JP2009218514A - Cleaning apparatus, cleaning method, and method for manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning apparatus and a cleaning method in which when a cleaning object (wafer) is cleaned, foreign substances are hard to be re-stuck to the surface of the cleaning object (wafer), and to provide a method for manufacturing a semiconductor device. <P>SOLUTION: In the cleaning apparatus, an inner tub 11 and an outer tub 4 are arranged on two upper and lower layers and a cleaning object (wafer 1) is dipped into the inner tub 11 and cleaned while jetting a cleaning liquid 3 upward from the bottom 11a side of the inner tub 11. The bottom 11a of the inner tub 11 is formed like a mortar of which the center is depressed and cleaning liquid supply ports 12 jetting the cleaning liquid are formed on the circumferential side of the bottom 11a of the inner tub 11. Precipitable foreign substances 8 peeled off from the cleaning object are collected in the depressed center part of the bottom 11a, so that even when the cleaning liquid 3 is jetted, the foreign substances 8 are hard to be floated up and re-sticking of the foreign substances 8 to the cleaning object can be prevented. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cleaning apparatus and a cleaning method for performing cleaning by immersing an object to be cleaned such as a wafer in a cleaning liquid, and a method for manufacturing a semiconductor device using the same.

  Various impurities and contaminants (foreign matter) remain on the surface of the wafer (substrate) by various processes used in the manufacturing process of the semiconductor device, such as coating, developing, ion implantation, and patterning. They cause problems such as pattern defects, insulation defects, and junction leaks when the next process is performed. Therefore, the cleaning of the wafer is very important for cleaning the wafer surface and improving the manufacturing yield and long-term reliability of the semiconductor device.

  Cleaning apparatuses used for cleaning wafers include a single wafer type for processing wafers one by one and a batch type for batch processing a plurality of wafers. As one of the batch type cleaning apparatuses, there is an immersion type cleaning apparatus in which a cleaning liquid is stored in a processing tank and a wafer is immersed to perform cleaning.

  Cleaning using an immersion type cleaning apparatus was performed as follows. First, the wafer is transferred to a carrier (a container for containing a wafer), and the wafer is immersed in a treatment tank together with the carrier to perform a cleaning process. Next, after removing the carrier from the treatment tank, if necessary, washing with another type of chemical, washing with water, and the like are performed. Finally, the wafer is dried and the cleaning process is completed (Patent Document 2).

  In the above-described cleaning, the foreign matter adhering to the wafer surface is removed by immersing the wafer immersion in the cleaning liquid. At this time, a part of the foreign matter is not completely dissolved in the cleaning liquid but floats in the cleaning liquid. For example, when hydrofluoric acid is used as a cleaning liquid in order to remove foreign substances made of silicon oxide, silicon oxide is completely dissolved in the cleaning liquid, but if the foreign substances contain unoxidized silicon, Since silicon does not dissolve in hydrofluoric acid, silicon particles drift in the cleaning solution.

  If such foreign matter that does not dissolve in the cleaning liquid floats in the cleaning liquid, there is a risk that the foreign matter will reattach to the surface of the wafer. Further, it is difficult to remove the reattached foreign matter no matter how much washing is performed in the subsequent washing step or the like.

For this reason, as shown in FIG. 1 as a cleaning apparatus 200, a recent cleaning apparatus has a cleaning tank having a two-layer structure including an inner tank 201 and an outer tank 4, and a cleaning liquid supply port on the bottom surface 201a side of the inner tank 201. The cleaning liquid was ejected from 7 to generate an upward flow in the cleaning liquid 3. In the cleaning apparatus 200, the foreign matter (symbol 9) that has fallen off from the wafer 1 easily flows on the flow of the cleaning liquid 3 overflowing from the inner tank and is discharged from the outer tank outlet 5 of the outer tank 4. The cleaning liquid 3 is filtered by a filtration / circulation system (CRS) 6 and then returned to the inner tank 201 again. In such a cleaning apparatus 200, foreign substances that easily float in the cleaning liquid (floating foreign substances) are removed by the filtration and circulation apparatus 6 (Patent Document 1).
No. 7-1795 JP-A-6-163505

  However, in the foreign matter, in addition to the floating foreign matter that is carried out of the inner tank by the upward flow of the cleaning liquid, there is a sedimentary foreign matter that is difficult to be transported outside the inner tank only by the upward flow of the cleaning liquid, It has been found that the conventional cleaning apparatus cannot completely remove the sedimentary foreign matters.

  Therefore, as schematically shown in FIG. 1, in the conventional cleaning device 200, the cleaning liquid 3 accumulated in the inner tank 201 and ejected from the cleaning liquid supply port 7 of the inner tank 201 is accumulated in the inner tank 201. As a result, the air flowed up and was reattached to the surface of the wafer 1.

  Accordingly, in a cleaning apparatus, a cleaning method, and a semiconductor device manufacturing method, it is intended to prevent foreign matters generated when cleaning an object to be cleaned (wafer) from reattaching to the surface of the object to be cleaned (wafer). To do.

  The above object is provided with an inner tank provided with a cleaning liquid supply port for ejecting a cleaning liquid on the inside, an outer tank disposed so as to cover a bottom surface and a side wall of the inner tank, and collecting the cleaning liquid overflowing from the inner tank, The bottom of the inner tub is formed in a mortar shape with a low center and the cleaning liquid supply port is located away from the lowest part of the inner tub. can do.

  In this cleaning apparatus, the bottom surface has a mortar shape (a shape in which the diameter increases as the bottom goes up), so sedimentary foreign matter tends to gather near the lowest part along the bottom slope. . Furthermore, the cleaning liquid supply port for ejecting the cleaning liquid is away from the lowest part of the mortar-shaped bottom surface, that is, away from the part where sedimentary foreign matters tend to collect (for example, at the side wall of the inner tank or the mortar-shaped bottom surface). The highest part). For this reason, even if the cleaning liquid is ejected from the cleaning liquid supply port, the sedimentary foreign matter collected at the lower part of the bottom of the mortar-shaped bottom is not rolled up, and the floating and sedimentary foreign matter is prevented from reattaching to the wafer surface. Can do. In addition, even if the amount of sedimentary foreign matter in the inner tank increases, re-adhesion is unlikely to occur, so it is possible to extend the maintenance cycle such as cleaning liquid replacement and cleaning of the cleaning device, improving throughput and reducing running costs. Can be achieved.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, the horizontal direction refers to a direction parallel to the liquid surface of the cleaning liquid, and the upward direction (or downward direction) refers to a direction orthogonal to the liquid surface of the cleaning liquid.

(First embodiment)
FIGS. 2A and 2B are schematic views showing the cleaning device according to the first embodiment of the present invention. FIGS. 3A and 3B are views of the cleaning device according to the first embodiment. It is sectional drawing which shows the structural example of 1 supply port. FIG. 4 is a perspective view showing an appearance of the cleaning apparatus according to the first embodiment of the present invention. FIG. 5 is a perspective view showing an example of a carrier and a wafer used in the cleaning apparatus according to the embodiment of the present invention.

  As shown in FIG. 2A, the cleaning device 10 of this embodiment includes an inner tank 11, an outer tank 4 that collects the cleaning liquid 3 overflowing from the inner tank 11, and a filtration and circulation device (Chemical) that circulates the cleaning liquid 3. Reclamation System (CRS) 6, and the wafer 2 is immersed in the cleaning liquid 3 in the inner tank 11 for cleaning. Hereinafter, each part of the cleaning apparatus 10 will be further described.

  As shown in FIG. 2A and FIG. 4, the inner tank 11 has a mortar-shaped bottom surface 11 a that is recessed and lowered, and a side wall 11 b that extends upward. The side wall 11b of the inner tank 11 can be formed in a rectangular shape, for example, as shown in FIG. The connection part of the bottom face 11a and the side wall 11b is watertightly connected. An opening is formed above the inner tank 11, and a carrier 2 (see FIG. 5 described later) containing the wafer 1 (object to be cleaned) can be taken in and out from this opening.

  As shown in FIG. 2B, which is a bottom view of the cleaning device 10, the first supply port 12 is disposed in the peripheral side portion of the bottom surface 11 a and is separated from the lowest portion (center portion) of the inner tank 11. It is provided at the place. The first supply port 12 is connected to the supply side (described later) of the filtration and circulation device 6 and ejects the cleaning liquid 3.

As shown in FIG. 3A, the first supply port 12 is formed so as to eject the cleaning liquid 3 in the upward direction (for example, θ ₁ is 40 ° to 50 °) from the horizontal direction (chain line A). . Thus, the upward flow can be generated in the cleaning liquid 3 in the inner tank 11 by discharging the cleaning liquid 3 upward from the bottom surface 11a. Furthermore, since the 1st supply port 12 is arrange | positioned in the location away from the lowest part of the inner tank 11, there is little possibility of winding up the sedimentary foreign material collected in the recessed part of the bottom face 11a. In addition, the 1st supply port 12 can also be comprised so that piping may protrude from the bottom face 11a of the inner tank 11, as shown in FIG.3 (b). Further, although not particularly illustrated, the first supply port 12 may be disposed on the side wall 11b side in the vicinity of the bottom surface 11a.

