JP2009220351A - Pattern forming body and duplication method using same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the first pattern forming material and the second pattern forming material both capable of giving an electroformable resin pattern, and to provide a pattern forming body using the pattern formaing materials. <P>SOLUTION: In the pattern forming body transferring a recessed pattern or a protrusive pattern of the first metallic original pattern and composed of the pattern forming material or in a duplication method of forming the second metallic original pattern using the pattern forming body, the pattern forming body comprises the first layer and the second layer, the first layer is composed of the first pattern forming material of a composition of an epoxide compound and an optical cationic-polymerization initiator, and the second layer is composed of the second pattern forming material of a composition of an epoxide resin and an epoxy resin curing agent. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a pattern formed body capable of reproducing a concave and / or convex pattern formed on a metal surface with high accuracy, and particularly an intaglio original plate that is good even when immersed in an electroforming liquid for duplicating an intaglio plate surface. The present invention relates to a two-layer pattern forming body that can be manufactured.

In general, in order to produce an intaglio plate surface used for printing, a metal plate is first formed by forming an intaglio image line (hereinafter referred to as “concave pattern”) by a manual method or mechanical engraving. An original plate (hereinafter referred to as “first metal original plate”) is produced. Copying the concave pattern of the first metal original plate to produce a duplicated plate (hereinafter referred to as “pattern forming body”), and further copying the convex pattern of the pattern forming body to form a concave pattern. After a metal original plate (hereinafter referred to as “second metal original plate”) is produced, the second metal original plate is multifaceted according to the number of printing surfaces to form a multifaceted printing plate surface for intaglio printing. The reason for producing a duplicate plate and a second metal plate from this first metal plate is that if the first metal plate is damaged during the copying or working process and cannot be used again, the first metal plate and Since it is necessary to prepare a similar metal original, it takes a lot of time and labor, and it is extremely difficult to reproduce the same concave pattern as that of the first metal original. A second metal master is produced and used for replication or work processes. Therefore, the first metal original is strictly stored as the only metal original without being repeatedly used when the second metal original is produced. Therefore, it is important how the first and second metal original plates can be reproduced and duplicated in a safe and stable manner with the same concave pattern. A person skilled in the art sometimes refers to the first metal original plate as an “intaglio original plate” and the second metal original plate as an “intaglio sub original plate”.

The step of producing the pattern forming body from the first metal original plate is to first transfer the concave pattern (intaglio image line) of the first metal original plate to obtain the pattern forming body. Then, the uneven shape is reversed. Conventionally, as a method of forming a two-layer structure using a UV curable resin for a pattern forming body, a method for producing a mold for producing a resin plate for transferring an uneven shape formed on a recording surface to a resin plate, After forming the resin layer that forms the resin layer on the recording surface of the master with the irregular shape formed, a reinforcing layer made of glass or ceramic is formed on the back surface of the formed resin layer to increase the mechanical strength of the resin layer. There is a method of increasing the height (for example, see Patent Document 1).

In addition, there is a method for preventing warpage or deformation of the resin plate and increasing the mechanical strength of the resin plate by forming a composite layer of metal and ceramic on the back surface of the thermosetting layer (for example, Patent Documents). 2).

JP 11-39732 A JP 58-3821

  However, in the method of Patent Document 1, when the transfer plate (nickel or the like) is peeled from the first metal original plate (generally a copper plate), the metal-to-metal adhesion is high, so that peeling becomes difficult and the original plate may be damaged. There is. In addition, since the back surface is ceramic or the like, there is a possibility that deformation, warpage or the like may occur due to internal stress of the electroforming liquid at the time of producing the second metal original plate.

Moreover, since the method of patent document 2 uses the thermosetting resin for formation of the resin layer which transcribe | transfers the fine pattern of the 1st metal original plate, in the reproducibility of the fine pattern of the 1st metal original plate. There is a risk of calling.

The present invention provides a pattern forming body for transferring a concave pattern or a convex pattern of a first metal original plate, wherein the pattern forming body is a second layer for reinforcing the first layer and the first layer for transferring the concave pattern or the convex pattern. The first layer is composed of a pattern forming material composed of an epoxy compound and a photocationic polymerization initiator, and the second layer is composed of an epoxy resin and an epoxy resin curing agent. The pattern forming body is characterized by comprising a reinforcing material.

