JP2009195995A - Cutting method by blade - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting method capable of accurately and stably cutting a material such as a rigid or fragile material by a plurality of blades. <P>SOLUTION: A plurality of blades having a super-abrasive layer provided along a circumference of a disk-like substrate are provided on a straight line in a plan view. Rotation axes of the plurality of blades adjacent in the feeding direction of the material are provided to be horizontally coplanar to one another. The plurality of blades provided on the straight line have respectively different diameters and arranged in an ascending order of the diameters sequentially from a blade with a small diameter to a blade with a large diameter. The material is cut by the blade with a small diameter, thereafter fed in the horizontal direction to be cut by a blade with a larger diameter and thus cut in a single pass. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of cutting various work materials with a blade, and in particular, when cutting hard and brittle materials such as silicon into a plate shape, the state of the working surface of the blade is stable for a long time. It is related with the cutting method which can continue a cutting | disconnection by.

  In recent years, polycrystalline silicon for solar cells is often cut with a circular saw blade, and in order to increase the cutting efficiency, a method of cutting the thickness with a single cut has been attempted. . Specifically, for example, there is a workpiece having a length of 800 mm and a thickness of 300 mm, and using a blade having a diameter of about 1 m, the workpiece is moved in the length direction to obtain a thickness of 300 mm. Things like cutting at once are performed. However, if the thickness of 300 mm is cut at a time, the load applied to the blade is too high and the working surface of the superabrasive layer provided on the outer periphery of the blade is crushed. Therefore, there are cases where a plurality of blades are used and the thickness direction is divided into two portions of 150 mm and cut twice.

  As a method of cutting using a plurality of blades, two circular saws are provided with the traveling path of the work material sandwiched and shifted in the front and rear directions of the work material, and the majority of the work material is first turned into one circular saw. A method is proposed in which the remaining portion is cut from the opposite side with the other circular saw. As a specific example, as shown in FIG. 3 (a), the majority of the cylindrical work material 5 is cut from the upper side with one circular saw 1, and then the remaining portion is cut as shown in FIG. 3 (b). A method of cutting from the lower side with the other circular saw 11 is disclosed (for example, see Patent Document 1).

  Moreover, in the method of cutting a steel plate simultaneously using a plurality of rotary blades, as shown in FIG. 4, a kerf along the cutting line of the work material (steel plate) 5 is formed by the rotary blade 1 in the previous stage, A method of cutting a steel sheet by sequentially cutting the kerfs with the subsequent rotary blades 11, 21, 31, 41 is disclosed (for example, see Patent Document 2).

  Furthermore, regarding a saw machine for sawing timber, a saw machine is proposed that uses the upstream saw 1 for feeding the work material 5 at a partial cut depth and the downstream saw 11 at a full cut depth. ing. In this saw machine, the kerf thickness cut by the downstream saw 11 is made slightly thicker than the kerf thickness cut by the upstream saw 1 (see, for example, Patent Document 3).

JP 56-126523 A JP-A-60-141426 JP-A-10-193301

  However, when cutting using a plurality of blades by the methods disclosed in these documents, the cutting situation may become unstable or the structure of the cutting device may be complicated, and the accuracy of the cut surface The problem of causing deterioration of the surface and damage of the superabrasive layer is likely to occur.

  In the method described in Patent Document 1, as shown in FIG. 3, circular saws 1 and 11 are provided on the upper and lower sides of the work material 5, and the majority of the work material 5 is moved by the circular saws 1 and 11. Since it cuts, the amount cut with one circular saw is almost determined by the size of the work material 5, and is difficult to adjust. Therefore, it is not always possible to cut under conditions suitable for a circular saw, and there is a possibility that the cutting accuracy is deteriorated and the superabrasive layer is damaged.

