JP2009206409A - Method for manufacturing wiring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring substrate wherein the wiring substrate which is thin and has high density is efficiently manufactured. <P>SOLUTION: The method for manufacturing the wiring substrate includes the stages of: laminating an insulating layer 21 formed of an electric insulating material containing a resin on a metal foil 12P with a base film which includes the metal foil 12P held on the base film 1 with an adhesive layer interposed, and forming a plurality of via holes V in the insulating layer 21; depositing and bonding a first wiring conductor 11, formed of a plated conductor connected to the metal foil 12P, in a predetermined pattern on the insulating layer 21 and in the via holes V; and separating the metal foil 12P supported on the base film 1 and a laminate 10 including the insulating layer 21 and first wiring conductor 11 from the base film 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a wiring board used for mounting electronic components such as semiconductor elements.

  Conventionally, there is a build-up wiring board as a high-density wiring board used for mounting electronic components such as semiconductor elements. A typical build-up wiring board has a thickness of about 10 to 100 μm on both sides of a core substrate made of a glass-resin plate having a thickness of about 0.2 to 2.0 mm, where wiring conductors made of copper foil are formed on both sides. Insulating layers made of the above resin and wiring conductors made of a copper plating film having a thickness of about 5 to 50 μm are alternately laminated. However, although such a general build-up wiring board is capable of high-density wiring, since a glass-resin plate having a thickness of about 0.2 to 2.0 mm is used as the core board, the entire wiring board is used. There was a problem that it was difficult to reduce the thickness.

  Therefore, a method of forming a wiring board only with a buildup layer without using a core board has been proposed. As such a method, for example, Patent Document 1 proposes a method of manufacturing a wiring board for a semiconductor device by forming a buildup layer on a metal plate and then etching away the metal plate. According to the method disclosed in Patent Document 1, a semiconductor device mounting surface is flat and a thin wiring substrate can be provided.

However, in the method described in Patent Document 1, it is necessary to etch away a metal plate that requires a relatively large thickness, and the etching takes a long time. Therefore, there was a problem to be solved that the production efficiency was low.
Japanese Patent No. 3635219

  The subject of this invention is providing the manufacturing method of the wiring board which can manufacture a thin and high-density wiring board efficiently.

  In the method for manufacturing a wiring board according to the present invention, an insulating layer made of an electrically insulating material containing a resin is laminated on the metal foil of the metal foil with a support film on which the metal foil is held via an adhesive layer. And forming a plurality of via holes in the insulating layer, and depositing a first wiring conductor made of a plating conductor connected to the metal foil on the insulating layer and in the via holes in a predetermined pattern. And a step of separating the laminate including the metal foil supported on the support film, the insulating layer, and the first wiring conductor from the support film. is there.

  Further, in the method for manufacturing a wiring board according to the present invention, before the step of forming the laminate, the metal foil with a support film is formed on the support board having a flat main surface wider than the metal foil with a support film. And laminating the metal foil so that the metal foil is exposed at the center of the main surface, the insulating layer extending from the metal foil to the support substrate outside the metal foil, and laminating. The first wiring conductor is deposited on an insulating layer, and the laminate is formed on the central portion of the main surface of the support substrate.

  Furthermore, in the method for manufacturing a wiring board according to the present invention, the step of laminating the metal foil with a support film on the main surface of the support substrate further includes a metal surrounding the metal foil on an outer peripheral portion of the main surface of the support substrate. A step of laminating the frame such that one main surface of the metal frame is exposed;

  Still further, in the method for manufacturing a wiring board according to the present invention, before the step of separating the laminate from the support film, the laminate and the support substrate located in the inner region of the outer peripheral edge of the metal foil are the remaining portions. A step of cutting out from.

  According to the method for manufacturing a wiring board of the present invention, an insulating layer and a first wiring conductor are sequentially laminated on the metal foil of the metal foil with a support film in which the metal foil is held on the support film via an adhesive layer. In addition, since a laminate for a wiring board composed of the metal foil, the insulating layer, and the first wiring conductor is formed, the overall thickness of the wiring board cannot be reduced by using the core board. Therefore, a thin and high-density wiring board can be provided.

