heating element 30 in the bottom plate 22, the cooling plate is such that the distance from the back surface 12 b of the cooling plate 12 gradually increases from the communication flow path 18 toward the downstream refrigerant flow path 17. A downstream inclined portion 27 having a downstream inclined surface 27 a that is inclined with respect to the back surface 12 b of 12 is provided. The downstream inclined portion 27 has an upstream end connected to the upstream cooling fin 14, a downstream end connected to the adjacent downstream cooling fin 15, and an upstream end and a downstream end The part between is connected to the adjacent partition plates 20-1 and 20-2. The height of the downstream inclined portion 27 (downstream inclined surface 27a) gradually decreases from the upstream end to the downstream end, and the height of the upstream end is the partition plate 20-. It is set equal to (or substantially equal to) the height of 1,20-2. 1-4 shows an example in which the upstream inclined surface 26a and the downstream inclined surface 27a are planar. The upstream inclined portion 26 and the downstream inclined portion 27 can be formed integrally with the bottom plate 22 or can be formed separately from the bottom plate 22 and joined.

  In the cooling device 10 according to the present embodiment, the heat generated in the heating element 30 is transmitted to the cooling plate 12 and further transmitted to the upstream cooling fins 14 and the downstream cooling fins 15. As shown in FIGS. 5 and 6, the refrigerant (liquid refrigerant) supplied from the refrigerant inlet 36 flows into the upstream refrigerant flow path 16, and the upstream cooling fins 14 that form the upstream refrigerant flow path 16. The heat is removed from the heating element 30 by exchanging heat between the two. In this embodiment, the thickness of the upstream cooling fins 14 forming the upstream refrigerant flow path 16 is gradually reduced from the downstream side toward the upstream side, whereby the flow path cross-sectional area of the refrigerant inlet 36 and the upstream side are increased. The difference from the flow path cross-sectional area of the inlet of the refrigerant flow path 16 can be reduced, and the flow path cross-sectional area rapidly decreases when the refrigerant flow flows from the refrigerant flow inlet 36 into the upstream refrigerant flow path 16. It is possible to prevent the refrigerant flow from being separated from the wall surface of the upstream side refrigerant flow path 16. This suppresses the occurrence of a stagnation region of the refrigerant flow in the vicinity of the upstream end of the upstream cooling fin 14 and reduces the pressure loss that occurs when the liquid refrigerant flows into the upstream refrigerant flow path 16. Can do.

  As shown in FIGS. 5 and 6, the refrigerant supplied to the upstream refrigerant flow path 16 (having exchanged heat with the upstream cooling fins 14) faces the back surface 12b of the cooling plate 12 and this upstream side. The refrigerant flows into a pair of communication channels 18 communicating with the side refrigerant channel 16. The refrigerant passing through each of the pair of communication channels 18 exchanges heat with the cooling plate 12. This heat exchange also removes heat from the heating element 30. In the present embodiment, by providing the bottom plate 22 with the upstream inclined portion 26 whose height gradually increases from the upstream refrigerant flow path 16 toward the communication flow path 18, the refrigerant flowing into the upstream refrigerant flow path 16 is The flow direction can be inclined toward the back surface 12 b side of the cooling plate 12, and the liquid refrigerant can collide with the back surface 12 b of the cooling plate 12 to promote heat exchange with the cooling plate 12. When the liquid refrigerant flows from the upstream refrigerant flow path 16 to the communication flow path 18, the occurrence of a stagnation region of the refrigerant flow in the flow path 28 between the partition plates 20-1 and 20-2 is suppressed. Can do. Furthermore, in this embodiment, the liquid refrigerant flows into the communication channel 18 by forming the communication channel 18 from one end of the partition plate 20-1 (or the partition plate 20-2) to the other end. At this time, it is possible to suppress the occurrence of a stagnation region of the refrigerant flow in the vicinity of the inlet of the communication flow path 18.

