JP2009212115A - Method for manufacturing electronic equipment and electronic circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic equipment for conducting soldering the heat generating component mounted on a heat radiating member as conducted to other electronic component. <P>SOLUTION: An electronic circuit board 1 includes: a mounting board part 10 having a region with a plurality of electronic components mounted and through-holes 11 with the terminals of the heat generating component inserted; and a tentatively-fixing board part 20 with the heat generating components tentatively fixed. The electronic component are mounted on the mounting board part 10. The heat generating components are fixed to the tentatively-fixing board part 20 by tentatively-fixing members 21 and 22, and the lead terminals of the heat generating component are inserted into the through-holes 11. After that, the electronic component mounted on the mounting board part 10 and the lead terminals inserted into the through-holes 11 are soldered by the reflow soldering method. After the soldering, the tentatively fixing members 21 and 22 are detached from the heat generating component and the tentatively-fixing board part 20 is separated off from the electronic circuit board 1. A sub heat sink is attached to the heat generating component as substitute for the detached tentatively-fixing board part 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic device and an electronic circuit board used for the electronic device, and more particularly to a method for manufacturing an electronic device including a heat-generating component such as a power transistor and an electronic circuit substrate for the electronic device.

  A power transistor such as a field effect transistor (FET) is used for an in-vehicle audio amplifier. The power transistor is a so-called heat-generating component that generates heat. An in-vehicle audio amplifier employs an exterior case that functions as a heat sink (heat radiating member) in order to efficiently release the heat of the heat-generating component to the outside. The heat generating component is placed on a sub heat sink that is in surface contact with the exterior case. The heat of the heat generating component is transmitted to the exterior case through the sub heat sink and released to the outside.

  The process for manufacturing the above-described audio amplifier is as follows. First, a plate-like sub heat sink is attached to the edge of the electronic circuit board. A screw hole is provided at the edge of the electronic circuit board, and the sub heat sink is screwed onto the electronic circuit board by a screw inserted into the screw hole. After the sub heat sink is attached to the electronic circuit board, the heat generating component is attached on the sub heat sink. The lead terminal of the heat generating component is inserted into a through hole corresponding to the circuit pattern on the electronic circuit board and soldered.

  As described above, in the conventional audio amplifier, the heat sink is mounted after the sub heat sink is attached to the electronic circuit board. In this case, the electronic component on the electronic circuit board can be soldered by the flow soldering method, but the heat generating component cannot be soldered by the flow soldering method. This is because if the heat generating component is soldered by the flow soldering method, the jet solder is also welded to the sub heat sink and solidifies, and the solidified solder hinders the surface contact between the exterior case and the sub heat sink. Therefore, after soldering the electronic component placed on the electronic circuit board by flow soldering method, attach the sub heat sink to the electronic circuit board and manually solder the lead terminals of the heat generating component placed on the sub heat sink Must be attached.

Furthermore, as described above, a screw hole for fixing the sub heat sink is provided at the edge of the electronic circuit board. For this reason, the electronic circuit board cannot mount electronic components by the space necessary for providing the screw holes.
Japanese Utility Model Publication No. 63-46874 Japanese Utility Model Publication No. 62-8687 JP 2006-303139 A JP 2002-345262 A JP 2004-193386 A

  The objective of this invention is providing the manufacturing method of the electronic device which can be soldered like the other electronic components with respect to the heat-emitting component mounted on a heat radiating member.

  Another object of the present invention is to provide a method of manufacturing an electronic device that does not require a space for fixing a heat dissipation member in the electronic circuit board.

Means for Solving the Problems and Effects of the Invention

  A method of manufacturing an electronic device according to the present invention includes a mounting board portion having a region where a plurality of electronic components are mounted and a through-hole into which a terminal of the heat generating component is inserted, and a temporary fixing for fixing the heat generating component on the surface. A step of preparing an electronic circuit board including a mounting board part including a mechanism and a detachable temporary fixing board part; a step of mounting a plurality of electronic components on the mounting board part; A step of fixing the heat generating component onto the surface of the temporary fixing substrate portion by a temporary fixing mechanism, a step of soldering the terminals of the electronic component and the heat generating component inserted into the through hole, and soldering. After the fixing, the step of releasing the fixing of the heat generating component by the temporary fixing mechanism, the step of separating the temporary fixing substrate portion from the electronic circuit board after releasing the fixing, and the step of attaching the heat dissipation member to the heat generating component Prepare.