  As shown in FIGS. 2A and 2B, the cleaning device 10 may be provided with a heater 18 on the bottom surface 11 a of the inner tank 11 as necessary. When the heater 18 is provided, the cleaning liquid 3 can be heated to, for example, about 25 ° C to 120 ° C.

  As shown in FIG. 2A, the outer tank 4 is disposed so as to cover the bottom surface 11 a and the side wall 11 b of the inner tank 11, and collects the cleaning liquid 3 overflowing from the inner tank 11. An outer tank outlet 5 is provided near the bottom surface 11 a of the outer tank 4. The outer tank outlet 5 is connected to the discharge side of the filtration / circulation device 6 described later, and discharges the cleaning liquid 3 accumulated in the outer tank 4 to the filtration / circulation device 6.

  The filtration and circulation device 6 is provided with a filter and a pump (not shown), sucks the cleaning liquid 3 discharged from the inner tank 11 and the outer tank 4 on the discharge side, removes foreign matters, and sends out the clean cleaning liquid 3 from the supply side. If the cleaning liquid 3 is inexpensive, such as pure water, the cleaning / circulation device 6 may not be provided in the cleaning device 10.

  As shown in FIG. 5, the wafer 1 is transported and cleaned while being accommodated in a carrier 2. In the illustrated example, only one wafer 1 is accommodated in the carrier 2, but the carrier 2 can accommodate a plurality of wafers 1. The carrier 2 is made of, for example, quartz. When performing cleaning, the carrier 2 is held at a predetermined position in the inner tank 11 by a carrier fixing device (not shown) provided in the cleaning device 10.

  Although not particularly illustrated, the cleaning device 10 is provided with a mechanism unit that transports the carrier 2 and a control device that performs operation control, and the cleaning device 10 can automatically perform a series of cleaning operations (described later). .

  The cleaning apparatus 10 according to the present embodiment can process various substrates such as a silicon or a ceramic substrate used for a semiconductor device as the wafer 1.

As the cleaning liquid 3, for example, pure water, NH ₄ OH, H ₂ , HCl, H ₂ SO ₄ , H ₂ O ₂ , HF, NH ₄ F, or an aqueous solution of O ₃ can be used.

  Hereinafter, the cleaning operation of the cleaning apparatus 10 according to the first embodiment will be described with reference to FIGS. 6 and 7. FIG. 6 is a flowchart showing a cleaning operation example 1 of the cleaning apparatus according to the first embodiment of the present invention. FIG. 7 shows a cleaning operation example 2 of the cleaning apparatus according to the first embodiment of the present invention. FIG.

(Cleaning operation example 1 of the first embodiment)
In the cleaning operation example 1 of the present embodiment, the wafer 1 is cleaned while spraying the cleaning liquid 3 from the first supply port 12.

  First, as shown in FIG. 6, the filtration circulation device 6 is driven to start circulation of the cleaning liquid 3 (step S111). As a result, the cleaning liquid 3 is ejected from the first supply port 12 and an upward flow is generated in the inner tank 11.

  Next, the carrier 2 containing the wafer 1 is put through the opening at the top of the inner tank 11, and the wafer 1 is cleaned for a predetermined time (step S112). As a result, the wafer 1 is immersed in the cleaning liquid 3 and the foreign matter adhering to the surface of the wafer 1 is removed. At this time, the levitating foreign matter (symbol 9 in FIG. 2A) is discharged to the outer tank 4 side together with the cleaning liquid 3 overflowing from the inner tank 11. On the other hand, the sedimentary foreign matter (symbol 8 in FIG. 2A) falls in the inner tank 11 and eventually gathers in the central portion formed deepest on the bottom surface 11a.

  Thereafter, the carrier 2 is pulled up from the inner tank 11 (step S113), and the cleaning operation of the wafer 1 is completed.

  Thus, the cleaning apparatus 10 of the present embodiment is formed in a mortar shape in which the bottom surface 11 a of the inner tank 11 is recessed at the center, and the first supply port 12 is disposed on the peripheral side of the inner tank 11. Thereby, the sedimentary foreign matter accumulates in the vicinity of the lowest part of the mortar-shaped bottom surface 11a, and even if the cleaning liquid 3 is ejected, the sedimentary foreign matter is less likely to roll up, and reattachment of the foreign matter can be suppressed.

(Example 2 of cleaning operation of the first embodiment)
In the cleaning operation example 2 of the present embodiment, the operation of temporarily stopping the ejection of the first supply port 12 before the carrier 2 is pulled up from the inner tank 11 in order to precipitate foreign matters floating in the inner tank 11. Including.

  First, as shown in FIG. 7, the filtration / circulation device 6 is operated to start circulation of the cleaning liquid 3 (step S121), the carrier 2 is put into the inner tank 11, and the wafer 1 is cleaned for a predetermined time (step S122). . Up to this point, the operation is the same as in the cleaning operation example 1 of this embodiment.

  Next, the supply of the cleaning liquid 3 from the filtration / circulation device 6 to the inner tank 11 is stopped (step S123). Thereby, since the jet of the 1st supply port 12 stops and the flow in the inner tank 11 stops, the foreign material with larger specific gravity than a washing | cleaning liquid gathers on the bottom face 11a side. Thereafter, the carrier 2 is pulled out from the inner tank 11 (step S124). Finally, in preparation for the next cleaning operation, the supply of the cleaning liquid 3 from the filtration circulation device 6 to the inner tank 11 is resumed (step S125), and the series of cleaning operations is completed.

  As described above, in the cleaning operation example 2 of the present embodiment, since the flow of the cleaning liquid 3 is temporarily stopped before the carrier 2 is pulled up, the sedimentary foreign matter in the inner tank 11 can be more reliably precipitated. Thereby, it is possible to prevent foreign matters from reattaching to the surface of the wafer 1 while the carrier 2 is being pulled up.

  As described above, according to the cleaning apparatus 10 of the present embodiment, foreign matters can be prevented from rolling up and foreign matters can be prevented from reattaching to the surface of the wafer 1. Yield can be improved. Furthermore, since foreign matter can be prevented from rolling up even if some sedimentary foreign matter accumulates in the inner tank 11, the frequency of periodic maintenance such as replacement of the cleaning liquid 3 and cleaning of the cleaning device can be reduced. Throughput can be improved and running cost can be reduced.

(Second Embodiment)
In the second embodiment of the present invention, a downward flow is temporarily generated at the time of pulling up in order to prevent the sedimentary foreign matter from rising by the flow at the time of pulling up the object to be cleaned (wafer) from the inner tank. The present invention relates to a cleaning device capable of

  FIG. 8 is a schematic diagram showing a cleaning device according to the second embodiment of the present invention, and FIGS. 9A and 9B are configuration examples of the second supply port of the cleaning device according to the second embodiment. It is sectional drawing shown. In the following description, the configuration denoted by the same reference numeral as that of the first embodiment (cleaning device 10) is the same as the configuration of the first embodiment denoted by the corresponding symbol.

  As shown in FIG. 8, the cleaning device 20 according to the second embodiment circulates the cleaning liquid 3, an inner tank 11 having a bottom surface 11 a and a side wall 11 b, an outer tank 4 that collects the cleaning liquid 3 overflowing from the inner tank 11. And a filtration / circulation device 6. The configurations of the inner tank 11 (bottom surface 11a, side wall 11b), the outer tank 4, the outer tank discharge port 5, the first supply port 12, and the filtration cleaning device 6 are the same as the corresponding configurations of the first embodiment (cleaning device 10). is there.

  As shown in FIG. 8, the cleaning device 20 of the second embodiment is further provided with a second supply port 13 connected to the supply side of the filtration cleaning device 6. The second supply port 13 is disposed on the side wall 11 b near the opening at the top of the inner tank 11. For example, as shown in FIG. 9A, the second supply port 13 can be formed as a hole inclined in the side wall 11b, and jets the cleaning liquid 3 downward from the horizontal direction (chain line A). It is installed as follows. For example, the spray angle θ2 of the cleaning liquid 3 can be set to 40 ° to 50 °. In addition to the configuration shown in FIG. 9A, the second supply port 13 may be configured to protrude from the side wall 11b as shown in FIG. 9B.

  Further, the cleaning device 20 of the present embodiment includes a first supply valve 22 provided in a pipe between the first supply port 12 and the filtration circulation device 6, a second supply port 13, and the filtration circulation device 6. The 2nd supply valve 23 provided in the piping between is provided.

  Hereinafter, the cleaning operation of the cleaning device 20 of the present embodiment will be described. FIG. 10 is a flowchart showing an example of the cleaning operation of the cleaning apparatus according to the second embodiment of the present invention.

  First, the filtration circulation device 6 is operated to start circulation of the cleaning liquid 3 (step S211). Next, the first supply valve 22 is opened, the second supply valve 23 is closed, and the cleaning liquid 3 is ejected from only the first supply port 12 (step S212). As a result, an upward flow is generated in the inner tank 11. Next, the carrier 2 is put into the inner tank 11 and the wafer 1 is cleaned for a predetermined time (step S213).