  As shown in FIG. 5, the refrigerant supplied to the communication flow path 18 (heat exchanged with the cooling plate 12) flows into the downstream refrigerant flow path 17, and the downstream refrigerant flow path 17 is Heat is removed from the heating element 30 by exchanging heat with the downstream cooling fins 15 to be formed. In that case, the refrigerant | coolant from a pair of communicating flow path 18 connected with the downstream refrigerant flow path 17 joins, and flows in into this downstream refrigerant flow path 17. In the present embodiment, the bottom plate 22 is provided with the downstream inclined portion 27 whose height gradually decreases from the communication flow path 18 toward the downstream refrigerant flow path 17, so that the liquid refrigerant flows from the communication flow path 18 to the downstream refrigerant. When flowing to the flow path 17, it is possible to suppress the occurrence of a stagnation region of the refrigerant flow in the flow path 29 between the partition plates 20-1 and 20-2.

  The refrigerant that has passed through the downstream refrigerant flow path 17 (heat exchanged with the downstream cooling fins 15) flows out from the refrigerant outlet 46. In the present embodiment, the thickness of the downstream cooling fins 15 forming the downstream refrigerant flow path 17 is gradually reduced from the upstream side toward the downstream side, whereby the flow path cross-sectional area of the refrigerant outlet 46 and the downstream side are reduced. The difference from the channel cross-sectional area of the outlet portion of the refrigerant channel 17 can be reduced, and the channel cross-sectional area rapidly increases when the refrigerant flow flows out of the downstream refrigerant channel 17 to the refrigerant outlet 46. It is possible to suppress the occurrence of a stagnation region of the liquid refrigerant flow in the vicinity of the downstream end portion of the downstream cooling fin 15. Thereby, the pressure loss generated when the liquid refrigerant flows out of the downstream refrigerant flow path 17 can be reduced.

  In the present embodiment described above, a plurality of upstream cooling fins 14 and a plurality of downstream cooling fins 15 are installed immediately below the heating element 30 to form a plurality of upstream refrigerant channels 16 and downstream refrigerant channels 17 respectively. Thus, the heating element 30 can be cooled uniformly. Further, the communication flow path 18 facing the back surface 12b of the cooling plate 12 is formed directly below the heating element 30, so that the refrigerant flowing through the communication flow path 18 collides with the back surface 12b of the cooling plate 12, and heat with the cooling plate 12 is reached. Exchange can be promoted.

  In the present embodiment, the area of the cross section perpendicular to the refrigerant flow direction in the upstream cooling fin 14 is gradually reduced from the downstream side to the upstream side in the refrigerant flow direction, so that the refrigerant flow is from the refrigerant inlet 36. The refrigerant flow can be prevented from peeling from the fin wall surface when flowing into the upstream refrigerant flow path 16, and the occurrence of a stagnation region in the vicinity of the upstream end of the upstream cooling fin 14 can be suppressed. Can do. Therefore, it is possible to reduce the pressure loss that occurs when the liquid refrigerant flows into the upstream refrigerant flow path 16. In the present embodiment, the area of the cross section perpendicular to the refrigerant flow direction in the downstream cooling fins 15 is gradually decreased from the upstream side to the downstream side in the refrigerant flow direction, so that the refrigerant flow is in the downstream refrigerant flow path. When the refrigerant flows out from the refrigerant outlet 46 to the refrigerant outlet 46, it is possible to suppress the occurrence of a stagnation region in the vicinity of the downstream end of the downstream cooling fin 15, and when the liquid refrigerant flows out from the downstream refrigerant flow path 17. Can be reduced.

  In the present embodiment, the upstream side inclined portion 26 (upstream side inclined surface 26 a) is gradually increased from the upstream side refrigerant flow path 16 toward the communication flow path 18, so that the refrigerant flow becomes the upstream side refrigerant. When the flow path 16 flows into the communication flow path 18, it is possible to suppress the occurrence of a stagnation region in the flow path 28 between the partition plates 20-1 and 20-2, and the liquid refrigerant flows into the upstream side refrigerant flow path. It is possible to reduce the pressure loss that occurs when the gas flows from 16 into the communication flow path 18. Furthermore, the flow rate of the refrigerant that collides with the back surface 12b of the cooling plate 12 can be increased, and heat exchange with the cooling plate 12 can be further promoted. Further, in the present embodiment, the refrigerant flow is reduced by gradually decreasing the height of the downstream inclined portion 27 (downstream inclined surface 27a) from the communication flow path 18 toward the downstream refrigerant flow path 17. It is possible to suppress the occurrence of a stagnation region in the flow path 29 between the partition plates 20-1 and 20-2 when flowing out from the downstream refrigerant flow path 17 from 18, so that the liquid refrigerant flows from the communication flow path 18. It is possible to reduce pressure loss that occurs when the refrigerant flows out to the downstream side refrigerant flow path 17.