  In the method for manufacturing an electronic device according to the present invention, by using an electronic circuit board having a separable temporary fixing board portion, it is not necessary to attach a heat dissipation member to the electronic circuit board when soldering the heat-generating component. Specifically, the temporary fixing base member serves to fix the heat generating component when soldering the heat generating component instead of the heat radiating member. After the soldering of the heat generating component is completed, the temporary fixing substrate portion is separated from the electronic circuit board, and a heat radiating member is attached to the heat generating component instead of the temporary fixing substrate portion. Therefore, it is not necessary to solder the heat-generating component manually, and for example, a soldering method similar to that for other electronic components can be adopted by a flow soldering method or the like.

  Furthermore, since it is not necessary to attach a heat radiating member to the electronic circuit board, a space for arranging a screw or the like for fixing the heat radiating member becomes unnecessary. Therefore, the area where electronic components can be mounted in the electronic circuit board increases.

  Preferably, the temporary fixing mechanism includes a plurality of locking members that are erected and can be bent at intervals corresponding to the width of the heat generating component. The step of fixing the heat generating component includes a step of placing the heat generating component between adjacent locking members and a step of gripping the heat generating component by bending each locking member after the heat generating component is mounted. .

  In this case, the heat generating component can be fixed on the surface of the temporary fixing substrate portion by the locking member.

  An electronic circuit board according to the present invention includes a mounting board part and a temporary fixing board part. The mounting board portion has a region where a plurality of electronic components are mounted and a through hole into which a terminal of the heat generating component is inserted. The temporary fixing substrate portion includes a temporary fixing mechanism for fixing the heat generating component on the surface, and is separable from the mounting substrate portion.

  Preferably, the temporary fixing mechanism includes a plurality of locking members. The plurality of locking members are erected at intervals corresponding to the width of the heat generating component and are bent to grip the heat generating component.

  Preferably, the electronic circuit board has a groove or a slit at the boundary between the mounting board part and the temporary fixing board part.

  In this case, the temporary fixing substrate portion is easily separated from the electronic circuit substrate.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

[Configuration of electronic circuit board]
1 to 3, an electronic circuit board 1 of an electronic device according to an embodiment of the present invention includes a mounting board part 10 and a temporary fixing board part 20. A gap (hereinafter referred to as a slit) 30 is formed between the mounting substrate portion 10 and the temporary fixing substrate portion 20, and a gate 31 is formed between the adjacent slits 30. The temporary fixing substrate unit 20 is connected to the mounting substrate unit 10 by a gate 31.

  A wiring pattern (not shown) is printed on the mounting substrate unit 10. The mounting substrate unit 10 is formed with a plurality of through holes (not shown) corresponding to the wiring patterns. Lead terminals of lead parts (radial lead parts and axial lead parts) are inserted into the plurality of through holes. A surface mounting component (hereinafter referred to as a chip component) and the above-described lead component are mounted on the mounting substrate unit 10.

  The mounting substrate portion 10 further has a plurality of through holes 11 corresponding to the wiring patterns at the edge in the vicinity of the temporary fixing substrate portion 20. Lead terminals of heat-generating components such as power transistors are inserted into the plurality of through holes 11.

  The temporary fixing board part 20 has a temporary fixing mechanism, and temporarily fixes the heat generating component by the temporary fixing mechanism. The temporary fixing mechanism includes a plurality of locking members 21 and 22. The plurality of locking members 21 and 22 are erected on the surface of the temporary fixing substrate portion 20 and are arranged corresponding to the width of the heat generating component. More specifically, the locking members 21 and 22 are erected with an interval corresponding to the width of the heat generating component. The heat generating component is sandwiched between the locking members 21 and 22.

  Each of the locking members 21 and 22 is a gate-shaped frame, and the leg portions of the frame are fixed to the surface of the temporary fixing substrate portion 20. The locking members 21 and 22 are made of a foldable material. For example, the locking members 21 and 22 are made of a bendable metal. The height HE of the locking members 21 and 22 is higher than the height of the heat generating component. After the heat generating component is placed between the locking members 21 and 22, each of the locking members 21 and 22 is bent toward the mounted heat generating component. More specifically, a portion of each locking member that is higher than the height of the heat generating component is bent toward the heat generating component. Thereby, the locking members 21 and 22 hold the heat generating component, and the heat generating component is fixed on the surface of the temporary fixing substrate portion 20.