In the method described in Patent Document 2, as shown in FIG. 4, a kerf is formed with the front rotary blade 1, and then sequentially cut with the rear rotary blades 11, 21, 31, 41. Cutting blades having the same diameter are used, and a cutting method using an apparatus is disclosed in which the position of the axis of each rotary blade approaches the work material 5 as the position of the subsequent rotary blade becomes closer. Therefore, the cutting depth of one rotary blade is inevitably determined, and the structure of the apparatus becomes complicated when the apparatus is capable of adjusting the position of the shaft up and down.
Further, when cutting a single kerf with a plurality of rotary blades, when cutting a groove in a workpiece without a kerf, the accuracy tends to bend easily in the feed direction and the cutting direction of the rotary blade. According to the method described in this document, the rotary blade 1 that performs cutting first is most likely to bend, and thus it is necessary to secure a certain thickness with respect to the diameter of the substrate to provide rigidity. Moreover, since all the rotary blades have the same diameter, the minimum required diameter according to the thickness of the work material to be cut is determined by the diameter of the subsequent rotary blade 41. As a result, the diameter of the rotary blade 1 in the previous stage becomes larger than necessary, and in order to ensure rigidity in accordance with this diameter, it is necessary to increase the thickness. The yield of the work material is greatly deteriorated.

  Furthermore, in the method described in Patent Document 3, as shown in FIG. 5, the cutting is performed with a partial cutting depth by the upstream saw 1 and by the downstream saw 11 with a full cutting depth. However, it is disclosed that the kerf thickness of the downstream saw 11 is slightly thicker than the kerf thickness cut by the upstream saw 1, and when such cutting is performed, There is a possibility that the cut edge of the cutting material 5 is missing. In Patent Document 3, since the work material 5 is timber, the problem that the cut edge is chipped is unlikely to occur. However, when cutting a hard and brittle material such as polycrystalline silicon, the cut edge is extremely chipped. There is a risk that the cutting accuracy may be deteriorated.

  In view of the above, the present invention provides a cutting method capable of accurately and stably cutting a work material with a plurality of blades.

A first feature of the cutting method using the blade of the present invention is a method of cutting a work material using a plurality of blades provided with a superabrasive layer on the outer periphery of a disk-shaped substrate,
The plurality of blades are arranged in a straight line in plan view, and the rotation axes of the plurality of blades adjacent in the feed direction of the work material are arranged so as to be on the same plane in the horizontal direction,
The plurality of blades arranged on the straight line are arranged such that each of the blades has a different diameter and becomes a blade having a larger diameter sequentially from a blade having a smaller diameter,
The work material is sent in a horizontal direction so as to be cut by a blade having a larger diameter after being cut by the blade having a smaller diameter.

  The second feature is that the rotation axes of the plurality of blades are located above the upper surface of the work material.

  A third feature is that the rotation shafts of the plurality of blades are located below the lower surface of the work material in addition to those located above the upper surface of the work material. .

  A fourth feature is that the thickness of the superabrasive layer of the plurality of blades decreases as the diameter of the blade increases.

  A fifth feature is that the plane in which the rotation axes of a plurality of blades located above the upper surface of the work material are present is parallel to the direction in which the work material moves.

  A sixth feature is that the plane in which the rotation axes of a plurality of blades located below the lower surface of the work material are present is parallel to the direction in which the work material moves.

  A seventh feature is that the peripheral speeds of the plurality of blades are all the same.

  The eighth feature is that the work material is silicon for solar cells.

  According to the cutting method using the blade having the above-described configuration, even when cutting hard and brittle materials such as silicon, the blade can be cut in a stable state over a long period of time using a simple structure device. Therefore, efficient cutting can be performed and the cutting accuracy can be improved.

  The image of the cutting device used for the cutting method by the blade of this invention is shown in FIG. 1, (a) is a front view, (b) is a top view. Portions unnecessary for the description of the cutting method of the present invention, such as the apparatus main body, are not shown, and the superabrasive layer provided on the outer peripheral portion of the blade is not shown and is shown by a simple circle.

  This cutting device has a table 4 on which a work material 5 is placed and has a movable structure. Main shafts 3, 13, and 23 for attaching blades 1, 11, and 21 are provided on the upper side of the table 4, and the height positions of the main shafts 3, 13, and 23 are fixed. It is provided at the same distance from the top surface. The blades 1, 11, and 21 have the smallest diameter on the upstream side (left side in FIG. 1), and the diameter increases toward the blades 11, 21 and the downstream side (right side in FIG. 1). The same substrate thickness is used for the blades 1, 11, and 21, and they are provided so as to be in a straight line in plan view. The thicknesses of the superabrasive layers of the blades 1, 11, and 21 are theoretically preferably all the same, but in reality there are vibrations of the substrate, minute distortion, deformation, etc. The thickness is made slightly smaller (in other words, the more downstream the blade is). When these blades 1, 11, 21 are fixed to the main shafts 3, 13, 23, they are fixed with nuts via the flanges 2, 12, 22. The flanges 2, 12, and 22 all have the same diameter.