  Therefore, according to this embodiment, the cooling capacity can be improved while reducing the pressure loss of the refrigerant.

  In this embodiment, in order to further reduce the pressure loss that occurs when the refrigerant flows from the upstream refrigerant flow path 16 to the communication flow path 18, the flow path cross-sectional area of the inlet portion of the upstream refrigerant flow path 16 is reduced. The flow path cross-sectional area of the pair of communication flow paths 18 communicating with the upstream refrigerant flow path 16 (the refrigerant from the upstream refrigerant flow path 16 is supplied) may be equal (or substantially equal). preferable. Further, as shown in FIGS. 7 and 8A to 8C, the upstream side refrigerant flow path 16 and the partition plates 20-1 and 20-2 are arranged so that the areas in the cross sections orthogonal to the refrigerant flow lines 31A to 31C are substantially constant. It is preferable to design the shape of the flow path 28 and the communication flow path 18 (the shapes of the upstream cooling fin 14, the upstream inclined portion 26, and the partition plates 20-1 and 20-2). 8A is a cross-sectional view taken along the line AA of FIG. 7 (cross-sectional view of the inlet portion of the upstream refrigerant flow path 16), FIG. 8B is a cross-sectional view taken along the line BB of FIG. 7, and FIG. CC sectional drawing (sectional drawing of the communication flow path 18) is shown. In this embodiment, in order to further reduce the pressure loss that occurs when the refrigerant flows from the communication flow path 18 to the downstream refrigerant flow path 17, the flow path cross-sectional area of the outlet portion of the downstream refrigerant flow path 17 is set. It is preferable that the flow rate is equal to (or substantially equal to) the sum of the cross-sectional areas of the pair of communication flow paths 18 communicating with the downstream refrigerant flow path 17 (supplying refrigerant to the downstream refrigerant flow path 17). Further, as shown in FIGS. 7 and 8C to 8E, between the communication flow path 18 and the partition plates 20-1 and 20-2 so that the area in the cross section orthogonal to the coolant flow lines 31C to 31E is substantially constant. It is preferable to design the shape of the flow path 29 and the downstream refrigerant flow path 17 (the shape of the downstream cooling fin 15, the downstream inclined portion 27, and the partition plates 20-1 and 20-2). Here, FIG. 8D shows a DD sectional view of FIG. 7, and FIG. 8E shows an EE sectional view of FIG. 7 (a sectional view of the outlet portion of the downstream refrigerant flow path 17). Here, the streamlines 31A to 31E represent design streamlines.

  Next, another configuration example of this embodiment will be described.

  In the present embodiment, the height of the partition plates 20-1 and 20-2 (height of the communication flow path 18) does not necessarily have to be constant from one end to the other end, for example, as shown in FIGS. As described above, the height of the communication channel 18 can be changed from one end to the other end by changing the height of the partition plates 20-1 and 20-2 from the one end to the other end. For example, as shown in FIGS. 12 and 13, a part of the partition plates 20-1 and 20-2 is brought into contact with the back surface 12 b of the cooling plate 12 to divide the communication flow path 18 into a plurality of flow paths. It is also possible to do. In that case, the divided flow paths do not necessarily have the same shape.

  In the present embodiment, the shape of the upstream inclined surface 26a of the upstream inclined portion 26 is not necessarily a flat surface. For example, as shown in FIG. 10, the shape of the upstream inclined surface 26a is a curved surface (concave surface). Alternatively, for example, as shown in FIGS. 12 and 13, the shape of the upstream inclined surface 26a may be bent stepwise. Further, for example, as shown in FIG. 9, it is not always necessary to provide the upstream inclined portion 26 from the inlet portion of the upstream refrigerant flow path 16 (upstream tip portion of the upstream cooling fin 14). For example, as shown in FIGS. 9 and 12, the height of the downstream end of the upstream inclined portion 26 (upstream inclined surface 26a) is not necessarily equal to the height of the partition plates 20-1 and 20-2. Absent. Similarly, the shape of the downstream inclined surface 27a of the downstream inclined portion 27 is not necessarily a flat surface. For example, the shape of the downstream inclined surface 27a can be a curved surface (concave surface), or the downstream inclined surface can be inclined. The shape of the surface 27a may be bent in a stepwise manner. Further, it is not always necessary to provide the downstream inclined portion 27 to the outlet portion of the downstream refrigerant flow path 17 (downstream tip portion of the downstream cooling fin 15), and upstream of the downstream inclined portion 27 (downstream inclined surface 27a). The height of the side end portion is not necessarily equal to the height of the partition plates 20-1 and 20-2.