  The temporary fixing substrate portion 20 fixes the heat generating component on the surface until the lead terminal of the heat generating component is soldered to the through hole 11. After the lead terminals of the heat generating components are soldered, the fixing of the heat generating components by the locking members 21 and 22 is released, and the temporary fixing substrate portion 20 is separated from the electronic circuit substrate 1.

[Manufacturing method of electronic equipment]
If the above-described electronic circuit board 1 is used, it is possible to perform soldering by the flow soldering method in the same manner as other electronic components without manually soldering the heat-generating component. Further, since it is not necessary to previously attach a sub heat sink as a heat dissipation member to the electronic circuit board as a base for fixing the heat generating component, a space for providing a screw hole or the like for attaching the sub heat sink becomes unnecessary. Hereinafter, a method for manufacturing an electronic device using the electronic circuit board 1 will be described.

  Referring to FIG. 4, in the method for manufacturing an electronic device, a mounting process (S1 to S6) for mounting or mounting an electronic component on electronic circuit board 1 and soldering the mounted electronic component by a flow soldering method are performed. A flow soldering step (S7) and an assembly step of assembling an electronic device using the electronic circuit board after the flow soldering step is executed (S8 to S10).

  In the mounting process, first, a chip component is mounted on the surface of the mounting board portion 10 of the electronic circuit board 1 (S1). In this step, the chip component is soldered by a reflow soldering method. Specifically, the chip component is mounted on the surface of the mounting substrate unit 10 by a known component mounting apparatus. A solder paste having a predetermined pattern is printed on the surface of the mounting substrate unit 10, and the chip component is mounted on the printed solder paste. Then, the solder paste is melted by the reflow process, and the chip component is soldered.

  After the chip component is soldered to the surface of the electronic circuit board 1, the lead component is mounted on the surface of the mounting substrate portion 10 using a known component mounting apparatus (S2). The lead terminal of the lead component is inserted into a plurality of through holes formed in the mounting substrate unit 10, and thereby the lead component is mounted on the mounting substrate unit 10. At this stage, the lead component is not soldered to the mounting board portion 10.

  Subsequently, the chip component is mounted on the back surface of the mounting substrate unit 10 by glue processing (S3). In the glue treatment, the chip component is fixed on the back surface of the mounting substrate portion 10 with an adhesive. At this stage, the chip components on the back surface of the mounting board portion 10 are not soldered.

  In the above process, electronic components (chip components and lead components) are mounted using a known component mounting apparatus. However, a plurality of electronic components mounted on the electronic circuit board 1 can be mounted by the component mounting apparatus. There are also electronic components that are manually mounted. Therefore, in the next step, an electronic component that cannot be mounted by the component mounting apparatus is manually mounted on the surface of the mounting substrate unit 10.

  At this time, as shown in FIGS. 5 to 7, the plurality of heat generating components 40 are placed on the surface of the temporary fixing substrate portion 20 (S <b> 5). The heat generating component 40 includes a resin mold 41 in which an element body is included, a heat radiation plate 42 coupled to the rear end of the resin mold 41, and a plurality of lead terminals 43 extending from the front end of the resin mold 41.

  The heat generating component 40 is sandwiched and placed between the locking members 21 and 22. Further, the lead terminals 43 of the heat generating component 40 are inserted into the through holes 11 in the mounting substrate unit 10. Therefore, the heat generating component 40 is not easily displaced in the horizontal direction with respect to the surface of the electronic circuit board 1.

  Subsequently, the heat generating component 40 mounted between the locking members 21 and 22 is fixed by the locking members 21 and 22 so as not to be displaced in the vertical direction (S6). Referring to FIG. 7, the height HE of the locking members 21 and 22 is higher than the height H40 of the heat generating component 40. As shown in FIGS. 8 to 10, the upper portions of the locking members 21 and 22 are bent to the corresponding heat generating component side. The bent portions 21A and 22A of the locking members 21 and 22 hold the heat generating component 40 from the upper surface. Therefore, it is possible to suppress the heat generating component 40 from shifting in the vertical direction. The bending work of the locking members 21 and 22 may be performed manually or using an apparatus.

  Subsequently, the lead terminals of the lead component mounted on the electronic circuit board 1 and the chip component mounted on the back surface are soldered by flow soldering (S7). First, flux is applied to the back surface of the electronic circuit board 1. The flux has a role of enhancing the wettability of the solder.