  And when separating the formed laminated body from the said support film, since the said metal foil with a support film only hold | maintains the metal foil on the support film via the adhesion layer, a support film and metal foil The laminate can be easily separated in a short time without damaging the laminate by simply peeling off the gap between the two, and thereby a thin and high-density wiring board can be efficiently manufactured.

  In addition, a metal foil with a support film is laminated at the center of the main surface of the support substrate having a flat main surface wider than the metal foil with a support film, and an insulating layer is placed on the support substrate outside the metal foil. When the laminated body is formed by depositing the first wiring conductor on the insulating layer so as to extend, a support substrate having a flat main surface is used. While stability can be improved, since the outer peripheral part of a support substrate and an insulating layer are laminated directly, it is between metal foil and a support film in the manufacturing process which forms an insulating layer and the 1st wiring conductor. It is possible to effectively prevent the occurrence of peeling.

  Further, when a metal frame surrounding the metal foil with the support film is laminated on the outer peripheral portion of the main surface of the support substrate so that one main surface of the metal frame is exposed, the metal frame is supplied with electric charge for plating. As a result, the wiring board according to the present invention can be efficiently manufactured.

  Furthermore, before the step of separating the laminate from the support film, the laminate and the support substrate located in the inner region of the outer peripheral edge of the metal foil are cut out from the remaining portion to support the cut-out laminate. It can be easily peeled off from the film.

  Hereinafter, an embodiment of a method for manufacturing a wiring board according to the present invention will be described in detail with reference to FIGS.

  First, as shown in FIG. 1, the metal foil 2 with a support film, the prepreg 3P for the support substrate 3, and the metal frame 4 are prepared. The metal foil 2 with a support film is obtained by holding a metal foil 12P on the support film 1 via an adhesive layer (not shown).

  The support film 1 has a thickness of about 10 to 100 μm and effectively prevents the metal foil 12P from being broken or wrinkled, and facilitates the handling of the metal foil 12P. The support film 1 is preferably made of a heat resistant resin such as a polyester resin. Specific examples include a polyethylene terephthalate (PET) film.

  The metal foil 12P is for providing a conductor layer that is a starting point in the production of the wiring board. The metal foil 12P is preferably made of a highly conductive metal such as copper (copper foil). As thickness of metal foil 12P, about 1-35 micrometers is mentioned, for example. Thereby, when this metal foil 12P is removed by etching, it can be removed by etching in a short time. The metal foil 12P having such a thickness does not have to be removed by etching, and can be suitably used as a part of a wiring conductor after etching into a predetermined pattern. On the other hand, if the thickness of the metal foil 12P is less than 1 μm, the strength of the metal foil 12P is lowered, and the workability when alternately laminating a plurality of insulating layers and conductor layers on the metal foil 12P may be lowered. If the thickness is larger than 35 μm, the thickness becomes unnecessarily thick, and the time required for etching removal becomes longer, which is not preferable.

  The pressure-sensitive adhesive layer is preferably made of a heat-resistant pressure-sensitive adhesive material such as a silicone resin-based resin, an acrylic resin-based resin, or a polyorganosiloxane resin-based material in order to withstand the heat load applied during the production of the wiring board. The pressure-sensitive adhesive layer has a thickness of about 0.01 to 1.0 μm and an adhesive strength of 1 to 10 N in order to separate from the support film 1 without damaging the laminate 10 for a wiring board described later. / M is preferable.

  The prepreg 3P serves as a support substrate 3 for supporting the laminate 10 while maintaining the necessary flatness when the laminate 10 for a wiring board described later is manufactured, and a support film is provided on the main surface thereof. The attached metal foil 2 and the metal frame 4 are placed and heated while pressing them from above and below, whereby the metal foil 2 and the metal frame 4 with a support film are laminated on the prepreg 3P and are thermoset in that state. The prepreg 3P is generally formed of a substantially rectangular flat plate having a thickness of about 0.2 to 2.0 mm and a side length of about 300 to 1000 mm, but is not limited thereto. As the prepreg 3P, for example, a woven fabric made of heat-resistant fibers such as glass fibers is impregnated with a thermosetting resin such as an epoxy resin to form a semi-cured sheet.