  Moreover, in this embodiment, as shown, for example in FIG. 14, 15, the connection surface 14a of the partition plates 20-1 and 20-2 and the upstream cooling fin 14, and the partition plates 20-1 and 20-2 and the downstream The connection surface 15a with the side cooling fin 15 does not necessarily have to be parallel to the fin thickness direction. In the example shown in FIG. 14, the connection surface 14 a between the partition plates 20-1 and 20-2 and the upstream cooling fin 14 and the connection surface 15 a between the partition plates 20-1 and 20-2 and the downstream cooling fin 15 are provided. It is inclined along the refrigerant flow. For example, as shown in FIG. 15, the connection surface 14 a between the partition plates 20-1 and 20-2 and the upstream cooling fin 14, and the connection between the partition plates 20-1 and 20-2 and the downstream cooling fin 15. It is also possible to make the surface 15a a curved surface along the refrigerant flow.

  Further, in the present embodiment, the shape of the upstream cooling fin 14 is not necessarily an acute wedge shape. For example, as shown in FIG. 16, the shape of the upstream tip portion of the upstream cooling fin 14 is a convex curved surface shape. It can also be. Similarly, the shape of the downstream side cooling fin 15 is not necessarily an acute wedge shape. For example, as shown in FIG. 16, the shape of the downstream end of the downstream side cooling fin 15 may be a convex curved surface. it can. Further, for example, as shown in FIG. 17, the shape of the upstream end of the upstream cooling fin 14 can be a convex curved surface, and the shape of the downstream cooling fin 15 can be a wedge shape. Similarly, the shape of the upstream side cooling fin 14 can be a wedge shape, and the shape of the downstream end portion of the downstream side cooling fin 15 can be a convex curved surface.

  Moreover, in this embodiment, as shown, for example in FIG. 18, the shape of the upstream side cooling fin 14 and the shape of the downstream side cooling fin 15 can also be made into a thin plate shape. In the configuration example shown in FIG. 18, compared to the configuration examples shown in FIGS. 1 to 4, the pair of partition plates 20-1 and 20-2 connected to the upstream cooling fins 14 are connected to the upstream cooling fins 14. Are connected to each other at (or near) the connecting portions. And the downstream edge part of the thin plate-shaped upstream cooling fin 14 extended along a refrigerant | coolant flow direction is connected with the coupling | bond part (or its vicinity) of partition plates 20-1 and 20-2. Even with this configuration, it is possible to suppress the separation of the refrigerant flow from the fin wall surface when the refrigerant flow flows into the upstream refrigerant flow path 16 from the refrigerant inlet 36, and the upstream end of the upstream cooling fin 14. Occurrence of a stagnation area in the vicinity can be suppressed. Therefore, it is possible to reduce the pressure loss that occurs when the liquid refrigerant flows into the upstream refrigerant flow path 16. Further, in the configuration example shown in FIG. 18, the pair of partition plates 20-1 and 20-2 connected to the downstream side cooling fin 15 are connected to each other at the connection portion (or the vicinity thereof) with the downstream side cooling fin 15. Are combined. And the upstream edge part of the downstream cooling fin 15 of the thin-plate shape extended along a refrigerant | coolant flow direction is connected with the coupling | bond part (or its vicinity) of partition plates 20-1 and 20-2. Even with this configuration, it is possible to suppress the occurrence of a stagnation region near the downstream end of the downstream cooling fin 15 when the refrigerant flow flows out from the downstream refrigerant flow path 17 to the refrigerant outlet 46. The pressure loss that occurs when the liquid refrigerant flows out of the downstream refrigerant flow path 17 can be reduced. In the present embodiment, the shape of the upstream cooling fin 14 is a thin plate as shown in FIG. 18, for example, and the shape of the downstream end of the downstream cooling fin 15 is a wedge shape shown in FIG. 1 or FIG. A convex curved surface shape can also be used. Similarly, the upstream tip of the upstream cooling fin 14 has a wedge shape as shown in FIG. 1 or a convex curved shape as shown in FIG. 16, and the downstream cooling fin 15 has a thin plate shape as shown in FIG. You can also