The pattern forming material in the first layer of the present invention comprises 50% of polybutadiene epoxidized in liquid form at 30 ° C. and an alicyclic epoxy compound having an epoxy equivalent of 150 g / eq or more based on the entire pattern forming material. A pattern forming body comprising the composition contained above and a photocationic polymerization initiator, wherein the ratio of the polybutadiene epoxidized product and the alicyclic epoxy compound is in the range of 10:90 to 60:40.

Further, the pattern forming material in the first layer of the present invention is a composition containing two or more epoxy groups in one molecule and containing 40% or more of an epoxy compound containing a cyclic structure and a photocationic polymerization initiator. This is a featured pattern forming material.

The pattern forming material in the first layer of the present invention has two epoxy groups in one molecule, and the cyclic structure of an epoxy compound containing a cyclic structure is bisphenol A type, bisphenol F type, hydrogenated bisphenol A type. It is a pattern formation body characterized by being 1 or more types selected from.

The pattern forming material of the first layer of the present invention is characterized in that the viscosity at 30 ° C. is 20 Pa · s or less.

The reinforcing material in the second layer of the present invention is a pattern forming body characterized in that the viscosity at 30 ° C. is 20 Pa · s or less.

Moreover, the epoxy resin curing agent of the reinforcing material in the second layer of the present invention is an amine-based curing agent.

Moreover, this invention is 1 mm-6 mm in thickness of a 1st layer, and the thickness of a 2nd layer is 1 mm-4 mm, It is a pattern formation body characterized by the above-mentioned.

The present invention also includes a first layer forming step of forming a first layer of the pattern forming layer on the first metal original plate on which the concave pattern or the convex pattern is formed, and irradiation with ultraviolet rays from the pattern forming layer side. A first layer curing step by heating at room temperature to a temperature of 60 ° C. or less, a second layer forming step of forming a second layer of the pattern forming layer, and a heating at a temperature of room temperature to 60 ° C. or less. The second layer curing step, the pattern forming body peeling step for peeling the pattern forming body from the first metal original plate, and the pattern side of the peeled pattern forming body on the pattern side where the concave pattern and / or the convex pattern is transferred. Conductive layer forming step for electroless plating, electroformed layer forming step for forming an electroformed layer by electroforming, and by removing the electroformed layer from the pattern forming body, the concave pattern of the first metal original plate And / or convex Pattern is replicated second method replication second metal precursor to the electroformed layer peeling step to obtain a metal precursor, comprising the.

The pattern forming body of the present invention is a pattern forming body for molding used to replicate a concave pattern and / or a convex pattern formed on the surface of a metal plate, and is composed of two layers. It has excellent durability against peeling in the process, does not generate warpage with respect to the internal stress of the electroforming liquid during the production of the second metal original plate, and has good reproducibility of the concave pattern. In addition, the pattern forming body of the present invention is not limited to the concave pattern formed on the metal plate, and the pattern reproducibility is good even if it is a convex pattern or an uneven shape. The convex pattern refers to a relief image line used for relief printing.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, the present invention is not limited to the best mode for carrying out the invention described below, and various other embodiments are included within the scope of the technical idea described in the scope of claims. . In this embodiment, the metal plate surface used for intaglio printing is exemplified by duplication. However, other printing methods such as relief printing, holograms in other fields, concave shapes formed on metal plates such as CDs or semiconductors, and / or convex shapes. It can also be applied to the duplication.

(Configuration of pattern forming body)
A first metal original plate 1 shown in FIG. 1 is a one-sided intaglio original plate used for intaglio printing, and serves as a basis for a multi-sided intaglio plate surface to be a printing plate. Moreover, it was a copper plate and the concave pattern 1 was provided by the well-known corrosion method. The concave pattern 1 may be a manual method or mechanical engraving.