  The metal frame 4 is for use as a charge supply electrode for plating when manufacturing a laminate 10 for a wiring board to be described later, and has a thickness of about 12 to 35 μm. The metal frame 4 is preferably made of a highly conductive metal such as copper.

  After preparing each material as described above, as shown in FIG. 2, the metal foil 2 with a support film is placed on the center of the main surface of the prepreg 3P, and the support film 1 faces the main surface of the prepreg 3P. While arrange | positioning, the metal frame 4 is arrange | positioned on the main surface outer peripheral part of the prepreg 3P. Then, by pressing them from above and below at a pressure of 0.5 to 9 MPa and heating them at a temperature of 130 to 200 ° C. for about 30 minutes to 120 minutes, as shown in FIG. 3, the prepreg 3P is formed by thermosetting. The metal foil 2 with the support film is laminated on the main surface of the support substrate 3 so that the upper surface of the metal foil 12P is exposed, and the metal frame surrounding the metal foil 12P on the outer peripheral portion of the main surface of the support substrate 3 4 is laminated so that its upper surface is exposed.

  After the lamination, the upper surface of the exposed metal foil 12P, the upper surface of the exposed metal frame 4, and the main surface of the support substrate 3 exposed from between the metal foil 12P and the metal frame 4 are substantially the same height. become. Thereby, since the laminated body 10 for wiring boards which will be described later can be supported on a surface having excellent flatness, the laminated body 10 can be obtained while suppressing the occurrence of warpage and undulation associated with processing. The upper surface of the exposed metal foil 12P, the upper surface of the metal frame 4, and the main surface of the support substrate 3 exposed from between the metal foil 12P and the metal frame 4 do not have to be completely the same height. There may be a height difference of 5 μm or less between them.

  Next, as shown in FIG. 4, the insulating layer 21 is provided on the upper surface of the metal foil 12P, the upper surface of the metal frame 4 and the main surface of the support substrate 3 having substantially the same height, and one of the main surfaces is the above-described main surface. The metal foil 12P is laminated so as to be in close contact with the upper surface of the metal foil 12P, the upper surface of the metal frame 4, and the main surface of the support substrate 3. At this time, since one main surface of the insulating layer 21 is in close contact with the upper surface of the metal foil 12P, the upper surface of the metal frame 4, and the main surface of the support substrate 3, the space between the metal foil 12P and the support film 1 is between. There is no peeling. The insulating layer 21 is formed with notches 30 that expose a part of the outer peripheral side of the metal frame 4 so as to face each other at a plurality of locations in the circumferential direction of the insulating layer 21. The insulating layer 21 is made of an electrically insulating material in which an inorganic insulating filler such as silica or talc is dispersed in a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin. Alternatively, an electrically insulating material in which a glass cloth is impregnated with a thermosetting resin may be used.

  Such an insulating layer 21 is, for example, a paste-like mixture of inorganic curing fillers dispersed in an uncured thermosetting resin such as an epoxy resin or a bismaleimide triazine resin. It is formed by applying heat on the upper surface, the exposed upper surface of the metal frame 4, and the main surface of the support substrate 3 exposed from between the metal foil 12 </ b> P and the metal frame 4. Further, the present invention is not limited thereto. For example, a film of the above mixture or a prepreg impregnated with an uncured thermosetting resin in a glass cloth is exposed on the upper surface of the exposed metal foil 12P, an exposed metal frame. 4 and the main surface of the support substrate 3 exposed from between the upper surface of the metal foil 12P and between the metal foil 12P and the metal frame 4, and then thermally cured.

  Next, as shown in FIG. 5, a via hole V that exposes a part of the metal foil 12 </ b> P is formed in the insulating layer 21. The via hole V is formed by laser processing, for example. Alternatively, the mixture for the resin layer 21 may be formed by imparting photosensitivity and then subjecting the mixture to exposure / development processing using a photolithography technique, but is not limited thereto.

