JP2009216520A - Socket for inspecting ic package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC-package inspecting socket capable of preventing production of stresses in the package body of an IC package and external leads, and is excellent in contact reliability. <P>SOLUTION: The socket 10 is provided with a large number of electric contacts 12 and a cover 50. Each of the electric contacts 12 has a lower contact arm 22 which is united to a part 18 to be fixed to a base 14 via a spring part 24, and supports the base end part 4a of an external lead 4 adjoining the package body 6 of the IC package 8, and an upper contact arm 26 which presses the base end part 4a of the external lead 4 from the upside. The cover 50 engages with an operating lever 30 provided on the upper arm 26, and rotates the upper arm 26 between an open position where the IC package 8 is freely approachable to the upside of the lower arm 22, and a press position where the base end part 4a of the external lead 4 is pressed downwards and the lower arm 22 is displaced downwards while resisting the urging force of the spring part 24. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a socket for inspecting an IC package in which a large number of external leads, each having a mounting surface disposed at a tip portion, are protruded from the edge of a package body.

  Various types of sockets have been developed in order to connect the mounted IC package to a test device such as a burn-in device and inspect for the presence of an initial failure.

  For example, for the inspection of a surface-mount IC package in which an L-shaped lead terminal protrudes from the periphery of the package body, such as a gull-wing type external lead, a cut portion is provided at one tip and the other tip A pair of clamping pieces provided with a hook part in the part is formed on the contact pin, and the cut part and the hook part sandwich the bent part at the tip of the external lead forming the mounting surface for surface mounting, A socket for holding the IC package without pressing the lead terminal by the hook portion and using the lid has been developed (see, for example, Patent Document 1).

In addition, by supporting the shoulder of the external terminal adjacent to the package body of the external lead by the positioning base formed on the socket body, the mounting surface provided at the tip of the external lead is supported by floating from the package body, A socket for a semiconductor device has also been developed in which the movable contact terminal disposed facing the external lead presses the upper surface or the inclined surface of the shoulder of the external lead supported by the socket body (see, for example, Patent Document 2).
JP-A-62-93964 JP-A-6-231845

  When holding the bent part at the tip of the external lead of the IC package with a pair of holding pieces formed on the contact pin, the bent part of the external lead of the IC package is securely connected by the holding part formed on the contact pin of the socket. The IC package can be securely locked to the socket body, but the contact pin clamping portion locks the bent portion forming the mounting surface. Therefore, the external lead is deformed, and a large load acts on the socket body. Further, it may cause peeling in the coating such as plating on the tip of the external lead.

  In particular, as the density and size of the IC package are increased, the plate-shaped resin layer forming the package body is thinned and the number of external leads is increased, thereby increasing the possibility of damage to the IC package.

  On the other hand, when floating and supporting the tip of the external lead by the socket body, a thin burr or surface oxide film formed when forming the package body is formed on the shoulder surface of the external lead adjacent to the package body. As a result, good electrical contact is hindered. In particular, since the movable contact terminal contacts the external lead only at one point from the upper side, the contact reliability is inferior.

  The present invention has been made based on such circumstances, and an object of the present invention is to provide an IC package inspection socket having excellent contact reliability without causing stress on the package body and external leads of the IC package. And

  The socket of the present invention that achieves the above object is a socket for inspecting an IC package in which a large number of external leads having a mounting surface disposed at the front end portion are protruded from the side of the package body. A fixed portion fixed to the base, a lower contact arm connected to the fixed portion via a spring portion and supporting a base end portion of the external lead adjacent to the package body from below, and a spring portion to the fixed portion A plurality of electrical contacts having an upper contact arm that presses the proximal end portion of the external lead supported by the lower contact arm from above and an operating lever provided on the upper contact arm. The open position where the IC package can be freely moved on the lower contact arm and the base end portion of the external lead supported by the lower contact arm downward Pressure and wherein the the lower contact arm and an insulating material made driving member for rotating said on contact arm between a pressing position to displace downward against the biasing force of the spring portion.