  In the present embodiment, for example, as shown in FIG. 19, the flow width of the upstream refrigerant flow channel 16 (interval between the upstream cooling fins 14) can be varied according to the position in the fin thickness direction. . In that case, it is preferable to narrow the flow path width (interval between the upstream cooling fins 14) of the upstream refrigerant flow path 16 located on the back side (directly below) of the region where the heat generation amount of the heating element 30 is large. Similarly, the flow width of the downstream refrigerant flow channel 17 (interval between the downstream cooling fins 15) can be varied according to the position in the fin thickness direction. In that case, it is preferable to narrow the flow path width (interval between the downstream cooling fins 15) of the downstream refrigerant flow path 17 located on the back side (directly below) of the region where the heat generation amount of the heating element 30 is large. FIG. 19 shows an example in which the shape of the upstream cooling fin 14 and the shape of the downstream cooling fin 15 are thin plate shapes, but the shape of the upstream tip portion of the upstream cooling fin 14 is shown in FIG. The wedge shape or the convex curved surface shape shown in FIG. 16 can be used, and the downstream tip portion of the downstream cooling fin 15 can be the wedge shape shown in FIG. 1 or the convex curved surface shape shown in FIG.

  In the present embodiment, for example, as shown in FIGS. 20 and 21, the upstream side refrigerant flow path 16, the communication flow path 18, and the downstream side refrigerant flow path 17 are provided between the refrigerant inlet 36 and the refrigerant outlet 46. The refrigerant flow path can be formed in multiple stages. In that case, the shape of the refrigerant flow path by the upstream refrigerant flow path 16, the communication flow path 18, and the downstream refrigerant flow path 17 is not necessarily the same shape, and the back side of the region where the heat generation amount of the heating element 30 is large. It is preferable to make the shapes of the upstream refrigerant flow path 16, the communication flow path 18, and the downstream refrigerant flow path 17 positioned (directly below) fine.

  Further, in the present embodiment, for example, as shown in FIGS. 22 and 23, the partition plates 20-1 and 20-2 that connect the upstream cooling fins 14 and the downstream cooling fins 15 cross each other, so that the refrigerant flow The roads can overlap each other.

  24 and 25 show the results of confirming the operation of the cooling device 10 according to the present embodiment by heat flow analysis. In the heat flow analysis, the heat flow analysis was performed as a comparative example of the operation of the configuration using only the linear cooling fins. FIG. 24A shows the refrigerant flow velocity distribution in the comparative example, and FIG. 24B shows the refrigerant flow velocity distribution in the cooling device 10 according to the present embodiment. FIG. 25A shows the temperature distribution in the comparative example, and FIG. 25B shows the temperature distribution in the cooling device 10 according to the present embodiment. As shown in FIG. 24, according to the cooling device 10 according to the present embodiment, it can be seen that the flow rate of the refrigerant immediately below the heating element 30 can be increased as compared with the comparative example.

  As mentioned above, although the form for implementing this invention was demonstrated, this invention is not limited to such embodiment at all, and it can implement with a various form in the range which does not deviate from the summary of this invention. Of course.

It is a figure which shows schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure explaining the flow of the refrigerant in the cooling device concerning the embodiment of the present invention. It is a figure explaining the flow of the refrigerant in the cooling device concerning the embodiment of the present invention. It is a figure which shows schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the cooling device which concerns on embodiment of this invention. It is a figure which shows the result of having confirmed the flow velocity distribution of the refrigerant | coolant in the cooling device which concerns on this embodiment by heat flow analysis. It is a figure which shows the result which confirmed the temperature distribution in the cooling device which concerns on this embodiment by heat flow analysis. It is a figure which shows schematic structure of the cooling device which concerns on related technology.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Cooling device, 12 Cooling plate, 14 Upstream cooling fin, 15 Downstream cooling fin, 16 Upstream refrigerant flow path, 17 Downstream refrigerant flow path, 18 Communication flow path, 20-1, 20-2 Partition plate, 22 Bottom plate, 24 side plate, 26 upstream inclined portion, 27 downstream inclined portion, 30 heating element, 36 refrigerant inlet, 46 refrigerant outlet.