  Next, as shown in FIG. 6, the first wiring conductor 11 connected to the metal foil 12P is formed in a predetermined pattern in the surface of the insulating layer 21 and in the via hole V. The first wiring conductor 11 is made of, for example, an electroless copper plating film and an electrolytic copper plating film, and is preferably formed by a known semi-additive method. Since the semi-additive method is excellent in fine wiring, it is suitable for efficiently manufacturing a thin and high-density wiring board.

  Specifically, the surface of the insulating layer 21 is first roughened as necessary, and then an electroless copper plating film is deposited on the surface to a thickness of about 0.1 to 2.0 μm. At this time, the electroless copper plating film is also deposited on the surface of the metal frame 4 exposed from the notch 30 to a thickness of about 0.1 to 2.0 μm. Next, a plating resist layer having an opening corresponding to the first wiring conductor 11 is formed on the surface of the electroless copper plating film deposited on the surface of the insulating layer 21. The plating resist layer has the opening by sticking a photosensitive resin film on the electroless copper plating film and subjecting the resin film to exposure / development processing using a photolithography technique. Formed. Next, the electrolytic copper plating film is deposited to a thickness of about 5 to 30 μm on the electroless copper plating film exposed in the opening of the plating resist layer. At this time, the metal frame 4 exposed from the notch 30 can be used as a charge supply electrode for supplying a charge for electrolytic plating. Thereby, the metal frame 4 and the cathode of an electroplating apparatus can be electrically connected reliably. On the other hand, in the absence of the metal frame 4, the terminals of the electroplating apparatus are connected to an extremely thin electroless plating layer, and the electroless plating layer is rubbed or broken, making it difficult to stably supply power. . Next, after the plating resist layer is peeled off, the exposed portion of the electroless copper plating film and the electrolytic copper plating film is entirely etched until the electroless copper plating film between the electrolytic copper plating films disappears to form a first A wiring conductor 11 is formed.

  After forming the first wiring conductor 11 in this way, as shown in FIG. 7, a first solder resist layer 22 is formed on the insulating layer 21 and the first wiring conductor 11 to form the copper foil 12P. A laminate 10 for a wiring board composed of an insulating layer 21, a first wiring conductor 11, and a first solder resist layer 22 is formed.

  Solder resist layer 22, for example, an electrically insulating material in which inorganic powder fillers such as silica and talc are dispersed in an acrylic modified epoxy resin in an amount of about 30 to 70% by mass, a photosensitive resin such as an acrylic modified epoxy resin and a photopolymerization initiator, etc. A photosensitive resin paste in which an inorganic insulating filler such as silica or talc is contained in a mixture of the above is applied to the insulating layer 21 and the first wiring conductor 11 by a screen printing or roll coating method or the like to a thickness of about 10 to 30 μm. It is preferably formed by applying to a thickness, and then exposing and developing to a predetermined pattern using a photolithographic technique, followed by ultraviolet curing and heat curing.

  Next, as shown in FIG. 8, the laminated body 10 and the support substrate 3 located in the inner region of the metal frame 4 are cut. In order to efficiently perform such cutting, the laminate 10, the support film 1, and the support substrate 3 are cut at a portion located 10 to 30 mm inside from the outer periphery of the metal foil 12 </ b> P, and as shown in FIG. It is preferable to cut out the central portion of 10 together with the support film 1 and the support substrate 3. The cutting method is arbitrary as long as the effect of the present invention is not hindered. For example, the cutting may be performed using a dicing or a router device.

  Next, as shown in FIG. 10, the cut laminate 10 is separated from the support film 1. In this separation, since the metal foil 12P is only held on the support film 1 via an adhesive layer (not shown), the laminate 10 is damaged only by peeling off the support film 1 and the metal foil 12P. And can be easily separated.