  The base is provided with a guide for guiding the lower contact arm, and the guide preferably has a guide hole for tilting the lower contact arm when the spring portion of the lower contact arm is bent.

  The spring part between the upper contact arm and the fixed part preferably biases the upper contact arm in the direction of the pressing position.

  Further, the lower contact arm may have an ear portion that is locked by the guide and restricts a protruding amount from the guide hole.

  Furthermore, it is preferable that the contact of the upper contact arm and the contact of the lower contact arm urge the base end portion of the external lead from both sides at a position facing each other.

  According to the socket of the present invention, the external lead of the IC package is pressed against the base end portion adjacent to the package body by the lower contact arm and the upper contact arm of the electrical contact, so that the lower contact arm and the upper contact are provided. The electrical contact is reliably brought into contact with both of the contacts with the arm, and the upper contact arm presses the base end portion of the external lead supported by the lower contact arm downward so that the lower contact arm is moved to the spring portion. A very high contact reliability can be obtained by the wiping action that is displaced downward against the urging force. Further, since the upper contact arm and the lower contact arm are respectively connected to the fixed portion via the spring portion, the force acting on the external lead is distributed to the upper contact arm and the lower contact arm, In addition, since the upper contact arm and the contact arm support the base end portion adjacent to the package body from above and below, the moment acting on the external leads is extremely small. The deformation action can be made extremely small.

  Thus, according to the present invention, an IC package inspection socket having excellent contact reliability can be provided without causing stress on the package body and external leads of the IC package.

  When the guide provided on the base has a guide hole that tilts the lower contact arm when the spring part of the lower contact arm is bent, the wiping action of the lower contact arm is ensured to further improve the contact reliability. Can be increased.

  When the spring part between the upper contact arm and the fixed part forms an urging force in the direction of pressing the upper contact arm against the lower contact arm, it operates with a certain pressing force or contact force against the external lead. Reliability can be improved.

  When the guide provided on the base restricts the protruding amount from the guide hole by locking the ear part of the lower contact arm, the protruding height of these lower contact arms can be kept constant. it can.

  In addition, when the contact of the upper contact arm and the contact of the lower contact arm urge the base end of the external lead from opposite sides, the moment acting on the external lead is minimized, and the package The stress acting on the main body is also minimized.

  The figure shows a socket 10 according to a preferred embodiment of the invention for inspecting an IC package 8 (see FIGS. 4 and 5).

  As shown in FIG. 1, this socket 10 is formed as an open top type socket, and is suitable for mounting and removing the IC package 8 from above. The IC package 8 (FIGS. 4 and 5) to be inspected by being mounted on the socket 10 of the present embodiment is not limited to this, but an L-shaped external lead is formed from the four edges of the package body 6 having a thin plate structure. 4 is formed in a surface mount type called QFP (quad flat package). The external lead 4 has a base end portion 4 a adjacent to the package body 6 formed in a horizontal beam shape substantially parallel to the package body 6, and a mounting surface 4 b formed below the bent tip portion.

  As shown in FIGS. 1 to 3, the socket 10 according to the present embodiment includes a base 14 made of an insulating material that supports a large number of electrical contacts 12 and is attached to a board (not shown) such as a socket board or a burn-in board. The base 14 is formed in a substantially rectangular thick plate shape, and bases 16 arranged at four corners protrude upward from the flat upper surface 14a. A large number of receiving holes 20 for receiving and fixing the fixing portions 18 of the electrical contacts 12 are opened in the upper surface 14a along the edges arranged between the base portions 16.

  In the electrical contact 12 of the present embodiment, the fixed portion 18 is formed in an L shape having a horizontal portion and a vertical portion. Three fixing legs 18 a projecting downward from the horizontal portion are fitted into the fixing holes 20 a continuing to the accommodation holes 20 and fixed to the base 14. A connection terminal 18 b extending from one of the fixed legs 18 a protrudes from the lower surface of the base 14.