  The work material 5 is placed on the table 4, and the work material 5 is moved from the upstream side to the downstream side by moving the table 4, and is cut by the blade 1, and then cut by the blade 11 and the blade 21. Is done. At the time of cutting, the main shaft of each blade remains fixed without moving, and only the work material 5 moves. In the example of FIG. 1, the blade 1 cuts the height h of the work material 5 from the upper surface to the height of (1/3) h, and then the blade 11 cuts the upper surface of the work material 5 from the height h. To the height of (2/3) h, and finally the blade 21 cuts to the lowest end of the work material 5.

  By performing cutting using such a cutting device, the load on each blade is reduced and the structure of the cutting device is simplified. The main shafts 3, 13, and 23 do not need to be moved in the vertical direction, and the depth of cut can be set according to the size of the work material simply by changing the diameter of the blade used. If there is a function to make it possible to cut. Moreover, by selecting the blade specifications, it is possible to cut under appropriate conditions, and stable cutting can be performed. Further, since the thickness of the superabrasive layer of the plurality of blades is slightly smaller as the downstream blade, the cutting edge of the work material is less likely to occur when cutting with the downstream blade, and the superabrasive grain It is also possible to prevent the layer from being damaged.

  In addition, since the diameter of the upstream blade 1 that is most likely to bend at the time of cutting can be reduced, the thickness of the blade 1 is not excessively thick and the rigidity can be secured even with a thin one. The yield is improved. If the thickness of the downstream blades 11 and 21 is also matched to the thickness of the upstream blade 1, the thickness with respect to the diameter will be reduced, but since the kerf formed by the blade 1 is traced and cut, bending is unlikely to occur. The cutting accuracy is not deteriorated. Further, since the flanges 2, 12, and 22 all have the same diameter, the ratio of the area of the upstream blade 1 fixed by the flange 2 to the area of the entire substrate is increased, and the rigidity of the blade 1 at the time of cutting is increased. Therefore, the thickness of the blade 1 can be reduced. The ratio of the area fixed by the flanges 12 and 22 to the blades 11 and 21 on the downstream side is low, but in the same manner as described above, the blades 11 and 21 are cut by tracing the kerf formed by the blade 1. Bending is unlikely to occur and cutting accuracy is not deteriorated.

  As a second embodiment of the cutting method of the present invention, an image of a cutting device used for this is shown in FIG. 2, where (a) is a front view and (b) is a plan view. As in FIG. 1, the parts unnecessary for the explanation of the cutting method of the present invention such as the apparatus main body are omitted, and the superabrasive layer provided on the outer peripheral part of the blade is not shown, and is shown by a simple circle. ing.

  This cutting apparatus has a table 4 on which a work material is placed and has a movable structure. The main shafts 3 and 23 for attaching the blades 1 and 21 are provided on the upper side of the table 4, and the height positions of the main shafts 3 and 23 are fixed, and both main shafts are located at the same distance from the upper surface of the table 4. Is provided. Further, main shafts 13 and 33 for attaching the blades 11 and 31 are provided on the lower side of the table 4, and the height positions of the main shafts 13 and 33 are fixed, and both main shafts are the same from the upper surface of the table 4. It is provided at a distance position. The positions of the main shafts in plan view are such that the main shaft 3 is provided on the most upstream side and the main shafts 13, 23, 33 are arranged in the downstream side in this order.

  In the upper blade of the table 4, the blade 1 on the upstream side (left side in FIG. 2) has a smaller diameter, and the blade 21 on the downstream side (right side in FIG. 2) has a larger diameter. In the lower blade of the table 4, the upstream blade 11 has a smaller diameter, and the downstream blade 31 has a larger diameter. Blades 1 and 11 have the same diameter, and blades 21 and 31 have the same diameter. All the blades 1, 11, 21, and 31 have the same substrate thickness and are provided so as to be in a straight line in plan view. It is preferable that the thicknesses of the superabrasive layers of the blades 1, 11, 21, and 31 are theoretically all the same, but in reality there are vibrations, minute distortions, deformations, etc. of the substrate. The larger the blade (in other words, the more downstream the blade), the smaller the thickness. When these blades 1, 11, 21, 31 are fixed to the main shafts 3, 13, 23, 33, they are fixed with nuts via the flanges 2, 12, 22, 32. The flanges 2, 12, 22, and 32 all have the same diameter.