Claims (11)

A cooling plate on which a heating element is placed on one main surface;
A bottom member disposed opposite to the back surface of one main surface of the cooling plate at an interval, and a coolant channel is formed between the back surface of the cooling plate;
A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other, wherein an upstream refrigerant flow path is formed between the adjacent upstream cooling fins. Fins,
A plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at a distance from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins, and downstream between adjacent downstream cooling fins A plurality of downstream cooling fins in which a refrigerant flow path is formed;
A plurality of partition plates arranged in a standing state on the bottom member and connecting the upstream side cooling fin and the downstream side cooling fin, the communication flow connecting the upstream side refrigerant channel and the downstream side refrigerant channel. A plurality of partition plates formed between the back surface of the cooling plate and the path;
With
At least some of the upstream cooling fins are connected to a partition plate that gradually increases in distance from the upstream cooling fins toward the downstream cooling fins,
At least some of the downstream cooling fins are connected to a partition plate that gradually increases in distance from the downstream cooling fins toward the upstream cooling fins,
The upstream side cooling fin connected to the partition plate is a cooling device in which the area of the cross section perpendicular to the refrigerant flow direction is gradually reduced from the downstream side to the upstream side in the refrigerant flow direction. A cooling plate on which a heating element is placed on one main surface;
A bottom member disposed opposite to the back surface of one main surface of the cooling plate at an interval, and a coolant channel is formed between the back surface of the cooling plate;
A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other, wherein an upstream refrigerant flow path is formed between the adjacent upstream cooling fins. Fins,
A plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at a distance from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins, and downstream between adjacent downstream cooling fins A plurality of downstream cooling fins in which a refrigerant flow path is formed;
A plurality of partition plates arranged in a standing state on the bottom member and connecting the upstream side cooling fin and the downstream side cooling fin, the communication flow connecting the upstream side refrigerant channel and the downstream side refrigerant channel. A plurality of partition plates formed between the back surface of the cooling plate and the path;
With
At least some of the upstream cooling fins are connected to a partition plate that gradually increases in distance from the upstream cooling fins toward the downstream cooling fins,
At least some of the downstream cooling fins are connected to a partition plate that gradually increases in distance from the downstream cooling fins toward the upstream cooling fins,
The partition plates connected to the upstream cooling fins are coupled to each other at or near the connection portion with the upstream cooling fin,
The upstream cooling fin to which the partition plate is connected is a cooling device that is a thin plate-shaped fin. The cooling device according to claim 1 or 2,
The downstream cooling fin to which the partition plate is coupled is a cooling device in which an area of a cross section perpendicular to the refrigerant flow direction is gradually decreased from the upstream side to the downstream side in the refrigerant flow direction. The cooling device according to claim 1 or 2,
The partition plates connected to the downstream cooling fins are coupled to each other at or near the connection portion with the downstream cooling fins,
The downstream side cooling fin to which the partition plate is connected is a cooling device that is a thin plate-shaped fin. A cooling plate on which a heating element is placed on one main surface;
A bottom member disposed opposite to the back surface of one main surface of the cooling plate at an interval, and a coolant channel is formed between the back surface of the cooling plate;
A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other, wherein an upstream refrigerant flow path is formed between the adjacent upstream cooling fins. Fins,
A plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at a distance from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins, and downstream between adjacent downstream cooling fins A plurality of downstream cooling fins in which a refrigerant flow path is formed;
A plurality of partition plates arranged in a standing state on the bottom member and connecting the upstream side cooling fin and the downstream side cooling fin, the communication flow connecting the upstream side refrigerant channel and the downstream side refrigerant channel. A plurality of partition plates formed between the back surface of the cooling plate and the path;
With
At least some of the upstream cooling fins are connected to a partition plate that gradually increases in distance from the upstream cooling fins toward the downstream cooling fins,
At least some of the downstream cooling fins are connected to a partition plate that gradually increases in distance from the downstream cooling fins toward the upstream cooling fins,
The downstream cooling fin to which the partition plate is coupled is a cooling device in which an area of a cross section perpendicular to the refrigerant flow direction is gradually decreased from the upstream side to the downstream side in the refrigerant flow direction. A cooling plate on which a heating element is placed on one main surface;
A bottom member disposed opposite to the back surface of one main surface of the cooling plate at an interval, and a coolant channel is formed between the back surface of the cooling plate;