  Next, as shown in FIG. 11, the second wiring conductor 12 is formed on the other main surface of the insulating layer 21 by performing an etching process for etching the metal foil 12 </ b> P into a predetermined pattern. In order to etch the metal foil 12P into a predetermined pattern, for example, an etching resist layer having a shape corresponding to the wiring conductor is formed on the surface of the metal foil 12P, and the metal foil 12P exposed from the etching resist layer is removed by etching. Good. The etching resist layer has a shape corresponding to the wiring conductor by sticking a photosensitive resin film on the metal foil 12P and subjecting the resin film to exposure / development processing using a photolithography technique. After the metal foil 12P is etched, it is peeled off.

  Finally, as shown in FIG. 12, a second solder resist layer 23 is formed on the surfaces of the second wiring conductor 12 and the insulating layer 21 to obtain the wiring board 20 according to the present embodiment. As described above, according to the present embodiment, the laminated body 10 is not directly formed on the support substrate 3, but the metal foil 2 with the support film is first exposed on the main surface of the support substrate 3. In this manner, the insulating layer 21 and the first wiring conductor 11 are laminated on the metal foil 12P to obtain the laminated body 10. Therefore, the supporting film 1 of the metal foil 2 with the supporting film is laminated with the laminated body 10. When separating from the support substrate 3, it can function as a boundary layer for facilitating the separation, and as a result, the laminate 10 can be easily peeled from the support substrate 3 in a short time. In addition, the metal foil 12P can be used as a part of the first wiring conductor 11 by etching into a predetermined pattern. Therefore, according to the present embodiment, the thin and high-density wiring board 20 can be efficiently manufactured. The second solder resist layer 23 is made of the same material as that of the first solder resist layer 22 and is formed by the same method as that of the first solder resist layer 22.

  In the above-described embodiment, the case where the laminated body 10 for the wiring substrate is formed on one support substrate 3 has been described. However, as another embodiment according to the present invention, for example, two support substrates 3 are back to back. The laminated body 10 for the wiring board may be simultaneously formed on the outer main surface of each support substrate 3. FIG. 13 is a schematic cross-sectional view illustrating the method for manufacturing the wiring board according to the present embodiment, and corresponds to FIG. 1 described above. In FIG. 13, the same components as those shown in FIGS.

  As shown in FIG. 13, the step of forming the laminated body 10 according to the present embodiment first includes the metal foil 2 with a support film, the prepreg 3P for the support substrate 3, the metal frame 4, and the separation film 5. Prepare two each. The separation film 5 functions as a boundary layer for easily separating the two support substrates 3 from each other after the laminated body 10 is formed on each support substrate 3. The separation film 5 is preferably made of a metal foil such as a copper foil or a heat resistant film such as a polyethylene terephthalate (PET) film. The thickness of the separation film 5 is preferably about 1 to 35 μm, for example.

  After preparing each material including such a separation film 5, as shown in FIGS. 14-19, the laminated body 10 is obtained and the wiring board 20 is obtained using this laminated body 10. FIG. That is, as shown in FIG. 14, the two separation films 5 are sandwiched and sandwiched between the central portions of the two prepregs 3P, and the metal foil 2 with a support film is provided on the central portion of the main surface outside each prepreg 3P. And the metal frame 4 is arrange | positioned at the outer peripheral part of the said outer main surface, respectively. Next, by heating them while pressing them from above and below, as shown in FIG. 15, two separation films 5 are sandwiched between two support substrates 3 formed and integrated by thermosetting the prepreg 3P. Are overlapped with each other, and a metal foil 2 with a support film and a metal frame 4 are laminated on the outer main surface of each support substrate 3. At this time, the two separation films 5 are not bonded to each other, and are bonded only to the support substrate 3.

  Next, as shown in FIG. 16, wiring board laminates 10 are simultaneously formed on the outer main surfaces of the two support substrates 3. In addition, formation of each laminated body 10 is performed similarly to the process demonstrated based on FIGS. 4-7 in the said one Embodiment.