  A lower contact arm 22 that engages with the external lead 4 of the IC package 8 from below is connected to the lateral tip of the L-shaped fixing portion 18 via a spring portion 24. The lower contact arm 22 extends upward from the distal end portion of the spring portion 24 having a curved structure, that is, on the side opposite to the fixed leg 18a. The base portion connected to the spring portion 24 has a side portion 23 protruding sideways. It protrudes toward. By this spring portion 24, the lower contact arm 22 can be moved up and down and tilted as a whole.

  Further, an upper contact arm 26 that engages with the external lead 4 of the IC package 8 from above is connected to the front end side of the vertical portion of the fixed portion 18 via a spring portion 28. The upper contact arm 26 extends from the distal end portion of the spring portion 28 having a curved structure in an inclined direction toward the lower contact arm 22. In a natural state, that is, in a state where no external force is applied to the spring parts 24 and 28, the contact part provided at the front part of the upper contact 26 presses the front part, that is, the contact part of the lower contact arm 22.

  Further, an L-shaped actuating lever 30 for tilting the upper contact arm 26 is integrally formed at the base of the upper contact arm 26, and above the spring portion 28, on the vertical portion side of the fixed portion 18. Project outward. When the operation lever 30 is driven by a driving member to be described later, the upper contact arm 26 has a position where the tip portion presses the tip portion of the lower contact arm 26 and a position where the tip portion of the lower contact arm 26 is separated from the tip portion. And pivots about the base.

  The electrical contact 12 in the present embodiment can be formed by stamping from a suitable metal plate such as beryllium copper having a plate thickness of about 0.18 mm. In a state where the tip portion of the upper contact arm 26 presses the tip portion of the lower contact arm 22, a space sufficient to accommodate the external lead 4 of the IC package 8 between the upper contact arm 26 and the lower contact arm 22. Is formed. As a result, various IC packages 8 with different protruding lengths of the external leads 4 can be mounted and inspected.

  An insulating material guide 32 for guiding the lower contact arm 22 and the upper contact arm 26 of the electrical contact 12 is attached to the base 14. The guide 32 has a wall portion 36 extending upward from four edge portions of a rectangular plate-shaped portion 34 placed on the base 14, and a base portion 38 provided through four columnar portions 38. It is positioned in the guide groove 16a on the inner side of the 14 base portions 16, and is fixed to the base 14 by holding legs 40, 42 with hooks protruding from the lower surface, and is held at a predetermined position.

  A lead guide 44 for guiding the external lead 4 of the IC package 8 to the center position on the plate-like portion 34 is formed inside each columnar portion 38. These lead guides 44 are formed by inclined surfaces inside the columnar portion 38, and the interval between the opposing lead guides 44 is wide on the upper opening side and gradually narrows on the plate-like portion 34 side, and the IC package 8 is guided toward the center of the plate-like portion 34. After being guided to the central portion by these lead guides 44, the IC package 8 is guided to the final position by the body guide 45 formed by an inclined surface along the peripheral portion of the plate-like portion 34.

  In the guide 32, a large number of guide slots 46 for swingably accommodating the upper contact arm 26 of the electrical contact 12 are formed in each of the wall portions 36 surrounding the plate-like portion 34. The actuating lever 30 protruding outward from the base portion of the upper contact arm 26 is disposed outside the wall portion 36. The plate-like portion 34 is formed with a large number of guide holes 48 along the thin portion inside the wall portion 36. The guide hole 48 accommodates the lower contact arm 22 of the electrical contact 12 and guides the distal end of the electrical contact 12 so as to contact the lower surface of the base end portion 4 a of the external lead 4 of the IC package 8. The amount or height at which the lower contact arm 22 protrudes from the plate-like portion 34 of the guide 32 is always kept constant when the ear 23 provided on the lower contact arm 22 contacts the lower surface of the plate-like portion 34. The