The concave pattern 1p, which is the intaglio image line of the first metal original plate 1, is transferred to the first layer 2a of the pattern forming body 2 to form the convex pattern 2p. The pattern forming body 2 has a two-layer structure in which the second layer 2b is laminated on the first layer 2a, and the composition is a feature of the configuration in the present invention.

The reason why the pattern forming body 2 is composed of the first layer 2a and the second layer 2b is that the first layer 2a has a function of transferring the shape of the concave pattern 1P in the first metal original plate 1 with high accuracy. On the other hand, the second layer 2b has a function of reinforcing against stress at the time of peeling or electroforming of the pattern forming body 2 in the process of obtaining the second metal original plate, and the first layer 2a and the second layer 2b The purpose is to add different functions.

The thickness of the first layer 2a can be selected according to the image line depth of the concave pattern 1P, but is preferably 1 to 6 mm. The reason why the thickness of the first layer 2a is 1 mm or more is that the depth of the image of the concave pattern 1P when used for intaglio printing is 0.1 mm at the maximum, which is larger than that of a semiconductor or CD stamper (metal original plate). This is because the thickness is required. The reason why the thickness of the first layer 2a is 6 mm or less is to avoid poor curing in the first layer curing step due to ultraviolet rays.

In addition, as for the thickness of the 2nd layer 2b, it is desirable that it is 1-4 mm. This is because the reinforcing effect is poor when the thickness of the second layer 2b is 1 mm or less. Moreover, it is because it is not preferable when the thickness of the 2nd layer 2b is 4 mm or more in consideration of drying efficiency and economical efficiency.

(Composition 1 of the first layer 2a)
The pattern forming material to be the first layer 2a of the pattern forming body 2 of the present invention comprises a polybutadiene epoxidized liquid at 30 ° C. and an alicyclic epoxy compound having an epoxy equivalent of 150 g / eq or more with respect to the entire pattern forming material. A pattern forming material comprising a composition containing 50% or more in total and a cationic photopolymerization initiator, and the ratio of the polybutadiene epoxidized product to the alicyclic epoxy compound is in the range of 10:90 to 60:40 A pattern forming material characterized by the following.

Further, if the ratio of the polybutadiene epoxidized product and the alicyclic epoxy compound to the entire pattern forming material is 50% or more, it is possible to further blend other epoxy compounds or materials capable of cationic polymerization. The epoxy compound added additionally preferably has two or more functional groups capable of cationic polymerization.

  The epoxy equivalent of the alicyclic epoxy compound combined with the polybutadiene epoxidized product is preferably 150 g / eq. When an alicyclic epoxy compound (epoxy equivalent is less than 150 g / eq) having a small epoxy equivalent is used, it is deformed because the curing reaction is fast, and the strength is reduced due to the high crosslink density of the cured product. It is not suitable for the use of the invention. Moreover, since the higher intensity | strength is obtained, the one where a polybutadiene epoxidized material has a larger molecular weight is preferable.

Moreover, it is preferable that the ratio of a polybutadiene epoxidized material exists in the range of 10 to 60% with respect to the total amount of a polybutadiene epoxidized material and an alicyclic epoxy compound. When the polybutadiene epoxidized product is less than 10%, the UV curability is lowered and the peelability from the first metal original plate is deteriorated. Further, when the polybutadiene epoxidized product exceeds 60%, the viscosity becomes too high, so that workability is deteriorated and a long time is required for removing bubbles in the pattern forming material before curing.
Next, Table 1 is used to verify the blending ratio of the polybutadiene epoxidized product and the alicyclic epoxy compound.

Table 1 shows the defoaming property under vacuum (at room temperature of 25 to 30 ° C.) at each blending ratio of the polybutadiene epoxidized product and the alicyclic epoxy compound. It is verification about the peelability from the first metal original plate later. The evaluation criteria were as follows.
○: Good ×: Bad

In Formulation Example 1, the ratio of the polybutadiene epoxidized product to the alicyclic epoxy compound is 15:85. In Formulation Example 1, all of the defoaming property, curability and peelability were good.

In Formulation Example 2, the ratio of the polybutadiene epoxidized product to the alicyclic epoxy compound is 55:45. In Formulation Example 2, as in Formulation Example 1, all of the defoaming property, curability and peelability were good.