A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other, wherein an upstream refrigerant flow path is formed between the adjacent upstream cooling fins. Fins,
A plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at a distance from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins, and downstream between adjacent downstream cooling fins A plurality of downstream cooling fins in which a refrigerant flow path is formed;
A plurality of partition plates arranged in a standing state on the bottom member and connecting the upstream side cooling fin and the downstream side cooling fin, the communication flow connecting the upstream side refrigerant channel and the downstream side refrigerant channel. A plurality of partition plates formed between the back surface of the cooling plate and the path;
With
At least some of the upstream cooling fins are connected to a partition plate that gradually increases in distance from the upstream cooling fins toward the downstream cooling fins,
At least some of the downstream cooling fins are connected to a partition plate that gradually increases in distance from the downstream cooling fins toward the upstream cooling fins,
The partition plates connected to the downstream cooling fins are coupled to each other at or near the connection portion with the downstream cooling fins,
The downstream side cooling fin to which the partition plate is connected is a cooling device that is a thin plate-shaped fin. The cooling device according to any one of claims 1 to 6,
The cooling device, wherein the bottom member is provided with an upstream inclined portion in which the distance from the back surface of the cooling plate gradually decreases as it goes from the upstream refrigerant flow path to the communication flow path. The cooling device according to any one of claims 1 to 7,
The cooling device, wherein the bottom member is provided with a downstream inclined portion in which the distance from the back surface of the cooling plate gradually increases as it goes from the communication channel to the downstream refrigerant channel. A cooling plate on which a heating element is placed on one main surface;
A bottom member disposed opposite to the back surface of one main surface of the cooling plate at an interval, and a coolant channel is formed between the back surface of the cooling plate;
A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other, wherein an upstream refrigerant flow path is formed between the adjacent upstream cooling fins. Fins,
A plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at a distance from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins, and downstream between adjacent downstream cooling fins A plurality of downstream cooling fins in which a refrigerant flow path is formed;
A plurality of partition plates arranged in a standing state on the bottom member and connecting the upstream side cooling fin and the downstream side cooling fin, the communication flow connecting the upstream side refrigerant channel and the downstream side refrigerant channel. A plurality of partition plates formed between the back surface of the cooling plate and the path;
With
At least some of the upstream cooling fins are connected to a partition plate that gradually increases in distance from the upstream cooling fins toward the downstream cooling fins,
At least some of the downstream cooling fins are connected to a partition plate that gradually increases in distance from the downstream cooling fins toward the upstream cooling fins,
The cooling device, wherein the bottom member is provided with an upstream inclined portion in which the distance from the back surface of the cooling plate gradually decreases as it goes from the upstream refrigerant flow path to the communication flow path. The cooling device according to claim 9,
The cooling device, wherein the bottom member is provided with a downstream inclined portion in which the distance from the back surface of the cooling plate gradually increases as it goes from the communication channel to the downstream refrigerant channel. A cooling plate on which a heating element is placed on one main surface;
A bottom member disposed opposite to the back surface of one main surface of the cooling plate at an interval, and a coolant channel is formed between the back surface of the cooling plate;
A plurality of upstream cooling fins standing on the back surface of the cooling plate and arranged at intervals from each other, wherein an upstream refrigerant flow path is formed between the adjacent upstream cooling fins. Fins,
A plurality of downstream cooling fins standing on the back surface of the cooling plate and arranged at a distance from each other in a direction substantially parallel to the arrangement direction of the upstream cooling fins, and downstream between adjacent downstream cooling fins A plurality of downstream cooling fins in which a refrigerant flow path is formed;
A plurality of partition plates arranged in a standing state on the bottom member and connecting the upstream side cooling fin and the downstream side cooling fin, the communication flow connecting the upstream side refrigerant channel and the downstream side refrigerant channel. A plurality of partition plates formed between the back surface of the cooling plate and the path;
With
At least some of the upstream cooling fins are connected to a partition plate that gradually increases in distance from the upstream cooling fins toward the downstream cooling fins,
At least some of the downstream cooling fins are connected to a partition plate that gradually increases in distance from the downstream cooling fins toward the upstream cooling fins,
The cooling device, wherein the bottom member is provided with a downstream inclined portion in which the distance from the back surface of the cooling plate gradually increases as it goes from the communication channel to the downstream refrigerant channel.

Images