  Note that the amount by which the tip of the lower contact arm 22 protrudes from the plate-like portion 34 is larger than the distance between the lower surface of the base end portion 4a of the external lead 4 of the IC package 8 and the mounting surface 4b. It is preferable to prevent the mounting surface 4b from coming into contact with the plate-like portion 34 during and before and after. That is, the tip end portion of the lower contact arm 22 that supports the lower surface of the base end portion 4 a of the external lead 4 forms a contact point with the external lead 4 and functions as a support portion that supports the IC package 8.

  The upper side of the guide hole 48 for guiding the lower contact arm 22 is formed to be slightly larger than the width of the lower contact arm 22, and as will be described later, when pressed by the upper contact arm 26, the lower contact arm 22 The arm 22 can descend while tilting forward in the guide hole 48. Thereby, the contact of the front-end | tip part of the lower contact arm 22 wipes the lower surface of the base end part 4a of the external lead 4, and ensures favorable electrical contact. When the wiping is performed from the outer peripheral side to the inner peripheral side of the IC package 8, the IC package 8 can be guided to a more accurate position toward the center of the guide 32.

  A cover 50 made of an insulating material covering the electrical contact 12 from above is attached on the base 14. The cover 50 has a rectangular frame-shaped cover main body 54 in which an opening 52 through which the IC package 8 enters and exits is formed at the center, and a columnar slide guide 56 extending downward from a corner of the cover main body 54. It is slidably inserted into a through hole 58 formed in the base portion 16 of the base 14 and positioned with respect to the base 14 and the guide 32. The maximum separation distance between the base 14 and the cover 50 is determined by the length of a regulating member such as a rivet (not shown) inserted through the slide guide 56. By connecting the base 14 and the cover 50 with such rivets or the like, the structural strength of the base 14 and the cover 50 can be increased. A coil spring (not shown) is preferably disposed around the slide guide 56 to urge the cover 50 in a direction away from the base 14.

  The cover 50 of this embodiment is formed as a drive member that rotates the upper contact arm 26, and a plurality of lever slots 58 that accommodate the operating lever 30 are formed in the cover main body 54. Each lever slot 58 is arranged corresponding to the fixing hole 20 formed in the base 14. These lever slots 58 open downward and inward and outward to accommodate the operating lever 30 provided on the upper contact arm 26. The upper portions of these lever slots 58 are closed by an outwardly inclined surface 60, and when the electrical contact 12, the base 14, the guide 32 and the cover 50 are assembled, the operation surface of the operating lever 30 is attached to the inclined surface 60. The top engages.

  FIG. 3A shows a state in which the electrical contact 12 is mounted in the fixing hole 20 of the base 14 and the guide 32 and the cover 50 are assembled.

  The lower contact arm 22 is inserted into the guide hole 48 of the guide 32, and the protruding amount from the upper surface of the plate-like portion 34 is regulated by the ear portion 23 that is in contact with the lower surface of the guide 32. The operation lever 30 is accommodated in the lever slot 58 of the cover 50, and the tip end portion engages with the inclined surface 60. As a result, the urging force of the spring portion 28 disposed between the upper contact arm 26 and the fixed portion 18 acts on the cover 50, and the cover 50 is disposed at a position spaced upward from the base 14. The upper contact arm 26 protrudes from the guide slot 46 (not shown in FIG. 3) of the guide 32 onto the plate portion 34 and engages with the front end of the lower contact arm 22.

  As shown in FIG. 3B, when the cover 50 is pushed down, the top of the operating lever 30 is pressed by the inclined surface 60 of the lever slot 58 and moves outward. The upper contact arm 26 rotates counterclockwise around the base portion on the spring portion 28 side and retracts into the guide slot 46 (FIG. 1). As a result, the upper contact arm 26 is disposed in the open position, and the entire upper surface of the plate-like portion 34 is opened to the cover 50 in a state where the tip of each lower contact arm 22 is exposed on the upper surface of the plate-like portion 34. Largely open to the outside through 52. Through this opening 52, the IC package 8 can be freely moved on the plate-like portion 34 of the guide 32, and the IC package 8 can be placed on or removed from the tip of the lower contact arm 22.