In blending example 3, the ratio of the polybutadiene epoxidized product to the alicyclic epoxy compound is 5:95. In Formulation Example 3, the defoaming property was good, but the curing of the resin was poor compared to Formulation Example 1 and Formulation Example 2, and peeling from the first metal original plate was difficult.

In Formulation Example 4, the ratio of the polybutadiene epoxidized product to the alicyclic epoxy compound is 65:35. In Formulation Example 4, the viscosity of Formulation Examples 1, 2, and 3 was 19 Pa · s at 30 ° C., whereas it was difficult to defoam because the viscosity at 30 ° C. was 29 Pa · s. .

(Composition 2 of the first layer)
The pattern forming material to be the first layer 2a of the other pattern forming body 2 has an epoxy composition containing two or more epoxy groups in one molecule and containing 40% or more of an epoxy compound containing a cyclic structure, and light. A pattern forming material comprising a cationic polymerization initiator. When only one epoxy group is contained in one molecule, the surface of the cured pattern forming material layer becomes rough during electroless plating, and a uniform plating film cannot be obtained. Moreover, in the case of the composition which has as a main component the epoxy resin which has 3 or more of epoxy groups in 1 molecule, hardened | cured material becomes weak and it becomes easy to break when peeling from a 1st metal original plate.

Further, the proportion of the epoxy compound having two epoxy groups in one molecule and including the cyclic structure in the entire pattern forming material may be 40% or more, and another epoxy compound or a material capable of cationic polymerization may be further added. Additional blending is also possible. The additionally compounded epoxy compound or cationically polymerizable material preferably has two or more functional groups capable of cationic polymerization in view of stability during electroless plating. The epoxy compound added additionally includes an alicyclic epoxy compound, but there is no limitation on the epoxy equivalent, and an alicyclic epoxy compound having an epoxy equivalent of 150 g / eq or less can also be used.

  Moreover, the cyclic structure of the epoxy compound having two or more epoxy groups in one molecule and including a cyclic structure is one or more selected from bisphenol A type, bisphenol F type or hydrogenated bisphenol A type, and includes a plurality It may be. By using bisphenol A type, bisphenol F type or hydrogenated bisphenol A type, a cured product without deformation can be obtained.

The pattern forming material of the first layer 2a preferably has a viscosity at 30 ° C. of 20 Pa · s or less, more preferably 4 Pa · s or less, in consideration of the removal of bubbles in the pattern forming material before curing. This is because when the viscosity at 30 ° C. is 20 Pa · s or more, it is difficult to remove bubbles in the pattern forming material before curing.

  A photoinitiator will not be limited if it can absorb an ultraviolet-ray and can start the cationic polymerization of an epoxy functional group. An example is an aromatic sulfonium salt. The addition amount of the photopolymerization initiator to the pattern forming material is preferably 0.1 to 5%. The amount added is appropriately increased or decreased according to the thickness of the cured product. When the thickness is 4 to 5 mm, it is preferable to add in the range of 0.2 to 2% in order to reduce deformation caused by curing.

  By using the above pattern forming material for the first layer 2a, it is possible to obtain a resin plate that is free from deformation such as warpage and can be easily peeled off from the first metal original plate.

(Composition of the second layer)
The reinforcing material to be the second layer 2b of the pattern forming body 2 of the present invention preferably forms a room temperature or thermosetting resin layer using an epoxy resin and an amine curing agent. The epoxy resin is not particularly limited as long as it has a reinforcing effect, and any epoxy resin can be used, but it is preferably liquid at normal temperature, and more preferably a low-viscosity epoxy resin. This is because it is necessary to consider workability such as defoaming. Specifically, the viscosity at 30 ° C. is 20 Pa · s or less, more preferably 4 Pa · s or less. Examples of the epoxy resin having a reinforcing effect include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, and cresol novolac type epoxy resin.