  Next, as shown in FIG. 17, the laminate 10, the support film 1, the support substrate 3, and the separation film 5 are cut at a portion located 10 to 30 mm inside from the outer periphery of the metal foil 12 </ b> P. As shown, the central part of each laminate 10 is cut out together with the support film 1, the support substrate 3, and the release film 5. At this time, since the release films 5 are not bonded to each other, both are easily separated.

  Next, as shown in FIG. 19, each cut-out laminated body 10 is separated from the support film 1 in the same manner as in the embodiment. Thereby, since the two laminated bodies 10 can be obtained, the efficiency at the time of forming the laminated body 10 can be improved about twice compared with the said one Embodiment. Then, two wiring boards 20 are obtained by performing the process explained based on FIG. 11 and FIG. Therefore, according to the present embodiment, the thin and high-density wiring board 20 can be manufactured more efficiently.

  As still another embodiment according to the present invention, two support substrates 3 are overlapped with another separation substrate interposed between them to facilitate separation of the two, and the outside of each support substrate 3. A laminate 10 for a wiring board may be simultaneously formed on the main surface. FIG. 20 is a schematic cross-sectional view illustrating the method for manufacturing the wiring board according to the present embodiment, and corresponds to FIGS. 1 and 13 described above. In FIG. 20, the same components as those shown in FIGS.

  As shown in FIG. 20, the process of forming the laminated body 10 concerning this embodiment first, the metal foil 2 with a support film, the prepreg 3P for the support substrate 3, the metal frame 4, and the separation film 5 and Are prepared two by two, and one separation substrate 6 is prepared. The separation substrate 6 functions as a boundary layer for easily separating the two support substrates 3 from each other after the laminated body 10 is formed on each support substrate 3. The separation substrate 6 is made of, for example, a double-sided copper-clad plate in which a copper foil 8 having a thickness of about 12 to 35 μm is laminated on both surfaces of a glass-epoxy plate 7 having a thickness of about 50 to 400 μm.

  After preparing each material including such a separation substrate 6, a laminate 10 is obtained as shown in FIGS. 21 to 25, and a wiring substrate 20 is obtained using the laminate 10. That is, as shown in FIG. 21, the separation substrate 6 is sandwiched between the two prepregs 3P, the separation film 5 is disposed at the center between the separation substrate 6 and the prepreg 3P, and each prepreg 3P A metal foil 2 with a support film is disposed on the outer main surface central portion, and a metal frame 4 is disposed on the outer peripheral portion of the outer main surface.

  Next, by heating them while pressing them from above and below, as shown in FIG. 22, the separation substrate 6 is laminated and integrated between the two support substrates 3 on which the prepreg 3P is thermally cured, and for separation. The separation film 5 is sealed between the substrate 6 and the support substrate 3, and the metal foil 2 with support film and the metal frame 4 are laminated on the outer main surface of each support substrate 3. At this time, the separation substrate 6 and the separation film 5 are not bonded to each other, and are bonded only to the support substrate 3.

  Next, as shown in FIG. 23, the laminated bodies 10 for wiring boards are simultaneously formed on the outer main surfaces of the two supporting boards 3, respectively. In addition, formation of each laminated body 10 is performed similarly to the process demonstrated based on FIGS. 4-7 in the said one Embodiment.

  Next, as shown in FIG. 24, the laminate 10, the support film 1, the support substrate 3, the separation film 5, and the separation substrate 6 are cut at a portion located 10 to 30 mm inside from the outer periphery of the metal foil 12 </ b> P. The center part of each laminated body 10 is cut out with the support film 1, the support substrate 3, and the peeling film 5. At this time, since the separation film 5 and the separation substrate 6 are not bonded, they are easily separated.

  Next, as shown in FIG. 25, the cut laminate 10 is separated from the support film 1 in the same manner as described based on FIG. 19 in the other embodiment. Thereby, since the two laminated bodies 10 can be obtained, the efficiency which forms the laminated body 10 can be raised about 2 time compared with the said one Embodiment. Then, two wiring boards 20 are obtained by performing the process explained based on FIG. 11 and FIG. Therefore, according to the present embodiment, the thin and high-density wiring board 20 can be manufactured more efficiently.