  4 and 5 show details of the external leads 4 and the electrical contacts 12 when the IC package 8 is mounted.

  When the IC package 8 is inserted through the opening 52 of the cover 50 with the upper contact arm 26 disposed at the open position, the lead guide 44 and the body guide 45 (see FIG. 1) formed on the columnar portion 38. Accordingly, the lower surface of the base end portion 4a of the external lead 4 is placed at the tip of the lower contact arm 22 as shown in FIGS. 4A and 4B. The lower contact arm 22 is supported. The mounting surface 4 b is held in a state of being separated from the plate-like portion 34. Since the tip of the lower contact arm 22 is held in the guide hole 48, it can be reliably engaged with the lower surface of the base end portion 4a of the external lead 4.

  When the force acting on the cover 50, which is a driving member, is released, the cover 50 is moved upward by the urging force of the spring portion 28 acting via the operating lever 30, and the upper contact arm 26 is shown in FIG. From the position shown, it rotates clockwise to the position shown in FIG. At this time, the tip of the upper contact arm 26 engages with the upper surface of the base portion 4a of the outer arm 4, and presses the outer arm 4 downward while sliding on the upper surface. The tip of the lower contact arm 22 is moved downward against the urging force of the spring portion 24 by the urging force of the upper contact arm 26 acting via the external arm 4, and the upper contact arm 26 is moved to the lower contact arm 26. It arrange | positions in the press position which displaced 22 below.

  At the position where the tip of the lower contact arm 22 is displaced downward at this pressing position, the urging forces of the spring portions 24 and 28 are balanced. The external lead 4 and the package main body 6 of the IC package 8 are hardly affected by the load from the lower contact arm 22 and the upper contact arm 26. As shown in FIG. 5, even when the lower contact arm 22 is pressed and bent by the upper contact arm 26, the tip of the external lead 4 is provided with a gap between the upper surface of the plate-like portion 34. The mounting surface 4b is not damaged, or no bending force acts through the plate-like portion 34.

  When the lower contact arm 22 bends downward, the lower contact arm 22 descends while tilting forward in the guide hole 48, so that the tip wipes the lower surface of the base end portion 4a. As a result, even if a thin burr or surface oxide film remains on the base end portion 4a of the external lead 4, good electrical contact is ensured. In addition, since the wiping is performed by tilting the tip of the lower contact arm 22 forward, that is, by moving from the outside toward the package body 6, the IC package 8 is arranged at a more accurate position. Become.

  As described above, in a state where the upper contact arm 26 is disposed at the pressing position, the external lead 4 of the IC package 8 connects the base end portion 4 a adjacent to the package body 6 with the lower contact arm 22 and the upper contact of the electrical contact 12. By being pressed by the arm 26, the electrical contact 12 can be reliably contacted via both the contact points of the lower contact arm 22 and the upper contact arm 26, and the upper contact arm 22 is secured by the lower contact arm 26. A very high contact reliability is obtained by a wiping action by pressing the base end portion 4a of the supported external lead 4 downward and displacing the lower contact arm 22 against the urging force of the spring portion 24. It is done.

  Further, since the upper contact arm 22 and the lower contact arm 26 are connected to the fixed portion 18 via the spring portions 24 and 28, respectively, the force acting on the external lead 4 is connected to the upper contact arm 22 and Since the upper contact arm 22 and the lower contact arm 26 are distributed to the lower contact arm 26 and support the base end portion 4a close to the package body 6 from above and below, the outer contact arm 26 acts on the external lead 4. Therefore, the deformation effect on the external lead 4 and the package body 6 can be made extremely small.