  The back surface of the electronic circuit board 1 to which the flux is applied is immersed in a jet made of molten solder. At this time, molten solder adheres to the back surface of the electronic circuit board 1 and solidifies. Through the above steps, the terminals of the plurality of lead components including the heat generating component 40 and the chip components bonded to the back surface are soldered to the electronic circuit board 1. Thus, in the present embodiment, the heat generating component 40 is not soldered manually, but is soldered by the flow soldering method in the same manner as other electronic components.

  After the flow soldering process is completed, an electronic device assembly process is performed (S8 to S10). First, the fixing of the heat generating component 40 to the temporary fixing substrate 20 is released (S8). Specifically, the locking members 21 and 22 are removed from the heat generating component 40. For example, the bent portions 21A and 22A are extended and returned to the original state. As a result, the heat generating component 40 is coupled only to the mounting substrate unit 10 by the soldered lead terminals 43.

  After the fixation by the locking members 21 and 22 is released, the temporary fixing board portion 20 is separated from the electronic circuit board 1 (S9). If all the gates 31 connecting the mounting substrate unit 10 and the temporary fixing substrate unit 20 are cut, the temporary fixing substrate unit 20 is separated from the electronic circuit substrate 1 as shown in FIGS. In the electronic circuit board 1 from which the temporary fixing substrate portion 20 is separated, the resin mold 41 and the heat dissipation plate 42 of the heat generating component 40 protrude from the mounting substrate portion 10, and the resin mold 41 and the heat dissipation plate 42 are connected by the lead terminals 43. It is supported.

  As shown in FIG. 13, the electronic circuit board 1 from which the temporary fixing board portion 20 has been separated is attached to a heat sink 50 corresponding to an exterior case of the electronic device (S10). The electronic circuit board 1 is screwed to the heat sink 50 by screws 60. At this time, the heat generating component 40 supported in a state of protruding from the mounting substrate unit 10 is brought into surface contact with the sub heat sink 51 that is in surface contact with the heat sink 50. At this time, the screw 61 is inserted into the screw hole 45 provided in the heat radiating plate 42, and the sub heat sink 51 is attached to the heat generating component 40 without being attached to the mounting substrate unit 10.

  Each heat generating component 40 is soldered in a state of being fixed on the temporary fixing substrate portion 20 by the locking members 21 and 22. Therefore, the bottom surface 44 of each heat generating component 40 is aligned on the same plane. As a result, the bottom surface 44 of each heat generating component 40 is in surface contact with the top surface 52 of the sub heat sink 51, and the bottom surface position of any heat generating component 40 is shifted from the bottom surface position of the other heat generating component 40. The problem of not contacting the upper surface 52 does not occur. Therefore, when the heat generating component 40 is screwed to the sub heat sink 51 with the screw 61, the stress generated in the lead terminal 43 due to the shift of the bottom surface position can be suppressed. The cover 70 is screwed to the heat sink 50 with screws 62, and the electronic device is completed.

As described above, in the manufacturing method of the electronic device described above, the heat generating component 40 can be soldered in the same manner as other electronic components by using the electronic circuit substrate 1 having the separable temporary fixing substrate portion 20. Furthermore, since it is not necessary to attach the sub heat sink 51 to the electronic circuit board, it is not necessary to provide a fixing region on the electronic circuit board in which a screw or the like for fixing the sub heat sink 51 is provided. Therefore, the area where electronic components can be mounted on the electronic circuit board increases.
Moreover, since the arrangement positions of the heat generating components can be accurately set by the locking members 21 and 22, contact between the heat generating components can be avoided even if the interval between the adjacent heat generating components is narrowed.

  In this embodiment, the temporary fixing substrate portion 20 can be separated by providing the slit 30 between the temporary fixing substrate portion 20 and the mounting substrate portion 10. However, the temporary fixing substrate portion 20 can be separated by other methods. And the mounting substrate unit 10 may be separable. For example, as shown in FIG. 14, a groove 35 may be formed on one side or both sides of the electronic circuit board 1 to be a boundary between the temporary fixing board part 20 and the mounting board part 10. Even in this case, the temporary fixing substrate portion 20 can be separated from the electronic circuit substrate 1 by the groove 35.