  Next, simultaneously with the start of raising the carrier 2, the first supply valve 22 is closed and the second supply valve 23 is opened, and the cleaning liquid 3 is ejected from only the second supply port 13 (step S214). At this time, the upward movement of the carrier 2 generates an upward flow in the vicinity of the bottom surface 11a of the inner tank 11, but a downward flow of the cleaning liquid 3 is generated from the second supply port 13 on the opening side. Flow is suppressed. This can prevent the precipitation of foreign matters. In addition, it is preferable to perform the timing which injects from the 2nd supply port 13 simultaneously with raising the carrier 2. FIG. This is to prevent the foreign matter collected on the bottom surface 11a from flying up due to the injection of the second supply port 13. Thereafter, the carrier 2 is completely pulled out from the inner tank 11 while performing injection from the second supply port 13 (step S215), and a series of cleaning operations is completed.

  As described above, according to the cleaning apparatus 20 of the present embodiment, when the object to be cleaned (the wafer 1 accommodated in the carrier 2) is pulled up, the cleaning liquid 3 in the inner tank 11 temporarily flows downward. Can be given. Thereby, when the carrier 2 is pulled up, the flow in the vicinity of the bottom surface 11a can be suppressed, and the roll-up of the sedimentary foreign matter can be suppressed, so that the reattachment of the foreign matter can be prevented. For this reason, it becomes difficult for foreign matters to reattach to the wafer 1, and the reliability of the semiconductor device and the manufacturing yield can be improved. Furthermore, since foreign matter can be prevented from rolling up even if some sedimentary foreign matter accumulates in the inner tank 11, the frequency of periodic maintenance such as replacement of the cleaning liquid 3 and cleaning of the cleaning device can be reduced. Throughput can be improved and running cost can be reduced.

(Third embodiment)
3rd Embodiment is related with the washing | cleaning apparatus which provided the 1st discharge port in the lowest part of the mortar-shaped bottom face of an inner tank in order to prevent the reattachment by the rolling-up of the sedimentary foreign material collected on the bottom face of the inner tank. . FIG. 11A is a schematic view showing a cleaning device according to the third embodiment of the present invention, and FIG. 11B is a bottom view of the inner tank of the third embodiment. In addition, in FIG. 11 and the following description, the structure which attached | subjected the same code | symbol as 1st Embodiment (cleaning apparatus 10) is the same as that of 1st Embodiment (cleaning apparatus 10) which attached | subjected the corresponding code | symbol. is there.

  As shown in FIG. 11, the cleaning device 30 includes an inner tank 11 having a bottom surface 11 a and a side wall 11 b, an outer tank 4 provided with an outer tank discharge port 5, and a filtration and circulation device 6. In addition, these structures are the same as that of the washing | cleaning apparatus 10 of 1st Embodiment.

  The cleaning device 30 of the present embodiment further has a first discharge port 14 at the lowest part of the inner tank 11 (bottom surface 11a). As shown in FIG.11 (b), the 1st discharge port 14 is arrange | positioned in the center part of the mortar-shaped bottom face 11a. The first discharge port 14 is connected to the discharge side of the filtration and circulation device 6 and can discharge the cleaning liquid 3 in the inner tank 11. Further, a first discharge valve 24 is provided in a pipe connecting the first discharge port 14 and the filtration / circulation device 6.

  Hereinafter, the cleaning operation of the cleaning device 30 of the third embodiment will be described. FIG. 12 is a flowchart showing a cleaning operation example 1 of the cleaning apparatus according to the third embodiment of the present invention, and FIG. 13 is a cleaning operation example 2 of the cleaning apparatus according to the third embodiment of the present invention. FIG.

(Cleaning operation example 1 of the third embodiment)
In the cleaning operation example 1 of the present embodiment, a series of cleaning operations are performed while the cleaning liquid 3 is always discharged from the first discharge port 14.

  First, as shown in FIG. 12, the filtration and circulation device 6 is operated to start the circulation of the cleaning liquid 3 (step S311). Next, the first discharge valve 24 is opened (step S312). At this time, the cleaning liquid 3 is ejected from the first supply port 12 and discharged from the first discharge port 14 and the outer tank discharge port 5. Next, the carrier 2 is put into the inner tank 11 and the wafer 1 is cleaned for a predetermined time (step S313). At this time, floating foreign substances are discharged to the outer tub 4 side along the upward flow of the cleaning liquid 3. On the other hand, the sedimentary foreign matter falls in the inner tank 11 and eventually moves to the vicinity of the lowest part of the bottom surface 11a. Since the first discharge port 14 is provided at the lowest portion of the bottom surface 11 a, the settled foreign matter that has fallen is discharged together with the cleaning liquid 3. Thereafter, the carrier 2 is pulled up (step S314), and a series of cleaning operations is completed.

  As described above, according to the cleaning operation example 1 of the present embodiment, the sedimentary foreign matter is quickly discharged out of the inner tank 11 through the first discharge port 14, and thus reattachment of the sedimentary foreign matter is suppressed. be able to. In addition, when using the cleaning apparatus 30 of this embodiment only for this operation example, it is not necessary to provide the first discharge valve 24. In this case, the operation of opening the first discharge valve 24 (step S312) It is unnecessary.

(Example 2 of cleaning operation of the third embodiment)
In the cleaning operation example 2 of the present embodiment, after the cleaning of the carrier 2 is finished, discharging from the first discharge port 14 is started before the carrier 2 is pulled up.

  First, as shown in FIG. 13, the filtration and circulation device 6 is operated to start circulation of the cleaning liquid 3 (step S321). Next, the first discharge valve 24 is closed (step S322). At this time, the cleaning liquid 3 is sprayed from the first supply port 12 and discharged from the outer tank discharge port 5. Next, the carrier 2 is put into the inner tank 11 and the wafer 1 is cleaned for a predetermined time (step S323). Precipitating foreign matter generated by cleaning the wafer 1 collects in the vicinity of the lowest central portion of the inner tank 11 (bottom surface 11a). Next, the first discharge valve 24 is opened and the cleaning liquid 3 is discharged from the first discharge port 14 (step S324). Thereby, the sedimentary foreign matter is discharged from the inner tank together with the cleaning liquid 3 and removed by the filtration and circulation device 6. Next, the carrier 2 is pulled up (step S325). Finally, the first discharge valve 24 is closed (step S326), and the series of cleaning operations is finished.

  Thus, in the cleaning operation example 2 of the present embodiment, the first discharge port 14 is temporarily discharged before and after the carrier 2 is pulled up. As a result, the upward flow caused by pulling up the carrier 2 can be offset by the downward flow caused by the discharge of the first discharge port 14, and the rise of foreign matter near the bottom surface 11a can be prevented.

  As described above, according to the cleaning apparatus of the present embodiment, the sedimentary foreign matter is discharged together with the cleaning liquid 3 from the first discharge port 14 at the bottom of the inner tank 11, and the foreign matter on the bottom surface 11a can be reduced. For this reason, the rising of the foreign matter is suppressed, the foreign matter is less likely to reattach to the wafer 1, and the reliability of the semiconductor device and the manufacturing yield can be improved. Furthermore, since sedimentary foreign matters are quickly discharged from the inner tank 11, the frequency of periodic maintenance such as replacement of the cleaning liquid 3 and cleaning of the cleaning device can be reduced, and throughput can be improved and running cost can be reduced. Can do.

(Fourth embodiment)
FIG. 14 is a schematic view showing a cleaning apparatus according to the fourth embodiment of the present invention. In FIG. 14 and the following description, the same reference numerals as those in the first to third embodiments (cleaning apparatuses 10, 20 and 30) are assigned to the first to third embodiments. The configuration is the same as that described in the third embodiment.

  As shown in FIG. 14, the cleaning device 40 according to the fourth embodiment includes an inner tank 11 having a bottom surface 11 a and a side wall 11 b, a first supply port 12, a second supply port 13, a first discharge port 14, An outer tub 4 provided with an outer tub discharge port 5 and a filtration / circulation device 6 are provided. The inner tank 11, the first supply port 12, the outer tank 4, and the filtration and circulation device 6 are the same as those in the first embodiment (cleaning device 10). Moreover, the 2nd supply port 13 is the same as that of 2nd Embodiment (cleaning apparatus 20), and the 1st discharge port 14 is the same as that of 3rd Embodiment (cleaning apparatus 30).

  As shown in FIG. 14, a first supply valve 22 is provided in the piping of the first supply port 12, a second supply valve 23 is provided in the piping of the second supply port 13, and a first supply valve 22 is provided in the piping of the first discharge port 14. One discharge valve 24 is provided.