As the amine-based curing agent, known ones can be used, but a low-viscosity curing agent having a pot life of 30 minutes or more at room temperature is preferable, and curing is performed at a working temperature (room temperature to 60 ° C. or less). Must be a possible curing agent. This is because it is necessary to consider workability such as defoaming. Specifically, the viscosity at 30 ° C. is 20 Pa · s or less, more preferably 4 Pa · s or less. Examples of amine-based curing agents include diethylenetriamine, triethylenetetramine, metaxylylenediamine, isophoronediamine, diaminodiphenylmethane, polyamide (dimer acid modified), ketimine (ketone modified), and thiourea modified.

(Replication process using pattern forming body)
Next, the process of replicating the first metal original plate 1 to the second metal original plate 5 with the pattern forming body of the present invention will be described with reference to the flowchart of FIG.

  As an example, as shown in FIG. 2, the steps of replicating the first metal original plate 1 to the second metal original plate 5 are the first layer forming step (S1), the first layer curing step (S2), and the second layer. Formation step (S3), second layer curing step (S4), pattern forming body peeling step (S5), conductive layer forming step (S6), electroformed layer forming step (S7), electroformed layer peeling step (S8) Standing from.

  The first layer forming step (S1) is a step of forming a first layer by pouring a photocurable pattern forming material onto the first metal original plate on which the concave pattern or the convex pattern is formed.

The first layer curing step (S2) is a step of curing the first layer by irradiating the pattern forming material poured in the first layer forming step (S1) with ultraviolet rays or the like.

  In the second layer forming step (S3), a thermosetting epoxy resin is poured onto the first layer cured in the first layer curing step (S2), and the thermosetting epoxy resin is formed on the first layer. This is a step of forming the second layer.

The second layer curing step (S4) is a step in which the thermosetting epoxy resin poured in the second layer forming step (S3) is heated to 60 ° C. or lower to cure the second layer.

A pattern formation body peeling process (S5) is a process of peeling a pattern formation body from a 1st metal original plate after hardening of a 2nd layer.

The conductive layer forming step (S6) is a step of performing electroless plating on the resin plate peeled in the pattern forming body peeling step (S5) and forming a conductive layer on the pattern side transferred from the first original plate. is there.

The electroformed layer forming step (S7) is a step of forming an electroformed layer by electroforming with respect to the conductive layer formed in the conductive layer forming step (S6).

The electroformed layer peeling step (S8) is a step of peeling the second metal original plate composed of the electroformed layer and the conductive layer formed in the electroformed layer forming step (S7) from the resin plate. Next, the process of replicating the second metal original plate 5 from the first metal original plate 1 using the pattern forming body 2 of the present invention will be specifically described with reference to FIG.

  For example, as shown to FIG. 3A, the 1st metal original plate 1 which formed the concave pattern 1P in the copper metal plate was produced.

Next, as shown in FIG. 3B, the pattern forming material to be the first layer 2a of the pattern forming body 2 of the present invention is poured into the surface of the first metal original plate 1 so as to have a thickness of about 1 to 5 mm. Defoam under reduced pressure. At this time, if the viscosity of the first layer 2a is lowered by heating appropriately, defoaming becomes easier. The pattern forming material of the present invention is photocurable and does not cause a curing reaction even when heated.

  Next, as shown in FIG. 3C, the first layer 2a is irradiated with ultraviolet rays 10 and heated to room temperature or a temperature of about 60 ° C. or less for several hours to cure the first layer 2a.

The ultraviolet irradiation device used here may be a metal halide lamp, a high-pressure mercury lamp, or the like used for curing ultraviolet curable ink, but is not particularly limited as long as it can excite the photopolymerization initiator to generate cations.

After irradiation with ultraviolet rays 10, in order to allow the cationic polymerization to proceed completely, it is allowed to stand at room temperature or heated at a temperature of 60 ° C. or lower. Since heating for 3 hours or more is necessary even at a temperature of 60 ° C., a higher temperature is preferable. However, since the alteration of the first layer 2a occurs at 70 ° C. or more, 60 ° C. or less is preferable. In order to prevent the deformation of the first layer 2a, a lower temperature is preferable. The reaction temperature and reaction time can be appropriately adjusted according to the working time.

  Next, as shown in FIG. 3D, the second layer 2 b is formed on the first layer 2 a to form the pattern forming body (layer) 2. The reinforcing material to be the second layer 2b is formed by pouring the surface of the first layer 2a to a thickness of about 1 to 4 mm and heating at a temperature of room temperature to 60 ° C. for 5 hours or more.