  In order to allow the workpiece 5 to be cut by the lower blades 11 and 31 of the table 4, the structure of the table 4 is such that the blades 11 and 31 can protrude upward from the table 4 with the blades 11 and 4b. The work material 5 is placed so as to straddle the tables 4a and 4b.

  The work material 5 placed on the table 4 is moved from the upstream side to the downstream side by moving the table 4 and starts to be cut by the blade 1. Then, cutting is started with the blade 11 before or after the cutting with the blade 1 is finished, and similarly, cutting with the blade 21 is started before or after the cutting with the blade 11 is finished. Similarly, the blade 31 is also cut. At the time of cutting, the main shaft of each blade remains fixed without moving, and only the work material 5 moves. In the example of FIG. 2, the blade 1 cuts the height h of the work material 5 from the upper surface to the height of (1/3) h, and then the blade 11 cuts the lower surface of the height h of the work material 5. To a height of (1/3) h. Next, the blade 21 cuts the height h of the work material 5 from the upper surface to the height of (1/2) h. Finally, the blade 31 cuts the height 5 of the work material 5 from the lower surface (1). / 2) Cutting up to the height of h is completed.

  The cutting method using such a cutting apparatus has the same effect as the method described in the first embodiment, and has the effect that it can easily cope with the increase in the size of the work material.

  In the above two examples, it is preferable that the peripheral speed of each blade is constant. This is because the load applied to each blade is made uniform, the resistance given to the work material is made constant, and the accuracy of the cut surface and the state of the surface are made uniform.

  The cutting method using the blade of the present invention is suitable for cutting hard and brittle materials such as silicon into a plate shape, but can also be used for cutting various other materials.

It is a figure which shows the image of the cutting device used for the 1st example of the cutting method by the braid | blade of this invention, (a) is a front view, (b) is a top view. It is a figure which shows the image of the cutting device used for the 2nd example of the cutting method by the braid | blade of this invention, (a) is a front view, (b) is a top view. It is an image figure which shows the example of the cutting method by the conventional circular saw. It is a figure which shows the example of the cutting method of the steel materials by the conventional rotary blade. It is a figure which shows the example of the method of cut | disconnecting timber with the conventional saw machine.

Explanation of symbols

1, 11, 21, 31, 41 Blade (round saw, rotary blade)
2, 12, 22, 32 Flange 3, 13, 23, 33, 43 Spindle 4 Table 5 Work material

Claims (8)

A method of cutting a work material using a plurality of blades provided with a superabrasive layer on the outer periphery of a disk-shaped substrate,
The plurality of blades are arranged in a straight line in plan view, and the rotation axes of the plurality of blades adjacent in the feed direction of the work material are arranged so as to be on the same plane in the horizontal direction,
The plurality of blades arranged on the straight line are arranged such that each of the blades has a different diameter and becomes a blade having a larger diameter sequentially from a blade having a smaller diameter,
A cutting method using a blade, characterized in that the work material is cut with the blade having a small diameter and then sent in a horizontal direction so as to be cut with a blade having a larger diameter and cut with one pass.   The blade cutting method according to claim 1, wherein the rotation shafts of the plurality of blades are positioned above the upper surface of the work material.   3. The cutting by the blade according to claim 2, wherein the rotation shafts of the plurality of blades are located below the lower surface of the work material in addition to those located above the upper surface of the work material. Method.   The cutting method using a blade according to any one of claims 1 to 3, wherein a thickness of the superabrasive layer of the plurality of blades decreases as the diameter of the blade increases.   The plane in which the rotating shafts of a plurality of blades located above the upper surface of the work material exist and the direction in which the work material moves are parallel to each other. Cutting method using the described blade.   The plane in which the rotational axes of a plurality of blades positioned below the lower surface of the work material exist and the direction in which the work material moves are parallel to each other. A cutting method using the blade described in 1.   The blade cutting method according to claim 1, wherein peripheral speeds of the plurality of blades are all the same.   The cutting method using a blade according to claim 1, wherein the work material is silicon for solar cells.

Images