Next, the cleaning operation of the cleaning device 40 according to the fourth embodiment will be described with reference to FIGS. 15 and 16. FIG. 15 is a flowchart illustrating a cleaning operation example 1 of the cleaning device according to the fourth embodiment, and FIG. 16 is a flowchart illustrating a cleaning operation example 2 of the cleaning device according to the fourth embodiment.
(First cleaning operation example 4)
In the cleaning operation example 1 of the present embodiment, the wafer 1 is cleaned while being discharged from the first discharge port 14, and when the carrier 2 is pulled up, the cleaning liquid 3 is sprayed from the first supply port 12 to the second supply port 13. Switch.

  First, as shown in FIG. 15, the filtration and circulation device 6 is driven to start circulation of the cleaning liquid 3 (step S411). Next, the first discharge valve 24 is opened, and the discharge of the cleaning liquid 3 from the first discharge port 14 is started (step S412). Next, the first supply valve 22 is opened, the second supply valve 23 is closed, and the cleaning liquid 3 is sprayed from only the first supply port 12 (step S413). Next, the carrier 2 is put into the inner tank 11 and the wafer 1 is cleaned for a predetermined time (step S414). At this time, the precipitating foreign matter falls in the inner tank 11 and is discharged from the inner tank 11 together with the cleaning liquid 3 from the first discharge port 14 provided in the lowest part of the inner tank 11.

  Next, simultaneously with the start of raising the carrier 2, the first supply valve 22 is closed and the second supply valve 23 is opened, and the cleaning liquid 3 is sprayed only from the second supply port 13. As a result, a downward flow is generated in the inner tank 11 and foreign matter collected near the bottom surface 11 a of the inner tank 11 is discharged together with the cleaning liquid 3 from the first discharge port 14. Thereafter, the carrier 2 is completely pulled up (step S416), and a series of cleaning operations is completed.

  In the cleaning operation example 1 of the present embodiment, the sedimentary foreign matter is quickly discharged from the first discharge port 14. Further, since the carrier 2 is pulled up and the second supply port 13 is jetted at the same time to generate a downward flow in the inner tank 11, precipitation foreign matters are wound during the cleaning of the wafer 1 and when the carrier 2 is pulled up. The rise is further effectively suppressed, and the reattachment of sedimentary foreign matters can be more effectively prevented.

(Example 2 of cleaning operation of the fourth embodiment)
In the cleaning operation example 2 of the present embodiment, when the carrier 2 is pulled up, the spray of the cleaning liquid 3 is switched from the first supply port 12 to the second supply port 13, and the cleaning liquid 3 is discharged from the first discharge port 14. Do.

  First, as shown in FIG. 16, the filtration / circulation device 6 is operated to start circulation of the cleaning liquid 3 (step S421). Next, the first discharge valve 24 is closed (step S422). Next, the first supply valve 22 is opened, the second supply valve 23 is opened, and the cleaning liquid 3 is ejected from only the first supply port 12 (step S423). Next, the carrier 2 is put into the inner tank 11 and the wafer 1 is cleaned for a predetermined time (step S424).

  Next, simultaneously with the raising of the carrier 2, the first supply valve 22 is closed, the second supply valve is opened, and the injection of the cleaning liquid 3 is switched to the second supply port 13 (step S425). Immediately after that, the first discharge valve 24 is opened to start discharging the cleaning liquid 3 from the first discharge port 14 (step S426). At this time, a downward flow is generated in the inner tank 11 by the injection from the second supply port 13 and the discharge from the first discharge port 14. Further, the sedimentary foreign matter collected on the bottom surface 11 a side of the inner tank 11 is discharged from the inner tank 11 together with the cleaning liquid 3 from the discharge port 14. Thereafter, the carrier 2 is completely pulled up (step S427). Finally, the first discharge valve 24 is closed to stop the discharge from the first discharge port 14 (step S428), and a series of cleaning processes is completed.

  In the cleaning operation example 2 of the present embodiment, when the carrier 2 is pulled up, the ejection from the second supply port 13 and the ejection from the first discharge port 14 are temporarily performed. Thereby, since the downward flow is temporarily generated when the carrier 2 is pulled up, the sedimentary foreign matter staying on the bottom surface 11a side of the inner tank 11 can be efficiently discharged while suppressing the rising of the foreign matter.

  As described above, according to the cleaning device 40 of the present embodiment, it is possible to more effectively prevent foreign matters from being reattached during cleaning of the wafer 1 or when the carrier 2 is pulled up. Improvement and manufacturing yield can be improved. Furthermore, since sedimentary foreign matters are quickly discharged from the inner tank 11, the frequency of periodic maintenance such as replacement of the cleaning liquid 3 and cleaning of the cleaning device can be reduced, and throughput can be improved and running cost can be reduced. Can do.

(Fifth embodiment)
The cleaning device of the fifth embodiment supplies the cleaning liquid 3 from the second supply port at the upper part of the inner tank, discharges the cleaning liquid 3 from the second discharge port formed from the side wall to the bottom surface of the inner tank, and faces downward to the inner tank The wafer is cleaned by generating a flow of FIG. 17 is a schematic diagram showing a cleaning device according to the fifth embodiment of the present invention.

  As shown in FIG. 17, the cleaning device 50 of the fifth embodiment includes an inner tank 11, an outer tank 4 provided with an outer tank discharge port 5, and a filtration and circulation device 6. The configurations of the inner tank 11, the outer tank 4, the outer tank discharge port 5, and the filtration and circulation device 6 are the same as the corresponding configurations in the first embodiment (cleaning device 10).

  In addition, the inner tank 11 of the cleaning apparatus 50 of this embodiment is not limited to the structure which made the bottom face 11a mortar shape, For example, you may form the bottom face 11a flat.

  As shown in FIG. 17, the second supply port 13 is formed near the opening of the inner tank 11 in the cleaning device 50. The second supply port 13 of the cleaning device 50 is the same as the second supply port 13 (see FIGS. 8 and 9) of the second embodiment (cleaning device 20).

  Further, as shown in FIG. 17, the cleaning device 50 is provided with a second discharge port 15 formed of a plurality of holes from the side wall 11 b to the bottom surface 11 a of the inner tank 11. The second discharge port 15 is connected to the discharge side of the filtration cleaning device 6 and can discharge the cleaning liquid 3 in the inner tank 11.

  Next, the cleaning operation of the cleaning device 50 according to the fifth embodiment will be described with reference to FIG. FIG. 18 is a flowchart showing an example of the cleaning operation of the cleaning device 50 according to the fifth embodiment.

  First, the filtration / circulation device 6 is driven to start circulation of the cleaning liquid 3 (step S511). At this time, the cleaning liquid 3 is sprayed from the second supply port 13 and discharged from the second discharge port 15 and the outer tank discharge port 5. A downward flow is generated in the inner tank 11. Next, the carrier 2 is put into the inner tank 11 and the wafer 1 is cleaned for a predetermined time (step S512). At this time, the floating foreign matter dropped from the wafer 1 is discharged from the second discharge port 15 by the downward flow of the cleaning liquid 3. Precipitating foreign matter falls down the inner tank 11 and is discharged together with the cleaning liquid 3 from the second discharge port 15 formed on the bottom surface 11a. Finally, the carrier 2 is pulled up (step S513), and the series of cleaning operations is completed.

  According to the present embodiment, cleaning is performed while generating a downward flow in the inner tank 11 by the first supply port 12 and the second discharge port 15, and thus the generated floating and sedimentary foreign matters are removed from the second discharge port 15. Can be discharged quickly. As a result, foreign substances can be prevented from flying up and reattached during cleaning of the wafer 1 and when the carrier 2 is pulled up, and the reliability of the semiconductor device and the manufacturing yield can be improved. Furthermore, since sedimentary foreign matters are quickly discharged from the inner tank 11, the frequency of periodic maintenance such as replacement of the cleaning liquid 3 and cleaning of the cleaning device can be reduced, and throughput can be improved and running cost can be reduced. Can do.

(Sixth embodiment)
In the cleaning device of the sixth embodiment, a first discharge port is further provided at the lowest portion of the inner tank of the cleaning device of the fifth embodiment. FIG. 19 is a schematic diagram showing a cleaning device according to the sixth embodiment of the present invention. In addition, in FIG. 19 and the following description, the structure to which the same code | symbol as 5th Embodiment (cleaning apparatus 50) was attached | subjected is the same as the structure as described in 5th Embodiment to which the corresponding code | symbol was attached | subjected.

  As shown in FIG. 19, the cleaning device 60 of the sixth embodiment is provided with an inner tank 11 having a bottom surface 11a and a side wall 11b, a second supply port 13, a second discharge port 15, and an outer tank discharge port 5. The outer tub 4 and the filtration / circulation device 6 are provided. In addition, it is preferable that the washing | cleaning apparatus 60 of this embodiment makes the bottom face 11a of the inner tank 11 into the shape of a mortar with the center part depressed, in order to discharge | emit sedimentary foreign material efficiently.

  Further, the cleaning device 60 is provided with a first discharge port 14 at the lowest portion of the inner tank 11 (bottom surface 11a). The first discharge port 14 of the cleaning device 60 is the same as the first discharge port 14 of the cleaning device 30 (see FIG. 11) of the third embodiment.