Next, as shown in FIG. 3E, the cured pattern forming body 2 was peeled from the first metal original plate 1. Therefore, the pattern forming body 2 is accurately formed with a convex pattern 2'a which is the reverse shape of the concave pattern 1P. Depending on the type of pattern forming material of the first layer 2a, the resin plate is peeled off from the intaglio plate surface immediately after irradiation with ultraviolet rays, and then heated at room temperature or a temperature of about 60 ° C. or lower for several hours to be completely cured. A method for forming the layer can also be selected.

Next, as shown in FIG. 3F, the conductor layer 3 is formed by conducting a conductor treatment on the convex pattern 2a side of the first layer 2a of the pattern forming body 2 by means such as known electroless plating. In addition, you may perform the hydrophilic treatment by corona discharge etc. before conducting a conductor process.

Next, as shown in FIG. 3G, the second metal original plate 5 is formed by forming the electroformed layer 4 on the conductive layer 3 by electroforming. At this time, it is desirable that the material of the conductive layer 3 and the electroformed layer 4 is the same, for example, copper or nickel is preferable, but different materials may be combined. Electroforming is a process in which a metal layer is formed on a conductive material (conducting layer 3) by electrolysis, and the concave pattern formed on the surface of the original pattern forming body 2 is accurately reversed. Since it is a method of duplicating, it can be carried out by a known method.

Next, as shown in FIG. 3H, the second metal original plate 5 is obtained by peeling from the pattern forming body 2. At this time, the concave pattern 1p of the first metal original plate 1 and the concave pattern 5p of the second metal original plate 5 had the same line width and line depth.
〔Example〕

Hereinafter, the pattern forming body 2 of the present invention will be described in detail with specific examples.

Example 1
15 parts of polybutadiene epoxidized in liquid form at 30 ° C. (Epolyde PB3600 manufactured by Daicel Chemical Industries, epoxy equivalent 190), 85 parts of alicyclic epoxy compound (Optomer KRM2199 manufactured by ADEKA, epoxy equivalent 200), photocationic polymerization initiator (Optomer SP170 manufactured by ADEKA) ) 0.5 part was mixed to prepare a pattern forming material for the first layer 2a.

The first metal original plate 1 was provided with a frame so that the pattern forming material did not flow out, the pattern forming material of the first layer 2a was poured so as to have a thickness of about 5 mm, and degassed under reduced pressure. The pattern forming body 2 was irradiated with ultraviolet light 10 having an integrated light amount of 9000 mJ / cm ² and heated at 60 ° C. for 5 hours.

Next, a reinforcing material obtained by mixing 100 parts of bisphenol F type epoxy resin (JER806 made by Japan Epoxy Resin) and 38 parts epoxy resin hardener (LV11 made by Japan Epoxy Resin) as the second layer 2b on the first layer 2a is about Poured at a thickness of 1 mm and dried at 50 ° C. for 5 hours. Thus, the first layer 2a and the second layer 2b were completely in close contact, and the pattern forming body 2 was formed.

Next, when the pattern forming body 2 was peeled off from the first metal original plate 1, a pattern forming body 2 having high reproducibility of the convex pattern 2p without warping was obtained. The pattern forming body 2 was subjected to nickel plating 3 by a known electroless plating method and nickel electroforming 4 by a known method to obtain a nickel electroforming plate (second metal original plate 5). The second metal original plate 5 replicated the first metal original plate 1 with high accuracy even in a fine image area.

(Example 2)
In the following examples, since the composition of the second layer 2b is the same as that of Example 1, only the composition of the pattern forming material of the different first layer 2a will be described. 100 parts of bisphenol F-type epoxy resin (Japan Epoxy Resin JER806, epoxy equivalent 160-170) and photocationic polymerization initiator (ADEKA Optomer SP170) 0.5 part are mixed to produce a pattern forming material for the first layer 2a. did. The subsequent steps were performed in the same manner as in Example 1 to obtain a pattern forming body 2 without warping. Further, a nickel electroforming plate (second metal original plate 5) was obtained by performing electroforming by a known method.