  In the present embodiment, the locking members 21 and 22 are gate-shaped frames. However, as shown in FIG. 15, for example, the locking members 21 and 22 may be bendable plates. . Further, after the heat generating component 40 is placed, a bar material may be inserted into the upper part inside the frame of the locking members 21 and 22 made of a portal frame, and the heat generating component 40 may be suppressed from the upper surface by the bar material. In short, the temporary fixing mechanism formed on the temporary fixing substrate portion 20 can fix each heat generating component 40 so as not to swing in the horizontal direction and the vertical direction with respect to the surface of the electronic circuit board 1 and can be fixed. Any mechanism that can be released may be used.

  In FIG. 1, the locking members 21 and 22 are arranged in a line, but as shown in FIG. 16, the locking member 21 is arranged on the heat radiation plate 42 side, and the locking member 22 is arranged on the resin mold 41 side. May be. Even with such an arrangement, it is possible to sandwich the heat generating component 40 and to suppress bending of the heat generating component in the vertical direction by bending.

  While the embodiments of the present invention have been described above, the above-described embodiments are merely examples for carrying out the present invention. Therefore, the present invention is not limited to the above-described embodiment, and can be implemented by appropriately modifying the above-described embodiment without departing from the spirit thereof.

1 is a top view of an electronic circuit board according to an embodiment of the present invention. It is the side view of the electronic circuit board seen from the arrow II direction in FIG. It is the side view of the electronic circuit board seen from the arrow III direction in FIG. It is a flowchart which shows each process of the manufacturing method of the electronic device by embodiment of this invention. It is a top view of the electronic circuit board with which the heat-emitting component was mounted. It is the side view of the electronic circuit board seen from the arrow VI direction in FIG. It is the side view of the electronic circuit board seen from the arrow VII direction in FIG. It is a top view of the electronic circuit board by which the heat-emitting component was temporarily fixed. It is the side view of the electronic circuit board seen from the arrow IX direction in FIG. It is a side view of the electronic circuit board seen from the arrow X direction in FIG. It is a front view of the electronic circuit board by which the temporary fix | stop board | substrate part was cut away. It is a side view of the electronic circuit board seen from the arrow XII direction in FIG. It is sectional drawing of an electronic device. It is a side view of the other electronic circuit board different from FIG. It is a side view of the other electronic circuit board different from FIG.2 and FIG.14. It is a front view of the other electronic circuit board different from FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic circuit board 10 Mounting board | substrate part 11 Through-hole 20 Temporary-fixing board | substrate part 30 Slit 35 Groove 40 Heat-generating component 43 Lead terminal 50 Heat sink 51 Sub heat sink

Claims (5)

Temporary fixing board including a mounting board part having a region where a plurality of electronic parts are mounted and a through hole into which a terminal of the heat generating part is inserted, and a temporary fixing mechanism that fixes the heat generating part and can be separated from the mounting board part A step of preparing an electronic circuit board comprising a portion;
Mounting the plurality of electronic components on the mounting substrate portion;
Inserting the terminal of the heat generating component into the through hole, and fixing the heat generating component on the surface of the temporary fixing substrate portion by the temporary fixing mechanism;
Soldering electronic components mounted on the mounting substrate and terminals of the heat generating components inserted into the through holes;
After soldering, releasing the fixing of the heat generating component by the temporary fixing mechanism;
Separating the temporary fixing substrate part from the electronic circuit board after releasing the fixing;
And a step of attaching a heat radiating member to the heat generating component. It is a manufacturing method of the electronic device of Claim 1, Comprising:
The temporary fixing mechanism includes a plurality of locking members that are erected and bendable at intervals corresponding to the width of the heat generating component,
The step of fixing the heat generating component includes:
Placing the heat-generating component between adjacent locking members;
And a step of bending each of the locking members and gripping the heat generating component after the heat generating component is placed. A mounting board portion having a region where a plurality of electronic components are mounted and a through hole into which a terminal of the heat generating component is inserted;
An electronic circuit board comprising a temporary fixing mechanism for fixing the heat generating component on a surface, and comprising a temporary fixing board part separable from the mounting board part. The electronic circuit board according to claim 3,
The electronic circuit board according to claim 1, wherein the temporary fixing mechanism includes a plurality of locking members that are erected and bent at intervals corresponding to the width of the heat generating component to grip the heat generating component. The electronic circuit board according to claim 4, further comprising:
An electronic circuit board having a gap or a groove at a boundary between the mounting board part and the temporary fixing board part.

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