  Further, a first discharge pump 74 is provided in a pipe connecting the first discharge port 14 and the filtration circulation device 6, and a second discharge pump 75 is provided in a pipe connecting the second discharge port 15 and the filtration circulation device 6. Is provided.

  The second discharge port 15 mainly removes floating foreign substances up to the same specific gravity as water, but the amount of floating foreign substances is not so large and the flow required for discharge is weak, so The suction force (discharge amount) of the first discharge port 14 can be made smaller. On the other hand, since the sedimentary foreign matter having a large specific gravity is difficult to flow into the flow of the cleaning liquid 3, a stronger flow is required for discharging the sedimentary foreign matter. Therefore, it is preferable that the discharge amount (the suction force of the foreign matter) of the first discharge port 14 at the lowest portion where foreign matters are likely to gather be larger than the discharge amount of the second discharge port 15. That is, it is preferable that the discharge capacity of the first discharge pump 74 is higher than the discharge capacity of the second discharge pump 75.

  Hereinafter, an example of the cleaning operation of the cleaning device 60 according to the sixth embodiment will be described. FIG. 20 is a flowchart showing an example of the cleaning operation of the cleaning device 60 according to the sixth embodiment.

  First, as shown in FIG. 20, the filtration / circulation device 6 is operated to start circulation of the cleaning liquid 3 (step S611). At this time, the cleaning liquid 3 is ejected from the second supply port 13 and discharged from the first discharge port 14 and the second discharge port 15. A downward flow is generated in the inner tank 11. Next, the carrier 2 is put into the inner tank 11 and the wafer 1 is cleaned for a predetermined time (step S612).

  At this time, floating foreign matters generated from the wafer 1 are discharged from the first discharge port 14 and the second discharge port 15 together with the cleaning liquid 3 in the inner tank 11. Precipitating foreign matter falls in the inner tank 11 and is discharged mainly from the first discharge port 14 formed in the lowest part. For this reason, the floating and sedimentary foreign matters in the inner tank 11 are quickly discharged from the inner tank. Thereafter, the carrier 2 is pulled up (step S613), and a series of cleaning operations is completed.

  As described above, the foreign matter dropped from the wafer 1 at the time of cleaning is quickly discharged from the first discharge port 14 and the second discharge port 15 in the inner tank 11. It is possible to prevent foreign matters from rolling up and reattaching to the wafer 1. For this reason, according to the cleaning apparatus 60 according to the modification of the sixth embodiment, it is possible to prevent the reattachment of foreign matters, so that the long-term reliability and yield of the semiconductor device can be improved. Further, the maintenance interval can be extended, and the throughput can be improved and the running cost can be reduced.

(Modification of the sixth embodiment)
The cleaning device of the present embodiment is not limited to the above-described configuration example (cleaning device 60, FIG. 19), and may be configured as shown in FIG. FIG. 21 is a schematic diagram showing a cleaning device according to a modification of the sixth embodiment of the present invention.

  As shown in FIG. 21, the cleaning device 70 according to the modification of the present embodiment is replaced with a first discharge pump 74 (see FIG. 19) and a second discharge pump 75 (see FIG. 19) of the cleaning device 60. The difference is that a discharge valve 24 and a second discharge valve 25 are provided. Since the other configuration is the same as that of the cleaning device 60 (see FIG. 19), the description thereof is omitted.

  The first discharge valve 24 is provided in a pipe connecting the first discharge port 14 and the discharge side of the filtration and circulation device 6. The second discharge valve 25 is provided in a pipe connecting the second discharge port 15 and the discharge side of the filtration and circulation device 6.

  Hereinafter, an example of the cleaning operation of the cleaning apparatus 70 according to the modification of the sixth embodiment will be described with reference to FIG. FIG. 22 is a flowchart showing an example of the cleaning operation of the cleaning apparatus according to the modification of the sixth embodiment.

  First, the filtration circulation device 6 is operated to start circulation of the cleaning liquid 3 (step S711). Next, the second discharge valve 25 is opened, and the first discharge valve 24 is closed (step S712). At this time, the cleaning liquid 3 is ejected from the second supply port 13 and discharged from the second discharge port 15 and the outer tank discharge port 5. As a result, a downward flow is generated in the inner tank 11.

  Next, the carrier 2 is put into the inner tank 11 and the wafer 1 is cleaned for a predetermined time (step S713). At this time, the floating foreign matter dropped from the wafer 1 is discharged together with the cleaning liquid 3 mainly from the second discharge port 15. Next, the first discharge valve 24 is opened and the second discharge valve 25 is closed (step S714). As a result, the precipitating foreign matter is discharged together with the cleaning liquid 3 from the first discharge port 14. Since the 1st discharge port 14 is formed only in the bottom face 11a vicinity of the inner tank 11, the sedimentary foreign material collected near the bottom face 11a of the inner tank 11 can be discharged more reliably.

  Thereafter, the carrier 2 is pulled up from the inner tank 11 (step S715). Finally, the first discharge valve 24 is closed and the second discharge valve 25 is opened (step S716), and the series of cleaning processes is completed.

  As described above, in the cleaning device 70 according to the modified example of the sixth embodiment, the cleaning liquid 3 is temporarily discharged from the first discharge port 14 before and after the carrier 2 is pulled up, thereby efficiently discharging the sedimentary foreign matters. Can do.

  As described above, according to the sixth embodiment of the present invention, it is possible to prevent reattachment due to the rising of sedimentary foreign matters during the cleaning of the wafer 1 and when the carrier 2 is pulled up, thereby improving the reliability of the semiconductor device. The production yield can be improved. Furthermore, since the sedimentary foreign matter can be discharged more reliably by the first discharge port 14 provided in the lowest part of the inner tank 11, the frequency of periodic maintenance such as replacement of the cleaning liquid 3 and cleaning of the cleaning device may be reduced. It is possible to improve throughput and reduce running costs.

(Seventh embodiment)
The cleaning device of the seventh embodiment can partition the bottom surface side of the inner tank from the opening side so as to prevent the foreign matter collected on the bottom surface of the inner tank from rolling up due to the flow generated when the carrier is pulled up. A movable partition plate is provided. Here, FIGS. 23A and 23B are schematic views showing a cleaning apparatus according to the eighth embodiment of the present invention.

  As shown in FIGS. 23A and 23B, the cleaning device 80 according to the seventh embodiment includes an inner tank 11 having a bottom surface 11a and a side wall 11b, and an outer tank 4 in which an outer tank discharge port 5 is formed. The 1st supply port 12 arrange | positioned in the peripheral side of the bottom face of the inner tank 11 and the filtration circulation apparatus 6 are provided. Furthermore, it has a movable partition plate 16 that can be inserted into the inner tank 11.

  The inner tank 11 has a side wall 11b extending in the vertical direction and a mortar-shaped bottom surface 11a that is depressed so that the center part is the lowest, and the first supply port 12 is disposed on the peripheral side of the bottom surface 11a of the inner tank 11. Has been. In addition, the structure of the 1st supply port 12 is the same as that of the 1st supply port 12 of the washing | cleaning apparatus 10 (refer FIG. 2, FIG. 3) of 1st Embodiment.

  Furthermore, the inner tank 11 of this embodiment is provided with a partition plate insertion portion (not shown), and the partition plate 16 can be inserted from the side of the inner tank 11. The outer tub 4 is disposed so as to cover the bottom surface 11a and the side wall 11b of the inner tub 11, and is provided with a partition plate insertion portion (not shown) into which the partition plate 16 can be inserted.

  The outer tank discharge port 5 is provided near the bottom of the outer tank 4 and is connected to the discharge side of the filtration and circulation device 6. The first supply port 12 is connected to the supply side of the filtration and circulation device 6. Since the 1st supply port 12 is arrange | positioned above the position where the partition plate 16 is inserted, even if it inserts the partition plate 16, it can continue ejecting the washing | cleaning liquid 3 without trouble.

  The partition plate 16 is movably provided, and is arranged outside the outer tub 4 as shown in FIG. 23A except when the carrier 2 is pulled up. Immediately before the carrier 2 is pulled up, the partition plate 16 is inserted into the inner tank 11 as shown in FIG. A seal member (not shown) is provided at a sliding portion between the inner tank 11 and the partition plate 16, and when the partition plate 16 is inserted, the cleaning liquid 3 moves between the upper and lower sides of the partition plate 16 in the inner tank 11. Be blocked. For this reason, even if the carrier 2 is pulled up, the precipitating foreign matter collected on the bottom surface 11a side of the inner tank 11 can be prevented from being rolled up, and reattachment of the foreign matter can be prevented.

  Hereinafter, the cleaning operation of the cleaning device 80 of the present embodiment will be described. FIG. 24 is a flowchart showing the cleaning operation of the cleaning apparatus according to the seventh embodiment of the present invention.

  First, as shown in FIG. 24, the filtration cleaning device 6 is driven to start circulation of the cleaning liquid 3 (step S811). Accordingly, the cleaning liquid 3 is jetted upward from the first supply port 12 arranged on the peripheral side of the bottom surface 11a, and a flow of the cleaning liquid 3 is generated in the upward direction. Next, the carrier 2 is carried into the inner tank 11 and the wafer 1 is cleaned for a certain time (step S811). At this time, floating foreign substances flow out from the opening above the inner tank 11, and sedimentary foreign substances gather on the bottom surface 11 a side of the inner tank 11.