(Example 3)
78 parts hydrogenated bisphenol A type epoxy resin (Japan Epoxy Resin YX8034, epoxy equivalent 290), alicyclic epoxy compound (Daicel Chemical Celloxide 2021P, epoxy equivalent 130), photocationic polymerization initiator (ADEKA Optomer SP170) ) 0.5 part was mixed to prepare a pattern forming material for the first layer 2a. The subsequent steps were performed in the same manner as in Example 1 to obtain a pattern forming body 2 without warping. Furthermore, by performing electroforming by a known method, a nickel electroforming plate (second metal original plate 5) was obtained. However, the ultraviolet irradiation amount was performed with an integrated light amount of 6000 mJ / cm ² .

Example 4
44 parts hydrogenated bisphenol A type epoxy resin (Japan Epoxy Resin YX8034, epoxy equivalent 290), alicyclic epoxy compound (ADEKA Optomer KRM2199, epoxy equivalent 200), photocationic polymerization initiator (ADEKA Optomer SP170) 2 parts were mixed and the pattern formation material of the 1st layer 2a was produced. The subsequent steps were performed in the same manner as in Example 1 to obtain a pattern forming body 2 without warping. Further, a nickel electroforming plate (second metal original plate 5) was obtained by performing electroforming by a known method. However, the ultraviolet irradiation amount was performed with an integrated light amount of 12000 mJ / cm ² .

In order to compare warpage, deformation, and the like of the pattern forming body 2 made of the pattern forming material of the present invention, the composition of the first layer pattern forming material is illustrated as a comparative example. Since Comparative Example 1 to Comparative Example 3 are the same except for the pattern forming material of Example 1 and the first layer 2a, only the pattern forming material of the first layer 2a will be described.

(Comparative Example 1)
24 parts of polybutadiene epoxidized in liquid form at 30 ° C. (Epolyd PB3600 manufactured by Daicel Chemical Industries, 190 epoxy equivalent), 76 parts alicyclic epoxy compound (Celoxide 2021P manufactured by Daicel Chemical Industries, 130 epoxy equivalent), photocationic polymerization initiator (Optomer manufactured by ADEKA) SP170) 0.5 part was mixed and the pattern formation material 2 of the 1st layer 2a was produced.

A frame is provided on the first metal original plate 1 so that the pattern forming material of the first layer 2a does not flow out, the pattern forming material of the first layer 2a is poured so as to have a thickness of about 5 mm, and defoamed under reduced pressure. did. Next, the pattern forming material 2 was irradiated with ultraviolet rays having an integrated light amount of 3000 mJ / cm ² and heated at 60 ° C. for 5 hours. Next, after forming and drying the second layer 2b, the pattern forming body 2 ′ was formed and peeled, and the warpage was remarkable (3% or more).

(Comparative Example 2)
5 parts of polybutadiene epoxidized in liquid form at 30 ° C (Dacel Chemical Epolide PB3600, Epoxy equivalent 190), Alicyclic epoxy compound (ADEKA Optomer KRM2199, Epoxy equivalent 200), Photocationic polymerization initiator (ADEKA Optomer SP170) ) 0.5 part was mixed to prepare a pattern forming material for the first layer 2a.

A frame was provided on the first metal original plate 1 so that the pattern forming material did not flow out, the pattern forming material was poured to a thickness of about 5 mm, and defoamed under reduced pressure. The pattern forming material layer 2 was formed by irradiating ultraviolet rays with an integrated light amount of 12000 mJ / cm ² from the pattern forming material layer side and heating at 60 ° C. for 5 hours. An attempt was made to peel the resin plate 2 ′ from the first metal original plate 1, but it could not be peeled.

(Comparative Example 3)
65 parts of polybutadiene epoxidized in liquid form at 30 ° C (Dacel Chemical Epolide PB3600, epoxy equivalent 190), Alicyclic epoxy compound (ADEKA Optomer KRM2199, epoxy equivalent 200), Photocationic polymerization initiator (ADEKA Optomer SP170) ) 0.5 part was mixed to prepare a pattern forming material for the first layer 2a. The viscosity of this pattern forming material was 29 Pa · s at 30 ° C., 7.8 Pa · s at 50 ° C., and 4.7 Pa · s at 60 ° C.