  Thus, according to the method for manufacturing a wiring board of the present invention, a thin and high-density wiring board can be efficiently manufactured. It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the gist of the present invention. For example, in the several embodiments described above, the case where the metal foil 12P is etched into a predetermined pattern and used as a part of the wiring conductor has been described, but the present invention is not limited to this, and FIG. As shown in FIG. 4, the metal foil 12P may be entirely removed by etching as necessary. In this case, the first wiring conductor 11 exposed in the via of the insulating layer 21 serves as an external connection pad or the like.

  In the case where the metal frame 4 is used as the charge supply electrode, the case where the notched portion 30 is formed in the insulating layer 21 has been described. However, instead of the notched portion 30, for example, all the outer peripheral sides of the metal frame 4 are frame-shaped. The insulating layer 21 may be laminated so as to be exposed.

  Furthermore, as shown in FIG. 27, the second wiring conductor 12 made of a plating conductor such as copper plating is deposited on the metal foil 12P in a predetermined pattern by a semi-additive method or a full additive method. Then, the insulating layer 21 and the first wiring conductor 11 are laminated thereon to form the wiring board laminated body 10 including the second wiring conductor 12 as a constituent element, which is cut out from the support film 1. After the separation, the second wiring conductor 12 may be exposed by etching away all of the metal foil 12P as shown in FIG. In this case, since the second wiring conductor 12 is made of a plating conductor deposited in a predetermined pattern by a semi-additive method or a full additive method, the second wiring conductor 12 is etched by etching the metal foil 12P into the predetermined pattern. Compared with the case where it forms, the wiring conductor of a fine and narrow pitch is realizable. Furthermore, since the second wiring conductor 12 is embedded in the insulating layer 21, the electrical insulation reliability between adjacent patterns in the second wiring conductor 12 is excellent, and the second wiring The entire thickness of the wiring board 20 can be reduced by the amount of the conductor 12 embedded in the insulating layer 21, that is, by the thickness of the second wiring conductor 12.

It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on one Embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on other embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on other embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on other embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on other embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on other embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on other embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on other embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on further another embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on further another embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on further another embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on further another embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on further another embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on further another embodiment of this invention. It is a schematic sectional drawing which shows the wiring board which concerns on further another embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on further another embodiment of this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the wiring board which concerns on further another embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support film 2 Metal foil with support film 3P prepreg 3 Support substrate 4 Metal frame 5 Separation film 6 Separation board 10 Laminate for wiring board 11 First wiring conductor 12P Copper foil 21 Insulating layer 20 Wiring board 30 Notch

Claims (4)

  An insulating layer made of an electrically insulating material containing a resin is laminated on the metal foil of the metal foil with a supporting film, on which the metal foil is held via an adhesive layer, and a plurality of via holes are formed in the insulating layer. Forming a first wiring conductor made of a plating conductor connected to the metal foil on the insulating layer and in the via hole and depositing the first wiring conductor in a predetermined pattern; and on the support film A method of manufacturing a wiring board, comprising: separating a laminated body including the supported metal foil, the insulating layer, and the first wiring conductor from the supporting film.   Prior to the step of forming the laminate, the metal foil is exposed to the central portion of the main surface of the support substrate having a flat main surface wider than the metal foil with the support film. And laminating the insulating layer by extending the insulating layer from the metal foil to the support substrate outside the metal foil and covering the first wiring conductor on the insulating layer. The method for manufacturing a wiring board according to claim 1, wherein the laminated body is formed on a central portion of the main surface of the support substrate.   The step of laminating the metal foil with the support film on the main surface of the support substrate further includes a metal frame surrounding the metal foil on the outer peripheral portion of the main surface of the support substrate, and one main surface of the metal frame is The method for manufacturing a wiring board according to claim 2, comprising a step of laminating so as to be exposed.   4. The method according to claim 2, further comprising a step of cutting out the laminate and the support substrate located in an inner region of an outer peripheral edge of the metal foil from a remaining portion before the step of separating the laminate from the support film. A method for manufacturing a wiring board.

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