  Next, the partition plate 16 is inserted into the inner tank 11 as shown in FIG. 8B (step S813). Thereby, the flow of the cleaning liquid 3 between the bottom surface 11a side and the opening side of the inner tank 11 is blocked. Thereafter, the carrier 2 is pulled up (step S814). At this time, since the region on the bottom surface 11a side of the inner tank 11 is covered with the partition plate 16, no sedimentary foreign matter is rolled up. And the partition plate 16 is pulled out (step S815), and a series of washing | cleaning processes are complete | finished.

  As described above, according to the present embodiment, the sedimentary foreign matter collected on the bottom surface 11a side of the inner tank 11 is isolated by the partition plate 16 when the carrier 2 is pulled up. I'm sorry. As described above, according to the cleaning device 80 according to the modification of the seventh embodiment, the reattachment of foreign matters can be prevented, so that the long-term reliability and yield of the semiconductor device can be improved. Further, the maintenance interval can be extended, and the throughput can be improved and the running cost can be reduced.

(Eighth embodiment)
The cleaning apparatus according to the eighth embodiment has a discharge port (first discharge port 14 or discharge port 17) for discharging sedimentary foreign matter accumulated on the bottom surface of the inner tank in addition to the movable partition plate that partitions the inner tank. Have.

  FIG. 25 is a schematic diagram showing a cleaning device according to the eighth embodiment of the present invention. In FIG. 25, the configuration denoted by the same reference numeral as that of the seventh embodiment (cleaning device 80, see FIG. 23) is the same as the configuration of the seventh embodiment (cleaning device 80) denoted by the corresponding symbol. is there.

  As shown in FIG. 25 (a), in the cleaning device 90 of the present embodiment, the inner tub 11 has a side wall 11b and a mortar-shaped bottom surface 11a formed with a depressed central portion, and the bottom surface 11a A third discharge port 17 for discharging foreign matter is provided at the lowest central portion. The third discharge port 17 can be opened and closed. As shown in FIG. 23B, when the liquid level of the cleaning liquid 3 in the outer tub 4 is lowered, the third discharge port 17 is opened so that the vicinity of the bottom surface 11a. It is possible to discharge the sedimentary foreign matter collected in the inner tank 11 together with the cleaning liquid 3.

  In addition, the inner tank 11, the outer tank 4, the outer tank discharge port 5, the filtration cleaning device 6 and the first supply port 12 of the cleaning device 90 are the same as the corresponding configurations in the seventh embodiment (cleaning device 80).

  Next, the cleaning operation of the cleaning device 90 according to the eighth embodiment will be described. FIG. 26 is a flowchart showing the cleaning operation of the cleaning apparatus 90 according to the eighth embodiment of the present invention.

  First, in a state where the third discharge port 17 is closed, the filtration circulation device 6 is operated to start circulation of the cleaning liquid 3 (step S911). Next, the carrier 2 is put into the inner tank 11, and the wafer 1 is cleaned for a predetermined time (step S912). Next, the partition plate 16 is inserted into the inner tank 11 (step S913). Thereby, the movement of the cleaning liquid 3 between the area on the bottom surface 11a side and the area on the opening side in the inner tank 11 is prevented. Thereafter, the carrier 2 is pulled up (step S914). At this time, even if the carrier 2 is pulled up, the sedimentary foreign matter does not rise. Thereafter, the first supply valve 22 is closed to stop the supply of the cleaning liquid 3 (step S915). Thereby, discharge | emission of the washing | cleaning liquid 3 advances from the outer tank discharge port 5 of the outer tank 4, Thereby, as shown in FIG.25 (b), the liquid level of the washing | cleaning liquid 3 of the outer tank 4 falls. Then, the 3rd discharge port 17 is opened and the washing | cleaning liquid 3 of the area | region by the side of the bottom face 11a of the inner tank 11 is discharged | emitted (step S916). At this time, the sedimentary foreign matter collected on the bottom surface 11 a side of the inner tank 11 is discharged together with the cleaning liquid 3. Then, the 3rd discharge port 17 is closed and the partition plate 16 is pulled out from the inner tank 11 (step S917). Further, the first supply valve 22 is opened to start supplying the cleaning liquid 3 (step S918), and the series of cleaning operations is finished.

  As described above, according to the cleaning device 90 of the present embodiment, the partition plate 16 that can be inserted into the inner tank 11 is provided, so that the foreign matter does not rise when the carrier 2 is pulled up. For this reason, the reattachment of a foreign substance can be prevented. Furthermore, since the third discharge port 17 is provided in the lowest part of the bottom surface 11 of the inner tank 11, the sedimentary foreign matter collected in the inner tank 11 can be discharged together with the cleaning liquid 3. Thereby, the maintenance interval of the cleaning device 90 can be extended, and the throughput can be improved and the running cost can be reduced.

(Modification of the eighth embodiment)
The cleaning device of the present embodiment is not limited to the above-described example (cleaning device 90, see FIG. 25), and can be configured as follows. FIG. 27 is a schematic diagram showing a cleaning device according to a modification of the eighth embodiment of the present invention. In FIG. 27, the configuration with the same reference numerals as the cleaning device 90 of the eighth embodiment is the same as the configuration of the cleaning device 90 with the corresponding reference numerals.

  The cleaning device 100 according to the modified example of the eighth embodiment is provided with a first discharge port 14 instead of the third discharge port 17 (see FIG. 25) of the cleaning device 90 of the eighth embodiment. As shown in FIG. 27, the first discharge port 14 is formed in the lowest portion (center portion) of the bottom surface 11 a of the inner tank 11. The first discharge port 14 is connected to the discharge side of the filtration cleaning device 6, and a first discharge valve 24 is provided in the piping between the filtration circulation device 6. Further, an outer tank discharge valve 26 is provided in a pipe between the outer tank discharge port 5 and the filtration cleaning device 6.

  Hereinafter, the cleaning operation of the cleaning apparatus 100 will be described with reference to FIG. FIG. 28 is a flowchart showing the cleaning operation of the cleaning apparatus according to the modification of the eighth embodiment of the present invention.

  As shown in FIG. 28, first, the overcleaning device 6 is operated with the first discharge valve 24 closed and the outer tank discharge valve 26 opened, and the circulation of the cleaning liquid 3 is started (step S1011). Next, the carrier 2 is put into the inner tank 11, and the wafer 1 is cleaned for a certain time (step S1012). Next, the partition plate 16 is inserted into the inner tank 11 (step S1013). Thereafter, the carrier 2 is pulled up (step S1014). At this time, since the region on the bottom surface 11a side of the inner tank 11 is covered with the partition plate 16, even if the carrier 2 is pulled up, the sedimentary foreign matter collected on the bottom surface 11a side does not roll up.

  Next, the outer tank discharge valve 26 is closed, the first discharge valve 24 is opened, and the cleaning liquid 3 at the inner tank bottom is discharged (step S1015). Thereby, the cleaning liquid 3 in the region below the partition plate 16 of the inner tank 11 is discharged. At this time, together with the cleaning liquid 3, sedimentary foreign matter is discharged from the first discharge port 14 to the outside of the inner tank 11. Thereafter, the outer tank discharge valve 26 is opened, and the first discharge valve 24 is closed (step S1016). Then, the partition plate 16 is pulled out (step S1017), and a series of cleaning operations is completed.

  As described above, according to the cleaning apparatus 100 according to the modified example of the eighth embodiment, it is possible to prevent the reattachment of foreign matters, so that the long-term reliability and yield of the semiconductor device can be improved. Further, the maintenance interval can be extended, and the throughput can be improved and the running cost can be reduced.

(Ninth embodiment)
The ninth embodiment relates to the structure of the inner tub suitable for each cleaning device according to the first to eighth embodiments.

(Configuration example 1 of the ninth embodiment)
The structural example 1 of 9th Embodiment is related with what has arrange | positioned the helical plate-shaped member in the bottom face vicinity of the inner tank which has a mortar-shaped bottom face. FIG. 29 is a schematic diagram showing an inner tank according to Configuration Example 1 of the ninth embodiment of the present invention.

  The inner tub 110 of this configuration example includes a rectangular side wall 110b and a mortar-shaped bottom surface 110a having a depressed central portion. Further, a plate-like member 111 formed in a spiral shape is provided above the bottom surface 110a. The first supply port 12 is a portion above the spiral plate-shaped member 111 and is provided in the vicinity of the side wall 110 b of the inner tank 110.