  The first metal original plate 1 is provided with a frame so that the pattern forming material does not flow out, and the pattern forming material is poured so as to have a thickness of about 5 mm and defoamed under reduced pressure. Defoaming was necessary while heating to 60 ° C or higher, and workability was poor.

Sectional drawing of the pattern formation body of this invention The flowchart figure of the process of replicating the 2nd metal original plate (intaglio) from the 1st metal original plate (intaglio) of the present invention. Sectional drawing of the process of replicating the 2nd metal original plate (intaglio) from the 1st metal original plate (intaglio) of this invention

Explanation of symbols

1 1st metal original plate 1p concave pattern 2 pattern formation body (layer)
2a First layer 2b Second layer 2p Convex pattern 3 Conductive layer 4 Electroformed layer 5 Second metal original plate 5p Concave pattern 10 UV

Claims (9)

In the pattern forming body for transferring the concave pattern or convex pattern of the first metal original plate,
The pattern forming body comprises two layers, a first layer that transfers a concave pattern or a convex pattern, and a second layer that reinforces the first layer,
The first layer comprises a pattern forming material of a composition comprising an epoxy compound and a cationic photopolymerization initiator,
The said 2nd layer consists of a reinforcement material of the composition which consists of an epoxy resin and an epoxy resin hardening | curing agent, The pattern formation body characterized by the above-mentioned. The pattern forming material of the first layer contains 50% or more of polybutadiene epoxidized liquid at 30 ° C. and an alicyclic epoxy compound having an epoxy equivalent of 150 g / eq or more in total with respect to the entire pattern forming material. 2. The pattern formation according to claim 1, comprising: a composition comprising: a cationic photopolymerization initiator, wherein the ratio of the polybutadiene epoxidized product to the alicyclic epoxy compound is in the range of 10:90 to 60:40. body. The pattern forming material of the first layer is a composition containing two or more epoxy groups in one molecule and containing 40% or more of an epoxy compound containing a cyclic structure, and a photocationic polymerization initiator. The pattern forming body according to claim 1. The pattern forming material of the first layer has two epoxy groups in one molecule, and the cyclic structure of an epoxy compound including a cyclic structure is selected from bisphenol A type, bisphenol F type, and hydrogenated bisphenol A type. The pattern forming body according to claim 3, wherein the pattern forming body is one or more. 5. The pattern forming body according to claim 1, wherein the pattern forming material of the first layer has a viscosity at 30 ° C. of 20 Pa · s or less. The pattern forming body according to claim 1, wherein the reinforcing material of the second layer has a viscosity at 30 ° C. of 20 Pa · s or less. The pattern forming body according to claim 1, wherein the epoxy resin curing agent in the reinforcing material of the second layer is an amine-based curing agent. The pattern forming body according to any one of claims 1 to 6, wherein the first layer has a thickness of 1 mm to 6 mm and the second layer has a thickness of 1 mm to 4 mm. A first layer forming step of forming the first layer of the pattern forming layer according to any one of claims 1 to 5 on a first metal original plate on which a concave pattern or a convex pattern is formed;
A first layer curing step by irradiating ultraviolet rays from the pattern forming layer side of the first layer and heating at a temperature of from room temperature to 60 ° C. or lower;
A second layer forming step of forming the second layer of the pattern forming layer;
A second layer curing step for curing the second layer by heating at room temperature to a temperature of 60 ° C. or lower;
From the first metal original plate, a pattern forming body peeling step for peeling the pattern forming body,
A conductive layer forming step of performing electroless plating on the pattern side on which the concave pattern and / or the convex pattern is transferred of the peeled pattern forming body;
An electroformed layer forming step of forming an electroformed layer by electroforming;
From the pattern forming body, by peeling the electroformed layer, an electroformed layer peeling step for obtaining a second metal original in which the concave pattern and / or the convex pattern of the first metal original is copied,
A second method for replicating a metal original plate, comprising:

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