  As a result, the socket 10 for testing the IC package 8 having excellent contact reliability is formed without causing stress on the package body 6 and the external leads 4 of the IC package 8.

  Further, the spring portion 28 disposed between the upper contact arm 26 and the fixed portion 18 forms a biasing force that presses the lower contact arm 22 downward via the upper contact arm 26, thereby providing a constant force to the external lead 4. The pressing force, that is, the contact force can be ensured, and the operation reliability can be improved.

  Further, the contact disposed at the distal end of the upper contact arm 26 and the contact disposed at the distal end of the lower contact arm 22 urge the base end portion 4a of the external lead 4 in opposite directions from both sides at positions facing each other. By doing so, the moment acting on the external lead 4 is minimized, and the stress acting on the package body 6 is also minimized.

  When the IC package 8 is removed after the test is completed, the cover 50 is pressed downward in the same manner as described above. The upper contact arm 26 moves to the open position via the operating lever 30, and the lower contact arm 22 moves the IC package 8 upward via the base end portion 4a.

  Even in the case of repeated inspections, the lower contact arm 22 always keeps the contact at the tip in an accurate position, and the upper contact arm 26 presses the tip of the lower contact arm 22 to the pressing position reliably and accurately. can do.

  In the above-described embodiment, the IC package 8 has been described for QFP inspection. However, it is apparent that the present invention can also be used for other types of IC packages such as SOP (small outline package).

1 is a schematic perspective view showing a socket according to a preferred embodiment of the present invention in an exploded state. The schematic fragmentary sectional view of each part which shows the attachment state of an electrical contact. The operation | movement of the socket of the assembled state is shown, (A) is sectional drawing of a press position, (B) is sectional drawing of an open position. The open position which mounts an IC package is shown, (A) is explanatory drawing of an upper contact arm, a lower contact arm, and an IC package, (B) is an enlarged view of the part enclosed by B of (A). The press position which test | inspects an IC package is shown, (A) is explanatory drawing of an upper contact arm, a lower contact arm, and an IC package, (B) is an enlarged view of the part enclosed by B of (A).

Explanation of symbols

  DESCRIPTION OF SYMBOLS 4 ... External lead, 4a ... Base end part, 4b ... Mounting surface, 8 ... IC package, 10 ... Socket, 12 ... Electrical contact, 14 ... Base, 22 ... Lower contact arm, 18 ... Fixed part, 24, 28 ... Spring , 26 ... upper contact arm, 30 ... actuating lever, 50 ... cover (drive member).

Claims (5)

A socket for inspecting an IC package in which a large number of external leads each having a mounting surface disposed at the front end portion are protruded from the edge of the package body,
A fixed portion fixed to the insulating base, a lower contact arm connected to the fixed portion via a spring portion and supporting the base end portion of the external lead adjacent to the package body from below, and the fixed portion A number of electrical contacts having an upper contact arm that is connected via a spring portion and supported by the lower contact arm and presses the proximal end portion of the external lead from above;
Engage with the operating lever provided on the upper contact arm to push the IC package close to the lower contact arm and the base portion of the external lead supported by the lower contact arm downward. An insulating material drive member that rotates the upper contact arm between a pressing position that displaces the lower contact arm downward against the biasing force of the spring portion.   2. The guide according to claim 1, wherein a guide for guiding the lower contact arm is provided on the base, and the guide has a guide hole for tilting the lower contact arm when a spring portion of the lower contact arm is bent. Socket described in.   3. The socket according to claim 1, wherein a spring portion between the upper contact arm and the fixed portion biases the upper contact arm in the direction of the pressing position.   4. The socket according to claim 2, wherein the lower contact arm has an ear portion that is locked by the guide and restricts a protruding amount from the guide hole. 5.   The contact point of the upper contact arm and the contact point of the lower contact arm urge the base end portion of the external lead from both sides at a position facing each other. The listed socket.

Images