  The inner tank 110 functions as follows by being used instead of the inner tank 11 of the cleaning apparatus 10 of the first embodiment, for example. By jetting the cleaning liquid 3 upward from the first supply port 12, a flow upward is generated in a portion above the first supply port 12 of the inner tank 110, and thereby floating foreign substances are generated in the inner tank 110. It is discharged from the opening. On the other hand, the sedimentary foreign matter falls below the object to be cleaned (wafer 1) and eventually gathers at the lowest portion of the inner tank 110 along the inclination of the spiral plate-like member 111. Since the sedimentary foreign matter collected in the lowest part of the inner tank 110 is covered with the plate-like member 111, it is difficult to wind up by raising the carrier 2 or ejecting the first supply port 12. As described above, by using the inner tank 110 according to the configuration example 1 of the present embodiment instead of the inner tank 11 of the cleaning device 10, it is possible to prevent reattachment due to rolling-up of the sedimentary foreign matter. In addition, the inner tank 110 of this structural example can be used also for the washing | cleaning apparatus which concerns on 2nd Embodiment thru | or 8th Embodiment.

(Configuration example 2 of the ninth embodiment)
The configuration example 2 of the ninth embodiment will be described below. FIG. 30 is a cross-sectional view showing an inner tank according to Configuration Example 2 of the ninth embodiment of the present invention. This configuration example 2 relates to an inner tank in which plate-like members arranged alternately are provided above a mortar-shaped bottom surface.

  The inner tank 115 has a side wall 115b formed in a rectangular shape and a mortar-shaped bottom surface 115a having a depressed center. As shown in FIG. 30, a plate-like member 116 is formed above the bottom surface 115 a of the inner tank 115 so that the tip end side is lowered. These plate-like members 116 extend from the side wall 115b and the bottom surface 115a in the mutually opposing directions, and the front end side alternately intersects with a certain interval in the vertical direction. As shown in FIG. 30, the lowest part of the inner tank 115 is covered with the plate-like member 116 described above. The first supply port 12 is a part above the plate-like member 116 and provided in a part near the side wall 115 b of the inner tank 115.

  For example, the inner tank 115 functions as follows by being used instead of the inner tank 11 of the cleaning device 10 of the first embodiment. By ejecting the cleaning liquid 3 upward from the first supply port 12, a flow upward is generated in a portion above the first supply port 12 of the inner tank 110, and thereby floating foreign substances are generated in the inner tank 115. It is discharged from the opening. On the other hand, the sedimentary foreign matter falls below the object to be cleaned (wafer 1) and eventually gathers at the lowest portion of the inner tank 115 along the inclination of the plate member 116.

  Since the sedimentary foreign matter collected in the lowest part of the inner tank 115 is covered with the plate-like member 111, it is difficult to wind up by raising the carrier 2 or ejecting the first supply port 12. As described above, since the inner tank 115 according to the configuration example 1 of the present embodiment is used instead of the inner tank 11 of the cleaning device 10, it is difficult for the sedimentary foreign matter to roll up. Can be prevented. In addition, the inner tank 115 of this structural example can also be used for the cleaning apparatus according to the second to eighth embodiments.

(Configuration Example 3 of Ninth Embodiment)
The configuration example 3 of the ninth embodiment will be described below. FIGS. 31A to 31D are schematic views showing an inner tank according to Configuration Example 3 of the ninth embodiment. FIG. 31A shows a cross section of the inner tub of the present configuration example with the sheet member pulled out, and FIG. 31B shows the inner tub of the present configuration example with the sheet member pulled out from above. Shows how it was done. FIG. 31 (c) shows a cross section of the inner tank of the present configuration example with the sheet member pushed in, and FIG. 31 (d) shows the inner tank of the present configuration example with the sheet member pushed in from above. Shows how it was done.

  As shown in FIG. 31A, the inner tank 120 according to the configuration example 3 of the ninth embodiment includes a side wall 120b formed in a rectangular shape and a mortar-shaped bottom surface 120a having a depressed center. . On the bottom surface 120a of the inner tank 120, a guide member 122 for guiding a moving direction of a sheet member 121 described later is formed. The first supply port 12 is a portion above the guide member 122 and is provided on the peripheral side of the inner tank 120.

  A pair of sheet members 121 are provided inside the inner tank 120. The sheet member 121 is disposed along the inner surface of the side wall 120b facing each other, and can be pushed in the direction of arrow c while sliding on the side wall 120b, as shown in FIG. A portion on the front end side of the sheet member 121 is guided by the guide member 122 and is bent toward the center side of the inner tank 120. As shown in FIG. 31B, the sheet member 121 has an opening 121a. The above-mentioned first supply port 12 protrudes toward the center side of the inner tank 120 through the opening 121a. Since the opening 121a extends in the direction in which the sheet member 121 is pushed in, the sheet member 121 can be pushed into the inner tank 120 with the first supply port 12 protruding. The 1st jet nozzle 12 and opening part 121a which were provided in the surface which opposes are arrange | positioned in the position which mutually shifted | deviated as shown in FIG.31 (b).

  As shown in FIG. 31 (c), when the sheet member 121 is pushed in, the front end portion of the sheet member 121 is guided by the guide member 122 and extends toward the center of the inner tank 120. Then, both the sheet members 121 overlap with each other, and the upper part of the bottom surface 120a is covered with the pair of sheet members 121. In addition, as shown in FIG. 31 (d), the openings 121a are arranged at positions shifted from each other. Thereby, each opening part 121a can be plugged up by the sheet member 121 on the opposite side. Thus, the area | region by the side of the bottom face 120a of the inner tank 120 can be isolated by pushing in the sheet | seat member 121. FIG.

  The inner tank 120 functions as follows, for example, by using it instead of the inner tank 11 of the cleaning device 10 of the first embodiment. By jetting the cleaning liquid 3 upward from the first supply port 12, an upward flow is generated in a portion above the first supply port 12 of the inner tank 120. At this time, the sheet member 121 is pulled out as shown in FIG. When the object to be cleaned (wafer 1) is put into the inner tank 120 and cleaning is performed in this state, floating foreign matters are discharged from the upper part (opening) of the inner tank 120, and sedimentary foreign matters are removed from the object to be cleaned (wafers). It falls below 1) and gathers at the lowest part of the bottom surface 120a.

  Thereafter, after the cleaning of the object to be cleaned is completed, the state shown in FIG. 31 (the sheet member 121 is pushed into the inner tank 120 and shown in FIG. 31B. Next, the object to be cleaned is pulled up. Although a turbulent flow is generated in 120 due to the lifting of the object to be cleaned, since the upper part of the bottom surface 120a is covered with the pair of sheet members 121, it is possible to prevent the sedimentary foreign matter from rolling up near the bottom surface 120a. Therefore, by using the inner tank 110 according to the configuration example 1 of the present embodiment instead of the inner tank 11 of the cleaning apparatus 10, the foreign matter of the sedimentary foreign matter is prevented from rolling up, and the reattachment of the sedimentary foreign matter is prevented. The inner tank 120 of this configuration example can also be used in the cleaning device according to the second to eighth embodiments.

  Further, the cleaning device of this configuration example of the ninth embodiment is not limited to the above-described configuration. For example, in the inner tank 120 shown in FIG. 31B, the first supply port 12 can be provided on the upper and lower side walls 120b in the drawing. In this case, since the first supply port 12 is provided on the side wall 120b on the side not covered by the sheet member 121, the opening 121a may not be provided in the sheet member 121.

  The cleaning apparatus of the above-described embodiments of the present invention described above can be used for manufacturing a semiconductor device. For example, as a cleaning process performed during application, development, ion implantation, patterning process, and the like, cleaning using the above-described various types of cleaning apparatuses can be performed. As a result, the reattachment of foreign matters in the cleaning process can be prevented, so that the long-term reliability and yield of the manufactured semiconductor device can be improved. In addition, since the cleaning apparatuses of the above-described embodiments can extend the regular maintenance interval, the throughput of the semiconductor manufacturing process can be improved and the running cost can be reduced.

  Furthermore, the cleaning apparatus of the above-described embodiments can be used not only in the semiconductor device manufacturing process but also in various electronic device manufacturing processes in which various materials such as magnetic materials and piezoelectric materials are formed and patterned.

  Hereinafter, various aspects of the present invention will be collectively described as supplementary notes.

  (Appendix 1) An inner tank provided with a cleaning liquid supply port for ejecting a cleaning liquid on the inside, an outer tank disposed so as to cover the bottom surface and the side wall of the inner tank, and collecting the cleaning liquid overflowing from the inner tank, The cleaning apparatus is characterized in that the bottom surface of the inner tank is formed in a mortar shape with a low center and the cleaning liquid supply port is disposed at a location away from the lowest part of the inner tank.

  (Additional remark 2) Furthermore, the plate-shaped member inclined toward the lowest part of the bottom face of the said inner tank is arrange | positioned near the bottom face of the said inner tank, The washing | cleaning apparatus of Additional remark 1 characterized by the above-mentioned.

  (Supplementary note 3) The cleaning apparatus according to Supplementary note 1 or 2, wherein the cleaning liquid supply port is disposed on one or both of a bottom surface side of the inner tank and an upper end side of the inner tank.

  (Additional remark 4) Furthermore, the 1st discharge port which discharges the said washing | cleaning liquid is provided in the lowest part of the bottom face of the said inner tank, The washing | cleaning apparatus of any one of Additional remark 1 thru | or 3 characterized by the above-mentioned.

  (Supplementary note 5) The cleaning apparatus according to any one of supplementary notes 1 to 4, further comprising a plurality of second discharge ports for discharging the cleaning liquid from a side wall to a bottom surface of the inner tank.

  (Additional remark 6) Furthermore, it was provided so that insertion / extraction was possible in the said inner tank, and the movable partition plate which isolates the said washing | cleaning liquid of the bottom face side of the said inner tank when it was inserted in the said inner tank was characterized by the above-mentioned. The cleaning apparatus according to any one of appendices 1 to 4.

  (Supplementary Note 7) The cleaning liquid supply port is disposed on both the bottom surface side of the inner tank and the upper end side of the inner tank, and the cleaning liquid provided on the bottom surface side of the inner tank when the object to be cleaned is cleaned. The cleaning apparatus according to claim 3, wherein the cleaning liquid is ejected from a cleaning liquid supply port provided on an upper end side of the inner tank when the cleaning liquid is sprayed from a supply port and the object to be cleaned is pulled out from the inner tank. .

  (Supplementary note 8) The cleaning apparatus according to supplementary note 4, wherein the first discharge port discharges the cleaning liquid only when the object to be cleaned is pulled out of the inner tank.

  (Supplementary note 9) An inner tank provided with a cleaning liquid supply port for ejecting a cleaning liquid on the inner side, an outer tank disposed so as to cover the bottom surface and the side wall of the inner tank, and collecting the cleaning liquid overflowing from the inner tank, And a bottom of the inner tub is formed in a mortar shape with a low center, and the cleaning liquid supply port is disposed away from the lowest part of the inner tub. A cleaning method, comprising: a step of performing cleaning by putting the object to be cleaned into the inner tank while performing injection from the cleaning liquid supply port; and a step of pulling up the object to be cleaned from the inner tank. A characteristic cleaning method.

  (Supplementary Note 10) An inner tank provided with a cleaning liquid supply port for ejecting a cleaning liquid inside, an outer tank disposed so as to cover a bottom surface and a side wall of the inner tank, and collecting the cleaning liquid overflowing from the inner tank, And a bottom of the inner tub is formed in a mortar shape with a low center, and the cleaning liquid supply port is disposed away from the lowest part of the inner tub. A method for manufacturing a semiconductor device, the step of performing cleaning by putting the object to be cleaned into the inner tank while spraying from the cleaning liquid supply port, and the step of pulling up the object to be cleaned from the inner tank. A method for manufacturing a semiconductor device, comprising:

1A and 1B are schematic views showing a conventional cleaning apparatus. FIGS. 2A and 2B are schematic views showing the cleaning apparatus according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating a configuration example of the first supply port of the cleaning device according to the first embodiment. FIG. 4 is a perspective view showing an appearance of the cleaning apparatus according to the first embodiment of the present invention. FIG. 5 is a perspective view showing an example of a carrier and a wafer used in the cleaning apparatus according to the first embodiment of the present invention. FIG. 6 is a flowchart showing a cleaning operation example 1 of the cleaning apparatus according to the first embodiment of the present invention. FIG. 7 is a flowchart showing a cleaning operation example 2 of the cleaning apparatus according to the first embodiment of the present invention. FIG. 8 is a schematic view showing a cleaning apparatus according to the second embodiment of the present invention. FIGS. 9A and 9B are cross-sectional views illustrating a configuration example of the second supply port of the cleaning device according to the second embodiment. FIG. 10 is a flowchart showing an example of the cleaning operation of the cleaning apparatus according to the second embodiment of the present invention. FIG. 11 is a schematic view showing a cleaning apparatus according to the third embodiment of the present invention. FIG. 12 is a flowchart showing a cleaning operation example 1 of the cleaning apparatus according to the third embodiment of the present invention. FIG. 13 is a flowchart showing a cleaning operation example 2 of the cleaning apparatus according to the third embodiment of the present invention. FIG. 14 is a schematic view showing a cleaning apparatus according to the fourth embodiment of the present invention. FIG. 15 is a flowchart showing a cleaning operation example 1 of the cleaning apparatus according to the fourth embodiment of the present invention. FIG. 16 is a flowchart showing a cleaning operation example 2 of the cleaning apparatus according to the fourth embodiment of the present invention. FIG. 17 is a schematic view showing a cleaning apparatus according to the fifth embodiment of the present invention. FIG. 18 is a flowchart showing an example of the cleaning operation of the cleaning apparatus according to the fifth embodiment of the present invention. FIG. 19 is a schematic view showing a cleaning apparatus according to the sixth embodiment of the present invention. FIG. 20 is a schematic diagram illustrating an example of the cleaning operation of the cleaning device according to the sixth embodiment of the present invention. FIG. 21 is a schematic view showing a cleaning apparatus according to a modification of the sixth embodiment of the present invention. FIG. 22 is a flowchart showing an example of the cleaning operation of the cleaning device according to the modification of the sixth embodiment of the present invention. FIGS. 23A and 23B are schematic views showing a cleaning apparatus according to the seventh embodiment of the present invention. FIG. 24 is a flowchart showing an example of the cleaning operation of the cleaning device according to the seventh embodiment of the present invention. FIGS. 25A and 25B are schematic views showing a cleaning apparatus according to the eighth embodiment of the present invention. FIG. 26 is a flowchart showing an example of the cleaning operation of the cleaning device according to the eighth embodiment of the present invention. FIG. 27 is a schematic view showing a cleaning device according to a modification of the eighth embodiment of the present invention. FIG. 28 is a flowchart showing an example of the cleaning operation of the cleaning device according to the modification of the eighth embodiment of the present invention. FIG. 29 is a perspective view showing an inner tank according to Configuration Example 1 of the ninth embodiment of the present invention. FIG. 30 is a cross-sectional view showing an inner tank according to Configuration Example 2 of the ninth embodiment of the present invention. FIGS. 31A to 31D are schematic views showing an inner tank according to Configuration Example 3 of the ninth embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wafer, 2 ... Carrier, 3 ... Cleaning liquid, 4 ... Outer tank, 5 ... Outer tank discharge port, 6 ... Filtration circulation apparatus (CRS), 7 ... Cleaning liquid supply port, 8 ... Foreign material (precipitation), 9 ... Foreign material (Floatability) 10, 20, 30, 40, 50, 60, 70, 80, 90, 100 ... Cleaning device, 11, 110, 115, 120, 201 ... Inner tank, 11a, 110a, 115a, 120a, 201a ... bottom surface, 11b, 110b, 115b, 120b, 201b ... side wall, 12 ... first supply port, 13 ... second supply port, 14 ... first discharge port, 15 ... second discharge port, 16 ... partition plate, 17 ... 3rd discharge port, 18 ... heater, 22 ... 1st supply valve, 23 ... 2nd supply valve, 24 ... 1st discharge valve, 25 ... 2nd discharge valve, 26 ... outer tank discharge valve, 74 ... 1st discharge pump 75 ... Second discharge pump, 111, 116 - plate-like member, 121 ... sheet member, 122 ... guide member.

Claims (5)

An inner tank provided with a cleaning liquid supply port for jetting the cleaning liquid on the inside;
An outer tank disposed so as to cover the bottom and side walls of the inner tank, and collecting the cleaning liquid overflowing from the inner tank,
The cleaning apparatus according to claim 1, wherein a bottom surface of the inner tank is formed in a mortar shape having a low center, and the cleaning liquid supply port is disposed at a position away from the lowest part of the inner tank.   Furthermore, the washing | cleaning apparatus of Claim 1 by which the plate-shaped member inclined toward the lowest part of the bottom face of the said inner tank is arrange | positioned in the bottom face vicinity of the said inner tank.   The cleaning apparatus according to claim 1, wherein the cleaning liquid supply port is disposed on one or both of a bottom surface side of the inner tank and an upper end side of the inner tank. An inner tank provided with a cleaning liquid supply port for jetting the cleaning liquid on the inside;
An outer tank disposed so as to cover the bottom and side walls of the inner tank, and collecting the cleaning liquid overflowing from the inner tank,
In the cleaning method using the cleaning device, the bottom surface of the inner tank is formed in a mortar shape with a low center and the cleaning liquid supply port is disposed at a location away from the lowest part of the inner tank. There,
Performing the cleaning by putting the object to be cleaned into the inner tank while performing the injection from the cleaning liquid supply port;
And a step of pulling up the object to be cleaned from the inner tank. An inner tank provided with a cleaning liquid supply port for jetting the cleaning liquid on the inside;
An outer tank disposed so as to cover the bottom and side walls of the inner tank, and collecting the cleaning liquid overflowing from the inner tank,
A bottom surface of the inner tank is formed in a mortar shape with a low center, and the cleaning liquid supply port is disposed at a location away from the lowest part of the inner tank. A manufacturing method comprising:
Performing the cleaning by putting the object to be cleaned into the inner tank while performing the injection from the cleaning liquid supply port;
And a step of pulling up the object to be cleaned from the inner tub.

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